Display compensation method, display panel manufacturing apparatus, and display device

Abstract

The application provides a display compensation method, a display panel manufacturing device and a display device. The method comprises the following steps: detecting the display state of each light-emitting chip on the driving backplate after the light-emitting chip is transferred to the driving backplate; determining a region abnormal cluster in the light-emitting chip according to the display state; determining a target transfer head corresponding to the region abnormal cluster, and matching a display compensation parameter corresponding to the target transfer head; and performing a display compensation operation on the light-emitting chip in the region abnormal cluster based on the display compensation parameter. The target transfer head corresponding to the region abnormal cluster is determined, and the display compensation parameter corresponding to the target transfer head is matched, so that the display compensation parameter can directly reflect the characteristics of the transfer head causing the region abnormal cluster, and then the display compensation is performed on the light-emitting chip in the region abnormal cluster in combination with the overall influence of the transfer head on the region abnormal cluster, thereby avoiding the compensation failure caused by the lack of surrounding healthy pixels.

Description

Technical Field

[0001] This invention relates to the field of displays, and more particularly to a display compensation method, display panel manufacturing equipment, and display device. Background Technology

[0002] Micro-LED display technology is considered the core of the next generation of display technology due to its superior performance. Mass transfer is a key step in its manufacturing process, which involves precisely assembling millions of micron-sized LED chips onto a driver backplane. However, the yield of this process is difficult to reach 100%, which leads to display abnormalities in the light-emitting chips on the driver backplane, such as failure to emit light or deviation of the light-emitting state from the design value.

[0003] In existing technologies, abnormal light-emitting chips are usually compensated by nearby healthy light-emitting chips. However, for mass transfer, the abnormal light-emitting chips after transfer have significant spatial clustering. The clustering of abnormal light-emitting devices causes the pixels around the abnormally displayed pixels to also be abnormal, making it too difficult to compensate one by one, thus making it difficult to effectively compensate for abnormal light-emitting chips. Summary of the Invention

[0004] The main objective of this invention is to provide a display compensation method, display panel manufacturing equipment, and display device, aiming to solve the problem in the prior art of compensating for abnormal light-emitting chips generated after mass transfer.

[0005] To achieve the above objectives, the present invention provides a display compensation method, the method comprising the steps of: After transferring the light-emitting chips to the driving backplane, the display status of each of the light-emitting chips on the driving backplane is detected. Based on the display state, an abnormal cluster of regions in the light-emitting chip is determined, wherein the abnormal cluster of regions is a region of the light-emitting chip that includes multiple consecutive abnormal display states; Determine the target transfer head corresponding to the anomaly cluster in the region, and match the display compensation parameters corresponding to the target transfer head; Based on the display compensation parameters, a display compensation operation is performed on the light-emitting chips within the abnormal clusters of the region.

[0006] Optionally, the matching of the display compensation parameters corresponding to the target transfer head includes: Acquire the historical process parameters, historical abnormal display status of historical light-emitting chips, and historical compensation parameters corresponding to the target transfer head from the historical transfer data; The historical process parameters, the historical anomaly display status, and the historical compensation parameters are used as training samples to train the compensation model; The display compensation parameters corresponding to the target transfer head include: Obtain the compensation model corresponding to the target transfer head, the current process parameters, and the abnormal display status corresponding to the light-emitting chip; The current process parameters and the abnormal display status are input into the compensation model to obtain the display compensation parameters.

[0007] Optionally, the step of determining the target transfer head corresponding to the regional anomaly cluster includes: Obtain the abnormal display status of each abnormal light-emitting chip in the abnormal cluster of the region; Determine the process adjustment parameters corresponding to the target transfer head based on the abnormal display status; The process parameters of the target transfer head are adjusted using the process adjustment parameters.

[0008] Optionally, determining the target transfer head corresponding to the regional anomaly cluster includes: Obtain the abnormal display status of the abnormal light-emitting chips contained in the abnormal cluster of the region; Determine whether the abnormal display states of the abnormal light-emitting chips are consistent; If the abnormal display states of the abnormal light-emitting chips are consistent, then the target transfer head corresponding to the abnormal cluster in the region is determined.

[0009] Optionally, the step of determining whether the abnormal display state of the abnormal light-emitting chip is consistent includes: If the abnormal display states of the abnormal light-emitting chips are inconsistent, then for each abnormal light-emitting chip, a target compensation area corresponding to the abnormal light-emitting chip is determined, and the abnormal light-emitting chip is located at the center of the target compensation area. The compensation amount of the abnormal light-emitting chip is determined based on the abnormal display state of the abnormal light-emitting chip; The compensation parameters corresponding to the compensation light-emitting chips within the target compensation area are determined based on the compensation amount. The display compensation parameters are obtained by associating the compensation light-emitting chip with the corresponding compensation parameters.

[0010] Optionally, determining the target compensation region corresponding to the abnormal light-emitting chip includes: Determine the first compensation region corresponding to the abnormal light-emitting chip, wherein the area of ​​the first compensation region is a first area; Obtain the number of normally emitting chips within the first compensation area, and determine whether the number of normally emitting chips is less than a preset compensation number threshold; If the number of normally emitting chips is less than the preset compensation number threshold, then a second compensation region corresponding to the abnormal emitting chip is determined, wherein the area of ​​the second compensation region is a second area, and the second area is greater than the first area; The second compensation region is taken as the target compensation region corresponding to the abnormal light-emitting chip.

[0011] Optionally, determining the compensation amount for the abnormal light-emitting chip based on its abnormal display state includes: Obtain the current brightness of the abnormal light-emitting chip; Determine the recoverable brightness corresponding to the current brightness, wherein the recoverable brightness is the brightness that can be achieved by increasing the driving signal of the abnormal light-emitting chip; Obtain the brightness difference between the recoverable brightness and the target brightness; The brightness difference is used as the compensation amount for the abnormal light-emitting chip.

[0012] Optionally, the step of performing display compensation operation on the light-emitting chips within the abnormal cluster of the region based on the display compensation parameters includes: Obtain the regional dimensions of the anomaly clusters in the region; Determine whether the dimensions of the region are greater than the maximum compensation size, wherein the maximum compensation size is less than the human eye's resolution scale; If the dimension of the region is greater than the maximum compensation size, then repairable light-emitting chips and light-emitting chips to be compensated are determined in the abnormal cluster of the region, wherein the sub-dimension of the abnormal sub-region formed by the consecutive light-emitting chips to be compensated is less than the maximum compensation size. The repaired light-emitting chip is physically repaired so that it can display in a normal display state; Perform display compensation operation on the light-emitting chip to be compensated.

[0013] To achieve the above objectives, the present invention also provides a display panel manufacturing apparatus, the display panel manufacturing apparatus including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program, when executed by the processor, implements the steps of the display compensation method as described above.

[0014] To achieve the above objectives, the present invention also provides a display device, which is manufactured by the display panel manufacturing equipment described above.

[0015] This invention proposes a display compensation method, display panel manufacturing equipment, and display device. After transferring light-emitting chips to a driving backplane, the display state of each light-emitting chip on the driving backplane is detected. Based on the display state, an abnormal cluster of regions within the light-emitting chips is determined, wherein the abnormal cluster is a region comprising multiple consecutive abnormal display states of the light-emitting chips. A target transfer head corresponding to the abnormal cluster is determined, and a display compensation parameter corresponding to the target transfer head is matched. Display compensation is performed on the light-emitting chips within the abnormal cluster based on the display compensation parameter. By determining the target transfer head corresponding to the abnormal cluster and matching the display compensation parameter corresponding to the target transfer head, the display compensation parameter can directly reflect the characteristics of the transfer head causing the abnormal cluster. Furthermore, by combining the overall influence of the transfer head on the abnormal cluster, display compensation is performed on the light-emitting chips within the abnormal cluster, avoiding compensation failure due to the lack of surrounding healthy pixels. Attached Figure Description

[0016] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a flowchart illustrating the first embodiment of the compensation method of the present invention; Figure 2 This is a schematic diagram of the abnormal light-emitting chip in the display compensation method of the present invention; Figure 3 This is a schematic diagram of the transfer head array in the compensation method of the present invention; Figure 4 This is a schematic diagram of the compensation process in the compensation method of the present invention; Figure 5 This is a schematic diagram showing the overall process of the compensation method of the present invention; Figure 6 This is a schematic diagram illustrating the feedback mechanism in the compensation method of the present invention; Figure 7 This is a schematic diagram of the module structure of the display panel manufacturing equipment of the present invention; Figure 8 This is a schematic diagram illustrating the manufacturing process of the display device of the present invention.

[0019] Annotation instructions: 10 - Communication module; 20 - Memory; 30 - Processor. Detailed Implementation

[0020] It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this application.

[0021] This invention provides a display compensation method, referring to... Figure 1 , Figure 1 This is a flowchart illustrating a first embodiment of the compensation method of the present invention, the method comprising the following steps: Step S10: After transferring the light-emitting chip to the driving backplane, detect the display status of each of the light-emitting chips on the driving backplane. The light-emitting chip is the smallest light-emitting unit in a Micro-LED display panel.

[0022] The driving backplane is a substrate with driving circuits and pixel circuits. The driving backplane is used to carry the light-emitting chip and provide driving signals to the light-emitting chip so that the light-emitting chip emits light according to the driving signals.

[0023] In Micro-LED display panels, the size of the light-emitting chips is reduced to the micrometer level, making it impossible to assemble them using the traditional pick-and-place method. Therefore, it is necessary to assemble millions of light-emitting chips from the source wafer to the driver backplane in one go or in batches through mass transfer.

[0024] Mass transfer is a process that uses a transfer head array to pick up and release light-emitting chips in batches from a source wafer to preset positions on a driver backplane. The transfer head array consists of multiple transfer heads, each of which is responsible for picking up and releasing light-emitting chips in a rectangular block on the driver backplane.

[0025] The display status refers to the brightness and color of the light-emitting chips under the drive of the standard drive signal. The standard drive signal can be set according to actual needs. For example, the standard drive signal is the drive signal corresponding to when the screen is white. When the screen is white, the red light-emitting chip displays red, the green light-emitting chip displays green, and the blue light-emitting chip displays blue.

[0026] The display status includes normal display status and abnormal display status; the light-emitting chip in the normal display status is a normal light-emitting chip, and the light-emitting chip in the abnormal display status is an abnormal light-emitting chip.

[0027] A normal display state is a display state in which the brightness and chromaticity of the light-emitting chip both fall within the threshold range required by the standard driving signal, that is, the light-emitting chip can emit light normally according to the design requirements; an abnormal display state is a display state in which at least one of the brightness and chromaticity of the light-emitting chip exceeds the threshold range required by the standard driving signal, that is, the light-emitting chip fails to emit light according to the design requirements, and display compensation is required.

[0028] See Figure 2 Abnormal display states include complete failure, abnormal brightness, and abnormal color.

[0029] A complete failure state is characterized by the absence of a light-emitting chip or electrical failure, resulting in a display state with zero brightness under a standard drive signal, which manifests as a dark spot on the display screen. An abnormal brightness condition occurs when the LED chip can emit light, but the brightness exceeds the brightness threshold range required by the standard drive signal, appearing as bright spots or dark spots on the display screen. The value of the brightness threshold range can be set based on actual needs, such as a brightness threshold range of ±30% of the standard brightness. A colorimetric abnormality is a display state in which the colorimetric value of the light-emitting chip deviates from the standard colorimetric value, which manifests as color dots on the display screen.

[0030] The specific detection method for the display status can be set based on actual needs. For example, in a packaging and testing station, the testing equipment drives the backplane to display a standard white field, and a high-precision imaging colorimeter scans the light-emitting chips to obtain the physical coordinates, brightness values, and chromaticity coordinates of each chip. Then, the brightness values ​​and chromaticity coordinates of each chip are compared with the standard brightness values ​​and standard chromaticity values ​​to determine the display status. Taking a 3840×2160 resolution (4K) display as an example, after determining the display status of each chip, it is found that the red chip at coordinates (1200, 500) is completely faulty with zero brightness, indicating a complete failure state; the blue chip at coordinates (800, 1500) has a brightness of only 70% of the standard value, indicating an abnormal brightness state.

[0031] Step S20: Determine the abnormal clusters of regions in the light-emitting chip according to the display state, wherein the abnormal clusters of regions are regions of the light-emitting chip that include multiple consecutive abnormal display states; An abnormal cluster is an area on the driver backplane covered by a series of consecutive abnormal LED chips. "Consecutive" here means that in the row and column arrangement of the driver backplane, adjacent abnormal LED chips are adjacent to each other; that is, there are no gaps between normal LED chips in the row or column direction, thus multiple abnormal LED chips together form a continuous area.

[0032] The specific method for determining the regional abnormal cluster can be set based on actual needs. For example, the physical coordinates of each abnormal light-emitting chip recorded in the defect map can be mapped to the transfer head array and the source wafer layout. The area covered by abnormal light-emitting chips with continuous coordinates and a number that reaches the preset cluster number can be determined as the regional abnormal cluster. The specific value of the preset cluster number can be set based on actual needs. For example, taking a display screen with a resolution of 3840×2160, i.e., 4K, after determining the display status of each light-emitting chip, it is found that there are 8×8 light-emitting chips with all abnormal display status near the coordinates (2000, 1000). Then, the light-emitting chips in this 8×8 area constitute the regional abnormal cluster.

[0033] It should be noted that the shape of regional anomaly clusters is not limited to rectangles; they can appear as lines, strips, or irregular blocks.

[0034] Step S30: Determine the target transfer head corresponding to the regional anomaly cluster, and match the display compensation parameters corresponding to the target transfer head; It is understandable that the clustering of abnormal light-emitting chips in the region may be caused by abnormal process parameters of the transfer head. For example, when the failure rate of the abnormal light-emitting chips in the rectangular block corresponding to the target transfer head is higher than a preset multiple of the overall average failure rate of the driving backplane, it can be determined that the regional abnormal cluster is caused by the target transfer head. Therefore, in this embodiment, after detecting the regional abnormal cluster, the corresponding target transfer head is determined, and compensation is then performed based on the target transfer head.

[0035] The target transfer head is the transfer head in the transfer head array that is responsible for transferring the light-emitting chips contained in the regional anomalous clusters to the driving backplane during the mass transfer process.

[0036] See Figure 3 There is a one-to-one mapping relationship between each transfer head in the transfer head array and each rectangular block on the drive backplane. Therefore, after determining the coordinate range covered by the regional anomaly cluster, the corresponding target transfer head can be determined based on this mapping relationship. For example, in the example above, the regional anomaly cluster near the coordinates (2000, 1000) corresponds to the picking area of ​​the (i, j)th transfer head in the transfer head array. Then, the (i, j)th transfer head is the target transfer head corresponding to the regional anomaly cluster.

[0037] The display compensation parameters are parameters used to perform display compensation for abnormal light-emitting chips.

[0038] It is understandable that defects caused by mass transfer have significant process-related characteristics, and the abnormal displays caused by the same transfer head during its life cycle are often consistent or similar. Therefore, for the same transfer head, the abnormal display states caused by it in different transfer tasks are similar, and thus, the compensation for the light-emitting chips with abnormal display states also needs to be similar. Therefore, in this embodiment, setting display compensation parameters corresponding to the target transfer head can effectively compensate for the abnormal display states caused by the process parameters of the target transfer head. At the same time, this compensation is not for a single light-emitting chip, but for the entire abnormal cluster in the region. Therefore, in implementation, it can combine the overall abnormal situation for comprehensive compensation, thereby improving the reliability of compensation.

[0039] Step S40: Perform display compensation operation on the light-emitting chips within the abnormal cluster of the region based on the display compensation parameters.

[0040] The display compensation operation is an operation that adjusts the driving signal of the light-emitting chip based on the display compensation parameters, so that the abnormal light-emitting chip can visually present the correct brightness and color.

[0041] The specific execution method of the display compensation operation can be set according to actual needs, as shown in the following figure. Figure 4 , 5 Real-time compensation is performed by a pixel signal remapping engine residing in the TCON (Timing Controller) or a dedicated processing chip.

[0042] This embodiment determines the target transfer head corresponding to the regional abnormal cluster and matches the display compensation parameters corresponding to the target transfer head, so that the display compensation parameters can directly reflect the characteristics of the transfer head that caused the regional abnormal cluster. Then, by combining the overall influence of the transfer head on the regional abnormal cluster, the display compensation is performed on the light-emitting chip in the regional abnormal cluster, avoiding compensation failure caused by the lack of surrounding healthy pixels.

[0043] Furthermore, in the second embodiment of the display compensation method of the present invention based on the first embodiment of the present invention, step S30 includes the following steps: Step S50: Obtain the historical process parameters, historical abnormal display status of the historical light-emitting chip, and historical compensation parameters corresponding to the target transfer head from the historical transfer data; Step S60: Use the historical process parameters, the historical anomaly display status, and the historical compensation parameters as training samples to train the compensation model; Step S30 includes the following steps: Step S31: Obtain the compensation model, current process parameters, and abnormal display status of the light-emitting chip corresponding to the target transfer head; Step S32: Input the current process parameters and the abnormal display status into the compensation model to obtain the display compensation parameters.

[0044] Historical transfer data refers to the data recorded during the mass transfer process of previous batches and panels. This data includes the process parameters used by each transfer head during transfer, the abnormal display states exhibited by each light-emitting chip after transfer, and the historical compensation parameters actually used to address these abnormal display states. Initially, these historical compensation parameters can be manually determined by staff. As the compensation model is trained, they are output by the model after training. It should be noted that the validity of the historical compensation parameters output by the compensation model can be verified. When the historical compensation parameters meet the compensation requirements, they are used as training samples.

[0045] After the target transfer head is determined, the historical transfer data corresponding to the target transfer head can be matched in the historical transfer data. The historical transfer data can be collected according to the identifier of the transfer head, that is, for each transfer head, its corresponding historical process parameters, historical abnormal display status of historical light-emitting chips, and historical compensation parameters can be collected separately.

[0046] Historical process parameters are the process parameters used by the target transfer head during the historical transfer process; the specific type of process parameters can be set according to actual needs, such as process parameters including but not limited to bonding force, alignment accuracy, vacuum degree, and pick-up and drop-off sequence.

[0047] The compensation model is used to output corresponding display compensation parameters based on the input process parameters and abnormal display status. The specific type of compensation model can be set according to actual needs, such as using a machine learning model or a neural network model.

[0048] In this embodiment, historical process parameters, historical anomaly display states, and historical compensation parameters are used as training samples to train the compensation model. This allows the compensation model to learn the relationship between the process parameters, anomaly display states, and compensation parameters of the transfer head. Thus, when compensation is needed, the corresponding target compensation parameters can be obtained by matching the process parameters and anomaly display parameters of the target transfer head. It should be noted that multiple sets of training samples can be obtained from historical transfer data generated by multiple transfers. In practical applications, the data generated by each transfer can be used as historical transfer data to optimize the compensation model, thereby continuously improving the accuracy of the compensation model.

[0049] When matching display compensation parameters is required, the current process parameters and the current abnormal display status are input into the compensation model to obtain the display compensation parameters. This allows full use of the compensation experience accumulated by the target transfer head during the historical transfer process to perform overall display compensation for the regional abnormal cluster, avoiding the need to inspect each light-emitting chip individually and improving the matching efficiency and accuracy of display compensation parameters.

[0050] Furthermore, in the third embodiment of the display compensation method of the present invention based on the first embodiment of the present invention, step S30 is followed by the following step: Step S70: Obtain the abnormal display status of each abnormal light-emitting chip in the abnormal cluster of the region; Step S80: Determine the process adjustment parameters corresponding to the target transfer head based on the abnormal display status; Step S90: Adjust the process parameters of the target transfer head using the process adjustment parameters.

[0051] Process adjustment parameters are parameters used to adjust the process parameters of the target transfer head. The specific types of process parameters targeted by the process adjustment parameters can be set according to actual needs. For example, process adjustment parameters include, but are not limited to, bond force adjustment, alignment accuracy compensation, vacuum degree adjustment, and pick-up / placement timing adjustment.

[0052] It is understandable that the process parameters of the target transfer head affect the abnormal display state of the light-emitting chip. In other words, the abnormal display state of the light-emitting chip also reflects problems in the process parameter settings of the target transfer head. If the abnormal cluster mainly shows a completely failed state, it indicates that there is a problem with the pick-up and release process of the target transfer head, such as insufficient vacuum causing the light-emitting chip to fall off during transfer, or insufficient bonding force causing the light-emitting chip to fail to bond effectively. If the abnormal cluster mainly shows an abnormal brightness state, it indicates that there is a consistency problem in the bonding process of the target transfer head, such as insufficient bonding force leading to excessive contact resistance.

[0053] Therefore, in this embodiment, after determining the target transfer head, the process adjustment parameters of the target transfer head are further determined based on the abnormal display status of each abnormal light-emitting chip within the regional abnormal cluster, and the process parameters of the target transfer head are adjusted to optimize the process parameters of the target transfer head and improve the physical yield of the next round of mass transfer; see also Figure 6In the TCON or special processing chip of the display driving link, a real-time pixel signal remapping engine is integrated, the input image frame is queried to the stored defect atlas, and compensation is applied in real time; the compensation model parameters can be based on the display content to output the driving signal, and feedback iteration optimization is integrated with the light sensor to monitor aging; the system can transfer the defect atlas to the process, forming a detection-compensation-process feedback closed loop. After the compensation engine runs through the entire panel, three types of correction data that can be fed back to the process are precipitated: 1. Multi-dimensional defect atlas, indicating the coordinates, types, and quantitative deviations of each defect; 2. Transfer head shadow parameters, which are obtained by looking up a table according to the transfer head position; 3. Cluster statistics, indicating which coordinates fail in blocks and clusters, and the failure rate of each cluster; the correction data is fed back to the mass transfer process through two paths, both of which point to the transfer head array; Path 1, process level, characterized by offline, slow, mapping defect coordinates back to the transfer head array / source wafer layout, identifying low-yield transfer heads (i, j), whose corresponding rectangular block failure rate is significantly higher, adjusting the bonding force, alignment accuracy, vacuum degree, pick-and-place timing of the transfer head, or replacing, maintaining the transfer head, or sorting the source wafer to remove defective chips in advance, thereby improving the physical yield of the next mass transfer; Path 2, model level, characterized by online, fast, even if the hardware has not been changed, the transfer head shadow has been quantified and written into the compensation model library, and the subsequent panel or the remaining area of the same panel is powered on by TCON to directly query the head deviation Profile to do regional gain / offset pre-compensation, and the signal layer is first smoothed to eliminate systematic deviations, so that the display uniformity under the same process defect is immediately up to standard. The two paths share the same correction data, forming a detection-compensation-process feedback closed loop.

[0054] The specific determination method of the process adjustment parameter can be set based on actual needs, such as pre-setting a corresponding relationship table between the abnormal display state and the process adjustment parameter, and after determining the main abnormal display state in the area abnormal cluster, the corresponding process adjustment parameter is obtained through the corresponding relationship table; or, a parameter adjustment model is set, and the parameter adjustment model is trained through the abnormal display state and the process adjustment parameter, so that the parameter adjustment model can obtain the process adjustment parameter through the abnormal display state.

[0055] It should be noted that adjusting the process parameters of the target transfer head by the process adjustment parameter does not conflict with the aforementioned display compensation operation; the adjustment of the process adjustment parameter acts on the subsequent mass transfer process, and its effect is reflected on the subsequent batches of panels, which is a root-cause treatment method; the display compensation operation acts on the display process of the current panel, and its effect is reflected on the current panel, which is a symptom treatment method. The two together constitute a closed loop of detection, compensation and process feedback, that is, after completing the compensation of the current panel, the transfer head-related information reflected in the defect map is fed back to the mass transfer process, so that the display uniformity of the current panel is immediately up to standard, and the physical yield of the subsequent batches is improved.

[0056] In other embodiments, when the number of area abnormal clusters or the failure rate corresponding to a certain transfer head exceeds the preset failure threshold, a maintenance prompt information for the transfer head can be directly output to prompt replacement or maintenance of the transfer head, such as replacing the suction nozzle of the transfer head, cleaning the vacuum pipeline, or re-calibrating the alignment.

[0057] The embodiment adjusts the process parameters of the target transfer head by the process adjustment parameter, so that the process causes of the area abnormal cluster can be directly fed back to the mass transfer link, thereby reducing the occurrence of similar defects in the subsequent mass transfer process.

[0058] Further, in the fourth embodiment of the display compensation method of the present application based on the first embodiment of the present application, step S30 comprises the steps of: Step S33, acquiring the abnormal display state of the abnormal light emitting chip contained in the area abnormal cluster; Step S34, determining whether the abnormal display states of the abnormal light emitting chips are consistent; Step S35, if the abnormal display states of the abnormal light emitting chips are consistent, determining the target transfer head corresponding to the area abnormal cluster.

[0059] It can be understood that whether the abnormal display states of the abnormal light emitting chips in the area abnormal cluster are consistent directly reflects whether the cause of the area abnormal cluster is single; when the abnormal display states of the abnormal light emitting chips are consistent, it means that the defects in the area abnormal cluster have the same cause, and therefore, it is highly likely that the same process cause of the transfer head causes it, at this time, the target transfer head corresponding to the area abnormal cluster is determined, and display compensation is performed based on the target transfer head.

[0060] Conversely, when the abnormal display states of the abnormal light emitting chips are inconsistent, it indicates that the causes of the abnormal cluster in the region are relatively complex, which can be caused by multiple reasons. At this time, if the abnormal cluster in the region is directly attributed to a certain transfer head and a unified compensation strategy is adopted, it will lead to compensation errors. Therefore, in this case, the display compensation is not based on the target transfer head.

[0061] It should be noted that in actual application, due to accidental factors, there can be a situation that multiple abnormal display states exist in the abnormal cluster caused by the transfer head. Therefore, a consistency proportion threshold can be set. When a certain abnormal display state in the abnormal light emitting chips contained in the abnormal cluster exceeds the consistency proportion threshold, it is considered to be caused by the transfer head, and the step of determining the target transfer head corresponding to the abnormal cluster is executed. The specific value of the consistency proportion threshold can be set based on actual needs, such as 80%.

[0062] In the case of consistent abnormal display states, since the defect manifestations of the light emitting chips in the abnormal cluster are uniform, cluster-level brightness and chroma rebalancing can be used to uniformly compensate the entire cluster. That is, the normal light emitting chips outside the cluster boundary are used as a reference to estimate the target brightness and target chroma of each abnormal light emitting chip in the cluster. The overall least squares constraint in the cluster is used to make the brightness transition of the entire compensated region smooth and free of color blocks and bright steps, thereby eliminating the seams generated by point-by-point compensation at the cluster boundary. In the case of inconsistent abnormal display states, each abnormal light emitting chip needs to be processed separately.

[0063] Further, step S34 includes the following steps: Step S36, if the abnormal display states of the abnormal light emitting chips are inconsistent, for each abnormal light emitting chip, determining a target compensation region corresponding to the abnormal light emitting chip, and the abnormal light emitting chip is located at the center of the target compensation region. Step S37, determining a compensation amount of the abnormal light emitting chip according to the abnormal display state; Step S38, determining a compensation parameter corresponding to a compensation light emitting chip in the target compensation region according to the compensation amount; Step S39, associating the compensation light emitting chip with the corresponding compensation parameter to obtain the display compensation parameter.

[0064] The target compensation area is the region centered on the abnormal light-emitting chip, used to perform display compensation for that chip. The specific shape of the target compensation area can be set according to actual needs, such as a square, rectangular, or circular area centered on the abnormal light-emitting chip; the specific area of ​​the target compensation area can be set according to actual needs, such as covering 3×3 light-emitting chips of the same color centered on the abnormal light-emitting chip.

[0065] The compensation light-emitting chip is a light-emitting chip in normal display state within the target compensation area, excluding abnormal light-emitting chips.

[0066] The compensation amount is the difference between the brightness and chromaticity of the abnormal light-emitting chip and the standard value; this difference needs to be eliminated through display compensation.

[0067] It is understandable that when the abnormal display states of the abnormal light-emitting chips within a cluster are inconsistent, if a uniform display compensation parameter is used to compensate the entire cluster, undercompensation will occur for abnormal light-emitting chips exhibiting a completely failed state, while overcompensation will occur for abnormal light-emitting chips exhibiting an abnormal brightness state, thus introducing new brightness and color differences within the cluster. Therefore, in this embodiment, a target compensation area and compensation amount are determined for each abnormal light-emitting chip, so that each abnormal light-emitting chip can obtain display compensation parameters that match its actual abnormal display state.

[0068] The compensation parameter indicates the parameters that need to be adjusted to compensate for the abnormal light emission state of the light emission chip, so that the light emission in the target compensation area is consistent with the normal light emission.

[0069] It is understandable that the human eye has limited ability to distinguish pixels in a display, that is, the human eye has a limited resolution scale. For multiple pixels in a small area, at a normal viewing distance, the human eye cannot distinguish a single pixel. Therefore, from the human eye's perspective, the light from the pixels in the area will merge into a whole. Thus, when a certain light-emitting chip malfunctions, the abnormality can be compensated by adjusting the display of the normal chips around it, so that the overall display of the area is normal. Therefore, in this embodiment, compensation parameters are set to adjust the surrounding normal compensation light-emitting chips to compensate for the abnormal light-emitting chip.

[0070] The specific method for determining the compensation parameters can be set based on actual needs. For example, Gaussian spatial weights can be used to set the compensation parameters, with the weight representing the degree to which the compensation chip compensates for the abnormal state of the abnormal chip. The distance between the compensation chip and the abnormal chip is negatively correlated with the weight. The abnormal chip is located at the center of the target compensation area, and the compensation chips are distributed around it. It can be understood that the closer the compensation chip is to the abnormal chip, the better the compensation effect of the compensation chip. Therefore, setting the distance between the compensation chip and the abnormal chip to be negatively correlated with the weight makes the compensation chip closer to the abnormal chip have a larger weight, so that the normal chips around the abnormal chip are geometrically symmetrically distributed, thereby making the compensation weight distribution uniform in all directions.

[0071] The compensation parameters can be determined by the compensation amount and weights. Within the target compensation area, the weights of each compensation chip are determined based on the distance to the abnormal light-emitting chip, and the sum of the weights of all compensation chips is 1. The product of the compensation amount and the weights is used as the compensation parameter of the corresponding compensation chip.

[0072] Understandably, the compensation parameters for different compensation LEDs are set based on their weights. Therefore, it is necessary to associate the compensation parameters with the compensation LEDs so that the association can be called in subsequent displays to obtain the compensation parameters of the compensation LEDs, and then achieve normal display based on the compensation parameters. The specific method of associating the compensation LEDs with their corresponding compensation parameters can be set according to actual needs. For example, a correspondence table between the physical coordinates of the compensation LEDs and the compensation parameters can be established, thereby binding the identifier of each compensation LED to its corresponding compensation parameter to obtain the display compensation parameters. After establishing the above correspondence, when the real-time pixel signal remapping engine finds the coordinates of a certain compensation LED, it can directly call its corresponding compensation parameters and calculate the driving increment of the compensation LED accordingly.

[0073] Taking an abnormal light-emitting chip within an abnormal cluster, exhibiting a brightness level 70% lower than the standard value, as an example, without considering self-recovery, its compensation amount is 1-70%=30%. If there are four compensation light-emitting chips within the target compensation area, with compensation weights of 0.25, 0.25, 0.25, and 0.25 respectively, then the compensation parameters allocated to the four chips are 30%×0.25=7.5%; 30%×0.25=7.5%; 30%×0.25=7.5%; 30%×0.25=7.5%. Associating the physical coordinates of the four chips with their respective compensation parameters yields the display compensation parameters corresponding to the abnormal light-emitting chip. The values ​​in the above example are merely illustrative; in practical applications, appropriate values ​​can be set based on actual needs.

[0074] Further, step S36 includes: Step S361: Determine the first compensation region corresponding to the abnormal light-emitting chip, wherein the area of ​​the first compensation region is the first area; Step S362: Obtain the number of normally emitting chips in the first compensation area, and determine whether the number of normally emitting chips is less than a preset compensation number threshold. Step S363: If the number of normally emitting chips is less than the preset compensation number threshold, then determine the second compensation area corresponding to the abnormal emitting chip, wherein the area of ​​the second compensation area is a second area, and the second area is greater than the first area; Step S364: The second compensation region is used as the target compensation region corresponding to the abnormal light-emitting chip.

[0075] If the number of normally emitting chips is greater than or equal to the preset compensation quantity threshold, then the first compensation area is taken as the target compensation area corresponding to the abnormal emitting chip.

[0076] The first compensation region is an initial compensation region defined with the abnormal light-emitting chip as the center, and its area is the first area. The second compensation region is an expanded compensation region determined when the number of normal light-emitting chips in the first compensation region is insufficient. Its area is the second area, and the second area is larger than the first area.

[0077] It should be noted that the dimensions of the largest compensation area should be smaller than the resolution scale of the human eye.

[0078] The specific values ​​of the first area and the second area can be set according to actual needs. For example, the first area corresponds to the area covered by 3×3 neighbors of the same color centered on the abnormal light-emitting chip, and the second area corresponds to the area covered by 5×5 neighbors of the same color centered on the abnormal light-emitting chip. In other embodiments, the second compensation area can be further expanded based on the first compensation area according to actual needs, such as setting a third compensation area or a fourth compensation area with a larger area, until the number of normal light-emitting chips in the area meets the requirements.

[0079] The number of normally operating light-emitting chips is the number of light-emitting chips in the first compensation area that are in a normal display state, that is, the number of light-emitting chips in the first compensation area that can be used to bear the burden of brightness and chromaticity distribution.

[0080] The preset compensation quantity threshold is the critical number of light-emitting chips that can be used for compensation. Its specific value can be set according to actual needs, such as 4, 6 or 8.

[0081] Within an abnormal cluster, surrounding chips of the same color may also be abnormal. In severe cases, there may be only a few or even none of the chips in normal display condition available for compensation. If the limited compensation amount is still distributed to a small number of normal chips, the compensation amount distributed to each normal chip will far exceed its compensation capacity. This will not only cause the normal chips that are being used for light to age prematurely, but will also create new bright spots visually. Therefore, in this embodiment, a first compensation area is first determined. Only when the number of normal light-emitting chips within the first compensation area is insufficient is the compensation area expanded to a larger second compensation area, which is then used as the target compensation area to ensure a sufficient number of compensation light-emitting chips participating in the compensation. For an abnormal light-emitting chip at the center of an abnormal cluster, its first compensation area is a 3×3 neighborhood area of ​​the same color centered on the abnormal chip. This area has 8 neighboring locations, of which 6 neighboring locations also exhibit abnormal display states, with only 2 in a normal display state, meaning the number of normal light-emitting chips is 2. If the preset compensation quantity threshold is 4, then 2 is less than 4. In this case, the compensation area is expanded to a 5×5 neighborhood area of ​​the same color centered on the abnormal chip, resulting in a second compensation area. If the number of light-emitting chips in a normal display state within this area is 12, meaning the number of normal light-emitting chips is sufficient, then the 5×5 second compensation area is used as the target compensation area corresponding to the abnormal chip. The area size, quantity, and threshold values ​​in the above example are merely feasible examples; in practical applications, appropriate values ​​can be set based on actual needs.

[0082] Further, step S37 includes: Step S371: Obtain the current brightness of the abnormal light-emitting chip; Step S372: Determine the recoverable brightness corresponding to the current brightness, wherein the recoverable brightness is the brightness that can be achieved by increasing the driving signal of the abnormal light-emitting chip; Step S373: Obtain the brightness difference between the recoverable brightness and the target brightness; Step S374: Use the brightness difference as the compensation amount for the abnormal light-emitting chip.

[0083] The current brightness is the actual brightness exhibited by the abnormal light-emitting chip under the standard driving signal. It is determined by the quantization deviation recorded in the defect map. For example, if the brightness of the abnormal light-emitting chip is 70% of the standard value, then its current brightness is 70% of the standard brightness.

[0084] The recoverable brightness is the brightness that can be achieved by increasing the drive signal to the abnormal light-emitting chip.

[0085] Understandably, LEDs are not typically driven to their rated maximum value during normal operation; they retain a certain driving margin. Therefore, for LEDs exhibiting abnormal low brightness, their brightness can be restored to some extent by increasing their driving signal. However, due to the limited driving margin and the fact that excessively high driving signals accelerate the aging of the LEDs, their brightness cannot be increased indefinitely; the upper limit is the recoverable brightness. The specific method for determining the recoverable brightness can be set based on actual needs, such as calculating it based on the rated driving signal of the abnormal LED and the current driving signal, or looking up a table based on the correspondence curve between brightness and driving signal obtained from production line calibration.

[0086] The target brightness is the brightness that the abnormal light-emitting chip should exhibit under ideal conditions, that is, the standard brightness corresponding to the standard driving signal.

[0087] The brightness difference is the difference between the recoverable brightness and the target brightness.

[0088] For an abnormal light-emitting chip exhibiting an abnormal brightness state, the missing brightness can be compensated either by increasing its own drive signal or by being shared by surrounding normal light-emitting chips. If all the missing brightness is shared by surrounding normal light-emitting chips, it will significantly increase the drive burden on surrounding normal light-emitting chips, leading to overload drive, increased power consumption, and accelerated aging. At the same time, since the drive margin of surrounding normal light-emitting chips is also limited, compensation will not be possible when the missing brightness exceeds its tolerable range. Therefore, in this embodiment, the current brightness of the abnormal light-emitting chip is first obtained, the recoverable brightness that can be achieved by increasing the drive signal is determined, and then the brightness difference between the recoverable brightness and the target brightness is calculated. This brightness difference is used as the compensation amount for the abnormal light-emitting chip, that is, only the remaining part that cannot be compensated by itself is shared by surrounding normal light-emitting chips, thereby making full use of the abnormal light-emitting chip's own drive margin.

[0089] Taking the blue light-emitting chip at the aforementioned coordinates (800, 1500) as an example, its current brightness is 70% of the standard value. If the driving signal is increased, its brightness can be restored to 85% of the standard value. If the target brightness is the standard value, the brightness difference between the restored brightness and the target brightness is 15% of the standard value. This 15% is the compensation amount of the abnormal light-emitting chip, which is the portion shared by the surrounding normal light-emitting chips.

[0090] It should be noted that the ratio between the self-recovery portion and the portion shared by the surrounding normal light-emitting chips can be adjusted based on the actual driving margin of the abnormal light-emitting chip and the tolerable margin of the surrounding normal light-emitting chips. For example, during the production line calibration stage, for blue / green light-emitting chips with weak light output, the overload driving degree of the surrounding light-emitting chips and the overall power consumption are tested under different self-recovery ratios. The safe ratio that ensures the uniformity after compensation meets the standard without overload driving is selected as the default parameter. When the abnormal light-emitting chip itself has sufficient driving margin, that is, when its recoverable brightness is greater than or equal to the target brightness, the brightness difference is less than or equal to zero. At this time, the compensation amount of the abnormal light-emitting chip is zero, that is, it does not need to be shared by the surrounding normal light-emitting chips, and the compensation can be completed by simply increasing the driving signal itself.

[0091] In other embodiments, for an abnormal light-emitting chip that exhibits a completely failed state, its current brightness is zero, and its recoverable brightness is also zero, meaning that no recovery can be achieved by increasing the driving signal. In this case, its compensation amount is equal to the target brightness, that is, all the brightness deficit is shared by the surrounding normal light-emitting chips according to the compensation weight.

[0092] This embodiment obtains the current brightness of the abnormal light-emitting chip, determines the recoverable brightness that can be achieved by increasing the driving signal, and uses the brightness difference between the recoverable brightness and the target brightness as the compensation amount for the abnormal light-emitting chip. This allows the driving margin of the abnormal light-emitting chip to be utilized first, and only the remaining brightness difference that cannot be compensated by itself is shared by the surrounding normal light-emitting chips. This reduces the driving burden of the surrounding normal light-emitting chips and the power consumption of the whole machine, and avoids the surrounding normal light-emitting chips from aging prematurely due to overload driving. At the same time, since the compensation amount is calculated based on the recoverability of the abnormal light-emitting chip itself, the compensation amount corresponds precisely to the actual degree of deficiency, avoiding overcompensation and undercompensation caused by a fixed compensation amount.

[0093] Further, step S40 includes: Step S41: Obtain the region dimensions of the anomaly clusters in the region; Step S42: Determine whether the dimensions of the region are greater than the maximum compensation size, wherein the maximum compensation size is less than the human eye's resolution scale; Step S43: If the dimension of the region is greater than the maximum compensation size, then determine the repair light-emitting chip and the light-emitting chip to be compensated in the abnormal cluster of the region, wherein the sub-dimension of the abnormal sub-region formed by the consecutive light-emitting chips to be compensated is less than the maximum compensation size. Step S44: Physically repair the repaired light-emitting chip so that it can display in a normal display state; Step S45: Perform display compensation operation on the light-emitting chip to be compensated.

[0094] The region dimension is the maximum span size of the region anomaly cluster in space. Its specific type can be set according to actual needs. For example, the region dimension includes the span of the region anomaly cluster in the row direction, the span in the column direction, or the span in a combination of the two. For example, taking the aforementioned 8×8 region anomaly cluster as an example, its region dimension is the actual size corresponding to the pitch of 8 light-emitting chips.

[0095] The maximum compensation size is the maximum linear dimension allowed in the compensation area, which is smaller than the resolution scale of the human eye.

[0096] The human eye's resolution scale is the smallest spatial size that the human eye can distinguish at a given viewing distance. It can be understood that the limit of human eye resolution is approximately 1 arcminute (J / min), which corresponds to a physical size on the screen of approximately 1 / 3400 of the viewing distance, or about 0.29 mm per meter of viewing distance. When the linear dimension of an abnormal cluster is smaller than this value, the brightness difference caused by neighboring light will be naturally blended by the human eye. However, when the linear dimension of an abnormal cluster is larger than this value, the abnormal cluster is too far from the nearest normal light-emitting chip, and the compensating light cannot effectively cover the abnormal light-emitting chip, causing the user to still be able to see the abnormal light-emitting chip. Based on a pixel pitch of 0.4 mm, the linear dimension of the aforementioned 8×8 abnormal cluster is approximately 3.2 mm, corresponding to approximately 11.0 to 3.7 J / min at a viewing distance of 1 to 3 meters. The J / min decreases as the viewing distance increases, far exceeding 1 J / min. Therefore, the 8×8 abnormal cluster is a relatively large boundary case.

[0097] The repaired light-emitting chip is the abnormal light-emitting chip selected from the regional abnormal cluster for physical repair; the specific physical repair method can be set according to actual needs, including but not limited to laser-induced forward transfer, laser resoldering, micro-transfer chip repair, or local bonding; after the physical repair is completed, the originally abnormal repaired light-emitting chip is repaired to a normal display state light-emitting chip, which can be used as a compensation light-emitting chip to compensate for the abnormal light-emitting chips around it.

[0098] The light-emitting chips to be compensated are the abnormal light-emitting chips in the regional abnormal cluster, excluding the light-emitting chips to be repaired.

[0099] An abnormal sub-region is a sub-region consisting of continuous light-emitting chips to be compensated, whose dimensions are smaller than the maximum compensation size.

[0100] Understandably, after the repaired light-emitting chip is restored to a normal light-emitting chip, the abnormal clusters in the originally large linear area are divided into multiple abnormal clusters with smaller linear dimensions, namely abnormal sub-regions. The linear dimension of each abnormal sub-region is smaller than the maximum compensation size. Therefore, compensation with abnormal sub-regions can avoid the problem of being perceived by the human eye due to excessive linearity.

[0101] The selection method for repairing the light-emitting chip can be set based on actual needs, such as setting "the maximum size of each connected component in the dead cluster does not exceed the compensable threshold D". maxUnder the constraint of minimizing the number of repaired pixels, the problem can be modeled as a combinatorial optimization problem, which can be solved using minimum cut, integer programming, or heuristic greedy algorithms to output a definite number of repaired light-emitting chips. For example, taking the aforementioned 9×9 region with 81 pixels and a pixel pitch of 0.4 mm as an example, repairing along the middle row and column results in the repair of 17 pixels, approximately 20% of the entire cluster. This divides the cluster into four approximately 4×4 abnormal sub-regions. The cluster center in each quadrant is approximately two light-emitting chips away from the nearest repaired chip, and the dimensions of a single abnormal sub-region are smaller than the maximum compensation size. Further... Furthermore, several more beads can be repaired within the key aberrant sub-regions. For example, repairing seven beads to form a small cross can further divide the quadrant into four smaller aberrant sub-regions, such as a 2×2 aberrant sub-region. The sub-dimension of a 2×2 aberrant sub-region is approximately 0.8 mm, which corresponds to approximately 0.9 arcminutes at a viewing distance of 3 meters. This falls within the human eye's fusion scale, achieving visual indistinguishability. The cluster size, number of beads repaired, proportion, and arcminute values ​​in the above examples are merely feasible illustrations. In practical applications, appropriate values ​​can be set based on actual needs.

[0102] It should be noted that even if the number of repaired light-emitting chips that fail again during subsequent use does not exceed the preset proportion of the total number of repaired chips, since they have been placed within the range of small-sized abnormal sub-regions, the new clusters formed by their failure are still within the compensable range. The specific value of the preset proportion can be set according to actual needs, such as 50%, and can still be covered by visual compensation, thus forming a synergistic effect of physically repairing one point and digitally supplementing a whole area.

[0103] This embodiment identifies the repairable light-emitting chip and the light-emitting chip to be compensated within the target compensation area when the linear dimension of an abnormal cluster exceeds the maximum compensation size. First, the repairable light-emitting chip is physically repaired to break the large cluster into several abnormal sub-regions with linear dimensions smaller than the maximum compensation size. Then, display compensation is performed on the light-emitting chip to be compensated. This transforms the previously unsolvable situation of large-size abnormal clusters exceeding the compensable size criterion—where only whole-cluster physical repair or abandonment of compensation is possible—into a solvable situation combining partial physical repair and digital compensation. This significantly reduces physical repair costs and process rework rates while extending the applicability of visual compensation to larger-size defect scenarios. Simultaneously, since the repairable light-emitting chip is in a normal display state after repair, the distance between the cluster center of each abnormal sub-region and the nearest normal light-emitting chip falls back to within the effective diffusion radius of compensation, resulting in more uniform compensation.

[0104] In this embodiment, the values ​​corresponding to each of the aforementioned criteria can be determined by the following calibration process: The first step is to select standard samples in the production line and use an imaging colorimeter to scan them under a standard white field to obtain the physical coordinates, brightness values ​​and chromaticity coordinates of each light-emitting chip, thus forming a standard defect map. The second step is to manually verify the abnormal display status type of each abnormal light-emitting chip to obtain a labeled benchmark sample set. The third step involves running the display compensation method described in this invention under multiple candidate values ​​for preset cluster number, preset compensation number threshold, consistency ratio threshold, maximum compensation size and self-recovery ratio, and retesting the brightness uniformity and chromaticity deviation of the compensated area with an imaging colorimeter. The fourth step is to select candidate values ​​that ensure the uniformity of brightness in the compensated area meets the standard and that the driving increment of the compensation light-emitting chip does not exceed its rated margin, and write these values ​​into the non-volatile memory area of ​​the display panel as factory default parameters. Fifth, repeat the above process after product or process changes to recalibrate the parameters. It should be noted that the implementation of this invention does not depend on the accuracy of the values ​​obtained from the above calibration. Any implementation method that satisfies the technical concept of attributing anomalies to the transfer head, compensating for cluster-wide damage, and, when necessary, physically repairing broken clusters, falls within the protection scope of this invention.

[0105] External measurable characteristics: After implementation of this invention, the following characteristics can be directly observed on the product side by external instruments, which can be used to verify the implementation effect, factory calibration, and product consistency: First, when scanned with an imaging colorimeter under a standard white field, it can be measured that the brightness uniformity of the area where the abnormal clusters are located after compensation is improved compared with that before compensation, and there are no distinguishable seams, brightness levels and color blocks between the area and the surrounding normal area. Second, by scanning with a high-brightness grayscale image, it can be measured that the driving signal of each compensation light-emitting chip in the target compensation area has a non-zero driving increment relative to the nominal value, and the driving increment is negatively correlated with its distance relative to the abnormal light-emitting chip, and has a spatial distribution with a predetermined weight. Third, for abnormal light-emitting chips that exhibit abnormal brightness, it can be measured that their driving signal is higher than the standard driving signal, and their actual brightness is between the current brightness and the recoverable brightness. Fourth, for the display panel that has undergone the physical repair treatment, it can be measured that there are multiple abnormal sub-regions in the abnormal cluster of the region with a linearity smaller than the maximum compensation size, and there are repaired light-emitting chips displayed in normal display state between adjacent abnormal sub-regions; Fifth, the defect map, transfer head shadow parameters, and calibration parameters in the non-volatile storage area of ​​the display panel can be read and compared with the aforementioned external test results for consistency verification.

[0106] It should be noted that, for the sake of simplicity, the foregoing method embodiments are all described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, as some steps may be performed in other orders or simultaneously according to this application. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions and modules involved are not necessarily essential to this application.

[0107] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods according to the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0108] Reference Figure 7 In terms of hardware structure, the display panel manufacturing equipment may include components such as a communication module 10, a memory 20, and a processor 30. In the display panel manufacturing equipment, the processor 30 is connected to both the memory 20 and the communication module 10. The memory 20 stores a computer program, which is executed by the processor 30. When the computer program is executed, it implements the steps of the above-described method embodiments.

[0109] The communication module 10 can connect to external communication devices via a network. The communication module 10 can receive requests from the external communication devices and can also send requests, instructions, and information to the external communication devices. The external communication devices can be other display panel manufacturing equipment, servers, or IoT devices, such as televisions, etc.

[0110] The memory 20 can be used to store software programs and various data. The memory 20 may primarily include a program storage area and a data storage area. The program storage area may store the operating system, at least one application program required for a function (such as detecting the display status of each of the light-emitting chips on the driver backplane), etc.; the data storage area may include a database, and may store data or information created based on system usage. Furthermore, the memory 20 may include high-speed random access memory, and may also include non-volatile memory, such as at least one disk storage device, flash memory device, or other volatile solid-state storage device.

[0111] The processor 30 is the control center of the display panel manufacturing equipment. It connects to various parts of the equipment via various interfaces and lines. By running or executing software programs and / or modules stored in the memory 20, and by calling data stored in the memory 20, it performs various functions and processes data, thereby providing overall monitoring of the display panel manufacturing equipment. The processor 30 may include one or more processing units; optionally, it may integrate an application processor and a modem processor. The application processor primarily handles the operating system, user interface, and applications, while the modem processor primarily handles wireless communication. It is understood that the modem processor may not be integrated into the processor 30.

[0112] although Figure 7 Not shown, but the aforementioned display panel manufacturing equipment may further include a circuit control module, which is connected to a power supply to ensure the normal operation of other components. Those skilled in the art will understand that... Figure 7 The display panel manufacturing equipment structure shown does not constitute a limitation on the display panel manufacturing equipment. It may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0113] The present invention also proposes a display device, see [link to relevant documentation]. Figure 8 The display device is manufactured using the display panel manufacturing equipment described above.

[0114] In this invention, the terms "first," "second," "third," "fourth," and "fifth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0115] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0116] Although embodiments of the present invention have been shown and described above, the scope of protection of the present invention is not limited thereto. It is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, and substitutions to the above embodiments within the scope of the present invention, and such changes, modifications, and substitutions should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A display compensation method, characterized in that, The display compensation method includes: After transferring the light-emitting chips to the driving backplane, the display status of each of the light-emitting chips on the driving backplane is detected. Based on the display state, an abnormal cluster of regions in the light-emitting chip is determined, wherein the abnormal cluster of regions is a region of the light-emitting chip that includes multiple consecutive abnormal display states; Determine the target transfer head corresponding to the anomaly cluster in the region, and match the display compensation parameters corresponding to the target transfer head; Based on the display compensation parameters, a display compensation operation is performed on the light-emitting chips within the abnormal clusters of the region.

2. The display compensation method as described in claim 1, characterized in that, The process of matching the display compensation parameters corresponding to the target transfer head includes: Acquire the historical process parameters, historical abnormal display status of historical light-emitting chips, and historical compensation parameters corresponding to the target transfer head from the historical transfer data; The historical process parameters, the historical anomaly display status, and the historical compensation parameters are used as training samples to train the compensation model; The display compensation parameters corresponding to the target transfer head include: Obtain the compensation model corresponding to the target transfer head, the current process parameters, and the abnormal display status corresponding to the light-emitting chip; The current process parameters and the abnormal display status are input into the compensation model to obtain the display compensation parameters.

3. The display compensation method as described in claim 1, characterized in that, After determining the target transfer head corresponding to the regional anomaly cluster, the following steps are included: Obtain the abnormal display status of each abnormal light-emitting chip in the abnormal cluster of the region; Determine the process adjustment parameters corresponding to the target transfer head based on the abnormal display status; The process parameters of the target transfer head are adjusted using the process adjustment parameters.

4. The display compensation method as described in claim 1, characterized in that, The step of determining the target transfer head corresponding to the regional anomaly cluster includes: Obtain the abnormal display status of the abnormal light-emitting chips contained in the abnormal cluster of the region; Determine whether the abnormal display states of the abnormal light-emitting chips are consistent; If the abnormal display states of the abnormal light-emitting chips are consistent, then the target transfer head corresponding to the abnormal cluster in the region is determined.

5. The display compensation method as described in claim 4, characterized in that, The step of determining whether the abnormal display states of the abnormal light-emitting chips are consistent includes: If the abnormal display states of the abnormal light-emitting chips are inconsistent, then for each abnormal light-emitting chip, a target compensation area corresponding to the abnormal light-emitting chip is determined, and the abnormal light-emitting chip is located at the center of the target compensation area. The compensation amount of the abnormal light-emitting chip is determined based on the abnormal display state of the abnormal light-emitting chip; The compensation parameters corresponding to the compensation light-emitting chips within the target compensation area are determined based on the compensation amount. The display compensation parameters are obtained by associating the compensation light-emitting chip with the corresponding compensation parameters.

6. The display compensation method as described in claim 5, characterized in that, Determining the target compensation region corresponding to the abnormal light-emitting chip includes: Determine the first compensation region corresponding to the abnormal light-emitting chip, wherein the area of ​​the first compensation region is a first area; Obtain the number of normally emitting chips within the first compensation area, and determine whether the number of normally emitting chips is less than a preset compensation number threshold; If the number of normally emitting chips is less than the preset compensation number threshold, then a second compensation region corresponding to the abnormal emitting chip is determined, wherein the area of ​​the second compensation region is a second area, and the second area is greater than the first area; The second compensation region is taken as the target compensation region corresponding to the abnormal light-emitting chip.

7. The display compensation method as described in claim 5, characterized in that, The step of determining the compensation amount of the abnormal light-emitting chip based on the abnormal display state of the abnormal light-emitting chip includes: Obtain the current brightness of the abnormal light-emitting chip; Determine the recoverable brightness corresponding to the current brightness, wherein the recoverable brightness is the brightness that can be achieved by increasing the driving signal of the abnormal light-emitting chip; Obtain the brightness difference between the recoverable brightness and the target brightness; The brightness difference is used as the compensation amount for the abnormal light-emitting chip.

8. The display compensation method as described in claim 1, characterized in that, The step of performing display compensation operation on the light-emitting chips within the abnormal cluster of the region based on the display compensation parameters includes: Obtain the regional dimensions of the anomaly clusters in the region; Determine whether the dimensions of the region are greater than the maximum compensation size, wherein the maximum compensation size is less than the human eye's resolution scale; If the dimension of the region is greater than the maximum compensation size, then repairable light-emitting chips and light-emitting chips to be compensated are determined in the abnormal cluster of the region, wherein the sub-dimension of the abnormal sub-region formed by the consecutive light-emitting chips to be compensated is less than the maximum compensation size. The repaired light-emitting chip is physically repaired so that it can display in a normal display state; A display compensation operation is performed on the light-emitting chip to be compensated.

9. A display panel manufacturing apparatus, characterized in that, The display panel manufacturing apparatus includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program, when executed by the processor, implements the steps of the display compensation method as described in any one of claims 1 to 8.

10. A display device, characterized in that, The display device is manufactured using the display panel manufacturing equipment as described in claim 9.

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