Filter

Abstract

The utility model discloses a filter which comprises a shell, a circuit board, an input connector and an output connector, wherein the input connector and the output connector are arranged on the two sides of the shell. The shell comprises an upper cover and a lower cover, the upper cover is detachably mounted on the lower cover, and the lower cover is provided with an isolation wall; the circuit board is arranged between the upper cover and the lower cover and comprises a plurality of conductive through holes penetrating through the circuit board and two metal resonance layers arranged on two opposite sides of the circuit board; each of the two metal resonance layers comprises a plurality of resonators arranged at intervals, isolation patterns for isolating adjacent resonators and a grounding frame connected with the plurality of resonators are correspondingly connected with each other through a plurality of conductive through holes, and the isolation patterns of the two metal resonance layers are correspondingly configured on the isolation walls; the grounding frames of the two metal resonance layers are correspondingly arranged on the edge, facing the upper cover, of the lower cover; the connecting rod of the input connector is connected with a resonator positioned on one side edge in the shell; the connecting rod of the output connector is connected with a resonator located on the other side edge in the shell.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to a filter. Background Art

[0002] In wireless communication systems, interference from the external environment can seriously affect the performance of the entire system. Therefore, filters used to select communication signals and filter out clutter or interference signals become indispensable components.

[0003] However, different communication environments require filters of different specifications. The materials and sizes of the resonators required for filters of different specifications cannot be unified, and multiple processing methods may be required (for example, turning, milling, CNC processing, stretching, cold heading, etc.), resulting in high processing costs and the problem of not being able to produce modular products in large quantities. In addition, filters of different specifications also have the problem of relatively unstable part sizes and complex assembly. Utility Model Content

[0004] The embodiment of the present application provides a filter, which can solve the problems in the prior art that filters suitable for different communication environments cannot be produced in a modularized manner in large quantities due to different specifications, and the size of parts is relatively unstable and the assembly is complicated.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] The present application provides a filter, which includes: a housing, a circuit board, an input connector and an output connector. The housing includes an upper cover and a lower cover, the upper cover is detachably mounted on the lower cover, and the lower cover is provided with a partition wall; the circuit board is provided between the upper cover and the lower cover, and includes a plurality of conductive through holes penetrating the circuit board and two metal resonant layers provided on opposite sides of the circuit board, the two metal resonant layers each include a plurality of resonators provided at intervals, an isolation pattern isolating adjacent resonators, and a grounding frame connected to the plurality of resonators, which are connected to each other through a plurality of conductive through holes, the isolation pattern included in each of the two metal resonant layers is correspondingly configured on the partition wall, and the grounding frame included in each of the two metal resonant layers is correspondingly configured on the edge of the lower cover facing the upper cover; the input connector is provided on one side of the housing, and the connecting rod of the input connector is connected to a resonator located on one side of the housing; the output connector is provided on the other side of the housing, and the connecting rod of the output connector is connected to a resonator located on the other side of the housing.

[0007] In the embodiment of the present application, an air cavity is simulated by designing an isolation pattern and a ground frame integrated on a circuit board and a housing (i.e., an upper cover and a lower cover), and a printed circuit board (PCB) stack filter is formed with a resonator integrated on the circuit board. Among them, the PCB board stack filter includes an upper cover, a lower cover, a circuit board with two metal resonant layers integrated, an input connector, and an output connector; the upper cover and the lower cover can be made of alloy material, and their surfaces can be silver-plated, copper-plated, or gold-plated; the two metal resonant layers can be integrated on the circuit board by sinking aluminum, sinking copper, sinking silver, or sinking gold; therefore, the PCB board stack filter has an easy-to-build framework, and the power, frequency, insertion loss, and coupling required by the filter can also achieve optimal electrical performance in a limited space, so that it is suitable for various topological structures, and it can also solve the problem that filters suitable for different communication environments in the prior art cannot be mass-produced modularly due to different specifications, and the size of parts is relatively unstable and the assembly is complicated. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are configured to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0009] Figure 1 is a three-dimensional schematic diagram of an embodiment of a filter according to the present application;

[0010] Figure 2 for Figure 1 Exploded diagram of the filter;

[0011] Figure 3 for Figure 1 The schematic cross-sectional view of the AA line segment shown;

[0012] Figure 4 for Figure 1 The schematic cross-sectional view of line segment BB shown;

[0013] Figure 5 for Figure 1 Schematic diagram of the integration of the circuit board and the metal resonance layer;

[0014] Figure 6 for Figure 5 A side view schematic diagram of

[0015] Figure 7 A side view of an embodiment of a circuit board of the present application; and

[0016] Figure 8 for Figure 2 Simulation characteristic curve of the transmission coefficient and reflection coefficient of the filter. DETAILED DESCRIPTION

[0017] The following will be used in conjunction with the accompanying drawings to illustrate the embodiments of the present utility model. In these drawings, the same reference numerals represent the same or similar components or method flows.

[0018] It must be understood that the words "comprise", "include", etc. used in this specification are configured to indicate the existence of specific technical features, values, method steps, job processing and / or components, but do not exclude the addition of more technical features, values, method steps, job processing, components, or any combination of the above.

[0019] It should be understood that when a component is described as being "connected" or "coupled" to another component, it may be directly connected or coupled to the other component, and intermediate components may be present. Conversely, when a component is described as being "directly connected" or "directly coupled" to another component, there are no intermediate components.

[0020] See also Figures 1 to 5 , Figure 1 is a three-dimensional schematic diagram of an embodiment of a filter according to the present application, Figure 2 for Figure 1 Exploded diagram of the filter, Figure 3 for Figure 1 The AA line segment cross-section diagram shown in FIG. Figure 4 for Figure 1 The BB line section diagram shown in FIG. Figure 5 for Figure 1 Schematic diagram of the integration of the circuit board and the metal resonance layer. Figures 1 to 5 As shown, the filter 1 includes: a housing 11 , a circuit board 12 , an input connector 13 and an output connector 14 .

[0021] The housing 11 includes an upper cover 111 and a lower cover 112. The upper cover 111 is detachably mounted on the lower cover 112. The lower cover 112 is provided with a partition wall 1121. The upper cover 111 and the lower cover 112 only need to have metal surfaces. Therefore, they can be produced in large quantities using various materials (e.g., alloy materials) and then subjected to electroplating metal (e.g., silver, copper, or gold) treatment.

[0022] The circuit board 12 is disposed between the upper cover 111 and the lower cover 112, and includes a plurality of conductive through holes 121 (such as Figure 2 , Figure 3 and Figure 5 ) and two metal resonant layers 122 disposed on opposite sides of the circuit board 12 (ie, the two metal resonant layers 122 are integrated on the circuit board 12, as shown in the dotted circle in FIG. Figure 6 As shown, Figure 6 for Figure 5It should be noted that in order to avoid Figure 6 The drawing is too complicated, and only four conductive through holes 121 are drawn as a representative), the two metal resonant layers 122 each include a plurality of resonators 1221 arranged at intervals, an isolation pattern 1222 isolating adjacent resonators 1221, and a ground frame 1223 connected to the plurality of resonators 1221, and the plurality of resonators 1221, the isolation pattern 1222 and the ground frame 1223 included in the two metal resonant layers 122 are connected to each other through a plurality of conductive through holes 121 (that is, the two metal resonant layers 122 arranged on opposite sides of the circuit board 12 are electrically connected to each other through a plurality of conductive through holes 121).

[0023] The isolation patterns 1222 included in each of the two metal resonant layers 122 are correspondingly configured on the isolation wall 1121, and the grounding frames 1223 included in each of the two metal resonant layers 122 are correspondingly configured on the edge 1122 of the lower cover 112 facing the upper cover 111, so as to simulate the air cavity required for forming the filter 1; the number and shape of the isolation patterns 1222 and the isolation walls 1121 correspond to each other (in this embodiment, the number of the isolation patterns 1222 and the isolation walls 1121 is three, the shapes of the two isolation patterns 1222 are long strips, and the shape of one isolation pattern 1222 is T-shaped) ; The number, shape and configuration position of the resonator 1221 and the isolation pattern 1222 can be designed according to the signal transmission path and other requirements of the filter 1 (in this embodiment, the shape of the resonator 1221 is an inverted mountain, and the number of resonators 1221 is eight, arranged in two rows and showing a mirror distribution); the material of the multiple conductive through holes 121 and the two metal resonant layers 122 can be the same or different; the two metal resonant layers 122 can be patterned and integrated on the circuit board 12 by using aluminum, copper, silver or gold, which is conducive to large-scale modular production and does not have the problem of complex assembly. It should be noted that in this embodiment, the shapes of the multiple resonators 1221, isolation patterns 1222 and ground frames 1223 included in the two metal resonant layers 122 are all the same, so, Figure 2 , Figure 3 and Figure 5 Only the shapes of the multiple resonators 1221, the isolation patterns 1222 and the ground frame 1223 of a single metal resonance layer 122 are depicted.

[0024] The input connector 13 is arranged on one side of the housing 11, and the connecting rod 131 of the input connector 13 is connected to a resonator 1221 located on one side of the housing 11; the output connector 14 is arranged on the other side of the housing 11, and the connecting rod 141 of the output connector 14 is connected to a resonator 1221 located on the other side of the housing 11. The input connector 13 is used to input signals to the filter 1, and the output connector 14 is used to output signals filtered by the filter 1. The input connector 13 and the output connector 14 can be arranged on both sides of the housing 11 by screws 2, and the connecting rod 131 of the input connector 13 is connected to the adjacent resonator 1221, and the connecting rod 141 of the output connector 14 is connected to the adjacent resonator 1221. The resonators 1221 connected to the input connector 13 and the output connector 14 are located on the same metal resonant layer 122 (such as Figure 3 shown).

[0025] In one embodiment, the filter 1 may further include a tap plate 15, which is disposed in the housing 11 and integrated on the circuit board 12, and the connecting rod 131 of the input connector 13 is connected to a resonator 1221 located on one side of the housing 11 through the tap plate 15.

[0026] In one embodiment, the connecting rod 141 of the output connector 14 may be a connector inner conductor 1411 and a connecting main rod 1412 , and the connector inner conductor 1411 is connected to a resonator 1221 located on the other side of the housing 11 via the connecting main rod 1412 .

[0027] In one embodiment, the upper cover 111 may be provided with a plurality of screw holes 1111, and the filter 1 may further include a plurality of tuning screws 16 and / or a plurality of coupling screws 17, and the plurality of tuning screws 16 and / or a plurality of coupling screws 17 pass through the plurality of screw holes 1111 and extend into the housing 11. The length of the tuning screws 16 and the coupling screws 17 extending into the housing 11 is adjustable, the tuning screws 16 are used to adjust the resonant frequency, and the coupling screws 17 are used to adjust the coupling amount, so as to improve the accuracy of the filter 1, so that the overall index of the filter 1 can be adjusted, and it is convenient for mass production; the tuning screws 16 and the coupling screws 17 may be made of alloy material, and the surfaces of the tuning screws 16 and the coupling screws 17 may be passivated, plated with metal (for example: copper, silver, gold) and waxed.

[0028] In one embodiment, a positioning pin 1123 may be provided on the edge 1122 of the lower cover 112 facing the upper cover 111, and a positioning ear 124 having a positioning hole 123 may be provided on the circuit board 12. The positioning pin 1123 and the positioning hole 123 of the positioning ear 124 are aligned and matched to fix the circuit board 12. The number and configuration positions of the positioning pins 1123 and the positioning ears 124 can be adjusted according to actual needs.

[0029] In one embodiment, solder paste may be provided on the edge 1122 of the lower cover 112 facing the upper cover 111 , and the lower cover 112 and the ground frame 1223 disposed on the circuit board 12 are welded by the solder paste.

[0030] In one embodiment, the periphery of the lower cover 112 may be provided with a plurality of thread grooves 1124, the periphery of the upper cover 111 may be provided with a plurality of connection ears 1113 provided with threaded holes 1112, and the filter 1 may further include a plurality of screws 18, and the plurality of connection ears 1113 and the plurality of thread grooves 1124 are connected by the plurality of screws 18 to mount the upper cover 111 on the lower cover 112. Therefore, when the filter 1 fails and needs to be repaired or replaced when the circuit board 12 provided with two metal resonance layers 122 installed in the housing 11 is replaced, it can be easily disassembled and repeatedly assembled for use.

[0031] In one embodiment, the greater the density of the plurality of conductive vias 121 connecting the resonators 1221, the greater the quality factor (Q value) of the plurality of resonators 1221 included in each of the two metal resonant layers 122. Specifically, the denser the plurality of conductive vias 121, the more obvious the improvement in the Q value, but when the spacing between adjacent conductive vias 121 is less than or equal to one eighth of the wavelength of the resonant frequency of the filter 1, the influence on the Q value will gradually decrease.

[0032] In one embodiment, the shapes of the plurality of resonators 1221 included in each of the two metal resonant layers 122 may be the same or different.

[0033] In one embodiment, the shapes of the plurality of resonators 1221 included in each of the two metal resonant layers 122 may be inverted mountain shapes, T shapes, S shapes, F shapes, or other irregular shapes.

[0034] In one embodiment, the two metal resonant layers 122 may each further include a cross-coupling pattern 1224 (i.e., a flying rod) for realizing capacitive cross-coupling between two non-adjacent resonators 1221, and the cross-coupling patterns 1224 included in the two metal resonant layers 122 are correspondingly connected through a plurality of conductive vias 121. The number and configuration positions of the cross-coupling patterns 1224 may be designed according to the actual requirements of the filter 1. Therefore, the cross-coupling patterns 1224 may be integrated and configured on the circuit board 12, which is conducive to mass modular production without the problem of complex assembly.

[0035] In one embodiment, one of the two metal resonant layers 122 may further include a reinforcing rib 1225 connecting two adjacent resonators 1221. The reinforcing rib 1225 is used to strengthen the coupling strength between the two connected resonators 1221; the number and configuration position of the reinforcing rib 1225 may be designed according to the actual requirements of the filter 1. Therefore, the reinforcing rib 1225 may be integrated and configured on the circuit board 12, which is conducive to mass modular production without the problem of complex assembly.

[0036] In one embodiment, the circuit board 12 may be any one of a single-layer board, a double-layer board, and a multi-layer board. The more layers the circuit board 12 has, the smaller the quality factor (Q value) of the multiple resonators 1221 included in each of the two metal resonance layers 122. In other words, the more layers the circuit board 12 has, the Q value of the multiple resonators 1221 included in each of the two metal resonance layers 122 will gradually deteriorate.

[0037] In one embodiment, the circuit board 12 may be a multi-layer board and may include a plurality of wiring layers 125 and a plurality of dielectric layers 126 that are stacked alternately. The plurality of dielectric layers 126 may be made of the same material or different materials. The plurality of wiring layers 125 and the two metal resonant layers 122 are electrically connected via a plurality of conductive vias 127 that penetrate the dielectric layers 126 (e.g., Figure 7 As shown, Figure 7 This is a side view of an embodiment of the circuit board of the present application. It should be noted that in order to avoid Figure 7 The drawing is too complex, and only four conductive vias 127 are drawn as a representative).

[0038] In one embodiment, the structural shapes of the plurality of wiring layers 125 and the two metal resonant layers 122 may be the same or different.

[0039] In one embodiment, the more the number of the wiring layers 125 is, the greater the Q value of the resonators 1221 included in each of the two metal resonant layers 122 is.

[0040] See also Figure 2 and Figure 8 , Figure 8 for Figure 2 The transmission coefficient (S21) and reflection coefficient (S11) of the filter are simulated characteristic curves, where: Figure 8 The horizontal axis is frequency, and the unit is Hertz (Hz); Figure 8 The left vertical axis is the transmission coefficient (S21), in decibels (dB); Figure 8 The right vertical axis is the reflection coefficient (S11), in decibels (dB); Figure 8 The solid line is the simulation characteristic curve of the reflection coefficient; Figure 8 The dotted line is the simulation characteristic curve of the transmission coefficient. Figure 2and Figure 8 As shown, filter 1 uses eight resonators 1221 and loads three transmission poles (at the low end (i.e. Figure 8 The left side of the Figure 8 Two zero points are generated on the right side of the filter 1), which satisfies the passband low loss characteristics of filter 1 and presents the characteristics of a bandpass filter.

[0041] In summary, by integrating the isolation pattern and ground frame and the shell (i.e., the upper cover and the lower cover) configured on the circuit board, an air cavity is simulated and formed, and the resonator integrated on the circuit board is matched to form a PCB stacked filter. Among them, the PCB stacked filter includes an upper cover, a lower cover, a circuit board with two metal resonant layers integrated, an input connector and an output connector; the upper cover and the lower cover can be made of alloy material, and the surface can be silver-plated, copper-plated or gold-plated; the two metal resonant layers can be integrated on the circuit board by aluminum, copper, silver or gold; therefore, the PCB stacked filter has an easy-to-build frame, and the power, frequency, insertion loss and coupling required by the filter can also achieve optimal electrical performance in a limited space, so that it is suitable for various topological structures, and it can also solve the problem that filters suitable for different communication environments in the prior art cannot be mass-produced modularly due to different specifications, the size of parts is relatively unstable and the assembly is complicated.

[0042] Although the present invention is described using the above embodiments, it should be noted that these descriptions are not configured to limit the present invention. On the contrary, the present invention covers obvious modifications and similar arrangements that are obvious to those skilled in the art. Therefore, the scope of the claims should be interpreted in the broadest way to include all obvious modifications and similar arrangements.

Claims

1. A filter, characterized in that: include: The housing comprises: an upper cover and a lower cover, wherein the upper cover is detachably mounted on the lower cover, and the lower cover is provided with a partition wall; A circuit board is arranged between the upper cover and the lower cover, comprising a plurality of conductive through holes penetrating the circuit board and two metal resonance layers arranged on opposite sides of the circuit board, wherein the two metal resonance layers respectively comprise a plurality of resonators arranged at intervals, an isolation pattern isolating adjacent resonators, and a ground frame connected to the plurality of resonators, which are connected to each other correspondingly through the plurality of conductive through holes, the isolation pattern respectively comprised by the two metal resonance layers is correspondingly arranged on the isolation wall, and the ground frame respectively comprised by the two metal resonance layers is correspondingly arranged on the edge of the lower cover facing the upper cover; an input connector, disposed on one side of the housing, wherein a connecting rod of the input connector is connected to a resonator located on one side of the housing; and The output connector is arranged on the other side of the shell, and the connecting rod of the output connector is connected to a resonator located on the other side of the shell.

2. The filter according to claim 1, characterized in that It also includes a tap plate, which is arranged in the shell and integrated on the circuit board. The connecting rod of the input connector is connected to the resonator located on the one side of the shell through the tap plate.

3. The filter according to claim 1, characterized in that The connecting rod of the output connector is a connector inner conductor and a connecting main rod, and the connector inner conductor is connected to the resonator located on the other side of the shell through the connecting main rod.

4. The filter according to claim 1, characterized in that The upper cover is provided with a plurality of screw holes, and the filter further comprises a plurality of tuning screws and / or a plurality of coupling screws, and the plurality of tuning screws and / or the plurality of coupling screws pass through the plurality of screw holes and extend into the housing.

5. The filter according to claim 1, characterized in that A positioning pin is provided on the edge of the lower cover facing the upper cover, and a positioning ear with a positioning hole is provided on the circuit board, and the positioning pin and the positioning hole are aligned and matched.

6. The filter according to claim 1, characterized in that The edge of the lower cover facing the upper cover is provided with solder paste, and the lower cover and the ground frame arranged on the circuit board are welded by the solder paste.

7. The filter according to claim 1, characterized in that The periphery of the lower cover is provided with a plurality of threaded grooves, the periphery of the upper cover is provided with a plurality of connecting ears with threaded holes, and the filter further comprises a plurality of screws, the plurality of connecting ears and the plurality of threaded grooves are connected by the plurality of screws so as to mount the upper cover on the lower cover.

8. The filter according to claim 1, characterized in that The circuit board is any one of a single-layer board, a double-layer board, and a multi-layer board. The more layers the circuit board has, the smaller the quality factor of the multiple resonators included in each of the two metal resonance layers.

9. The filter according to claim 1, characterized in that The circuit board includes a plurality of wiring layers and a plurality of dielectric layers which are stacked alternately, and the plurality of dielectric layers are made of the same material or different materials.

10. The filter according to claim 9, characterized in that The more the number of the wiring layers is, the greater the quality factor of the resonators included in each of the two metal resonant layers is.

11. The filter according to claim 9, characterized in that The plurality of wiring layers and the two metal resonant layers may have the same or different structural shapes.

12. The filter according to claim 1, characterized in that The greater the density of the plurality of conductive vias connecting the resonators, the greater the quality factor of the plurality of resonators included in each of the two metal resonant layers.

13. The filter according to claim 1, characterized in that The shapes of the plurality of resonators included in each of the two metal resonant layers are the same or different.

14. The filter according to claim 1, characterized in that The multiple resonators included in each of the two metal resonance layers are in an inverted mountain shape, a T shape, an S shape, an F shape or other irregular shapes.

15. The filter according to claim 1, characterized in that The two metal resonance layers each further include a cross-coupling pattern for realizing capacitive cross-coupling between two non-adjacent resonators, and the cross-coupling patterns included in each of the two metal resonance layers are correspondingly connected through the plurality of conductive through holes.

16. The filter according to claim 1, characterized in that One of the two metal resonance layers further includes a reinforcing rib connecting two adjacent resonators.

Images