Light source control chip, backlight module, display and electronic equipment

Abstract

The utility model provides a light source control chip, a backlight module, a display and electronic equipment, and relates to the field of display. The light source control chip comprises a substrate, a first crystal grain and a second crystal grain which are located in the same packaging body. The first crystal grain is arranged on the substrate, and the first crystal grain is used for being connected with a light source in a first direction in a backlight module; the second crystal grain is arranged on the substrate, and the second crystal grain is used for being connected with a light source in a second direction in the backlight module. The light source control chip can reduce the cost of the backlight module and improve the integration level.

Description

Technical Field

[0001] The present application relates to the display field, and in particular, to a light source control chip, a backlight module, a display and an electronic device. Background Art

[0002] In the backlight module, multiple light source control chips are set, and each light source control chip is connected to and controls multiple light sources. At present, the control of each row of light sources and the control of each column of light sources in the backlight module use two different independently packaged light source control chips, namely row control chips and column control chips. The row control chip will turn on or off the light source of a row according to the control instructions of the controller, and the column control chip will turn on or off the light source of a column according to the control instructions of the controller and adjust the brightness of the light source in the column.

[0003] Since the two light source control chips are packaged independently, there are problems of high packaging cost and high layout cost. In addition, the layout of the two light source control chips will occupy a large area, which is not conducive to the circuit integration of the backlight module. Utility Model Content

[0004] In view of this, the present application aims to provide a light source control chip, a backlight module, a display and an electronic device to reduce the cost of the light source control chip and improve the integration.

[0005] In a first aspect, an embodiment of the present application provides a light source control chip, comprising: a substrate, a first grain, and a second grain located in the same package; the first grain is arranged on the substrate, and the first grain is used to connect to a light source in a first direction in a backlight module; the second grain is arranged on the substrate, and the second grain is used to connect to a light source in a second direction in the backlight module.

[0006] In this embodiment, the first crystal grain is used to connect to the light source in the first direction of the backlight module, and the second crystal grain is used to connect to the light source in the second direction of the backlight module, that is, the first crystal grain and the second crystal grain are chip crystal grains for controlling and managing the row light source and the column light source respectively. That is, the embodiment of the present application encapsulates the crystal grains for controlling light sources in different directions in the same chip, thereby enabling the light source control chip to control the row light source and the column light source respectively, effectively improving the integration of the light source control chip. Furthermore, when the light source control chip is used to configure the backlight module, there is no need to separately arrange the column tube chip and the row tube chip, which helps to reduce the difficulty of arranging the light source control chip in the backlight module and improve the integration of the backlight module. At the same time, since there is no need to separately package the two light source control chips, the packaging cost can be reduced.

[0007] In one embodiment, the first die is manufactured based on a first process, and the second die is manufactured based on a second process; the first process is different from the second process.

[0008] In the embodiments of the present application, the first grain and the second grain can be made by different processes. Therefore, during production, it is not necessary to make the two grains using the same process. Different grains can be manufactured in a relatively cost-effective manner to reduce costs.

[0009] In one embodiment, the first chip is a chip for controlling the switch of the connected light source; the second chip is a chip for controlling the switch and brightness of the connected light source.

[0010] Generally speaking, the more complex the function of a grain, the higher the difficulty and cost of its manufacturing. In the embodiment of the present application, the first grain and the second grain can be two grains with different functions. For example, the first grain only controls the light source switch, and the second grain can control both the switch and the brightness. Therefore, under the premise of meeting the control requirements of the light source, only one of the grains needs to have this function, and the other grain can use a grain with simpler functions, thereby reducing costs.

[0011] In one embodiment, the second die is stacked with the first die so as to be disposed on the substrate through the first die.

[0012] In the embodiment of the present application, by stacking and arranging the second die above the first die, the chip area occupied by the two die in the light source control chip can be reduced, thereby reducing the area occupied by the light source control chip in the backlight module and improving the integration of the backlight module.

[0013] In one embodiment, the thickness of the first die is less than or equal to a first thickness, and the thickness of the second die is less than or equal to a second thickness; the sum of the first thickness and the second thickness is less than or equal to a prescribed threshold of the package for die thickness.

[0014] Since the packaging specification has a specified threshold for the grain setting of the package body, and the first grain and the second grain are stacked and their thickness may exceed the specified threshold, therefore, in an embodiment of the present application, the thickness of the first grain can be made equal to or less than the first thickness, and the thickness of the second grain can be less than or equal to the second thickness, so that the first grain and the second grain can be stacked in the package body to achieve the purpose of reducing the chip occupied area.

[0015] In one embodiment, the first thickness is greater than or equal to 100 μm and less than or equal to 200 μm; and the second thickness is greater than or equal to 100 μm and less than or equal to 200 μm.

[0016] In the embodiment of the present application, the first crystal grain and the second crystal grain are both thinned to a range of 100 μm to 200 μm, which helps to reduce the overall thickness of the light source control chip, so that the light source control chip can be applied to backlight modules or displays that require thinner thickness.

[0017] In one embodiment, the first die is bonded to the substrate by conductive glue, and the second die is stacked on the first die by non-conductive glue or film adhesive.

[0018] In this embodiment, since the second die is stacked with the first die, and since the die are semiconductors, contact between them will cause malfunction, the second die is stacked on the first die through non-conductive glue or film adhesive so that the two can still work normally when stacked.

[0019] In one embodiment, pins belonging to the same electrical network in the first die and the second die are connected to each other.

[0020] In this embodiment, the functions corresponding to the pins of the same electrical network are usually the same, and the pins of the same electrical network are interconnected so that the electrical networks with the same functions share pins, reducing the number of pins of the light source control chip and improving integration.

[0021] In one embodiment, the pins in the first die and the second die that belong to the same electrical network are connected by gold-copper wire or RDL (Re-distribution Layer) line electroplating.

[0022] Gold-copper wire and electroplating have excellent conductivity. In the embodiment of the present application, pins belonging to the same electrical network are connected by gold-copper wire or RDL line electroplating, which can improve the conductivity between the first grain and the second grain, improve the reliability of signal transmission inside the light source control chip, and thereby improve the reliability of the light source control chip.

[0023] In a second aspect, an embodiment of the present application further provides a backlight module, comprising: a controller; a light source control chip as described in any one of the first aspects, connected to the controller; and a light source, connected to the light source control chip.

[0024] In a third aspect, an embodiment of the present application further provides a display, comprising: a display panel; and a backlight module as described in the second aspect.

[0025] In a fourth aspect, an embodiment of the present application further provides an electronic device, comprising: a backlight module as described in the third aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 A schematic diagram of the structure of a light source control chip provided in one embodiment of the present application;

[0028] Figure 2 A schematic diagram of the structure of a light source control chip provided in another embodiment of the present application;

[0029] Figure 3 A schematic diagram of a backlight module provided in one embodiment of the present application.

[0030] Icons: light source control chip 100 ; substrate 110 ; first die 120 ; second die 130 ; package body 140 ; ​​controller 200 ; light source 300 . DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solution and advantages of the embodiments of the present application more clear, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application and are not used to limit the present application.

[0032] See also Figure 1 , Figure 1 The light source control chip provided in one embodiment of the present application includes a substrate, a first die 120 , a second die 130 and a package 140 .

[0033] The substrate 110, or packaging substrate, is used to carry the die. A circuit is disposed on the substrate to connect the die to an external PCB (Printed circuit board).

[0034] In this embodiment, the type of substrate 110 can be selected according to the type of packaging. For example, it can be divided into a wire bonding packaging substrate and a flip chip packaging substrate, a ball grid array packaging substrate, a pin grid array packaging substrate, a grid array packaging substrate, a chip size packaging substrate, a board on chip packaging substrate, etc., which will not be expanded here.

[0035] The first crystal grain 120 is disposed on the substrate 110, and the first crystal grain 120 is used to connect with the light source in the first direction of the backlight module. The second crystal grain 130 is disposed on the substrate 110, and the second crystal grain 130 is used to connect with the light source in the second direction of the backlight module. For example, the first direction can be the direction in which the light sources in the light source array are arranged in rows, and the second direction can be the direction of columns, or vice versa, that is, the first direction can also be the direction of columns, and the second direction can be the direction of rows, which is not limited here.

[0036] In an embodiment of the present application, the substrate 110, the first crystal grain 120 and the second crystal grain 130 are all in the same package body 140. That is, the first crystal grain 120 and the second crystal grain 130 are packaged into the same light source control chip. In this way, the integration of the light source control chip can be effectively improved, thereby eliminating the need to separately provide corresponding light source control chips for row light sources and column light sources in the backlight module. Accordingly, since the first crystal grain 120 and the second crystal grain 130 are packaged into the same light source control chip, there is no need to separately package the light source control chips for light sources in different directions, thereby reducing the packaging cost.

[0037] In an embodiment of the present application, the functions of controlling the light source by the first chip 120 and the second chip 130 can be brought out through different pins, so that the pins corresponding to different chips are respectively connected to the light sources in different directions, such as the pin corresponding to the first chip 120 is connected to the light source 300 in the first direction, and the pin corresponding to the second chip 130 is connected to the light source in the second direction, thereby enabling different chips to connect and control the light sources in different directions in the backlight module.

[0038] In the embodiment of the present application, the first crystal grain 120 and the second crystal grain 130 may be crystal grains with the same function. For example, the first crystal grain 120 and the second crystal grain 130 may be crystal grains produced under the same process conditions or even from the same batch.

[0039] The same process refers to the same process method and the same process parameter values ​​used when implementing the process method, such as the same time, temperature, position, etc. Different processes refer to different process methods and / or different process parameter values ​​used when implementing the process method, that is, if the same process method is used, but the parameter values ​​used in the process of implementing the process method are different, they can still be considered as different processes in the embodiments of the present application.

[0040] In the embodiment of the present application, the first die 120 and the second die 130 may be different die, including but not limited to die with different functions and manufactured by different processes.

[0041] For example, the first die 120 and the second die 130 may be the die used by the existing row-pipe chip and column-pipe chip.

[0042] In the embodiment of the present application, the first die 120 and the second die 130 may also be die with the same function produced by different processes, that is, the first die 120 is produced based on the first process, and the second die 130 is produced based on the second process; the first process is different from the second process. It can be understood that there are many types of chip manufacturing production processes at present, and different processes can produce die with the same function, which will not be described in detail here.

[0043] In the embodiment of the present application, the first die 120 and the second die 130 may also be die with different functions. For example, the first die 120 may be a die of a row-pipe chip, that is, the first die 120 is a die that only controls the switch of the light source, and the second die 130 may be a die of a column-pipe chip, that is, the second die 130 is a die that controls the switch and brightness of the connected light source 300.

[0044] In other embodiments, the first chip 120 may also be a chip of a column-tube chip, that is, the first chip 120 is a chip that controls the switch and brightness of the connected light source 300, and the second chip 130 may be a chip of a row-tube chip, that is, the second chip 130 is a chip that only controls the switch of the connected light source, and there is no limitation here.

[0045] In the embodiment of the present application, since the functions of the first die 120 and the second die 130 are different, there are differences in the processes or process parameters during the manufacturing process, and the die with different functions can also be considered as die made by different processes.

[0046] Since the first die 120 and the second die 130 can be die with different functions, the die with the required function can be selected according to the requirements, such as replacing one of the die with a die with the required function while the other die remains unchanged, without replacing both die with a die with the required function. In general, the simpler the function of the die, the lower its manufacturing cost will be. Therefore, in this way, the overall cost of the light source control chip can be effectively reduced.

[0047] Taking the row-pipe chip and the column-pipe chip as an example, when the two are manufactured, due to their different functions, such as a large number of control circuits inside the column-pipe chip, the circuit inside the column-pipe chip is more complex than that of the row-pipe chip, so the size of the column-pipe chip that controls the same-sized light source array is much larger than the row-pipe chip. This makes the processes used by the two different, such as the generation process of the column-pipe chip is also more advanced than that of the row-pipe chip. The column-pipe generally needs to use a process below 150nm, while the row-pipe can use a process above 250nm. The smaller the interval, the higher the price, so the cost of the column-pipe chip is higher than that of the column-pipe chip. In the embodiment of the present application, the grains of the row-pipe chip and the column-pipe chip can be configured in the light source control chip at the same time. Since the cost of the row-pipe chip grains is lower than that of the column-pipe chip grains, the cost can be effectively reduced while satisfying the function of controlling the brightness. In other words, while adding the brightness control function to the light source control chip, the cost will not be increased too much.

[0048] In some embodiments of the present application, the second die 130 and the first die 120 are stacked and disposed so as to be disposed on the substrate 110 through the first die 120 .

[0049] like Figure 1 As shown, the second die 130 is arranged above the first die 120 to achieve stacking. In this way, the chip area occupied by the light source control chip as a whole can be effectively reduced. For example, the area required by the original first die 120 is A, and the area required by the second die 130 is B. Assuming that A is larger than B, if the two are arranged on the same plane, the area required by the light source control chip is equal to the sum of the areas required by A, B and other circuits. If they are stacked, the area required by the light source control chip is equal to the sum of the areas required by A and other circuits, that is, the chip area occupied by the die with a smaller area can be saved.

[0050] The implementation method of stacking can refer to the existing stacking packaging, which will not be elaborated here.

[0051] In some other embodiments of the present application, the first die 120 may also be stacked on the second die 130, that is, the first die 120 is disposed on the substrate 110 through the second die 130. Regardless of the up-and-down relationship between the first die 120 and the second die 130, the effect of saving area can be achieved.

[0052] In some embodiments of the present application, the grain with a larger area may be arranged at the bottom, and the grain with a smaller area may be arranged at the top, that is, when the area of ​​the first grain 120 is larger than the area of ​​the second grain 130, the second grain 130 and the first grain 120 are stacked and arranged, and the second grain 130 is arranged on the substrate 110 through the first grain 120. Conversely, if the area of ​​the second grain 130 is larger than the area of ​​the first grain 120, the first grain 120 may also be arranged on the substrate 110 through the second grain 130. If the areas of the two are equal, the upper and lower position relationship is not limited.

[0053] Different dies can be manufactured separately, but in the packaging process, two dies need to be packaged in the same package body 140, and the pins need to be connected through bonding and other processes. In the process of stacking packaging, the dies are arranged from bottom to top. If the dies with smaller areas are arranged at the bottom, it is not convenient to connect the pins and to observe the position, which increases the difficulty of packaging. Therefore, in this embodiment, the dies with larger areas can be arranged at the bottom, and the dies with smaller areas can be arranged at the top, which helps to reduce the difficulty of manufacturing.

[0054] In some other embodiments, the area of ​​the first grain may be smaller than the area of ​​the second grain.

[0055] It can be understood that in some scenarios, there are requirements for the order of overlapping grains. Therefore, the area size and stacking order between the first grain and the second grain will not affect the functional realization of the light source control chip, and will not affect the improvement of integration. To a certain extent, it also achieves the effect of reducing costs. Therefore, in the embodiments of the present application, the first grain with a smaller area can also be arranged under the second grain with a larger area to meet the needs of different scenarios. The present application does not limit the size and position relationship between the first grain and the second grain.

[0056] See also Figure 2 , Figure 2 A schematic diagram of a light source control chip provided in another embodiment of the present application. In this embodiment, the first die 120 and the second die 130 can also be arranged on the same plane, that is, they are not stacked. Although this method cannot reduce the occupied chip area, the packaging difficulty is relatively low, and it can be used in scenarios with low chip area requirements.

[0057] During the chip packaging process, there are certain requirements for the thickness of the package body 140, and due to the stacking of two dies, its thickness may exceed the packaging requirements. Therefore, in the embodiment of the present application, the thickness of the first die 120 can be less than or equal to the first thickness, and the thickness of the second die 130 can be less than or equal to the second thickness; the sum of the first thickness and the second thickness is less than or equal to the prescribed threshold of the die thickness of the package body 140.

[0058] The first crystal grain 120 can be made less than or equal to the first thickness, and the second crystal grain 130 can be made less than or equal to the second thickness by using an existing thinning method. For example, after obtaining a wafer including the first crystal grain 120, the wafer is thinned to the first thickness, and then the wafer with the first thickness is divided to obtain the first crystal grain 120. Similarly, after obtaining a wafer including the second crystal grain 130, the wafer is thinned to the second thickness, and then the wafer with the second thickness is divided to obtain the second crystal grain 130.

[0059] As the requirements for display thickness increase, the display thickness needs to be thinner, which may make the thickness of the backlight module and the light source control chip required to be thinner. Therefore, in some embodiments of the present application, the first thickness may be greater than or equal to 100μm and less than or equal to 200μm; the second thickness may be greater than or equal to 100μm and less than or equal to 200μm.

[0060] Thinning the first crystal grain and the second crystal grain to a range of 100 μm to 200 μm helps to reduce the overall thickness of the light source control chip, so that the light source control chip can be applied to a backlight module or display that requires a thinner thickness.

[0061] In an embodiment of the present application, if the first crystal grain 120 and the second crystal grain 130 are both arranged on the same plane, that is, both are directly arranged on the surface of the substrate 110, the first crystal grain 120 and the second crystal grain 130 can be bonded to the electrode plate through a conductive adhesive and fixed by high-temperature baking.

[0062] If the first die 120 and the second die 130 are stacked, since the die is a semiconductor, if different die are in direct contact, the two may not work properly. Therefore, in the present application, if the second die 130 is stacked with the first die 120, and the second die 130 is arranged on the substrate 110 through the first die 120, then the first die 120 is bonded to the substrate 110 through a conductive adhesive, and the second die 130 is stacked on the first die 120 through a non-conductive adhesive or a film adhesive.

[0063] The non-conductive glue and the film adhesive have a fixing effect after high-temperature baking and are non-conductive. The non-conductive glue or the film adhesive is used to separate the first die 120 and the second die 130 so that the first die 120 and the second die 130 can work normally.

[0064] The first die 120 and the second die 130 have the same functions, such as power input, output, communication, etc. If the two die are provided with pins respectively, the pins of the light source control chip may be too complicated, and it is not easy to improve the integration.

[0065] Therefore, in some embodiments of the present application, pins in the first die 120 and the second die 130 that belong to the same electrical network may be connected to each other.

[0066] The pins of the same electrical network have the same function, so the pins of the same electrical network can be connected to each other, so that the light source control chip is internally conductive and connected to internal circuits, and can be easily led out by external pins.

[0067] When the pins belonging to the same electrical network in the first die 120 and the second die 130 are connected to each other internally, the connection can be performed by gold-copper wire or RDL line electroplating to reduce the internal resistance of the light source control chip and improve the reliability of the light source control chip.

[0068] In addition, on the light source control chip, the chip function can be led out of the plastic package through pins, and the pins can be circuited. The surface of the plastic package can also be laser printed with chip identification information, etc. This will not be expanded here.

[0069] The embodiment of the present application encapsulates the crystal grains of the row-pipe chip and the crystal grains of the column-pipe chip in the same chip, thereby effectively improving the integration of the light source control chip. When the light source control chip is used to set up a backlight module, there is no need to separately arrange the column-pipe chip and the row-pipe chip, which helps to reduce the difficulty of arranging the light source control chip in the backlight module and improve the integration of the backlight module. At the same time, since there is no need to separately package the two light source control chips, the packaging cost can be reduced.

[0070] For ease of understanding, an embodiment is provided herein for illustration.

[0071] In this embodiment, the light source control chip includes a first die 120, a second die 130, a substrate 110 and a package 140. The first die 120 is a die of a row-pipe chip, the second die 130 is a die of a column-pipe chip, the thickness of the first die 120 is a first thickness, obtained by thinning the wafer of the first die 120 to the first thickness and then cutting, and the thickness of the second die 130 is a second thickness, obtained by thinning the wafer of the first die 120 to the second thickness and then cutting. The sum of the first thickness and the second thickness is less than the prescribed threshold value of the die thickness of the package 140. The first die 120 is a die of a row-pipe chip, and the die is manufactured by a process of more than 250nm, and has the function of controlling the switch of the light source 300. The second die 130 is a column-pipe chip, manufactured by a process of less than 150nm, and has the function of controlling the switch and brightness of the light source 300. The area of ​​the first die 120 is smaller than the area of ​​the second die 130.

[0072] In the light source control chip, the first die 120 is arranged on the surface of the substrate 110 and fixedly connected to the substrate by conductive glue, and the second die 130 is arranged above the first die 120 and bonded to the first die 120 by non-conductive glue or film adhesive. The pins belonging to the same electrical network in the first die 120 and the second die 130 are connected by gold copper wire or electroplating.

[0073] Based on the same concept, the present application also provides a backlight module. Figure 3 , Figure 3 This is a schematic diagram of a backlight module provided in an embodiment of the present application. The backlight module includes: a controller 200 , a plurality of light source control chips and a plurality of light sources 300 .

[0074] The light source control chip may be the light source control chip provided by any of the above embodiments.

[0075] The controller 200 is connected to each light source control chip, and is used to send a control signal to each light source control chip, so that each light source control chip controls the switch and brightness of the light source 300 .

[0076] The plurality of light sources 300 are arranged as a light source array, and the light sources 300 in different rows or columns are respectively connected to different light source control chips.

[0077] Based on the same inventive concept, the embodiment of the present application further provides a display, which may include a display panel and a backlight module as provided in the above embodiment. The display may also have other structures, which may be specifically referred to in the prior art and will not be elaborated here.

[0078] Based on the same inventive concept, an embodiment of the present application further provides an electronic device, which includes the display provided in the above embodiment.

[0079] In the embodiments of the present application, the electronic device may be a discrete device, for example, the electronic device may be a computer including a host and a display. The electronic device may also be an integrated device, for example, the electronic device may be a mobile phone, a tablet computer, a television, or other electronic device in which a processor and a display are integrated in the same housing. This is not limited here.

[0080] The technical features of the above embodiments can be freely combined without conflict, and the embodiments obtained by the combination are included in the protection scope of this application.

[0081] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

[0082] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that an article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such articles or devices. In the absence of more restrictions, an element defined by the sentence "includes a ..." does not exclude the existence of other identical elements in the article or device including the element.

Claims

1. A light source control chip, characterized in that: include: A substrate, a first die, and a second die are located in the same package; The first crystal grain is disposed on the substrate, and the first crystal grain is used to connect with a light source in a first direction in the backlight module; The second chip is disposed on the substrate, and the second chip is used to connect with the light source in the second direction of the backlight module.

2. The light source control chip according to claim 1, characterized in that: The first die is manufactured based on a first process, and the second die is manufactured based on a second process; the first process is different from the second process.

3. The light source control chip according to claim 1, characterized in that: The first chip is a chip for controlling the switch of the connected light source; the second chip is a chip for controlling the switch and brightness of the connected light source.

4. The light source control chip according to any one of claims 1 to 3, characterized in that: The second die is stacked with the first die so as to be disposed on the substrate through the first die.

5. The light source control chip according to claim 4, characterized in that: The thickness of the first die is less than or equal to a first thickness, and the thickness of the second die is less than or equal to a second thickness; the sum of the first thickness and the second thickness is less than or equal to a threshold value of the package body for die thickness.

6. The light source control chip according to claim 5, characterized in that: The first thickness is greater than or equal to 100 μm and less than or equal to 200 μm; The second thickness is greater than or equal to 100 μm and less than or equal to 200 μm.

7. The light source control chip according to claim 4, characterized in that: The first die is bonded to the substrate by conductive glue, and the second die is stacked on the first die by non-conductive glue or film adhesive.

8. The light source control chip according to claim 4, characterized in that: The pins in the first die and the second die that belong to the same electrical network are connected to each other.

9. The light source control chip according to claim 8, characterized in that: The pins in the first die and the second die that belong to the same electrical network are connected by electroplating with gold-copper wires or RDL lines.

10. A backlight module, characterized in that: include: Controller; The light source control chip according to any one of claims 1 to 9, connected to the controller; A light source is connected to the light source control chip.

11. A display, characterized in that: include: Display panel; The backlight module as claimed in claim 10.

12. An electronic device, characterized in that: include: The display as claimed in claim 11.

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