Radio frequency device, radio device and terminal equipment

Abstract

The embodiment of the utility model relates to the technical field of signal processing, and discloses a radio frequency device, a radio device and terminal equipment, the radio frequency device comprises a chip packaging body, the first surface of the chip packaging body is provided with at least one radiation part, a plurality of solder balls are arranged around each radiation part, and a first waveguide channel is formed in the surrounding space; the PCB is provided with a second surface and a third surface which are opposite to each other, the second surface is in butt joint with the first surface of the chip packaging body, and a gap penetrating through the second surface and the third surface is formed in the position corresponding to each first waveguide channel; and radio frequency signals transmitted and received by the radiation part are transmitted between the first waveguide channel and the gap in a coupling manner. According to the scheme, the area occupied by the transition structure relative to the PCB can be effectively reduced on the basis of ensuring that the transition structure does not obviously influence the transmission performance of the radio frequency signal.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of signal processing technology, and in particular to a radio frequency device, a radio component and a terminal device. Background Art

[0002] ROP (radiation on package) technology adds a metal patch with a radiating effect to the package to transmit and receive signals. The radiating patch is surrounded by a circle of solder balls and connected to the windowed printed circuit boards (PCB) to form a transition structure of a metal cavity, which can transmit the radio frequency (RF) signal in the package to the external waveguide antenna.

[0003] However, in the scheme of transmitting RF signals through the above transition structure, in addition to ensuring low loss and wide impedance bandwidth characteristics during signal transmission, it is also necessary to consider how to reduce the area occupied by the transition structure relative to the PCB. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide a radio frequency device, a radio component and a terminal device, which can effectively reduce the area occupied by the transition structure relative to the PCB while ensuring that the transition structure does not significantly affect the transmission performance of the radio frequency signal.

[0005] In order to solve the above technical problems, an embodiment of the present application provides a radio frequency device, including:

[0006] A chip package, wherein at least one radiation portion is disposed on a first surface thereof, a plurality of solder balls are disposed around each of the radiation portions, and a space surrounded by the plurality of solder balls forms a first waveguide channel;

[0007] A PCB board having a second surface and a third surface opposite to each other, wherein the second surface is butted against the first surface of the chip package, and a gap penetrating the second surface and the third surface is provided at a position of the PCB board corresponding to each first waveguide channel;

[0008] The radio frequency signal received and sent by the radiation portion is transmitted between the first waveguide channel and the slot in a coupled manner.

[0009] In the radio frequency device provided in the embodiment of the present application, when the first surface of the chip package having the radiation part is connected to the second surface of the PCB board, a plurality of solder balls are arranged around each radiation part on the chip package to form a first waveguide channel, and a gap penetrating the second surface and the third surface is arranged on the PCB board corresponding to each first waveguide channel, so that the radio frequency signal received and sent by the radiation part can be transmitted in a coupling manner between the first waveguide channel and the gap, thereby realizing the function of receiving and sending radio frequency signals. At the same time, the transition scheme of replacing the traditional waveguide transmission with gap coupling on the PCB board has a smaller size, thereby reducing the packaging size of the chip package on the PCB board.

[0010] In some embodiments, it also includes: a waveguide structure connected to the third surface of the PCB board, and a second waveguide channel is provided corresponding to each of the gaps; the radio frequency signal is transmitted between the second waveguide channel and the gap in a coupled manner.

[0011] In some embodiments, the length of the slot is greater than or equal to 1 / 2 of the wavelength of the radio frequency signal when it is transmitted in the medium in the slot.

[0012] In some embodiments, a size of each of the slots is smaller than a cross-section of the corresponding first waveguide channel and the second waveguide channel.

[0013] In some embodiments, each of the slots is arranged corresponding to the waveguide openings of the corresponding first waveguide channel and the second waveguide channel.

[0014] In some embodiments, the radiating portion is a metal patch.

[0015] In some embodiments, the first waveguide channel and the second waveguide channel are both rectangular waveguides.

[0016] In some embodiments, the long sides of the slots are parallel to the long sides of the rectangular waveguide.

[0017] In some embodiments, the width of the gap is 0.4 mm.

[0018] In some embodiments, the slot has a length of 1.8 mm and a width of 0.4 mm, and the rectangular waveguide has a length of 2.4 mm and a width of 1 mm.

[0019] Another aspect of the present application provides a radio device, including:

[0020] Carrier;

[0021] The radio frequency device as described in any of the above embodiments is arranged on the carrier;

[0022] The antenna is arranged on the carrier and is used for sending and receiving radio signals.

[0023] Another aspect of the present application provides a terminal device, including:

[0024] Equipment body;

[0025] The radio device as described above is arranged on the device body, and the radio device is used for target detection and / or communication. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0027] Figure 1 is a schematic diagram of a radio frequency device in the prior art;

[0028] Figure 2 is a front view of a radio frequency device provided according to an embodiment of the present application;

[0029] Figure 3 yes Figure 2 A top view corresponding to the radio frequency device in FIG.

[0030] Figure 4 yes Figure 2 Figure 2. Return loss simulation results of the RF device in Figure 2. DETAILED DESCRIPTION

[0031] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, each embodiment of the present application will be described in detail below in conjunction with the accompanying drawings. However, it will be appreciated by those skilled in the art that in each embodiment of the present application, many technical details are proposed in order to enable the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical scheme claimed in the present application can also be implemented. The division of the following embodiments is for the convenience of description, and the specific implementation of the present application should not be construed as any limitation, and the various embodiments can be combined and referenced with each other without contradiction.

[0032] Currently, the schematic diagram of the existing transition structure from chip package 01 to waveguide is as follows Figure 1As shown, the transition structure includes a rectangular cavity (rectangular waveguide) surrounded by solder balls 02 and a waveguide channel 04 (usually also a rectangular waveguide) on a PCB board 03. The transmission line in the chip package 01 passes through an E-shaped patch, the rectangular cavity surrounded by solder balls 02 and the waveguide channel 04 on the PCB board 03, and then transitions to an external waveguide structure (not shown in the figure). Usually, the solder balls 02 are manufactured together with the chip package 01, so the solder balls 02 can be regarded as a part of the chip package 01, and the rectangular cavity surrounded by solder balls 02 can be called "the waveguide structure in the chip package 01". Similarly, the waveguide channel 04 on the PCB board 03 can also be called "the PCB waveguide structure". Therefore, the radio frequency signal is transmitted in the entire transition structure in the form of waveguide, and then transitions to the external waveguide structure. The size of the external waveguide structure is consistent with the size of the PCB waveguide structure.

[0033] In the above transition structure, the electromagnetic signal is transmitted from the chip package 01 to the external waveguide structure in the form of a waveguide through the waveguide structure surrounded by the solder ball 02 and the PCB waveguide structure. However, the rectangular waveguide usually has a large size, which causes the package transition structure of the chip package 01 to occupy a larger package area.

[0034] One embodiment of the present application relates to a radio frequency device, which can effectively reduce the area occupied by the transition structure relative to the PCB on the basis of ensuring that the transition structure does not significantly affect the transmission performance of the radio frequency signal. Figure 2 As shown, the radio frequency device includes: a chip package 11 and a PCB board 21.

[0035] The chip package 11 has a first surface S1 on which at least one radiation portion 12 is disposed. A plurality of solder balls 13 are disposed around each radiation portion 12 . The space surrounded by the plurality of solder balls 13 forms a first waveguide channel 14 .

[0036] The first surface S1 is a side of the chip package 11 facing the PCB board 21, and a radiation part 12 is arranged on the first surface S1 for externally transmitting and receiving radio frequency signals. A plurality of radiation parts 12 can be arranged, and a plurality of solder balls 13 are arranged around each radiation part 12. The space surrounded by the plurality of solder balls is a waveguide channel for the radiation part 12 to transmit and receive radio frequency signals on the chip package 11, which is called a first waveguide channel 14.

[0037] The PCB board 21 has a second surface S2 and a third surface S3 opposite to each other. The second surface S2 is connected to the first surface S1 of the chip package 11. A gap 22 penetrating the second surface S2 and the third surface S3 is provided at a position corresponding to each first waveguide channel 14 of the PCB board 21.

[0038] Among them, the second surface S2 and the third surface S3 are two surfaces parallel to each metal layer in the PCB board 21, wherein the second surface S2 is in direct contact with the solder ball 13 to achieve the docking of the PCB board 21 and the chip package 11. On the second surface S2 after docking, a gap 22 that runs through the second surface S2 and the third surface S3 is provided at the corresponding position of each first waveguide channel 14. In this embodiment, the explanation of "gap" is usually that the aspect ratio is much larger than the aspect ratio of the waveguide port of the rectangular waveguide. Based on the design of this gap structure, after docking with the first waveguide channel 14, it does not transmit the radio frequency signal in a traditional waveguide mode, but transmits it in a gap coupling mode. That is, the radio frequency signal received and sent by the radiation part 12 is transmitted in a coupling mode between the first waveguide channel 14 and the gap 22.

[0039] Usually, if Figure 1 As shown, in the conventional solution of converting the chip package 01 to an external waveguide, the solder balls 02 need to enclose a cavity with the same size as the waveguide opening of the waveguide channel 04 on the PCB board 03, and the size of the waveguide opening of the waveguide channel 04 on the PCB board 03 is also the same as the size of the external waveguide structure, which makes the packaging area on the chip package 01 larger. Compared with the waveguide size of the waveguide channel 04 on the PCB board 03 in the related art, the gap size of the gap 22 on the PCB board 21 in this embodiment is reduced, and the gap size enclosed by the corresponding solder balls 13 is also smaller, so the packaging size of the chip package 11 can be further reduced.

[0040] In this embodiment, by changing the transmission mode of the RF signal between the first waveguide channel and the slot, that is, transmitting in a slot coupling manner, the transition scheme of replacing the traditional waveguide transmission with the slot on the PCB board has a smaller size on the basis of realizing the transceiver function of the RF signal, thereby reducing the packaging size of the chip package on the PCB board.

[0041] In some embodiments, Figure 2 , Figure 3 ( Figure 3 for Figure 2 As shown in the top view observed from the plane of the solder ball 13 downward, the RF device in this embodiment may also include a waveguide structure 31, which is connected to the third surface S3 of the PCB board 21, and a second waveguide channel 32 is provided corresponding to each gap 22; the RF signal is transmitted between the second waveguide channel 32 and the gap 22 in a coupled manner.

[0042] Specifically, in order to facilitate the connection between the slot on the PCB board 21 and the external waveguide, and to couple the radio frequency signal in the slot to the external waveguide, a waveguide structure can be added and designed at the slot first, and the size of the waveguide structure is consistent with the waveguide port of the external waveguide, and then the added waveguide structure is connected to the external waveguide, so as to transmit the radio frequency signal in the slot to the external waveguide. That is, a waveguide structure 31 is added on the third surface S3 of the PCB board 21, and after the waveguide structure 31 is connected to the third surface S3, a second waveguide channel 32 is provided at the corresponding position of each slot 22, and the cross-sectional area of ​​the waveguide port of the second waveguide channel 32 is larger than the cross-sectional area of ​​the slot, and the size of the waveguide port of the second waveguide channel 32 is consistent with the size of the waveguide port of the external waveguide structure, so as to facilitate the connection with the external waveguide structure while ensuring the reduction of the package size. Similarly, the radio frequency signal is also transmitted between the second waveguide channel 32 and the slot 22 in a coupling manner.

[0043] In this way, through the slot 22 on the PCB board 21, the RF signal can be coupled and transmitted between the slot 22 and the first waveguide channel 14, and between the slot 22 and the second waveguide channel 32, respectively, so as to realize the transmission of the RF signal between the first waveguide channel 14 and the second waveguide channel 32, and this RF signal transmission mechanism can make the size of the first waveguide channel 14 and the size of the second waveguide channel 32 inconsistent. For example, in order to further reduce the package size of the chip package 11, the size of the first waveguide channel 14 can be made as small as possible by following the size of the slot 22; at the same time, in order to make the waveguide structure 31 better dock with the external waveguide structure, the size of the second waveguide channel 32 can be designed to follow the size of the external waveguide structure, that is, to keep consistent with the size of the external waveguide structure. In this way, the transition effect of the RF signal transmission between the chip package 11 and the external waveguide structure can be better achieved.

[0044] In some embodiments, the length of the slot 22 is greater than or equal to 1 / 2 of the wavelength of the radio frequency signal when it is transmitted in the medium in the slot 22. This setting is to ensure the effectiveness of the transmission of the radio frequency signal in the slot 22. The actual size corresponding to 1 / 2 of the wavelength is different with the difference of the medium in the slot 22. In the actual process, the specific size condition can be met by adjusting the medium in the slot 22.

[0045] For example, when the length of the slot 22 is less than 1 / 2 of the wavelength of the radio frequency signal when it is transmitted in the air, the slot 22 is also filled with a non-air medium, and the length of the slot 22 is greater than or equal to 1 / 2 of the wavelength of the radio frequency signal when it is transmitted in the slot medium filled with the non-air medium.

[0046] Specifically, when the length of the slot 22 cannot reach 1 / 2 of the wavelength of the radio frequency signal when it is transmitted in the air, it is necessary to additionally fill the slot 22 with a non-air medium to equivalently increase the length of the slot 22 to be greater than or equal to 1 / 2 of the wavelength of the radio frequency signal when it is transmitted in the slot 22. For example, a portion of the dielectric layer in the PCB board 21 can be retained in the slot 22 to equivalently serve as a filled non-air medium.

[0047] In some embodiments, the size of each slot 22 is smaller than the cross-section of the corresponding first waveguide channel 14 and second waveguide channel 32 .

[0048] In this embodiment, since the slot 22 realizes RF signal transmission with the first waveguide channel 14 and the second waveguide channel 32 respectively by coupling, the size of the slot 22 is designed to be smaller than the corresponding cross-sections of the first waveguide channel 14 and the second waveguide channel 32, which can make it easier to realize coupled transmission.

[0049] In some embodiments, each slot 22 is disposed corresponding to the waveguide openings of the corresponding first waveguide channel 14 and second waveguide channel 32 .

[0050] In this embodiment, the slot 22 is set to correspond to the waveguide openings of the first waveguide channel 14 and the second waveguide channel 32, which can effectively ensure the coupling transmission effect of the radio frequency signal between the slot 22 and the first waveguide channel 14 and the second waveguide channel 32. At the same time, the waveguide openings of the first waveguide channel 14 and the second waveguide channel 32 can also be directly aligned to achieve a better docking effect.

[0051] In some embodiments, the radiation portion 12 may be a metal patch.

[0052] In some embodiments, the first waveguide channel 14 and the second waveguide channel 32 may both be rectangular waveguides.

[0053] In some embodiments, when the first waveguide channel 14 and the second waveguide channel 32 are both rectangular waveguides, the long side of the slot 22 may be parallel to the long side of the rectangular waveguide. In this way, the size of the slot 22 can be minimized while meeting the minimum requirement, which is more helpful to reduce the package size of the chip package 11.

[0054] In some embodiments, the shape of the slit 22 may be, but is not limited to, a rectangle or a triangle.

[0055] In some embodiments, the width of the gap 22 is 0.4 mm.

[0056] In some embodiments, the slot 22 has a length of 1.8 mm and a width of 0.4 mm, and the rectangular waveguide has a length of 2.4 mm and a width of 1 mm.

[0057] Figure 2 In the RF device shown in FIG. 1 , when the first waveguide channel 14 and the second waveguide channel 32 are both rectangular waveguides, and the length and width of the waveguide opening are 2.6 mm×1.2 mm, and the size of the gap 22 is only 2 mm×0.4 mm, the corresponding simulation performance is as follows: Figure 4 As shown, -10dB can cover 76 to 81GHz in the 77GHz band. It can be seen that the transition structure in the RF device in this embodiment can be used for transmitting RF signals with a wide bandwidth and a compact structure, and can be used as a miniaturized package-to-waveguide solution, effectively reducing the package area.

[0058] Another embodiment of the present application relates to a radio device, comprising: a carrier; a radio frequency device as described in any of the above embodiments, arranged on the carrier; an antenna, arranged on the carrier, for sending and receiving radio signals.

[0059] The radio frequency device is connected to the antenna via a first transmission line for transmitting and receiving radio signals. The carrier may be a printed circuit board PCB, and the first transmission line may be a PCB trace. In addition, the radio frequency device may be integrated with the antenna to form a structure such as AiP, AoP or AoC.

[0060] Another embodiment of the present application relates to a terminal device, comprising: a device body; a radio device as described in any of the above embodiments, which is arranged on the device body, and the radio device is used for target detection and / or communication.

[0061] Specifically, based on the above embodiments, in one embodiment of the present application, the radio device can be arranged outside the device body, in another embodiment of the present application, the radio device can also be arranged inside the device body, and in other embodiments of the present application, the radio device can also be arranged partially inside the device body and partially outside the device body. The present application does not limit this, and it depends on the specific situation.

[0062] It should be noted that radio devices can achieve functions such as target detection and communication by transmitting and receiving signals.

[0063] In an optional embodiment, the above-mentioned device body can be a component and product used in fields such as smart housing, transportation, smart home, consumer electronics, monitoring, industrial automation, cabin detection and health care; for example, the device body can be intelligent transportation equipment (such as cars, bicycles, motorcycles, ships, subways, trains, etc.), security equipment (such as cameras), smart wearable devices (such as bracelets, glasses, etc.), smart home equipment (such as TVs, air conditioners, smart lights, etc.), various communication equipment (such as mobile phones, tablet computers, etc.), and such as gates, smart traffic lights, smart signs, traffic cameras and various industrial manipulators (or robots), etc., and can also be various instruments for detecting life characteristic parameters and various equipment equipped with the instrument. The radio device can be a radio device described in any embodiment of the present application. The structure and working principle of the radio device have been described in detail in the above embodiments, and will not be repeated here. The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0064] Those skilled in the art will appreciate that the above-mentioned embodiments are specific examples for implementing the present application, and in actual applications, various changes may be made thereto in form and detail without departing from the spirit and scope of the present application.

Claims

1. A radio frequency device, characterized in that: include: A chip package, wherein at least one radiation portion is disposed on a first surface thereof, a plurality of solder balls are disposed around each of the radiation portions, and a space surrounded by the plurality of solder balls forms a first waveguide channel; A PCB board having a second surface and a third surface opposite to each other, wherein the second surface is butted against the first surface of the chip package, and a gap penetrating the second surface and the third surface is provided at a position of the PCB board corresponding to each of the first waveguide channels; The radio frequency signal received and sent by the radiation portion is transmitted between the first waveguide channel and the slot in a coupled manner.

2. The radio frequency device according to claim 1, characterized in that: Also includes: A waveguide structure is connected to the third surface of the PCB board, and a second waveguide channel is provided at a position corresponding to each of the gaps; The radio frequency signal is transmitted between the second waveguide channel and the slot in a coupled manner.

3. The radio frequency device according to claim 1, characterized in that: The length of the slot is greater than or equal to 1 / 2 of the wavelength of the radio frequency signal when it is transmitted in the medium in the slot.

4. The radio frequency device according to claim 2, characterized in that: The size of each of the slots is smaller than the cross-section of the corresponding first waveguide channel and the second waveguide channel.

5. The radio frequency device according to claim 2, characterized in that: Each of the slots is arranged corresponding to the waveguide openings of the corresponding first waveguide channel and the second waveguide channel.

6. The radio frequency device according to claim 1, characterized in that: The radiation part is a metal patch.

7. The radio frequency device according to claim 2, characterized in that: The first waveguide channel and the second waveguide channel are both rectangular waveguides.

8. The radio frequency device according to claim 7, characterized in that: The long side of the slot is parallel to the long side of the rectangular waveguide.

9. The radio frequency device according to claim 8, characterized in that: The width of the gap is 0.4 mm.

10. The radio frequency device according to claim 8, characterized in that: The length of the slot is 1.8 mm and the width is 0.4 mm, and the length of the rectangular waveguide is 2.4 mm and the width is 1 mm.

11. A radio device, characterized in that: include: Carrier; The radio frequency device according to any one of claims 1 to 10, arranged on the carrier; The antenna is arranged on the carrier and is used for sending and receiving radio signals.

12. A terminal device, characterized in that: include: Equipment body; The radio device according to claim 11 is arranged on the device body, and is used for target detection and / or communication.

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