Multi-channel signal control circuit and plasma diagnosis system

Abstract

The utility model relates to the technical field of power electronics, in particular to a multipath signal control circuit and a plasma diagnosis system. The multi-channel signal control circuit is used for sending control signals to a plurality of target devices, and comprises a master control chip, multi-channel signal isolation modules and a plurality of first sub-control chips in one-to-one correspondence with the signal isolation modules, the master control chip comprises a first control signal output end and a plurality of chip selection signal output ends; the first control signal output end is connected with the plurality of signal isolation modules at the same time; the plurality of chip selection signal output ends are connected with the plurality of signal isolation modules in a one-to-one correspondence manner; the signal isolation module transmits a first control signal output by the first control signal output end to the corresponding sub-control chip under the enabling of the corresponding chip selection signal output end; the master control chip can realize control of a plurality of target devices through combination of one signal output end and the chip selection chip, and the isolation module can realize signal isolation between the sub-control chips and the master control chip.

Description

Technical Field

[0001] The utility model relates to the technical field of power electronics, in particular to a multi-channel signal control circuit and a plasma diagnosis system. Background Art

[0002] As an important component that boosts low-voltage DC power to the required high bias voltage, high-voltage power supply is widely used in many fields. For example, in the field of plasma diagnosis, some semiconductor radiation detectors usually require a very high bias voltage (800V) to maintain the working state, and this voltage needs to be generated by a high-voltage power supply; in addition, some other detectors, such as photomultiplier tubes, have an output gain that is directly related to the bias voltage, so it is also necessary to control the high-voltage bias voltage to control its working gain.

[0003] In some application scenarios, multiple high-voltage power supplies may need to be deployed to achieve multiple applications. In this case, how to control the independent operation of multiple high-voltage power supplies becomes a technical problem that needs to be solved urgently. Utility Model Content

[0004] In view of this, the utility model provides a multi-channel signal control circuit and a plasma diagnostic system to solve the problem that multiple high-voltage power supplies cannot work independently.

[0005] In the first aspect, the utility model provides a multi-channel signal control circuit for sending control signals to multiple target devices, including: a main control chip and a multi-channel signal isolation module and multiple first sub-control chips corresponding one-to-one to the signal isolation modules; the main control chip includes a first control signal output terminal and multiple chip select signal output terminals; the first control signal output terminal is simultaneously connected to multiple signal isolation modules; the multiple chip select signal output terminals are connected one-to-one to multiple signal isolation modules; the signal isolation module transmits the first control signal output from the first control signal output terminal to the corresponding first sub-control chip when the corresponding chip select signal output terminal is enabled, so that the first sub-control chip outputs a second control signal to the target device.

[0006] As an exemplary embodiment, each of the signal isolation modules includes an isolated communication interface, and the isolated communication interface includes a first isolated communication chip, an isolation device and a second isolated communication chip; the first isolated communication chip is connected to the main control chip, the second isolated communication chip is connected to the first sub-control chip, and the first isolated communication chip and the second isolated communication chip are connected through the isolation device.

[0007] As an exemplary embodiment, each of the first isolated communication chips is provided with a first signal receiving end and a first chip select signal receiving end, and the second isolated communication chip is provided with a first signal forwarding end; the first signal receiving end is connected to the first control signal output end, and the first chip select signal receiving end is connected to the chip select signal output end; the first signal forwarding end is connected to the first sub-control chip.

[0008] As an exemplary embodiment, the first sub-control chip includes a digital-to-analog conversion chip; the digital-to-analog conversion chip is provided with a second signal receiving end and a second control signal output end; the second signal receiving end is connected to the first signal forwarding end; the first sub-control chip outputs the second control signal through the second control signal output end.

[0009] As an exemplary embodiment, the second isolation communication chip is further provided with a chip select signal forwarding end, and the first sub-control chip is further provided with a second chip select signal receiving end; the chip select signal forwarding end and the second chip select signal receiving end are connected.

[0010] As an exemplary embodiment, the multi-channel signal control circuit also includes a second sub-control chip; the second sub-control chip is connected to the target device and the second isolated communication chip, and is used to collect the feedback signal of the target device and transmit the feedback signal of the target device to the main control chip.

[0011] As an exemplary embodiment, the second sub-control chip includes an analog-to-digital conversion chip, the analog-to-digital conversion chip includes a feedback signal acquisition end and a feedback signal sending end, the second isolation communication chip is provided with a second signal sending end and a third signal receiving end, the first isolation communication chip is provided with a second signal forwarding end, and the main control chip is provided with a feedback signal receiving end; the feedback signal acquisition end is connected to the target device; the feedback signal sending end is connected to the third signal receiving end; the second signal sending end is connected to the first isolation communication chip; and the second signal forwarding end is connected to the feedback signal receiving end.

[0012] As an exemplary embodiment, the analog-to-digital conversion chip also includes a chip select signal transmitting end, and the second isolation communication chip is provided with a third chip select signal receiving end; the chip select signal transmitting end is connected to the third chip select signal receiving end.

[0013] As an exemplary embodiment, the signal isolation module further includes a radio frequency coaxial connector; the radio frequency coaxial connector is connected between the isolation device and the second isolation communication chip.

[0014] In a second aspect, the utility model provides a plasma diagnostic system, comprising a plurality of detectors, a plurality of high-voltage power supplies corresponding one-to-one to the detectors, and a multi-channel signal control circuit as described in any one of the above items, wherein the control ends of the high-voltage power supplies are respectively connected one-to-one to the first sub-control chips in the multi-channel signal control circuit.

[0015] The utility model provides a multi-channel signal control circuit for sending control signals to multiple target devices, including: a main control chip and a multi-channel signal isolation module and a sub-control chip corresponding to the signal isolation module one by one; the main control chip includes a first control signal output terminal and multiple chip selection signal output terminals; the first control signal output terminal is connected to multiple signal isolation modules at the same time; the multiple chip selection signal output terminals are connected to multiple signal isolation modules one by one; the signal isolation module transmits the control signal output by the first control signal output terminal to the first sub-control chip under the enablement of the corresponding chip selection signal output terminal, so that the first sub-control chip outputs a second control signal to the target device; according to the above connection relationship, the main control chip can realize the control of multiple target devices by combining a signal output terminal and a chip selection chip, and by changing the enable state of the chip selection signal output terminal, so as to realize the independent operation of multiple target devices under the premise of saving the use of the control chip pins, and the isolation module is connected between the main control chip and the sub-control chip, which can realize the signal isolation between the sub-control chip and the main control chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a schematic diagram of a multi-channel signal control circuit according to an embodiment of the utility model;

[0018] Figure 2 is another schematic diagram of a multi-channel signal control circuit according to an embodiment of the utility model;

[0019] Figure 3 A schematic diagram showing an implementation of a signal isolation module according to an embodiment of the utility model is shown;

[0020] Figure 4 is a schematic diagram of another implementation of the signal isolation module according to an embodiment of the utility model;

[0021] Figure 5 is a schematic diagram of an implementation of a first sub-control chip according to an embodiment of the utility model;

[0022] Figure 6 is a schematic diagram of another implementation of the first sub-control chip according to an embodiment of the utility model;

[0023] Figure 7 is a schematic diagram of another implementation of a multi-channel signal control circuit according to an embodiment of the utility model;

[0024] Figure 8 is a schematic diagram of an implementation of a second control sub-chip according to an embodiment of the utility model;

[0025] Fig. 9 is a schematic diagram of an implementation of a second control sub-chip according to an embodiment of the utility model;

[0026] Fig.10 It is a circuit connection diagram of a schematic multi-channel signal control circuit according to an embodiment of the utility model.

[0027] Attached figure mark: 100, main control chip; 110, first control signal output terminal; 120, chip select signal output terminal; 130, feedback signal receiving terminal; 200, signal isolation module; 210, first isolation communication chip; 211, first signal receiving terminal; 212, first chip select signal receiving terminal; 213, second signal forwarding terminal; 220, isolation device; 230, second isolation communication chip; 231, first signal forwarding terminal; 232, chip select signal forwarding terminal; 233, third signal receiving terminal; 234, second signal sending terminal; 240 RF coaxial connector; 30, first sub-control chip; 310, second signal receiving terminal; 320, second control signal output terminal; 330, second chip select signal receiving terminal; 40, second sub-control chip; 410, feedback signal sending terminal; 420, feedback signal acquisition terminal. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0029] In a first aspect, the utility model provides a multi-channel signal control circuit for sending control signals to multiple target devices; Figure 1is a schematic diagram of a multi-channel signal control circuit according to an embodiment of the utility model, Figure 2 is another schematic diagram of a multi-channel signal control circuit according to an embodiment of the utility model, such as Figure 1 , Figure 2 As shown, the multi-channel signal control circuit includes: a general control chip 100 and a multi-channel signal isolation module 200, and a plurality of first sub-control chips 30 corresponding to the signal isolation modules 200. The general control chip 100 includes a first control signal output terminal 110 and a plurality of chip selection signal output terminals 120; the first control signal output terminal 110 is connected to the plurality of signal isolation modules 200 at the same time; the plurality of chip selection signal output terminals 120 are connected to the plurality of signal isolation modules 200 in a one-to-one correspondence; each of the signal isolation modules 200 transmits the first control signal output from the first control signal output terminal 110 to the corresponding first sub-control chip 30 when the corresponding chip selection signal output terminal 120 is enabled, so that the first sub-control chip 30 outputs a second control signal to the target device.

[0030] In this embodiment, the main control chip 100 includes a first control signal output terminal 110 and multiple chip select signal output terminals 120, and the multiple chip select signal output terminals 120 are connected one by one to the multiple signal isolation modules 200; the main control chip 100 can change the enable state of the signal isolation module 200 by changing the level state of the chip select signal output terminal 120; the signal isolation module 200 transmits the first control signal output by the first control signal output terminal 110 to the first sub-control chip 30 when the corresponding chip select signal output terminal 120 is enabled, so that the first sub-control chip 30 outputs a second control signal to the target device.

[0031] On the other hand, the signal isolation module 200 is connected between the overall control chip 100 and the first sub-control chip 30 , so as to achieve high-voltage signal isolation between the first sub-control chip 30 and the overall control chip 100 .

[0032] Exemplarily, the main control chip 100 can be a single-chip control chip, which realizes the connection with the signal isolation module 200 by means of a serial peripheral interface (SPI) communication mode; Exemplarily, the technical solution of the utility model is described by taking the single-chip control chip as a microcontroller of a Raspberry Pi and the target device as a high-voltage power supply as an example. Specifically, the microcontroller includes a MOSI (Master Input Slave Output) terminal and multiple CS (Chip Select) terminals, the MOSI terminal serving as a first control signal output terminal 110, and multiple CS terminals serving as multiple chip select signal output terminals 120; each CS terminal is connected to multiple signal isolation modules 200 in a one-to-one correspondence, and the signal isolation module 200 transmits the first control signal output from the MOSI terminal to the first sub-control chip 30 when the corresponding CS terminal is enabled, so that the first sub-control chip 30 outputs a second control signal to the high-voltage power supply. Other types of single-chip microcomputers are also applicable.

[0033] According to the above connection relationship, the main control chip 100 can realize the control of multiple target devices through the combination of one signal output terminal and the chip select chip, by changing the enable state of the chip select signal output terminal 120, so as to realize the independent operation of multiple target devices under the premise of saving the use of the control chip pins, and the signal isolation module 200 is connected between the main control chip 100 and the first sub-control chip 30, so as to realize the high-voltage isolation of the signal between the first sub-control chip 30 and the main control chip 100.

[0034] As an exemplary embodiment, Figure 3 FIG. 1 is a schematic diagram showing an implementation of a signal isolation module according to an embodiment of the present utility model. Figure 3 As shown, each of the signal isolation modules 200 includes an isolated communication interface. The isolated communication interface includes a first isolated communication chip 210, an isolation device 220, and a second isolated communication chip 230; the first isolated communication chip 210 is connected to the overall control chip 100, the second isolated communication chip 230 is connected to the first sub-control chip 30, and the first isolated communication chip 210 and the second isolated communication chip 230 are connected through the isolation device 220.

[0035] In this embodiment, the isolated communication interface includes a first isolated communication chip 210, an isolation device 220 and a second isolated communication chip 230, so as to achieve signal isolation between the main control chip 100 and the first sub-control chip 30 through the connection between the first isolated communication chip 210, the isolation device 220 and the second isolated communication chip 230.

[0036] Exemplarily, the isolation device 220 may include a network port transformer.

[0037] The above signal isolation method can improve the stability, reliability and safety of the system. Isolation can prevent interference or faults from spreading to other parts, avoid electrical interconnection between different positions, maintain signal purity, and reduce potential dangers to operators or other circuits. In addition, isolation also helps to ensure independent operation and interconnection between different parts, ensure the compatibility of various parts of the system, and thus maintain the stable operation of the entire system.

[0038] As an exemplary embodiment, Figure 4 is a schematic diagram of another implementation of the signal isolation module according to an embodiment of the utility model, such as Figure 4 As shown, each of the first isolated communication chips 210 is provided with a first signal receiving terminal 211 and a first chip select signal receiving terminal 212, and the second isolated communication chip 230 is provided with a first signal forwarding terminal 231; the first signal receiving terminal 211 is connected to the first control signal output terminal 110, and the first chip select signal receiving terminal 212 is connected to the chip select signal output terminal 120; the first signal forwarding terminal 231 is connected to the first sub-control chip 30.

[0039] In this embodiment, the first isolated communication chip 210 is provided with a first signal receiving terminal 211 and a first chip select signal receiving terminal 212, and the second isolated communication chip 230 is provided with a first signal forwarding terminal 231; the first control signal is output to the first isolated communication chip 210 by connecting the first control signal output terminal 110 of the general control chip 100 and the first signal receiving terminal 211 of the first isolated communication chip 210; the chip select signal is output to the first isolated communication chip 210 by connecting the chip select signal output terminal 120 of the general control chip 100 and the first chip select signal receiving terminal 212 of the first isolated communication chip 210; the first control signal is further sent to the second isolated communication chip 230 through the first isolated communication chip 210, and finally the control signal is forwarded to the first sub-control chip 30 through the connection between the first signal forwarding terminal 231 of the second isolated communication chip 230 and the first sub-control chip 30.

[0040] As an exemplary embodiment, Figure 5 is a schematic diagram of an implementation of the first sub-control chip 30 according to an embodiment of the utility model, such as Figure 5As shown, the first sub-control chip 30 includes a digital-to-analog conversion chip; the digital-to-analog conversion chip is provided with a second signal receiving terminal 310 and a second control signal output terminal 320; the second signal receiving terminal 310 is connected to the first signal forwarding terminal 231; the first sub-control chip 30 outputs the second control signal through the second control signal output terminal 320.

[0041] In this embodiment, the first control signal is forwarded to the first sub-control chip 30 through the connection between the second signal receiving terminal 310 and the first signal forwarding terminal 231, and the first sub-control chip 30 outputs the second control signal through the second control signal output terminal 320 to output the second control signal to the target device.

[0042] In this embodiment, a first control signal is output to a target device through a digital-to-analog conversion chip. Since the signal output accuracy of the digital-to-analog conversion chip is much higher than the signal output accuracy of the overall control chip 100, the second control signal output by the digital-to-analog conversion chip can be used to control many post-circuits that require precise control signals, and has great application in high-voltage control signals.

[0043] As an exemplary embodiment, Figure 6 is a schematic diagram of another implementation of the first sub-control chip 30 according to an embodiment of the utility model, such as Figure 6 As shown, the second isolation communication chip 230 is further provided with a chip selection signal forwarding terminal 232, and the first sub-control chip 30 is further provided with a second chip selection signal receiving terminal 330; the chip selection signal forwarding terminal 232 and the second chip selection signal receiving terminal 330 are connected.

[0044] In this embodiment, the chip select signal is output to the first isolated communication chip 210 by connecting the chip select signal output terminal 120 of the main control chip 100 and the first chip select signal receiving terminal 212 of the first isolated communication chip 210; further, the chip select signal is sent to the second isolated communication chip 230 through the first isolated communication chip 210, and finally the chip select signal is forwarded to the first sub-control chip 30 through the chip select signal forwarding terminal 232 of the second isolated communication chip 230 and the second chip select signal receiving terminal 330 of the first sub-control chip 30.

[0045] As an exemplary embodiment, Figure 7 FIG. 1 is a schematic diagram of another implementation of a multi-channel signal control circuit according to an embodiment of the present utility model. Figure 7 As shown, the multi-channel signal control circuit also includes a second sub-control chip 40; the second sub-control chip 40 is connected to the target device and the second isolated communication chip 230, and is used to collect the feedback signal of the target device and transmit the feedback signal of the target device to the main control chip 100.

[0046] In this embodiment, the feedback signal of the target device may include a control signal of the target device, and may also include a feedback signal generated after the target device responds to the control signal; wherein, the feedback signal generated after the target device responds to the control signal may include a signal used to characterize the working state of the target device; the second sub-control chip 40 collects the feedback signal of the target device and transmits the feedback signal of the target device to the main control chip 100.

[0047] As an exemplary embodiment, Figure 8 is a schematic diagram of an implementation of a second control sub-chip according to an embodiment of the utility model, such as Figure 8 As shown, the second sub-control chip 40 includes an analog-to-digital conversion chip, and the analog-to-digital conversion chip includes a feedback signal acquisition terminal 420 and a feedback signal sending terminal 410. The second isolated communication chip 230 is provided with a second signal sending terminal 234 and a third signal receiving terminal 233. The first isolated communication chip 210 is provided with a second signal forwarding terminal 213, and the main control chip 100 is provided with a feedback signal receiving terminal 130; the feedback signal acquisition terminal 420 is connected to the target device; the feedback signal sending terminal 410 is connected to the third signal receiving terminal 233; the second signal sending terminal 234 is connected to the first isolated communication chip 210; and the second signal forwarding terminal is connected to the feedback signal receiving terminal 130.

[0048] In this embodiment, the analog-to-digital conversion chip collects feedback signals by connecting the feedback signal acquisition terminal 420 with the target device, and transmits the feedback signal to the second isolated communication chip 230 by connecting the feedback signal sending terminal 410 with the third signal receiving terminal 233 of the second isolated communication chip 230. Furthermore, the feedback signal is transmitted to the first isolated communication chip 210 by connecting the second signal sending terminal 234 with the first isolated communication chip 210. Finally, the first signal isolation module 200 forwards the feedback signal to the main control chip 100 through the second signal forwarding terminal 213 of the first isolated communication chip 210 and the feedback signal receiving terminal 130.

[0049] The above-mentioned connection method of this embodiment collects the feedback signal of the target device through the analog-to-digital conversion chip. The signal collection accuracy of the digital-to-analog conversion chip is much higher than the signal collection accuracy of the main control chip 100; and the digital-to-analog conversion chip and the analog-to-digital conversion chip use the same set of communication lines, and the output of the digital-to-analog conversion chip can be collected in real time through the analog-to-digital conversion chip, saving the occupancy of the chip pins, and at the same time ensuring that the same signal will not be interfered with by other signals.

[0050] Therefore, further, as an exemplary embodiment, the analog-to-digital conversion chip also includes a chip select signal transmitting end, and the second isolation communication chip 230 is provided with a third chip select signal receiving end; the chip select signal transmitting end is connected to the third chip select signal receiving end.

[0051] As an exemplary embodiment, Fig. 9 is a schematic diagram of an implementation of a second control sub-chip according to an embodiment of the utility model, such as Fig. 9 As shown, the signal isolation module 200 further includes a radio frequency coaxial connector 240 ; the radio frequency coaxial connector 240 is connected between the isolation device 220 and the second isolation communication chip 230 .

[0052] As a specific application embodiment of the present invention, Fig.10 is a schematic circuit connection diagram of a multi-channel signal control circuit according to an embodiment of the utility model; Fig.10 As shown:

[0053] In this embodiment, when controlling the target device, the master control chip 100 selects the corresponding CS terminal according to the target device, and communicates with the MOSI terminal and SCK terminal of the corresponding first isolated communication chip 210 through the MOSI terminal and SCK terminal of the master control chip 100 to transmit the control signal, and transmits the chip select signal through the CS terminal of the master control chip and the CS terminal of the corresponding first isolated communication chip 210; after receiving the control signal and the chip select signal, the first isolated communication chip 210 communicates through the IP terminal and IM terminal of the first isolated communication chip 210, the isolation device 220, the RF coaxial connector 240 and the second isolated communication chip 230 to send the control signal and the chip select signal to the isolation chip 210. Communication chip; wherein the MSTR terminal of the first isolated communication chip 210 is connected to a 5V power supply, and the MSTR terminal of the second isolated communication chip 230 is grounded, so that the first isolated communication chip 210 is the master terminal and the second isolated communication chip 230 is the controlled terminal; after the second isolated communication chip 230 receives the control signal and the chip select signal through the IP terminal and the IM terminal, the control signal and the chip select signal are forwarded to the first sub-control chip 30 through the connection of the MOSI terminal, the SCK terminal and the CS terminal with the SDIN / SDA terminal, the SYNC / A0 terminal, and the SCLK#SCL terminal of the first sub-control chip 30; the first sub-control chip 30 outputs the second control signal to the target device through the VOUT terminal.

[0054] In this embodiment, when the target device is controlled, the second sub-control chip 40 collects the feedback signal of the target device through the APIN terminal; wherein the feedback signal may include the control signal of the target device, and may also include the feedback signal generated by the target device in response to the control signal; and transmits the feedback signal and the chip select signal to the second isolated communication chip 230 through the connection of the SLCK terminal, DOUT terminal and CSNVST terminal of the second sub-control chip 40 with the MISO terminal, SCK terminal and CS terminal of the second isolated communication chip 230; when the second isolated communication chip 230 receives the feedback signal and the chip select signal, the feedback signal and the chip select signal are transmitted to the second isolated communication chip 230 through the second isolated communication chip 2 The IP end and IM end of 30, the isolation device 220, the RF coaxial connector 240 and the first isolation communication chip 210 communicate, and send the feedback signal and the chip select signal to the first isolation communication chip 210; after receiving the feedback signal and the chip select signal, the first isolation communication chip 210 forwards the feedback signal and the chip select signal to the main control chip 100 through the connection of the MISO end, SCK end, CS end of the first isolation communication chip 210 with the MISO end, SCK end, CS end of the main control chip 100; after receiving the feedback signal and the chip select signal, the main control chip 100 determines the target device for sending the feedback signal according to the chip select signal.

[0055] In the above implementation mode of this embodiment, the main control chip 100 can realize the control of multiple target devices through the combination of one signal output terminal and the chip select chip, by changing the enable state of the chip select signal output terminal 120, so as to realize the independent operation of multiple target devices under the premise of saving the use of the control chip pins, and the isolation module is connected between the main control chip 100 and the sub-control chip, which can realize the signal isolation between the sub-control chip and the main control chip 100.

[0056] The above signal isolation method can, on the one hand, improve the stability, reliability and safety of the system. Isolation can prevent interference or faults from spreading to other parts, avoid electrical interconnection between different positions, maintain signal purity, and reduce potential dangers to operators or other circuits. In addition, isolation also helps to ensure independent operation and interconnection between different parts, ensure the compatibility of various parts of the system, and thus maintain the stable operation of the entire system.

[0057] In addition, a control signal is output to the target device through the first sub-control chip 30 which is a digital-to-analog conversion chip. Since the signal output accuracy of the digital-to-analog conversion chip is much higher than the signal output accuracy of the main control chip 100, the second control signal output by the digital-to-analog conversion chip can be used to control many post-circuits that require precise control signals, and has good application in high-voltage control signals.

[0058] In addition, the feedback signal of the target device is collected by the second sub-control chip 40 as an analog-to-digital conversion chip. The signal collection accuracy of the digital-to-analog conversion chip is much higher than that of the main control chip 100.

[0059] Finally, the digital-to-analog conversion chip and the analog-to-digital conversion chip use the same set of communication lines, which can collect the output of the digital-to-analog conversion chip through the analog-to-digital conversion chip in real time, saving chip pins and ensuring that the same signal will not be interfered with by other signals.

[0060] In a second aspect, the utility model provides a plasma diagnostic system, comprising a plurality of detectors, a plurality of high-voltage power supplies corresponding one-to-one to the detectors, and a multi-channel signal control circuit as described in any one of the above items, wherein the control ends of the high-voltage power supplies are respectively connected one-to-one to the first sub-control chips in the multi-channel signal control circuit.

[0061] In the above implementation mode, the main control chip 100 in the multi-channel signal control circuit can realize the control of multiple target devices through the combination of one signal output terminal and the chip select chip, by changing the enable state of the chip select signal output terminal 120, so as to realize the independent operation of multiple target devices under the premise of saving the use of the control chip pins, and the isolation module is connected between the main control chip 100 and the sub-control chip, which can realize the signal isolation between the sub-control chip and the main control chip 100.

[0062] The signal isolation module 200 in the multi-channel signal control circuit can improve the stability, reliability and safety of the system. Isolation can prevent interference or faults from spreading to other parts, avoid electrical interconnection between different positions, maintain signal purity, and reduce potential dangers to operators or other circuits. In addition, isolation also helps to ensure independent operation and interconnection between different parts, ensure the compatibility of various parts of the system, and thus maintain the stable operation of the entire system.

[0063] In addition, a control signal is output to the target device through the first sub-control chip 30, which serves as a digital-to-analog conversion chip in the multi-channel signal control circuit. Since the signal output accuracy of the digital-to-analog conversion chip is much higher than the signal output accuracy of the main control chip 100, the second control signal output by the digital-to-analog conversion chip is sufficient to control many post-circuits that require precise control signals, and is well applied in high-voltage control signals.

[0064] In addition, the feedback signal of the target device is collected by the second sub-control chip 40 as an analog-to-digital conversion chip in the multi-channel signal control circuit. The signal collection accuracy of the digital-to-analog conversion chip is much higher than that of the main control chip 100.

[0065] Finally, the digital-to-analog conversion chip and the analog-to-digital conversion chip in the multi-channel signal control circuit use the same set of communication lines, which can collect the output of the digital-to-analog conversion chip through the analog-to-digital conversion chip in real time, saving chip pins and ensuring that the same signal will not be interfered with by other signals.

[0066] Optionally, the specific examples in this embodiment may refer to the examples described in the above embodiments, and this embodiment will not be described in detail here.

[0067] The serial numbers of the above-mentioned embodiments of the present application are for description only and do not represent the advantages or disadvantages of the embodiments.

[0068] The above are only preferred implementations of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

[0069] In the above embodiments of the present application, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, please refer to the relevant description of other embodiments.

[0070] The above are only preferred implementations of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A multi-channel signal control circuit, characterized in that: Used to send control signals to multiple target devices, including: a main control chip and a multi-channel signal isolation module and a plurality of first sub-control chips corresponding to the signal isolation modules one by one; The master control chip comprises a first control signal output terminal and a plurality of chip selection signal output terminals; The first control signal output terminal is connected to a plurality of the signal isolation modules at the same time; The plurality of chip selection signal output terminals are connected to the plurality of signal isolation modules in a one-to-one correspondence; When the corresponding chip select signal output terminal is enabled, the signal isolation module transmits the first control signal outputted from the first control signal output terminal to the corresponding first sub-control chip, so that the first sub-control chip outputs a second control signal to the target device.

2. The multi-channel signal control circuit according to claim 1, characterized in that: Each of the signal isolation modules includes an isolated communication interface, and the isolated communication interface includes a first isolated communication chip, an isolation device, and a second isolated communication chip; The first isolated communication chip is connected to the main control chip, the second isolated communication chip is connected to the first sub-control chip, and the first isolated communication chip and the second isolated communication chip are connected through the isolation device.

3. The multi-channel signal control circuit according to claim 2, characterized in that: Each of the first isolated communication chips is provided with a first signal receiving end and a first chip selection signal receiving end, and each of the second isolated communication chips is provided with a first signal forwarding end; The first signal receiving end is connected to the first control signal output end, and the first chip selection signal receiving end is connected to the chip selection signal output end; The first signal forwarding terminal is connected to the first sub-control chip.

4. The multi-channel signal control circuit according to claim 3, characterized in that: The first sub-control chip includes a digital-to-analog conversion chip; the digital-to-analog conversion chip is provided with a second signal receiving end and a second control signal output end; The second signal receiving end is connected to the first signal forwarding end; The first sub-control chip outputs the second control signal through the second control signal output terminal.

5. The multi-channel signal control circuit according to claim 4, characterized in that: The second isolation communication chip is further provided with a chip selection signal forwarding terminal, and the first sub-control chip is further provided with a second chip selection signal receiving terminal; The chip select signal forwarding end is connected to the second chip select signal receiving end.

6. The multi-channel signal control circuit according to claim 2, characterized in that: The multi-channel signal control circuit also includes a second sub-control chip; The second sub-control chip is connected to the target device and the second isolated communication chip, and is used for collecting the feedback signal of the target device and transmitting the feedback signal of the target device to the main control chip.

7. The multi-channel signal control circuit according to claim 6, characterized in that: The second sub-control chip includes an analog-to-digital conversion chip, the analog-to-digital conversion chip includes a feedback signal acquisition terminal and a feedback signal sending terminal, the second isolation communication chip is provided with a second signal sending terminal and a third signal receiving terminal, the first isolation communication chip is provided with a second signal forwarding terminal, and the main control chip is provided with a feedback signal receiving terminal; The feedback signal acquisition end is connected to the target device; The feedback signal sending end is connected to the third signal receiving end; The second signal sending end is connected to the first isolation communication chip; The second signal forwarding end is connected to the feedback signal receiving end.

8. The multi-channel signal control circuit according to claim 7, characterized in that: The analog-to-digital conversion chip also includes a chip select signal sending end, and the second isolation communication chip is provided with a third chip select signal receiving end; the chip select signal sending end is connected to the third chip select signal receiving end.

9. The multi-channel signal control circuit according to claim 2, characterized in that: The signal isolation module also includes a radio frequency coaxial connector; the radio frequency coaxial connector is connected between the isolation device and the second isolation communication chip.

10. A plasma diagnostic system, characterized in that: The plasma diagnostic system comprises a plurality of detectors, a plurality of high voltage power supplies corresponding to the detectors one by one, and a multi-channel signal control circuit as claimed in any one of claims 1 to 9, wherein: The control terminals of the high-voltage power supply are respectively connected to the first sub-control chips in the multi-channel signal control circuit in a one-to-one correspondence.

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