Debris removing device

Abstract

A chip removal device relates to the technical field of substrate stripping, and comprises a carrying table used for carrying and fixing a wafer assembly to be stripped; and the blowing device is used for blowing the to-be-stripped wafer assembly carried on the carrying table. According to the technical scheme of the invention, the blowing device is arranged and used for blowing the chippings generated in the stripping process of the to-be-stripped wafer assembly, so that the chippings are prevented from influencing the stripped device structure, and the yield of the stripped device structure is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of substrate stripping, in particular to a debris removing device. Background Art

[0002] During the manufacturing process of light-emitting diodes, after heterogeneously growing an epitaxial layer on a substrate, the substrate needs to be peeled off.

[0003] At present, the main technology for stripping substrates is laser stripping technology. The existing laser stripping technology uses laser to move from the edge of the epitaxial layer to the center of the epitaxial layer to scan the epitaxial layer. However, since the epitaxial layer is bonded to the target substrate (such as the drive backplane) after the substrate is grown, the edges of the epitaxial layer and the substrate are misaligned due to the bonding process, and the edge bonding quality is poor and peeling is prone to occur. During the scanning process, the stress of the edge film layer between the epitaxial layer and the target substrate is quickly released. After the film layer is peeled off, the debris splashes and randomly falls to the surface of the substrate, thereby forming an obstruction, affecting the effect of the laser energy on the epitaxial layer, and making the epitaxial layer after stripping a defective product. In addition, affected by the movement of the carrier on which the epitaxial layer is placed, some of the debris that falls to the vicinity of the carrier has a certain probability of falling onto the surface of the epitaxial layer again, making the epitaxial layer after stripping a defective product. Utility Model Content

[0004] The technical problem solved by the utility model is to provide a debris removal device to improve the yield rate of the device structure after stripping.

[0005] In order to solve the above problems, the technical solution of the utility model provides a debris removal device, including: a carrier for carrying and fixing a wafer assembly to be peeled off; and a purge device for blowing toward the wafer assembly to be peeled off carried on the carrier.

[0006] Compared with the prior art, the technical solution of the utility model has the following advantages:

[0007] In the debris removal device of the technical solution of the utility model, a purging device is provided to purge the debris generated by the wafer assembly to be peeled off during the peeling process, thereby preventing the debris from affecting the device structure after peeling, thereby improving the yield of the device structure after peeling.

[0008] Furthermore, the purging device further comprises: a support assembly connected to the pipeline assembly, which is used to support and fix the pipeline assembly. The pipeline assembly is supported by the support assembly, which facilitates the arrangement and fixation of the pipeline assembly.

[0009] Furthermore, the air outlet pipeline comprises: a plurality of segmented pipes connected in sequence and communicating with the air path, and at least some of the segmented pipes are rotatably connected. The plurality of segmented pipes connected rotatably facilitate the air outlet pipeline to flexibly adjust the blowing direction.

[0010] Furthermore, the purge path of the purge device is: moving from the center of the wafer assembly to be peeled to 1 / 2 of the radius of the wafer assembly to be peeled. Since the purge gas has a certain impact force after being sprayed, the purge path is limited to only from the center of the wafer assembly to be peeled to 1 / 2 of the radius of the wafer assembly to be peeled. From 1 / 2 of the radius of the wafer assembly to be peeled to the edge of the wafer assembly to be peeled, the debris is purged by relying on the impact force of the purge gas, which can effectively reduce the purge path and improve the purge efficiency.

[0011] Furthermore, the purge assembly also includes: a motion assembly fixedly connected to the carrier, used to drive the carrier to move, and the carrier drives the wafer assembly to be peeled to move. The motion assembly includes: a support table fixedly connected to the carrier; a driving member fixedly connected to the support table, used to drive the support table to rotate, so that the support table drives the carrier to rotate. The rotation of the wafer assembly to be peeled is ultimately driven by the motion assembly, so that the purge path only needs to move along a straight line on the surface of the wafer assembly to be peeled, and in the process of the rotation of the wafer assembly to be peeled, all-round purge of the surface of the wafer assembly to be peeled can be achieved.

[0012] Furthermore, the purging device further includes: a collecting component for collecting debris purged from the wafer assembly to be peeled off. The collecting component can collect the debris purged from the surface of the wafer assembly to be peeled off, thereby preventing the debris from being scattered again on the surface of the wafer assembly to be peeled off, thereby improving the device structure yield after peeling.

[0013] Furthermore, the collecting hood has a plurality of dust suction holes, which are connected to the collecting chamber; the collecting assembly also includes: a dust suction device, which is connected to the plurality of dust suction holes by air paths; and / or a dust removal adhesive layer attached to the surface of the side wall of the collecting chamber. The dust suction device can quickly absorb and clean the debris collected in the collecting hood, which can prevent the debris from being scattered again on the surface of the wafer assembly to be stripped, thereby improving the yield of the device structure after stripping. The collected debris is adhered and fixed by the dust removal adhesive layer, which can prevent the debris from being scattered again on the surface of the wafer assembly to be stripped, thereby improving the yield of the device structure after stripping. At the same time, the collected debris can be quickly cleaned by tearing off the dust removal adhesive layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic structural diagram of a debris removal device according to an embodiment of the utility model;

[0015] Figure 2 yes Figure 1 A schematic structural diagram of an embodiment of a purge device of a debris removal device of the illustrated embodiment;

[0016] Figure 3 yes Figure 1A schematic structural diagram of another embodiment of a purge device of the debris removal device of the illustrated embodiment;

[0017] Figure 4 yes Figure 1 A schematic diagram of the structure of a collection assembly of a debris removal device of the illustrated embodiment;

[0018] Figure 5 It is a structural schematic diagram of a debris removal device according to another embodiment of the utility model. DETAILED DESCRIPTION

[0019] As described in the background art, currently during the process of substrate stripping, debris generated will fall onto the epitaxial layer, making the epitaxial layer a defective product.

[0020] On this basis, the utility model provides a debris removal device. By setting up a purging device, the purging device is used to purge the debris generated by the wafer assembly to be peeled off during the peeling process, so as to prevent the debris from affecting the device structure after peeling, thereby improving the yield of the device structure after peeling.

[0021] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the technical scheme in the implementation mode of the utility model will be clearly and completely described below in conjunction with the drawings in the implementation mode of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0022] In the description of the present invention, it should be understood that the terms "upper", "lower", "top surface", "bottom surface" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the positions or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limitations of the present invention. In addition, the terms "first" and "second" are only used to distinguish an entity or operation from another entity or operation, and do not require or imply any actual relationship, order or relative importance between these entities or operations.

[0023] Figure 1 It is a schematic structural diagram of a debris removal device according to an embodiment of the utility model; Figure 2 yes Figure 1 A schematic structural diagram of an embodiment of a purge device of a debris removal device of the illustrated embodiment; Figure 3 yes Figure 1 A schematic structural diagram of another embodiment of a purge device of the debris removal device of the illustrated embodiment; Figure 4 yes Figure 1 A schematic diagram of the structure of a collection assembly of a debris removal device of the illustrated embodiment; Figure 5 It is a structural schematic diagram of a debris removal device according to another embodiment of the utility model.

[0024] Please refer to Figure 1 A debris removal device includes: a carrier 10, used to carry and fix a wafer assembly 20 to be peeled; a purge device 30, arranged above the carrier 10, used to purge gas toward the wafer assembly 20 to be peeled carried on the carrier 10, so that debris generated by the wafer assembly 20 to be peeled during the peeling process can be blown off from the wafer assembly 20 to be peeled.

[0025] By providing a purging device 30, the purging device 30 is used to purge the debris generated during the peeling process of the wafer assembly 20 to be peeled off, so as to prevent the debris from affecting the device structure after peeling, thereby improving the yield of the device structure after peeling.

[0026] Please refer to Figure 2 and Figure 3 In some embodiments, the purge device 30 includes: a gas storage component 301 for storing purge gas; a pipeline component 302 connected to the gas storage component 301 and in gas communication, for conveying the purge gas.

[0027] Please refer to Figure 2 and Figure 3 In some embodiments, the pipeline assembly 302 includes: an air inlet pipeline 3021 connected to the gas storage assembly 301 and communicated with the air circuit, for inputting purge gas; and an air outlet pipeline 3022 connected to the air inlet pipeline 3021 and communicated with the air circuit, for outputting purge gas.

[0028] Please continue to refer to Figure 2 and Figure 3 In some embodiments, the pipeline assembly 302 further includes: a gas nozzle 3023 connected to the gas outlet pipeline 3022 and in communication with the gas path. The nozzle can adjust the flow rate and speed of the purge gas, thereby achieving more accurate purge.

[0029] Please continue to refer to Figure 2 and Figure 3 In some embodiments, the purge device 30 further includes: a support assembly 303 connected to the pipeline assembly 302, used to support and fix the pipeline assembly 302; wherein the support assembly 303 includes: a support rod 3031, and a support head 3032 connected to the support rod 3031; wherein the support head 3032 is at least connected to the gas outlet pipeline 3022 and the gas path is in communication. The pipeline assembly 302 is supported by the support assembly 303, so that the pipeline assembly 302 can be tied and fixed to the support assembly 303 to prevent the pipeline assembly 302 from being tangled, thereby affecting the conduction of the gas path.

[0030] Please continue to refer to Figure 2 In some embodiments, the support head 3032 is also connected to the air inlet pipeline 3021 and the air path is communicated. That is, the support head 3032 is a hollow structure, and the support head 3032 is simultaneously connected to the air inlet pipeline 3021 and the air outlet pipeline 3022 and the air paths are communicated.

[0031] Please continue to refer to Figure 3 In some embodiments, the support head 3032 is connected to the support rod 3031 and the gas circuit is connected; the support rod 3031 is connected to the air inlet pipeline 3021 and the gas circuit is connected. That is, the support rod 3031 and the support head 3032 are both hollow structures, the air inlet pipeline 3021 is connected to the support rod 3031 and the gas circuit is connected, the support rod 3031 is connected to the support head 3032 and the gas circuit is connected, and the support head 3032 is connected to the air outlet pipeline 3022 and the gas circuit is connected.

[0032] Please continue to refer to Figure 2 and Figure 3 In some embodiments, the gas outlet pipeline 3022 includes: a plurality of segmented tubes 3022a connected in sequence and communicating with each other, and at least part of the segmented tubes 3022a are rotatably connected. By rotatably connecting the plurality of segmented tubes 3022a, the gas outlet pipeline 3022 can flexibly adjust the purge direction.

[0033] In a specific embodiment, all the joint tubes 3022a are rotatably connected in sequence, that is, the second section of the joint tube 3022a is rotatably installed on the first section of the joint tube 3022a, the third section of the joint tube 3022a is rotatably installed on the second section of the joint tube 3022a, and the Nth section of the joint tube 3022a is rotatably installed on the (N-1)th section of the joint tube 3022a. Therefore, the air outlet pipeline 3022 can adopt the universal joint bamboo joint tube 3022a available on the market.

[0034] Please continue to refer to Figure 1 In some embodiments, the purge gas is purged from the top of the wafer assembly 20 to be peeled to the surface to be purged of the wafer assembly 20 to be peeled; the purge path S of the purge device 30 is: moving from the center of the wafer assembly 20 to be peeled to 1 / 2 of the radius of the wafer assembly 20 to be peeled. Since the purge gas has a certain impact force after being sprayed, the purge path S is only limited to the center of the wafer assembly 20 to be peeled to 1 / 2 of the radius of the wafer assembly 20 to be peeled. From 1 / 2 of the radius of the wafer assembly 20 to the edge of the wafer assembly 20 to be peeled, the debris is purged by relying on the impact force of the purge gas, which can effectively shorten the purge path S and improve the purge efficiency.

[0035] Please continue to refer to Figure 1In some embodiments, there is a purge angle α between the spray direction of the purge gas and the surface of the wafer assembly 20 to be stripped, and the purge angle α is an acute angle.

[0036] Please refer to Figure 5 In some embodiments, the purge gas and the surface to be purged of the wafer assembly 20 to be stripped are located on the same horizontal plane.

[0037] Please continue to refer to Figure 1 In some embodiments, the purge assembly further includes: a motion assembly 304 fixedly connected to the carrier 10, used to drive the carrier 10 to move, and the carrier 10 drives the wafer assembly 20 to be peeled to move. The motion assembly 304 includes: a support table 3041 fixedly connected to the carrier 10; a driving member (not shown) fixedly connected to the support table 3041, used to drive the support table 3041 to rotate, so that the support table 3041 drives the carrier 10 to rotate. The rotation of the wafer assembly 20 to be peeled is finally driven by the motion assembly 304, so that the purge path S only needs to move along a straight line on the surface of the wafer assembly 20 to be peeled. During the rotation of the wafer assembly 20 to be peeled, the surface of the wafer assembly 20 to be peeled can be purged in all directions.

[0038] In some embodiments, the driving member is a motor, which may be a stepping motor or a servo motor, and can flexibly adjust the rotation speed of the carrier 1010 .

[0039] In some embodiments, the purge path S of the purge device 30 can be implemented by manually operating the air outlet pipeline 3022 .

[0040] In some embodiments, a reciprocating driving assembly (not shown) may be provided to fix the purge device 30 to the driving assembly, and the purge device 30 may be driven to move along the purge path S by the driving assembly.

[0041] In some embodiments, the support platform 3041 may be fixed on a driving assembly (not shown), and the support platform 3041 may be driven by the driving assembly to move relatively along the purge path S.

[0042] In some embodiments, the wafer assembly 20 to be peeled is supported and fixed on the carrier 10 by adsorption. Specifically, the carrier 10 has a plurality of adsorption through holes (not shown), and the gas paths of the plurality of through holes are connected to a negative pressure device (not shown), and the negative pressure device generates a negative pressure environment, thereby ensuring that the wafer assembly 20 to be peeled is adsorbed and supported on the surface of the carrier 10. The negative pressure device can be a vacuum pump device, a vacuum generator device, or other device capable of generating a negative pressure environment.

[0043] Please refer to Figure 4In some embodiments, the purging device 30 further includes: a collecting component 305, which is used to collect the debris purged from the wafer assembly 20 to be peeled. The collecting component 305 can collect the debris purged from the surface of the wafer assembly 20 to be peeled, so as to prevent the debris from being scattered on the surface of the wafer assembly 20 to be peeled again, thereby improving the device structure yield after peeling.

[0044] Please continue to refer to Figure 4 In some embodiments, the collecting assembly 305 includes: a collecting hood 3051 , the collecting hood 3051 having a collecting cavity 3052 ; wherein the carrier 10 passes through the collecting hood 3051 and is located in the collecting cavity 3052 .

[0045] In some embodiments, the collection cover 3051 can be directly mounted on the carrier 10, that is, the diameter of the opening 3053 through which the carrier 10 passes through the collection cover 3051 is equal to or smaller than (slightly smaller than) the diameter of the carrier 10. It should be noted that if the diameter of the opening 3053 through which the carrier 10 passes through the collection cover 3051 is slightly smaller than the diameter of the carrier 10, the material of the collection cover 3051 needs to have a certain deformation range to ensure that the carrier 10 can pass through the opening 3053 of the collection cover 3051.

[0046] In some embodiments, when the carrier 10 passes through the opening 3053 of the collecting cover 3051 which is larger than (slightly larger than) the diameter of the carrier 10 , the collecting cover 3051 can be detachably fixed on the supporting platform 3041 .

[0047] Please continue to refer to Figure 4 In some embodiments, the collection cover 3051 has a plurality of dust suction holes 3054, which are connected to the collection chamber 3052; the collection assembly 305 further includes: a dust suction device (not shown), which is connected to the plurality of dust suction holes 3054 by air path. The dust suction device can quickly absorb and clean the debris collected in the collection cover 3051, thereby preventing the debris from being scattered again on the surface of the wafer assembly 20 to be peeled off, thereby improving the yield rate of the device structure after peeling off.

[0048] It should be noted that, in some embodiments, the vacuum device and the negative pressure device may be the same device.

[0049] Please continue to refer to Figure 4 In some embodiments, a dust removal adhesive layer 3055 is attached to the side wall surface of the collection chamber 3052. The collected debris is adhered and fixed by the dust removal adhesive layer 3055, which can prevent the debris from being scattered again on the surface of the wafer assembly 20 to be peeled off, thereby improving the device structure yield after peeling. At the same time, the collected debris can be quickly cleaned by tearing off the dust removal adhesive layer 3055.

[0050] In some embodiments, if the collecting hood 3051 also has a dust suction hole 3054 , and the dust suction hole 3054 is opened at the bottom of the collecting hood 3051 , the dust removal adhesive layer 3055 can be attached to the side wall surface of the collecting cavity 3052 .

[0051] In some embodiments, if the collecting hood 3051 does not have the dust suction through hole 3054 , the dust removal adhesive layer 3055 can be attached to the side wall surface and the bottom surface of the collecting cavity 3052 .

[0052] In some embodiments, the purge gas may be nitrogen or an inert gas; wherein the purity of the nitrogen is greater than or equal to 99.999%, and the purity of the inert gas is greater than or equal to 99.99%.

[0053] Please continue to refer to Figure 1 In some embodiments, the wafer assembly 20 to be peeled includes: a substrate 201, and an epitaxial layer 202 formed on the substrate 201. When the wafer assembly 20 to be peeled is supported and fixed on the carrier, the epitaxial layer 202 is located between the substrate 201 and the carrier 10.

[0054] In some embodiments, a laser stripping technique is used to strip the wafer assembly to be stripped. Among them, the laser stripping technique is to move the laser from the edge of the wafer assembly 20 to be stripped to the center of the wafer assembly 20 to be stripped to scan the epitaxial layer 202. However, since the epitaxial layer 202 is bonded to the target substrate (such as a drive backplane) after the substrate 202 grows, the edges of the epitaxial layer 202 and the substrate 201 are misaligned due to the bonding process, and the edge bonding quality is poor and peeling is prone to occur. During the scanning process, the edge film stress between the epitaxial layer and the target substrate is quickly released, and the debris splashes after the film is peeled off, and randomly falls to the surface of the epitaxial layer 202, thereby forming an obstruction, affecting the effect of the laser energy on the epitaxial layer 202, and making the epitaxial layer 202 after stripping a defective product. In addition, affected by the movement of the carrier 10, some of the debris that falls near the carrier 10 has a certain probability of falling on the surface of the epitaxial layer 202 again, making the epitaxial layer 202 after stripping a defective product. In the process of stripping, the types of lasers used include infrared lasers and ultraviolet lasers. Among them, infrared laser stripping relies on thermal processes to work, absorbing light and converting it into thermal energy, thereby generating high temperatures within the bonding interface; ultraviolet laser stripping usually relies on chemical processes to work, using the energy absorbed by light to break chemical bonds, and then breaking the chemical bonds of the polymer will cause the original polymer to decompose.

[0055] In some embodiments, during the laser stripping process, the gasification effect generated will cause some tiny (nano-scale) debris to float on the periphery of the wafer assembly 20 to be stripped, so a purge process is also required during the stripping process, that is, the debris floating on the periphery of the wafer assembly 20 to be stripped is blown away by a purge gas to prevent these tiny debris from falling onto the epitaxial layer 202 again after stripping. In addition, since some debris is clamped between the epitaxial layer 202 and the substrate 201, after the substrate 201 is stripped and removed, the surface of the epitaxial layer 202 needs to be purged to purge the debris that originally fell on the surface of the epitaxial layer 202.

[0056] In some embodiments, the debris generated during the stripping process is non-metallic debris or metal debris. Among them, the non-metallic debris accounts for a larger proportion, which mainly comes from the materials of the substrate 201 and the epitaxial layer 202 themselves, while the metal debris accounts for a smaller proportion, which mainly comes from the metal material used when the substrate 201 and the epitaxial layer 202 are combined.

[0057] The debris removal device of the embodiment of the utility model can be applied in the manufacturing process of a micro display panel.

[0058] The micro display panel described above has a very small volume, and the length and width dimensions are between 500μm and 50000μm. The area of ​​the light-emitting area of ​​the above-mentioned micro display panel is very small, such as 1mm×1mm, 2.64mm×2.02mm, 3mm×5mm, etc. The light-emitting area of ​​the above-mentioned micro display panel includes a plurality of micro-LED pixels arranged in an array, and the specific pixel arrangement can be one of 320×240, 640×480, 1600×1200, 1920×1080, and 2560×1440. The size of a single micro LED pixel is between 100nm and 100μm. In some embodiments, the size of a single micro LED pixel is between 150nm and 15μm. In some embodiments, the size of a single micro LED pixel can also be less than 10μm.

[0059] A driving backplane is arranged on the back of the micro-LED pixel array. The driving backplane is electrically connected to the micro-LEDs in the micro-LED pixel array. The driving backplane can obtain signals such as image data from the outside world and can control the corresponding micro-LEDs to emit light or not. The driving backplane is a TFT (Thin Film Transistor) board or an IC (Integrated Circuit) board.

[0060] For example, the driving backplane of the above-mentioned micro display panel integrates a frame buffer, a column driving circuit, and a row driving circuit. The frame buffer includes a first pixel storage area, and the micro LED pixel array includes a second pixel storage area. A complete frame of pixel grayscale data from the outside world can first enter the first pixel storage area of ​​the frame buffer, and the column driving circuit can load the pixel grayscale data in the first pixel storage area of ​​the frame buffer to the second pixel storage area of ​​the micro LED pixel array. The row driving circuit can scan the pixel grayscale data in the second pixel storage area and generate a pulse modulation signal to achieve the purpose of displaying different grayscales. When driving multiple micro LED pixels in the micro LED pixel array, either a single pixel can be driven independently or multiple pixel units can be driven independently. The specific driving method should not constitute a limitation to the present utility model.

[0061] It should be noted that the application of the debris removal device of the present invention in the manufacturing process of a micro display panel should not constitute a limitation on the application of the present invention.

[0062] Although the utility model is disclosed as above, the utility model is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the utility model. Therefore, the protection scope of the utility model shall be subject to the scope defined by the claims.

Claims

1. A debris removal device, characterized in that: include: A carrier, used for carrying and fixing the wafer assembly to be peeled off; The purge device is used for purge toward the wafer assembly to be peeled off which is carried on the carrier.

2. The debris removal device according to claim 1, characterized in that: The purge device comprises: a gas storage component for storing purge gas; and a pipeline component connected to the gas storage component and in gas communication, for conveying the purge gas.

3. The debris removal device according to claim 2, characterized in that: The pipeline assembly includes: an air inlet pipeline connected to the gas storage assembly and communicated with the air circuit, used to input the purge gas; and an air outlet pipeline connected to the air inlet pipeline and communicated with the air circuit, used to output the purge gas.

4. The debris removal device according to claim 3, characterized in that: The pipeline assembly also includes: a gas nozzle connected to the gas outlet pipeline and communicated with the gas circuit.

5. The debris removal device according to claim 3, characterized in that: The purge device further comprises: a support assembly connected to the pipeline assembly and used for supporting and fixing the pipeline assembly.

6. The debris removal device according to claim 5, characterized in that: The support assembly includes: a support rod and a support head connected to the support rod; wherein the support head is at least connected to the air outlet pipeline and the air path is in communication.

7. The debris removal device according to claim 6, characterized in that: The support head is also connected to the air inlet pipeline and the air circuit is in communication; or, the support head is connected to the support rod and the air circuit is in communication, and the support rod is connected to the air inlet pipeline and the air circuit is in communication.

8. The debris removal device according to any one of claims 3 to 7, characterized in that: The air outlet pipeline comprises: a plurality of segmented pipes which are sequentially connected and communicate with each other through the air path, and at least part of the segmented pipes are rotatably connected.

9. The debris removal device according to claim 2, characterized in that: The purge gas is purged from above the wafer assembly to be peeled to the surface to be purged of the wafer assembly to be peeled.

10. The debris removal device according to claim 9, characterized in that: There is a purge angle between the spraying direction of the purge gas and the surface of the wafer assembly to be stripped, and the purge angle is an acute angle.

11. The debris removal device according to claim 9, characterized in that: The purge path of the purge device is: moving from the center of the wafer assembly to be peeled off to 1 / 2 of the radius of the wafer assembly to be peeled off.

12. The debris removal device according to claim 2, characterized in that: The purge gas and the surface to be purged of the wafer assembly to be stripped are located on the same horizontal plane.

13. The debris removal device according to claim 1, characterized in that: The purge assembly further includes: a motion assembly fixedly connected to the carrier, which is used to drive the carrier to move, and the carrier drives the to-be-peeled wafer assembly to move.

14. The debris removal device according to claim 13, characterized in that: The motion assembly includes: a support platform fixedly connected to the carrier; and a driving member fixedly connected to the support platform, used to drive the support platform to rotate, so that the support platform drives the carrier to rotate.

15. The debris removal device according to claim 1, characterized in that: The wafer assembly to be peeled off is supported and fixed on the carrier in an adsorption manner.

16. The debris removal device according to claim 15, characterized in that: The carrier is provided with a plurality of adsorption through holes, and the air paths of the plurality of adsorption through holes are connected to the negative pressure equipment.

17. The debris removal device according to claim 14, characterized in that: The purging device further comprises: a collecting component for collecting debris purged from the wafer component to be peeled off.

18. The debris removal device according to claim 17, characterized in that: The collecting assembly comprises: a collecting cover having a collecting cavity; wherein the carrier passes through the collecting cover and is located in the collecting cavity.

19. The debris removal device according to claim 18, characterized in that: The collecting cover has a plurality of dust suction holes, which are connected to the collecting chamber; the collecting assembly also includes: a dust suction device, which is connected to the air path of the plurality of dust suction holes; and / or a dust removal rubber layer attached to the side wall surface of the collecting chamber.

20. The debris removal device according to claim 18, characterized in that: The diameter of the opening through which the carrier passes through the collecting cover is greater than, equal to, or smaller than the diameter of the carrier.

21. The debris removal device according to claim 20, characterized in that: When the diameter of the opening through which the carrier passes through the collecting cover is larger than the diameter of the carrier, the collecting cover can be detachably fixed on the supporting platform.

22. The debris removal device according to claim 20, characterized in that: When the diameter of the opening through which the carrier passes through the collecting cover is equal to or smaller than the diameter of the carrier, the collecting cover is sleeved on the carrier.

23. The debris removal device according to claim 2, characterized in that: The purge gas includes: nitrogen or inert gas; wherein the purity of the nitrogen is greater than or equal to 99.999%, and the purity of the inert gas is greater than or equal to 99.99%.

24. The debris removal device according to claim 1, characterized in that: The wafer assembly to be peeled includes: a substrate, and an epitaxial layer formed on the substrate; when the wafer assembly to be peeled is fixed on the carrier, the epitaxial layer is located between the substrate and the carrier.

Images