Innovative miniature air conditioner without Freon participating in refrigeration
By using a combination of semiconductor refrigeration parts and heat-conducting cooling components in the air conditioner, combined with the auxiliary cooling method of water and wind, a Freon-free micro air conditioner is realized, which solves the problems of leakage and inconvenient maintenance of existing air conditioners, protects the ozone layer and provides Easy operation and good refrigeration effect.
Patent Information
- Application Number
- CN202323373591.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-12
- Publication Date
- 2025-01-21
- Estimated Expiration
- 2033-12-12
AI Technical Summary
Existing air conditioners rely on Freon as a refrigerant, resulting in high leakage risk, harmful to the ozone layer, and inconvenient maintenance, making it difficult for ordinary consumers to refill and maintain it themselves.
Semiconductor refrigeration parts are used as the cold source. Through the combination of heat-conducting and cold-conducting parts, electric energy is used to drive the semiconductor refrigeration parts for cooling and heating. Combined with the auxiliary cooling method of water and wind, a Freon-free micro air conditioner is realized.
There is no need for Freon, which avoids the risk of leakage and damage to the ozone layer, and reduces the complexity of maintenance. Ordinary consumers can operate it by themselves. The resources are simple and easy to obtain, and the cooling effect is good.
Smart Images
Figure CN222378290U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of refrigeration equipment, in particular to an innovative micro air conditioner which does not require Freon to participate in refrigeration. Background Art
[0002] The existing air conditioner refrigeration method uses Freon as the working medium of the refrigeration cycle. The air conditioner compressor first compresses the liquid Freon into high-temperature Freon, and then sends it to the condenser. At this time, the Freon will dissipate heat and become liquid Freon, so hot air appears in the air conditioner outdoor unit. The liquid Freon enters the evaporator and becomes low-temperature vapor. After being blown by the air conditioner indoor unit, the Freon absorbs heat and lowers the room temperature.
[0003] The Freon in existing air conditioners cannot be completely sealed and will leak, so existing air conditioners must be regularly refilled with Freon to ensure their cooling effect. The refilling of Freon must be done by professionally trained professionals using professional equipment and tools. Ordinary consumers cannot do it themselves, which causes great inconvenience to ordinary consumers. In addition, the leakage of Freon will cause great damage to the earth's ozone layer. After the ozone layer is destroyed, humans will be extremely vulnerable to damage from the sun's ultraviolet rays. Utility Model Content
[0004] In view of the problems existing in the prior art, the utility model discloses an innovative micro air conditioner that does not require Freon to participate in refrigeration. The technical solution adopted is that it includes a semiconductor refrigeration component, and the hot end and cold end of the semiconductor refrigeration component are respectively connected to a heat-conducting component and a cold-conducting component, and the cold-conducting component is connected to a blowing device. After the semiconductor refrigeration component is powered on, one end cools and the other end heats, and the heat from the hot end is exported. The cold air at the cold end is blown out through the blowing device for cooling.
[0005] As a preferred technical solution of the utility model, the heat-conducting component is the first heat-conducting component or the second heat-conducting component, and the first heat-conducting component and the cooling component are both heat-conducting and cooling components, and the heat-conducting and cooling components have good heat exchange effect.
[0006] As a preferred technical solution of the utility model, the first heat-conducting component also includes a first aluminum part, a first copper tube and a first aluminum sheet, the first copper tube connects the first aluminum part and the first aluminum sheet, there are multiple first aluminum sheets, the first aluminum sheet is connected to the semiconductor refrigeration element, and the first aluminum sheets are arranged in an array.
[0007] As an optimal technical solution of the utility model, the heat-conducting component is a first heat-conducting component, and there is a heat exchange box outside the semiconductor refrigeration component and the first heat-conducting component. The heat exchange box is connected with a liquid inlet pipe and a liquid outlet pipe, and cooling is assisted by flowing liquid, and water, oil, etc. can be used; there is a wind hood outside the cooling component, and a fan is installed on the wind hood. The wind hood can reduce the overflow of cold, and the fan can blow out the cold air to the greatest extent.
[0008] As a preferred technical solution of the utility model, the rear end of the wind hood is open and equipped with a rear plate, and the rear plate has vents for the outside air to enter to form air flow.
[0009] As a preferred technical solution of the utility model, the heat exchange box is located in the atomizer box, the upper end of the atomizer box is open, and the condensed water on the surface of the heat exchange box can fall into the atomizer box. The atomizer box is equipped with an atomizer device, which can atomize the received condensed water or external water to increase the ambient humidity and further assist in cooling.
[0010] As a preferred technical solution of the utility model, the heat-conducting component is a second heat-conducting component, and the second heat-conducting component is one of a columnar structure, a conical structure, a sheet structure, and a needle structure; the cold-conducting component also includes a second aluminum part, a second copper tube and a second aluminum sheet, and the second copper tube connects the second aluminum part and the second aluminum sheet. There are multiple groups of second aluminum sheets, and heat is dissipated by inserting the second heat-conducting component into the ground.
[0011] As a preferred technical solution of the utility model, the semiconductor refrigeration component is provided with a packaging box outside; the cooling component is provided with a wind cover outside, and a fan is installed on the wind cover.
[0012] Beneficial effects of the utility model: The utility model uses semiconductor refrigeration sheets as cold sources, thus not relying on refrigerants such as Freon, and without any exhaust gas emissions, thereby solving the risk of leakage from the root and protecting the earth's ozone layer and natural environment. Moreover, the resources relied on are water, electricity, and the earth that ordinary consumers can access in their daily lives. The resources are easy to obtain, the refrigeration effect is good, the operation is simple, and no special equipment or tools are required. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] In order to more clearly illustrate the specific implementation of the utility model or the technical solution in the prior art, the drawings required for use in the specific implementation or the prior art description will be briefly introduced below; in all the drawings, the elements or parts are not necessarily drawn according to the actual scale.
[0014] Figure 1 This is a schematic structural diagram of the first embodiment of the utility model;
[0015] Figure 2 This is a schematic diagram of the internal partial structure of the first embodiment of the utility model. Figure 1 ;
[0016] Figure 3 This is a schematic diagram of the internal partial structure of the first embodiment of the utility model. Figure 2 ;
[0017] Figure 4 This is a schematic diagram of the connection structure of the semiconductor refrigeration component in the first embodiment of the utility model;
[0018] Figure 5 This is a schematic structural diagram of a second embodiment of the utility model;
[0019] Figure 6 This is a schematic diagram of the connection structure of the semiconductor refrigeration component in the second embodiment of the utility model.
[0020] In the figure: 1. semiconductor refrigeration component; 2. first heat-conducting component; 201. first aluminum component; 202. first copper tube; 203. first aluminum sheet; 3. cooling component; 301. second aluminum component; 302. second copper tube; 303. second aluminum sheet; 4. heat exchange box; 5. wind hood; 501. back plate; 6. fan; 7. liquid inlet pipe; 8. liquid outlet pipe; 9. atomizing box; 10. atomizing device; 11. second heat-conducting component; 12. packaging box. DETAILED DESCRIPTION
[0021] Example 1
[0022] like Figures 1 to 4 As shown, the first embodiment of the utility model is disclosed, and the technical scheme adopted is, including a semiconductor refrigeration component 1, the upper end of the semiconductor refrigeration component 1 is a cold end, and the lower end is a hot end, the cold end is connected to the cooling component 3 of the heat-conducting and cooling device assembly, the cooling component 3 also includes a second aluminum component 301, a second copper tube 302 and a second aluminum sheet 303, the second aluminum component 301 is connected to the cold end of the semiconductor refrigeration component 1, the second copper tube 302 connects the second aluminum component 301 and the second aluminum sheet 303, there are multiple groups of second aluminum sheets 303, and they are arranged in an array, the hot end is connected to the first heat-conducting component 2 of the heat-conducting and cooling device assembly, the first heat-conducting component 2 also includes a first aluminum component 201, a first copper tube 202 and a first aluminum sheet 203, the first copper tube 202 connects the first aluminum component 201 and the first aluminum sheet 203, there are multiple first aluminum sheets 203, and they are arranged in an array. The first heat-conducting component 2 is located in the heat exchange box 4, which also includes a bottom shell and a panel. The bottom shell is a shell structure with an open top surface. The panel is located on the top surface of the bottom shell and is connected to the bottom shell. A liquid inlet pipe 7 and a liquid outlet pipe 8 are connected to the bottom shell. The liquid outlet pipe 8 is higher than the liquid inlet pipe 7. An air hood 5 is provided at the outer end of the cooling component 3. The air hood 5 is installed on the panel. Both ends of the air hood 5 are open. A rear plate 501 is installed at one end. The rear plate 501 has a through hole for air circulation. A fan 6 is installed at the other end.
[0023] In order to prevent condensed water from dripping on the outer surfaces of the cooling component 3, the wind hood 5 and the fan 6, an atomizer box 9 is arranged outside the heat exchange box 4, the heat exchange box 4 is located inside the atomizer box 9, the liquid inlet pipe 7 and the liquid outlet pipe 8 pass through the side wall of the atomizer box 9, the top surface of the atomizer box 9 is open, and a guide groove is opened on the panel of the heat exchange box 4 for collecting condensed water dripping on the outer surfaces of the cooling component 3, the wind hood 5 and the fan 6.
[0024] In order to adjust the air humidity and further optimize the environmental cooling effect, an atomization device 10 is provided in the atomization box 9 .
[0025] Working principle:
[0026] The liquid inlet pipe 7 is connected to the cooling water supply pipe and water is supplied. After the cooling water enters the heat exchange box 4, it flows out from the liquid outlet pipe 8 to form flowing water. The first aluminum sheet 203 of the first heat-conducting component 2 is immersed in the cooling water. The semiconductor refrigeration component 1 and the fan 6 are powered on. The cold end of the semiconductor refrigeration component 1 is cooled down and the hot end is heated up. The heat of the hot end is transferred to the first copper tube 202 through the first aluminum sheet 203. The first copper tube 202 transfers the heat to the first aluminum sheet 203. The first aluminum sheet 203 dissipates the heat into the cooling water. The cold amount of the cold end is transferred to the second copper tube 302 through the second aluminum piece 301 of the cooling component 3. The second copper tube 302 transfers the cold amount to the second aluminum sheet 303. The second aluminum sheet 303 transfers the cold amount into the wind hood 5. The fan 6 works to suck the air at the rear end of the wind hood 5 into the wind hood 5 from the through hole on the rear plate 501, and then blows the cold air in the wind hood 5 out.
[0027] The condensed water in the air condensed on the outer surfaces of the cooling component 3, the wind shield 5 and the fan 6 flows into the heat exchange box 4 along the outer wall, and then is atomized by the atomizing device 10 and blown into the air by the fan 6 to assist in cooling. Water can be added to the atomizing box 9 manually to increase the atomization amount.
[0028] Example 2
[0029] like Figure 5 , Figure 6As shown, this embodiment discloses the second implementation of the utility model, and the technical scheme adopted is that it includes a semiconductor refrigeration component 1, the upper end of the semiconductor refrigeration component 1 is a cold end, the lower end is a hot end, the cold end is connected to the cold conduction component 3 of the heat conduction and cooling assembly, the cold conduction component 3 also includes a second aluminum component 301, a second copper tube 302 and a second aluminum sheet 303, the second aluminum component 301 is connected to the cold end of the semiconductor refrigeration component 1, the second copper tube 302 connects the second aluminum component 301 and the second aluminum sheet 303, there are multiple groups of second aluminum sheets 303, and they are arranged in an array, the hot end is connected to the columnar second heat conduction component 11, and the second heat conduction component 11 is a heat conduction column, such as a copper tube. The semiconductor refrigeration component 1 and the first heat conduction component 2 are located in the packaging box 12, and the outer end of the cold conduction component 3 has a hood 5, the hood 5 is installed on the panel, the two ends of the hood 5 are open, one end is equipped with a rear plate 501, the rear plate 501 has a through hole, and the other end is equipped with a fan 6, and the structure and connection method of the hood 5 and the fan 6 are the same as those of the embodiment 1.
[0030] Working principle:
[0031] The second heat-conducting component 11 is inserted into the ground, and the semiconductor refrigeration component 1 and the fan 6 are powered on. The cold end of the semiconductor refrigeration component 1 is cooled down, and the hot end is heated up. The heat of the hot end is dissipated into the ground through the second cooling component 11, and the cold energy of the cold end is transferred to the wind cover 5 through the cooling component 3, and the fan 6 blows out the cold air in the wind cover 5. The process of cold energy entering the wind cover 5 is the same as that in Example 1.
[0032] Example 3
[0033] The difference between this embodiment and embodiment 2 is that the hot end of the semiconductor refrigeration element 1 is connected to the third aluminum plate, and the third aluminum plate is connected to the second heat-conducting component 11 through the third copper tube.
[0034] Example 4
[0035] The difference between this embodiment and embodiment 2 is that the hot end of the semiconductor refrigeration element 1 is connected to the third aluminum plate, and the third aluminum plate is connected to the second heat-conducting component 11 .
[0036] The mechanical connection involved in the present utility model is a common means used by those skilled in the art, and technical inspiration can be obtained through a limited number of tests, which belongs to common knowledge.
[0037] Components not described in detail herein are prior art.
[0038] Although the specific embodiments of the present invention are described in detail above, the present invention is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the field without departing from the purpose of the present invention, and modifications or deformations without creative labor are still within the scope of protection of the present invention.
Claims
1. An innovative micro air conditioner that does not require Freon for refrigeration, characterized by: It comprises a semiconductor refrigeration element (1), wherein the hot end and the cold end of the semiconductor refrigeration element (1) are respectively connected to a heat conduction component and a cold conduction component (3), and the cold conduction component (3) is connected to a blowing device; The heat-conducting component is a first heat-conducting component (2) or a second heat-conducting component (11), and the first heat-conducting component (2) and the cold-conducting component (3) All of them are heat-conducting and cooling components; the first heat-conducting component (2) also includes a first aluminum component (201), a first copper tube (202) and a first aluminum sheet (203); the first copper tube (202) connects the first aluminum component (201) and the first aluminum sheet (203); there are multiple first aluminum sheets (203); the heat-conducting component is the first heat-conducting component (2); the semiconductor refrigeration component (1) and the first heat-conducting component (2) are externally provided with a heat exchange box (4); the heat exchange box (4) is provided with a A liquid inlet pipe (7) and a liquid outlet pipe (8) are connected; the cooling component (3) is provided with a wind hood (5) outside, and a fan (6) is installed on the wind hood (5); the cooling component (3) has the same structure as the first heat-conducting component (2); the rear end of the wind hood (5) is open and is provided with a rear plate (501), and the rear plate (501) has a vent; the heat exchange box (4) is located in the atomizing box (9), the upper end of the atomizing box (9) is open, and an atomizing device (10) is installed in the atomizing box (9).
2. The innovative micro air conditioner without Freon for refrigeration according to claim 1, characterized in that: The heat-conducting component is a second heat-conducting component (11), and the second heat-conducting component (11) is one of a columnar structure, a conical structure, a sheet structure, and a needle structure; the cold-conducting component (3) also includes a second aluminum component (301), a second copper tube (302), and a second aluminum sheet (303), the second copper tube (302) connects the second aluminum component (301) and the second aluminum sheet (303), and there are multiple groups of the second aluminum sheets (303).
3. The innovative micro air conditioner without Freon for refrigeration according to claim 1, characterized in that: The semiconductor refrigeration component (1) is provided with a packaging box (12) outside; the cooling component (3) is provided with a wind cover (5) outside, and a fan (6) is installed on the wind cover (5).