Gluing device for MESA wafer

Abstract

A gluing device for an MESA wafer is provided with a rack, a glue spraying groove, a vacuum suction cup, a nozzle and a nozzle position adjusting mechanism. A glue spraying groove is embedded in a workbench of the rack; the vacuum chuck is fixed in the glue spraying groove; the nozzle is provided with a liquid collecting cavity and glue spraying holes, the liquid collecting cavity is an inverted frustum-shaped cavity, the glue spraying holes are formed in the circular bottom face of the liquid collecting cavity and distributed in a multi-layer annular mode, and the axial section of each glue spraying hole located in the center of the circular bottom face of the liquid collecting cavity is of an isosceles trapezoid structure. The axial sections of the other glue spraying holes surrounding the center position are all of right trapezoid structures, the right-angle sides of the right trapezoid structures are located on the sides close to the glue spraying holes in the center position, and the bevel edges are located on the sides away from the glue spraying holes in the center position; and the nozzle position adjusting mechanism is assembled with the nozzle and is arranged above the working table of the rack. According to the utility model, the photoresist is uniformly coated on the MESA wafer, and the purposes of ensuring the wafer gluing quality and reducing the wafer breakage rate are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of quartz wafers, in particular to a glue coating device for MESA wafers. Background Art

[0002] MESA wafer is an ultra-high base frequency wafer obtained by local processing on the quartz surface through etching. There is a glue coating process in the MESA wafer production process, the purpose of which is to evenly coat the photoresist on the wafer and ensure that the glue layer reaches the designed thickness.

[0003] In the prior art, the wafer coating process is as follows: the wafer is adsorbed on the suction cup, and a certain amount of photoresist is dripped on the wafer. Then the suction cup drives the wafer to rotate in segments at different speeds and time periods, and the photoresist is made to flow outward and distribute on the wafer by centrifugal force. However, the wafer coating process has the following defects: first, for thin wafers, in order to drive the wafer to rotate synchronously, the wafer needs to be fixed with a larger adsorption force, which may cause the wafer to be damaged; second, for special MESA wafer products, two photolithography processes are required. During the second coating, because the wafer has been etched with grooves, the surface of the wafer is uneven. If the rotating glue leveling method is used, radial lines will appear at the sharp corners of the pattern, causing the problem of uneven glue layer. Utility Model Content

[0004] The utility model provides a glue coating device for a MESA wafer, which aims to uniformly coat photoresist on the wafer through a structure in which the wafer is fixed and the nozzle moves, so as to achieve the purpose of ensuring the quality of wafer coating and reducing the wafer breakage rate.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A glue coating device for MESA wafers is provided with a frame, a glue spraying tank, a vacuum suction cup, a nozzle and a nozzle position adjustment mechanism; the frame is fixed on a horizontal ground, and the glue spraying tank is embedded on a workbench of the frame; the vacuum suction cup is fixed in the glue spraying tank and is connected to a vacuum pump through a vacuum extraction pipeline; the nozzle is provided with a liquid collecting chamber and a glue spraying hole, the liquid collecting chamber is an inverted frustum-shaped cavity, and the glue spraying hole is provided on the circular bottom surface of the liquid collecting chamber, and the glue spraying holes are distributed in a multi-layer ring shape, wherein the axial section of the glue spraying hole located at the center position of the circular bottom surface of the liquid collecting chamber is an isosceles trapezoidal structure, and the axial sections of the other glue spraying holes surrounding the center position are all right-angled trapezoidal structures, wherein the right-angled side is located on the side of the glue spraying hole close to the center position, and the hypotenuse is located on the side of the glue spraying hole away from the center position; the nozzle position adjustment mechanism is equipped with the nozzle and arranged above the workbench of the frame.

[0007] The above-mentioned glue coating device for MESA wafers, the nozzle is also provided with a glue liquid inlet and a high-pressure gas injection port; the glue liquid inlet is arranged on one side of the circular top surface of the liquid collecting cavity, and is connected to the glue liquid supply pipeline; the high-pressure gas injection port is arranged opposite to the glue liquid inlet, and is connected to the high-pressure gas supply pipeline.

[0008] The above-mentioned gluing device for MESA wafers, the nozzle position adjustment mechanism includes a rotating assembly, a lateral moving assembly and a longitudinal moving assembly; the longitudinal moving assembly includes a longitudinal moving motor, a longitudinal lead screw and a longitudinal slider, the longitudinal moving motor is fixed on the frame, the longitudinal moving motor output shaft is fixedly connected to the longitudinal lead screw, and the longitudinal slider and the longitudinal lead screw are assembled to form a longitudinal lead screw nut transmission unit.

[0009] The above-mentioned gluing device for MESA wafers, the lateral movement component includes a lateral movement motor, a lateral lead screw and a lateral slider, the lateral movement motor is fixed on the longitudinal slider, the lateral movement motor output shaft is fixedly connected to the lateral lead screw, the lateral slider and the lateral lead screw are assembled to form a lateral lead screw nut transmission unit, and the lateral lead screw nut transmission unit is a cantilever beam structure.

[0010] The above-mentioned gluing device for MESA wafers, the rotating assembly includes a rotating motor and a rotating shaft, the rotating motor is fixed on the side wall of the horizontal slider and is arranged vertically, the output shaft of the rotating motor is tightly connected to the upper end of the rotating shaft, and the lower end of the rotating shaft is fixedly assembled with the nozzle.

[0011] The above-mentioned gluing device for MESA wafers, the lateral movement assembly also includes a lateral movement guide rod, one end of which is installed on the longitudinal slider through a fixed seat, and the other end passes through the lateral slider in a clearance fit manner and is connected to the free end of the lateral lead screw through a connecting seat.

[0012] The above-mentioned gluing device for MESA wafers, the longitudinal moving component also includes a longitudinal moving guide rail, the longitudinal moving guide rail is fixed on the frame workbench, the bottom surface of the longitudinal slider is equipped with the longitudinal moving guide rail, and the longitudinal slider slides along the longitudinal moving guide rail under the drive of the longitudinal screw nut transmission unit.

[0013] The above-mentioned gluing device for MESA wafers, the vacuum suction cup is provided with a circular disk surface, the diameter of the circular disk surface is smaller than the diameter of the quartz wafer to be glued, and a plurality of layers of annular grooves are provided on the circular disk surface, the annular grooves are connected through radial grooves arranged along the radial direction, and vacuum air holes are provided on the bottom surface of the annular grooves or the radial grooves or the intersection of the annular grooves and the radial grooves, and the vacuum air holes are connected to the vacuum pump through a vacuum pipeline.

[0014] The above-mentioned glue coating device for MESA wafers is also provided with a PLC control system, through which the nozzle position and glue injection pressure are adjusted, and an operation panel of the PLC control system is installed on the frame.

[0015] The utility model provides a glue coating device for MESA wafers, which fixes the quartz wafer by adsorbing it through a vacuum suction cup. Since the vacuum suction cup is not needed to drive the quartz wafer to rotate, the adsorption force of the vacuum suction cup on the quartz wafer can be reduced, thereby reducing the breakage rate of the quartz wafer. The utility model controls the horizontal movement of the nozzle forward, backward, left and right through a nozzle position adjustment mechanism, and controls the spraying amount of the glue on the wafer by adjusting the glue pressure through the injection amount of high-pressure gas, thereby realizing the control of the glue coating thickness. The utility model is particularly suitable for MESA wafers that need to undergo two photolithography processes. By spraying with the nozzle, the problem of uneven glue layer caused by radial lines appearing at the sharp corners of the etched pattern during the second glue coating operation is effectively avoided. In addition, in the structure of the utility model, the glue spraying holes on the circular bottom surface of the nozzle liquid collection chamber are distributed in a multi-layer ring shape, and the axial section of the glue spraying hole located at the center of the circular bottom surface of the liquid collection chamber is designed to be an isosceles trapezoidal structure, and the axial section of the glue spraying hole surrounding the center is designed to be a right-angled trapezoidal structure. Therefore, when the nozzle sprays glue, the spraying surface of the glue spraying hole at the center is distributed in a circular shape, and the spraying surface of the glue spraying hole surrounding the center is distributed in a fan shape, avoiding the cross-spraying of two adjacent groups of glue spraying holes, so that the glue spraying is more uniform. In short, the photoresist is evenly coated on the MESA wafer through the utility model, and the purpose of ensuring the quality of the wafer glue coating and meeting the requirements of the glue layer coating thickness is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure of the utility model;

[0017] Figure 2 It is a schematic diagram of the nozzle structure of the utility model;

[0018] Figure 3 yes Figure 2 The enlarged view of the structure at position Ⅰ in the middle;

[0019] Figure 4 It is a schematic diagram of the nozzle working state;

[0020] Figure 5 yes Figure 2 A top view of

[0021] Figure 6 It is a schematic diagram of the cross-sectional structure of the vacuum suction cup of the utility model;

[0022] Figure 7 yes Figure 6 Top view of the .

[0023] Explanation of the symbols in the figure:

[0024] 1 is a vacuum suction cup, 1-1 is an annular groove, 1-2 is a vacuum air hole, and 1-3 is a radial groove; 2 is a quartz wafer; 3 is a glue spraying groove; 4 is a frame; 5 is a nozzle, 5-1 is a liquid collecting chamber, 5-2 is a glue liquid inlet, 5-3 is a high-pressure gas injection port, 5-4 is a glue spraying hole at the center position, and 5-5 is a glue spraying hole surrounding the center position; 6 is a transverse screw; 7 is a transverse slider; 8 is a rotating motor; 9 is a rotating shaft; 10 is a transverse moving motor; 11 is a longitudinal screw; 12 is a longitudinal slider; 13 is a longitudinal moving guide rail; 14 is an operation panel; 15 is glue; 16 is a longitudinal moving motor; 17 is a vacuum pump; 18 is a transverse moving guide rod; 19 is a fixed seat; 20 is a connecting seat. DETAILED DESCRIPTION

[0025] The utility model is further described below in conjunction with the accompanying drawings and specific embodiments.

[0026] See Figure 1. Figure 5 The utility model provides a glue coating device for MESA wafers, which is provided with a frame 4, a glue spraying tank 3, a vacuum suction cup 1, a nozzle 5, a nozzle position adjustment mechanism and a PLC control system; the frame 4 is fixed on a horizontal ground, and the glue spraying tank 3 is embedded on the workbench of the frame 4; the vacuum suction cup 1 is fixed in the glue spraying tank 3 and is connected to a vacuum pump 17 through a vacuum pipeline; the nozzle position adjustment mechanism is equipped with the nozzle 5 and is arranged above the workbench of the frame 4; the utility model controls the position of the nozzle 5 and the glue injection pressure through the PLC control system, and installs an operation panel 14 of the PLC control system on the frame 4.

[0027] Still referring to Figure 1, Figure 5In the nozzle position adjustment mechanism of the utility model, a rotating component, a lateral movement component and a longitudinal movement component are arranged; the longitudinal movement component comprises a longitudinal movement motor 16, a longitudinal lead screw 11, a longitudinal slider 12 and a longitudinal movement guide rail 13, the longitudinal movement motor 16 is fixed on the frame 4, the output shaft of the longitudinal movement motor 16 is fixedly connected to the longitudinal lead screw 11, the longitudinal slider 12 and the longitudinal lead screw 11 are assembled to form a longitudinal lead screw nut transmission unit, the longitudinal movement guide rail 13 is fixed on the workbench of the frame 4, the bottom surface of the longitudinal slider 12 is assembled with the longitudinal movement guide rail 13, and the longitudinal slider 12 slides along the longitudinal movement guide rail 13 under the drive of the longitudinal lead screw nut transmission unit; the lateral movement component comprises a lateral movement motor 10, a lateral lead screw 6, a lateral slider 7 and a lateral movement guide rod 18, The transverse moving motor 10 is fixed on the longitudinal slider 12, and the output shaft of the transverse moving motor 10 is fixedly connected to the transverse screw 6. The transverse slider 7 and the transverse screw 6 are assembled to form a transverse screw nut transmission unit. The transverse screw nut transmission unit is a cantilever beam structure, one end of which is connected to the output shaft of the output shaft of the transverse moving motor 10, and the other end is a free end. One end of the transverse moving guide rod 18 is installed on the longitudinal slider 12 through a fixed seat 19, and the other end passes through the transverse slider 7 in a clearance fit manner, and is connected to the free end of the transverse screw 6 through a connecting seat 20; the rotating assembly includes a rotating motor 8 and a rotating shaft 9, the rotating motor 8 is fixed on the side wall of the transverse slider 7 and is in a vertical arrangement state, the output shaft of the rotating motor 8 is tightly connected to the upper end of the rotating shaft 9, and the lower end of the rotating shaft 9 is fixedly assembled with the nozzle 5.

[0028] See also Figure 1 , Figure 2 , Figure 3 The glue coating device for MESA wafers described in the utility model, the nozzle 5 is provided with a liquid collecting chamber 5-1 and a glue spraying hole, the liquid collecting chamber 5-1 is an inverted frustum-shaped cavity, and the glue spraying hole is provided on the circular bottom surface of the liquid collecting chamber 5-1, and the glue spraying holes are distributed in a multi-layer ring shape, wherein the axial section of the glue spraying hole 5-4 located at the center position of the circular bottom surface of the liquid collecting chamber is an isosceles trapezoidal structure, and the axial sections of the other glue spraying holes 5-5 surrounding the center position are all right-angled trapezoidal structures, the right-angled sides are located on the side close to the glue spraying hole 5-4 at the center position, and the hypotenuse is located on the side away from the glue spraying hole 5-4 at the center position.

[0029] See also Figure 1 , Figure 5 , Figure 6 , Figure 7The glue coating device for MESA wafers described in the utility model has a vacuum suction cup 1 with a circular disk surface, the diameter of the circular disk surface is slightly smaller than the diameter of the quartz wafer 2 to be glued, and a plurality of layers of annular grooves 1-1 are arranged on the circular disk surface, and the annular grooves 1-1 are connected through radial grooves 1-3 arranged along the radial direction, and vacuum air holes 1-2 are arranged on the bottom surface of the annular groove 1-1 or the radial groove 1-3 or the intersection of the annular groove and the radial groove, and the vacuum air holes 1-2 are connected to the vacuum pump 17 through a vacuum pipeline.

[0030] See also Figure 1 , Figure 4 , Figure 5 The utility model provides a glue coating device for MESA wafers, which fixes the quartz wafer 2 by adsorbing it through a vacuum suction cup 1, and the vacuum suction cup 1 is fixed in a glue spraying groove 3 embedded on the work surface of a frame 4. Because the vacuum suction cup 1 does not need to drive the quartz wafer 2 to rotate, the adsorption force of the vacuum suction cup 1 on the quartz wafer 2 can be reduced, thereby reducing the breakage rate of the quartz wafer 2; during the glue coating operation, the utility model controls the horizontal movement of the nozzle 5 back and forth and left and right through the nozzle position adjustment mechanism, and adjusts the glue pressure by controlling the injection amount of high-pressure gas, so as to control the spraying amount of the glue on the wafer, and realize the control of the glue coating thickness. The utility model is particularly suitable for MESA wafers that need to undergo two photolithography processes. By spraying with a nozzle, the problem of uneven glue layer caused by radial lines appearing at the sharp corners of the etched pattern during the second glue coating operation is effectively avoided. In addition, in the structure of the utility model, the glue spraying holes on the circular bottom surface of the liquid collecting chamber 5-1 of the nozzle are distributed in a multi-layer ring shape, and the axial cross-section of the glue spraying hole 5-4 located at the center of the circular bottom surface of the liquid collecting chamber is designed to be an isosceles trapezoidal structure, and the axial cross-section of the glue spraying hole 5-5 surrounding the center is designed to be a right-angled trapezoidal structure. Therefore, when the nozzle 5 sprays the glue 15, the spraying surface of the glue spraying hole 5-4 at the center is distributed in a circular shape, and the spraying surface of the glue spraying hole 5-5 surrounding the center is distributed in a fan shape, which avoids the cross-spraying of two adjacent groups of glue spraying holes and makes the glue spraying more uniform (as shown in the attached figure). Figure 4 as shown).

Claims

1. A glue coating device for MESA wafer, characterized in that: It is provided with a frame (4), a glue spraying groove (3), a vacuum suction cup (1), a nozzle (5) and a nozzle position adjustment mechanism; the frame (4) is fixed on a horizontal ground, and the glue spraying groove (3) is embedded on a workbench of the frame (4); the vacuum suction cup (1) is fixed in the glue spraying groove (3) and is connected to a vacuum pump (17) through a vacuum extraction pipeline; the nozzle (5) is provided with a liquid collecting chamber (5-1) and a glue spraying hole, and the liquid collecting chamber (5-1) is an inverted frustum-shaped cavity, and a circular portion of the liquid collecting chamber (5-1) is provided with a liquid collecting chamber (5-1) and a glue spraying hole. The bottom surface is provided with glue spray holes, which are distributed in a multi-layered ring shape, wherein the axial cross-section of the glue spray hole (5-4) located at the center of the circular bottom surface of the liquid collecting cavity is an isosceles trapezoidal structure, and the axial cross-sections of the other glue spray holes (5-5) surrounding the center are all right-angled trapezoidal structures, with the right-angled sides located on the side close to the glue spray hole (5-4) at the center, and the hypotenuses located on the side away from the glue spray hole (5-4) at the center; the nozzle position adjustment mechanism is assembled with the nozzle (5) and arranged above the workbench of the frame (4).

2. The gluing device for MESA wafer according to claim 1, characterized in that: The nozzle (5) is also provided with a glue liquid inlet (5-2) and a high-pressure gas injection port (5-3); the glue liquid inlet (5-2) is arranged on one side of the circular top surface of the liquid collecting chamber (5-1) and is connected to the glue liquid supply pipeline; the high-pressure gas injection port (5-3) is arranged opposite to the glue liquid inlet (5-2) and is connected to the high-pressure gas supply pipeline.

3. The gluing device for MESA wafer according to claim 1 or 2, characterized in that: The nozzle position adjustment mechanism comprises a rotating assembly, a lateral movement assembly and a longitudinal movement assembly; the longitudinal movement assembly comprises a longitudinal movement motor (16), a longitudinal lead screw (11) and a longitudinal slider (12); the longitudinal movement motor (16) is fixed on a frame (4); an output shaft of the longitudinal movement motor (16) is fixedly connected to the longitudinal lead screw (11); the longitudinal slider (12) and the longitudinal lead screw (11) are assembled to form a longitudinal lead screw nut transmission unit.

4. The gluing device for MESA wafer according to claim 3, characterized in that: The transverse movement assembly comprises a transverse movement motor (10), a transverse lead screw (6) and a transverse slider (7); the transverse movement motor (10) is fixed on the longitudinal slider (12); the output shaft of the transverse movement motor (10) is fixedly connected to the transverse lead screw (6); the transverse slider (7) and the transverse lead screw (6) are assembled to form a transverse lead screw nut transmission unit; and the transverse lead screw nut transmission unit is a cantilever beam structure.

5. The gluing device for MESA wafer according to claim 4, characterized in that: The rotating assembly comprises a rotating motor (8) and a rotating shaft (9); the rotating motor (8) is fixed to the side wall of the transverse slider (7) and is arranged vertically; the output shaft of the rotating motor (8) is tightly connected to the upper end of the rotating shaft (9); and the lower end of the rotating shaft (9) is fixedly assembled with the nozzle (5).

6. The gluing device for MESA wafer according to claim 5, characterized in that: The transverse movement assembly further comprises a transverse movement guide rod (18), one end of which is mounted on the longitudinal slider (12) via a fixing seat (19), and the other end of which passes through the transverse slider (7) in a clearance fit manner and is connected to the free end of the transverse lead screw (6) via a connecting seat (20).

7. The gluing device for MESA wafer according to claim 5, characterized in that: The longitudinal moving assembly further comprises a longitudinal moving guide rail (13), wherein the longitudinal moving guide rail (13) is fixed on a workbench of the frame (4), the bottom surface of the longitudinal slider (12) is fitted with the longitudinal moving guide rail (13), and the longitudinal slider (12) slides along the longitudinal moving guide rail (13) when driven by the longitudinal screw nut transmission unit.

8. The glue coating device for MESA wafer according to claim 5, characterized in that: The vacuum suction cup (1) is provided with a circular disk surface, the diameter of the circular disk surface is smaller than the diameter of the quartz wafer (2) to be coated with glue, and a plurality of layers of annular grooves (1-1) are provided on the circular disk surface, the annular grooves (1-1) are connected through radial grooves (1-3) arranged along the radial direction, and vacuum air holes (1-2) are provided on the bottom surface of the annular groove (1-1) or the radial grooves (1-3) or the intersection of the annular groove and the radial grooves, and the vacuum air holes (1-2) are connected to a vacuum pump (17) through a vacuum pipeline.

9. The gluing device for MESA wafer according to claim 5, characterized in that: It is also provided with a PLC control system, through which the nozzle position and the glue liquid injection pressure are controlled, and an operation panel (14) of the PLC control system is installed on the frame (4).

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