Refrigeration mirror cabinet with overhead refrigeration assembly

Abstract

The refrigeration mirror cabinet comprises a long-strip-shaped vertical cabinet body with a refrigeration cavity, a mirror surface cabinet door rotatably connected to the opening side of the cabinet body in a pivoted mode and the refrigeration assembly installed on the cabinet body, and the refrigeration assembly comprises a semiconductor refrigeration module and a heat dissipation device; the refrigerating cavity is located on the lower middle portion of the cabinet body, and the refrigerating assembly is arranged above the refrigerating cavity in an abutting mode. A heat dissipation cavity is formed in the side face, back on to the mirror face cabinet door, of the upper portion of the cabinet body, at least one side face of the heat dissipation cavity is open, and the heat dissipation device is fixed in the heat dissipation cavity. A refrigeration installation position is arranged between the heat dissipation cavity and the refrigeration cavity of the cabinet body, and the semiconductor refrigeration module is fixed at the refrigeration installation position to provide refrigeration for the refrigeration cavity from top to bottom. By optimizing the installation structure of the refrigeration assembly on the cabinet body, the refrigeration assembly is arranged above the refrigeration cavity in an abutting mode, the refrigeration assembly can have the good refrigeration performance, and it can be guaranteed that the refrigeration cavity obtains the good refrigeration effect.

Description

Technical Field

[0001] The utility model relates to the technical field of refrigerated cabinets, in particular to a refrigerated mirror cabinet with a top-mounted refrigeration component. Background Art

[0002] Refrigerated mirror cabinets integrate refrigerator refrigeration functions on the basis of traditional mirror cabinets, including a long cabinet body, a mirror cabinet door hinged on the opening side of the cabinet body, and a refrigeration component installed on the cabinet body, which provides refrigeration for the storage cavity of the cabinet body. Refrigerated mirror cabinets are usually installed in bathrooms, dressing rooms and other places, so that users can refrigerate cosmetics, beverages, etc. in the refrigerated mirror cabinets for their convenience.

[0003] The prior art is to assemble the refrigeration component on the back side of the cabinet storage cavity, and set an evaporator on the inner side of the storage cavity to provide refrigeration, which has the following disadvantages: Since the refrigerated mirror cabinet is usually embedded in the wall or cabinet of the bathroom, dressing room and other places, the installation space is small, so the heat dissipation space is small, and the heat dissipation is not smooth, which affects the refrigeration effect of the refrigeration component. At the same time, if a fan is used to improve the heat dissipation effect, it will increase the cost and generate a large heat dissipation noise, which is not conducive to improving the user experience. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art, and provides a refrigerated mirror cabinet with a top-mounted refrigeration component, which improves the refrigeration effect of the refrigerated mirror cabinet by optimizing the installation structure of the refrigeration component.

[0005] The utility model provides a refrigerated mirror cabinet with a top-mounted refrigeration component, comprising a long vertical cabinet body with a refrigeration cavity, a mirror cabinet door rotatably pivoted on an opening side of the cabinet body, and a refrigeration component installed on the cabinet body, wherein the refrigeration component comprises a semiconductor refrigeration module and a heat dissipation device; the refrigeration cavity is located in the middle and lower part of the cabinet body, and the refrigeration component is placed on the top of the refrigeration cavity; a heat dissipation cavity is provided on the side of the upper part of the cabinet body facing away from the mirror cabinet door, and at least one side of the heat dissipation cavity is opened, and the heat dissipation device is fixed in the heat dissipation cavity; a refrigeration installation position is provided between the heat dissipation cavity and the refrigeration cavity of the cabinet body, and the semiconductor refrigeration module is fixed at the refrigeration installation position to provide refrigeration for the refrigeration cavity from top to bottom.

[0006] In some preferred embodiments, the top side of the cabinet is provided with an opening, or the top side of the cabinet is provided with a plurality of heat dissipation slots connected with the heat dissipation cavity.

[0007] In some preferred embodiments, a heat-insulating panel is provided on the side of the heat-dissipating cavity facing the mirror cabinet door to prevent the heat-dissipating cavity from being connected to the refrigerating cavity.

[0008] In some preferred embodiments, the axial height of the cabinet is at least 3 times the lateral width, and the axial height of the refrigerating chamber does not exceed 80% of the axial height of the cabinet.

[0009] In some preferred embodiments, a support plate and an air guide plate located below the support plate are provided at the refrigeration installation position, and a receiving cavity is formed by the support plate and the air guide plate, and the semiconductor refrigeration module is located in the receiving cavity.

[0010] In some preferred embodiments, the back side of the cabinet above the support plate is arranged to avoid airflow to form a heat dissipation cavity.

[0011] In some preferred embodiments, the air guide plate has a first ventilation groove and a second ventilation groove arranged at intervals, so that cold air circulation is formed between the accommodating cavity and the refrigerating cavity through the first ventilation groove and the second ventilation groove.

[0012] In some preferred embodiments, the semiconductor refrigeration module includes a semiconductor refrigeration plate, a heat sink connected to and in contact with the refrigeration end surface of the semiconductor refrigeration plate, and a turbo fan with an air outlet facing the heat sink is also provided in the accommodating cavity; the semiconductor refrigeration plate is fixed on a support plate, and the air inlet of the turbo fan and the heat sink are respectively located in the first ventilation groove and the second ventilation groove.

[0013] In some preferred embodiments, the support plate is provided with an assembly groove, the semiconductor cooling plate is limitedly arranged in the assembly groove by an insulating substrate, and the heating end surface of the semiconductor cooling plate is located on the outer side surface of the support plate and connected to the heat dissipation device.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] The utility model optimizes the installation structure of the refrigeration component on the cabinet, places the refrigeration component on top of the refrigeration cavity, and uses the semiconductor refrigeration module to provide refrigeration to the refrigeration cavity from top to bottom, so that the temperature in the refrigeration cavity is more uniform and the refrigeration effect is better; at the same time, the heat dissipation device is placed on the top of the cabinet, and the heat generated by the heat dissipation device is more easily dissipated by taking advantage of the fact that hot air moves upward, which is beneficial to improving the refrigeration performance of the refrigeration component. The overall structure is simple and easy to assemble. Furthermore, the refrigerated mirror cabinet places the refrigeration component on top of the refrigeration cavity, and the heat dissipation device preferably adopts a new heat dissipation form of heat pipes. There is no fan component at the heat dissipation end, which can greatly reduce noise and improve the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the refrigerated mirror cabinet when the mirror cabinet door is displayed;

[0017] Figure 2 It is a schematic diagram of the exploded structure of the refrigerated mirror cabinet;

[0018] Figure 3 It is a schematic diagram of the exploded structure of the refrigerated mirror cabinet when the mirror cabinet door is omitted.

[0019] Figure 4 It is a schematic diagram of the three-dimensional structure of the refrigerated mirror cabinet when the back and side surfaces are displayed;

[0020] Figure 5 It is a schematic diagram of the exploded structure of the refrigerated mirror cabinet when the back side is displayed. DETAILED DESCRIPTION

[0021] In order to further explain the technical means and effects adopted by the present application to achieve the predetermined purpose, the specific implementation methods, structures, features and effects of the present application are described in detail below in conjunction with the accompanying drawings and preferred embodiments. In the following description, different "one embodiment" or "embodiment" does not necessarily refer to the same embodiment. In addition, specific features, structures, or characteristics in one or more embodiments may be combined in any suitable form.

[0022] Combination Figure 1-Figure 3 As shown, the utility model discloses a refrigerated mirror cabinet with a top-mounted refrigeration assembly, comprising a long vertical cabinet body 1, a mirror cabinet door 2 rotatably pivoted to the opening side of the cabinet body 1, and a refrigeration assembly mounted on the cabinet body 1, wherein the refrigeration assembly comprises a semiconductor refrigeration module 6 and a heat dissipation device 7. Among them, a refrigeration chamber 11 is provided in the middle and lower part of the cabinet body 1, and the refrigeration assembly is placed on the top of the refrigeration chamber 11, so that the refrigeration assembly is used to provide refrigeration to the refrigeration chamber 11 from top to bottom, and the cold air is made to flow from top to bottom in the refrigeration chamber 11 by using the principle that the cold air flows downward because it is heavier, so that the temperature difference at different height positions of the refrigeration chamber 11 is small, and the refrigeration temperature is more uniform, which is conducive to improving the refrigeration effect of the refrigeration chamber 11.

[0023] Refrigerated mirror cabinets are usually installed in bathrooms, toilets, cloakrooms, etc. In order to take into account the user's usage habits, the mirror cabinet door 2 is usually capable of providing a mirror image of the user's upper body or even the whole body. Therefore, the cabinet body 1 is usually a long vertical structure, and its overall height H1 is basically equivalent to the upper body or even the whole body height of a person.

[0024] Since the installation environment of the refrigerated mirror cabinet has limited space, the overall width W1 of the refrigerated mirror cabinet is relatively narrow. Generally speaking, the axial height H1 of the cabinet body 1 is at least 3 times the lateral width W1.

[0025] At the same time, the refrigerated mirror cabinet is mainly used to store facial masks, cosmetics and other products, and the refrigeration capacity of the refrigeration chamber 11 is usually not too large. Generally speaking, the axial height H2 of the refrigeration chamber 11 does not exceed 80% of the axial height H1 of the cabinet 1, thereby providing assembly space for installing the refrigeration component in the upper part of the cabinet 1.

[0026] Especially combined with Figure 3-Figure 5As shown, a heat dissipation cavity 13 is provided on the side of the upper part of the cabinet body 1 facing away from the mirror cabinet door 2, and at least one side of the heat dissipation cavity 13 is opened. The heat dissipation device 7 is fixed in the heat dissipation cavity 13. By placing the heat dissipation device 7 on the top of the cabinet body 1 and utilizing the characteristic that hot air moves upward relatively lightly, the heat generated by the heat dissipation device 7 can be more easily dissipated, which is beneficial to improving the refrigeration performance of the refrigeration component.

[0027] A refrigeration installation position 12 is provided between the heat dissipation cavity 13 of the cabinet 1 and the refrigeration cavity 11, and the semiconductor refrigeration module 6 is fixed at the refrigeration installation position 12 to provide refrigeration from top to bottom for the refrigeration cavity 11. By arranging the semiconductor refrigeration module 6 below the heat dissipation device 7 and placing it on top of the refrigeration cavity 11, it is convenient for the hot air generated by the heat dissipation device 7 to be discharged upward, and it is also convenient for the cold air generated by the semiconductor refrigeration module 6 to move directly downward from the top of the refrigeration cavity 11, which not only allows the refrigeration component to have better refrigeration performance, but also ensures that the refrigeration cavity 11 has a better refrigeration effect.

[0028] In order to facilitate the heat dissipation of the heat dissipation device 7 , the top side surface 19 of the cabinet 11 is provided with an opening, or the top side surface 19 of the cabinet 1 is provided with a plurality of heat dissipation slots 191 connected with the heat dissipation cavity 13 .

[0029] In order to prevent the heat generated by the heat dissipation device 7 from affecting the refrigerating chamber 11 through radiation or the like, an insulating panel 5 is provided on the side of the heat dissipation chamber 13 facing the mirror cabinet door 2 to use the insulating panel 5 to block the heat dissipation chamber 13 from being connected to the refrigerating chamber 11.

[0030] A support plate 3 and an air guide plate 4 located below the support plate 3 are provided at the refrigeration installation position 12, and a receiving cavity is formed by the support plate 3 and the air guide plate 4, and the semiconductor refrigeration module 6 is located in the receiving cavity. The back side of the cabinet 1 located above the support plate 12 is arranged to avoid air and form a heat dissipation cavity.

[0031] The support plate 3 is mainly used to install and support the refrigeration component, and the air guide plate 4 mainly cooperates with the support plate 3 to form a accommodating cavity for the semiconductor refrigeration module 6, and introduces the cold energy generated by the semiconductor refrigeration module 6 into the refrigeration cavity 11 to achieve refrigeration. The overall structure is simple and easy to assemble.

[0032] The air guide plate 4 has a first ventilation groove 41 and a second ventilation groove 42 arranged at intervals, so that cold air circulation is formed between the accommodating chamber and the refrigerating chamber 11 through the first ventilation groove 41 and the second ventilation groove 42 .

[0033] In one embodiment, the semiconductor refrigeration module 6 includes a semiconductor refrigeration sheet 61 and a heat sink 62 that is in contact with and connected to the cooling end surface of the semiconductor refrigeration sheet 61. In addition, a turbo fan 63 is provided in the accommodating cavity, and the air outlet is arranged directly opposite to the heat sink 62. The semiconductor refrigeration sheet 61 is fixed on the support plate 3, and the air inlet of the turbo fan 63 and the heat sink 62 are respectively located in the first ventilation groove 41 and the second ventilation groove 42.

[0034] Specifically, the support plate 3 is provided with an assembly groove 31 , the semiconductor refrigeration module 6 is limitedly arranged in the assembly groove 31 by an insulating substrate, and the heating end surface of the semiconductor refrigeration plate 61 is located on the outer side surface of the support plate 3 and connected to the heat dissipation device 7 .

[0035] Usually, the heat sink 7 and the refrigeration module 6 are configured as an integral module. For example, the lower end of the heat sink 7 and the refrigeration module 6 are welded as a whole, which is convenient for overall assembly and subsequent disassembly and maintenance.

[0036] The working principle of the refrigeration component providing refrigeration for the cold storage chamber 11 is as follows: the cold energy of the cooling end surface of the semiconductor refrigeration plate 31 is transferred to the heat sink 62, and the air in the cold storage chamber 11 is drawn into the first ventilation groove 41 by the turbo fan 63, and accelerated to the heat sink 62 for heat exchange to form cold air, and the cold air is blown into the cold storage chamber 11 from the second ventilation groove 42 from top to bottom, so that the gas in the cold storage chamber 11 forms a refrigeration cycle; the heat in the cold storage chamber 11 is transferred to the heating end surface of the semiconductor refrigeration plate 31 through the heat sink 62, and the heating end surface of the semiconductor refrigeration plate 31 dissipates heat to the outside through the heat sink 7.

[0037] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A refrigerated mirror cabinet with a top-mounted refrigeration assembly, comprising a long vertical cabinet with a refrigeration chamber, a mirror cabinet door rotatably pivoted to an opening side of the cabinet, and a refrigeration assembly mounted on the cabinet, wherein the refrigeration assembly comprises a semiconductor refrigeration module and a heat dissipation device; characterized in that: The refrigeration chamber is located in the middle and lower part of the cabinet, and the refrigeration assembly is placed on top of the refrigeration chamber; A heat dissipation cavity is provided on the side of the upper part of the cabinet body facing away from the mirror cabinet door, and at least one side of the heat dissipation cavity is opened, and a heat dissipation device is fixed in the heat dissipation cavity; A refrigeration installation position is arranged between the heat dissipation cavity and the refrigeration cavity of the cabinet, and a semiconductor refrigeration module is fixed at the refrigeration installation position to provide refrigeration for the refrigeration cavity from top to bottom.

2. The refrigerated mirror cabinet according to claim 1, characterized in that: The top side of the cabinet is provided with an opening, or the top side of the cabinet is provided with a plurality of heat dissipation slots communicated with the heat dissipation cavity.

3. The refrigerated mirror cabinet according to claim 1, characterized in that: A heat insulation panel is arranged on the side of the heat dissipation cavity facing the mirror cabinet door to prevent the heat dissipation cavity from being connected with the refrigeration cavity.

4. The refrigerated mirror cabinet according to claim 1, characterized in that: The axial height of the cabinet body is at least 3 times the lateral width, and the axial height of the refrigerated cavity does not exceed 80% of the axial height of the cabinet body.

5. The refrigerated mirror cabinet according to any one of claims 1 to 4, characterized in that: A support plate and an air guide plate located below the support plate are provided at the refrigeration installation position. The support plate and the air guide plate enclose a receiving cavity, and the semiconductor refrigeration module is located in the receiving cavity.

6. The refrigerated mirror cabinet according to claim 5, characterized in that: The back side of the cabinet body above the support plate is arranged to avoid air and form a heat dissipation cavity.

7. The refrigerated mirror cabinet according to claim 5, characterized in that: The air guide plate has a first ventilation groove and a second ventilation groove which are arranged at intervals, so that cold air circulation is formed between the accommodating cavity and the refrigerating cavity through the first ventilation groove and the second ventilation groove.

8. The refrigerated mirror cabinet according to claim 7, characterized in that: The semiconductor refrigeration module includes a semiconductor refrigeration plate, a heat sink connected to the refrigeration end surface of the semiconductor refrigeration plate, and a turbo fan with an air outlet facing the heat sink in the accommodating cavity; the semiconductor refrigeration plate is fixed on a supporting plate, and the air inlet of the turbo fan and the heat sink are respectively located in the first ventilation groove and the second ventilation groove.

9. The refrigerated mirror cabinet according to claim 8, characterized in that: The support plate is provided with an assembly groove, the semiconductor cooling plate is limitedly arranged in the assembly groove through the insulating substrate, and the heating end surface of the semiconductor cooling plate is located on the outer side surface of the support plate and connected to the heat dissipation device.

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