earphone
By employing a dual-speaker unit design and reasonable layout in TWS earbuds, the challenges of low-frequency and high-frequency reproduction in traditional TWS earbuds have been solved, achieving more balanced audio quality and better active noise cancellation.
Patent Information
- Application Number
- CN202480090021.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-26
- Publication Date
- 2026-11-03
AI Technical Summary
Traditional TWS earbuds, due to the use of a single speaker unit, struggle to achieve balanced and high-fidelity sound output. Especially after incorporating active noise cancellation technology, the low-frequency and high-frequency reproduction of the speaker unit becomes challenging, while the structural design is limited by internal space.
It adopts a dual speaker unit design, in which the first speaker unit has good bass performance, the second speaker unit is close to the sound output port, and the microphone is located inside the earbud cover close to the eardrum. Sound is guided to the output port through the acoustic port and channel, and sound leakage is prevented by the use of sealing gaskets. The ANC signal is only provided to the first speaker unit to reduce high frequency overshoot.
It achieves balanced and high-fidelity sound output across the entire frequency range, enhances active noise cancellation performance, reduces high-frequency overshoot and background noise, and improves the audio quality of the headphones.
Smart Images

Figure CN123036866A_ABST
Abstract
Description
Technical Field
[0001] This disclosure generally relates to headphones, and more specifically, to headphones having two speaker units. Background Technology
[0002] In recent years, true wireless stereo (TWS) earbuds have become an increasingly indispensable item in people's daily lives. The growing popularity of TWS earbuds is due to their convenience, freedom from physical cables, and the good audio quality they offer.
[0003] Traditionally, TWS earbuds utilize a single speaker unit to reproduce sound across its entire audio spectrum. While this design simplifies the earbud's construction, it often results in compromised sound quality. Specifically, achieving a balanced and high-fidelity output is challenging for traditional earbuds with a single speaker unit, as it is difficult for a single speaker unit to equally represent both the low and high frequencies of the audio spectrum.
[0004] Furthermore, this problem may become more pronounced when active noise cancellation (ANC) technology is incorporated into earbuds. Good ANC performance requires speaker units with excellent low-frequency response, necessitating the use of larger speaker units. However, larger speaker units can lead to difficulties in accurately reproducing high-frequency sounds.
[0005] In addition, the internal space constraints of TWS earbuds pose significant challenges to the structural design for achieving an aesthetically pleasing appearance, ergonomic comfort, and excellent audio quality.
[0006] Therefore, a new headphone design is needed that overcomes at least some of these limitations. Summary of the Invention
[0007] According to one aspect of this disclosure, an earphone is provided. The earphone includes: a housing defining a sound output port; a first speaker unit positioned within the housing, facing the sound output port and configured to emit sound toward the sound output port; and a second speaker unit positioned within the housing, facing the sound output port and configured to emit sound toward the sound output port; wherein the first speaker unit has better bass performance than the second speaker unit, and the second speaker unit is positioned closer to the sound output port than the first speaker unit. Attached Figure Description
[0008] This disclosure will be better understood with reference to the following figures and description. The components shown in the figures are not necessarily drawn to scale, and the emphasis should be on the principles illustrated in this disclosure. Furthermore, in the figures, the same reference numerals denote the same parts throughout the figures.
[0009] Figure 1A A perspective view of an earphone according to one or more embodiments of the present disclosure is shown;
[0010] Figure 1B An exploded view of an earphone according to one or more embodiments of the present disclosure is shown;
[0011] Figure 2A A cross-sectional view of an earphone according to one or more embodiments of the present disclosure is shown;
[0012] Figure 2B yes Figure 2A Enlarged view of the dashed section 2B;
[0013] Figure 3 A perspective view of a second speaker unit of an earphone according to one or more embodiments of the present disclosure is shown;
[0014] Figure 4 A perspective view of headphones according to one or more embodiments of the present disclosure is shown, wherein the headphones are oriented so that their sound output ports face the viewer / reader; and
[0015] Figure 5 Frequency response curves of headphones according to embodiments of the present disclosure and headphones according to comparative embodiments are shown. Detailed Implementation
[0016] In the following, various embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings.
[0017] As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context explicitly indicates otherwise. As used herein, the terms “comprise,” “comprising,” “include,” and / or “including” specify the presence of the stated feature, integer, step, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof. As used herein, the terms “and / or” and the symbol “ / ” signify any and all combinations including one or more of the associated listed items. Furthermore, while the terms “first,” “second,” etc., may be used herein to describe various elements, components, steps, or calculations, these elements, components, steps, or calculations should not be limited by these terms, but rather these terms are used only to distinguish one element, component, step, or calculation from another. For example, a first component may be referred to as a second component; similarly, a first calculation may be referred to as a second calculation; likewise, a first step may be referred to as a second step; all of these do not depart from the scope of this disclosure.
[0018] In order to clarify its use in the pending claims and to provide notice to the public, the applicant defines the phrase "in the broadest sense" < >、......and <n> at least one of them or< / n> 、< >、......、 <n>"or at least one of their combinations," unless the applicant expressly states otherwise, this definition supersedes any other implied definition above or below, meaning one or more elements selected from the group consisting of A, B, ... and N, that is, any combination of one or more of elements A, B, ... or N, including any element existing alone or in combination with one or more other elements, and the combination may also include any unlisted additional elements existing in combination.
[0019] This disclosure provides an earphone comprising: a housing defining a sound output port; a first speaker unit and a second speaker unit, both positioned within the housing and facing the sound output port and configured to emit sound toward the sound output port; wherein the first speaker unit has better bass performance than the second speaker unit, and the second speaker unit is positioned closer to the sound output port than the first speaker unit. By incorporating both the first and second speaker units, the earphone is able to produce a more balanced and high-fidelity sound across its entire frequency range.
[0020] According to one or more embodiments, the earphones also include a microphone positioned within the housing, which is closer to the sound output port than the second speaker unit. According to one or more other embodiments, the earphones are TWS earphones with ear tips, and the ear tips define a sound path to the sound output port, with the microphone at least partially positioned within the ear tips. By positioning the microphone within the ear tips adjacent to the sound output port, the microphone 160 is close to the eardrum of the earphone wearer, effectively capturing sound near the wearer's eardrum. This arrangement facilitates optimal ANC performance.
[0021] According to one or more embodiments, the second speaker unit is located behind the microphone, and the first speaker unit is located further behind the second speaker unit. By placing the smallest possible microphone inside the narrow earbud cover, and thereby arranging the second and first speaker units in a gradually widening space behind the earbud cover, the limited space in or near the earbud cover of the headphones can be fully utilized.
[0022] According to one or more embodiments, the second speaker unit includes an acoustic port, and the headphones further include a second sound channel extending from the acoustic port to a second output port for directing sound from the second speaker unit to the sound output port. According to one or more other embodiments, the headphones further include a sealing gasket that seals between the acoustic port of the second speaker unit and the second sound channel.
[0023] This second sound channel ensures that the high-frequency sound generated by the second speaker unit is effectively transmitted to the sound output port and then into the wearer's ear canal. The sealing gasket effectively prevents sound leakage from the area between the second speaker unit and the second sound channel.
[0024] According to one or more embodiments, the earphone is a TWS earbud with an ANC mode, and the ANC signal of the earphone is provided to the first speaker unit but not to the second speaker unit. Since the first speaker unit, which is relatively far from the sound output port, provides a relatively low frequency response at high frequencies, this arrangement can effectively reduce high-frequency overshoot in the earphone's ANC mode.
[0025] < / n> Figure 1A A perspective view of an earphone 100 according to one or more embodiments of the present disclosure is shown. Figure 1B An exploded view of the headphones 100 is shown. Figure 1A As shown, the earphone 100 is a TWS earbud, including a main body 102, an ear tip 104, and an earphone stem 106. The ear tip 104 extends from the front or a first side of the main body 102, and the earphone stem 106 is located on the rear or a second side of the main body 102. When a user wears the earphone 100, the ear tip 104 is at least partially inserted into the user's ear canal, thereby allowing sound generated by the speaker unit of the earphone 100 to travel through the channel in the ear tip 104 into the user's ear canal. Figure 1A The earphone 100 shown is illustrative only and not limiting. In one or more other embodiments, the earphone can be earphones with any suitable shape or configuration.
[0026] like Figure 1B As shown, the headphones 100 include a front or first housing portion 112 and a rear or second housing portion 114. The front housing portion 112 and the rear housing portion 114 are configured to cooperate together to enclose or define a space for housing electronic components of the headphones therein. The front housing portion 112 and the rear housing portion 114 together may be referred to as the housing or outer shell of the headphones 100. The headphones 100 also includes a first speaker unit 120 and a second speaker unit 140. In one or more embodiments, the first speaker unit 120 may be a dynamic driver unit, and the second speaker unit 140 may be a balanced armature (BA) driver unit. The first speaker unit 120 has a larger size than the second speaker unit 140 and is characterized by its relatively better bass performance, while the second speaker unit 140 has a smaller size and relatively better high-frequency performance. By incorporating both the first speaker unit 120 and the second speaker unit 140, the headphones 100 are able to produce a more balanced and high-fidelity sound across its entire frequency range. In one or more other embodiments, the first speaker unit and the second speaker unit can be of other types, as long as the first speaker unit provides relatively good bass performance and the second speaker unit provides relatively good high-frequency performance.
[0027] Additionally, the headphones 100 also include a feedback (FB) microphone 160. The microphone 160 is configured to capture sound within the headphones 100, which may include ambient noise and audio output from the speaker units. A controller or processor (not shown) of the headphones 100 is configured to receive and process the audio signal captured by the microphone 160 to generate an anti-noise signal that is inversely related to the ambient noise. This anti-noise signal is then emitted through the speaker units of the headphones 100, effectively canceling out ambient noise and achieving active noise cancellation (ANC). ANC technology is known in the art, and its detailed description is omitted. The headphones 100 may also include a support 152 for holding a second speaker unit 140 in place, and a sealing gasket 156 having an opening 156a.
[0028] Figure 2A A cross-sectional view of the headphones 100 is shown. Figure 2B yes Figure 2A An enlarged view of the dashed portion 2B. In the illustrated embodiment, the earphone 100 is a TWS earphone and includes an ear tip 104 that, when worn by a user, is at least partially inserted into the user's ear canal. For ease of discussion, the direction in which the ear tip 104 faces is referred to as the forward direction, which is... Figures 2A to 2B The direction indicated by the forward arrow is also the direction from which sound is emitted from the headphones 100 through the ear tips 104. The terms "in front of" and / or "behind" as used herein are relative to the direction indicated by the forward arrow.
[0029] As shown in the figure, the front housing portion 112 has a protruding portion that serves as the housing portion of the earbud cover 104. The front housing portion 112 and the rear housing portion 114 mate together to form the housing of the earphone 100, thereby enclosing or defining a space for housing the electronic components of the earphone. The electronic components housed within the housing of the earphone 100 include a battery 190, a PCB 192, a first speaker unit 120, a second speaker unit 140, and a microphone 160. The battery 190 and PCB 192 are mounted to the rear housing portion 114, located away from the sound output port 172 of the earbud cover 104. Simultaneously, the first speaker unit 120, the second speaker unit 140, and the microphone 160 are mounted to the front housing portion 112, located near the sound output port 172 of the earbud cover 104. This arrangement facilitates the transmission of sound generated by the first speaker unit 120 and / or the second speaker unit 140 into the wearer's ear canal and the capture of sound near or within the wearer's ear canal.
[0030] A protruding portion of the front housing 112 provides a sound channel 170 leading to a sound output port 172. A first speaker unit 120 and a second speaker unit 140 are arranged such that both speaker units 120 and 140 face the sound output port 172, thereby allowing the generated sound to be directed towards the sound output port 172. Relative to the direction indicated by the forward arrow, the second speaker unit 140 is positioned in front of the first speaker unit 120, closer to the sound output port 172, while the first speaker unit 120 is positioned further away from the sound output port 172. Given that the first speaker unit 120 has a larger size and provides relatively better bass performance, while the second speaker unit 140 has a smaller size and provides relatively better high-frequency performance, this arrangement effectively utilizes the relatively narrow and limited space near the earbud cover 104 while achieving balanced and high-fidelity sound output.
[0031] As shown in the figure, microphone 160 is located inside earbud cover 104. The second speaker unit 140 is located behind microphone 160, with the first speaker unit 120 further behind it. The space inside earbud cover 104 is narrow, while the space behind earbud cover 104 gradually widens with distance from earbud cover 104. By placing the smallest microphone 160 inside the narrow earbud cover 104 and sequentially arranging the second speaker unit 140 and the first speaker unit 120 in the gradually widening space behind earbud cover 104, the limited space at or near earbud cover 104 of the headset 100 can be fully utilized.
[0032] Additionally, by placing the microphone 160 inside the earbud cover 104 adjacent to the sound output port 172, the microphone 160 is close to the wearer's eardrum, effectively capturing sound near the wearer's eardrum. This placement is beneficial for achieving optimal ANC performance.
[0033] Additionally, the earphone 100 includes a second sound channel 180 formed within the earbud cover 104. In the illustrated embodiment, the second sound channel 180 is formed or defined by an integral structure or wall portion 182 of the front housing portion 112. In one or more other embodiments, the second sound channel 180 may be formed or defined by a separate structure or wall portion attached to the front housing portion 112. The second sound channel 180 extends from the acoustic port 144 of the second speaker unit 140 ( Figure 3(As shown) extends to the sound output port 172. This second sound channel 180 effectively directs the sound generated by the second speaker unit 140 to the sound output port 172. This ensures that the high-frequency sound generated by the second speaker unit 140 is effectively transmitted to the sound output port 172 and then into the wearer's ear canal. Furthermore, the headphones 100 include a sealing gasket 156 located or sealed between the second speaker unit 140 and the second sound channel 180. The opening 156a of the sealing gasket 156 is aligned with the acoustic port 144 of the second speaker unit 140 and the second sound channel 180. The sealing gasket 156 effectively prevents sound leakage from the area between the second speaker unit 140 and the second sound channel, thereby allowing the high-frequency sound from the second speaker unit 140 to be effectively directed to the sound output port 172 and into the wearer's ear canal. The arrangement of the sealing gasket 156 further enhances the audio performance of the headphones 100. In one or more embodiments, the sealing gasket 156 is formed of an elastomeric material, such as ethylene vinyl acetate (EVA).
[0034] Figures 1A to 1B and Figures 2A to 2B The embodiments shown are illustrative only and not limiting. In one or more other embodiments, the headphones of this disclosure may have different structures or configurations. For example, the microphone, the first speaker unit, and the second speaker unit may have different structures or shapes, and their positions may differ. Figures 2A to 2B The locations shown differ. In some other embodiments, the second audio channel 180 may be omitted, and the first speaker unit 120 and the second speaker unit 140 may share the audio channel 170. In some other embodiments, the headphones of this disclosure may not include a microphone in or near the earpiece. In some other embodiments, both the microphone 160 and the second audio channel 180 may be omitted.
[0035] Figure 3 A perspective view of the second loudspeaker unit 140 is shown. The second loudspeaker unit 140 is a balanced armature (BA) unit, including a loudspeaker body 142 and an acoustic port 144. During operation, the sound generated by the second loudspeaker unit 140 is emitted from the second loudspeaker unit 140 through the acoustic port 144. Figures 2A to 2B In the earphone 100 shown, the sound generated by the second speaker unit 140 is guided through the acoustic port 144, through the second sound channel 180 to the sound output port 172, and then enters the wearer's ear canal.
[0036] Figure 4A perspective view of headphones 100 is shown, oriented with the sound output port 172 facing the viewer / reader. As shown, microphone 160, sound channel 170, and second sound channel 180 are compactly positioned within the area of sound output port 172. Because microphone 160, sound channel 170, and second sound channel 180 are all positioned near sound output port 172, this arrangement allows microphone 160 to effectively pick up sound near the wearer's eardrum at the headphone wearing position, while sound channels 170 and second sound channel 180 effectively direct audio from speaker units 120, 140 to the vicinity of the wearer's eardrum. This configuration not only enhances the headphones' ANC performance but also ensures balanced and high-fidelity audio performance.
[0037] In such Figures 1A to 2B In the illustrated headphone design, the first speaker unit 120 is positioned behind the second speaker unit 140. Compared to conventional headphones that include a single speaker unit, the first speaker unit 120 of the headphones 100 is positioned relatively far from the sound output port 172, resulting in a relatively low frequency response of the first speaker unit 120 at high frequencies. Experiments show that at high frequencies (such as frequencies above 6 kHz), the frequency response provided by the first speaker unit 120 of the headphones 100 is approximately 10 dB lower than that of conventional headphones that include a single speaker unit. In one or more embodiments of this disclosure, the headphones 100 are ANC headphones, and the ANC signal is provided only to the first speaker unit 120 and not to the second speaker unit 140. Because the first speaker unit 120 of the headphones 100 provides a relatively low frequency response at high frequencies above 6 kHz, the headphones 100 effectively reduce high-frequency overshoot in the ANC mode of the headphones 100. Additionally, background noise is also reduced at the same level of noise reduction intensity. Therefore, by effectively reducing high-frequency overshoot and lowering background noise at the same noise reduction level, the Headphone 100 significantly improves ANC performance and sound quality, demonstrating a remarkable improvement in ANC technology.
[0038] Figure 5 The present disclosure illustrates headphones according to one or more embodiments. Figure 5 (shown in solid lines) and headphones according to the comparative embodiment ( Figure 5 The frequency response curve is shown as a dashed line in the figure. The headphones of the present invention have the following characteristics: Figures 1A to 2BThe illustrated structure or configuration features dual speaker units, while the headphones of the comparative embodiment include a single speaker unit. The figure demonstrates that the subject of the invention provides a more balanced audio output across its entire frequency spectrum. Notably, at high frequencies around 10 kHz, the audio output provided by the subject of the invention is greater than 10 dB higher than that of the comparative embodiment, indicating a significant improvement in sound quality at high frequencies.
[0039] According to one or more embodiments of this disclosure, this disclosure may be implemented as follows.
[0040] Item 1: An earphone, comprising: a housing defining a sound output port; a first speaker unit positioned within the housing, facing the sound output port and configured to emit sound towards the sound output port; and a second speaker unit positioned within the housing, facing the sound output port and configured to emit sound towards the sound output port; wherein the first speaker unit has better bass performance than the second speaker unit, and the second speaker unit is positioned closer to the sound output port than the first speaker unit.
[0041] Project 2: The headphones as described in Project 1, wherein the first speaker unit is a dynamic driver and the second speaker unit is a BA driver, wherein the first speaker unit is located behind the second speaker unit.
[0042] Item 3: The headphones as described in any one of Items 1 to 2 further include a microphone positioned within the housing, the microphone being closer to the second output port than the second speaker unit.
[0043] Item 4: The headphones as described in any one of Items 1 to 3, wherein the microphone is an ANC microphone.
[0044] Item 5: The earphone as described in any one of Items 1 to 4, wherein the earphone is a TWS earphone with an ear tip, and the ear tip defines an audio channel to the audio output port, and the microphone is at least partially located within the ear tip.
[0045] Item 6: The headphones as described in any one of Items 1 to 5, wherein the second speaker unit is located behind the microphone, and the first speaker unit is located further behind the second speaker unit.
[0046] Item 7: Headphones as described in any one of Items 1 to 6, wherein the second speaker unit includes an acoustic port, and the headphones further include a second sound channel extending from the acoustic port to the sound output port for directing sound from the second speaker unit to the sound output port.
[0047] Item 8: The headphones as described in any one of Items 1 to 7, wherein the second sound channel is integrally formed with the housing.
[0048] Item 9: The headphones as described in any one of Items 1 to 8 further include a sealing gasket, the sealing gasket being sealed between the acoustic port of the second speaker unit and the second sound channel.
[0049] Item 10: Headphones as described in any one of Items 1 to 9, wherein the headphones are TWS earbuds with an ANC mode, and the ANC signal of the headphones is provided to the first speaker unit but not to the second speaker unit.
[0050] Item 11: The headphones as described in any one of items 1 to 10, wherein the first speaker unit has a larger size than the second speaker unit.
[0051] Item 12: The headphones as described in any one of Items 1 to 11, wherein the housing includes a first housing portion and a second housing portion that are fitted together, the sound output port is defined by the first housing portion, and the first speaker unit and the second speaker unit are mounted to the first housing portion.
[0052] Systems and methods have been generally described to aid in understanding the details of this disclosure. In some cases, well-known structures, materials, and / or operations have not been specifically shown or described in detail to prevent obscuring aspects of this disclosure. In other cases, specific details have been given to provide a thorough understanding of this disclosure. Those skilled in the art will recognize that this disclosure may be embodied in other specific forms, such as to suit a particular system or device or situation, or material or component, without departing from its spirit or essential characteristics. Therefore, the disclosure and description herein are intended to define the scope of this disclosure and not to limit it. Consequently, this disclosure is not limited except by consideration of the appended claims and their equivalents.
Claims
1. An earphone, comprising: A housing that defines a sound output port; A first speaker unit is located within the housing, facing the sound output port, and configured to emit sound toward the sound output port; A second speaker unit is located within the housing, facing the sound output port, and configured to emit sound toward the sound output port; The first speaker unit has better bass performance than the second speaker unit, and the second speaker unit is positioned closer to the sound output port than the first speaker unit.
2. The headphones of claim 1, wherein the first speaker unit is a dynamic driver and the second speaker unit is a BA driver, wherein the first speaker unit is positioned behind the second speaker unit.
3. The headphones of claim 1, further comprising a microphone positioned within the housing, the microphone being closer to the sound output port than the second speaker unit.
4. The headphones of claim 3, wherein the microphone is an ANC microphone.
5. The earphone of claim 3, wherein the earphone is a TWS earphone with an ear tip, the ear tip defining an audio channel to the audio output port, and the microphone is at least partially located within the ear tip.
6. The headphones of claim 3, wherein the second speaker unit is located behind the microphone, and the first speaker unit is located further behind the second speaker unit.
7. The headphones of claim 1, wherein the second speaker unit includes an acoustic port, and the headphones further include a second sound channel extending from the acoustic port to the sound output port for directing sound from the second speaker unit to the sound output port.
8. The headphones of claim 7, wherein the second sound channel is integrally formed with the housing.
9. The headphones of claim 7, further comprising a sealing gasket, the sealing gasket being sealed between the acoustic port of the second speaker unit and the second sound channel.
10. The earphones as claimed in any one of claims 1 to 9, wherein the earphones are TWS earbuds with an ANC mode, and in the ANC mode of the earphones, the ANC signal is provided only to the first speaker unit and not to the second speaker unit.
11. The headphones as claimed in any one of claims 1 to 9, wherein the first speaker unit has a larger size than the second speaker unit.
12. The headphones of any one of claims 1 to 9, wherein the housing comprises a first housing portion and a second housing portion mating together, wherein the sound output port is defined by the first housing portion, and the first speaker unit and the second speaker unit are mounted to the first housing portion.
