A semiconductor optical crystal sleeve rod processing device

Abstract

The application relates to the technical field of optical crystal processing, in particular to a semiconductor optical crystal sleeve rod processing equipment. The bottom of the equipment is provided with a plane moving platform to fix the optical crystal base material. A sleeve rod assembly is arranged above the plane moving platform, which comprises a vertical lifting stand capable of vertical movement, a stepless feed table slidably arranged on the lifting stand, and a vertical sleeve rod machine arranged on the stepless feed table. A hollow core barrel capable of rotation is arranged in the vertical sleeve rod machine. The lower end of the core barrel is connected with a sleeve rod cutter, and the upper end is connected with a cooling liquid. The rotation is driven by a rotating driving device through gear transmission. The stepless feed table is matched with a counterweight assembly through a hanging rope and a fixed pulley block to realize stepless flexible feeding of the sleeve rod cutter through gravity matching. The equipment is also provided with a bearing positioning sleeve to limit the shaking of the cutter, and the cutter head is provided with a chip removal hole to cooperate with the cooling liquid to synchronously complete cooling and chip removal. The application can reduce the breakage rate of brittle crystals in processing, improve the processing precision and material utilization rate, and shorten the processing cycle.

Description

Technical Field

[0001] This invention relates to the field of optical crystal processing technology, and more specifically to a semiconductor optical crystal rod processing equipment. Background Technology

[0002] In the semiconductor and optoelectronics industries, optical crystals, electro-optic crystals, and various semiconductor substrates are core functional materials and generally possess high economic value. These materials typically need to be processed into standard cylindrical rods or wafers before they can be used in subsequent optical component fabrication processes. Traditional crystal rod processing often employs edge removal and external cylindrical grinding processes, gradually grinding the outer contour of the substrate to obtain a rod-shaped finished product of the target size.

[0003] Because optical crystals are inherently brittle and sensitive to thermal stress, the impact of the rigid grinding wheel during traditional grinding processes can easily cause chipping at the crystal edges and microcracks inside, resulting in a high breakage rate of finished products. At the same time, the large amount of cutting heat generated during grinding can easily cause thermal deformation of the crystal, affecting the dimensional accuracy and optical performance of the finished product.

[0004] In addition, traditional external grinding processes require the removal of a large amount of substrate material, resulting in high material loss, long processing cycles, and low efficiency. This makes it difficult to meet the high-efficiency and low-loss processing requirements of precious optical crystal materials, thus restricting the processing efficiency and economic benefits of related industries. Summary of the Invention

[0005] To address the aforementioned technical problems, this invention proposes a semiconductor optical crystal rod processing equipment. It aims to solve the issues of large material removal, high loss of valuable substrates, and long processing cycles associated with traditional semiconductor optical crystal rod processing using external cylindrical grinding. Simultaneously, it resolves the defects of brittle crystals being easily chipped and damaged by rigid feed impacts, and the tendency for processing thermal stress to cause dimensional deformation. It also improves the pain point of difficulty in timely removal of debris and heat, which can damage the processed surface, thus achieving low-loss, high-yield, and high-efficiency processing of optical crystal rods.

[0006] To achieve the above objectives, the present invention provides the following technical solution: A semiconductor optical crystal rod processing equipment includes a base, and a planar moving platform is provided on the top of the base for fixing the optical crystal substrate with tooling. A sleeve assembly is located above the planar moving platform; The bar assembly includes a vertically movable lifting platform, on which a vertically movable stepless feed table is slidably mounted, and a vertical bar-sleeving machine is mounted on the stepless feed table. The vertical bar-setting machine includes a vertically arranged hollow sleeve, in which a rotatable core cylinder is installed. Coolant is introduced into the upper end of the core cylinder, and a driven wheel is fixedly fitted near the outer side of the upper end. A bar-setting cutter is sealed and fixed at the lower end of the core cylinder. A rotary drive device is also installed on the stepless feed table, and the output end of the rotary drive device is provided with a drive gear that is connected to the driven wheel. The continuously variable feed table uses a suspension rope, a fixed pulley system, and a counterweight assembly to achieve continuously variable feed of the bar tool by utilizing gravity ratio.

[0007] Furthermore, the base is provided with a column at the top, and the column is fixedly connected to a vertical seat arranged parallel to the column by a horizontal arm. The lifting platform is slidably mounted on the vertical seat.

[0008] Furthermore, the fixed pulley group includes a first fixed pulley and a second fixed pulley. The first fixed pulley and the second fixed pulley are respectively installed on the lifting platform and the top of the column. One end of the hoisting rope is connected to the stepless feed table, and the other end passes around the first fixed pulley and the second fixed pulley in sequence and is connected to the counterweight assembly.

[0009] Furthermore, the back of the lifting platform is provided with a sliding mounting part that is shorter than the lifting platform itself, in order to avoid interference with the hoisting rope; The sliding mounting part is slidably mounted on the vertical base.

[0010] Furthermore, the planar moving platform includes an X-axis platform and a Y-axis platform, the Y-axis platform is located above the X-axis platform, and an operating table is provided on the top of the Y-axis platform. The optical crystal substrate is fixedly mounted on the operating table by a suitable tooling. The X-axis platform and the Y-axis platform are respectively provided with a first lead screw assembly and a second lead screw assembly, which are used to drive the operating table to move along the X-axis and the Y-axis respectively. A third lead screw assembly is installed on the vertical seat to drive the sliding mounting part to move up and down along the slide rail on the vertical seat.

[0011] Furthermore, the bottom of the lifting vertical seat is provided with a positioning platform located above the optical crystal substrate. The positioning platform is provided with a bearing positioning sleeve, and the sleeve bar cutter passes through the bearing positioning sleeve to achieve positioning, thereby reducing the shaking and vibration of the end of the sleeve bar cutter.

[0012] Furthermore, the upper end of the core tube is connected to a cooling pipe via a rotary connector, and the cooling pipe is used to cooperate with a pressure pump to deliver coolant.

[0013] Furthermore, the sleeve tool is a hollow cylindrical shape used to sleeve a rod-shaped workpiece on the processing substrate; since the maximum outer diameter of the outer wall of the tool head is greater than the diameter of the sleeve tool body, and the diameter of the inner wall of the tool head is smaller than the inner diameter of the sleeve tool body, after the tool is retracted, the rod-shaped workpiece remains in the infeed hole of the processing substrate and is then removed.

[0014] Furthermore, the end of the bar tool is provided with a cutting head, and the inner and outer sides of the cutting head are provided with a high-strength electroplated layer. The side wall of the cutting head is also provided with a plurality of chip removal holes evenly arranged in a circle. The coolant pushes the machining chips out of the gap between the outer tube wall of the bar tool and the inlet hole of the optical crystal substrate through the chip removal holes.

[0015] Furthermore, the coolant is filtered through a filter screen, the pore size of which is smaller than the pore size of the chip removal holes.

[0016] This invention addresses the industry pain points of semiconductor optical crystals, such as high brittleness, easy breakage during processing, and high losses in traditional processes. Guided by the core design principles of low-loss nesting, flexible feed, and integrated cooling and chip removal, it constructs a comprehensive technical solution for vertical bushing machining, replacing the traditional external cylindrical grinding processing mode. Specific design highlights are as follows: In terms of processing method, the process route of directly taking the finished rod from the substrate by using a hollow sleeve bar cutter is adopted. Compared with the traditional process of de-edge and external grinding, the amount of material removed is greatly reduced, which shortens the processing cycle and improves the utilization rate of precious crystal materials.

[0017] In terms of feed control, the conventional rigid feed structure of the lead screw is abandoned. Instead, a gravity-type stepless feed structure is adopted, which combines counterweight, suspension rope and fixed pulley group. The gravity ratio is used to achieve flexible feed, so that the feed force of the ball tool can be adaptively buffered according to the crystal processing resistance, avoiding crystal breakage caused by rigid impact, and adapting to the processing characteristics of brittle materials.

[0018] In terms of precision assurance, a bearing positioning sleeve is added to the end of the bar tool to form a radial constraint, which suppresses the end shaking and vibration caused by the high-speed rotation of the tool and ensures the roundness accuracy of the bar tool machining; at the same time, it is equipped with a two-stage vertical lifting structure to achieve rapid tool advance and retraction, and is compatible with crystal substrates of different sizes and specifications.

[0019] In terms of processing environment control, the cooling channel is integrated into the rotating core cylinder and the sleeve tool, and together with the chip removal hole on the side wall of the tool head, the coolant can directly reach the processing area, simultaneously achieving tool cooling, crystal cooling and chip removal, avoiding the impact of thermal stress and chip scratches on the quality of the finished product, and constructing a processing unit that integrates cutting, cooling and chip removal.

[0020] In summary, the present invention has the following beneficial effects: This invention uses a rod-mounting processing method to replace the traditional edge-removing and external grinding process. It can directly mount the shaped rod from the crystal substrate, which greatly reduces the amount of substrate removed by grinding, significantly shortens the processing time of a single batch, and effectively improves the utilization rate of precious optical crystal materials, while reducing processing losses and production costs.

[0021] This invention employs a stepless feed structure with a counterweight component, a suspension rope, and a fixed pulley system. It achieves flexible feed by relying on gravity ratio. The feed force of the bar tool can adaptively change with the processing resistance, avoiding the impact and cracking caused by rigid feed on brittle crystal substrates. It is adapted to the brittle characteristics of semiconductor optical crystals, effectively reducing the processing breakage rate and improving the yield of finished products.

[0022] In this invention, the coolant is connected to the inside of the core tube and the cutting tool. With the chip removal holes evenly distributed on the side wall of the cutting tool, the coolant can directly act on the processing area. While continuously cooling the cutting tool and the crystal processing surface, it pushes the processing chips to be smoothly discharged along the gap between the outer wall of the cutting tool and the inlet hole, avoiding chip residue that scratches the processing surface. At the same time, it reduces the impact of processing thermal stress on the crystal substrate and reduces processing defects such as thermal collapse and thermal deformation.

[0023] In this invention, the lifting vertical table and the stepless feed table form a two-stage vertical adjustment structure. The lifting vertical table can achieve large-stroke machining height adjustment, and the stepless feed table can achieve precise control of the bar feed. Combined with the planar moving platform composed of the X and Y axes, the machining point can be flexibly adjusted to adapt to the machining of crystal substrates of different sizes and specifications. The equipment has a wide range of applications and is convenient and flexible to operate and adjust. Attached Figure Description

[0024] Figure 1 is a schematic diagram of the right side structure of the present invention.

[0025] Figure 2 is a front view of the structure of the present invention.

[0026] Figure 3 is a partial structural schematic diagram of the present invention.

[0027] Figure 4 is an enlarged structural diagram of part A in Figure 3.

[0028] The attached figures are labeled as follows: 100. Base; 110. Column; 120. Vertical seat; 130. Horizontal arm; 200. Planar moving platform; 210. Y-axis platform; 211. Second lead screw assembly; 220. X-axis platform; 221. First lead screw assembly; 222. Operating table; 300. Lifting vertical platform; 310. Sliding mounting part; 311. Third lead screw assembly; 320. Positioning platform; 321. Bearing positioning sleeve; 400. Hollow sleeve; 410. Stepless feed table; 420. Rotary drive device; 500. Sleeve bar cutter; 510. Core cylinder; 520. Driven wheel; 530. Rotary connector; 540. Cutting head; 541. Chip removal hole; 600. Lifting rope; 610. First fixed pulley; 620. Second fixed pulley; 630. Matching unit. Detailed Implementation

[0029] To enable those skilled in the art to better understand the present invention, the technical solution of the present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0030] Figures 1 to 4 A semiconductor optical crystal rod processing equipment is presented, with a base 100 as the basic support structure. A planar moving platform 200 is set on the top of the base 100 for clamping and fixing the optical crystal substrate with special tooling. A rod assembly is arranged above the planar moving platform 200. The entire rod assembly can complete the core processing actions of vertical feeding and rotating the rod.

[0031] A vertical column 110 is erected on the top of the base 100. A vertical seat 120 is fixedly connected to the upper part of the column 110 via a cross arm 130. The vertical seat 120 is arranged parallel to the column 110, providing a stable installation and guiding foundation for the vertical movement of the sleeve assembly. The planar moving platform 200 is composed of an X-axis platform and a Y-axis platform stacked on top of each other. The Y-axis platform is located above the X-axis platform, and an operating table 222 is set on the top of the Y-axis platform. The optical crystal substrate to be processed is fixedly installed on the operating table 222 using appropriate tooling. The X-axis platform and the Y-axis platform are respectively equipped with corresponding first lead screw assembly 221 and second lead screw assembly 211, which can drive the operating table 222 to make precise displacements along the X-axis and Y-axis directions, thereby adjusting the planar processing position of the substrate and meeting the sleeve processing requirements of different points on the substrate.

[0032] The tool assembly includes a lifting vertical platform 300 that can move up and down along a vertical base 120. A sliding mounting part 310 is provided on the back of the lifting vertical platform 300. The length of the sliding mounting part 310 is less than the overall length of the lifting vertical platform 300. The sliding mounting part 310 is fitted onto the slide rail of the vertical base 120, allowing the lifting vertical platform 300 to slide smoothly along the vertical base 120. A third lead screw assembly 311 is mounted on the vertical base 120. The output end of the third lead screw assembly 311 is connected to the sliding mounting part 310, driving the sliding mounting part 310 to move up and down along the slide rail of the vertical base 120. This drives the lifting vertical platform 300 to complete a large-stroke height adjustment, adapting to the processing of crystal substrates of different thicknesses. It also enables rapid alignment before processing and rapid tool retraction after processing.

[0033] A continuously variable feed table 410, capable of vertical movement, is slidably mounted on the front of the lifting platform 300. The vertical bar press is mounted entirely on the continuously variable feed table 410, and performs vertical feed actions synchronously with the continuously variable feed table 410. The continuously variable feed table 410 is connected to the matching unit 630 via a suspension rope 600 and a fixed pulley system. The fixed pulley system includes a first fixed pulley and a second fixed pulley 620. The first fixed pulley is mounted on the top of the lifting platform 300, and the second fixed pulley 620 is mounted on the top of the column 110. One end of the suspension rope 600 is fixedly connected to the upper part of the continuously variable feed table 410, and the other end passes through the first fixed pulley and the second fixed pulley 620 in sequence before being connected to the matching unit 630. By adjusting the weight distribution of the 630-piece weighted assembly, the principle of gravity balance can be used to achieve stepless flexible feed of the bar tool 500. This allows the feed force and feed speed to be adaptively adjusted according to the machining resistance, avoiding impact from rigid feed on brittle crystals and effectively reducing the risk of crystal chipping and breakage. The sliding mounting part 310 on the back of the lifting platform 300 is shorter than the main body of the lifting platform 300, which can avoid the movement path of the lifting rope 600 during the movement of the lifting platform 300, avoiding movement interference between structures and ensuring smooth operation of the equipment.

[0034] The vertical bar cutting machine includes a vertically arranged hollow sleeve 400, which is fixedly mounted on a continuously variable feed table 410. Inside the hollow sleeve 400, a rotatable core cylinder 510 is sealed and mounted via a sealed bearing assembly. The core cylinder 510 has a hollow structure; its upper end is used for coolant inlet, and a driven wheel 520 is fixedly mounted on its outer side near the upper end. A bar cutting tool 500 is sealed and fixedly mounted at the lower end of the core cylinder 510. The internal cavity of the bar cutting tool 500 is connected to the hollow cavity of the core cylinder 510, forming a complete coolant flow channel. A rotary drive device 420 is also installed on the continuously variable feed table 410. A drive gear is installed at the output end of the rotary drive device 420, and the drive gear meshes with the driven wheel 520 to form a transmission connection. When the rotary drive device 420 operates, it drives the core cylinder 510 and the bar cutting tool 500 to rotate synchronously via gear transmission, completing the core action of bar cutting.

[0035] A positioning platform 320 is installed at the bottom of the lifting platform 300. The positioning platform 320 is suspended above the optical crystal substrate. A bearing positioning sleeve 321 is installed on the positioning platform 320. The blade of the bar tool 500 passes through the inner hole of the bearing positioning sleeve 321, and the bearing positioning sleeve 321 provides radial support and positioning for the bar tool 500. When the bar tool 500 rotates at high speed, the bearing positioning sleeve 321 can effectively limit the radial wobble and vibration of the tool head 540, improve the accuracy and stability of bar processing, and ensure that the roundness of the finished bar meets the requirements of high-precision processing.

[0036] The upper end of the core cylinder 510 is connected to the cooling pipe via a rotary connector 530. The cooling pipe is connected to an external pressure pump and a coolant circulation system. The rotary connector 530 can keep the cooling pipe stationary while the core cylinder 510 is rotating at high speed, so as to achieve continuous delivery of coolant during rotation and prevent the pipe from being damaged by twisting with the core cylinder 510.

[0037] The hollow sleeve 400 can be a sealing jacket, which, together with the threaded assembly and sealing gasket assembly, achieves a sealed clamping and fixing of the core cylinder 510. The sleeve bar cutter 500 is generally in the shape of a hollow cylinder, with a cutter head 540 at its lower end. Both the inner and outer sides of the cutter head 540 are provided with a high-strength electroplated layer to improve the surface hardness and wear resistance of the cutter head 540 and extend the service life of the tool. The side wall of the cutter head 540 has multiple chip removal holes 541 evenly distributed in a ring. The coolant in the core cylinder 510 can flow to the machining area through the chip removal holes 541. While cooling the cutter head 540 and the crystal machining surface, it pushes the chips generated during machining upward along the gap between the outer tube wall of the sleeve bar cutter 500 and the inlet hole of the substrate, avoiding chip residue in the machining gap and scratching the machining surface.

[0038] A filter screen is installed at the inlet end of the coolant circulation loop. The pore size of the filter screen is smaller than that of the chip removal hole 541. It can filter the returning coolant, intercept the machining chips in the coolant, and prevent the chips from entering the core cylinder 510 with the coolant circulation and clogging the chip removal hole 541, thus ensuring the continuous and stable operation of the cooling chip removal system.

[0039] The outermost diameter of the outer wall of the cutting head 540 of the bar tool 500 is greater than the diameter of the cutting body of the bar tool 500, while the diameter of the inner wall of the cutting head 540 is smaller than the inner diameter of the cutting body of the bar tool 500. After the cutting is completed and the tool is retracted, the bar-shaped workpiece that has been removed will remain in the infeed hole of the substrate and can be taken out separately later. This avoids the bar material from falling and being bumped during the process of the tool rising, thus ensuring the integrity of the finished product.

[0040] When the equipment is in operation, the optical crystal substrate to be processed is first fixed on the operating table 222 using tooling. The planar position of the substrate is adjusted by the X-axis and Y-axis platforms so that the position to be processed is directly below the sleeve cutter 500, completing the planar alignment. Then, the lifting vertical table 300 is driven downward by the third lead screw assembly 311, so that the cutter head 540 of the sleeve cutter 500 approaches the surface of the substrate, completing the rough alignment before processing.

[0041] Then, the rotation drive device 420 is activated, driving the core cylinder 510 and the sleeve cutter 500 to rotate at high speed via gear transmission. Simultaneously, coolant is continuously supplied to the core cylinder 510 through cooling pipes, allowing the coolant to flow along the internal channels of the core cylinder 510 and the sleeve cutter 500 towards the cutter head 540. Under the gravity of the 630-piece assembly, the stepless feed table 410 slowly slides downwards along the lifting platform 300, driving the rotating sleeve cutter 500 to gradually cut into the crystal substrate, achieving flexible sleeve cutting. During processing, coolant is sprayed out through the chip removal hole 541 of the cutter head 540, continuously cooling the cutter and crystal in the processing area. Simultaneously, it pushes the generated chips upwards along the gap between the outer wall of the sleeve cutter 500 and the feed hole, maintaining the cleanliness and temperature stability of the processing area.

[0042] When the bar tool 500 is fed to the set depth, the third lead screw assembly 311 drives the lifting platform 300 to move upward, causing the bar tool 500 to slowly exit the substrate. The bar-shaped workpiece formed by the tool is left in the infeed hole of the substrate. After the tool is withdrawn, the bar is taken out, thus completing a single bar tool processing.

[0043] If other positions on the substrate need to be processed, the planar position of the substrate can be adjusted by the planar moving platform 200, and the above process can be repeated to complete the multi-station bar processing.

[0044] The terms "upper," "lower," "outer," "inner," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish relative positional relationships and are not necessarily qualitative. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0045] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A semiconductor optical crystal rod processing device, comprising a base, wherein a planar moving platform is provided on the top of the base for fixing the optical crystal substrate with tooling; characterized in that: A sleeve assembly is located above the planar moving platform; The bar assembly includes a vertically movable lifting platform, on which a vertically movable stepless feed table is slidably mounted, and a vertical bar-sleeving machine is mounted on the stepless feed table. The vertical bar-setting machine includes a vertically arranged hollow sleeve, in which a rotatable core cylinder is installed. Coolant is introduced into the upper end of the core cylinder, and a driven wheel is fixedly fitted near the outer side of the upper end. A bar-setting cutter is sealed and fixed at the lower end of the core cylinder. A rotary drive device is also installed on the stepless feed table, and the output end of the rotary drive device is provided with a drive gear that is connected to the driven wheel. The continuously variable feed table uses a suspension rope, a fixed pulley system, and a counterweight assembly to achieve continuously variable feed of the bar tool by utilizing gravity ratio.

2. The semiconductor optical crystal rod processing equipment as described in claim 1, characterized in that: The base is provided with a column at the top, and the column is fixedly connected to a vertical seat arranged parallel to the column by a horizontal arm. The lifting platform is slidably installed on the vertical seat.

3. The semiconductor optical crystal rod processing equipment as described in claim 2, characterized in that: The fixed pulley group includes a first fixed pulley and a second fixed pulley. The first fixed pulley and the second fixed pulley are respectively installed on the lifting platform and the top of the column. One end of the hoisting rope is connected to the stepless feed table, and the other end passes through the first fixed pulley and the second fixed pulley in sequence and is connected to the counterweight assembly.

4. The semiconductor optical crystal rod processing equipment as described in claim 3, characterized in that: The lifting platform has a sliding mounting part on its back, which is shorter than the lifting platform itself, to avoid interference with the hoisting rope. The sliding mounting part is slidably mounted on the vertical base.

5. The semiconductor optical crystal rod processing equipment as described in claim 4, characterized in that: The planar moving platform includes an X-axis platform and a Y-axis platform. The Y-axis platform is located above the X-axis platform, and an operating table is provided on the top of the Y-axis platform. The optical crystal substrate is fixedly mounted on the operating table by a suitable tooling. The X-axis platform and the Y-axis platform are respectively provided with a first lead screw assembly and a second lead screw assembly, which are used to drive the operating table to move along the X-axis and the Y-axis respectively. A third lead screw assembly is installed on the vertical seat to drive the sliding mounting part to move up and down along the slide rail on the vertical seat.

6. The semiconductor optical crystal rod processing equipment as described in claim 1, characterized in that: The bottom of the lifting vertical seat is provided with a positioning platform located above the optical crystal substrate. The positioning platform is provided with a bearing positioning sleeve. The sleeve bar cutter passes through the bearing positioning sleeve to achieve positioning, which is used to reduce the shaking and vibration of the end of the sleeve bar cutter.

7. The semiconductor optical crystal rod processing equipment as described in any one of claims 1 to 6, characterized in that: The upper end of the core tube is connected to a cooling pipe via a rotary connector, and the cooling pipe is used to cooperate with a pressure pump to deliver coolant.

8. The semiconductor optical crystal rod processing equipment as described in claim 7, characterized in that: The aforementioned bar-mounted cutter is a hollow cylindrical tool used to mount bar-shaped workpieces onto a processing substrate.

9. The semiconductor optical crystal rod processing equipment as described in claim 8, characterized in that: The end of the bar tool is provided with a cutting head, and the inner and outer sides of the cutting head are provided with a high-strength electroplated layer. The side wall of the cutting head is also provided with a plurality of chip removal holes evenly arranged in a circle. The coolant pushes the machining chips out of the gap between the outer tube wall of the bar tool and the inlet hole of the optical crystal substrate through the chip removal holes.

10. The semiconductor optical crystal rod processing equipment as described in claim 9, characterized in that: The coolant is filtered through a filter screen, the pore size of which is smaller than the pore size of the chip removal holes.

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