Cleaning and packaging mechanism of diode high-voltage silicon stack

Abstract

The utility model relates to the technical field of cleaning and packaging mechanisms, and discloses a cleaning and packaging mechanism of a diode high-voltage silicon stack, which comprises a machine body, supporting legs are arranged at the bottom of the machine body, box doors are connected to two sides of the front end of the machine body through hinges, and an ultrasonic cleaning machine is arranged on the left side of the bottom in the machine body. A supporting top plate is arranged at the top in the machine body, an air cylinder is connected to the lower end of the supporting top plate, a connecting block is connected to the lower end of the air cylinder, a mounting seat is mounted at the bottom of the connecting block, a heating rod is arranged at the bottom of the front end of the mounting seat, and a supporting table is arranged in the machine body and located on the right side of the ultrasonic cleaning machine. According to the utility model, the two mounting seats, the threading holes and the heating rod are arranged and are matched with each other, so that the two ends of the plastic film can be heated and cut off, the efficiency of cutting off the plastic film is improved, the packaging efficiency is further improved, and a notch is smooth.

Description

Technical Field

[0001] The utility model relates to the technical field of cleaning packaging mechanisms, in particular to a cleaning packaging mechanism for a diode high-voltage silicon stack. Background Art

[0002] High-voltage silicon stack is also called silicon column. It is a silicon high-frequency high-voltage rectifier diode. The working voltage is between several thousand volts and tens of thousands of volts. It is often used for high-frequency and high-voltage rectification in black-and-white TVs or other electronic instruments. When cleaning and packaging the diode high-voltage silicon stack, a special cleaning and packaging mechanism is used.

[0003] The existing cleaning and packaging mechanism for the diode high-voltage silicon stack cannot heat and cut off the two ends of the plastic film when in use, resulting in low efficiency in cutting the plastic film, which in turn affects the packaging efficiency, and the film cut is usually uneven. In addition, the existing cleaning and packaging mechanism for the diode high-voltage silicon stack generally sets the cleaning mechanism and the packaging mechanism as a split type, which occupies a large area, and requires running back and forth between the cleaning mechanism and the packaging mechanism during operation, wasting time. Therefore, there is an urgent need for a cleaning and packaging mechanism for the diode high-voltage silicon stack to solve the above technical problems. Utility Model Content

[0004] The purpose of the utility model is to provide a cleaning and packaging mechanism for a diode high-voltage silicon stack to solve the problem that the existing cleaning and packaging mechanism for a diode high-voltage silicon stack proposed in the above-mentioned background technology cannot heat and cut the two ends of the plastic film when in use, resulting in low efficiency in cutting the plastic film, which in turn affects the packaging efficiency, and the film cut is usually uneven. In addition, the existing cleaning and packaging mechanism for a diode high-voltage silicon stack generally sets the cleaning mechanism and the packaging mechanism as a split type, which occupies a large area, and needs to run back and forth between the cleaning mechanism and the packaging mechanism during operation, wasting time.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A cleaning and packaging mechanism for a diode high-voltage silicon stack comprises a body, the bottom of the body is provided with supporting feet, both sides of the front end of the body are connected to box doors through hinges, an ultrasonic cleaning machine is provided on the left side of the inner bottom of the body, a supporting top plate is provided on the inner top of the body, the lower end of the supporting top plate is connected to a cylinder, the lower end of the cylinder is connected to a connecting block, a mounting seat is installed on the bottom of the connecting block, a heating rod is provided on the front bottom of the mounting seat, a supporting platform is provided inside the body and on the right side of the ultrasonic cleaning machine, the top of the supporting platform is connected to a load-bearing platform, a packaging platform is provided in the middle of the top of the load-bearing platform, a supporting seat is provided on the upper left end of the load-bearing platform, a plastic film release roller is connected to the axis of the supporting seat through a bearing, and a heat dissipation port is provided on the lower right side of the body.

[0007] As a preferred technical solution of the utility model, the number of the hinges is set to four, and the four hinges are arranged opposite to each other in pairs with respect to the door.

[0008] As a preferred technical solution of the utility model, the number of the cylinders is set to two, and the two cylinders are symmetrically arranged about the supporting top plate.

[0009] As a preferred technical solution of the utility model, the number of the mounting seat and the heating rod is set to two, and both are symmetrically arranged about the connecting block, and the two heating rods are respectively located on the left and right sides of the packaging platform.

[0010] As a preferred technical solution of the utility model, a dustproof net is arranged in the heat dissipation port, and a threading hole is opened on the mounting seat.

[0011] As a preferred technical solution of the present utility model, the number of the supporting legs is set to four.

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] 1. The utility model provides two mounting seats, threading holes and a heating rod, and utilizes the cooperation between them to heat and cut off the two ends of the plastic film, thereby improving the efficiency of cutting the plastic film, thereby improving the packaging efficiency, and the incision is smooth.

[0014] 2. The utility model integrates the cleaning mechanism and the packaging mechanism, which saves floor space and eliminates the need to run back and forth between the cleaning mechanism and the packaging mechanism, thus saving time. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a schematic cross-sectional view of the overall structure of the utility model;

[0018] Figure 3 It is a right side cross-sectional structural schematic diagram of the connection relationship between the mounting seat, the heating rod and the threading hole of the utility model.

[0019] In the figure: 1. machine body; 2. hinge; 3. door; 4. support foot; 5. ultrasonic cleaning machine; 6. support top plate; 7. cylinder; 8. connecting block; 9. mounting seat; 10. heating rod; 11. load-bearing platform; 12. heat dissipation port; 13. dustproof net; 14. support platform; 15. packaging platform; 16. support seat; 17. plastic film release roller; 18. threading hole. DETAILED DESCRIPTION

[0020] The present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are only used to explain the relevant utility model, rather than to limit the utility model. It should also be noted that, for ease of description, only the parts related to the utility model are shown in the accompanying drawings. The different types of section lines in the drawings in the embodiments of the utility model are not marked according to the national standard, nor are there any requirements for the materials of the components, but are used to distinguish the cross-sectional views of the components in the drawings.

[0021] See also Figure 1-3 A cleaning and packaging mechanism for a diode high-voltage silicon stack includes a body 1, a support foot 4 is arranged at the bottom of the body 1, a box door 3 is connected to both sides of the front end of the body 1 through a hinge 2, an ultrasonic cleaning machine 5 is arranged on the left side of the inner bottom of the body 1, and the model of the ultrasonic cleaning machine 5 is DL-720E, a supporting top plate 6 is arranged at the inner top of the body 1, a cylinder 7 is connected to the lower end of the supporting top plate 6, a connecting block 8 is connected to the lower end of the cylinder 7, a mounting seat 9 is installed at the bottom of the connecting block 8, and a heating rod 10 is arranged at the bottom of the front end of the mounting seat 9, and the heating rod 10 is arranged at the bottom of the front end of the mounting seat 9. Due to the mutual cooperation between them, the two ends of the plastic film can be heated and cut off, the efficiency of cutting the plastic film is improved, and then the packaging efficiency is improved, and the incision is smooth. A support platform 14 is arranged inside the body 1 and on the right side of the ultrasonic cleaning machine 5. The top of the support platform 14 is connected to a load-bearing platform 11, and a packaging platform 15 is arranged in the middle of the top of the load-bearing platform 11. A support seat 16 is arranged at the upper left end of the load-bearing platform 11, and a plastic film release roller 17 is connected to the axis of the support seat 16 through a bearing, and a heat dissipation port 12 is opened on the lower right side of the body 1.

[0022] The number of hinges 2 is four, and the four hinges 2 are arranged opposite to each other in pairs with respect to the door 3 .

[0023] The number of the cylinders 7 is set to two, and the two cylinders 7 are symmetrically arranged about the supporting top plate 6 .

[0024] There are two mounting seats 9 and two heating rods 10 , which are both symmetrically arranged about the connecting block 8 . The two heating rods 10 are respectively located on the left and right sides of the packaging platform 15 .

[0025] A dustproof net 13 is provided in the heat dissipation port 12 , and a threading hole 18 is provided on the mounting seat 9 .

[0026] The number of the supporting legs 4 is set to four.

[0027] The working principle and use process of the utility model are as follows: first, open the cover plate on the top of the ultrasonic cleaning machine 5, place the diode high-voltage silicon stack in the ultrasonic cleaning machine 5 for cleaning, and place the packaging plastic film roll on the plastic film release roller 17, and then place the clean diode high-voltage silicon stack on the packaging table 15, and then manually pull the plastic film on the packaging plastic film roll to the right and pass it through the upper surface of the diode high-voltage silicon stack on the packaging table 15. At this time, the two heating rods 10 are powered on to heat up, and the two cylinders 7 are started to drive the mounting seat 9 on the connecting block 8 to move downward, so that the two heating rods 10 heat and cut the plastic films on both sides of the packaging table 15, thereby improving the efficiency of cutting the plastic films, thereby improving the packaging efficiency, and the incision is smooth, and the plastic films on both sides will automatically shrink and adsorb on the back of the diode high-voltage silicon stack to form a covering package after being cut;

[0028] The cleaning mechanism and the packaging mechanism are integrated into one body, which saves floor space and eliminates the need to run back and forth between the cleaning mechanism and the packaging mechanism, thus saving time. Contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0029] The above description is only a preferred embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the utility model involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the concept of the utility model. For example, the above features are replaced with the technical features with similar functions disclosed in the present application (but not limited to) by each other to form a technical solution.

Claims

1. A cleaning and packaging mechanism for a diode high voltage silicon stack, comprising a body (1), characterized in that: The bottom of the machine body (1) is provided with supporting feet (4), both sides of the front end of the machine body (1) are connected to cabinet doors (3) via hinges (2), an ultrasonic cleaning machine (5) is provided on the left side of the inner bottom of the machine body (1), a supporting top plate (6) is provided on the inner top of the machine body (1), the lower end of the supporting top plate (6) is connected to a cylinder (7), the lower end of the cylinder (7) is connected to a connecting block (8), a mounting seat (9) is installed at the bottom of the connecting block (8), and the front bottom of the mounting seat (9) is provided with a mounting seat (9). A heating rod (10) is provided, a support platform (14) is provided inside the body (1) and on the right side of the ultrasonic cleaning machine (5), the top of the support platform (14) is connected to a load-bearing platform (11), a packaging platform (15) is provided in the middle of the top of the load-bearing platform (11), a support seat (16) is provided at the upper left end of the load-bearing platform (11), a plastic film release roller (17) is connected to the axis of the support seat (16) via a bearing, and a heat dissipation port (12) is provided on the lower right side of the body (1).

2. The cleaning and packaging mechanism for a diode high voltage silicon stack according to claim 1, characterized in that: The number of the hinges (2) is set to four, and the four hinges (2) are arranged in pairs relative to the cabinet door (3).

3. The cleaning and packaging mechanism for a diode high voltage silicon stack according to claim 1, characterized in that: The number of the cylinders (7) is set to two, and the two cylinders (7) are arranged symmetrically about the left and right axes with respect to the supporting top plate (6).

4. The cleaning and packaging mechanism for a diode high voltage silicon stack according to claim 1, characterized in that: The number of the mounting seats (9) and the heating rods (10) is set to two, and both are arranged symmetrically about the left and right axes of the connecting block (8), and the two heating rods (10) are respectively located on the left and right sides of the packaging platform (15).

5. The cleaning and packaging mechanism for a diode high voltage silicon stack according to claim 1, characterized in that: A dustproof net (13) is provided in the heat dissipation port (12), and a threading hole (18) is provided on the mounting seat (9).

6. The cleaning and packaging mechanism for a diode high voltage silicon stack according to claim 1, characterized in that: The number of the supporting legs (4) is set to four.

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