Itla wave-locking method and system based on etalon s parameters
Patent Information
- Application Number
- CN202611196387.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-08-07
- Publication Date
- 2026-11-03
AI Technical Summary
[0005]本申请的主要目的在于提供一种基于Etalon S参数的ITLA波锁定标方法及系统,以解决现有技术中ITLA在高低温工况及多功率档位下波长偏移量大,无法满足全温域波长锁定精度要求的问题
[0015]本方法针对现有波锁定标方案采用单一维度参数模型导致全温域波长偏移量大的技术问题,通过构建S参数-温度多维度采样数据集并提取全局统一的锁波基准,结合全局寻优定位最优工作点,利用高斯过程回归拟合温度斜率系数,并建立功率交叉补偿与壳温全温域补偿系数矩阵,实现激光温度、Etalon温度、壳温与输出功率之间的多维度交叉补偿,使ITLA在全温域及多功率档位下波长锁定精度满足规格要求。
Smart Images

Figure CN123034897A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of data processing technology, and in particular to an ITLA wave-locking calibration method and system based on Etalon S-parameters. Background Technology
[0002] As dense wavelength division multiplexing systems evolve towards ultra-high-speed coherent optical communication, tunable lasers (ITLAs), as core light source devices, directly determine channel isolation and transmission performance through their wavelength locking accuracy.
[0003] Existing ITLA typically uses the Etalon etalon as a wavelength reference element. It achieves wavelength closed-loop locking by detecting the power ratio of transmitted light to reference light, i.e., the S-parameter, and performs wave-lock calibration to obtain compensation parameters across the entire operating range from room temperature to high and low temperatures.
[0004] However, existing wave-locking calibration schemes use a single-dimensional parameter model and fail to establish a multi-dimensional cross-compensation relationship between laser temperature, Etalon temperature, shell temperature, and output power. Specifically, the S-parameter wave-locking reference relies on empirical values for a single wavelength, and the wave-locking direction is inconsistent because the operating points of different channels fall on different slope segments of the Etalon transmission curve. Temperature compensation uses a single slope coefficient to cover the entire temperature range without distinguishing the independent effects of laser temperature, Etalon temperature, and shell temperature on the wavelength, as well as the thermal hysteresis effect of temperature rise and fall. The S-parameter drift caused by power switching lacks a quantitative compensation model. These defects result in large wavelength shifts in ITLA under high and low temperature conditions and at multiple power levels, failing to meet the wavelength locking accuracy requirements across the entire temperature range. Summary of the Invention
[0005] The main objective of this application is to provide an ITLA wave-locking calibration method and system based on Etalon S-parameters to solve the problem that the wavelength offset of existing ITLA is large under high and low temperature conditions and multiple power levels, which cannot meet the requirements of wavelength locking accuracy across the entire temperature range.
[0006] To achieve the above objectives, this application provides the following technical solution:
[0007] An ITLA wavelocking calibration method based on Etalon S-parameters, the ITLA wavelocking calibration method comprising:
[0008] Step S1: Acquire Etalon transmitted light detection signal PD1 and reference light detection signal PD2 to calculate the S-parameter sequence, and simultaneously record TEC2 temperature sampling value and laser temperature sampling value to construct an S-parameter-temperature multi-dimensional sampling dataset.
[0009] Step S2: Perform dual-wavelength intersection determination on the S-parameter-temperature multi-dimensional sampling dataset, and extract the globally unified S-parameter locked-wave reference SCaliTar by calculating the intersection of the two S-TEC2 temperature curves.
[0010] Step S3: Using the S-parameter lock-in reference SCaliTar as the target value, the TEC2 temperature control parameter space is searched globally to locate the optimal operating point temperature EtlTemp0 of Etalon and complete the lock-in loop closure.
[0011] Step S4: Scan the laser temperature and Etalon temperature multi-point data within the upper and lower intervals of the Etalon optimal operating point temperature EtlTemp0, and output the laser temperature-wavelength slope coefficient and Etalon temperature-wavelength slope coefficient through Gaussian process regression fitting.
[0012] Step S5: Under the target channel locked state, acquire a scanning dataset of multiple power points at equal intervals, and substitute the laser temperature-wavelength slope coefficient and the Etalon temperature-wavelength slope coefficient into the scanning dataset to fit and calculate the power-S parameter compensation coefficient dS0dPwr and the Etalon temperature-power compensation coefficient dPwr_dTetalon.
[0013] Step S6: Based on the power-S parameter compensation coefficient dS0dPwr and the Etalon temperature-power compensation coefficient dPwr_dTetalon, measure the open-loop and closed-loop wavelength offset and power change under high and low temperature shell temperature environments, and fit to generate a shell temperature-wavelength full-temperature-range compensation coefficient matrix.
[0014] Beneficial effects of steps S1 to S6:
[0015] This method addresses the technical problem of large wavelength offset across the entire temperature range caused by the single-dimensional parameter model used in existing wave-locking calibration schemes. It constructs a multi-dimensional S-parameter-temperature sampling dataset and extracts a globally unified wave-locking reference. Combined with global optimization to locate the optimal operating point, it uses Gaussian process regression to fit the temperature slope coefficient and establishes a power cross-compensation and shell temperature full-temperature-range compensation coefficient matrix. This achieves multi-dimensional cross-compensation between laser temperature, Etalon temperature, shell temperature, and output power, enabling ITLA to meet the wavelength locking accuracy requirements across the entire temperature range and multiple power levels.
[0016] The steps are as follows: Step S1 constructs a multi-dimensional sampling dataset to provide a unified data foundation for subsequent calculations; Step S2 extracts a global wave-locking reference to eliminate the inconsistency in wave-locking directions for different channels; Step S3 quickly locates the optimal operating point and completes the wave-locking loop closure through global optimization; Step S4 improves compensation accuracy by fitting the temperature slope coefficients that distinguish the heating and cooling directions through Gaussian process regression; Step S5 establishes cross-compensation coefficients for power, S-parameters, and Etalon temperature to eliminate wavelength drift caused by power switching; and Step S6 fits and generates a full-temperature-range compensation coefficient matrix to cover high and low temperature operating conditions.
[0017] As a further improvement to this application, in step S1, the Etalon transmitted light detection signal PD1 and the reference light detection signal PD2 are acquired to calculate the S-parameter sequence, and the TEC2 temperature sampling value and the laser temperature sampling value are recorded simultaneously to construct an S-parameter-temperature multi-dimensional sampling dataset, including:
[0018] Step S1.1: Configure the wavelength as the first channel and the first channel plus half of the Etalon free spectrum range respectively to obtain two target wavelength configurations;
[0019] Step S1.2: Scan the TEC2 temperature under the two target wavelength configurations respectively, and collect the Etalon transmitted light detection signal PD1 and the reference light detection signal PD2 at each sampling point to obtain the PD1 sampling value sequence and PD2 sampling value sequence of each of the two curves;
[0020] Step S1.3: Divide the PD1 sample value sequence by the corresponding PD2 sample value sequence to calculate the S-parameter sequences of the two curves, where the S-parameter is defined as the ratio of PD1 to PD2.
[0021] Step S1.4: Simultaneously record the TEC2 temperature sampling value at each sampling point and read the laser temperature sampling value to obtain the TEC2 temperature sequence and the laser temperature sequence;
[0022] Step S1.5: Align the S-parameter sequence, the TEC2 temperature sequence, and the laser temperature sequence according to the sampling timestamps, and concatenate them into an S-parameter-temperature multi-dimensional sampling dataset.
[0023] Beneficial effects of steps S1.1 to S1.5:
[0024] This series of steps, through dual-wavelength configuration and step-by-step acquisition of PD1 and PD2 signals, provides independent data sources for S-parameter calculation and synchronous temperature recording, ensuring the integrity and traceability of the sampled dataset and avoiding the wavelength locking reference deviation caused by single-wavelength sampling in traditional solutions. By separating wavelength configuration, signal acquisition, parameter calculation, and temperature recording into independent steps, the risk of timing misalignment during parallel acquisition of multi-source data is eliminated, providing a multi-dimensional data foundation with strictly aligned timestamps for subsequent dual-wavelength intersection calculation.
[0025] The steps are as follows: Step S1.1 obtains two target wavelength configurations to provide wavelength references for subsequent scanning; Step S1.2 acquires the sampled value sequences of PD1 and PD2 to retain the original detection signals; Step S1.3 calculates the S-parameter sequence to clarify the wave-locking parameters; Step S1.4 synchronously records the TEC2 temperature and laser temperature sequences to achieve multi-dimensional data alignment; Step S1.5 splices the data into a unified dataset according to timestamps to ensure the accuracy of subsequent intersection point calculations.
[0026] As a further improvement to this application, step S2 involves determining the intersection of two wavelengths in the S-parameter-temperature multidimensional sampling dataset, and extracting the globally unified S-parameter-locked reference SCaliTar by calculating the intersection of two S-TEC2 temperature curves, including:
[0027] Step S2.1: Extract the S-parameter sequences and corresponding TEC2 temperature sequences of the two curves from the S-parameter-temperature multidimensional sampling dataset, and construct the S-TEC2 temperature curve of the first channel and the S-TEC2 temperature curve of the second channel respectively.
[0028] Step S2.2: Solve for the intersection points of the S-TEC2 temperature curves of the first channel and the S-TEC2 temperature curves of the second channel to obtain the intersection point set;
[0029] Step S2.3: Select the intersection point closest to the target temperature from the set of intersection points, and extract the ordinate S value of the intersection point as the globally unified S-parameter wave-locking reference SCaliTar.
[0030] Beneficial effects of steps S2.1 to S2.3:
[0031] This series of steps extracts dual-wavelength curves and solves for their intersection points, providing a unified characteristic intersection point for determining the global wave-locking benchmark. This eliminates ambiguity in wave-locking direction caused by different channels operating at different slope segments of the transmission curve. Compared to traditional methods that rely on empirical values of a single wavelength to set the wave-locking benchmark, this series of steps determines SCaliTar based on the geometric characteristics of the dual-wavelength intersection points. This ensures that all channels operate at the same characteristic point on the Etalon transmission curve, fundamentally avoiding the risk of wave-locking failure caused by inconsistent slope signs, and providing a unique and definite benchmark target for subsequent global optimization.
[0032] In step S2.1, two S-TEC2 temperature curves are constructed to provide input for solving the intersection point; step S2.2, the intersection point is solved to obtain the intersection point set and lock the candidate benchmark point; step S2.3, the intersection point closest to the target temperature is selected to extract SCaliTar to ensure the engineering feasibility of the benchmark value.
[0033] As a further improvement to this application, step S3, using the S-parameter lock-in reference SCaliTar as the target value, involves globally optimizing the TEC2 temperature control parameter space to locate the optimal operating temperature EtlTemp0 of Etalon and complete the lock-in loop closure, including:
[0034] Step S3.1: Using the S-parameter locked wave reference SCaliTar as the target value, initialize the TEC2 temperature search range and optimization parameters, and construct the TEC2 temperature control parameter space;
[0035] Step S3.2: Perform a global optimization search within the TEC2 temperature control parameter space. In each iteration, calculate the deviation between the S-parameter and SCaliTar at the current TEC2 temperature, and update the search direction based on the deviation to obtain the optimal candidate value for TEC2 temperature.
[0036] Step S3.3: Set the optimal TEC2 temperature candidate value as the TEC2 target temperature, wait for the temperature to stabilize, and then check whether the S-parameter falls within the SCaliTar allowable range. If it does, confirm that the current TEC2 temperature is the Etalon optimal operating point temperature EtlTemp0.
[0037] Step S3.4: At the optimal operating temperature EtlTemp0 of Etalon, the laser temperature-S parameter closed-loop wavelock circuit is opened, and the target value of the S parameter is locked to SCaliTar, thus completing the closure of the wavelock circuit.
[0038] Beneficial effects of steps S3.1 to S3.4:
[0039] This series of steps uses SCaliTar as the target value to globally optimize and search the TEC2 parameter space, replacing the traditional manual fine-tuning method. This quickly locates the optimal operating temperature of Etalon and completes the cascade loop closure, improving calibration efficiency and cascade reliability. By initializing the search interval and iteratively calculating the deviation value to update the search direction, the operating point positioning deviation caused by local extrema traps is avoided. While ensuring that the S-parameters converge to the allowable range, the temperature search time is shortened, providing a stable operating point benchmark for subsequent multi-temperature slope fitting.
[0040] Specifically, step S3.1 initializes the search interval and optimization parameters to provide a calculation starting point for global optimization; step S3.2 iteratively searches to obtain the optimal TEC2 temperature candidate value to shorten the operating point positioning time; step S3.3 verifies that the S-parameters fall within the allowable range to ensure the accuracy of the operating point temperature; and step S3.4 opens the closed-loop wave-locking circuit to lock the S-parameters to SCaliTar to complete the wave-locking closed loop.
[0041] As a further improvement of this application, step S4 involves scanning multi-point data of laser temperature and Etalon temperature within the upper and lower intervals of the optimal operating temperature EtlTemp0 of Etalon, and outputting the laser temperature-wavelength slope coefficient and Etalon temperature-wavelength slope coefficient through Gaussian process regression fitting, including:
[0042] Step S4.1: Within the upper and lower range of the optimal operating temperature EtlTemp0 of Etalon, scan the laser temperature and Etalon temperature respectively with a preset step. Collect the laser temperature value, Etalon temperature value, S-parameter value and measured wavelength value at each sampling point to obtain laser temperature scanning data and Etalon temperature scanning data.
[0043] Step S4.2: Group the laser temperature scanning data according to the heating direction and the cooling direction, and construct heating laser temperature-wavelength mapping pairs and cooling laser temperature-wavelength mapping pairs respectively;
[0044] Step S4.3: Group the Etalon temperature scan data according to the heating direction and the cooling direction, and construct heating Etalon temperature-wavelength mapping pairs and cooling Etalon temperature-wavelength mapping pairs respectively;
[0045] Step S4.4: Perform Gaussian process regression fitting on the heating laser temperature-wavelength mapping pair and the cooling laser temperature-wavelength mapping pair respectively, and output the laser temperature-wavelength slope coefficient in the heating direction and the laser temperature-wavelength slope coefficient in the cooling direction.
[0046] Step S4.5: Perform Gaussian process regression fitting on the heating Etalon temperature-wavelength mapping pair and the cooling Etalon temperature-wavelength mapping pair respectively, and output the Etalon temperature-wavelength slope coefficient in the heating direction and the Etalon temperature-wavelength slope coefficient in the cooling direction.
[0047] Beneficial effects of steps S4.1 to S4.5:
[0048] This series of steps involves scanning the temperature range above and below the optimal operating point and fitting the data in groups according to the heating and cooling directions. Gaussian regression is used to output bidirectional temperature slope coefficients, fully considering thermal hysteresis and improving temperature compensation accuracy. Compared to traditional methods that use a single slope coefficient to cover the entire temperature range, this series of steps scans the laser temperature and Etalon temperature independently and differentiates the heating and cooling directions for regression fitting. This captures the differential influence of the two temperature sources on wavelength shift, providing direction-sensitive slope parameter inputs for subsequent power cross-compensation and full-temperature-range shell temperature compensation.
[0049] In step S4.1, multiple points of laser temperature and Etalon temperature data are scanned and collected to provide data samples for fitting; in steps S4.2 and S4.3, heating and cooling mapping pairs are constructed to achieve directional grouping; in steps S4.4 and S4.5, Gaussian process regression fitting is performed on laser temperature and Etalon temperature to output their respective bidirectional slope coefficients.
[0050] As a further improvement of this application, step S5 involves acquiring a scanning dataset of multiple power points at equal intervals while the target channel is locked. The laser temperature-wavelength slope coefficient and the Etalon temperature-wavelength slope coefficient are then substituted into the scanning dataset to fit and calculate the power-S parameter compensation coefficient dS0dPwr and the Etalon temperature-power compensation coefficient dPwr_dTetalon, including:
[0051] Step S5.1: Under the target channel locked state, select multiple power points at equal intervals, and adjust the SOA current one by one to make the output power reach the target value of each power point, so as to obtain the power point sequence.
[0052] Step S5.2: Fine-tune the target value of S at each power point to compensate for wavelength drift and keep the wavelength within the target value range;
[0053] Step S5.3: Record the measured power, reference light detection sampling value, SOA current and actual S-parameter values corresponding to each power point to obtain a multi-power point scanning dataset;
[0054] Step S5.4: Substitute the laser temperature-wavelength slope coefficient and the Etalon temperature-wavelength slope coefficient into the multi-power point scanning dataset, perform linear fitting with the measured power as the abscissa and the S-parameter as the ordinate, and output the power-S-parameter compensation coefficient dS0dPwr.
[0055] Step S5.5: Keep the reference light detection sampling value constant, scan the TEC2 temperature within the preset temperature range, and record the measured output power at each temperature;
[0056] Step S5.6: Perform linear fitting with TEC2 temperature as the abscissa and measured output power as the ordinate, and output the Etalon temperature-power compensation coefficient dPwr_dTetalon by taking the negative slope value.
[0057] Beneficial effects of steps S5.1 to S5.6:
[0058] This series of steps establishes a cross-compensation relationship between power, S-parameters, and Etalon temperature through multi-power-point scanning and dual-coefficient fitting, eliminating S-parameter drift and wavelength shift caused by output power switching. Compared to traditional solutions that rely on passive wave locking after power stabilization, this series of steps actively fine-tunes the target S-parameter value at each power point to compensate for wavelength drift. Furthermore, it quantifies the impact of power on S-parameters and the impact of Etalon temperature on power using dual coefficients, achieving active wavelength feedforward compensation under power switching conditions. This provides a calibrated parameter basis in the power dimension for subsequent full-temperature-range shell temperature compensation.
[0059] The process includes the following steps: Step S5.1: Selecting a power point and adjusting the SOA current to achieve the target power to provide a power reference for scanning; Step S5.2: Fine-tuning the target S value to compensate for wavelength drift and ensure wavelength stability during the scanning process; Step S5.3: Recording the multi-power point scanning dataset to provide complete data for fitting; Step S5.4: Fitting the output dS0dPwr to quantify the influence of power on S-parameters; Step S5.5: Scanning the TEC2 temperature and recording power changes to provide data for temperature-power compensation; Step S5.6: Fitting the output dPwr_dTetalon to compensate for power fluctuations caused by temperature changes in Etalon.
[0060] As a further improvement to this application, step S6 involves measuring the open-loop and closed-loop wavelength shifts and power changes under high and low shell temperature environments based on the power-S parameter compensation coefficient dS0dPwr and the Etalon temperature-power compensation coefficient dPwr_dTetalon, and then fitting and generating a shell temperature-wavelength full-temperature-range compensation coefficient matrix, including:
[0061] Step S6.1: Control the shell temperature at the high temperature target value, close the S loop after the temperature stabilizes, issue the room temperature calibration parameters and measure the open-loop wavelength offset, and calculate the high temperature open-loop shell temperature-wavelength coefficient.
[0062] Step S6.2: Open the S-loop wave lock until it is stable, measure the closed-loop wavelength offset, and calculate the high-temperature closed-loop shell temperature-wavelength coefficient.
[0063] Step S6.3: Keep the reference light detection sampling value constant, measure the power change at high temperature, and calculate the high temperature shell temperature-power compensation coefficient;
[0064] Step S6.4: Control the shell temperature at the low temperature target value, close the S loop after the temperature stabilizes, issue the room temperature calibration parameters and measure the open-loop wavelength offset, and calculate the low temperature open-loop shell temperature-wavelength coefficient.
[0065] Step S6.5: Open the S-loop wave lock until it is stable, measure the closed-loop wavelength offset, and calculate the low-temperature closed-loop shell temperature-wavelength coefficient.
[0066] Step S6.6: Keep the reference light detection sampling value constant, measure the power change at low temperature, and calculate the low temperature shell temperature-power compensation coefficient;
[0067] Step S6.7: Combine the high-temperature open-loop shell temperature-wavelength coefficient, the high-temperature closed-loop shell temperature-wavelength coefficient, the high-temperature shell temperature-power compensation coefficient, the low-temperature open-loop shell temperature-wavelength coefficient, the low-temperature closed-loop shell temperature-wavelength coefficient, and the low-temperature shell temperature-power compensation coefficient into a shell temperature-wavelength full-temperature-range compensation coefficient matrix.
[0068] Beneficial effects of steps S6.1 to S6.7:
[0069] This series of steps uses two sets of open-loop and closed-loop measurements at high and low temperatures, along with power measurements, to generate a full-temperature-range compensation coefficient matrix. This matrix covers the independent effects of shell temperature changes on wavelength and power, ensuring the wavelength locking accuracy of the ITLA under both high and low temperature conditions. Compared to traditional solutions that use a single temperature slope coefficient to cover the entire temperature range, this series of steps measures the wavelength shift in both open-loop and closed-loop states and calculates their respective shell temperature-wavelength coefficients independently. Simultaneously, it keeps the reference light detection sampling value constant while measuring power changes to calculate the shell temperature-power compensation coefficient. These six coefficients are combined into a matrix to achieve joint compensation across three dimensions: shell temperature, wavelength locking loop state, and power. This provides a complete parameter set for wavelength feedforward compensation during actual ITLA operation.
[0070] Specifically, steps S6.1 to S6.3 measure the open-loop wavelength shift, closed-loop wavelength shift, and power change at high temperatures and calculate their respective compensation coefficients; steps S6.4 to S6.6 measure the open-loop wavelength shift, closed-loop wavelength shift, and power change at low temperatures and calculate their respective compensation coefficients; and step S6.7 combines the six coefficients into a shell temperature-wavelength full-temperature-range compensation coefficient matrix for use in actual work.
[0071] To achieve the above objectives, this application also provides the following technical solutions:
[0072] An ITLA wavelocking system based on Etalon S-parameters, wherein the ITLA wavelocking system is applied to the ITLA wavelocking method described above, and the ITLA wavelocking system comprises:
[0073] The S-parameter-temperature dataset acquisition module is used to acquire the Etalon transmitted light detection signal PD1 and the reference light detection signal PD2 to calculate the S-parameter sequence, and simultaneously record the TEC2 temperature sampling value and the laser temperature sampling value to construct a multi-dimensional S-parameter-temperature sampling dataset.
[0074] The S-parameter locked-wave reference extraction module is used to determine the intersection of two wavelengths in the S-parameter-temperature multidimensional sampling dataset and extract the globally unified S-parameter locked-wave reference SCaliTar by calculating the intersection of two S-TEC2 temperature curves.
[0075] The Etalon optimal operating point temperature positioning module is used to locate the Etalon optimal operating point temperature EtlTemp0 and complete the closed loop of the wave lock by using the S-parameter wave lock reference SCaliTar as the target value and searching the TEC2 temperature control parameter space through global optimization.
[0076] The slope coefficient calculation module is used to scan multi-point data of laser temperature and Etalon temperature within the upper and lower intervals of the optimal operating point temperature EtlTemp0 of Etalon, and output the laser temperature-wavelength slope coefficient and Etalon temperature-wavelength slope coefficient through Gaussian process regression fitting.
[0077] The compensation coefficient calculation module is used to acquire a scanning dataset of multiple power points at equal intervals under the target channel locking state, and substitute the laser temperature-wavelength slope coefficient and the Etalon temperature-wavelength slope coefficient into the scanning dataset to fit and calculate the power-S parameter compensation coefficient dS0dPwr and the Etalon temperature-power compensation coefficient dPwr_dTetalon.
[0078] The shell temperature-wavelength full-temperature-range compensation coefficient matrix fitting module is used to measure the open-loop and closed-loop wavelength offset and power change under high and low shell temperature environments based on the power-S parameter compensation coefficient dS0dPwr and the Etalon temperature-power compensation coefficient dPwr_dTetalon, and to fit and generate the shell temperature-wavelength full-temperature-range compensation coefficient matrix.
[0079] To achieve the above objectives, this application also provides the following technical solutions:
[0080] An electronic device includes a processor and a memory coupled to the processor, the memory storing program instructions executable by the processor; when the processor executes the program instructions stored in the memory, it implements the ITLA wave-locking calibration method based on Etalon S-parameters as described above.
[0081] To achieve the above objectives, this application also provides the following technical solutions:
[0082] A computer-readable storage medium storing program instructions that, when executed by a processor, enable the implementation of the ITLA wave-locking calibration method based on Etalon S-parameters as described above. Attached Figure Description
[0083] Figure 1 This is a flowchart illustrating the steps of an embodiment of an ITLA wave-locking calibration method based on Etalon S-parameters according to this application.
[0084] Figure 2 This is a schematic diagram of the functional modules of an embodiment of an ITLA wave-locking beacon system based on Etalon S-parameters according to this application;
[0085] Figure 3 This is a schematic diagram of the structure of an embodiment of the electronic device of this application;
[0086] Figure 4 This is a schematic diagram of the structure of one embodiment of the storage medium of this application. Detailed Implementation
[0087] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0088] The terms "first," "second," and "third" in this application are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (e.g., as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive having. For example, a process, method, system, product, or device having a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.
[0089] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be present in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0090] It should be noted that, due to the limited types and number of symbols or letters that can represent specific meanings, for embodiments with many formulas or codes, there may be situations where symbols or letters cannot meet the usage requirements. Therefore, the interpretation of formula symbols in the steps or sub-steps of the embodiments is only valid for the current step or sub-step.
[0091] If the same symbol has different interpretations in different steps or sub-steps, the interpretation in the current step or sub-step shall prevail; if the same symbol appears in different steps or sub-steps, but no interpretation is given in subsequent steps or sub-steps after its first appearance, the interpretation in the first step or sub-step shall be used.
[0092] For example, "i=1,2,...,n" is a writing convention and a well-known meaning. If "i=1,2,...,n" has already appeared once in an embodiment and needs to be used again in formulas with different scenarios and meanings in the future, then the meaning of "i=1,2,...,n" should be interpreted according to the corresponding formulas. If "i=1,2,...,n" is not used for the first time and is changed to a symbol or letter with a non-well-known meaning, such as "p=1,2,...,q", to avoid repetition, it is more likely to cause confusion, ambiguity, and unclear problems.
[0093] like Figure 1 As shown, this embodiment provides an example of an ITLA wavelocking calibration method based on Etalon S-parameters. In this embodiment, the ITLA wavelocking calibration method includes the following steps:
[0094] Step S1: Acquire Etalon transmitted light detection signal PD1 and reference light detection signal PD2 to calculate the S-parameter sequence, and simultaneously record TEC2 temperature sampling value and laser temperature sampling value to construct an S-parameter-temperature multi-dimensional sampling dataset.
[0095] Furthermore, step S1 specifically includes the following steps:
[0096] Step S1.1: Configure the wavelength as the first channel and the first channel plus half of the Etalon free spectrum range respectively to obtain two target wavelength configurations.
[0097] Preferably, the core of this step is to complete the dual-wavelength configuration. By selecting the first channel as the reference wavelength and adding half of the Etalon free spectral range FSR / 2 to the first channel as the offset wavelength, two target wavelength configurations are obtained, providing wavelength conditions for the subsequent dual-wavelength intersection method.
[0098] The Etalon Free Spectral Range (FSR) refers to the frequency interval between adjacent transmission peaks of the Etalon etalon, which is determined by the cavity length and refractive index of the Etalon. The calculation formula is as follows: .
[0099] Where c is the speed of light in vacuum, n is the refractive index of the Etalon medium, and L is the length of the Etalon cavity.
[0100] For the first channel, the first channel in the full range of ITLA is selected as the reference wavelength, and the offset wavelength is the frequency corresponding to the first channel plus FSR / 2, so that the two wavelengths fall exactly at the adjacent half-cycle positions of the Etalon transmission curve, ensuring that the two S-TEC2 temperature curves have an intersection point within the temperature scanning range.
[0101] Preferably, the typical value of FSR is 25 GHz, and the offset wavelength configuration accuracy is ±0.5 GHz.
[0102] For example, the first channel is configured as 190.700THz, the offset wavelength is configured as 190.725THz, and the corresponding timestamp record is YYYY-MM-DD-HH:MM:SS-001.
[0103] Step S1.2: Scan the TEC2 temperature under two target wavelength configurations respectively, and collect the Etalon transmitted light detection signal PD1 and the reference light detection signal PD2 at each sampling point to obtain the PD1 sampling value sequence and PD2 sampling value sequence of each of the two curves.
[0104] Preferably, the core of this step is to complete temperature scanning and signal acquisition. The temperature of the Etalon temperature controller TEC2 is scanned under two target wavelength configurations. PD1 and PD2 are acquired synchronously at each sampling point to obtain the PD1 sampling value sequence and PD2 sampling value sequence of each of the two curves.
[0105] PD1 (Photodiode1) refers to the Etalon transmission light detector, used to detect the light power after transmission through the Etalon etalon; PD2 (Photodiode2) refers to the reference light detector, used to detect the reference light power after spectral splitting without Etalon transmission.
[0106] For TEC2 temperature scanning, the scanning range was set to 30℃ to 59℃, with a scanning step of 1℃. At each sampling point, the ADC sampling values of PD1 and PD2 were acquired after the TEC2 temperature stabilized. During the acquisition of each sampling point, the RTH2 temperature fluctuation was verified to be no more than ±0.5℃ and the shell temperature fluctuation to be no more than ±1℃ to ensure the validity of the sampling data.
[0107] The first curve corresponds to the first channel wavelength configuration, and the second curve corresponds to the offset wavelength configuration. The PD1 sample value sequences of the two curves are denoted as follows: and The PD2 sample value sequences are denoted as follows: and , where N is the number of sampling points for each temperature scan sequence.
[0108] Preferably, the TEC2 temperature scanning range is 30°C to 59°C, the scanning step is 1°C, and the stabilization waiting time for each sampling point is 0.5s.
[0109] For example, the first curve scans 30 sampling points from 30°C to 59°C at the first channel wavelength, and the PD1 sampling value sequence is denoted as... The corresponding TEC2 temperature sequence is The sampling start timestamp is YYYY-MM-DD-HH:MM:SS-002.
[0110] Step S1.3: Divide the PD1 sample value sequence by the corresponding PD2 sample value sequence to calculate the S-parameter sequences of the two curves, where the S-parameter is defined as the ratio of PD1 to PD2.
[0111] Preferably, the core of this step is to calculate the S-parameters by dividing the PD1 sample value sequence by the corresponding PD2 sample value sequence to obtain the S-parameter sequences of the two curves.
[0112] The S-parameter is defined as the ratio of PD1 to PD2, and its calculation formula is as follows:
[0113] .
[0114] in, Let Etalon transmitted light detection signal be the i-th sampling point. Let i be the reference light detection signal at the i-th sampling point. Let S be the S-parameter of the i-th sampling point.
[0115] The S-parameter sequence of the first curve is calculated as follows: The S-parameter sequence of the second curve is calculated as follows: , The S-parameter reflects the change of Etalon transmittance with temperature. When the temperature of TEC2 changes, the Etalon transmission spectrum shifts, PD1 changes accordingly, while PD2 remains basically unchanged. Therefore, the curve of the change of the S-parameter is equivalent to the Etalon transmission curve.
[0116] Preferably, the S-parameter calculation precision is retained to two decimal places, and the ADC sampling value bit width of PD1 and PD2 is 16 bits.
[0117] For example, the first sampling point of the first curve =32768, =65536, then =32768 / 65536=0.50.
[0118] Step S1.4: Synchronously record the TEC2 temperature sampling value at each sampling point and read the laser temperature sampling value to obtain the TEC2 temperature sequence and the laser temperature sequence.
[0119] Preferably, the core of this step is to complete the synchronous recording of temperature, synchronously record the TEC2 temperature sampling value at each sampling point, and read the laser temperature sampling value to obtain the TEC2 temperature sequence and the laser temperature sequence.
[0120] Specifically, the TEC2 temperature sequence refers to the measured temperature at each sampling point of the Etalon temperature control system, calculated by reading the resistance value of the RTH2 thermistor in the TEC2 temperature control loop. The laser temperature sequence is calculated by reading the resistance value of the RTH1 thermistor in the TEC1 temperature control loop of the laser.
[0121] The TEC2 temperature sequence of the first curve is denoted as... The laser temperature sequence is denoted as The TEC2 temperature sequence of the second curve is denoted as... The laser temperature sequence is denoted as Temperature synchronization recording requires that the TEC2 temperature and laser temperature at each sampling point be read within the same ADC sampling cycle, with a time deviation not exceeding 1ms.
[0122] Preferably, the sampling period of the RTH2 and RTH1 thermistors is 10ms, and the temperature reading accuracy is ±0.01℃.
[0123] For example, the temperature of TEC2 at the first sampling point of the first curve is T_{tec2,1,1} = 30.02℃, and the laser temperature is... =45.12℃, corresponding to timestamp YYYY-MM-DD-HH:MM:SS-003.
[0124] Step S1.5: Align the S-parameter sequence, TEC2 temperature sequence and laser temperature sequence according to the sampling timestamp, and splice them into an S-parameter-temperature multidimensional sampling dataset.
[0125] Preferably, the core of this step is to complete data alignment and splicing, aligning the S-parameter sequence, TEC2 temperature sequence and laser temperature sequence according to the sampling timestamp, and splicing them into an S-parameter-temperature multi-dimensional sampling dataset.
[0126] Specifically, the S-parameter-temperature multi-dimensional sampling dataset refers to the concatenation of the S-parameter sequences, TEC2 temperature sequences, and laser temperature sequences of the two curves, aligned according to their sampling timestamps, into a unified data matrix. Each sampling row contains the curve number, S-parameter value, TEC2 temperature value, laser temperature value, and timestamp. The dimensions of the data matrix D are... The data structure for each row is as follows:
[0127] .
[0128] in, The curve number is either 1 or 2. For S-parameter values, This is the TEC2 temperature value. This is the laser temperature value. For sampling timestamps, .
[0129] Among them, the timestamp alignment strategy adopts nearest neighbor matching. For each timestamp of the S-parameter sequence, the sampling point with the smallest time difference is found in the TEC2 temperature sequence and the laser temperature sequence. When the time difference exceeds 1ms, it is marked as an outlier and removed.
[0130] Preferably, the outlier removal threshold is set to 1ms, and each row of the dataset is separated by commas.
[0131] For example, the first two rows of the dataset are: 1,0.50,30.02,45.12,YYYY-MM-DD-HH:MM:SS-003; 1,0.52,31.01,45.13,YYYY-MM-DD-HH:MM:SS-004.
[0132] Beneficial effects of steps S1.1 to S1.5:
[0133] This series of steps, through dual-wavelength configuration and step-by-step acquisition of PD1 and PD2 signals, provides independent data sources for S-parameter calculation and synchronous temperature recording, ensuring the integrity and traceability of the sampled dataset and avoiding the wavelength locking reference deviation caused by single-wavelength sampling in traditional solutions. By separating wavelength configuration, signal acquisition, parameter calculation, and temperature recording into independent steps, the risk of timing misalignment during parallel acquisition of multi-source data is eliminated, providing a multi-dimensional data foundation with strictly aligned timestamps for subsequent dual-wavelength intersection calculation.
[0134] The steps are as follows: Step S1.1 obtains two target wavelength configurations to provide wavelength references for subsequent scanning; Step S1.2 acquires the sampled value sequences of PD1 and PD2 to retain the original detection signals; Step S1.3 calculates the S-parameter sequence to clarify the wave-locking parameters; Step S1.4 synchronously records the TEC2 temperature and laser temperature sequences to achieve multi-dimensional data alignment; Step S1.5 splices the data into a unified dataset according to timestamps to ensure the accuracy of subsequent intersection point calculations.
[0135] Step S2 involves determining the intersection of two wavelengths in the S-parameter-temperature multidimensional sampling dataset and extracting the globally unified S-parameter locked-wave reference SCaliTar by calculating the intersection of two S-TEC2 temperature curves.
[0136] Furthermore, step S2 specifically includes the following steps:
[0137] Step S2.1: Extract the S-parameter sequences and corresponding TEC2 temperature sequences of the two curves from the S-parameter-temperature multidimensional sampling dataset, and construct the S-TEC2 temperature curves of the first channel and the second channel respectively.
[0138] Preferably, the core of this step is to construct the hyperbola by extracting the S-parameter sequences and TEC2 temperature sequences of the two curves from the S-parameter-temperature multidimensional sampling dataset, and constructing the S-TEC2 temperature curves of the first channel and the second channel respectively, providing function input for subsequent intersection point solving.
[0139] Specifically, the S-TEC2 temperature curve for the first channel refers to a sequence of discrete data points with TEC2 temperature on the x-axis and S-parameters on the y-axis, acquired under the specified wavelength configuration of the first channel. Continuous functions are obtained by cubic spline interpolation. For the S-TEC2 temperature profile of the second channel, from A continuous function is obtained by the same interpolation. .
[0140] Cubic spline interpolation involves constructing a piecewise approximation of a third-order polynomial between adjacent sampling points. This ensures continuity between the function value and the first derivative at the piecewise nodes, resulting in higher interpolation accuracy than linear interpolation and a more accurate reflection of the variation trend of S-parameters between adjacent sampling points. The interpolation step is 0.1℃, and the interpolation range covers the TEC2 temperature scan range from 30℃ to 59℃.
[0141] Preferably, the cubic spline interpolation step is 0.1℃, and the interpolation range is 30℃ to 59℃.
[0142] For example, the spline interpolation coefficients for the first channel curve in the TEC2 temperature range of 30.0℃ to 30.1℃ are: =0.5021, =0.0183, =-0.0007, =0.00002, corresponding to the interpolation function The timestamp is YYYY-MM-DD-HH:MM:SS-005.
[0143] Step S2.2: Solve for the intersection points of the S-TEC2 temperature curves of the first channel and the S-TEC2 temperature curves of the second channel to obtain the intersection point set.
[0144] Preferably, the core of this step is to solve for the intersection point by finding the intersection point of the S-TEC2 temperature curve of the first channel and the S-TEC2 temperature curve of the second channel, thus obtaining the intersection point set.
[0145] Among them, solving for the intersection point refers to finding the point that satisfies the condition within the TEC2 temperature scan range. The temperature point, i.e., solving the equation:
[0146] .
[0147] in, This is the interpolation function for the S-TEC2 temperature curve of the first channel. is the interpolation function for the S-TEC2 temperature curve of the second channel, and g(T) is the difference between the two curves.
[0148] Among them, the solution method uses the bisection method to scan the sign change of g(T) segment by segment within the interpolation interval. Time determination interval If there is an intersection point, the temperature at that intersection point can be obtained by performing a binary approximation with an accuracy of 0.001℃ within that interval. With the corresponding S-parameter values The scanning step is 0.1℃, and the set of intersection points is obtained after scanning the entire interval. , where M is the total number of intersections.
[0149] Preferably, the convergence accuracy of the bisection method is 0.001℃, and the intersection search step is 0.1℃.
[0150] For example, in the TEC2 temperature range of 44.2℃ to 44.3℃, g(44.2) = 0.0031 and g(44.3) = -0.0028 were detected, with the sign flipping. After 12 iterations using the bisection method, the result converged to... =44.256℃, =0.6173, timestamp YYYY-MM-DD-HH:MM:SS-006.
[0151] Step S2.3: Select the intersection point closest to the target temperature from the intersection point set, and extract the ordinate S value of the intersection point as the globally unified S-parameter locking reference SCaliTar.
[0152] Preferably, the core of this step is to extract the wave-locking reference, select the intersection point closest to the target temperature from the intersection point set, and extract the ordinate S value of the intersection point as the globally unified S-parameter wave-locking reference SCaliTar.
[0153] The target temperature refers to the nominal operating temperature of Etalon in the ITLA design specifications, denoted as . From the set of intersection points Selected Minimum intersection point ,Will Assign the value SCaliTar, that is:
[0154] .
[0155] in, The optimal intersection temperature, represents the S-parameter value corresponding to the optimal intersection point, and SCaliTar is the global wavelock reference.
[0156] In engineering terms, SCaliTar is the S-parameter value at the intersection of two S-TEC2 temperature curves. At the intersection, the S-parameters of the first and second channels are equal, which means that the transmittance ratio of the Etalon transmission curves for the two wavelengths is the same at this temperature point. This S-value does not depend on the slope direction of the transmission curve for a single wavelength, so it can eliminate ambiguity in the locking direction as a locking reference shared by all channels.
[0157] Preferably, the target temperature The typical value is 45℃, and SCaliTar precision is retained to four decimal places.
[0158] For example, the intersection set contains three intersection points: (42.103, 0.5892), (44.256, 0.6173), and (51.877, 0.7044), with a target temperature. =45℃, the calculated distances are 2.897, 0.744, and 6.877 respectively. Select (44.256, 0.6173), then SCaliTar=0.6173, timestamp YYYY-MM-DD-HH:MM:SS-007.
[0159] Beneficial effects of steps S2.1 to S2.3:
[0160] This series of steps extracts dual-wavelength curves and solves for their intersection points, providing a unified characteristic intersection point for determining the global wave-locking benchmark. This eliminates ambiguity in wave-locking direction caused by different channels operating at different slope segments of the transmission curve. Compared to traditional methods that rely on empirical values of a single wavelength to set the wave-locking benchmark, this series of steps determines SCaliTar based on the geometric characteristics of the dual-wavelength intersection points. This ensures that all channels operate at the same characteristic point on the Etalon transmission curve, fundamentally avoiding the risk of wave-locking failure caused by inconsistent slope signs, and providing a unique and definite benchmark target for subsequent global optimization.
[0161] In step S2.1, two S-TEC2 temperature curves are constructed to provide input for solving the intersection point; step S2.2, the intersection point is solved to obtain the intersection point set and lock the candidate benchmark point; step S2.3, the intersection point closest to the target temperature is selected to extract SCaliTar to ensure the engineering feasibility of the benchmark value.
[0162] Step S3: Using the S-parameter lock-in reference SCaliTar as the target value, the TEC2 temperature control parameter space is searched globally to locate the optimal operating temperature EtlTemp0 of Etalon and complete the lock-in loop closure.
[0163] Furthermore, step S3 specifically includes the following steps:
[0164] Step S3.1: Using the S-parameter lock-in reference SCaliTar as the target value, initialize the TEC2 temperature search range and optimization parameters, and construct the TEC2 temperature control parameter space.
[0165] Preferably, the core of this step is to complete the optimization initialization. Using SCaliTar as the target value, the TEC2 temperature search range and optimization parameters are initialized, and the TEC2 temperature control parameter space is constructed to provide a calculation starting point for subsequent global optimization.
[0166] For the TEC2 temperature search range, the optimal intersection temperature corresponding to SCaliTar is used. The search range is set by expanding outwards from the center, with the lower bound of the interval defined. upper bound of the interval ,in The search interval is the half-width. The search interval must cover the linear region of the Etalon transmission curve to ensure convergence of the optimization.
[0167] Among these, the optimization parameters include the particle swarm size. Inertia weight w, individual learning factor Social learning factors With maximum number of iterations Each particle represents a candidate TEC2 temperature value. The particle position is initialized to a uniformly distributed random value within the search interval, and the particle velocity is initialized to zero.
[0168] Preferably, the search half-width =7℃, particle swarm size =20, inertia weight w=0.6, individual learning factor =1.5, Social Learning Factor =1.5, maximum number of iterations =50.
[0169] For example, optimal intersection temperature =44.256℃, the search range is 37.256℃ to 51.256℃, the 20 particles are initialized with a random temperature value uniformly distributed within this range, timestamp YYYY-MM-DD-HH:MM:SS-008.
[0170] Step S3.2: Perform a global optimization search within the TEC2 temperature control parameter space. In each iteration, calculate the deviation between the S-parameter and SCaliTar at the current TEC2 temperature, and update the search direction based on the deviation to obtain the optimal candidate TEC2 temperature value.
[0171] Preferably, the core of this step is to complete the global optimization iteration, which searches within the TEC2 temperature control parameter space. In each iteration, the deviation between the S-parameter and SCaliTar at the current TEC2 temperature is calculated, and the search direction is updated based on the deviation to obtain the optimal candidate value for the TEC2 temperature.
[0172] Specifically, for the deviation value calculation, in the k-th iteration, the position of the j-th particle is... Set the target temperature to TEC2, wait for the temperature to stabilize, and then collect data from PD1 and PD2 to calculate the current S-parameters. The deviation value is defined as:
[0173] .
[0174] in, Here, S is the measured S-parameter corresponding to the j-th particle in the k-th iteration, and SCaliTar is the wave-locking reference. This represents the absolute value of the deviation.
[0175] For the search direction update, the particle swarm position update formula is used:
[0176] .
[0177] .
[0178] in, Let be the velocity of the j-th particle. Let be the historical best position of the j-th particle, and gbest be the global best position. and The random numbers are uniformly distributed within the interval [0,1], and w is the inertia weight. For individual learning factors, It is a social learning factor.
[0179] Specifically, the determination of the optimal candidate TEC2 temperature is updated after each iteration. With gbest, when Updated regularly When the global minimum deviation The convergence condition is met or the maximum number of iterations is reached. The search is terminated when the time is right, and gbest is output as the optimal candidate value for TEC2 temperature. .
[0180] Preferably, the convergence condition is: Maximum number of iterations Upper limit of particle velocity ℃.
[0181] For example, after the 35th iteration, gbest = 44.812℃, corresponding to the deviation. =0.0006 < 0.001, the convergence condition is met, and the optimal candidate value for TEC2 temperature is output. =44.812℃, timestamp YYYY-MM-DD-HH:MM:SS-009.
[0182] Step S3.3: Set the optimal TEC2 temperature candidate value as the TEC2 target temperature. After the temperature stabilizes, check whether the S-parameter falls within the SCaliTar allowable range. If it does, confirm that the current TEC2 temperature is the Etalon optimal operating point temperature EtlTemp0.
[0183] Preferably, the core of this step is to confirm and verify the operating point, set the optimal TEC2 temperature candidate value as the TEC2 target temperature, and after the temperature stabilizes, verify whether the S-parameter falls within the SCaliTar allowable range. If it does, then the current TEC2 temperature is confirmed as the Etalon optimal operating point temperature EtlTemp0.
[0184] Specifically, for temperature stability determination, the TEC2 target temperature is set to... Then, the RTH2 temperature value was continuously read. When the fluctuation of the value did not exceed ±0.05℃ for three consecutive readings, the temperature was considered stable, and the measured value of TEC2 temperature after stabilization was recorded. .
[0185] For S-parameter verification, the measured S-parameters are calculated by collecting data from PD1 and PD2 after the temperature stabilizes. The permissible range is defined as follows: ,in To allow for deviation. When Confirm when falling within the allowable range ;when When it does not fall within the allowable range, Narrow the search width to the new search center Repeat step S3.2.
[0186] Preferably, the allowable deviation =0.002, the temperature stability judgment window is 3 consecutive readings, and the fluctuation threshold is ±0.05℃.
[0187] For example, =44.812℃, measured after temperature stabilized. =44.809℃, =0.6169, the allowable range is [0.6153, 0.6193]. The temperature falls within the range, confirming EtlTemp0 = 44.809℃, with the timestamp YYYY-MM-DD-HH:MM:SS-010.
[0188] Step S3.4: At the optimal operating temperature of EtlTemp0 of Etalon, start the laser temperature-S parameter closed-loop wavelock circuit, lock the target value of the S parameter to SCaliTar, and complete the closure of the wavelock circuit.
[0189] Preferably, the core of this step is to complete the closed-loop circuit. Under EtlTemp0, the laser temperature-S parameter closed-loop circuit is opened, and the target value of the S parameter is locked to SCaliTar, thus completing the closed-loop circuit.
[0190] Specifically, the closed-loop wave-locked circuit refers to a closed-loop control loop that uses the laser temperature TEC1 as the controlled object and the S-parameters as the feedback quantity. After the loop starts, PD1 and PD2 are collected in real time to calculate the current S-parameters. The deviation between the S-parameters and SCaliTar is input into the PID controller. The PID controller outputs the TEC1 temperature adjustment quantity to drive the laser temperature change, so that the S-parameters converge to SCaliTar.
[0191] For the PID controller, the control law is as follows:
[0192] .
[0193] Where u(t) is the TEC1 temperature adjustment amount, and e(t) = SCaliTar - S(t) is the S-parameter deviation. This is the proportionality coefficient. The integral coefficient is... These are the differential coefficients. The integral term is used to eliminate steady-state error, and the differential term is used to suppress overshoot.
[0194] Among them, for the loop closure determination, when the S-parameter deviation is 10 consecutive times... When the wave-locked loop converges, the temperature of TEC1 after convergence is recorded as the laser temperature lock value LaserTemp0, and the loop closure is completed.
[0195] Preferably, =0.05, =0.005, =0.001, sampling period is 100ms, and convergence judgment window is 10 consecutive samples.
[0196] For example, after the loop starts, the initial deviation of the S-parameters is e(0)=0.0123. After PID adjustment, the deviation converges to |e|=0.0008<0.002 in the 45th sampling period. The convergence condition is met for 10 consecutive samplings. LaserTemp0=45.103℃ is recorded, and the timestamp is YYYY-MM-DD-HH:MM:SS-011.
[0197] Beneficial effects of steps S3.1 to S3.4:
[0198] This series of steps uses SCaliTar as the target value to globally optimize and search the TEC2 parameter space, replacing the traditional manual fine-tuning method. This quickly locates the optimal operating temperature of Etalon and completes the cascade loop closure, improving calibration efficiency and cascade reliability. By initializing the search interval and iteratively calculating the deviation value to update the search direction, the operating point positioning deviation caused by local extrema traps is avoided. While ensuring that the S-parameters converge to the allowable range, the temperature search time is shortened, providing a stable operating point benchmark for subsequent multi-temperature slope fitting.
[0199] Specifically, step S3.1 initializes the search interval and optimization parameters to provide a calculation starting point for global optimization; step S3.2 iteratively searches to obtain the optimal TEC2 temperature candidate value to shorten the operating point positioning time; step S3.3 verifies that the S-parameters fall within the allowable range to ensure the accuracy of the operating point temperature; and step S3.4 opens the closed-loop wave-locking circuit to lock the S-parameters to SCaliTar to complete the wave-locking closed loop.
[0200] Step S4: Scan the laser temperature and Etalon temperature multi-point data within the upper and lower intervals of the Etalon optimal operating point temperature EtlTemp0, and output the laser temperature-wavelength slope coefficient and Etalon temperature-wavelength slope coefficient through Gaussian process regression fitting.
[0201] Furthermore, step S4 specifically includes the following steps:
[0202] Step S4.1: Within the range above and below the optimal operating temperature EtlTemp0 of Etalon, scan the laser temperature and Etalon temperature separately with a preset step. Collect the laser temperature value, Etalon temperature value, S-parameter value and measured wavelength value at each sampling point to obtain laser temperature scanning data and Etalon temperature scanning data.
[0203] Preferably, the core of this step is to complete temperature scanning and data acquisition. Within the upper and lower intervals of EtlTemp0, the laser temperature and Etalon temperature are scanned separately with a preset step. At each sampling point, the laser temperature value, Etalon temperature value, S-parameter value and measured wavelength value are collected to obtain laser temperature scanning data and Etalon temperature scanning data.
[0204] For laser temperature scanning, the laser temperature lock value LaserTemp0 is used as the center, in Within the interval, in steps Scan point by point, and record the laser temperature value at each sampling point after the TEC1 temperature stabilizes. Compared with the wavelength value measured by the wavelength meter Simultaneously, the S-parameter value S is recorded. The laser temperature scan data is denoted as... , where P is the number of laser temperature scanning sampling points.
[0205] For Etalon temperature scanning, with EtlTemp0 as the center, in Within the interval, in steps Scan point by point, and record the Etalon temperature value at each sampling point after the TEC2 temperature stabilizes. Compared with the wavelength value measured by the wavelength meter Simultaneously, the S-parameter value S is recorded. Etalon temperature scan data is denoted as... , where Q is the number of Etalon temperature scan sampling points.
[0206] Specifically, the measured wavelength value refers to the laser output wavelength measured at each sampling point using an external high-precision wavelength meter, which serves as the label value for GPR fitting. The wavelength meter has a measurement accuracy of ±0.1 GHz, and each measurement requires waiting for the laser frequency to stabilize before triggering.
[0207] Preferably, the laser temperature scanning half-width is... =0.5℃, step =0.1℃; Etalon temperature scan half width =7℃, step =1℃; Wavelength meter measurement accuracy is ±0.1GHz.
[0208] For example, laser temperature scanning collects 11 sampling points in 0.1℃ steps within the range of 44.603℃ to 45.603℃, centered at LaserTemp0=45.103℃. The first sampling point... =44.603℃, =193.41234THz, =0.6185, timestamp YYYY-MM-DD-HH:MM:SS-012.
[0209] Step S4.2: Group the laser temperature scanning data according to the heating direction and the cooling direction, and construct heating laser temperature-wavelength mapping pairs and cooling laser temperature-wavelength mapping pairs respectively.
[0210] Preferably, the core of this step is to group the laser temperature data by direction, grouping the laser temperature scanning data according to the heating direction and the cooling direction, and constructing heating laser temperature-wavelength mapping pairs and cooling laser temperature-wavelength mapping pairs respectively.
[0211] Among them, the heating direction refers to the direction from which the laser temperature rises. Gradually rise to The scanning process corresponds to the data subset Regarding the cooling direction, it refers to the laser temperature decreasing from... Gradually reduce to The scanning process corresponds to the data subset .
[0212] Thermal hysteresis refers to the phenomenon where the output wavelengths of a laser chip do not completely coincide at the same set temperature due to differences in temperature gradients along the heat conduction path during heating and cooling. Directional fitting can capture this effect and improve compensation accuracy. The typical wavelength difference between the heating and cooling directions ranges from 0.5 GHz to 2 GHz.
[0213] Preferably, P / 2 sampling points are collected for both the heating and cooling scans, with directional markings. .
[0214] For example, the laser temperature rise direction scans 6 sampling points from 44.603℃ to 45.603℃, and the cooling direction scans 5 sampling points from 45.603℃ to 44.603℃. The first term of the heating mapping pair is (44.603, 193.41234), and the first term of the cooling mapping pair is (45.603, 193.41876), with timestamp YYYY-MM-DD-HH:MM:SS-013.
[0215] Step S4.3: Group the Etalon temperature scan data according to the heating direction and the cooling direction, and construct Etalon temperature-wavelength mapping pairs for heating and Etalon temperature-wavelength mapping pairs for cooling respectively.
[0216] Preferably, the core of this step is to complete the directional grouping of Etalon temperature data, grouping the Etalon temperature scan data according to the heating direction and the cooling direction, and constructing heating Etalon temperature-wavelength mapping pairs and cooling Etalon temperature-wavelength mapping pairs respectively.
[0217] Specifically, the heating direction of Etalon refers to the temperature of TEC2 rising from... Gradually rise to The scanning process corresponds to the data subset For the cooling direction of Etalon, the corresponding data subset .
[0218] Regarding the mechanism by which Etalon temperature changes affect wavelength, TEC2 temperature changes cause thermo-optical and thermal expansion effects on the refractive index and cavity length of the Etalon etalon, altering the center frequency of the transmission spectrum, which in turn drives the laser wavelength shift through the wavelock loop. The typical thermal hysteresis amplitude in the heating and cooling directions ranges from 1 GHz to 3 GHz.
[0219] Preferably, Etalon collects Q / 2 sampling points for both heating and cooling scans, and the scanning direction is alternated to eliminate the residual effects of historical temperatures.
[0220] For example, Etalon scans 8 sampling points from 37.809℃ to 51.809℃ in the heating direction and 7 sampling points from 51.809℃ to 37.809℃ in the cooling direction. The first item of the heating mapping pair is (37.809, 193.40891), and the timestamp is YYYY-MM-DD-HH:MM:SS-014.
[0221] Step S4.4: Perform Gaussian process regression fitting on the heating laser temperature-wavelength mapping pair and the cooling laser temperature-wavelength mapping pair respectively, and output the laser temperature-wavelength slope coefficient in the heating direction and the laser temperature-wavelength slope coefficient in the cooling direction.
[0222] Preferably, the core of this step is to complete the laser temperature GPR fitting, and to perform Gaussian process regression on the laser temperature-wavelength mapping pairs in the heating and cooling directions respectively, and output the laser temperature-wavelength slope coefficients in the heating direction and the laser temperature-wavelength slope coefficients in the cooling direction.
[0223] Gaussian Process Regression (GPR) is a nonparametric Bayesian regression method that defines the similarity between data points in the input space using a kernel function, applies a Gaussian process prior to the regression function, and calculates the posterior mean and variance using the training data. GPR can not only output predicted values but also provide estimates of uncertainty, making it suitable for small-sample nonlinear regression.
[0224] Specifically, for the kernel function, a radial basis function (RBF) kernel is used:
[0225] .
[0226] in, Let be the signal variance, l be the length scale parameter, and T and T' be two temperature input values. The kernel function hyperparameters are obtained by maximizing the marginal likelihood optimization.
[0227] For the GPR fitting output, given the training data The posterior mean function is:
[0228] .
[0229] in, This is the kernel vector between the test temperature T and the training temperature. To train the kernel matrix across temperatures, To observe the standard deviation of noise, It is the identity matrix. This is the wavelength observation vector. The slope coefficient of the heating direction. Slope coefficient of cooling direction It is obtained by differentiating the posterior mean function at the operating point.
[0230] Preferably, the initial value of the RBF kernel length scale is l=0.5, and the signal variance is... =1, observation noise =0.001THz, and the hyperparameter optimization method is L-BFGS.
[0231] For example, the derivative of the GPR fitting along the heating direction at LaserTemp0 = 45.103℃ is obtained. =0.0234THz / ℃, the cooling direction is obtained =0.0218THz / ℃, timestamp YYYY-MM-DD-HH:MM:SS-015.
[0232] Step S4.5: Perform Gaussian process regression fitting on the Etalon temperature-wavelength mapping pairs for heating and cooling respectively, and output the Etalon temperature-wavelength slope coefficients for heating and cooling directions.
[0233] Preferably, the core of this step is to complete the Etalon temperature GPR fitting, and to perform Gaussian process regression on the Etalon temperature-wavelength mapping pairs in the heating and cooling directions respectively, and output the Etalon temperature-wavelength slope coefficients in the heating direction and the Etalon temperature-wavelength slope coefficients in the cooling direction.
[0234] For Etalon temperature GPR fitting, the training data is: The kernel function is consistent with the laser temperature GPR, using the RBF kernel, and the posterior mean function is:
[0235] .
[0236] in, Train the kernel matrix between temperatures for Etalon. This is the vector of wavelength observations from the Etalon temperature scan. The slope coefficient for the heating direction. Slope coefficient of cooling direction .
[0237] Regarding the physical meaning of the slope coefficient, The magnitude of the laser wavelength shift caused by a 1°C change in Etalon temperature is typically 0.05 to 0.15 THz / °C, significantly greater than the laser temperature slope coefficient, indicating that Etalon temperature dominates the wavelength effect. The difference in the slope of the heating and cooling directions reflects the magnitude of the thermal hysteresis effect.
[0238] Preferably, the initial value of the RBF kernel length scale is l=3, and the signal variance is... =1, observation noise =0.001THz, and the hyperparameter optimization method is L-BFGS.
[0239] For example, the derivative of the GPR fitting along the heating direction at EtlTemp0 = 44.809℃ yields... =0.0847THz / ℃, the cooling direction is obtained =0.0812THz / ℃, timestamp YYYY-MM-DD-HH:MM:SS-016.
[0240] Beneficial effects of steps S4.1 to S4.5:
[0241] This series of steps involves scanning the temperature range above and below the optimal operating point and fitting the data in groups according to the heating and cooling directions. Gaussian regression is used to output bidirectional temperature slope coefficients, fully considering thermal hysteresis and improving temperature compensation accuracy. Compared to traditional methods that use a single slope coefficient to cover the entire temperature range, this series of steps scans the laser temperature and Etalon temperature independently and differentiates the heating and cooling directions for regression fitting. This captures the differential influence of the two temperature sources on wavelength shift, providing direction-sensitive slope parameter inputs for subsequent power cross-compensation and full-temperature-range shell temperature compensation.
[0242] In step S4.1, multiple points of laser temperature and Etalon temperature data are scanned and collected to provide data samples for fitting; in steps S4.2 and S4.3, heating and cooling mapping pairs are constructed to achieve directional grouping; in steps S4.4 and S4.5, Gaussian process regression fitting is performed on laser temperature and Etalon temperature to output their respective bidirectional slope coefficients.
[0243] Step S5: Under the target channel locked state, acquire a scanning dataset of multiple power points at equal intervals. Substitute the laser temperature-wavelength slope coefficient and the Etalon temperature-wavelength slope coefficient into the scanning dataset to fit and calculate the power-S parameter compensation coefficient dS0dPwr and the Etalon temperature-power compensation coefficient dPwr_dTetalon.
[0244] Furthermore, step S5 specifically includes the following steps:
[0245] Step S5.1: Under the target channel locked state, select multiple power points at equal intervals, and adjust the SOA current one by one to make the output power reach the target value of each power point, so as to obtain the power point sequence.
[0246] Preferably, the core of this step is to complete the selection of power points and the adjustment of SOA current. In the target channel locked state, multiple power points are selected at equal intervals, and the SOA current is adjusted one by one to make the output power reach the target value of each power point, so as to obtain the power point sequence.
[0247] In this context, the target channel lock-in state refers to a state where the lock-in loop is closed and the S-parameters are stably locked at SCaliTar, with the laser wavelength stable at the nominal wavelength corresponding to the target channel. Performing a power scan under this state ensures that the wavelength reference does not drift.
[0248] For power point selection, multiple power points are selected at equal intervals within the ITLA output power specification range, and the power point sequence is denoted as follows. Where T is the total number of power points. The distance between adjacent power points is... The lowest power point is The highest power point is .
[0249] Specifically, regarding SOA current adjustment, SOA (Semiconductor Optical Amplifier) refers to the semiconductor optical amplifier within the laser chip. The laser output power is controlled by adjusting the SOA drive current. Each power point target value corresponds to an SOA current setpoint, and after adjustment, the output power is allowed to stabilize.
[0250] Preferably, the total number of power points T=8, the power range is 10dBm to 17dBm, and they are evenly spaced. =1dBm, and the stabilization waiting time after SOA current adjustment is 0.3s.
[0251] For example, the eight power points are 10, 11, 12, 13, 14, 15, 16, and 17 dBm, with the first power point... =10dBm corresponds to the SOA current =45.2mA, the actual measured output power after stabilization is 10.03dBm, timestamp YYYY-MM-DD-HH:MM:SS-017.
[0252] Step S5.2: Fine-tune the target value of S at each power point to compensate for wavelength drift and keep the wavelength within the target value range.
[0253] Preferably, the core of this step is to complete wavelength drift compensation, and to fine-tune the target value of S at each power point to compensate for wavelength drift, so that the wavelength is kept within the target value range.
[0254] Regarding the causes of wavelength drift, changes in SOA current lead to variations in carrier density and thermal effects within the laser chip, resulting in wavelength shift. A typical wavelength drift of 0.3 to 0.8 GHz occurs for every 1 dBm increase in power, requiring compensation through fine-tuning of the target S value.
[0255] For fine-tuning the target value of S, at the t-th power point, the wavelength measured by the wavelength meter is read. Calculate wavelength deviation According to the laser temperature slope coefficient Estimate the adjustment amount for the target value S:
[0256] .
[0257] in, This represents the average value of the laser temperature-wavelength slope coefficient. For wavelength deviation, Adjust the target value S by an amount. Update the target value S to... And send it to the wave lock loop.
[0258] Specifically, for the target value range, the wavelength deviation needs to be controlled within... Within GHz, if the deviation still exceeds the range after a single fine-tuning, iterative fine-tuning will be performed, with a maximum of 3 times.
[0259] Preferably, the wavelength deviation tolerance range is ±0.1 GHz, and the upper limit of fine-tuning iterations is 3 times. Take the average slope of the heating and cooling.
[0260] For example, the third power point Wavelength deviation at 12dBm =0.45GHz, =0.0226THz / ℃ =0.45 / 22.6=0.0199, update the target value of S to 0.6173+0.0199=0.6372, after fine-tuning the wavelength deviation converges to 0.02GHz, timestamp YYYY-MM-DD-HH:MM:SS-018.
[0261] Step S5.3: Record the measured power, reference light detection sampling value, SOA current and actual S-parameter values corresponding to each power point to obtain a multi-power point scanning dataset.
[0262] Preferably, the core of this step is to complete the multi-power point data recording, recording the measured power, reference light detection sampling value PD2, SOA current and actual S-parameter values corresponding to each power point, and obtaining the multi-power point scanning dataset.
[0263] For the multi-power-point scanning dataset, each power point is recorded as a data row, containing the power point number, measured power, PD2 sample value, SOA current, actual S-parameter value, and target S-parameter value. The dataset is denoted as... ,in Let be the measured output power at the t-th power point. For reference light detection sampling value, For SOA current, The actual value of the S-parameter. Let S be the target value.
[0264] For data validity verification, the synchronous verification wavelength deviation for each power point recording should not exceed ±0.1GHz, the spectral locking loop should be in closed-loop locked state, and the PD2 sampling value fluctuation should not exceed ±0.5%. Data rows that fail verification are marked as invalid and resampled.
[0265] Preferably, each power point is recorded 3 times and the average is taken, resulting in a dataset of T rows.
[0266] For example, the data recorded at the third power point is: 3, 12.03dBm, 58342, 52.7mA, 0.6368, 0.6372, wavelength deviation 0.02GHz, verification passed, timestamp YYYY-MM-DD-HH:MM:SS-019.
[0267] Step S5.4: Substitute the laser temperature-wavelength slope coefficient and the Etalon temperature-wavelength slope coefficient into the multi-power point scanning dataset, perform linear fitting with the measured power as the abscissa and the S-parameter as the ordinate, and output the power-S-parameter compensation coefficient dS0dPwr.
[0268] Preferably, the core of this step is to complete the dS0dPwr fitting, substituting the laser temperature-wavelength slope coefficient and the Etalon temperature-wavelength slope coefficient into the multi-power point scanning dataset, and performing linear fitting with the measured power as the abscissa and the S-parameter as the ordinate, and outputting the power-S-parameter compensation coefficient dS0dPwr.
[0269] The physical meaning of dS0dPwr refers to the S-parameter drift caused by a 1dBm change in output power, reflecting the degree of interference of power switching on the locked reference. This coefficient is used in practical applications to perform power dimension feedforward compensation for the target S-parameter value.
[0270] For the linear fitting method, the laser temperature-wavelength slope coefficient is used. With Etalon temperature-wavelength slope coefficient After substituting the dataset and eliminating the influence of temperature on the S-parameters, a least-squares linear fit is performed on the remaining power-S-parameter relationship:
[0271] .
[0272] .
[0273] in, To eliminate the residual S-parameters after the effect of temperature, and Let and be the offsets of the laser temperature and Etalon temperature relative to the operating point at the t-th power point, respectively, and b be the fitting intercept. The slope dS0dPwr is solved using the least squares method:
[0274] .
[0275] in, The power average. The mean of the residual S-parameters.
[0276] Preferably, the number of least squares fitted data points T=8, and the precision of dS0dPwr is retained to four decimal places.
[0277] For example, after eliminating the temperature effect, the residual S-parameters of the 8 power points are 0.6173, 0.6218, 0.6368, 0.6487, 0.6612, 0.6735, 0.6891, and 0.7023, respectively. The least squares fitting yields dS0dPwr=0.0121 / dBm, b=0.4958, and the timestamp is YYYY-MM-DD-HH:MM:SS-020.
[0278] Step S5.5: Keep the reference light detection sampling value constant, scan the TEC2 temperature within the preset temperature range, and record the measured output power at each temperature.
[0279] Preferably, the core of this step is to complete the TEC2 temperature scan and power recording, keep the PD2 sampling value constant, scan the TEC2 temperature within a preset temperature range, and record the measured output power at each temperature.
[0280] Specifically, constant PD2 control refers to maintaining the sampled value of the reference photodetector PD2 at a fixed value by adjusting the SOA current. This ensures that the optical power entering the Etalon remains constant. Under these conditions, changes in output power caused by temperature variations in TEC2 only reflect changes in the Etalon's transmittance.
[0281] For TEC2 temperature scanning, in Within range, in steps Scan the TEC2 temperature point by point, and record the TEC2 temperature at each sampling point after the temperature stabilizes. The measured output power Pwr is compared with the actual output power. The scan data is denoted as... , where R is the number of scan sampling points.
[0282] Preferably, The PD2 mean value was set for room temperature calibration, with a TEC2 temperature scan range of 30°C to 70°C and a step size of [missing value]. ℃, number of sampling points R=5.
[0283] For example, the five scanning points are 30℃, 40℃, 50℃, 60℃, and 70℃, corresponding to measured output power of 13.52dBm, 13.41dBm, 13.28dBm, 13.15dBm, and 13.02dBm, with timestamp YYYY-MM-DD-HH:MM:SS-021.
[0284] Step S5.6: Perform linear fitting with TEC2 temperature as the abscissa and measured output power as the ordinate, and output the Etalon temperature-power compensation coefficient dPwr_dTetalon by taking the negative slope value.
[0285] Preferably, the core of this step is to complete the dPwr_dTetalon fitting, which uses TEC2 temperature as the abscissa and measured output power as the ordinate to perform linear fitting, and takes the negative slope value to output the Etalon temperature-power compensation coefficient dPwr_dTetalon.
[0286] The physical meaning of dPwr_dTetalon refers to the change in output power caused by a 1°C change in Etalon temperature, reflecting the degree of crosstalk between Etalon temperature and output power. Since Etalon transmittance decreases with increasing temperature, and output power decreases with increasing TEC2 temperature, the fitting slope is negative, and the negative value is used to obtain a positive compensation coefficient.
[0287] For linear fitting, the least squares method is used:
[0288] .
[0289] .
[0290] Where a is the fitting slope, The intercept is the fitted slope. The slope 'a' is solved using the least squares method:
[0291] .
[0292] in, This is the average temperature of TEC2. This represents the average output power.
[0293] Preferably, the number of least squares fitted data points R=5, and the precision of dPwr_dTetalon is retained to four decimal places.
[0294] For example, if the least squares fitting of 5 scan points yields a = -0.0125 dBm / ℃, then... =0.0125dBm / ℃, =13.8950dBm, timestamp YYYY-MM-DD-HH:MM:SS-022.
[0295] Beneficial effects of steps S5.1 to S5.6:
[0296] This series of steps establishes a cross-compensation relationship between power, S-parameters, and Etalon temperature through multi-power-point scanning and dual-coefficient fitting, eliminating S-parameter drift and wavelength shift caused by output power switching. Compared to traditional solutions that rely on passive wave locking after power stabilization, this series of steps actively fine-tunes the target S-parameter value at each power point to compensate for wavelength drift. Furthermore, it quantifies the impact of power on S-parameters and the impact of Etalon temperature on power using dual coefficients, achieving active wavelength feedforward compensation under power switching conditions. This provides a calibrated parameter basis in the power dimension for subsequent full-temperature-range shell temperature compensation.
[0297] The process includes the following steps: Step S5.1: Selecting a power point and adjusting the SOA current to achieve the target power to provide a power reference for scanning; Step S5.2: Fine-tuning the target S value to compensate for wavelength drift and ensure wavelength stability during the scanning process; Step S5.3: Recording the multi-power point scanning dataset to provide complete data for fitting; Step S5.4: Fitting the output dS0dPwr to quantify the influence of power on S-parameters; Step S5.5: Scanning the TEC2 temperature and recording power changes to provide data for temperature-power compensation; Step S5.6: Fitting the output dPwr_dTetalon to compensate for power fluctuations caused by temperature changes in Etalon.
[0298] Step S6: Based on the power-S parameter compensation coefficient dS0dPwr and the Etalon temperature-power compensation coefficient dPwr_dTetalon, measure the open-loop and closed-loop wavelength offset and power change under high and low temperature shell temperature environments, and fit to generate a shell temperature-wavelength full-temperature-range compensation coefficient matrix.
[0299] Furthermore, step S6 specifically includes the following steps:
[0300] Step S6.1: Control the shell temperature at the high temperature target value. After the temperature stabilizes, close the S loop, issue the room temperature calibration parameters, measure the open-loop wavelength offset, and calculate the high temperature open-loop shell temperature-wavelength coefficient.
[0301] Preferably, the core of this step is to complete the high-temperature open-loop measurement, control the shell temperature at the high-temperature target value, close the S loop after the temperature stabilizes, issue room temperature calibration parameters and measure the open-loop wavelength offset, and calculate the high-temperature open-loop shell temperature-wavelength coefficient.
[0302] The high-temperature target value refers to the high-temperature operating case temperature defined in the ITLA specification, denoted as . The shell temperature is heated to [a certain temperature] using a temperature control chamber. And it is stable. Stability is determined by three consecutive readings of the shell temperature sensor, where the fluctuation does not exceed ±0.5℃.
[0303] Specifically, closing the S-loop means disconnecting the laser temperature-S-parameter closed-loop wavelength lock-in loop. The laser TEC1 temperature is maintained at LaserTemp0 recorded during room temperature calibration, and the TEC2 temperature is maintained at EtlTemp0, without performing S-parameter feedback adjustment. In this state, the wavelength shift is only caused by changes in the shell temperature, reflecting the open-loop characteristics.
[0304] For open-loop wavelength offset measurement, after the high-temperature shell temperature stabilizes, the measured wavelength is read using a wavelength meter. During room temperature calibration, the wavelength is recorded as The open-loop wavelength offset is:
[0305] .
[0306] in, This is the measured wavelength for high-temperature open-loop operation. The wavelength is calibrated for room temperature. The high-temperature open-loop shell temperature-wavelength coefficient is:
[0307] .
[0308] in, The shell temperature is room temperature. The target shell temperature is high temperature. This represents the open-loop wavelength shift at high temperatures. This is the high-temperature open-loop shell temperature-wavelength coefficient.
[0309] Preferably, the target shell temperature is high. =63℃, room temperature shell temperature =25℃, wavelength meter measurement accuracy is ±0.1GHz.
[0310] For example, actual measurements after the high-temperature shell temperature stabilizes. =193.41567THz, room temperature calibration wavelength =193.41234THz, =0.00333THz=3.33GHz, =3.33 / (63-25)=0.0876GHz / ℃, timestamp YYYY-MM-DD-HH:MM:SS-023.
[0311] Step S6.2: Enable S-loop wave locking until stable, measure closed-loop wavelength offset, and calculate high-temperature closed-loop shell temperature-wavelength coefficient.
[0312] Preferably, the core of this step is to complete the high-temperature closed-loop measurement, activate the S-loop wave lock until it is stable, measure the closed-loop wavelength offset, and calculate the high-temperature closed-loop shell temperature-wavelength coefficient.
[0313] Specifically, opening the S-loop means reclosing the laser temperature-S-parameter closed-loop wavelocking loop, locking the target S-parameter value to SCaliTar. Because the high-temperature case temperature alters the thermal environment of the laser chip, the wavelocking loop adjusts the TEC1 temperature to compensate for the wavelength shift, causing the S-parameter to return to SCaliTar.
[0314] For closed-loop wavelength offset measurement, the measured wavelength is read using a wavelength meter after the wavelocked loop converges. The closed-loop wavelength offset is:
[0315] .
[0316] in, This is the measured wavelength in the high-temperature closed-loop circuit. The high-temperature closed-loop shell temperature-wavelength coefficient is:
[0317] .
[0318] in, This is the high-temperature closed-loop shell temperature-wavelength coefficient. The closed-loop offset is usually smaller than the open-loop offset, reflecting the compensation capability of the wave-locked loop.
[0319] Preferably, the convergence of the wave-locked loop is determined by the S-parameter deviation |e| < 0.002 after 10 consecutive samplings, and the wavelength meter reads 3 times and takes the average value after convergence.
[0320] For example, the measured value after high-temperature closed-loop wavelock convergence. =193.41289THz, =0.00055THz=0.55GHz, =0.55 / 38=0.0145GHz / ℃, timestamp YYYY-MM-DD-HH:MM:SS-024.
[0321] Step S6.3: Keep the reference light detection sampling value constant, measure the power change at high temperature, and calculate the high temperature shell temperature-power compensation coefficient.
[0322] Preferably, the core of this step is to complete the high-temperature power measurement, keep the PD2 sampling value constant, measure the power change at high temperature, and calculate the high-temperature shell temperature-power compensation coefficient.
[0323] For constant PD2 control, the SOA current is adjusted to maintain PD2 at a constant value. Under these conditions, the output power at high shell temperature was measured. The change in power is:
[0324] .
[0325] in, This is the actual output power measured at high temperature. This is the output power calibrated at room temperature. The high-temperature case temperature-power compensation factor is:
[0326] .
[0327] in, This is the high-temperature case temperature-power compensation coefficient. This coefficient reflects the crosstalk of case temperature changes to output power. Combined with dPwr_dTetalon, the effect of power changes on wavelength can be further decomposed.
[0328] Preferably, Consistent with the set value in step S5.5, the power meter measures 3 times and takes the average value.
[0329] For example, measured after PD2 stabilized at high temperature. =12.78dBm, room temperature =13.05dBm, =-0.27dBm, =-0.27 / 38=-0.0071dBm / ℃, timestamp YYYY-MM-DD-HH:MM:SS-025.
[0330] Step S6.4: Control the shell temperature at the low temperature target value, close the S loop after the temperature stabilizes, issue the room temperature calibration parameters and measure the open-loop wavelength offset, and calculate the low temperature open-loop shell temperature-wavelength coefficient.
[0331] Preferably, the core of this step is to complete the low-temperature open-loop measurement, control the shell temperature at the low-temperature target value, close the S loop after the temperature stabilizes, issue the room temperature calibration parameters and measure the open-loop wavelength offset, and calculate the low-temperature open-loop shell temperature-wavelength coefficient.
[0332] The low-temperature target value refers to the low-temperature operating case temperature defined in the ITLA specification, denoted as . The shell temperature is lowered to [a certain value] through a temperature control chamber. And it is stable, with the stability criteria being consistent with those for high temperature.
[0333] For low-temperature open-loop measurements, after closing the S-loop, the temperature of laser TEC1 is maintained at LaserTemp0, and the temperature of TEC2 is maintained at EtlTemp0. The actual measured wavelength at low temperature open loop is read using a wavelength meter. The low-temperature open-loop wavelength shift is:
[0334] .
[0335] in, This is the measured wavelength at low-temperature open-loop conditions. The low-temperature open-loop shell temperature-wavelength coefficient is:
[0336] .
[0337] in, The target shell temperature is low temperature. This is the open-loop shell temperature-wavelength coefficient at low temperatures. The open-loop offset direction at low temperatures is usually opposite to that at high temperatures, resulting in a decrease in wavelength.
[0338] Preferably, the target shell temperature is low. = -5℃, cooling rate not exceeding 2℃ / min.
[0339] For example, actual measurements after the low-temperature shell temperature stabilizes. =193.40912THz, =-0.00322THz=-3.22GHz, =-3.22 / (-5-25)=0.1073GHz / ℃, timestamp YYYY-MM-DD-HH:MM:SS-026.
[0340] Step S6.5: Activate the S-loop wave lock until it stabilizes, measure the closed-loop wavelength offset, and calculate the low-temperature closed-loop shell temperature-wavelength coefficient.
[0341] Preferably, the core of this step is to complete the low-temperature closed-loop measurement, activate the S-loop wave lock until it is stable, measure the closed-loop wavelength offset, and calculate the low-temperature closed-loop shell temperature-wavelength coefficient.
[0342] Specifically, for low-temperature closed-loop wavelocking, the S-loop is reclosed, and the target value of the S-parameters is locked to SCaliTar. In low-temperature environments, the wavelocking loop compensates for wavelength shift by adjusting the temperature of TEC1.
[0343] Specifically, the low-temperature closed-loop wavelength offset is read after wavelock convergence. The closed-loop wavelength offset is:
[0344] .
[0345] in, This is the measured wavelength in the low-temperature closed-loop system. The low-temperature closed-loop shell temperature-wavelength coefficient is:
[0346] .
[0347] in, It is the low-temperature closed-loop shell temperature-wavelength coefficient.
[0348] Preferably, the wave lock convergence determination is consistent with the high temperature, and the wavelength meter reads three times and takes the average value.
[0349] For example, the measured value after low-temperature closed-loop wavelock convergence. =193.41187THz, =-0.00047THz=-0.47GHz, =-0.47 / (-30)=0.0157GHz / ℃, timestamp YYYY-MM-DD-HH:MM:SS-027.
[0350] Step S6.6: Keep the reference light detection sampling value constant, measure the power change at low temperature, and calculate the low temperature shell temperature-power compensation coefficient.
[0351] Preferably, the core of this step is to complete the low-temperature power measurement, keep the PD2 sampling value constant, measure the power change at low temperature, and calculate the low-temperature shell temperature-power compensation coefficient.
[0352] Specifically, for the constant control of PD2 at low temperature, the SOA current is adjusted to maintain PD2 at a constant value. Measure the output power at low shell temperature The change in power is:
[0353] .
[0354] in, This represents the measured output power at low temperatures. The low-temperature case temperature-power compensation coefficient is:
[0355] .
[0356] in, This is the low-temperature shell temperature-power compensation coefficient.
[0357] Preferably, As with high-temperature measurements, the power meter was used to take three measurements and the average value was taken.
[0358] For example, measured after PD2 was kept constant at low temperature. =13.31dBm, =13.31-13.05=0.26dBm =0.26 / (-30)=-0.0087dBm / ℃, timestamp YYYY-MM-DD-HH:MM:SS-028.
[0359] Step S6.7: Combine the high-temperature open-loop shell temperature-wavelength coefficient, the high-temperature closed-loop shell temperature-wavelength coefficient, the high-temperature shell temperature-power compensation coefficient, the low-temperature open-loop shell temperature-wavelength coefficient, the low-temperature closed-loop shell temperature-wavelength coefficient, and the low-temperature shell temperature-power compensation coefficient into a shell temperature-wavelength full-temperature-range compensation coefficient matrix.
[0360] Preferably, the core of this step is to complete the combination of compensation coefficient matrices, which combines the open-loop shell temperature-wavelength coefficient, closed-loop shell temperature-wavelength coefficient, and shell temperature-power compensation coefficient for both high and low temperatures into a shell temperature-wavelength full-temperature-range compensation coefficient matrix.
[0361] The shell temperature-wavelength full-temperature-domain compensation coefficient matrix is defined as follows:
[0362] .
[0363] in, This refers to the high-temperature open-loop shell temperature-wavelength coefficient. This refers to the high-temperature closed-loop shell temperature-wavelength coefficient. This is the high-temperature casing temperature-power compensation coefficient. The low-temperature open-loop shell temperature-wavelength coefficient, The low-temperature closed-loop shell temperature-wavelength coefficient, This is the low-temperature shell temperature-power compensation coefficient.
[0364] In engineering applications of matrices, in actual ITLA work, the current shell temperature is considered. Linear interpolation is performed between high and low temperatures, and the corresponding open-loop coefficients, closed-loop coefficients, and power compensation coefficients are extracted from the matrix. Combined with dS0dPwr and dPwr_dTetalon, feedforward compensation is performed on the target value of S-parameters and SOA current to achieve full-temperature wavelength locking.
[0365] For linear interpolation, when In When the interval is within the specified range, the interpolation weights are:
[0366] .
[0367] in, The interpolation weights range from [0,1]. The compensation coefficients are obtained through two-endpoint linear interpolation.
[0368] .
[0369] .
[0370] .
[0371] in, This is the interpolated open-loop shell temperature-wavelength coefficient. This is the interpolated closed-loop shell temperature-wavelength coefficient. This is the interpolated shell temperature-power compensation coefficient.
[0372] Preferably, the matrix is stored as a 2-row, 3-column floating-point array with precision retained to four decimal places and an interpolation range of -5℃ to 63℃.
[0373] For example, the compensation coefficient matrix is When the shell temperature At 40℃, =(40-(-5)) / (63-(-5))=45 / 68=0.6618, interpolation value GHz / ℃, timestamp YYYY-MM-DD-HH:MM:SS-029.
[0374] Beneficial effects of steps S6.1 to S6.7:
[0375] This series of steps uses two sets of open-loop and closed-loop measurements at high and low temperatures, along with power measurements, to generate a full-temperature-range compensation coefficient matrix. This matrix covers the independent effects of shell temperature changes on wavelength and power, ensuring the wavelength locking accuracy of the ITLA under both high and low temperature conditions. Compared to traditional solutions that use a single temperature slope coefficient to cover the entire temperature range, this series of steps measures the wavelength shift in both open-loop and closed-loop states and calculates their respective shell temperature-wavelength coefficients independently. Simultaneously, it keeps the reference light detection sampling value constant while measuring power changes to calculate the shell temperature-power compensation coefficient. These six coefficients are combined into a matrix to achieve joint compensation across three dimensions: shell temperature, wavelength locking loop state, and power. This provides a complete parameter set for wavelength feedforward compensation during actual ITLA operation.
[0376] Specifically, steps S6.1 to S6.3 measure the open-loop wavelength shift, closed-loop wavelength shift, and power change at high temperatures and calculate their respective compensation coefficients; steps S6.4 to S6.6 measure the open-loop wavelength shift, closed-loop wavelength shift, and power change at low temperatures and calculate their respective compensation coefficients; and step S6.7 combines the six coefficients into a shell temperature-wavelength full-temperature-range compensation coefficient matrix for use in actual work.
[0377] In summary, the overall beneficial effects of steps S1 to S6 in this embodiment are as follows:
[0378] This method addresses the technical problem of large wavelength offset across the entire temperature range caused by the single-dimensional parameter model used in existing wave-locking calibration schemes. It constructs a multi-dimensional S-parameter-temperature sampling dataset and extracts a globally unified wave-locking reference. Combined with global optimization to locate the optimal operating point, it uses Gaussian process regression to fit the temperature slope coefficient and establishes a power cross-compensation and shell temperature full-temperature-range compensation coefficient matrix. This achieves multi-dimensional cross-compensation between laser temperature, Etalon temperature, shell temperature, and output power, enabling ITLA to meet the wavelength locking accuracy requirements across the entire temperature range and multiple power levels.
[0379] The steps are as follows: Step S1 constructs a multi-dimensional sampling dataset to provide a unified data foundation for subsequent calculations; Step S2 extracts a global wave-locking reference to eliminate the inconsistency in wave-locking directions for different channels; Step S3 quickly locates the optimal operating point and completes the wave-locking loop closure through global optimization; Step S4 improves compensation accuracy by fitting the temperature slope coefficients that distinguish the heating and cooling directions through Gaussian process regression; Step S5 establishes cross-compensation coefficients for power, S-parameters, and Etalon temperature to eliminate wavelength drift caused by power switching; and Step S6 fits and generates a full-temperature-range compensation coefficient matrix to cover high and low temperature operating conditions.
[0380] like Figure 2 As shown, this embodiment provides an ITLA wave-locking system based on Etalon S parameters. In this embodiment, the ITLA wave-locking system is applied to the ITLA wave-locking method described above.
[0381] Specifically, the ITLA wave-locking calibration system includes an S-parameter-temperature dataset acquisition module 1, an S-parameter wave-locking reference extraction module 2, an Etalon optimal operating point temperature positioning module 3, a slope coefficient calculation module 4, a compensation coefficient calculation module 5, and a shell temperature-wavelength full-temperature-range compensation coefficient matrix fitting module 6, which are connected electrically or through communication in sequence.
[0382] The S-parameter-temperature dataset acquisition module 1 is used to acquire the Etalon transmitted light detection signal PD1 and the reference light detection signal PD2 to calculate the S-parameter sequence, and simultaneously record the TEC2 temperature sampling value and the laser temperature sampling value to construct a multi-dimensional S-parameter-temperature sampling dataset; the S-parameter lock-in reference extraction module 2 is used to determine the intersection of the two wavelengths in the multi-dimensional S-parameter-temperature sampling dataset, and extract the globally unified S-parameter lock-in reference SCaliTar by calculating the intersection of two S-TEC2 temperature curves; the Etalon optimal operating point temperature positioning module 3 is used to locate the Etalon optimal operating point temperature EtlTemp0 and complete the lock-in loop closure by globally optimizing the TEC2 temperature control parameter space with the S-parameter lock-in reference SCaliTar as the target value; the slope coefficient calculation module 4 is used to calculate the Etalon optimal operating point temperature EtlTemp0. The system scans multiple points of laser temperature and Etalon temperature within the upper and lower intervals, and outputs the laser temperature-wavelength slope coefficient and Etalon temperature-wavelength slope coefficient through Gaussian process regression fitting. The compensation coefficient calculation module 5 is used to acquire multiple power point scanning datasets at equal intervals under the target channel locking state, and substitutes the laser temperature-wavelength slope coefficient and Etalon temperature-wavelength slope coefficient into the scanning dataset to fit and calculate the power-S parameter compensation coefficient dS0dPwr and the Etalon temperature-power compensation coefficient dPwr_dTetalon. The shell temperature-wavelength full-temperature-range compensation coefficient matrix fitting module 6 is used to measure the open-loop and closed-loop wavelength offset and power change under high and low shell temperature environments based on the power-S parameter compensation coefficient dS0dPwr and the Etalon temperature-power compensation coefficient dPwr_dTetalon, and fit to generate the shell temperature-wavelength full-temperature-range compensation coefficient matrix.
[0383] like Figure 3 As shown, the electronic device 7 includes a processor 71 and a memory 72 coupled to the processor 71.
[0384] The memory 72 stores program instructions for implementing the ITLA wave-locking calibration method based on Etalon S-parameters in any of the above embodiments.
[0385] Processor 71 is used to execute program instructions stored in memory 72 to perform ITLA wave-locking based on Etalon S-parameters.
[0386] The processor 71 can also be referred to as a CPU (Central Processing Unit). The processor 71 may be an integrated circuit chip with signal processing capabilities. The processor 71 can also be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. A general-purpose processor can be a microprocessor or any conventional processor.
[0387] Furthermore, Figure 4 This is a schematic diagram of the structure of a storage medium according to an embodiment of this application. See also: Figure 4 The storage medium 8 in this embodiment stores program instructions 81 capable of implementing all the above methods. These program instructions 81 can be stored in the storage medium as a software product, including several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) or processor to execute all or part of the steps of the methods in each embodiment of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks, or terminal devices such as computers, servers, mobile phones, and tablets.
[0388] In the several embodiments provided in this application, it should be understood that the disclosed systems, methods, and approaches can be implemented in other ways. For example, the system embodiments described above are merely illustrative. For instance, the ITLA wave-locking marker based on the Etalon S-parameter of a unit is only one logical function based on the Etalon S-parameter of the ITLA wave-locking marker. In actual implementation, there may be other methods of based on the Etalon S-parameter of the ITLA wave-locking marker. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interface, and the indirect coupling or communication connection of the system or unit may be electrical, mechanical, signal, or other forms.
[0389] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated units described above can be implemented in hardware or as software functional units. The above are merely embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made based on the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.
Claims
1. An ITLA wave-locking calibration method based on Etalon S-parameters, characterized in that, The ITLA wave-locking method includes: Step S1: Acquire Etalon transmitted light detection signal PD1 and reference light detection signal PD2 to calculate the S-parameter sequence, and simultaneously record TEC2 temperature sampling value and laser temperature sampling value to construct an S-parameter-temperature multi-dimensional sampling dataset. Step S2: Perform dual-wavelength intersection determination on the S-parameter-temperature multi-dimensional sampling dataset, and extract the globally unified S-parameter locked-wave reference SCaliTar by calculating the intersection of the two S-TEC2 temperature curves. Step S3: Using the S-parameter lock-in reference SCaliTar as the target value, the TEC2 temperature control parameter space is searched globally to locate the optimal operating point temperature EtlTemp0 of Etalon and complete the lock-in loop closure. Step S4: Scan the laser temperature and Etalon temperature multi-point data within the upper and lower intervals of the Etalon optimal operating point temperature EtlTemp0, and output the laser temperature-wavelength slope coefficient and Etalon temperature-wavelength slope coefficient through Gaussian process regression fitting. Step S5: Under the target channel locked state, acquire a scanning dataset of multiple power points at equal intervals, and substitute the laser temperature-wavelength slope coefficient and the Etalon temperature-wavelength slope coefficient into the scanning dataset to fit and calculate the power-S parameter compensation coefficient dS0dPwr and the Etalon temperature-power compensation coefficient dPwr_dTetalon. Step S6: Based on the power-S parameter compensation coefficient dS0dPwr and the Etalon temperature-power compensation coefficient dPwr_dTetalon, measure the open-loop and closed-loop wavelength offset and power change under high and low temperature shell temperature environments, and fit to generate a shell temperature-wavelength full-temperature-range compensation coefficient matrix.
2. The ITLA wave-locking calibration method according to claim 1, characterized in that, Step S1: Acquire the Etalon transmitted light detection signal PD1 and the reference light detection signal PD2 to calculate the S-parameter sequence, and simultaneously record the TEC2 temperature sampling value and the laser temperature sampling value to construct an S-parameter-temperature multi-dimensional sampling dataset, including: Step S1.1: Configure the wavelength as the first channel and the first channel plus half of the Etalon free spectrum range respectively to obtain two target wavelength configurations; Step S1.2: Scan the TEC2 temperature under the two target wavelength configurations respectively, and collect the Etalon transmitted light detection signal PD1 and the reference light detection signal PD2 at each sampling point to obtain the PD1 sampling value sequence and PD2 sampling value sequence of each of the two curves; Step S1.3: Divide the PD1 sample value sequence by the corresponding PD2 sample value sequence to calculate the S-parameter sequences of the two curves, where the S-parameter is defined as the ratio of PD1 to PD2. Step S1.4: Simultaneously record the TEC2 temperature sampling value at each sampling point and read the laser temperature sampling value to obtain the TEC2 temperature sequence and the laser temperature sequence; Step S1.5: Align the S-parameter sequence, the TEC2 temperature sequence, and the laser temperature sequence according to the sampling timestamps, and concatenate them into an S-parameter-temperature multi-dimensional sampling dataset.
3. The ITLA wave-locking calibration method according to claim 1, characterized in that, Step S2 involves determining the intersection of two wavelengths in the S-parameter-temperature multi-dimensional sampling dataset, and extracting the globally unified S-parameter-locked reference SCaliTar by calculating the intersection of two S-TEC2 temperature curves, including: Step S2.1: Extract the S-parameter sequences and corresponding TEC2 temperature sequences of the two curves from the S-parameter-temperature multidimensional sampling dataset, and construct the S-TEC2 temperature curve of the first channel and the S-TEC2 temperature curve of the second channel respectively. Step S2.2: Solve for the intersection points of the S-TEC2 temperature curves of the first channel and the S-TEC2 temperature curves of the second channel to obtain the intersection point set; Step S2.3: Select the intersection point closest to the target temperature from the set of intersection points, and extract the ordinate S value of the intersection point as the globally unified S-parameter wave-locking reference SCaliTar.
4. The ITLA wave-locking calibration method according to claim 1, characterized in that, Step S3, using the S-parameter lock-in reference SCaliTar as the target value, globally optimizes the TEC2 temperature control parameter space to locate the optimal operating temperature EtlTemp0 of Etalon and complete the lock-in loop closure, including: Step S3.1: Using the S-parameter locked wave reference SCaliTar as the target value, initialize the TEC2 temperature search range and optimization parameters, and construct the TEC2 temperature control parameter space; Step S3.2: Perform a global optimization search within the TEC2 temperature control parameter space. In each iteration, calculate the deviation between the S-parameter and SCaliTar at the current TEC2 temperature, and update the search direction based on the deviation to obtain the optimal candidate value for TEC2 temperature. Step S3.3: Set the optimal TEC2 temperature candidate value as the TEC2 target temperature, wait for the temperature to stabilize, and then check whether the S-parameter falls within the SCaliTar allowable range. If it does, confirm that the current TEC2 temperature is the Etalon optimal operating point temperature EtlTemp0. Step S3.4: At the optimal operating temperature EtlTemp0 of Etalon, the laser temperature-S parameter closed-loop wavelock circuit is opened, and the target value of the S parameter is locked to SCaliTar, thus completing the closure of the wavelock circuit.
5. The ITLA wave-locking calibration method according to claim 1, characterized in that, Step S4: Scan multi-point data of laser temperature and Etalon temperature within the upper and lower intervals of the optimal Etalon operating point temperature EtlTemp0, and output the laser temperature-wavelength slope coefficient and Etalon temperature-wavelength slope coefficient through Gaussian process regression fitting, including: Step S4.1: Within the upper and lower range of the optimal operating temperature EtlTemp0 of Etalon, scan the laser temperature and Etalon temperature respectively with a preset step. Collect the laser temperature value, Etalon temperature value, S-parameter value and measured wavelength value at each sampling point to obtain laser temperature scanning data and Etalon temperature scanning data. Step S4.2: Group the laser temperature scanning data according to the heating direction and the cooling direction, and construct heating laser temperature-wavelength mapping pairs and cooling laser temperature-wavelength mapping pairs respectively; Step S4.3: Group the Etalon temperature scan data according to the heating direction and the cooling direction, and construct heating Etalon temperature-wavelength mapping pairs and cooling Etalon temperature-wavelength mapping pairs respectively; Step S4.4: Perform Gaussian process regression fitting on the heating laser temperature-wavelength mapping pair and the cooling laser temperature-wavelength mapping pair respectively, and output the laser temperature-wavelength slope coefficient in the heating direction and the laser temperature-wavelength slope coefficient in the cooling direction. Step S4.5: Perform Gaussian process regression fitting on the heating Etalon temperature-wavelength mapping pair and the cooling Etalon temperature-wavelength mapping pair respectively, and output the Etalon temperature-wavelength slope coefficient in the heating direction and the Etalon temperature-wavelength slope coefficient in the cooling direction.
6. The ITLA wave-locking calibration method according to claim 1, characterized in that, Step S5: Under target channel locking, acquire a scanning dataset of multiple power points at equal intervals. Substitute the laser temperature-wavelength slope coefficient and the Etalon temperature-wavelength slope coefficient into the scanning dataset to fit and calculate the power-S parameter compensation coefficient dS0dPwr and the Etalon temperature-power compensation coefficient dPwr_dTetalon, including: Step S5.1: Under the target channel locked state, select multiple power points at equal intervals, and adjust the SOA current one by one to make the output power reach the target value of each power point, so as to obtain the power point sequence. Step S5.2: Fine-tune the target value of S at each power point to compensate for wavelength drift and keep the wavelength within the target value range; Step S5.3: Record the measured power, reference light detection sampling value, SOA current and actual S-parameter values corresponding to each power point to obtain a multi-power point scanning dataset; Step S5.4: Substitute the laser temperature-wavelength slope coefficient and the Etalon temperature-wavelength slope coefficient into the multi-power point scanning dataset, perform linear fitting with the measured power as the abscissa and the S-parameter as the ordinate, and output the power-S-parameter compensation coefficient dS0dPwr. Step S5.5: Keep the reference light detection sampling value constant, scan the TEC2 temperature within the preset temperature range, and record the measured output power at each temperature; Step S5.6: Perform linear fitting with TEC2 temperature as the abscissa and measured output power as the ordinate, and output the Etalon temperature-power compensation coefficient dPwr_dTetalon by taking the negative slope value.
7. The ITLA wave-locking calibration method according to claim 1, characterized in that, Step S6: Based on the power-S parameter compensation coefficient dS0dPwr and the Etalon temperature-power compensation coefficient dPwr_dTetalon, measure the open-loop and closed-loop wavelength shifts and power changes under high and low shell temperature environments, and fit and generate a shell temperature-wavelength full-temperature-range compensation coefficient matrix, including: Step S6.1: Control the shell temperature at the high temperature target value, close the S loop after the temperature stabilizes, issue the room temperature calibration parameters and measure the open-loop wavelength offset, and calculate the high temperature open-loop shell temperature-wavelength coefficient. Step S6.2: Open the S-loop wave lock until it is stable, measure the closed-loop wavelength offset, and calculate the high-temperature closed-loop shell temperature-wavelength coefficient. Step S6.3: Keep the reference light detection sampling value constant, measure the power change at high temperature, and calculate the high temperature shell temperature-power compensation coefficient; Step S6.4: Control the shell temperature at the low temperature target value, close the S loop after the temperature stabilizes, issue the room temperature calibration parameters and measure the open-loop wavelength offset, and calculate the low temperature open-loop shell temperature-wavelength coefficient. Step S6.5: Open the S-loop wave lock until it is stable, measure the closed-loop wavelength offset, and calculate the low-temperature closed-loop shell temperature-wavelength coefficient. Step S6.6: Keep the reference light detection sampling value constant, measure the power change at low temperature, and calculate the low temperature shell temperature-power compensation coefficient; Step S6.7: Combine the high-temperature open-loop shell temperature-wavelength coefficient, the high-temperature closed-loop shell temperature-wavelength coefficient, the high-temperature shell temperature-power compensation coefficient, the low-temperature open-loop shell temperature-wavelength coefficient, the low-temperature closed-loop shell temperature-wavelength coefficient, and the low-temperature shell temperature-power compensation coefficient into a shell temperature-wavelength full-temperature-range compensation coefficient matrix.
8. An ITLA wave-locking calibration system based on Etalon S-parameters, wherein the ITLA wave-locking calibration system is applied to the ITLA wave-locking calibration method as described in any one of claims 1 to 7, characterized in that, The ITLA wave-locking beacon system includes: The S-parameter-temperature dataset acquisition module is used to acquire the Etalon transmitted light detection signal PD1 and the reference light detection signal PD2 to calculate the S-parameter sequence, and simultaneously record the TEC2 temperature sampling value and the laser temperature sampling value to construct a multi-dimensional S-parameter-temperature sampling dataset. The S-parameter locked-wave reference extraction module is used to determine the intersection of two wavelengths in the S-parameter-temperature multidimensional sampling dataset and extract the globally unified S-parameter locked-wave reference SCaliTar by calculating the intersection of two S-TEC2 temperature curves. The Etalon optimal operating point temperature positioning module is used to locate the Etalon optimal operating point temperature EtlTemp0 and complete the closed loop of the wave lock by using the S-parameter wave lock reference SCaliTar as the target value and searching the TEC2 temperature control parameter space through global optimization. The slope coefficient calculation module is used to scan multi-point data of laser temperature and Etalon temperature within the upper and lower intervals of the optimal operating point temperature EtlTemp0 of Etalon, and output the laser temperature-wavelength slope coefficient and Etalon temperature-wavelength slope coefficient through Gaussian process regression fitting. The compensation coefficient calculation module is used to acquire a scanning dataset of multiple power points at equal intervals under the target channel locking state, and substitute the laser temperature-wavelength slope coefficient and the Etalon temperature-wavelength slope coefficient into the scanning dataset to fit and calculate the power-S parameter compensation coefficient dS0dPwr and the Etalon temperature-power compensation coefficient dPwr_dTetalon. The shell temperature-wavelength full-temperature-range compensation coefficient matrix fitting module is used to measure the open-loop and closed-loop wavelength offset and power change under high and low shell temperature environments based on the power-S parameter compensation coefficient dS0dPwr and the Etalon temperature-power compensation coefficient dPwr_dTetalon, and to fit and generate the shell temperature-wavelength full-temperature-range compensation coefficient matrix.
9. An electronic device, characterized in that, The method includes a processor and a memory coupled to the processor, the memory storing program instructions executable by the processor; when the processor executes the program instructions stored in the memory, it implements the ITLA wave-locking calibration method as described in any one of claims 1 to 7.
10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores program instructions that, when executed by a processor, enable the implementation of the ITLA wave-locking method as described in any one of claims 1 to 7.
