Mobile phone mainboard upper cover assembly with good dustproof effect

Abstract

The utility model discloses a mobile phone mainboard upper cover assembly with a good dustproof effect, which comprises a mainboard mounting seat, a mobile phone mainboard is fixedly mounted on the mainboard mounting seat, a mainboard upper cover is arranged on the mainboard mounting seat, clamping blocks are fixedly adhered to the outer walls of the two ends of the mainboard upper cover, and the clamping blocks are fixedly adhered to the outer walls of the two ends of the mainboard upper cover. Two clamping seats are fixedly adhered to the top wall of the mainboard mounting seat, clamping grooves are formed in the clamping seats, cavities are formed in the two clamping blocks, and inserting assemblies are arranged on the clamping blocks. When the main board upper cover is disassembled, only the two pull blocks need to be pressed at the same time, the two pull blocks move towards the main board upper cover at the same time, the pull blocks drive the base to slide in the cavity through the connecting block, and therefore the inserting block is driven to be separated from the inserting groove, limiting on the clamping block is relieved, and the main board upper cover is disassembled. Compared with an installation mode of fixing through a plurality of fastening screws, the mainboard upper cover can be disassembled from the mainboard installation base, and the convenience of disassembling and assembling the mainboard upper cover is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of mobile phone accessories, in particular to a mobile phone mainboard upper cover component with good dustproof effect. Background Art

[0002] The mobile phone motherboard is one of the main parts of the mobile phone. Due to its too many precise structures, it is very easy to be damaged. Therefore, after the mobile phone motherboard is installed, a motherboard cover is usually installed to provide a certain degree of protection for the mobile phone motherboard.

[0003] At present, the existing mobile phone motherboard cover is usually fixed by multiple fastening screws, and the fastening screws are small in size. When the mobile phone motherboard needs to be repaired, the disassembly and assembly of the motherboard cover is not only inconvenient to operate, but also once the fastening screws are accidentally lost during maintenance, the motherboard cover will not be firmly fixed. In this regard, we propose a mobile phone motherboard cover assembly with good dustproof effect to solve the above-mentioned problems. Utility Model Content

[0004] The utility model aims to provide a mobile phone mainboard upper cover assembly with good dustproof effect, so as to solve the problems raised in the above background technology.

[0005] To achieve the above purpose, the utility model provides the following technical solution: a mobile phone mainboard upper cover assembly with good dustproof effect, comprising:

[0006] The jack is fixedly mounted on the base, and a mainboard cover is arranged on the base, and the outer walls at both ends of the mainboard cover are fixedly bonded with card blocks, and two card seats are fixedly bonded on the top wall of the mainboard mounting base, and a card slot is provided on the card seat, and the two card blocks are movably plugged into the two card slots respectively, and cavities are provided in the two card blocks, and a plug-in assembly is arranged on the card block, and the plug-in assembly includes a base, and the base is slidably connected in the cavity, and a plug-in block is fixedly bonded on the base, and the plug-in block penetrates the card block and is slidably connected thereto, and a pair of elastic springs are fixedly connected to the base, and one end of the elastic spring away from the base is fixedly connected to the inner wall of the cavity, and a plug-in slot is provided on the inner wall of the card slot, and the plug-in block is movably plugged into the plug-in slot, and a pull block is arranged on the top wall of the card block.

[0007] Preferably, a pair of through slots are formed on the top wall of the clamping block, a pair of connecting blocks are fixedly bonded to the bottom wall of the pulling block, the connecting blocks are slidably connected in the through slots, and the bottom ends of the connecting blocks are fixedly bonded to the base.

[0008] Preferably, a sealing ring is fixedly bonded to the bottom wall of the mainboard upper cover.

[0009] Preferably, a plurality of equidistantly distributed mounting grooves are provided on the top wall of the mainboard cover, heat sink fins are fixedly installed in the mounting grooves, a same heat conductive sheet is fixedly bonded to the bottom walls of the plurality of heat sink fins, and the heat conductive sheet is fitted on the top wall of the mobile phone mainboard.

[0010] Preferably, the bottom walls of the two plug-in blocks are both arranged to be inclined.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] 1. When disassembling the mainboard cover of the utility model, it is only necessary to press the two pull blocks at the same time to make the two pull blocks move toward the mainboard cover at the same time. The pull blocks drive the base to slide in the cavity through the connecting blocks, thereby driving the plug-in block to disengage from the plug-in slot, releasing the limit of the card-connecting block, and then pulling the mainboard cover upward to remove the mainboard cover from the mainboard mounting seat. Compared with the installation method fixed by multiple fastening screws, the convenience of disassembling and assembling the mainboard cover is greatly improved;

[0013] 2. The motherboard upper cover of the utility model is installed in a sealed manner, which can prevent external dust from falling onto the mobile phone motherboard through the gap between the motherboard upper cover and the motherboard mounting seat, and has a good dustproof effect. The provided heat conductive sheet can conduct the heat generated by the mobile phone motherboard to multiple cooling fins to cool the mobile phone motherboard, solving the problem of poor sealing and heat dissipation of the motherboard upper cover. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the three-dimensional structure of a mobile phone mainboard upper cover assembly with good dustproof effect proposed by the utility model;

[0015] Figure 2 This is a front view of the overall cross-section structure of a mobile phone mainboard upper cover assembly with good dustproof effect proposed by the utility model;

[0016] Figure 3 The utility model provides a mobile phone mainboard upper cover component with good dustproof effect. Figure 2 Enlarged structural diagram at point A in the middle.

[0017] In the figure: 1. Mainboard mounting seat; 2. Mobile phone mainboard; 3. Mainboard cover; 4. Snap-in block; 5. Snap-in seat; 6. Snap-in slot; 7. Cavity; 8. Base; 9. Plug-in block; 10. Elastic spring; 11. Plug-in slot; 12. Pull block; 13. Through slot; 14. Connecting block; 15. Sealing ring; 16. Mounting slot; 17. Heat sink fins; 18. Heat conducting sheet. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] See also Figure 1-3 The utility model provides a technical solution: a mobile phone mainboard upper cover component with good dustproof effect, comprising:

[0020] A motherboard mounting seat 1, on which a mobile phone motherboard 2 is fixedly mounted, a motherboard upper cover 3 is arranged on the motherboard mounting seat 1, and a clamping block 4 is fixedly bonded to the outer walls at both ends of the motherboard upper cover 3, and two clamping seats 5 are fixedly bonded to the top wall of the motherboard mounting seat 1, and a clamping groove 6 is provided on the clamping seat 5, and the two clamping blocks 4 are respectively movably plugged into the two clamping grooves 6, and the two clamping blocks 4 are each provided with a cavity 7, and a plug-in component is arranged on the clamping block 4, so that The plug-in assembly includes a base 8, which is slidably connected in the cavity 7. A plug-in block 9 is fixedly bonded to the base 8, and the plug-in block 9 passes through the clamping block 4 and is slidably connected thereto. A pair of elastic springs 10 are fixedly connected to the base 8, and one end of the elastic spring 10 away from the base 8 is fixedly connected to the inner wall of the cavity 7. A plug-in groove 11 is provided on the inner wall of the clamping groove 6, and the plug-in block 9 is movably plugged into the plug-in groove 11. A pull block 12 is provided on the top wall of the clamping block 4.

[0021] A pair of through slots 13 are provided on the top wall of the clamping block 4, and a pair of connecting blocks 14 are fixedly bonded to the bottom wall of the pulling block 12. The connecting blocks 14 are slidably connected in the through slots 13, and the bottom ends of the connecting blocks 14 are fixedly bonded to the base 8. When the pulling block 12 moves toward the mainboard cover 3, the base 8 can be driven to slide in the cavity 7 through the connecting blocks 14, thereby driving the plug-in block 9 to disengage from the plug-in slot 11, which is convenient for disassembly of the mainboard cover 3.

[0022] A sealing ring 15 is fixedly bonded to the bottom wall of the mainboard cover 3 , and the sealing ring 15 improves the sealing when the mainboard cover 3 is closed, thereby preventing dust from falling onto the mobile phone mainboard 2 through the gap between the mainboard cover 3 and the mainboard mounting seat 1 .

[0023] A plurality of equidistantly distributed mounting grooves 16 are provided on the top wall of the mainboard cover 3, and heat sink fins 17 are fixedly installed in the mounting grooves 16. A same heat conductive sheet 18 is fixedly bonded to the bottom walls of the plurality of heat sink fins 17, and the heat conductive sheet 18 is fittedly arranged on the top wall of the mobile phone mainboard 2. The heat conductive sheet 18 can conduct the heat generated by the mobile phone mainboard 2 to the plurality of heat sink fins 17 to cool and dissipate the heat of the mobile phone mainboard 2.

[0024] The bottom walls of the two plug-in blocks 9 are both arranged to be inclined. The plug-in blocks 9 with inclined bottom walls are convenient for sliding into the plug-in slots 11 when the mainboard cover 3 is installed, thereby improving the convenience of installing the mainboard cover 3.

[0025] Working principle: When disassembling the main board cover 3 of the utility model, it is only necessary to press the two pull blocks 12 at the same time to make the two pull blocks 12 move toward the main board cover 3 at the same time. The pull block 12 drives the base 8 to slide in the cavity 7 through the connecting block 14, thereby driving the plug-in block 9 to disengage from the plug-in slot 11, releasing the limit on the card block 4, and then pulling the main board cover 3 upwards to remove the main board cover 3 from the main board mounting seat 1. Compared with the installation method fixed by multiple fastening screws, the convenience of disassembly and assembly of the main board cover 3 is greatly improved. The main board cover 3 adopts a sealed installation to prevent external dust from falling on the mobile phone main board 2 from the gap between the main board cover 3 and the main board mounting seat 1, which has a good dustproof effect. The set heat conductive sheet 18 can conduct the heat generated by the mobile phone main board 2 to the multiple heat dissipation fins 17 to cool the mobile phone main board 2, solving the problem of poor sealing and heat dissipation of the main board cover 3.

[0026] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0027] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A mobile phone mainboard upper cover assembly with good dustproof effect, characterized in that: include: A motherboard mounting seat (1), a mobile phone motherboard (2) is fixedly mounted on the motherboard mounting seat (1), a motherboard upper cover (3) is arranged on the motherboard mounting seat (1), and a clamping block (4) is fixedly bonded to the outer walls at both ends of the motherboard upper cover (3), two clamping seats (5) are fixedly bonded to the top wall of the motherboard mounting seat (1), a clamping groove (6) is provided on the clamping seat (5), two of the clamping blocks (4) are movably plugged into the two clamping grooves (6), two of the clamping blocks (4) are provided with a cavity (7), a plug-in assembly is arranged on the clamping block (4), and the plug-in assembly is provided on the clamping block (4). The connecting assembly comprises a base (8), the base (8) is slidably connected in the cavity (7), a plug-in block (9) is fixedly bonded to the base (8), the plug-in block (9) passes through the clamping block (4) and is slidably connected thereto, a pair of elastic springs (10) are fixedly connected to the base (8), one end of the elastic spring (10) away from the base (8) is fixedly connected to the inner wall of the cavity (7), a plug-in groove (11) is provided on the inner wall of the clamping groove (6), the plug-in block (9) is movably plugged into the plug-in groove (11), and a pull block (12) is provided on the top wall of the clamping block (4).

2. A mobile phone mainboard upper cover assembly with good dustproof effect according to claim 1, characterized in that: A pair of through grooves (13) are provided on the top wall of the clamping block (4), and a pair of connecting blocks (14) are fixedly bonded to the bottom wall of the pulling block (12). The connecting blocks (14) are slidably connected in the through grooves (13), and the bottom ends of the connecting blocks (14) are fixedly bonded to the base (8).

3. A mobile phone mainboard upper cover assembly with good dustproof effect according to claim 1, characterized in that: A sealing ring (15) is fixedly bonded to the bottom wall of the mainboard upper cover (3).

4. A mobile phone mainboard upper cover assembly with good dustproof effect according to claim 1, characterized in that: The top wall of the mainboard upper cover (3) is provided with a plurality of equally spaced mounting grooves (16), a heat dissipation fin (17) is fixedly mounted in the mounting groove (16), a common heat conducting sheet (18) is fixedly bonded to the bottom walls of the plurality of heat dissipation fins (17), and the heat conducting sheet (18) is fitted on the top wall of the mobile phone mainboard (2).

5. A mobile phone mainboard upper cover assembly with good dustproof effect according to claim 1, characterized in that: The bottom walls of the two plug-in blocks (9) are both arranged to be inclined.

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