Radio frequency device, radio frequency system, radar and electronic equipment

Abstract

Provided are a radio frequency device, a radio frequency system, a radar and an electronic device, the radio frequency device comprises a chip packaging body, an integrated circuit bare chip is arranged in the chip packaging body, and the chip packaging body is provided with a first surface and a second surface which are oppositely arranged; wherein the first surface and the second surface are both provided with a plurality of salient points, at least one radiation structure is arranged on the first surface or the second surface, and the radiation structure is connected with the integrated circuit bare chip and used for transmitting or receiving radio frequency signals.

Description

Technical Field

[0001] The present application relates to the semiconductor field, and in particular to a radio frequency device, a radio frequency system, a radar and an electronic device. Background Art

[0002] At present, the RF connection usage modes supported by the chip include: using welding to connect the RF part of the chip to an external antenna, directly using the package antenna to radiate, or using a radiator to connect the chip to an external waveguide antenna, etc. However, currently a chip can only support one RF connection usage mode, which greatly limits its application. Summary of the invention

[0003] An embodiment of the present disclosure provides a radio frequency device, including a chip package, wherein an integrated circuit bare die is arranged in the chip package, the chip package has a first surface and a second surface arranged opposite to each other, wherein the first surface and the second surface are both provided with a plurality of bumps, and at least one radiation structure is arranged on the first surface or the second surface, and the radiation structure is connected to the integrated circuit bare die for transmitting or receiving radio frequency signals.

[0004] Exemplarily, the plurality of protrusions on the first surface or the second surface at least include a plurality of first protrusions arranged around the radiation structure, and the plurality of first protrusions are arranged around the radiation structure to form a first waveguide channel.

[0005] Exemplarily, the plurality of bumps on the first surface and the second surface each include at least a plurality of second bumps, and the second bumps are connected to the integrated circuit die for signal transmission.

[0006] Exemplarily, the radiation structure is a radiation patch.

[0007] Exemplarily, the bump is a solder ball.

[0008] An embodiment of the present disclosure further provides a radio frequency system, including a PCB board and a radio frequency device arranged on the PCB board, wherein the radio frequency device is the radio frequency device as described in any embodiment of the present disclosure.

[0009] Exemplarily, the chip package is connected to the PCB board via bumps on the first surface or the second surface, and at least one second waveguide channel is provided on the PCB board, and an input waveguide port of the second waveguide channel is arranged opposite to the radiation structure.

[0010] Exemplarily, the plurality of protrusions on the first surface or the second surface include at least a plurality of first protrusions, and the plurality of first protrusions are arranged around an input waveguide port of the second waveguide channel to form a first waveguide channel.

[0011] Exemplarily, the plurality of bumps on the first surface include at least a plurality of second bumps, the second bumps on the first surface are electrically connected to the PCB board, and the RF device is connected to electrical components on the PCB board through the second bumps.

[0012] Exemplarily, the RF system also includes a waveguide fan-out structure, which is arranged on a side of the PCB board away from the chip package, and the waveguide fan-out structure includes at least one third waveguide channel; the input waveguide port of the third waveguide channel is arranged opposite to the output waveguide port of the second waveguide channel for signal transmission.

[0013] Exemplarily, the chip package is connected to the PCB board via bumps on the first surface or the second surface, and the radiation structure is arranged on a side facing away from the PCB board and used as an antenna.

[0014] Exemplarily, the plurality of bumps on the second surface include at least a plurality of second bumps, and the radio frequency device is connected to electrical components on the PCB board via the second bumps.

[0015] Exemplarily, the radio frequency device also includes a waveguide fan-out structure, which is arranged on a side of the chip package away from the PCB board, the chip package is connected to the waveguide fan-out structure through the bumps on the first surface, and the waveguide fan-out structure includes at least one third waveguide channel; the input waveguide port of the third waveguide channel is arranged opposite to the radiation structure.

[0016] Exemplarily, the radio frequency device further includes an auxiliary PCB board, the chip package is connected to the auxiliary PCB board via bumps on the first surface, and the waveguide fan-out structure is arranged on a side of the auxiliary PCB board away from the chip package;

[0017] The auxiliary PCB board includes at least one fourth waveguide channel, an input waveguide port of the fourth waveguide channel is arranged opposite to the radiation structure, and the third waveguide channel is connected to the fourth waveguide channel.

[0018] An embodiment of the present disclosure also provides a radar, comprising a radio frequency system as described in any embodiment of the present disclosure.

[0019] An embodiment of the present disclosure also provides an electronic device, comprising a radar as described in any embodiment of the present disclosure.

[0020] The RF device, RF system, radar and electronic equipment of the embodiments of the present disclosure can enable the chip to support multiple RF connection usage modes by providing multiple bumps on the first surface and the second surface of the chip package, thereby expanding the application scenarios of the chip. For example, in low-cost or miniaturized usage scenarios, signals can be radiated externally in the form of a packaged antenna (AiP); in the usage scenario of an external antenna system, the chip and an external waveguide antenna can be connected in the form of a radiator.

[0021] Other features and advantages of the present disclosure will be described in the following description, and partly become apparent from the description, or be understood by implementing the present disclosure. Other advantages of the present disclosure can be realized and obtained by the schemes described in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings are used to provide an understanding of the technical solution of the present disclosure and constitute a part of the specification. Together with the embodiments of the present disclosure, they are used to explain the technical solution of the present disclosure and do not constitute a limitation on the technical solution of the present disclosure.

[0023] Figure 1 It is a structural schematic diagram of a radio frequency device of an exemplary embodiment of the present disclosure;

[0024] Figures 2 to 6 Schematic diagrams of the structures of five radio frequency systems according to exemplary embodiments of the present disclosure. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the present disclosure more clear, the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. It should be noted that the embodiments and features in the embodiments of the present disclosure can be combined with each other arbitrarily without conflict.

[0026] Unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the embodiments of the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprising" and similar words mean that the elements or objects before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0027] like Figure 1As shown, an embodiment of the present disclosure provides a radio frequency device, including a chip package 10, in which an integrated circuit bare chip (not shown in the figure) is arranged, the chip package 10 has a first surface 101 and a second surface 102 arranged opposite to each other, the first surface 101 and the second surface 102 are both provided with a plurality of bumps 30, at least one radiation structure 20 is arranged on the first surface 101 or the second surface 102, and the radiation structure 20 is connected to the integrated circuit bare chip for transmitting or receiving radio frequency signals.

[0028] In the disclosed embodiment, the bumps 30 are distributed on both sides of the chip package 10. When the chip package 10 is connected to a printed circuit board (PCB), the bumps 30 on any side can be used to connect the chip package 10 to the PCB.

[0029] The RF device of the embodiment of the present disclosure can enable the chip to support multiple RF connection usage modes by providing multiple bumps 30 on the first surface 101 and the second surface 102 of the chip package 10, thereby expanding the application scenarios of the chip. For example, in low-cost or miniaturized usage scenarios, signals can be radiated externally in the form of a packaged antenna (AiP); in the usage scenario of an external antenna system, the chip and an external waveguide antenna can be connected in the form of a radiator.

[0030] In some exemplary embodiments, the plurality of protrusions 30 on the first surface 101 or the second surface 102 includes at least a plurality of first protrusions 301 arranged around the radiation structure 20 , and the plurality of first protrusions 301 are arranged around the radiation structure 20 to form a first waveguide channel 3011 .

[0031] In the embodiment of the present disclosure, the radiation structure 20 is used to radiate radio frequency signals. The radiation structure 20 is connected to the integrated circuit bare chip arranged in the chip package body 10 through a signal line (not shown in the figure). By arranging a plurality of first bumps 301 around the radiation structure 20, one or more first waveguide channels 3011 are formed on the radiation side of the radiation structure 20. When the radio frequency device is externally connected to other waveguide antennas, the first waveguide channel 3011 can be connected to the waveguide channel in the waveguide antenna.

[0032] In the embodiment of the present disclosure, the radiation structure 20 can be prepared by a metal material arranged on the first surface 101 or the second surface 102 of the chip package 10, or by a metal layer located on the first surface 101 or the second surface 102 side of the chip package 10.

[0033] In the embodiment of the present disclosure, the radiation structure 20 may be a patch antenna structure, or may be any other form of radiation structure, which is not limited in the embodiment of the present disclosure.

[0034] In the embodiment of the present disclosure, the shape of the patch antenna structure may be a rectangle, or any other pattern shape, and the embodiment of the present disclosure is not limited to this.

[0035] In the embodiment of the present disclosure, the size and number of the radiation structure 20 can be set as needed, and the embodiment of the present disclosure does not limit this.

[0036] In the embodiment of the present disclosure, the distance between the radiation structure 20 and the adjacent first protrusion 301 can be set as needed, and the embodiment of the present disclosure is not limited to this.

[0037] In some exemplary embodiments, the bump 30 may be a metal solder ball. However, the present disclosure is not limited to this. In the present disclosure, the bump 30 may be in any shape such as a spherical shape, a columnar shape, or a block shape.

[0038] In the disclosed embodiment, the material of the bump 30 can be gold, copper, copper-nickel-gold, tin, etc.

[0039] In some exemplary embodiments, the plurality of bumps 30 on the first surface 101 and the second surface 102 each include at least a plurality of second bumps (not shown in the figure), and the second bumps are connected to the integrated circuit die for signal transmission.

[0040] In the disclosed embodiment, among the bumps 30 on the first surface 101 and the second surface 102, a portion of the bumps 30 is only used to connect (such as using welding) the chip package and the PCB board (not used to form a waveguide channel or connect with the integrated circuit bare chip); another portion of the bumps 30 (i.e., the first bumps 301) is used to form a waveguide channel around the radiation structure while connecting the chip package and the PCB board; and another portion of the bumps 30 (i.e., the second bumps) is used to achieve electrical connection between the integrated circuit bare chip and the PCB board while connecting the chip package and the PCB board, thereby achieving connection between the chip and other electrical devices on the PCB board.

[0041] like Figures 2 to 6 As shown, the embodiment of the present disclosure also provides a radio frequency system, including a PCB board 40 and a chip package 10 arranged on the PCB board 40, an integrated circuit bare chip (not shown in the figure) is arranged in the chip package 10, the chip package 10 has a first surface 101 and a second surface 102 arranged opposite to each other, the first surface 101 and the second surface 102 are both provided with a plurality of bumps 30, at least one radiation structure 20 is arranged on the first surface 101 or the second surface 102, the radiation structure 20 is connected to the integrated circuit bare chip, and is used to transmit or receive radio frequency signals.

[0042] The radio frequency system of the embodiment of the present disclosure can connect the PCB board 40 and the chip package 10 through multiple bumps 30 on the first surface 101 of the chip package 10, and can also connect the PCB board 40 and the chip package 10 through multiple bumps 30 on the second surface 102 of the chip package 10, so that the chip can support multiple radio frequency connection usage modes. For example, in low-cost or miniaturized usage scenarios, signals can be radiated externally in the form of a packaged antenna (AiP); in the usage scenario of an external antenna system, the chip and an external waveguide antenna can be connected in the form of a radiator.

[0043] In some exemplary embodiments, the plurality of bumps on the first surface 101 and the second surface 102 each include at least a plurality of second bumps 302 , and the second bumps 302 are respectively connected to the PCB board 40 and the integrated circuit bare chip for signal transmission.

[0044] In the disclosed embodiment, the bumps 30 on the first surface 101 and the second surface 102 may include some second bumps 302 for transmitting signals. The second bumps 302 are electrically connected to the integrated circuit die and the PCB board 40 in the chip package 10 for signal transmission.

[0045] In some exemplary embodiments, Figure 2 As shown, the chip package 10 is connected to the PCB board 40 through the bumps 30 on the first surface 101 . At least one second waveguide channel 50 is arranged on the PCB board 40 . The input waveguide port 501 of the second waveguide channel 50 is arranged opposite to the radiation structure 20 .

[0046] In some exemplary embodiments, the plurality of protrusions on the first surface 101 or the second surface 102 include at least a plurality of first protrusions 301 , and the plurality of first protrusions 301 are arranged around the input waveguide port 501 of the second waveguide channel 50 to form a first waveguide channel 3011 .

[0047] The radio frequency system of the embodiment of the present disclosure connects the chip package 10 and the PCB board 40 through the bumps 30 on the first surface 101 of the chip package 10. Figure 2 As shown, a plurality of first bumps 301 are arranged around the radiation structure 20, thereby forming one or more first waveguide channels 3011 on the radiation side of the radiation structure 20, each first waveguide channel 3011 is connected to a corresponding second waveguide channel 50, and the first waveguide channel 3011 can prevent the signal from leaking out from between the chip package 10 and the PCB board 40.

[0048] In some exemplary embodiments, the bumps 30 on the first surface 101 further include at least a plurality of second bumps 302 , and the second bumps 302 are connected to the integrated circuit die for signal transmission.

[0049] In the embodiment of the present disclosure, among the bumps 30 on the first surface 101, a portion of the bumps 30 are only used to connect (such as using welding) the chip package and the PCB board (not used to form a waveguide channel or connect with the integrated circuit bare chip); another portion of the bumps 30 (i.e., the first bumps 301) are used to form a first waveguide channel around the radiation structure while connecting the chip package and the PCB board; and another portion of the bumps 30 (i.e., the second bumps 302) are used to achieve electrical connection between the integrated circuit bare chip and the PCB board while connecting the chip package and the PCB board, thereby achieving connection between the chip and other electrical devices on the PCB board.

[0050] In the embodiment of the present disclosure, the RF system can be connected to an external antenna system to expand the distance and strength of signal transmission. The structure of the external antenna system is not limited to a waveguide antenna. The following is an introduction using the external antenna system as a waveguide antenna as an example.

[0051] In some exemplary embodiments, Figure 3 As shown, the RF system also includes a waveguide fan-out structure 60, which is arranged on a side of the PCB board 40 away from the chip package 10, and the waveguide fan-out structure 60 includes at least one third waveguide channel 70; the input waveguide port 701 of the third waveguide channel 70 is arranged opposite to the output waveguide port 502 of the second waveguide channel 50 for signal transmission.

[0052] In the embodiment of the present disclosure, the waveguide fan-out structure 60 is provided on the side of the PCB board 40 away from the chip package 10, so as to increase the distance and strength of signal transmission. When transmitting a radio frequency signal, the radio frequency signal is emitted from the radiation structure 20, passes through the first waveguide channel 3011, the second waveguide channel 50 and the third waveguide channel 70 in sequence, and then radiates out from the output waveguide port 702 of the third waveguide channel 70.

[0053] It should be noted that in the embodiment of the present disclosure, the radiation structure 20 can also be used to receive radio frequency signals. When receiving radio frequency signals, the radio frequency signals enter from the output waveguide port 702 of the third waveguide channel 70, and pass through the third waveguide channel 70, the second waveguide channel 50 and the first waveguide channel 3011 in sequence before being received by the radiation structure 20.

[0054] In some exemplary embodiments, Figure 3 As shown, an antenna structure 80 may be provided at the output waveguide port 702 of the third waveguide channel 70 to further extend the signal radiation distance. In the embodiment of the present disclosure, the antenna structure 80 may not be provided at the output waveguide port 702 of the third waveguide channel 70.

[0055] In the embodiment of the present disclosure, the antenna structure 80 may be a patch antenna structure or a horn antenna structure, and the present disclosure does not limit this.

[0056] In some exemplary embodiments, Figure 3 As shown, the radiation structure 20 includes multiple, and correspondingly, the second waveguide channels 50 and the third waveguide channels 70 include multiple, respectively, and the number of the radiation structures 20, the number of the second waveguide channels 50, and the number of the third waveguide channels 70 are equal.

[0057] There are at least two third waveguide channels 70 that satisfy: the distance between the output waveguide ports 702 of the two third waveguide channels 70 is greater than the distance between the input waveguide ports 701 of the two third waveguide channels 70. In the embodiment of the present disclosure, by making the distance between the output waveguide ports 702 of the two third waveguide channels 70 greater than the distance between the input waveguide ports 701 of the two third waveguide channels 70, the distance between the antenna structures can be increased and the signal interference between the antenna structures can be reduced.

[0058] In some other exemplary embodiments, Figure 4 As shown, the chip package 10 is connected to the PCB board 40 through the bumps 30 on the first surface 101 or the second surface 102, and the radiation structure 20 is arranged on the side facing away from the PCB board 40 to be used as an antenna. The radio frequency system of the embodiment of the present disclosure can be directly applied in low-cost or miniaturized usage scenarios, and the chip package can radiate signals externally in the form of a packaged antenna (AiP).

[0059] In some exemplary embodiments, the plurality of protrusions 30 on the first surface 101 or the second surface 102 includes at least a plurality of first protrusions 301 , and the plurality of first protrusions 301 are arranged around the input waveguide port of the second waveguide channel 50 to form a first waveguide channel 3011 .

[0060] In some exemplary embodiments, the bumps 30 on the second surface 102 include at least a plurality of second bumps 302 , and the RF device is connected to electrical components on the PCB board 40 (not shown) via the second bumps 302 for signal transmission.

[0061] In the disclosed embodiment, among the bumps 30 on the second surface 102, a portion of the bumps 30 is only used to connect (such as by welding) the chip package and the PCB board (not used to form a waveguide channel or connect with the integrated circuit bare chip); another portion of the bumps 30 (i.e., the second bumps 302) is used to achieve electrical connection between the integrated circuit bare chip and the PCB board while connecting the chip package and the PCB board, thereby achieving connection between the radio frequency device and other electrical components on the PCB board.

[0062] In some exemplary embodiments, Figure 5As shown, the RF system also includes a waveguide fan-out structure 60, which is arranged on a side of the chip package away from the PCB board 40, and the waveguide fan-out structure 60 is connected to the chip package through the bumps 30 on the first surface 101. The waveguide fan-out structure 60 includes at least one third waveguide channel 70; the input waveguide port 701 of the third waveguide channel 70 is arranged opposite to the radiation structure 20.

[0063] In the embodiment of the present disclosure, each third waveguide channel 70 is connected to a corresponding first waveguide channel 3011. By providing the third waveguide channel 70, the distance and strength of signal transmission can be expanded. In addition, by making the distance between the output waveguide ports 702 of two third waveguide channels 70 greater than the distance between the input waveguide ports 701 of the two third waveguide channels 70, the distance between the antenna structures can be increased and the signal interference between the antenna structures can be reduced.

[0064] In some exemplary embodiments, Figure 6 As shown, the radio frequency system further includes an auxiliary PCB board 90, the chip package 10 is connected to the auxiliary PCB board 90 via the bumps on the first surface 101, and the waveguide fan-out structure 60 is arranged on a side of the auxiliary PCB board 90 away from the chip package 10;

[0065] The auxiliary PCB board 90 includes at least one fourth waveguide channel 100 . An input waveguide port 1001 of the fourth waveguide channel 100 is arranged opposite to the radiation structure 20 . The third waveguide channel 70 is connected to the fourth waveguide channel 100 .

[0066] The radio frequency system in the embodiment of the present disclosure includes an auxiliary PCB board 90 and a waveguide fan-out structure 60. The auxiliary PCB board 90 is connected to the chip package through the bumps 30 on the first surface 101. The waveguide fan-out structure 60 is arranged on a side of the auxiliary PCB board 90 away from the chip package. The waveguide fan-out structure 60 includes at least one third waveguide channel 70. The auxiliary PCB board 90 includes at least one fourth waveguide channel 100. The third waveguide channel 70 is connected to the fourth waveguide channel 100. The fourth waveguide channel 100 is connected to the first waveguide channel 3011. The input waveguide port 1001 of the fourth waveguide channel 100 is arranged opposite to the radiation structure 20. The output waveguide port 1002 of the fourth waveguide channel 100 is arranged opposite to the input waveguide port 701 of the third waveguide channel 70.

[0067] The embodiment of the present disclosure can expand the distance and strength of signal transmission by setting a third waveguide channel 70; by setting an auxiliary PCB board 90, the waveguide fan-out structure 60 can be easily installed on the chip package 10, and the signal leakage between the chip package 10 and the waveguide fan-out structure 60 can be reduced.

[0068] In the embodiment of the present disclosure, the auxiliary PCB board 90 may or may not be provided with signal routing and circuit components, and the present disclosure does not impose any limitation on this.

[0069] In the disclosed embodiment, the body of the waveguide fan-out structure 60 (i.e., the portion except the third waveguide channel 70 ) may be made of metal, or may be made of plastic, and a metal layer may be plated around the inner wall of the third waveguide channel 70 .

[0070] In the embodiment of the present disclosure, the third waveguide channel 70 in the waveguide fan-out structure 60 may be an air waveguide, a dielectric waveguide, etc., which is not limited in the embodiment of the present disclosure.

[0071] In the embodiment of the present disclosure, an antenna structure 80 may be provided at the output waveguide port of the third waveguide channel 70, or the antenna structure 80 may not be provided. By providing the antenna structure 80, the transmission distance and strength of the radio frequency signal can be further increased. When the antenna structure 80 is provided, the antenna structure 80 may be a patch antenna structure or a horn antenna structure, and the present disclosure does not limit this.

[0072] An embodiment of the present disclosure also provides a radar, comprising a radio frequency system as described in any embodiment of the present disclosure.

[0073] In the embodiment of the present disclosure, the radar may include a radar chip, a transmitting antenna and a receiving antenna, and the transmitting antenna and the receiving antenna respectively include corresponding radiation structures 20. In some embodiments, the transmitting antenna and the receiving antenna may share one antenna.

[0074] The radar chip transmits a beam through the radiation structure 20 in the transmitting antenna. When the transmitted beam encounters an obstacle, the echo reflected by the obstacle is received by the radiation structure 20 in the receiving antenna and transmitted to the radar chip. The radar chip determines the direction of the target and calculates the relative angle between the direction and the radar.

[0075] In some exemplary embodiments, the radar chip may be a millimeter wave radar chip. The radar chip may include a data processing module, which is used to process the received echo signal to achieve target detection.

[0076] The radar of the disclosed embodiment can support a variety of RF connection usage modes by providing a plurality of bumps on the first surface and the second surface of the chip package, thereby expanding the application scenarios of the chip. For example, in low-cost or miniaturized usage scenarios, the signal can be radiated externally in the form of a packaged antenna (AiP); in the usage scenario of an external antenna system, the chip and an external waveguide antenna can be connected in the form of a radiator.

[0077] An embodiment of the present disclosure also provides an electronic device, comprising a radar as described in any embodiment of the present disclosure.

[0078] Although the embodiments disclosed in the present disclosure are as above, the contents described are only embodiments adopted for facilitating the understanding of the present disclosure and are not intended to limit the present disclosure. Any technician in the field to which the present disclosure belongs can make any modifications and changes in the form and details of implementation without departing from the spirit and scope disclosed in the present disclosure, but the protection scope of the present disclosure shall still be subject to the scope defined by the attached claims.

Claims

1. A radio frequency device, characterized in that: include: A chip package, wherein an integrated circuit bare die is arranged in the chip package, and the chip package has a first surface and a second surface arranged opposite to each other; The first surface and the second surface are both provided with a plurality of bumps, at least one radiation structure is provided on the first surface or the second surface, and the radiation structure is connected to the integrated circuit die for transmitting or receiving radio frequency signals.

2. The radio frequency device according to claim 1, characterized in that: The plurality of protrusions on the first surface or the second surface at least include a plurality of first protrusions arranged around the radiation structure, and the plurality of first protrusions are arranged around the radiation structure to form a first waveguide channel.

3. The radio frequency device according to claim 1 or 2, characterized in that: The plurality of bumps on the first surface and the second surface each include at least a plurality of second bumps, and the second bumps are connected to the integrated circuit bare chip for signal transmission.

4. The radio frequency device according to claim 1, characterized in that: The radiation structure is a radiation patch.

5. The radio frequency device according to claim 1, characterized in that: The bumps are solder balls.

6. A radio frequency system, characterized in that: It comprises a PCB board and a radio frequency device arranged on the PCB board, wherein the radio frequency device is the radio frequency device according to any one of claims 1 to 5.

7. The radio frequency system according to claim 6, characterized in that: The chip package is connected to the PCB board via bumps on the first surface or the second surface. At least one second waveguide channel is provided on the PCB board. An input waveguide port of the second waveguide channel is arranged opposite to the radiation structure.

8. The radio frequency system according to claim 7, characterized in that: The plurality of protrusions on the first surface or the second surface include at least a plurality of first protrusions, and the plurality of first protrusions are arranged around an input waveguide port of the second waveguide channel to form a first waveguide channel.

9. The radio frequency system according to claim 7, characterized in that: The plurality of bumps on the first surface include at least a plurality of second bumps, the second bumps on the first surface are electrically connected to the PCB board, and the radio frequency device is connected to the electrical components on the PCB board through the second bumps.

10. The radio frequency system according to claim 7, characterized in that: It also includes a waveguide fan-out structure, which is arranged on a side of the PCB board away from the chip package, and the waveguide fan-out structure includes at least one third waveguide channel; the input waveguide port of the three waveguide channels is arranged opposite to the output waveguide port of the second waveguide channel to perform signal transmission.

11. The radio frequency system according to claim 6, characterized in that: The chip package is connected to the PCB board via bumps on the first surface or the second surface, and the radiation structure is arranged on a side facing away from the PCB board and used as an antenna.

12. The radio frequency system according to claim 11, characterized in that: The plurality of bumps on the second surface include at least a plurality of second bumps, and the radio frequency device is connected to the electrical components on the PCB board through the second bumps.

13. The radio frequency system according to claim 11, characterized in that: The radio frequency device also includes a waveguide fan-out structure, which is arranged on a side of the chip package away from the PCB board, the chip package is connected to the waveguide fan-out structure through the bumps on the first surface, and the waveguide fan-out structure includes at least one third waveguide channel; the input waveguide port of the third waveguide channel is arranged opposite to the radiation structure.

14. The radio frequency system according to claim 13, characterized in that: The radio frequency device further comprises an auxiliary PCB board, the chip package is connected to the auxiliary PCB board via bumps on the first surface, and the waveguide fan-out structure is arranged on a side of the auxiliary PCB board away from the chip package; The auxiliary PCB board includes at least one fourth waveguide channel, an input waveguide port of the fourth waveguide channel is arranged opposite to the radiation structure, and the third waveguide channel is connected to the fourth waveguide channel.

15. A radar, characterized in that: Comprising a radio frequency system as described in any one of claims 6 to 14.

16. An electronic device, characterized in that: Comprising a radar as claimed in claim 15.

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