Ultrasonic cleaning equipment for wafer

Abstract

The ultrasonic cleaning equipment comprises an ultrasonic cleaning main body, a placing plate is installed in the ultrasonic cleaning main body, the top end of the placing plate is movably connected with a rotating rod in a sleeved mode, and a first bevel gear is installed at the bottom end of the rotating rod. A wafer is placed on a placing plate, a rotating rod is screwed to rotate, a first bevel gear is driven to rotate, a second bevel gear is driven to rotate through meshing of the first bevel gear, a screw rod is driven to rotate, then a movable block moves on the surface of the screw rod in a threaded mode, and then the movable block pushes a connecting block to move. Meanwhile, a movable block slides upwards in a placement plate, pushes a supporting rod to slide, pushes a supporting block to slide out of the placement plate through the supporting rod, and through the supporting block arranged at the top end of the placement plate, supporting points are increased during placement, the contact area between the supporting point and the placement plate is reduced, ultrasonic cleaning is faster, and the cleaning efficiency is improved. And the cleaning efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cleaning, in particular to an ultrasonic cleaning device for wafers. Background Art

[0002] Ultrasonic cleaning utilizes the cavitation effect, acceleration effect and straight-forward flow effect of ultrasound in liquid to directly and indirectly affect liquid and dirt, so that the dirt layer is dispersed, emulsified and peeled off to achieve the cleaning purpose. In the ultrasonic cleaning machines currently used, cavitation and straight-forward flow are used more. The propagation of ultrasound depends on elastic media. When it propagates, the particles in the elastic medium oscillate and transfer energy through the medium in the direction of ultrasound propagation. This wave can be divided into longitudinal waves and transverse waves.

[0003] However, when the above structure is used in an ultrasonic cleaning device for wafers, due to the particularity of the wafer material, it is not stable enough after being placed, and it is inevitable that they will collide with each other and affect each other during cleaning, which will reduce the cleaning efficiency. At the same time, after placement, the contact area is too large, which will lead to uneven cleaning and increase the cleaning time. Utility Model Content

[0004] The purpose of the utility model is to solve at least one of the technical problems existing in the prior art and to provide an ultrasonic cleaning device for wafers. Due to the particularity of the wafer material, the wafers are not stable enough after being placed, and inevitably collide with and affect each other during cleaning, which reduces the cleaning efficiency. At the same time, after being placed, the contact area is too large, which leads to uneven cleaning and increases the cleaning time.

[0005] To achieve the above-mentioned purpose, an ultrasonic cleaning device for wafers is provided, comprising an ultrasonic cleaning body, a placing plate is installed inside the ultrasonic cleaning body, and a rotating rod is movably sleeved on the top of the placing plate, a first bevel gear is installed on the bottom end of the rotating rod, and a second bevel gear is meshingly connected to the surface of the first bevel gear, the second bevel gear is installed on the outer wall of the screw, and a movable block is threadedly connected to the surface of the screw, the top of the movable block is movably connected to a connecting block, and the top of the connecting block is fixedly connected to a support rod, and the top of the support rod is fixedly connected to the support block.

[0006] Place the wafer on the placement plate, turn the rotating rod to rotate, drive the first bevel gear to rotate, and drive the second bevel gear to rotate through the meshing of the first bevel gear, and then drive the screw to rotate, and then the movable block moves on the surface of the screw, and the movable block pushes the connecting block to move, and then pushes the support rod to slide, and then the support rod pushes the support block to slide out of the placement plate. The support block set on the top of the placement plate increases the support points during placement, reduces the contact area between the contact and the placement plate, makes ultrasonic cleaning faster, and improves the cleaning efficiency.

[0007] According to the ultrasonic cleaning device for wafers, a telescopic spring is installed at the bottom end of the support block, and the telescopic spring is sleeved on the outer wall of the support rod.

[0008] According to the ultrasonic cleaning equipment for wafers, threaded blocks are symmetrically installed on both sides of the placement plate, and the threaded blocks are threadedly connected to the outer wall of the threaded rod, the threaded rod is movably sleeved inside the ultrasonic cleaning body, and the threaded blocks are movably sleeved on the inner wall of the ultrasonic cleaning body.

[0009] According to the ultrasonic cleaning equipment for wafers, a partition is installed on the top of the placement plate.

[0010] According to the ultrasonic cleaning device for wafers, a limiting groove is provided inside the partition, and a pad is movably sleeved inside the limiting groove, the pad is fixedly sleeved on the outer wall of the movable rod, and a limiting plate is fixedly installed on one side of the movable rod.

[0011] According to the ultrasonic cleaning device for wafers, a return spring is fixedly mounted on one side of the pad, and the other side of the return spring is mounted inside the limiting groove.

[0012] According to the ultrasonic cleaning device for wafers, a plurality of soft blocks are installed on one side of the limiting plate.

[0013] When the wafer is placed on the placement plate, the limit plate is pushed, which pushes the movable rod to slide inward in the limit groove, and also drives the pad to slide, so that the reset spring contracts. After there is no driving force, the limit plate is pushed to reset and move through the elasticity of the reset spring, and the wafer is clamped to ensure the stability of the wafer during cleaning and avoid mutual collision and influence. When the threaded rod is turned, the threaded block moves threadably on the surface of the threaded rod, thereby driving the placement plate to descend and slide into the ultrasonic cleaning body for cleaning, and then drives the placement plate up and down, which is convenient for taking and placing before and after cleaning.

[0014] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The utility model is further described below in conjunction with the accompanying drawings and embodiments;

[0016] Figure 1 This is a structural diagram of an ultrasonic cleaning device for wafers according to the utility model;

[0017] Figure 2 The utility model is an ultrasonic cleaning device for wafers Figure 1The local enlarged structural diagram of the placement board in the middle;

[0018] Figure 3 The utility model is an ultrasonic cleaning device for wafers Figure 2 The local cross-sectional structure diagram of the plate is placed in the middle;

[0019] Figure 4 The utility model is an ultrasonic cleaning device for wafers Figure 3 The enlarged structural diagram of the local section of the middle placement plate;

[0020] Figure 5 The utility model is an ultrasonic cleaning device for wafers Figure 1 The structure diagram of the threaded rod and the placement plate is gradually enlarged;

[0021] Figure 6 The utility model is an ultrasonic cleaning device for wafers Figure 1 Partial cross-sectional structural diagram of the middle partition;

[0022] Figure 7 The utility model is an ultrasonic cleaning device for wafers Figure 6 Enlarged structural diagram of the partial section of the middle partition.

[0023] Legend:

[0024] 1. Ultrasonic cleaning body; 2. Placement plate; 3. Rotating rod; 4. First bevel gear; 5. Second bevel gear; 6. Screw; 7. Movable block; 8. Connecting block; 9. Support rod; 10. Support block; 11. Telescopic spring; 12. Threaded block; 13. Threaded rod; 14. Partition; 15. Limiting groove; 16. Cushion block; 17. Movable rod; 18. Limiting plate; 19. Reset spring; 20. Soft block. DETAILED DESCRIPTION

[0025] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0026] Reference Figures 1 to 7The utility model embodiment is an ultrasonic cleaning device for wafers, comprising an ultrasonic cleaning body 1, a placing plate 2 is installed inside the ultrasonic cleaning body 1, and a rotating rod 3 is movably sleeved on the top of the placing plate 2, a first bevel gear 4 is installed on the bottom end of the rotating rod 3, and a second bevel gear 5 is meshingly connected to the surface of the first bevel gear 4, the second bevel gear 5 is installed on the outer wall of a screw rod 6, and a movable block 7 is threadedly connected to the surface of the screw rod 6, the top of the movable block 7 is movably connected to a connecting block 8, and the top of the connecting block 8 is fixedly connected to a support rod 9, and the top of the support rod 9 is fixedly connected to a support block 10. Place the wafer on the placement plate 2, turn the rotating rod 3 to rotate, and drive the second bevel gear 5 to rotate through the engagement of the first bevel gear 4, and then drive the screw 6 to rotate, and then the movable block 7 moves on the surface of the screw 6, and then the movable block 7 pushes the connecting block 8 to move, and then pushes the support rod 9 to slide, and then the support block 10 is pushed out of the placement plate 2 by the support block 10 set at the top of the placement plate 2, so that the support point is increased during placement, and the contact area between the contact and the placement plate 2 is reduced.

[0027] A telescopic spring 11 is installed at the bottom of the support block 10, and the telescopic spring 11 is sleeved on the outer wall of the support rod 9. When the support block 10 is pushed, the telescopic spring 11 is driven to extend and retract. When the support block 10 has no driving force, the telescopic spring 11 can drive the support block 10 to reset and slide back into the placement plate 2.

[0028] Threaded blocks 12 are symmetrically mounted on both sides of the placement plate 2, and the threaded blocks 12 are threadedly connected to the outer wall of the threaded rod 13, the threaded rod 13 is movably sleeved inside the ultrasonic cleaning body 1, and the threaded blocks 12 are movably sleeved on the inner wall of the ultrasonic cleaning body 1. By twisting the threaded rod 13, the threaded blocks 12 are threadedly moved up and down on the surface of the threaded rod 13, and at the same time, the threaded blocks 12 are also moved up and down on the inner wall of the ultrasonic cleaning body 1, and then the placement plate 2 is driven up and down, which is convenient for taking and placing before and after cleaning.

[0029] A partition 14 is installed on the top of the placement plate 2. The placement plate 2 can be separated to avoid collision between wafers during cleaning.

[0030] A limiting groove 15 is provided inside the partition 14, and a cushion block 16 is movably sleeved inside the limiting groove 15, and the cushion block 16 is fixedly sleeved on the outer wall of the movable rod 17, and a limiting plate 18 is fixedly installed on one side of the movable rod 17. When the wafer is placed on the placement plate 2, the limiting plate 18 is pushed, and the movable rod 17 is pushed to slide inward inside the limiting groove 15, and the cushion block 16 is also driven to slide, so that the reset spring 19 is contracted. When there is no driving force, the limiting plate 18 is pushed to reset and move through the elasticity of the reset spring 19, and the wafer is limited and clamped to ensure the stability of the wafer during cleaning.

[0031] A return spring 19 is fixedly mounted on one side of the cushion block 16, and the other side of the return spring 19 is mounted inside the limiting groove 15. Through the elasticity of the return spring 19, the cushion block 16 can be driven to reset and move after there is no driving force.

[0032] A plurality of soft blocks 20 are installed on one side of the limit plate 18. The softness of the soft blocks 20 prevents the limit plate 18 from damaging the wafer during limit clamping.

[0033] Working principle: first, place the wafer on the placement plate 2, then turn the rotating rod 3 to rotate, drive the first bevel gear 4 to rotate, and drive the second bevel gear 5 to rotate through the meshing of the first bevel gear 4, and then drive the screw 6 to rotate, and then the movable block 7 moves on the surface of the screw 6, and then pushes the connecting block 8 to move through the movable block 7. At the same time, the movable block 7 slides upward inside the placement plate 2, and then pushes the support rod 9 to slide, and then pushes the support block 10 to slide out of the placement plate 2 through the support block 10 set at the top of the placement plate 2, so that the support point is increased during placement and the contact is reduced The contact area between the placement plate 2 and the wafer is placed on the placement plate 2. When the wafer is placed on the placement plate 2, the limit plate 18 is pushed, and the movable rod 17 is pushed to slide inward inside the limit groove 15, and the pad 16 is also driven to slide, so that the reset spring 19 contracts. After there is no driving force, the limit plate 18 is pushed to reset and move through the elasticity of the reset spring 19, and the wafer is clamped to ensure the stability of the wafer during cleaning. When the threaded rod 13 is turned, the threaded block 12 is threadedly moved on the surface of the threaded rod 13, thereby driving the placement plate 2 to descend and slide into the ultrasonic cleaning body 1 for cleaning.

[0034] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. An ultrasonic cleaning device for wafers, characterized in that: The ultrasonic cleaning device comprises an ultrasonic cleaning body (1), wherein a placement plate (2) is installed inside the ultrasonic cleaning body (1), and a rotating rod (3) is movably sleeved on the top of the placement plate (2), a first bevel gear (4) is installed on the bottom of the rotating rod (3), and a second bevel gear (5) is meshingly connected to the surface of the first bevel gear (4), the second bevel gear (5) is installed on the outer wall of a screw rod (6), and a movable block (7) is threadedly connected to the surface of the screw rod (6), the top of the movable block (7) is movably connected to a connecting block (8), and the top of the connecting block (8) is fixedly connected to a support rod (9), and the top of the support rod (9) is fixedly connected to a support block (10).

2. The ultrasonic cleaning device for wafers according to claim 1, characterized in that: A telescopic spring (11) is installed at the bottom end of the support block (10), and the telescopic spring (11) is sleeved on the outer wall of the support rod (9).

3. The ultrasonic cleaning device for wafers according to claim 1, characterized in that: Threaded blocks (12) are symmetrically mounted on both sides of the placement plate (2), and the threaded blocks (12) are threadedly connected to the outer wall of the threaded rod (13), the threaded rod (13) is movably sleeved inside the ultrasonic cleaning body (1), and the threaded blocks (12) are movably sleeved on the inner wall of the ultrasonic cleaning body (1).

4. The ultrasonic cleaning device for wafers according to claim 1, characterized in that: A partition plate (14) is installed on the top of the placement plate (2).

5. The ultrasonic cleaning device for wafers according to claim 4, characterized in that: A limiting groove (15) is provided inside the partition (14), and a cushion block (16) is movably sleeved inside the limiting groove (15). The cushion block (16) is fixedly sleeved on the outer wall of the movable rod (17), and a limiting plate (18) is fixedly installed on one side of the movable rod (17).

6. The ultrasonic cleaning device for wafers according to claim 5, characterized in that: A return spring (19) is fixedly mounted on one side of the cushion block (16), and the other side of the return spring (19) is mounted inside the limiting groove (15).

7. The ultrasonic cleaning device for wafers according to claim 5, characterized in that: A plurality of soft blocks (20) are installed on one side of the limiting plate (18).

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