Dynamic balancing machine

Abstract

The application discloses a dynamic balance testing machine, which comprises a testing table, a clamping mechanism, a matching mechanism, a dynamic balance testing mechanism and a dynamic balance sensing mechanism. The clamping mechanism is slidably connected with the testing table top and clamps and drives the other end of a wafer cleaning brush to rotate. The matching mechanism clamps and drives the other end of the wafer cleaning brush to rotate. The dynamic balance testing mechanism is slidably connected with the testing table top. The dynamic balance sensing mechanism is connected with the dynamic balance testing mechanism. The application simulates the rotating speed under actual application, continuously tests the height of the surface cleaning bumps of the wafer cleaning brush in the rotating state, can detect the height value of the cleaning bumps on the wafer cleaning brush, sensitively feedbacks the change of the cleaning bumps on the wafer cleaning brush, judges whether there is an abnormal point according to the single circle rotating time and whether there are different values and the appearance frequency of the different values, detects the consistency of the diameter of the brush roller and the height of the bumps, evaluates the concentricity of the inner rod, the stability of the assembly of the inner rod and PVA cotton, and determines the number of abnormal points.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and more specifically, to a dynamic balancing testing machine. Background Technology

[0002] Wafer cleaning is a crucial step in semiconductor manufacturing, aiming to remove various contaminants from the wafer surface to ensure subsequent processing steps can be performed on a clean surface. As semiconductor device dimensions continue to shrink and precision requirements increase, the technical demands of wafer cleaning processes are becoming increasingly stringent. Even the smallest particles, organic matter, metal ions, or oxide residues on the wafer surface can significantly impact device performance, thereby affecting semiconductor device yield and reliability.

[0003] Wafer cleaning mainly includes the following steps: chemical dosing and soaking, spraying and brushing, rinsing and washing, and drying. Chemical dosing and soaking: Specific chemical agents, such as acidic hydrogen peroxide and ammonium hydroxide solutions, are added to the cleaning tank. These chemicals react with contaminants on the wafer surface, loosening and partially dissolving them. Spraying and brushing: In a high-pressure spraying system, high-pressure nozzles evenly spray the cleaning solution onto the wafer surface, removing attached contaminants through a combination of mechanical force and chemical action. In a brushing system, brushes rotate, working in conjunction with the cleaning solution to scrub the wafer surface. The chemical components in the cleaning solution react with the contaminants, and the brushes carry the loosened solid contaminants away from the wafer, further removing stubborn contaminants. Rinsing and washing: The wafer is rinsed in a rinsing tank to remove residual cleaning solution and dissolved contaminants, followed by washing to ensure a thorough cleaning of the wafer surface. Drying: The wafer surface is rapidly dried in a drying chamber using hot air or infrared radiation to prevent water stains and effectively remove static electricity from the wafer surface, reducing dust adsorption in subsequent processes.

[0004] During the cleaning process, a wafer cleaning brush is used. This brush is typically a roller brush, and cleaning of the wafer surface is achieved by rotating it. The surface of the wafer cleaning brush has cleaning bumps with a specific layout, size, and shape. Except for special process requirements, the cleaning bumps on the wafer cleaning brush surface should generally maintain the same height to ensure dynamic balance during rotation. This maximizes protection of the wafer from damage and ensures consistent cleaning results across different parts of the wafer. Summary of the Invention

[0005] In view of the shortcomings of the existing technology, the purpose of this invention is to provide a dynamic balancing testing machine to solve one or more of the above-mentioned problems.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A dynamic balancing testing machine includes a testing platform, on which are provided...

[0008] A clamping mechanism, which is slidably connected to the test stage surface, clamps one end of the wafer cleaning brush;

[0009] A cooperating mechanism is located at the opposite end of the clamping mechanism, which clamps and drives the other end of the wafer cleaning brush to rotate.

[0010] A dynamic balancing testing mechanism is slidably connected to the test table surface and is located behind the clamping mechanism and the mating mechanism.

[0011] A dynamic balancing sensing mechanism, which is connected to the dynamic balancing testing mechanism;

[0012] The dynamic balancing test mechanism approaches and contacts the rotating wafer cleaning brush. The cleaning bumps of different heights on the surface of the wafer cleaning brush cause the dynamic balancing test mechanism to swing at different amplitudes, which is fed back by the dynamic balancing sensing mechanism.

[0013] Furthermore, a transverse slide rail seat is provided on one side of the test platform, and two transverse slide rails are arranged horizontally and parallel on the transverse slide rail seat. A lead screw seat is provided at one end of the transverse slide rail seat.

[0014] Furthermore, the clamping mechanism includes two transverse sliding blocks, a transverse mounting base, a lead screw, and a limiting seat;

[0015] The transverse sliding block is slidably connected to the transverse sliding rail, and the transverse mounting base is fixedly connected to both transverse sliding blocks. The lead screw passes through the lead screw seat and abuts against the transverse mounting base. An elastic element is provided around the lead screw. The limiting seat is fixedly located at the other end of the transverse sliding rail seat. A buffer element is provided on the side of the limiting seat facing the transverse mounting base.

[0016] Furthermore, a docking coupling is provided on the transverse mounting base, and one end of the wafer cleaning brush is rotatably docked to the transverse mounting base through the docking coupling.

[0017] Furthermore, the mating mechanism includes a mating base, a rotary coupling, and a rotary motor.

[0018] The mating base is fixedly mounted on the test bench surface, the rotary motor is fixedly mounted on one end of the mating base, and the rotary coupling passes through the mating base, engaging with the end of the wafer cleaning brush.

[0019] The rotary motor drives the wafer cleaning brush to rotate via the rotary coupling.

[0020] Furthermore, a longitudinal slide rail seat is provided on the rear side of the test platform.

[0021] The dynamic balancing testing mechanism includes a test sliding stage, an induction mounting frame, a contact connection frame, and several contact plates.

[0022] The test slide stage is slidably connected to the longitudinal slide rail seat. The induction mounting frame is fixedly installed at the front end of the test slide stage. The contact connection frame is fixedly installed at the top of the induction mounting frame. A plurality of contact plates are horizontally arrayed and hinged to the front end of the contact connection frame and hang down. The dynamic balance sensing mechanism passes through the induction mounting frame.

[0023] Furthermore, the dynamic balancing sensing mechanism includes several contact sensors, several through couplings, and several point-touch sensors.

[0024] The through-coupling is inserted through the holes in the transverse array of the sensing mounting bracket, the contact sensor is inserted through the through-coupling, and the touch sensor is fixedly installed inside the test bench.

[0025] Furthermore, in the rotating state, the different cleaning bumps of the wafer cleaning brush sequentially push the contact plate backward, causing the contact sensor to move longitudinally backward and activate the touch sensor.

[0026] Furthermore, the height of the cleaning bumps of the wafer cleaning brush is reflected by the amplitude of the backward swing of the contact plate and / or the distance of the longitudinal backward movement of the contact sensor, and the change in the height of the cleaning bumps of the wafer cleaning brush is fed back by the touch sensor.

[0027] Furthermore, the front end of the contact sensor is provided with a contact wheel.

[0028] In summary, the present invention has the following beneficial effects: simulating the rotational speed under actual application conditions, by continuously testing the height of the surface cleaning bumps on the rotating wafer cleaning brush, it can not only detect the current height value of the cleaning bumps on the wafer cleaning brush, but also sensitively reflect the changes in the cleaning bumps on the wafer cleaning brush. Based on the single-turn rotation time and the presence or absence of different values ​​and the frequency of different values, it can determine whether there are any abnormal points, detect the consistency between the diameter of the brush roller itself and the height of the bumps, evaluate the concentricity of the inner rod, the stability of the assembly of the inner rod and PVA cotton, and determine the number of abnormal points. Attached Figure Description

[0029] Figure 1 A schematic diagram of the overall structure of one embodiment of the present invention;

[0030] Figure 2 A schematic diagram of the main structure of one embodiment of the present invention is provided;

[0031] Figure 3 This is a schematic diagram of a clamping mechanism and a mating mechanism in one embodiment of the present invention;

[0032] Figure 4 This is a schematic diagram of a dynamic balancing testing mechanism and a dynamic balancing sensing mechanism in one embodiment of the present invention.

[0033] In the diagram: 10. Test bench; 11. Transverse slide rail seat; 12. Transverse slide rail; 13. Lead screw seat; 14. Longitudinal slide rail seat; 20. Wafer cleaning brush; 30. Clamping mechanism; 31. Transverse sliding block; 32. Transverse mounting seat; 33. Lead screw component; 34. Limit seat; 35. Connecting coupling; 40. Mating mechanism; 41. Mating base; 42. Rotary coupling; 43. Rotary motor; 50. Dynamic balancing test mechanism; 51. Test sliding stage; 52. Induction mounting frame; 53. Contact connection frame; 54. Contact plate; 60. Dynamic balancing induction mechanism; 61. Contact sensor; 62. Through coupling; 63. Point touch sensor; 64. Contact wheel. Detailed Implementation

[0034] Example:

[0035] The following is in conjunction with the appendix Figure 1-4 The present invention will be described in further detail below.

[0036] Dynamic balancing testing machine, such as Figure 1 As shown, the main body is a cavity-type test station 10. The front of the test station 10 has a lifting door for easy placement and removal of the wafer cleaning brush 20 for testing, and it isolates the cavity from the outside during the testing process. The test station 10 mentioned below mainly refers to the test area inside the cavity. The electrical system, control panel, and behavior logic of the test station 10 itself will not be described in detail, but will be understood according to its actual function.

[0037] like Figure 2As shown, the left end of the test platform 10 is the clamping mechanism 30, and the right end is the mating mechanism 40. Their neutral lines must coincide during operation. Together, they clamp the wafer cleaning brush 20, and the mating mechanism 40 drives the wafer cleaning brush 20 to rotate. The clamping mechanism itself can be adjusted horizontally relative to the test platform 10. A matching dynamic balancing testing mechanism 50 and a dynamic balancing sensing mechanism 60 are located at the rear end of the test platform 10 to monitor the rotating wafer cleaning brush 20 in real time. The dynamic balancing sensing mechanism 60 is based on the dynamic balancing testing mechanism 50 and can move horizontally relative to the test platform 10. The dynamic balancing testing mechanism 50 approaches and contacts the rotating wafer cleaning brush 20, measuring its radius throughout its rotation. If the cleaning bumps or other factors cause a change in the radius of the wafer cleaning brush 20, it will be reflected by the different amplitudes of the oscillation of the dynamic balancing testing mechanism 50, providing direct feedback through the dynamic balancing sensing mechanism 60.

[0038] Among them, such as Figure 3 As shown, a transverse slide rail seat 11 is provided on the left end of the test bench 10. The bottom of the transverse slide rail seat 11 is a structural component, and the top is provided with two transverse slide rails 12 that are arranged horizontally and aligned in parallel. A lead screw seat 13 is provided on the transverse slide rail seat 11 corresponding to the left end of the transverse slide rail 12. The clamping mechanism 30 is entirely based on the transverse slide rail 12. The clamping mechanism 30 includes two transverse sliding blocks 31, a transverse mounting seat 32, a lead screw 33, and a limiting seat 34. The two transverse sliding blocks 31 are used to engage with the two transverse slide rails 12 to form a sliding structure. The transverse mounting seat 32 directly engages with the two transverse sliding blocks 31. The transverse mounting seat 32 has a transversely through slot and is used to clamp the left end of the wafer cleaning brush 20. The lead screw 33 passes through the lead screw seat 13, and the two are threadedly connected. The left end of the lead screw 33 passes through and abuts against the base of the transverse mounting seat 32, and an elastic element is provided around the outer ring of the lead screw 33. A limiting seat 34 is provided on the transverse slide rail seat 11 corresponding to the right end of the two transverse slide rails 12, and a buffer element is provided on the left side of the limiting seat 34. The transverse mounting seat 32 is moved and adjusted within its stroke range by the transverse sliding block 31 and the transverse slide rails 12. The lead screw 33 assists in the movement. Both the limiting seat 34 and the lead screw seat 13 serve to prevent the transverse mounting seat 32 from disengaging from the transverse slide rails 12 and to provide buffering. A docking coupling 35 passes through the slot of the transverse mounting seat 32. The left end of the wafer cleaning brush 20 is docked and clamped on the docking coupling 35 and rotates accordingly.

[0039] like Figure 2As shown, the mating mechanism 40 includes a mating base 41, a rotary coupling 42, and a rotary motor 43. The mating base 41 is fixedly mounted on the test bench 10 and aligned with the transverse mounting base 32, with aligned slots. The mating base 41 has two uprights. The rotary coupling 42 is installed in the slot of the left upright, and the rotary coupling 42 connects to the right end of the wafer cleaning brush 20. The right end face of the right upright is fixedly connected to the rotary motor 43. The output shaft of the rotary motor 43 passes through the slot of the right upright, and an additional coupling is provided on the left side of the right upright, which connects the output shaft of the rotary motor 43 and the rotary coupling 42. The output of the rotary motor 43 drives the wafer cleaning brush 20 to rotate through the rotary coupling 42.

[0040] like Figure 4 As shown, a longitudinal slide rail seat 14 is provided behind the test platform 10, and the slide rail of the longitudinal slide rail seat 14 is arranged in the front-to-back direction. The dynamic balancing test mechanism 50 includes a test sliding stage 51, a sensor mounting frame 52, a contact connection frame 53, and five contact plates 54. The bottom of the test sliding stage 51 is slidably connected to the longitudinal slide rail seat 14, and the sensor mounting frame 52 is fixedly provided at the front end of the test sliding stage 51. The sensor mounting frame 52 is an upright component, and the contact connection frame 53 is fixedly provided at its top. Five contact plates 54 are hinged to the front end of the contact connection frame 53. The five contact plates 54 are arranged in a horizontal array along the left and right sides, and the contact plates 54 hang naturally. The sensor mounting frame 52 is used to pass through the dynamic balancing sensor mechanism 60. The dynamic balancing sensor mechanism 60 includes five contact sensors 61, five through couplings 62, and five point touch sensors 63. The sensor mounting bracket 52 has corresponding through slots, and each control unit has a through coupling 62. The contact sensor 61 is mounted on the corresponding through coupling 62. The front end of the contact sensor 61 is provided with a contact wheel 64 to reduce impact and facilitate force application. The touch sensor is set at a distance from the rear end of the contact dry hardware, and the touch sensor is fixed on the mounting bracket inside the test bench 10.

[0041] The cleaning bumps of the rotating wafer cleaning brush 20 periodically and sequentially actuate the contact plate 54, causing it to swing backward and move the contact sensor 61 backward. The point-type sensor detects the change in distance from the contact sensor 61, takes a reading, and sends a signal. One contact plate 54 can cover the cleaning bumps within a corresponding area. Measurements are taken by area, and the brush is adjusted left and right to test related cleaning bumps individually, thus identifying abnormal points through elimination. The height of the cleaning bumps can be reflected by the swing amplitude of the contact plate 54 and the spacing of the contacts of the contact sensor 61, and the feedback is sent to the interactive interface by the point-type sensor.

[0042] The dynamic balancing tester measures the radius of the wafer cleaning brush 20 in a rotating state from start to finish. The theoretical value is the radius of the mandrel, the thickness of the cotton component, plus the height of the cleaning bumps. The acceptable radius and maximum permissible error of the calibration object are pre-set. The original sensor values ​​are linearly converted to the radius values ​​required for the project, and standard parts are used for pre-calibration to ensure the accuracy of the preset values. The calibration object must be cleaned before testing; otherwise, dimensional misjudgment may occur. The results are displayed as a real-time curve.

[0043] It should be noted that this specific embodiment is merely an explanation of the present invention and is not intended to limit the present invention. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A dynamic balancing testing machine, comprising a testing bench (10), characterized in that: The test bench (10) is equipped with A clamping mechanism (30) is slidably connected to the test stage (10) and clamps one end of the wafer cleaning brush (20); The cooperating mechanism (40) is located at the opposite end of the clamping mechanism (30) to clamp and drive the other end of the wafer cleaning brush (20) to rotate; The dynamic balancing testing mechanism (50) is slidably connected to the test table (10) and is located behind the clamping mechanism (30) and the cooperating mechanism (40); A dynamic balancing sensing mechanism (60) is connected to the dynamic balancing testing mechanism (50); The dynamic balancing test mechanism (50) approaches and contacts the rotating wafer cleaning brush (20). The cleaning bumps of different heights on the surface of the wafer cleaning brush (20) cause the dynamic balancing test mechanism (50) to swing at different amplitudes and receive feedback through the dynamic balancing sensing mechanism (60).

2. The dynamic balancing testing machine according to claim 1, characterized in that: The test bench (10) has a transverse slide rail seat (11) on one side of the table surface. The transverse slide rail seat (11) has two transverse slide rails (12) arranged horizontally and parallel. One end of the transverse slide rail seat (11) has a lead screw seat (13).

3. The dynamic balancing testing machine according to claim 2, characterized in that: The clamping mechanism (30) includes two transverse sliding blocks (31), a transverse mounting base (32), a lead screw (33), and a limiting seat (34); The transverse sliding block (31) is slidably connected to the transverse sliding rail (12), the transverse mounting base (32) is fixedly connected to both transverse sliding blocks (31), the lead screw (33) passes through the lead screw seat (13) and abuts against the transverse mounting base (32), the lead screw (33) is provided with an elastic element, the limiting seat (34) is fixedly provided at the other end of the transverse sliding rail seat (11), and the side of the limiting seat (34) facing the transverse mounting base (32) is provided with a buffer element.

4. The dynamic balancing testing machine according to claim 3, characterized in that: A docking coupling (35) is provided on the transverse mounting base (32), and one end of the wafer cleaning brush (20) is rotatably docked to the transverse mounting base (32) through the docking coupling (35).

5. The dynamic balancing testing machine according to claim 1, characterized in that: The mating mechanism (40) includes a mating base (41), a rotary coupling (42), and a rotary motor (43). The mating base (41) is fixedly mounted on the test bench (10) surface, the rotary motor (43) is fixedly mounted on one end of the mating base (41), and the rotary coupling (42) passes through the mating base (41) and engages with the end of the wafer cleaning brush (20). The rotary motor (43) drives the wafer cleaning brush (20) to rotate via the rotary coupling (42).

6. The dynamic balancing testing machine according to claim 1, characterized in that: The test bench (10) has a longitudinal slide rail seat (14) on the rear side of the table surface. The dynamic balancing testing mechanism (50) includes a test sliding stage (51), an induction mounting frame (52), a contact connection frame (53), and several contact plates (54). The test slide stage (51) is slidably connected to the longitudinal slide rail seat (14), the induction mounting frame (52) is fixedly disposed at the front end of the test slide stage (51), the contact connection frame (53) is fixedly disposed at the top of the induction mounting frame (52), a plurality of contact plates (54) are horizontally arrayed and hinged to the front end of the contact connection frame (53) and hang down, and the dynamic balance sensing mechanism (60) passes through the induction mounting frame (52).

7. The dynamic balancing testing machine according to claim 6, characterized in that: The dynamic balancing sensing mechanism (60) includes several contact sensors (61), several through couplings (62), and several point touch sensors (63). The through-coupling (62) is inserted through the holes in the transverse array of the sensing mounting bracket (52), the contact sensor (61) is inserted through the through-coupling (62), and the touch sensor (63) is fixedly installed inside the test bench (10).

8. The dynamic balancing testing machine according to claim 7, characterized in that: In the rotating state, the different cleaning bumps of the wafer cleaning brush (20) sequentially push the contact plate (54) backward, causing the contact sensor (61) to move longitudinally backward and activate the touch sensor (63).

9. The dynamic balancing testing machine according to claim 8, characterized in that: The height of the cleaning bumps of the wafer cleaning brush (20) is reflected by the amplitude of the backward swing of the contact plate (54) and / or the distance of the longitudinal backward movement of the contact sensor (61), and the change in the height of the cleaning bumps of the wafer cleaning brush (20) is fed back by the touch sensor (63).

10. The dynamic balancing testing machine according to claim 8, characterized in that: The contact sensor (61) has a contact wheel (64) at its front end.

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