Temperature rise measuring device for electronic equipment

Abstract

The utility model relates to a temperature rise measuring device for electronic equipment. Comprising a non-contact temperature measuring device for detecting heating points on an electronic device to be detected, a contact temperature measuring device for detecting the temperature of all the heating points which are located on the electronic device to be detected and detected by the non-contact temperature measuring device, and a controller connected with the non-contact temperature measuring device and the contact temperature measuring device. The controller performs processing according to detection results of the non-contact temperature measurement device and the contact temperature measurement device to obtain a temperature rise result of the to-be-measured electronic device, so that the temperature rise result of the to-be-measured electronic device is obtained on the basis that the non-contact temperature measurement device accurately detects a heating point of the to-be-measured electronic device. And then the contact type temperature measuring equipment is used for carrying out direct contact detection on all the heating points of the electronic equipment to be measured, so that the temperature detection is more accurate and reliable, and adverse effects of an external environment and an intermediate medium on temperature measurement are avoided.

Description

Technical Field

[0001] The utility model relates to the field of electronic equipment temperature measurement, in particular to an electronic equipment temperature rise measurement device. Background Art

[0002] With the development of science and technology, electronic devices are applied to different and diverse usage scenarios. Due to the diversity of electronic device usage scenarios, electronic devices will also face the challenge of high temperature environment. High temperature will not only have an adverse effect on the performance and life of electronic devices, but may also cause failures and damage. Therefore, in the design and debugging process of electronic equipment, temperature rise test experiments for electronic equipment have become an important step to ensure that electronic equipment can work safely and stably.

[0003] In the temperature rise test experiment, the temperature rise is an indicator of the degree to which the electronic device exceeds the ambient temperature during operation. For example, under standard atmospheric pressure, the ambient temperature is T0 (usually set to 25°C), and the electronic device will produce a current thermal effect after the current is passed through it. As the time for the electronic device to pass the current continues to pass, the temperature on the surface of the electronic device will continue to rise until the temperature stabilizes. Among them, the surface temperature of the electronic device measured after the surface temperature of the electronic device stabilizes is the final temperature of the electronic device. Assuming that the final temperature of the electronic device is T1, then the temperature rise of the electronic device (marked as △T) is the difference between the final temperature T1 and the ambient temperature T0, that is, △T=T1-T0.

[0004] In order to accurately measure the temperature rise value of electronic equipment, the temperature rise measurement method of electronic equipment based on thermistor electronics and the temperature rise measurement method based on infrared thermal imaging are mainly used.

[0005] The temperature rise measurement method of electronic equipment based on thermistors is a contact-type temperature rise measurement method. A thermistor is attached to the surface of the device under test, and the temperature of the device under test is inferred by using the corresponding relationship between the resistance value of the thermistor and the temperature. This temperature rise measurement method has the advantages of low test cost and simple and fast test. It is suitable for scenarios where the temperature rise requirements of electronic equipment are not high, but it also has the disadvantage of large errors in the temperature rise measurement results.

[0006] The temperature rise measurement method based on infrared thermal imaging is a non-contact temperature rise measurement method. It uses an infrared thermal imager to measure the infrared radiation energy on the surface of the device under test, and then obtains the temperature distribution image of the device under test, and finally processes it to obtain the required temperature rise result of the device under test. Due to the different properties of the materials used in different devices under test, materials of different properties have different reflection effects, which makes it difficult to determine the reflectivity of materials of different properties, and the measurement accuracy is easily affected by the reflection of light on the surface of the object. This requires that the surface of the device under test must be perpendicular to the infrared thermal imager. Once there is insufficient space, it is impossible to ensure the vertical relationship between the infrared thermal imager and the surface under test, and it is difficult to accurately measure the temperature rise of the device under test.

[0007] Therefore, the current temperature rise measurement method of electronic equipment based on thermistor electronics and the temperature rise measurement method based on infrared thermal imaging are easily affected by the external environment and intermediate media on the temperature measurement, and cannot ensure the accuracy of the temperature rise measurement results of the electronic equipment. Utility Model Content

[0008] The technical problem to be solved by the utility model is to provide a temperature rise measuring device for electronic equipment which can reduce the influence of external factors to achieve accurate measurement in view of the above-mentioned prior art.

[0009] The technical solution adopted by the utility model to solve the above technical problems is: an electronic equipment temperature rise measuring device, characterized in that it includes:

[0010] Non-contact temperature measurement equipment to detect hot spots on the electronic equipment to be tested;

[0011] The contact temperature measuring device detects the temperature of all the hot spots on the electronic device to be tested and detected by the non-contact temperature measuring device;

[0012] The controller is connected to the non-contact temperature measuring device and the contact temperature measuring device respectively, and processes according to the detection results of the non-contact temperature measuring device and the contact temperature measuring device to obtain the temperature rise result of the electronic device to be tested.

[0013] Improved, in the utility model, the electronic equipment temperature rise measuring device further comprises:

[0014] A measuring device body having a cavity with a top opening;

[0015] A support arm, a first end of which is fixed to the measuring device body, and a second end of which has a fixing clamp for placing the non-contact temperature measuring device;

[0016] The pad is arranged at the bottom of the cavity of the measuring device body and supports the electronic device to be tested so as to form an air circulation channel at the lower side of the electronic device to be tested.

[0017] Furthermore, in the electronic device temperature rise measuring device, the inner wall of the cavity of the measuring device body is a dark inner wall.

[0018] Further improvement, in the electronic device temperature rise measuring device, the controller has a wireless communication module configured to connect to an external control terminal, a WIFI antenna is provided at the second end of the support arm, a RF coaxial line is provided inside the support arm, one end of the RF coaxial line is connected to the WIFI antenna, and the other end of the RF coaxial line is connected to the wireless communication module of the controller.

[0019] As a further improvement, in the electronic equipment temperature rise measuring device, the non-contact temperature measuring device is an infrared thermal imager, and the contact temperature measuring device is a thermocouple.

[0020] Compared with the prior art, the utility model has the advantages that: in the electronic equipment temperature rise measuring device of the utility model, by setting a non-contact temperature measuring device, a contact temperature measuring device and a controller, the non-contact temperature measuring device detects the hot spots on the electronic equipment to be tested, and the contact temperature measuring device performs temperature detection on the hot spots located on the electronic equipment to be tested and detected by the non-contact temperature measuring device, and then the controller performs processing according to the detection results of the non-contact temperature measuring device and the contact temperature measuring device to obtain the temperature rise result of the electronic equipment to be tested, so that on the basis of the non-contact temperature measuring device accurately detecting the hot spots of the electronic equipment to be tested, the contact temperature measuring device is used to perform direct contact detection on all the hot spots of the electronic equipment to be tested, so that the temperature detection is more accurate and reliable, and the adverse effects of the external environment and the intermediate medium on the temperature measurement are avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of a temperature rise measuring device for an electronic device in an embodiment of the utility model;

[0022] Figure 2 The figure is a flow chart of a method for measuring temperature rise of an electronic device in an embodiment of the present utility model. DETAILED DESCRIPTION

[0023] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0024] This embodiment provides an electronic device temperature rise measurement device for testing the temperature rise of electronic devices such as mobile phones or tablet computers. Figure 1As shown, the electronic equipment temperature rise measuring device of this embodiment includes a non-contact temperature measuring device 1, a contact temperature measuring device 2 and a controller 3. The non-contact temperature measuring device 1 is used to detect the hot spots on the electronic equipment X to be tested. For example, the non-contact temperature measuring device 1 uses an infrared thermal imager of model Fluke-TI32. The contact temperature measuring device 2 is used to detect the temperature of the hot spots located on the electronic equipment X to be tested and detected by the non-contact temperature measuring device 1. As needed, the contact temperature measuring device 2 in this embodiment uses a thermocouple. The controller 3 is connected to the non-contact temperature measuring device 1 and the contact temperature measuring device 2 respectively. The controller 3 processes the detection results of the non-contact temperature measuring device 1 and the contact temperature measuring device 2 to obtain the temperature rise result of the electronic equipment X to be tested. The controller 3 here uses a 32-bit microprocessor of model GD32F330CBT6.

[0025] Since the non-contact temperature measurement equipment uses an infrared thermal imager, which is a fully passive receiving instrument that works by receiving the infrared energy radiated from various parts of the target electronic device when it is working and generating heat, and because infrared radiation is an electromagnetic wave, the infrared thermal imager can receive infrared radiation and convert it into temperature, and then mark the converted temperature with different colors and display it on the LCD screen of the infrared thermal imager in the form of a thermal image. Testers can derive the corresponding temperature based on the colors presented by different parts of the target electronic device (e.g., the temperature of the yellow part is higher than that of the red part, and the temperature of the red part is higher than that of the blue part), and the temperature measurement process does not interfere with other precision electronic instruments and equipment.

[0026] In order to better fix the non-contact temperature measuring device and the contact temperature measuring device, the electronic device temperature rise measuring device of this embodiment also includes a measuring device body 4, a support arm 5 and a pad 6. The measuring device body 4 has a cavity 40 with a top opening. For example, the measuring device body 4 adopts a rectangular body ABCDEFGH structure. The first end of the support arm 5 is fixed to the measuring device body 4. The second end of the support arm 5 has a fixed clamp 51 for placing the non-contact temperature measuring device 1. The support arm 5 is L-shaped as a whole. The fixed clamp 51 adopts a plastic clamp to clamp the non-contact temperature measuring device 1. The pad 6 is arranged at the bottom of the cavity 40 of the measuring device body 4 and supports the electronic device X to be tested to form an air circulation channel on the lower side of the electronic device X to be tested. By making the measuring device body 4 have a top opening, the electronic device to be tested can be conveniently placed in its cavity 40.

[0027] It should be noted that, by forming an air circulation channel at the bottom of the electronic device X to be tested, it can be ensured that when the temperature rise test is performed, air flows through the bottom of the electronic device X to be tested by natural convection, which is beneficial to the accuracy of the temperature rise test.

[0028] In order to accurately measure the hot spots on the electronic device to be tested and prevent the reflection of light emitted by the screen of the electronic device to be tested from adversely affecting the stability of the temperature of the electronic device to be tested, in this embodiment, the inner wall of the cavity 40 of the measuring device body 4 is a dark inner wall. For example, the inner wall of the cavity 40 can be set to black.

[0029] In order to satisfy the requirement that the electronic equipment temperature rise measuring device of this embodiment can establish a communication connection with an external control terminal (such as a mobile phone) to realize data intercommunication or control, in the electronic equipment temperature rise measuring device of this embodiment, the controller 3 has a wireless communication module 31 configured to connect to the external control terminal, a WIFI antenna 32 is provided at the second end of the support arm 5, and a radio frequency coaxial line 33 is provided inside the support arm 5, one end of the radio frequency coaxial line 33 is connected to the WIFI antenna 32, and the other end of the radio frequency coaxial line 33 is connected to the wireless communication module 31 of the controller 3. Among them, the WIFI antenna 32 is made of metal material, and is used to connect the APP software of the external control terminal to the wireless communication module 31 of the electronic equipment temperature rise measuring device, so as to realize the temperature rise test process of controlling the electronic equipment temperature rise measuring device by using the external control terminal.

[0030] This embodiment also provides a method for cooling down an electronic device using the above-mentioned electronic device temperature rise measuring device. Specifically, the method for cooling down an electronic device in this embodiment includes the following steps:

[0031] Step 1, detecting the real-time temperature inside the electronic device after it is turned on;

[0032] Step 2, obtaining the actual temperature rise in the electronic device according to the detected real-time temperature and the preset reference temperature; for example, in this embodiment, the detected real-time temperature is marked as T, the preset reference temperature is marked as T0, and the actual temperature rise in the electronic device is marked as ΔT, ΔT=T-T0;

[0033] Step 3: Compare the obtained real-time temperature rise △T with the first preset temperature rise threshold △T th1 and the second preset temperature rise threshold △T th2 Make judgment and handle:

[0034] When the obtained real-time temperature rise △T is greater than the first preset temperature rise threshold and less than the second preset temperature rise threshold, that is, △T th1 <△T<△T th2 , go to step 4; otherwise, go to step 8; wherein the first preset temperature rise threshold is less than the second preset temperature rise threshold, that is, △T th1 <△T th2 ;

[0035] Step 4, obtaining the first duration t1 of the electronic device being in the current actual temperature rise state, and making a judgment based on the first duration:

[0036] When the first duration t1 is greater than the preset duration threshold t0, it indicates that the electronic device has high power consumption and continuously generates a lot of heat, so the charging current and screen backlight brightness of the electronic device are reduced, and the process goes to step 5; otherwise, the process goes to step 1;

[0037] Step 5, detecting the real-time temperature in the electronic device again, and obtaining the actual temperature rise in the electronic device again according to the detected real-time temperature and the preset reference temperature, and then proceeding to step 6; wherein the actual temperature rise in the electronic device obtained again after calculation in step 5 is marked as ΔT';

[0038] Step 6: compare the real-time temperature rise △T' obtained again with the first preset temperature rise threshold △T th1 Make judgment and handle:

[0039] When the real-time temperature rise △T' obtained again is less than the first preset temperature rise threshold △T th1 When the actual temperature rise in the electronic device is normal, it is determined that the actual temperature rise in the electronic device is normal; otherwise, it indicates that the current actual temperature rise in the electronic device is abnormal, and the process goes to step 7;

[0040] Step 7, obtaining the second duration t2 of the electronic device being in the current actual temperature rise state, and making a judgment based on the second duration t2:

[0041] When the second duration t2 is greater than the preset duration threshold t0, it indicates that the electronic device has high power consumption and continuously generates more heat, and the charging current and screen backlight brightness of the electronic device are reduced, and hardware cooling measures are performed on the electronic device; otherwise, the process proceeds to step 5; wherein the hardware cooling measures here are to set heat dissipation materials on at least one structure of the chip, shielding cover and mobile phone back cover of the electronic device;

[0042] Step 8: Compare the obtained real-time temperature rise △T with the second preset temperature rise threshold △T th2 Make judgment and handle:

[0043] When the obtained real-time temperature rise is greater than or equal to the second preset temperature rise threshold, that is, △T>△T th2 If yes, go to step 9; otherwise, go to step 1;

[0044] Step 9, obtaining the third duration t3 of the electronic device being in the current actual temperature rise state, and making a judgment based on the third duration t3:

[0045] When the third duration t3 is longer than the preset duration threshold t0, the CPU power consumption in the electronic device is reduced and the process goes to step 5; otherwise, the process goes to step 1.

[0046] Although the preferred embodiments of the present invention are described in detail above, it should be clearly understood that the present invention may be modified and varied by those skilled in the art. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An electronic equipment temperature rise measuring device, characterized in that: include: A non-contact temperature measuring device (1) detects hot spots on the electronic device (X) to be tested; The contact temperature measuring device (2) performs temperature detection on all the heating points on the electronic device (X) to be tested and detected by the non-contact temperature measuring device (1); The controller (3) is connected to the non-contact temperature measuring device (1) and the contact temperature measuring device (2) respectively, and processes the detection results of the non-contact temperature measuring device (1) and the contact temperature measuring device (2) to obtain the temperature rise result of the electronic device (X) to be tested.

2. The electronic equipment temperature rise measuring device according to claim 1, characterized in that: Also includes: A measuring device body (4) having a cavity (40) with an opening at the top; A support arm (5), a first end of which is fixed to the measuring device body (4), and a second end of which is provided with a fixing clamp (51) for placing the non-contact temperature measuring device (1); A pad (6) is arranged at the bottom of a cavity (40) of a measuring device body (4) and supports the electronic device (X) to be tested, so as to form an air circulation channel on the lower side of the electronic device (X) to be tested.

3. The electronic equipment temperature rise measuring device according to claim 2, characterized in that: The inner wall of the cavity (40) of the measuring device body (4) is a dark inner wall.

4. The electronic equipment temperature rise measuring device according to claim 2, characterized in that: The controller (3) has a wireless communication module (31) configured to be connected to an external control terminal, a WIFI antenna (32) is arranged at the second end of the support arm (5), a radio frequency coaxial line (33) is arranged inside the support arm (5), one end of the radio frequency coaxial line (33) is connected to the WIFI antenna (32), and the other end of the radio frequency coaxial line (33) is connected to the wireless communication module (31) of the controller (3).

5. The electronic equipment temperature rise measuring device according to any one of claims 1 to 4, characterized in that: The non-contact temperature measurement device (1) is an infrared thermal imager, and the contact temperature measurement device (2) is a thermocouple.

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