Signal connector and circuit

Abstract

The utility model relates to a signal connector and a circuit. The signal connecting piece comprises a base, a plurality of resistive elements, a plurality of signal pins and a plurality of power pins, at least one resistive element is connected between at least one group of two adjacent pins so as to absorb interference and noise generated by the first circuit board and the second circuit board in the process of transmitting the first signal and the second signal, and there is no need to reserve a placement space for an absorption circuit on the circuit board, thereby saving the space and cost of the circuit board, and improving the reliability of the circuit board. The first circuit board and the second circuit board which are connected with the resistive element can be miniaturized, and an absorption loop formed by the resistive element is short, so that the resistive element has a better absorption effect on high-frequency signals.

Description

Technical Field

[0001] The present application relates to the technical field of signal transmission, and in particular to a signal connector and a circuit. Background Art

[0002] In the process of signal transmission between different circuit boards, such as the signal transmission process between an aluminum substrate and a printed circuit board, there will be problems with electromagnetic compatibility and signal integrity. In traditional technology, an absorption circuit for improving electromagnetic compatibility and signal integrity is generally set on an aluminum substrate or a printed circuit board. Since the absorption circuit needs to occupy a certain circuit board area, it will increase the board area of ​​the aluminum substrate or printed circuit board where the absorption circuit is installed. Utility Model Content

[0003] Based on this, it is necessary to provide a signal connector with good absorption effect, which is conducive to reducing the area of ​​other circuit boards in the circuit connected to the signal connector.

[0004] In a first aspect, a signal connector is provided, the signal connector comprising:

[0005] Pedestal;

[0006] Multiple resistive elements are integrated inside the base;

[0007] A plurality of signal pins are integrated on the base, wherein a first end of each signal pin is used to connect to the first circuit board, and a second end of each signal pin is used to connect to the second circuit board, so as to support transmission of a first signal between the first circuit board and the second circuit board;

[0008] A plurality of power pins are integrated on the base, wherein a first end of each power pin is used to connect to the first circuit board, and a second end of each power pin is used to connect to the second circuit board, so as to support transmission of a second signal between the first circuit board and the second circuit board; a power level of the second signal is greater than a power level of the first signal;

[0009] Wherein, at least one resistive element is connected between at least one group of two adjacent pins, and the pins include at least one of a signal pin and a power pin.

[0010] In one embodiment, the resistive element is an absorption capacitor or a resistor.

[0011] In one embodiment, a resistive element is connected between each power pin and an adjacent power pin or signal pin.

[0012] In one embodiment, a mounting groove is formed between at least two adjacent pins inside the base for accommodating the resistive element.

[0013] In one embodiment, the mounting groove is a sealed groove, or the mounting groove is an open groove communicating with the outside.

[0014] In one embodiment, a cover plate with a snap-fit ​​structure is provided on the installation slot to form a limiting structure with the installation slot.

[0015] In one embodiment, the base is made of insulating material.

[0016] In one embodiment, a separation boss is formed inside the base to isolate two adjacent pins.

[0017] In a second aspect, a circuit is provided, the circuit comprising:

[0018] The first circuit board supports the transmission and reception of a first signal and a second signal, wherein a power level of the second signal is greater than a power level of the first signal;

[0019] A second circuit board supports the transmission and reception of the first signal and the second signal;

[0020] The signal connector as mentioned above supports the transmission of the first signal and the second signal between the first circuit board and the second circuit board.

[0021] In one embodiment, the first circuit board is a printed circuit board, and the second circuit board is an aluminum substrate.

[0022] The above-mentioned signal connector and circuit connect at least one resistive element between at least one group of two adjacent pins to absorb the interference and noise generated by the first circuit board and the second circuit board during the transmission of the first signal and the second signal. It is no longer necessary to reserve space for the absorption circuit on the first circuit board and the second circuit board, which saves the space and cost of the circuit board and is conducive to the miniaturization design of the circuit board. In addition, the absorption loop formed by the resistive element is shorter and has a better absorption effect on high-frequency signals. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 is a module structure diagram of a signal connector of an embodiment;

[0025] Figure 2 is a cross-sectional view of a module structure of a signal connector according to an embodiment;

[0026] Figure 3 FIG. 4 is a schematic diagram of a circuit structure of an embodiment. DETAILED DESCRIPTION

[0027] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0029] It is understood that the terms "first circuit board", "second circuit board", etc. used in this application may be used herein to describe various components, but these components are not limited by these terms. These terms are only used to distinguish a first component from another component. For example, without departing from the scope of this application, a first circuit board may be referred to as a second circuit board, and similarly, a second circuit board may be referred to as a first circuit board. Both the first circuit board and the second circuit board are circuit boards, but they are not the same circuit board.

[0030] It can be understood that the “connection” in the following embodiments should be understood as “electrical connection”, “communication connection”, etc. if the connected circuits, modules, units, etc. have electrical signals or data transmission between each other.

[0031] It can be understood that “at least one” means one or more, “plurality” means two or more, and “at least part of an element” means part or all of an element.

[0032] When used herein, the singular forms "a", "an" and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" etc. specify the presence of stated features, wholes, components, parts or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, components, parts or combinations thereof.

[0033] In one embodiment, Figure 1 As shown, a signal connector 100 is provided, the signal connector 100 includes: a base 102, a plurality of resistive elements ( Figure 1 (not shown), multiple signal pins 104 and multiple power pins 106.

[0034] A plurality of resistive elements are integrated inside the base 102. Resistive elements are elements that hinder the flow of current in a circuit, so as to adjust the current and voltage of the circuit and perform energy conversion.

[0035] A plurality of signal pins 104 are integrated on the base 102 , a first end of each signal pin 104 is used to connect to the first circuit board, and a second end of each signal pin 104 is used to connect to the second circuit board to support transmission of a first signal between the first circuit board and the second circuit board.

[0036] A plurality of power pins 106 are integrated on the base 102, the first end of each power pin 106 is used to connect to the first circuit board, and the second end of each power pin 106 is used to connect to the second circuit board to support transmission of a second signal between the first circuit board and the second circuit board; the power level of the second signal is greater than the power level of the first signal.

[0037] The first signal is a low-power signal, which may be a signal with a current level of milliamperes or other levels of low-power signals. The second signal is a high-power signal, which may be a signal with a current level of amperes or other levels of high-power signals.

[0038] It should be noted that the power levels of the first signal and the second signal are relative, that is, the power level of the first signal is lower than the power level of the second signal, and the power level of the second signal is higher than the power level of the first signal.

[0039] At least one resistive element is connected between at least one group of two adjacent pins, and the pins include at least one of a signal pin 104 and a power pin 106 .

[0040] like Figure 2 As shown, for multiple groups of adjacent pins, at least one resistive element 108 may be connected across at least one group of pins. The setting of the resistive element 108 may be determined according to the signal transmission quality requirements. For example, Figure 2 As shown, at least one resistive element 108 may be connected between adjacent power pins 106 and signal pins 104, and at least one resistive element 108 may be connected across two adjacent power pins 106. Of course, at least one resistive element 108 may also be connected across two adjacent signal pins 104. The number of resistive elements 108 and the effect of suppressing electromagnetic interference, voltage spikes, and current surges are positively correlated.

[0041] In one embodiment, when at least one resistive element 108 is connected between two adjacent signal pins 104, the resistive element 108 can suppress mutual interference between multiple first signals during the transmission process to obtain a purer first signal; when at least one resistive element 108 is connected between two adjacent power pins 106, the resistive element 108 can suppress mutual interference between multiple second signals during the transmission process to obtain a purer second signal; when at least one resistive element 108 is connected between adjacent power pins 106 and signal pins 104, the resistive element 108 can suppress mutual interference between the first signal and the second signal during the transmission process to obtain a purer first signal and second signal.

[0042] like Figure 3 As shown, at least one resistive element 108 is connected between at least one group of two adjacent pins to absorb the interference and noise generated by the first circuit board 200 and the second circuit board 300 during the transmission of the first signal and the second signal. It is no longer necessary to reserve space for the absorption circuit on the circuit board, which saves the space and cost of the circuit board and is conducive to miniaturization. In addition, the absorption loop formed by the resistive element 108 is shorter and has a better absorption effect on high-frequency signals.

[0043] In one embodiment, the resistive element 108 may also be connected in series or in parallel with at least one resistor to form an absorption network to suppress the above-mentioned interference and noise.

[0044] In one embodiment, the resistive element 108 is an absorption capacitor or a resistor.

[0045] Absorption capacitor is a capacitor that can be used to suppress electromagnetic interference, voltage spikes and current surges. Absorption capacitor can effectively absorb interference signals or interference noise in the circuit, making the circuit terminal signal clearer and more stable, thereby improving the stability and performance of the circuit.

[0046] The resistive element 108 can be a chip-type absorption capacitor. The chip-type absorption capacitor is small in size and suitable for high-density circuit board design, making the circuit board more compact. Moreover, the chip-type absorption capacitor can be quickly and efficiently welded by automated welding equipment, and has high efficiency. In addition, the chip-type absorption capacitor adopts a design with tight packaging and stable structure, has good shock and vibration resistance, and can maintain a stable working state in harsh environments.

[0047] When the resistive element 108 is a resistor and is placed between two adjacent signal pins, the resistor can prevent static electricity from accumulating and being damaged by discharge. Through the resistor, static electricity can be discharged to the ground, reducing the impact of static electricity on various components, thereby improving the stability and reliability of the circuit equipped with the signal connector. When the resistive element 108 is a resistor and is placed between two adjacent power pins, the resistor at this time is a load resistor. When the resistive element 108 is a resistor and is placed between adjacent signal pins and power pins, the adjacent signal pins and power pins can be grounded through a grounding point to achieve single-point grounding, so as to reduce the length of the ground loop, reduce the impedance of the ground loop, reduce the voltage drop in the ground loop, and improve the anti-interference ability and signal quality of the circuit.

[0048] In one embodiment, Figure 2 and Figure 3 As shown, a resistive element 108 is connected between the power pin 106 and the adjacent power pin 106 or signal pin 104 .

[0049] The closer the installation position of the resistive element 108 is to the signal source, the higher the working effect of the resistive element 108. The power of the second signal transmitted by the power pin 106 is relatively large, and the interference to the first circuit board 200 and the second circuit board 300 is relatively obvious. Therefore, connecting the resistive element 108 between the power pin 106 and the adjacent power pin 106 or signal pin 104 can suppress the mutual interference between the second signal and another second signal or the first signal, and improve the stability and reliability of signal interaction.

[0050] In one embodiment, Figure 1 As shown, a mounting groove 110 is formed between at least two adjacent pins inside the base 102 for accommodating the resistive element 108 .

[0051] The size of the mounting groove 110 depends on the package size of the resistive element 108. Accommodating the resistive element 108 inside the base 102 can improve the integration, miniaturization and integration of the signal connector 100.

[0052] In one embodiment, the mounting groove 110 is a sealed groove, or the mounting groove 110 is an open groove communicating with the outside.

[0053] When the mounting groove 110 is a sealing groove, it is possible to prevent dust or tiny debris from adhering to the port of the resistive element 108 to cause poor contact, and the sealing groove has a good dustproof effect.

[0054] When the installation slot 110 is an open slot, it is convenient for the staff to replace the resistor element 108 of different types according to different working conditions, which improves the convenience of operation. The slot direction of the open installation slot 110 can be in any direction. In practical applications, the appropriate slot direction can be selected according to the on-site environment. For example, Figure 1 As shown, the slotting direction is the same as the extending direction of the pin.

[0055] In one embodiment, a cover plate with a snap-fit ​​structure is provided on the installation slot to form a limiting structure with the installation slot.

[0056] The limiting structure formed by the cover plate and the mounting groove can limit the power devices such as the metal oxide semiconductor field effect tube connected to the power pin and the device connected to the signal pin, and can also perform corresponding installation limits on the resistive element. In addition, the buckle structure can make the installation between the cover plate and the mounting groove easier and faster. The installation can be completed by simply inserting or pressing, and the operation is simple. The buckle structure can ensure that the cover plate is firmly fixed on the mounting groove, and it is not easy to loosen or shift, thereby improving the stability and reliability of the overall equipment.

[0057] In one embodiment, the mounting slot 110 is adapted to the package specification of 1206 or the package specification of 1210 .

[0058] The package size of 1206 means that the package size of the resistive element 108 is 1.2 mm x 0.6 mm. The package size of 1206 is suitable for most circuits and has a wide range of applications.

[0059] The package size of 1210 means that the package size of the resistive element 108 is 1.2 mm x 1.0 mm. The package size of 1210 is suitable for the resistive element 108 that needs a larger power carrying capacity or a higher capacitance value.

[0060] In actual application scenarios, appropriate packaging specifications can be selected according to circuit requirements.

[0061] In one embodiment, the number of pins of each signal pin 104 and each power pin 106 can be selected according to actual conditions.

[0062] The principle for selecting the number of pins of each signal pin 104 and each power pin 106 is to ensure that during the manufacturing process of the signal connector 100, the pins of each signal pin 104 and each power pin 106 remain regular, so as to facilitate subsequent welding or other fixing processes, and to ensure that after the signal connector 100 is connected, stable and reliable data reception and transmission can be maintained, while also improving the flatness of the surface of the base 102 after packaging.

[0063] In one embodiment, Figure 2 As shown, the base 102 is made of insulating material.

[0064] The insulating material is used to obtain an insulating effect, thereby improving the safety of the signal connector 100. The insulating material may be plastic. The use of a lightweight insulating material can take into account signal transmission reliability, low cost, and reduced weight.

[0065] The distance between each pin and the distance between each plug-in and the outer surface of the base 102 can be adjusted to accommodate circuit boards with different capacitance values, different withstand voltages and different packaging specifications.

[0066] In one embodiment, Figure 1 As shown, a separation boss is formed inside the base to isolate two adjacent pins.

[0067] Adjacent pins can be isolated from each other by the separation bosses, so that during use, the pins can be clearly distinguished by the separation bosses, thereby improving the user's comfort.

[0068] In one embodiment, Figure 3 As shown, a circuit is provided, which includes a first circuit board 200, a second circuit board 300 and the signal connector 100 as described above.

[0069] The first circuit board 200 supports the transmission and reception of a first signal and a second signal, and a power level of the second signal is greater than a power level of the first signal.

[0070] The second circuit board 300 supports the transmission and reception of the first signal and the second signal.

[0071] The signal connector 100 as described above supports transmission of the first signal and the second signal between the first circuit board 200 and the second circuit board 300 .

[0072] The signal connector 100 can utilize its built-in resistive element to suppress the mutual interference between the first signal and the second signal during the transmission process, so that the first circuit board 200 and the second circuit board 300 obtain purer first and second signals, thereby improving the accuracy of the signals.

[0073] In one embodiment, the first circuit board 200 is a printed circuit board, and the second circuit board 300 is an aluminum substrate.

[0074] The signal connector 100 supports connecting one end to the printed circuit board and the other end to the aluminum substrate. After the connection is successful, the printed circuit board and the aluminum substrate can transmit signals to each other through the signal connector 100. Furthermore, the signal connector 100 has a built-in resistive element, which can suppress interference and noise during signal transmission, reduce signal distortion, and improve signal accuracy without increasing the board area.

[0075] In one embodiment, the printed circuit board is used to place the control circuit and other peripheral circuits, and the aluminum substrate is used to place power devices such as metal oxide semiconductor field effect transistors.

[0076] In the description of this specification, the description with reference to the terms "some embodiments", "other embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic description of the above terms does not necessarily refer to the same embodiment or example.

[0077] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0078] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A signal connector, characterized in that: include: Pedestal; A plurality of resistive elements integrated inside the base; A plurality of signal pins are integrated on the base, wherein a first end of each of the signal pins is used to connect to a first circuit board, and a second end of each of the signal pins is used to connect to a second circuit board, so as to support transmission of a first signal between the first circuit board and the second circuit board; a plurality of power pins integrated on the base, wherein a first end of each of the power pins is used to connect to the first circuit board, and a second end of each of the power pins is used to connect to the second circuit board, so as to support transmission of a second signal between the first circuit board and the second circuit board; a power level of the second signal is greater than a power level of the first signal; Wherein, at least one of the resistive elements is connected between at least one group of two adjacent pins, and the pins include at least one of the signal pins and the power pins.

2. The signal connector according to claim 1, characterized in that: The resistive element is an absorption capacitor or a resistor.

3. The signal connector according to claim 1, characterized in that: The resistive element is connected between each of the power pins and an adjacent power pin or signal pin.

4. The signal connector according to claim 1, characterized in that: A mounting groove is formed between at least two adjacent pins inside the base for accommodating the resistive element.

5. The signal connector according to claim 4, characterized in that: The installation groove is a sealed groove, or the installation groove is an open groove communicating with the outside.

6. The signal connector according to claim 4, characterized in that: A cover plate with a snap-fit ​​structure is arranged on the installation slot to form a limiting structure with the installation slot.

7. The signal connector according to claim 1, characterized in that: The base is made of insulating material.

8. The signal connector according to claim 1, characterized in that: A separation boss is formed inside the base to isolate two adjacent pins.

9. A circuit, characterized in that: include: A first circuit board supports the transmission and reception of a first signal and a second signal, wherein a power level of the second signal is greater than a power level of the first signal; A second circuit board, supporting the transmission and reception of the first signal and the second signal; The signal connector according to any one of claims 1 to 8 supports transmission of the first signal and the second signal between the first circuit board and the second circuit board.

10. The circuit according to claim 9, characterized in that The first circuit board is a printed circuit board, and the second circuit board is an aluminum substrate.

Images