Anti-interference RFID tag

Abstract

The utility model relates to the field of tags, in particular to an anti-interference RFID tag, which comprises a chip layer, release paper is fixedly arranged below the chip layer, a spacing piece is movably arranged on the upper surface of the release paper, a printing layer is fixedly mounted on the upper surface of the chip layer, and a protective ring is fixedly mounted on the lower surface of the printing layer in an embedded manner. The chip layer comprises a substrate and a chip, the chip is fixedly installed on the upper surface of the substrate, antenna connecting lines are symmetrically and fixedly connected to the surface, located on one side of the chip, of the upper surface of the substrate, an antenna is fixedly connected to the end, located on the antenna connecting lines, of the upper surface of the substrate, and a bonding layer is fixedly arranged on the lower surface of the substrate. According to the utility model, when the label is torn off from the surface of the release paper, the chip layer is prevented from being bent, a gap is prevented from being reserved between the bent chip layer and an object after the chip layer is pasted, dust is prevented from entering, the bonding firmness of the chip is maintained, the label is easier to tear down, the protection effect of the chip layer is improved, and the chip is prevented from being easily bent and damaged.

Description

Technical Field

[0001] The utility model relates to the field of labels, in particular to an anti-interference RFID label. Background Art

[0002] RFID tags are composed of coupling elements and chips. Each RFID tag has a unique electronic code and is attached to an object to identify the target object. It is commonly known as an electronic tag or smart tag. There are many types of RFID tags.

[0003] The announcement number is: CN218568053U, which discloses "an anti-interference RFID tag, including a substrate, the substrate is a double-layer structure, the substrate includes a connecting layer, a heat insulation layer, a first absorbing layer is provided on one side of the substrate, the first absorbing layer and the substrate are located in a position corresponding to each other, and the first absorbing layer is pasted on the connecting layer of the substrate, a chip layer is provided on one side of the first absorbing layer, and the chip layer is pasted on one side of the wall of the first absorbing layer by bonding. The beneficial effects of the utility model: by arranging the substrate, the first absorbing layer and the second absorbing layer, not only can the device have a better heat insulation effect through the substrate, avoiding the high temperature from affecting the normal use of the device, but also the anti-interference ability of the device is improved by the arrangement of the first absorbing layer and the second absorbing layer, so that the device is less affected by electromagnetic waves in a metal environment, avoiding the problem that the reading distance of the device is short due to the metal environment and the use environment is subject to certain restrictions";

[0004] There are still certain disadvantages when using it. The chip layer of the label is made of a relatively hard material. When it is torn off from the surface of the release paper, the chip layer is easily bent. The bent chip layer is not easy to recover. After pasting, there will be a gap between the adhesive layer and the object, causing dust to enter and reducing the adhesion of the chip. In addition, the protective effect of the chip layer is poor and it is easy to bend, causing damage to the chip. Utility Model Content

[0005] In order to overcome the above-mentioned technical problems, the utility model aims to provide an anti-interference RFID tag, which increases the bending resistance of the edge of the printed layer by a protective ring, thereby indirectly improving the bending resistance of the chip layer connected thereto, and further improving the protective effect of the label to prevent the chip layer from being easily bent and damaged. When tearing off the chip layer, hold the edge of the chip layer and pull the connecting piece to separate the release paper from the adhesive layer at the through groove. At the same time, the connection area between the release paper and the adhesive layer is reduced by a spacer, so that when the label is torn off from the surface of the release paper, the chip layer can be prevented from bending, so as to prevent the bent chip layer from leaving a gap with the object after pasting, thereby preventing dust from entering, maintaining the adhesive firmness of the label, and making the label easier to tear off.

[0006] The purpose of the utility model can be achieved through the following technical solutions:

[0007] An anti-interference RFID tag comprises a chip layer, a release paper is fixedly arranged below the chip layer, a spacer is movably arranged on the upper surface of the release paper, a printing layer is fixedly installed on the upper surface of the chip layer, and a protective ring is fixedly embedded and installed on the lower surface of the printing layer.

[0008] Furthermore, the chip layer includes a substrate and a chip, the chip is fixedly mounted on the upper surface of the substrate, and the upper surface of the substrate is symmetrically fixedly connected with an antenna connection line on one side of the chip.

[0009] Furthermore, an antenna is fixedly connected to the upper surface of the substrate at one end of the antenna connecting line, and an adhesive layer is fixedly provided on the lower surface of the substrate.

[0010] Furthermore, the release paper has through grooves symmetrically formed on its upper surface, and a connecting piece is symmetrically fixedly connected to one end surface of the spacer.

[0011] Furthermore, the connecting sheet passes through the through slot, and the release paper and the spacer sheet are both movably bonded to the bonding layer.

[0012] Furthermore, a protective film is fixedly installed on the upper surface of the printing layer.

[0013] Beneficial effects of the utility model:

[0014] 1. The protective ring increases the anti-bending ability of the edge of the printed layer, thereby indirectly improving the anti-bending effect of the chip layer connected to it, and then improving the protection effect of the label to prevent the chip layer from being easily bent and damaged. The protective film protects the printed layer and improves its waterproof and anti-fouling effects.

[0015] 2. When tearing off the chip layer, hold the edge of the chip layer and pull the connecting piece to separate the release paper from the adhesive layer at the through groove. At the same time, the spacer is used to reduce the connection area between the release paper and the adhesive layer. This can prevent the chip layer from bending when the label is torn off the release paper surface, so that there is no gap between the bent chip layer and the object after pasting, which prevents dust from entering, maintains the adhesion of the label, and makes the label easier to tear off. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The utility model is further described below in conjunction with the accompanying drawings.

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the overall split structure of the utility model;

[0019] Figure 3 It is a schematic diagram of the lower surface structure of the printing layer of the utility model;

[0020] Figure 4 It is a schematic diagram of the overall side section structure of the utility model;

[0021] Figure 5 It is a schematic diagram of the separation structure of the release paper and the spacer sheet of the utility model.

[0022] In the figure: 1. chip layer; 101. antenna; 102. antenna connecting line; 103. chip; 104. adhesive layer; 2. release paper; 201. spacer; 202. connecting sheet; 203. through groove; 3. printing layer; 301. protective ring; 302. protective film. DETAILED DESCRIPTION

[0023] The following will be combined with the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1-5 As shown, an anti-interference RFID tag includes a chip layer 1, a release paper 2 is fixedly provided below the chip layer 1, a spacer 201 is movably provided on the upper surface of the release paper 2, a printing layer 3 is fixedly installed on the upper surface of the chip layer 1, and a protective ring 301 is fixedly embedded and installed on the lower surface of the printing layer 3. The protective ring 301 increases the bending resistance at the edge of the printing layer 3, thereby indirectly improving the bending resistance of the chip layer 1 connected thereto, thereby improving the protective effect of the tag to prevent the chip layer 1 from being easily bent and damaged.

[0025] The chip layer 1 includes a substrate and a chip 103. The chip 103 is fixedly mounted on the upper surface of the substrate. The upper surface of the substrate is symmetrically fixedly connected to an antenna connecting line 102 on one side of the chip 103; the upper surface of the substrate is fixedly connected to an antenna 101 on one end of the antenna connecting line 102, and an adhesive layer 104 is fixedly provided on the lower surface of the substrate. The chip layer 1 is movably bonded to the release paper 2 and the spacer 201 through the adhesive layer 104, and the label can be easily bonded to the surface of an object.

[0026] The upper surface of the release paper 2 is symmetrically provided with through grooves 203, and one end surface of the spacer 201 is symmetrically fixedly connected with a connecting piece 202; the connecting piece 202 passes through the through grooves 203, and the release paper 2 and the spacer 201 are both movably bonded to the adhesive layer 104. Before the release paper 2 and the label are compounded, a plurality of through grooves 203 are cut out on the surface of the release paper 2 by a die-cutting mechanism, and the continuous spacer 201 is electrostatically adsorbed on the surface of the release paper 2 so that the connecting piece 202 passes through the through grooves 203, and then the connecting piece 202 is pressed and twisted by a compounding mechanism so that the connecting piece 202 is bent, thereby improving the firmness of the connection between the spacer 201 and the release paper 2, and then the release paper 2 is compounded with the chip layer 1 by the compounding mechanism of the label. The label and the spacer 201 are then cut synchronously by the die-cutting mechanism. When tearing off the chip layer 1, hold the edge of the chip layer 1 and pull the connecting piece 202 to separate the release paper 2 from the adhesive layer 104 at the through groove 203. At the same time, the spacer 201 is used to reduce the connection area between the release paper 2 and the adhesive layer 104, so that when the label is torn off from the surface of the release paper 2, the chip layer 1 can be prevented from bending, so as to prevent the bent chip layer 1 from leaving a gap with the object after pasting, thereby preventing dust from entering, maintaining the adhesion firmness of the label, and making the label easier to tear off. A protective film 302 is fixedly installed on the upper surface of the printing layer 3, and the protective film 302 protects the printing layer 3 to improve its waterproof and anti-fouling effects.

[0027] Working principle: When in use, the protective ring 301 is used to increase the anti-bending ability of the edge of the printing layer 3, thereby indirectly improving the anti-bending effect of the chip layer 1 connected thereto, and then improving the protective effect of the label to prevent the chip layer 1 from being easily bent and damaged. The protective film 302 protects the printing layer 3 to improve its waterproof and anti-fouling effects. The chip layer 1 is movably bonded to the release paper 2 and the spacer 201 through the adhesive layer 104, and the label is easy to bond to the surface of the object. During production, before the release paper 2 and the label are compounded, a plurality of through grooves 203 are cut out on the surface of the release paper 2 by a die-cutting mechanism, and the continuous spacers 201 are electrostatically adsorbed on the surface of the release paper 2, so that the connecting piece 202 passes through the through grooves 203, and then is connected by a compounding mechanism. The sheet 202 is used to bend the connecting sheet 202, thereby improving the firmness of the connection between the spacer sheet 201 and the release paper 2. Then, the release paper 2 and the chip layer 1 are compounded by the label compounding mechanism. Finally, the label and the spacer sheet 201 are synchronously cut by the die-cutting mechanism. When tearing off the chip layer 1, the edge of the chip layer 1 is held and the connecting sheet 202 is pulled to separate the release paper 2 from the adhesive layer 104 at the through groove 203. At the same time, the connection area between the release paper 2 and the adhesive layer 104 is reduced by the spacer sheet 201, so that when the label is torn off from the surface of the release paper 2, the chip layer 1 is prevented from bending, so as to avoid a gap between the bent chip layer 1 and the object after pasting, thereby preventing dust from entering, maintaining the adhesive firmness of the label, and making the label easier to tear off.

[0028] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0029] The above contents are merely examples and explanations of the present utility model. The technicians in this technical field may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the utility model or exceed the scope defined in the claims, they should all fall within the protection scope of the present utility model.

Claims

1. An anti-interference RFID tag, characterized in that: The device comprises a chip layer (1), a release paper (2) is fixedly provided below the chip layer (1), a spacer (201) is movably provided on the upper surface of the release paper (2), a printing layer (3) is fixedly installed on the upper surface of the chip layer (1), and a protective ring (301) is fixedly embedded and installed on the lower surface of the printing layer (3).

2. The anti-interference RFID tag according to claim 1, characterized in that: A protective film (302) is fixedly mounted on the upper surface of the printing layer (3).

3. The anti-interference RFID tag according to claim 1, characterized in that: The chip layer (1) comprises a substrate and a chip (103), wherein the chip (103) is fixedly mounted on the upper surface of the substrate, and an antenna connection line (102) is symmetrically fixedly connected to the upper surface of the substrate located on one side of the chip (103).

4. The anti-interference RFID tag according to claim 2, characterized in that: An antenna (101) is fixedly connected to one end of the antenna connection line (102) on the upper surface of the substrate, and an adhesive layer (104) is fixedly provided on the lower surface of the substrate.

5. The anti-interference RFID tag according to claim 3, characterized in that: The upper surface of the release paper (2) is symmetrically provided with through grooves (203), and one end surface of the spacer (201) is symmetrically fixedly connected with a connecting piece (202).

6. The anti-interference RFID tag according to claim 5, characterized in that: The connecting sheet (202) passes through the through groove (203), and the release paper (2) and the spacer sheet (201) are both movably bonded to the bonding layer (104).

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