Semiconductor wafer detection device

Abstract

The utility model discloses a semiconductor wafer detection device which comprises a base, the top of the base is fixedly connected with a supporting plate, the top of the supporting plate is fixedly connected with a bearing plate, an object placing plate is arranged above the bearing plate, the two ends of the object placing plate are fixedly connected with the bearing plate through vertical plates, and the vertical plates are fixedly connected with the supporting plate. The device comprises a bearing plate, the top of the bearing plate is fixedly connected with a supporting frame, a rotating rod is rotatably inserted into the supporting frame and rotatably connected with the bearing plate, the rotating rod is fixedly sleeved with a first gear, second gears meshed with each other are arranged on the two sides of the first gear, and one side of each second gear is fixedly connected with a threaded rod. One end of the threaded rod is rotationally connected with the inner wall of the supporting frame, the threaded rod is sleeved with a clamping plate in a threaded mode, the workpiece can be well positioned through the arrangement of the clamping assembly, the stability in the detection process is improved, and fixing can be carried out according to workpieces of different sizes.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor related products, in particular to a semiconductor wafer detection device. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. Its original material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, which are then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod is formed into a silicon wafer, or wafer. The main processing methods for wafers are sheet processing and batch processing, that is, processing one or more wafers at the same time. As the feature size of semiconductors becomes smaller and smaller, and processing and measuring equipment becomes more advanced, semiconductor wafers need to be tested during the production and processing process to ensure the quality of semiconductor wafers.

[0003] The existing patent announcement number CN216209634U discloses a semiconductor wafer detection device, including a base, a moving mechanism is installed on both sides of the bottom of the base, and a lifting mechanism is installed on the top of the base. The semiconductor wafer detection device is arranged by a fixed plate, a first slide groove, a first slider, a sliding plate, a replacement film, a second slide groove, a second slider, a fixed column, a threaded pin, a rotating column and a detection head. When in use, if the light is not good, the wafer is placed on the sliding plate, the sliding plate is pulled to one side, and the sliding plate drives the first slider to slide out on the first slide groove to a suitable position for light, and the detection head is pulled to one side, and the detection head drives the second slider to slide out on the second slide groove to a suitable position, so as to facilitate the detection of the wafer, and finally according to the angle, the rotating column is pulled to one side, and the threaded pin drives the rotating column to rotate and adjust the position, so as to facilitate use.

[0004] Based on the search of the above patents and in combination with semiconductor wafers in the prior art, it is found that the above detection equipment can detect semiconductor wafers during actual application, but it cannot conveniently limit and fix workpieces of different sizes, making it inconvenient for the equipment to detect workpieces. Utility Model Content

[0005] The purpose of the utility model is to provide a semiconductor wafer detection device to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor wafer detection device, comprising a base, a support plate is fixedly connected to the top of the base, a carrying plate is fixedly connected to the top of the support plate, a storage plate is arranged above the carrying plate, both ends of the storage plate are fixedly connected to the carrying plate through a vertical plate, a support frame is fixedly connected to the top of the carrying plate, a rotating rod is rotatably inserted on the support frame, the rotating rod is rotatably connected to the carrying plate, a first gear is fixedly sleeved on the rotating rod, both sides of the first gear are provided with meshing second gears, one side of the second gear is fixedly connected with a threaded rod, one end of the threaded rod is rotatably connected to the inner wall of the support frame, a clamping plate is threadedly sleeved on the threaded rod, the top of the clamping plate passes through the support frame and the storage plate and extends upward, the support frame and the storage plate are provided with sliding openings corresponding to the clamping plate, a mounting frame is arranged above the storage plate, the bottom of both ends of the mounting frame are fixed to the carrying plate through connecting blocks, and a detection probe is fixedly connected to the inner top of the mounting frame.

[0007] Preferably, a rotating block is fixedly connected to the top end of the rotating rod, and anti-slip grooves are provided on the outer wall of the rotating block.

[0008] Preferably, four universal self-locking wheels are provided at the bottom of the base, and the four universal self-locking wheels are respectively fixed at the four corners of the bottom of the base.

[0009] Preferably, a limiting rod is fixedly connected in the sliding opening on the storage plate, and the clamping plate is slidably sleeved on the limiting rod.

[0010] Preferably, a rubber plate is fixedly connected to one side of the top end of the clamping plate.

[0011] Preferably, the first gear and the second gear are both bevel gears.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] The semiconductor wafer detection device places the workpiece on a placement plate and then rotates a rotating rod on a support frame. At this time, a first gear installed on the rotating rod rotates accordingly and then engages with second gears on both sides to rotate. At this time, the second gear will drive the threaded rod to rotate accordingly. When the threaded rod rotates, a clamping plate threadedly sleeved thereon will move accordingly to clamp and fix the workpiece. Subsequently, the detection operation of the workpiece is realized through a detection probe on the bottom of the mounting frame. The utility model adopts the setting of a clamping component to well position the workpiece, improve stability during detection, and can fix workpieces of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic structural diagram of a semiconductor wafer detection device of the utility model;

[0015] Figure 2 This is an enlarged view of point A of a semiconductor wafer detection device of the present invention.

[0016] In the figure: 1. base; 2. support plate; 3. load-bearing plate; 4. storage plate; 5. vertical plate; 6. support frame; 7. rotating rod; 8. first gear; 9. second gear; 10. threaded rod; 11. clamping plate; 12. mounting frame; 13. connecting block; 14. detection probe; 15. rotating block; 16. universal self-locking wheel; 17. limit rod; 18. rubber plate. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0018] See also Figure 1-2 The utility model provides an embodiment of a semiconductor wafer detection device, comprising a base 1, a support plate 2 is fixedly connected to the top of the base 1, a carrying plate 3 is fixedly connected to the top of the support plate 2, a storage plate 4 is arranged above the carrying plate 3, both ends of the storage plate 4 are fixedly connected to the carrying plate 3 through a vertical plate 5, a support frame 6 is fixedly connected to the top of the carrying plate 3, a rotating rod 7 is rotatably inserted on the support frame 6, the rotating rod 7 is rotatably connected to the carrying plate 3, a first gear 8 is fixedly sleeved on the rotating rod 7, both sides of the first gear 8 are provided with meshing second gears 9, one side of the second gear 9 is fixedly connected with a threaded rod 10, one end of the threaded rod 10 is rotatably connected to the inner wall of the support frame 6, a clamping plate 11 is threadedly sleeved on the threaded rod 10, and the top of the clamping plate 11 passes through the support frame 6 and The storage plate 4 extends upward, and the support frame 6 and the storage plate 4 are both provided with sliding openings corresponding to the clamping plate 11. A mounting frame 12 is provided above the storage plate 4. The bottom of both ends of the mounting frame 12 are fixed to the load-bearing plate 3 by connecting blocks 13. The inner top of the mounting frame 12 is fixedly connected with a detection probe 14. Specifically, the workpiece is placed on the storage plate 4, and then the rotating rod 7 is rotated on the support frame 6. At this time, the first gear 8 installed on the rotating rod 7 follows the rotation and then engages with the second gear 9 on both sides to rotate. At this time, the second gear 9 will drive the threaded rod 10 to follow the rotation. When the threaded rod 10 rotates, the clamping plate 11 threadedly sleeved thereon will follow the movement to achieve clamping and fixing of the workpiece, and then the detection operation of the workpiece is achieved through the detection probe 14 at the bottom of the mounting frame 12.

[0019] In this embodiment, a rotating block 15 is fixedly connected to the top of the rotating rod 7, and anti-slip grooves are provided on the outer wall of the rotating block 15 to facilitate the rotation of the rotating rod 7; four universal self-locking wheels 16 are provided at the bottom of the base 1, and the four universal self-locking wheels 16 are respectively fixed at the four corners of the bottom of the base 1 to facilitate the movement of the entire device; a limiting rod 17 is fixedly connected to the sliding mouth on the storage plate 4, and the clamping plate 11 is slidably sleeved on the limiting rod 17 to provide sliding support for the clamping plate 11 to avoid following the revolution of the threaded rod 10; a rubber plate 18 is fixedly connected to one side of the top of the clamping plate 11 to increase the buffering force during clamping; the first gear 8 and the second gear 9 are both bevel gears.

[0020] Working principle: by placing the workpiece on the placement plate 4, and then rotating the rotating rod 7 on the support frame 6, the first gear 8 installed on the rotating rod 7 will rotate accordingly and then engage the second gears 9 on both sides to rotate. At this time, the second gear 9 will drive the threaded rod 10 to rotate accordingly. When the threaded rod 10 rotates, the clamping plate 11 threadedly connected thereto will move accordingly to clamp and fix the workpiece, and then the detection operation of the workpiece will be realized through the detection probe 14 at the bottom of the mounting frame 12.

[0021] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A semiconductor wafer inspection device, comprising a base (1), characterized in that: The top of the base (1) is fixedly connected to a support plate (2), the top of the support plate (2) is fixedly connected to a carrying plate (3), a storage plate (4) is arranged above the carrying plate (3), both ends of the storage plate (4) are fixedly connected to the carrying plate (3) via vertical plates (5), the top of the carrying plate (3) is fixedly connected to a support frame (6), a rotating rod (7) is rotatably inserted on the support frame (6), the rotating rod (7) is rotatably connected to the carrying plate (3), a first gear (8) is fixedly sleeved on the rotating rod (7), both sides of the first gear (8) are provided with meshing second gears (9), and the second gear (9) is meshed with each other. A threaded rod (10) is fixedly connected to one side of the support frame (9), one end of the threaded rod (10) is rotatably connected to the inner wall of the support frame (6), a clamping plate (11) is threadedly sleeved on the threaded rod (10), the top end of the clamping plate (11) passes through the support frame (6) and the storage plate (4) and extends upward, the support frame (6) and the storage plate (4) are both provided with sliding openings corresponding to the clamping plate (11), a mounting frame (12) is provided above the storage plate (4), the bottom ends of the mounting frame (12) are fixed to the bearing plate (3) by connecting blocks (13), and the inner top of the mounting frame (12) is fixedly connected to a detection probe (14).

2. A semiconductor wafer inspection device according to claim 1, characterized in that: The top end of the rotating rod (7) is fixedly connected to a rotating block (15), and the outer wall of the rotating block (15) is provided with anti-slip grooves.

3. A semiconductor wafer inspection device according to claim 1, characterized in that: The bottom of the base (1) is provided with four universal self-locking wheels (16), and the four universal self-locking wheels (16) are respectively fixed at the four corners of the bottom of the base (1).

4. The semiconductor wafer inspection device according to claim 1, characterized in that: A limit rod (17) is fixedly connected in the sliding opening on the storage plate (4), and the clamping plate (11) is slidably sleeved on the limit rod (17).

5. The semiconductor wafer inspection device according to claim 1, characterized in that: A rubber plate (18) is fixedly connected to one side of the top end of the clamping plate (11).

6. The semiconductor wafer inspection device according to claim 1, characterized in that: The first gear (8) and the second gear (9) are both bevel gears.

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