Substrate alignment turner

Abstract

The application relates to the field of substrate positioning and overturning, and provides a substrate alignment and overturning machine which comprises an overturning assembly, a grabbing assembly and an adjusting assembly. The overturning assembly comprises a mounting frame, an overturning frame overturning driving element and a first overturning frame. The first overturning frame is rotationally arranged on the mounting frame, and the overturning frame overturning driving element is connected with the first overturning frame. The grabbing assembly comprises a suction cup, an elastic element and a negative pressure air source. The suction cup is arranged on the first overturning frame and is connected with the negative pressure air source. The suction cup is used for adsorbing a substrate. The suction cup has a flexible lip, the elastic element is arranged on the inner side of the flexible lip, the suction cup and the elastic element are configured so that when the suction cup approaches the substrate, the elastic element contacts the substrate first, and when the flexible lip just contacts the substrate, a gap exists between the inner side of the flexible lip and the elastic element. The adjusting assembly is connected with the mounting frame and is used for driving the substrate to move or change a posture. The application solves the problems that the substrate overturning and positioning process is relatively complicated, and the substrate is easily damaged when the substrate is adsorbed and grabbed.

Description

Technical Field

[0001] This application relates to the field of substrate positioning and flipping, and more particularly to a substrate alignment and flipping machine. Background Technology

[0002] In industries such as electronics manufacturing and panel display, it is often necessary to process both sides of a substrate (such as a circuit board or glass substrate). On such production lines, the substrate usually needs to be flipped to process the other side, and before and after flipping, the substrate needs to be precisely positioned at a preset reference position to ensure the accuracy of subsequent processes.

[0003] Existing substrate processing methods typically include separate alignment and flipping mechanisms. The substrate is first aligned at one station and then transferred to another station for flipping via a transport mechanism. This step-by-step processing method not only occupies a large amount of equipment space, but also easily accumulates positioning errors due to the multiple transfers and repositioning of the substrate, affecting the final alignment accuracy. In addition, traditional positioning methods often squeeze the edges of the substrate, which can easily damage it, and the substrate is also prone to friction with other components during movement, leading to further damage.

[0004] To address the issue of substrate damage during positioning and flipping, current solutions utilize a negative pressure device (suction cup) to adsorb the substrate, thereby driving its flipping and positioning. However, traditional suction cups have the following drawbacks: 1. For some heavy substrates, the suction cup needs to have sufficient suction force; however, excessive suction force can easily cause deformation and damage to the substrate. 2. When the suction cup first contacts the substrate, it will impact the substrate, which can easily cause damage to some fragile or thin substrates. 3. The traditional negative pressure device is typically set up as follows: a negative pressure air source is connected to the suction cups. The negative pressure air source is used to create negative pressure to adsorb materials (substrates). The negative pressure air source may include a vacuum pump and air pipes. When there are multiple suction cups, the air pipes of the negative pressure air source are multi-port pipes. The main pipe of the multi-port pipe is connected to the vacuum pump, and each branch of the multi-port pipe is connected to each suction cup. Each branch of the multi-port pipe is usually equipped with a first valve, so that the adsorption force of each suction cup can be adjusted.

[0005] There are generally two ways to release the substrate: First, the negative pressure gas source has a (two-position three-way) solenoid valve on its air pipe. The three ports of the solenoid valve are used to connect the vacuum pump, the suction cup, and the outside atmosphere, respectively. When the substrate needs to be released, the vacuum pump is disconnected from the suction cup, while the suction cup is connected to the outside atmosphere to eliminate the negative pressure. Second, the negative pressure gas source is equipped with a matching positive pressure gas source (air pump) accessory. The positive pressure gas source is connected to the main pipe of the negative pressure gas source through the air supply pipe, and both the main pipe and the air supply pipe of the negative pressure gas source are equipped with second valves. When the substrate needs to be released, the connection between the suction cup and the vacuum pump is cut off by closing the second valve on the main pipe of the negative pressure gas source, and then the second valve on the air supply pipe is opened to connect the positive pressure gas source to the suction cup. Finally, gas is introduced into the suction cup through the positive pressure gas source to eliminate the negative pressure.

[0006] Of the aforementioned methods for releasing the substrate, the first method has a slower response speed, and the suction cup and substrate may still be stuck together after the negative pressure is removed. This requires pulling the suction cup or substrate to separate them, which increases the risk of substrate damage. The second method, however, has a faster response and can force the suction cup and substrate apart using positive pressure gas, making it more widely used. However, after the substrate detaches from the suction cup, the positive pressure gas may cause displacement, affecting positioning. Furthermore, to achieve rapid substrate release, the positive pressure gas pressure is usually relatively high. If the substrate is fragile, the impact of the positive pressure gas on a single point on the substrate may cause damage. Summary of the Invention

[0007] To address the issues of cumbersome substrate flipping and positioning processes and the potential damage to substrates during adsorption and gripping, this application provides a substrate alignment and flipping machine.

[0008] The substrate alignment and flipping machine provided in this application adopts the following technical solution: A substrate alignment and flipping machine, comprising: The flipping assembly includes a mounting frame, a flipping frame flipping drive, and a first flipping frame; the first flipping frame is rotatably mounted on the mounting frame, and the flipping frame flipping drive is connected to the first flipping frame; The gripping assembly includes a suction cup, an elastic element, and a negative pressure air source; the suction cup is disposed on the first flipping frame and connected to the negative pressure air source; the suction cup is used to adsorb a substrate; the suction cup has a flexible lip, and the elastic element is disposed on the inner side of the flexible lip; the suction cup and the elastic element are configured such that when the suction cup approaches the substrate, the elastic element contacts the substrate before the suction cup, and when the flexible lip just contacts the substrate, there is a gap between the inner side of the flexible lip and the elastic element; An adjustment component, connected to the mounting bracket, is used to drive the substrate to move or change its posture.

[0009] By adopting the above technical solution, the alignment and flipping functions are integrated into one unit, reducing the equipment's footprint, avoiding the accumulation of positioning errors caused by multiple transfers of the substrate between multiple workstations, and improving alignment accuracy. Adjusting the mounting bracket to achieve substrate positioning prevents substrate wear during the positioning process. The gripping component can fix the substrate to prevent it from falling during flipping. When gripping the substrate, the elastic element contacts the substrate first to provide cushioning, preventing damage caused by impact when the suction cup first contacts the substrate. During adsorption, the gap between the inner side of the flexible lip and the elastic element ensures the formation of negative pressure, while the inner elastic element limits excessive indentation and deformation of the substrate into the suction cup, solving the problem of substrate deformation and damage caused by increasing suction force to grip heavy substrates. When releasing the substrate, whether external gas is allowed to enter the suction cup naturally or actively introduced, the elastic element is the first to be impacted by the gas after entering the suction cup, preventing substrate damage.

[0010] Optionally, the elastic element is an elastic airbag; The gripping component also includes an air supply component, which is internally connected to the elastic member and is used to introduce gas into the elastic member.

[0011] By adopting the above technical solution, the elastic airbag possesses excellent cushioning performance. When the substrate needs to be released, gas is introduced into the airbag through the air supply component, causing the airbag to expand and gently push the substrate out physically, forcing the substrate to separate from the suction cup. In addition, by controlling the amount of gas in the airbag, the contact area between the airbag and the substrate can be changed, which helps to prevent damage to the substrate.

[0012] Optionally, the gap width between the inner side of the flexible lip and the elastic element is adjustable.

[0013] By adopting the above technical solution, the equipment can flexibly adjust the gap width according to the material, thickness, weight and fragility of different substrates, thereby accurately controlling the magnitude of the adsorption force and the limit range of allowable deformation of the substrate, which significantly improves the equipment's versatility and protection capability for substrates of different specifications.

[0014] Optionally, the gap width between the inner side of the flexible lip and the elastic element can be adjusted by the negative pressure air source changing the negative pressure between the inner side of the flexible lip and the elastic element and / or by the air supply element changing the air volume in the elastic element.

[0015] By adopting the above technical solution, the existing negative pressure air source and air supply components are cleverly utilized to realize the automatic adjustment of the gap width. There is no need to add a complicated mechanical adjustment mechanism, which makes the adjustment process more convenient, fast and accurate, and allows the magnitude of the adsorption force and the limit range of the substrate's allowable deformation to be flexibly controlled.

[0016] Optionally, the width of the gap between the inner side of the flexible lip and the elastic element is at least zero.

[0017] By adopting the above technical solution, the gap is adjusted to zero, so that the suction force of the suction cup on the substrate remains stable.

[0018] Optionally, there are multiple suction cups and multiple elastic elements, and each suction cup corresponds to one elastic element. The gap width between each of the elastic elements and the flexible lip of the corresponding suction cup may be the same or not exactly the same.

[0019] By adopting the above technical solution, multiple suction cup arrays can stably grip large or heavy substrates; at the same time, the gap width can be set individually (not exactly the same), so that the device can apply differentiated adsorption force and support limit to different areas of the same substrate (such as the edge and center, or for irregularly shaped substrates), preventing the substrate from deforming or being damaged due to uneven local stress.

[0020] Optionally, the flipping assembly further includes a second flipping frame, a connecting seat, and a flipping frame movement drive; The connecting seat is connected to the flipping frame flipping drive component, and the flipping frame moving drive component and the second flipping frame are both disposed on the connecting seat; the first flipping frame is slidably disposed on the connecting seat; the flipping frame moving drive component is connected to the first flipping frame and is used to drive the first flipping frame to move closer to or away from the second flipping frame; The second flipping frame is used to support the substrate.

[0021] By adopting the above technical solution, a second flipping frame is introduced to cooperate with the first flipping frame to form a clamping structure. The moving drive of the flipping frame can freely adjust the distance between the two to allow the suction cup to move closer to or further away from the substrate, and it can also adapt to substrates of different thicknesses. During the flipping process, the second flipping frame physically supports the substrate, avoiding the separation of the suction cup from the substrate due to the compression of the substrate by the elastic element, which greatly improves the safety and stability of the entire flipping process.

[0022] Optionally, the second flip plate is provided with a support column, the support column pointing towards the first flip frame, and the support column is used to support the base plate; There are multiple support columns and suction cups, and the positions of the support columns and suction cups correspond one-to-one.

[0023] By adopting the above technical solution, the point-to-point support method with one-to-one correspondence between the support column and the suction cup ensures that the force points on both sides of the substrate are collinear when it is clamped and flipped, thus avoiding the generation of bending torque inside the substrate and ensuring the flatness of the substrate. At the same time, the point contact greatly reduces the contact area with the back of the substrate, reducing the risk of the back of the substrate being scratched or contaminated by friction.

[0024] Optionally, the end of the support column facing the first tilting frame is provided with a flexible pad.

[0025] By adopting the above technical solution, the flexible pad plays a good role in buffering and flexible isolation when the support column comes into contact with the back of the substrate, further preventing physical damage such as indentations and scratches caused by hard contact to the back of the substrate.

[0026] Optionally, the substrate alignment and flipping machine further includes an alignment detection component, which is used to detect whether the substrate is in a preset position.

[0027] By adopting the above technical solution, the alignment detection component can detect whether the substrate is in the preset position, providing accurate data feedback for the adjustment component, thereby realizing closed-loop position control, ensuring that the substrate can be accurately positioned in the preset reference position after being gripped and flipped, and guaranteeing the high precision requirements of subsequent processing technology.

[0028] In summary, this application includes at least one of the following beneficial technical effects: 1. This application integrates the alignment and flipping functions, which saves equipment space and avoids the accumulation of positioning errors caused by multiple substrate transfers. In addition, it innovatively sets an elastic element in the flexible lip of the suction cup, which not only plays a buffering and shock-proof role at the initial contact, but also limits the excessive deformation of the substrate into the suction cup during adsorption, fundamentally solving the problem that traditional suction cups are prone to causing physical damage to thin and brittle substrates. 2. This application sets the elastic element as an inflatable airbag, and uses the expansion of the airbag to physically push out the substrate when releasing the substrate, thereby achieving fast and non-adhesive gentle material removal, which perfectly overcomes the technical bias of the traditional positive pressure reverse blowing release method, which is prone to substrate displacement or damage to the substrate. 3. This application, through the independent adjustable gap width and differentiated configuration of multiple suction cup arrays, combined with the design of the second flipping frame and flexible support column, enables the equipment to not only flexibly accommodate substrates of various materials, sizes and thicknesses, but also to provide ultimate safety protection and high-precision positioning guarantee throughout the entire flipping and moving process. Attached Figure Description

[0029] Figure 1 This is a three-dimensional structural schematic diagram of the substrate alignment and flipping machine in the first embodiment provided in this application; Figure 2 This application provides Figure 1 Enlarged view of point A in the middle; Figure 3 This is a partial three-dimensional structural schematic diagram of the substrate alignment and flipping machine in the first embodiment provided in this application; Figure 4 This is a three-dimensional structural diagram of the grasping component in the first embodiment provided in this application; Figure 5 This is one of the structural schematic diagrams of the grasping component in the second embodiment provided in this application; Figure 6 This is the second schematic diagram of the structure of the grasping component in the second embodiment provided in this application; Figure 7 This is the third structural schematic diagram of the grasping component in the second embodiment provided in this application; Figure 8 This application provides Figure 7 Enlarged view of point B in the middle; Figure 9 This is a schematic diagram of the gripping component in the third embodiment provided in this application; Figure 10 This application provides Figure 9 Enlarged diagram of point C in the middle.

[0030] Explanation of reference numerals in the attached figures: 1. Flipping assembly; 11. Mounting bracket; 12. Flipping frame flipping drive component; 13. Connecting seat; 14. Flipping frame moving drive component; 15. First flipping frame; 16. Second flipping frame; 161. Support column; 2. Gripping component; 21. Suction cup; 211. Flexible lip; 212. Air extraction port; 22. Negative pressure air source; 23. Elastic component; 24. Air supply component; 241. Air supply pipe; 242. Valve; 3. Adjustment component; 31. Base; 32. X-axis movement drive; 33. X-axis slide; 34. Y-axis movement drive; 35. Y-axis slide; 36. Rotation drive; 4. Outer frame; 5. Alignment detection components; 200. Substrate. Detailed Implementation

[0031] The following is in conjunction with the appendix Figures 1 to 10 This application will be described in further detail.

[0032] Example 1

[0033] like Figures 1 to 3 As shown in the figure, this application discloses a substrate alignment and flipping machine, including a flipping component 1, a gripping component 2, an adjustment component 3, an outer frame 4, and an alignment detection component 5.

[0034] The flipping assembly 1 is used to flip the substrate 200. It includes a mounting frame 11, a flipping frame flipping drive 12, a connecting seat 13, a flipping frame moving drive 14, a first flipping frame 15, and a second flipping frame 16. The flipping frame flipping drive 12 (e.g., a rotary motor) is fixed to the mounting frame 11, and its power output shaft is connected to the connecting seat 13 to drive the connecting seat 13 to perform a flipping motion. The flipping frame moving drive 14 (e.g., a cylinder or linear motor) and the second flipping frame 16 are both mounted on the connecting seat 13. The second flipping frame 16 supports the substrate 200. The first flipping frame 15 is slidably disposed on the connecting seat 13 via a linear guide rail, parallel and directly opposite the second flipping frame 16. The driving end of the flipping frame moving drive 14 is connected to the first flipping frame 15 and is used to drive the first flipping frame 15 closer to or away from the second flipping frame 16.

[0035] The second flipping frame 16 is provided with one or more support columns 161 arranged in an array. In this embodiment, there are multiple support columns 161. These support columns 161 point towards the first flipping frame 15. The support columns 161 are used to support the substrate 200. Furthermore, each support column 161 has a flexible pad (such as a silicone pad or a Teflon pad) at the end facing the first flipping frame 15. The flexible pad contacts the substrate 200, providing excellent flexible isolation and cushioning, effectively preventing indentations or scratches caused by hard mechanical contact to the substrate 200.

[0036] like Figures 3 to 4 As shown, the gripping component 2 is used to adsorb the substrate 200, and it includes suction cups 21 and a negative pressure air source 22. There may be one or more suction cups 21; in this embodiment, there are multiple suction cups 21 arranged in a rectangular array on the first flipping frame 15, with the adsorption ends of the suction cups 21 facing the second flipping frame 16. The positions of the suction cups 21 and the supporting posts 161 correspond one-to-one, allowing the suction cups 21 and the supporting posts 161 to better cooperate in limiting the substrate 200.

[0037] The suction cup 21 has a flexible lip 211 around its suction end opening edge for adhering to the surface of the substrate 200. In its natural state, the flexible lip 211 resembles a bowl shape and can be made of rubber. When the suction cup 21 adsorbs the substrate 200, the flexible lip 211 partially adheres to the substrate 200, which helps to create a negative pressure inside the suction cup 21. The negative pressure air source 22 is existing technology; its principle of creating negative pressure to allow the suction cup 21 to adsorb the substrate 200 and eliminating negative pressure to release the substrate 200 will not be elaborated upon.

[0038] like Figures 1 to 2As shown, the outer frame 4 is located outside the flipping assembly 1, and the alignment detection element 5 is located on the outer frame 4. The alignment detection element 5 is used to detect whether the substrate 200 is in a preset position. For example, the alignment detection element 5 can be an industrial camera, which performs visual recognition to detect whether the substrate 200 is in the preset position. Alternatively, the alignment detection element 5 can include multiple sets of laser beam sensors. The emitting and receiving ends of the laser beam sensors are arranged vertically at intervals, and the substrate 200 is determined to be in the preset position based on whether the laser emitted by each set of emitting ends is blocked by the substrate 200.

[0039] like Figure 3 As shown, the adjustment component 3 is connected to the mounting bracket 11 and is used to drive the base plate 200 to move or change its posture. Specifically, the adjustment component 3 includes a base 31, an X-axis movement drive 32, an X-axis slide 33, a Y-axis movement drive 34, a Y-axis slide 35, and a rotation drive 36. The X-axis slide 33 is slidably mounted on the base 31. The X-axis movement drive 32 is mounted on the base 31 and connected to the X-axis slide 33, and is used to drive the X-axis slide 33 to slide along the X direction. The Y-axis movement drive 34 and the Y-axis slide 35 are both mounted on the X-axis slide 33, and the Y-axis slide 35 is slidably connected to the X-axis slide 33. The Y-axis movement drive 34 is connected to the Y-axis slide 35 and is used to drive the Y-axis slide 35 to slide along the Y direction. The mounting bracket 11 is rotatably mounted on the Y-axis slide 35. The rotary drive 36 is mounted on the Y-axis slide 35 and is connected to the mounting bracket 11. The rotary drive 36 is used to drive the mounting bracket 11 to rotate.

[0040] In this design, both the X and Y directions are horizontal and perpendicular to each other. Both the X-axis movement drive 32 and the Y-axis movement drive 34 can be motor-screw drive mechanisms, which are existing technologies and will not be described in detail. The rotation axis of the mounting bracket 11 is vertical. The rotation drive 36 can be a motor.

[0041] The implementation principle of this embodiment is as follows: (by a robotic arm) the substrate 200 is placed on the support column 161 on the horizontal second flipping frame 16. Then, the flipping frame moving drive 14 drives the first flipping frame 15 to move up and down to approach the second flipping frame 16 so that the suction cup 21 contacts the substrate 200. After the substrate 200 is adsorbed, the flipping frame flipping drive 12 drives the connecting seat 13 to rotate, so that the first flipping frame 15, the second flipping frame 16 and the substrate 200 are flipped together. Then, the adjusting component 3 drives the mounting frame 11 to translate and / or rotate, and with the cooperation of the alignment detection component 5, the substrate 200 is moved to a preset position. Then, the first flipping frame 15 is moved away from the second flipping frame 16, and the suction cup 21 releases the substrate 200. Finally, the substrate 200 is taken away.

[0042] Example 2

[0043] The difference between this embodiment and embodiment 1 is that the crawling component 2 has been optimized.

[0044] like Figures 5 to 8 As shown, specifically, the gripping component 2 also includes an elastic element 23, which can be a rubber ball or an elastic airbag. The elastic element 23 is located inside the flexible lip 211 of the suction cup 21 and is connected to the suction cup 21. When the suction cup 21 approaches the substrate 200, the elastic element 23 can contact the substrate 200 first, thereby playing a buffering role and preventing the suction cup 21 from impacting the substrate 200 and causing damage to the substrate 200. As the suction cup 21 gradually approaches the substrate 200, the flexible lip 211 and the elastic element 23 can contact the substrate 200 simultaneously, and there is a gap between the inner side of the flexible lip 211 and the elastic element 23 at the moment of contact, ensuring that the negative pressure air source 22 can draw away the air inside the flexible lip 211 to form a negative pressure.

[0045] like Figure 6 As shown, when the suction cup 21 adsorbs the substrate 200, the elastic element 23 is in a flattened state. The elastic element 23 can compress the substrate 200, thereby preventing the substrate 200 from deforming due to excessive negative pressure suction. Furthermore, the greater the negative pressure suction, the greater the deformation of the elastic element 23, and the greater the compressive force exerted by the elastic element 23 on the substrate 200. It can automatically adapt to the magnitude of the suction force, effectively preventing deformation of the substrate 200. In addition, the elastic element 23 and the second flipping frame 16 (with its supporting pillar 161) can work together to flexibly clamp the substrate 200. Combined with the adsorption of the suction cup 21, this effectively prevents the substrate 200 from shifting. The limiting effect of the second flipping frame 16 (with its supporting pillar 161) on the substrate 200 also prevents the suction cup 21 from detaching from the substrate 200 due to the compression of the substrate 200 by the elastic element 23.

[0046] Furthermore, in this embodiment, during the process of the suction cup 21 releasing the substrate 200, the first flipping frame 15 does not need to move away from the second flipping frame 16, but remains relatively stationary with the second flipping frame 16. When air enters the inner side of the flexible lip 211, the negative pressure is eliminated. At this time, the elastic member 23 and the supporting column 161 can still limit the substrate 200, thereby preventing the substrate 200 from shaking during the process of the suction cup 21 eliminating the negative pressure. Afterward, the first flipping frame 15 moves away from the second flipping frame 16, the flexible lip 211 of the suction cup 21 first detaches from the substrate 200, and the elastic member 23 then separates from the substrate 200, further preventing the flexible lip 211 from dragging the substrate 200 and causing the substrate 200 to shake. The surface of the elastic member 23 is rough to avoid adhesion to the substrate 200.

[0047] In addition, when air enters the inner side of the flexible lip 211 to eliminate negative pressure, the elastic element 23 is the first to be impacted by the air, thereby preventing damage to the substrate 200 when the air pressure inside the flexible lip 211 is high and directly impacts the substrate 200.

[0048] Furthermore, when the suction cup 21 adsorbs the substrate 200, the gap width between the inner side of the flexible lip 211 and the elastic element 23 is adjustable. This is because when negative pressure is applied, the flexible lip 211 tends to retract inwards; therefore, the greater the negative pressure, the smaller the gap width between the inner side of the flexible lip 211 and the elastic element 23. Figures 7 to 8 As shown, in this embodiment, the minimum gap width between the inner side of the flexible lip 211 and the elastic member 23 can be zero, that is, the inner side of the flexible lip 211 and the elastic member 23 can be in contact. At this time, the upper half of the contact part between the flexible lip 211 and the elastic member 23 is still connected to the air extraction hole 212 of the suction cup 21, while the lower half is still under negative pressure and adsorbs the substrate 200. Even if the negative pressure air source 22 continues to extract the air in the upper half, the negative pressure in the lower half will not change much, thereby ensuring that the adsorption force on the substrate 200 remains stable and avoiding damage to the substrate 200 due to excessive suction.

[0049] In this embodiment, the suction cup 21, the elastic element 23 and the support column 161 work together to simultaneously adsorb and flexibly hold the substrate 200. The elastic element 23 can also prevent the substrate 200 from deforming or shaking.

[0050] Example 3

[0051] like Figures 9 to 10 As shown, the difference between this embodiment and embodiment 2 is that the elastic element 23 is an elastic airbag; the gripping component 2 also includes an air supply element 24.

[0052] Specifically, the air supply component 24 includes an air pump, an air supply pipe 241, and valves 242. The air supply pipe 241 is a multi-port pipe. The air pump communicates with the interior of each elastic element 23 through the air supply pipe 241, which passes through the inner side of the flexible lip 211. Each branch of the air supply pipe 241 is equipped with a valve 242. By controlling each valve 242, the air volume in each elastic element 23 and the size of the elastic element 23 can be adjusted. By flexibly controlling the air volume in the elastic element 23, the elastic element 23 can provide better protection and clamping effect for the substrate 200, while also avoiding excessive pressure from the elastic element 23 on the substrate 200, which could damage the substrate 200.

[0053] Furthermore, in this embodiment, the gap width between the inner side of the flexible lip 211 and the elastic element 23 can also be changed by altering the air volume within the elastic element 23. The gap width between each elastic element 23 and the corresponding flexible lip 211 of the suction cup 21 can be either exactly the same or not exactly the same, and can be flexibly selected according to the actual situation. In this embodiment, when fixing the substrate 200, the gap width between each elastic element 23 and the corresponding flexible lip 211 of the suction cup 21 is exactly the same and the gap width is zero, thereby reducing fluctuations in the adsorption force.

[0054] When the amount of air in the elastic element 23 is large, the size of the elastic element 23 is also larger. In this case, only a small negative pressure needs to be formed on the inner side of the flexible lip 211 to deform the flexible lip 211 and fit it against the elastic element 23. Conversely, when the amount of air in the elastic element 23 is small, the size of the elastic element 23 is also smaller. In this case, a larger negative pressure needs to be formed on the inner side of the flexible lip 211 to deform the flexible lip 211 and fit it against the elastic element 23. Therefore, in this embodiment, the adsorption force of the suction cup 21 and the clamping force of the elastic element 23 on the substrate 200 can be flexibly distributed, thereby better fixing the substrate 200. For example, for some uneven parts of the substrate 200, the adsorption and fixing effect of the suction cup 21 may not be reliable enough. In this case, the amount of air in the elastic element 23 at the corresponding part can be increased, thereby increasing the clamping force, while the suction cup 21 at that part only plays an auxiliary fixing role.

[0055] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A substrate alignment and flipping machine, characterized in that, include: The flipping assembly (1) includes a mounting frame (11), a flipping frame flipping drive (12), and a first flipping frame (15); the first flipping frame (15) is rotatably mounted on the mounting frame (11), and the flipping frame flipping drive (12) is connected to the first flipping frame (15); The gripping component (2) includes a suction cup (21), an elastic element (23), and a negative pressure air source (22); the suction cup (21) is disposed on the first flipping frame (15), and the suction cup (21) is connected to the negative pressure air source (22); the suction cup (21) is used to adsorb the substrate (200); the suction cup (21) has a flexible lip (211), and the elastic element (23) is disposed on the inner side of the flexible lip (211). The suction cup (21) and the elastic element (23) are configured such that when the suction cup (21) approaches the substrate (200), the elastic element (23) contacts the substrate (200) before the suction cup (21), and when the flexible lip (211) just contacts the substrate (200), there is a gap between the inner side of the flexible lip (211) and the elastic element (23). Adjustment component (3) is connected to the mounting bracket (11) and is used to drive the substrate (200) to move or change its posture.

2. The substrate alignment and flipping machine according to claim 1, characterized in that: The elastic element (23) is an elastic airbag; The gripping component (2) also includes an air supply component (24), which is internally connected to the elastic member (23) and is used to introduce gas into the elastic member (23).

3. The substrate alignment and flipping machine according to claim 2, characterized in that: The gap width between the inner side of the flexible lip (211) and the elastic element (23) is adjustable.

4. The substrate alignment and flipping machine according to claim 3, characterized in that: The adjustment method for the gap width between the inner side of the flexible lip (211) and the elastic element (23) is that the negative pressure air source (22) changes the negative pressure between the inner side of the flexible lip (211) and the elastic element (23) and / or the air supply element (24) changes the air volume in the elastic element (23).

5. The substrate alignment and flipping machine according to claim 3, characterized in that: The minimum width of the gap between the inner side of the flexible lip (211) and the elastic element (23) is zero.

6. The substrate alignment and flipping machine according to claim 3, characterized in that: The number of suction cups (21) and elastic elements (23) are both multiple, and the suction cups (21) and elastic elements (23) correspond one-to-one; The gap width between each of the elastic elements (23) and the flexible lip (211) of the corresponding suction cup (21) is either the same or not exactly the same.

7. The substrate alignment and flipping machine according to claim 1, characterized in that: The flipping assembly (1) also includes a second flipping frame (16), a connecting seat (13), and a flipping frame moving drive (14). The connecting seat (13) is connected to the flipping frame flipping drive (12), and the flipping frame moving drive (14) and the second flipping frame (16) are both disposed on the connecting seat (13); the first flipping frame (15) is slidably disposed on the connecting seat (13); the flipping frame moving drive (14) is connected to the first flipping frame (15) and is used to drive the first flipping frame (15) to move closer to or away from the second flipping frame (16). The second flipping frame (16) is used to support the substrate (200).

8. The substrate alignment and flipping machine according to claim 7, characterized in that: The second flip plate is provided with a support column (161), the support column (161) points to the first flip frame (15), and the support column (161) is used to support the base plate (200). There are multiple support columns (161) and suction cups (21), and the positions of the support columns (161) and suction cups (21) correspond one-to-one.

9. The substrate alignment and flipping machine according to claim 8, characterized in that: The supporting column (161) has a flexible pad at one end facing the first flipping frame (15).

10. The substrate alignment and flipping machine according to claim 1, characterized in that: The substrate alignment and flipping machine also includes an alignment detection component (5), which is used to detect whether the substrate (200) is in a preset position.

Images