Display module capable of avoiding aperture change of hot melt adhesive
By setting a shielding layer on the array substrate of the mobile phone display module and using the first hot melt adhesive for bonding, the problem of inner diameter changes caused by the increase in the viscosity of the hot melt adhesive is solved, and manufacturing efficiency and bonding stability are improved.
CN222189639UActive Publication Date: 2024-12-17XINLI OPTICAL RENSHOU CO LTD
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Patent Information
- Application Number
- CN202420261641.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-01
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2034-02-01
AI Technical Summary
Technical Problem
In mobile phone display modules, the increase in viscosity of hot melt adhesive causes changes in the inner diameter of the rubber ring, affecting the bonding effect and manufacturing efficiency.
Method used
A shielding layer is provided on the array substrate and bonded with a first hot melt adhesive. The tail end is arranged on the shielding layer. The head end contacts the side of the array substrate to ensure that the hot melt adhesive falls into the shielding layer and avoids changes in the inner diameter.
Benefits of technology
It reduces the trouble of repeated adjustment of the machine, avoids changes in the pore size of the hot melt adhesive, improves manufacturing efficiency, and ensures the stability of the bonding effect.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN222189639U_ABST
Abstract
The utility model discloses a display module avoiding hot melt adhesive aperture change, which comprises a cover plate, OCA optical cement, an upper polaroid, a color film substrate, an array substrate and a lower polaroid, the array substrate is provided with a shielding layer, first hot melt adhesive is arranged between the shielding layer of the array substrate and the array substrate, and second hot melt adhesive is arranged between the shielding layer of the array substrate and the lower polaroid. The tail end of the first hot melt adhesive is arranged on the array substrate shielding layer, and the head end of the first hot melt adhesive makes contact with the side face of the array substrate. The array substrate shielding layer is arranged on the array substrate, the first hot melt adhesive is used for bonding, the tail end of the first hot melt adhesive is arranged on the shielding layer, the head end of the first hot melt adhesive is arranged on the side face of the array substrate, the first hot melt adhesive can fall into the shielding layer no matter the first hot melt adhesive is flowing or reduced, and the inner diameter of the shielding layer is stable; therefore, the trouble of repeatedly adjusting the machine is reduced, the machine does not need to check the inner diameter every time the hot melt adhesive is dispensed, and the change of the hole diameter of the hot melt adhesive is avoided.
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