Combined heat-conducting silica gel sheet with embedded heat-conducting structure
By designing a combined thermally conductive silicone sheet with embedded thermal conductive structure, and using the combination of frame and thermal conductive components, the thermal conductive area can be flexibly adjusted, solving the problem of insufficient heat dissipation caused by the fixed area of traditional thermal conductive products, and achieving a more efficient heat dissipation effect.
Patent Information
- Application Number
- CN202420970505.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-07
- Publication Date
- 2025-01-21
- Estimated Expiration
- 2034-05-07
AI Technical Summary
The design area of existing embedded thermal conductivity products is fixed and cannot be adjusted according to actual application needs, resulting in insufficient heat dissipation area and cannot meet the heat dissipation requirements of some specific equipment.
A combined thermally conductive silicone sheet with embedded thermal conductive structure is designed. Through the combination of frame and thermal conductive components, the thermal conductive area can be flexibly adjusted. Thermal conductive components include heat-absorbing layers, heat-conducting frames, thermal conductive layers and adhesive layers. Through the combination and structural design of these layers, effective heat conduction and dissipation are achieved.
Through the design of this combined thermally conductive silicone sheet, it can be customized according to the size and shape of different devices to achieve a more efficient heat dissipation effect and solve the problem of insufficient heat dissipation caused by the fixed area of traditional thermally conductive products.
Smart Images
Figure CN222382001U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat-conducting silicone sheets, in particular to a combined heat-conducting silicone sheet with an embedded heat-conducting structure. Background Art
[0002] As the performance of electronic devices continues to improve, the heat they generate is also increasing. Therefore, a more effective heat dissipation solution is needed to ensure the stable operation of the equipment. Traditional thermal conductive silicone sheets are made of a single material, and their thermal conductivity and heat dissipation effects are limited. In order to improve the heat dissipation efficiency of thermal conductive silicone sheets, a combined thermal conductive silicone sheet with an embedded thermal conductive structure came into being.
[0003] Existing technologies include: embedded thermal conductive structure, embedding thermal conductive structure inside thermal conductive silicone sheet. These structures can increase the thermal conduction path, improve heat conduction efficiency, and effectively transfer heat to the radiator surface. Combined design, combined thermal conductive silicone sheet combines thermal conductive silicone and embedded thermal conductive structure to form an integrated heat dissipation material. This design takes into account softness and adaptability, improves thermal conductivity and heat dissipation efficiency, and optimizes the heat conduction path.
[0004] However, the design area of existing embedded thermal conductive products is fixed and cannot be adjusted according to actual application needs, which will result in insufficient heat dissipation area and cannot meet the heat dissipation requirements of some specific equipment. Since the size of embedded thermal conductive products is fixed, they cannot be customized according to the size and shape of different equipment. Therefore, for some equipment with non-standard sizes or shapes, existing embedded thermal conductive products cannot function effectively. Therefore, a combined thermal conductive silicone sheet with an embedded thermal conductive structure is proposed to solve the above problems. Utility Model Content
[0005] In order to make up for the above shortcomings, the utility model provides a combined thermally conductive silicone sheet with an embedded thermally conductive structure, aiming to improve the problem in the prior art that the thermal conductive area is fixed and cannot be expanded.
[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a combined thermally conductive silicone sheet with an embedded thermal conductive structure, comprising a frame, a thermally conductive component is arranged inside the frame, blocks are fixedly connected to the left and rear sides of the frame, buckles are slidably connected to the front and right sides of the frame, limiting plates are slidably connected to the front and right sides of the frame, sliders are slidably connected to the front and right sides of the frame, one end of the two limiting plates is respectively fixedly connected to one end of the two buckles, springs are sleeved on the outer circumferences of the two buckles, the other ends of the two limiting plates are respectively fixedly connected to one end of the two sliders, card slots are provided on the front and right sides of the frame, and sliding slots are provided on the front and right sides of the upper part of the frame.
[0007] Furthermore, the heat-conducting component includes a heat-absorbing layer, the heat-absorbing layer is fixedly connected to the inner wall of the frame, a heat-conducting frame is fixedly connected inside the heat-absorbing layer, an adhesive layer is fixedly connected to the bottom of the heat-absorbing layer, and a heat-conducting layer is fixedly connected to the top of the heat-absorbing layer.
[0008] Furthermore, the two buckles and the two limiting plates are respectively slidably connected inside the two sliding grooves, and the two sliding blocks are respectively slidably connected inside the two sliding grooves.
[0009] Furthermore, one end of the two springs is respectively fixedly connected to the inside of the two slide grooves, and the other end of the two springs is respectively fixedly connected to one end of the two limit plates.
[0010] Furthermore, the heat conducting frame is made of aluminum alloy.
[0011] Furthermore, the heat absorbing layer is made of heat absorbing sponge.
[0012] Furthermore, the heat-conducting layer is made of heat-conducting silica gel.
[0013] Furthermore, the adhesive layer is made of thermally conductive adhesive.
[0014] The utility model has the following beneficial effects:
[0015] 1. In the utility model, a card block is inserted into the card slot, and the card block will squeeze and push a buckle to slide and embed into the frame. At this time, a limit plate, a slider and a buckle will slide in a slide slot, and a spring will be stretched and extended. When a card block is completely embedded in the card slot, a buckle will lose its squeeze, and this spring will shrink and pull a slider, a buckle and a limit plate back to their original position. At this time, a buckle will jam the buckle to prevent it from falling off. Sliding the slider will cause the limit plate to pull the spring to stretch, and the buckle will be embedded in the frame. At this time, the card block can be taken out to complete the splicing and removal of the two heat conducting devices.
[0016] 2. In the utility model, heat conduction is achieved by stacking three layers and embedding a heat-conducting structure. The bottom adhesive layer is made of a thermally conductive adhesive, which has a good bonding effect and does not affect the conduction of heat. The middle layer of the heat-absorbing layer is made of a heat-absorbing sponge, which can absorb and conduct heat well. The heat-conducting frame inside the heat-absorbing layer is made of an aluminum alloy, which can accelerate heat conduction and provide structural support. The top heat-conducting layer is made of a thermally conductive silicone rubber, which can conduct heat to the heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 A three-dimensional schematic diagram of a combined heat-conducting silicone sheet with an embedded heat-conducting structure proposed by the utility model;
[0018] Figure 2 It is a structural schematic diagram of the buckle of the combined heat-conducting silicone sheet with an embedded heat-conducting structure proposed by the utility model;
[0019] Figure 3 The utility model provides a schematic structural diagram of a heat-conducting frame with a combined heat-conducting silicone sheet with an embedded heat-conducting structure.
[0020] Legend:
[0021] 1. Frame; 2. Buckle; 3. Limiting plate; 4. Slider; 5. Spring; 6. Adhesive layer; 7. Heat absorbing layer; 8. Heat conducting layer; 9. Heat conducting frame; 10. Slot; 11. Slide; 12. Block. DETAILED DESCRIPTION
[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0023] Reference Figure 1 and Figure 2, an embodiment provided by the utility model: a combined thermally conductive silicone sheet with an embedded thermally conductive structure, comprising a frame 1, the frame 1 is used to provide internal structural support and fix the thermally conductive components of the inner wall, a thermally conductive component is arranged inside the frame 1, a card slot 10 is opened on the front and right sides of the frame 1, the two card slots 10 provide two installation positions for two card blocks 12 to be embedded therein, the left and rear sides of the frame 1 are fixedly connected with card blocks 12, the two card blocks 12 can be clamped in the frame 1 and fixedly installed, the front and right sides of the frame 1 are slidably connected with card buckles 2, the two card buckles 2 can clamp the two card blocks 12, the outer peripheries of the two card buckles 2 are sleeved with springs 5, the two springs 5 provide the two card buckles 2 with moving pulling force or pushing force, the front and right sides of the frame 1 are slidably connected with limiting plates 3, the two limiting plates 3 can prevent the two card buckles 2 from falling off when sliding, one end of the two limiting plates 3 is respectively fixedly connected to one end of the two card buckles 2, and the frame 1 is provided with a plurality of card buckles 2. The front and right sides of the frame 1 are slidably connected with sliders 4, and the two sliders 4 can slide and pull the two limit plates 3 and the two buckles 2 to move, and the other ends of the two limit plates 3 are respectively fixedly connected to one end of the two sliders 4. The front and right sides of the upper part of the frame 1 are provided with sliding grooves 11, and the two sliding grooves 11 provide sliding space for the two buckles 2, the two limit plates 3 and the two sliders 4, which can limit the sliding space. The two buckles 2 and the two limit plates 3 are respectively slidably connected to the inside of the two sliding grooves 11, and the two sliders 4 are respectively slidably connected to the inside of the two sliding grooves 11, and the two sliders 4 are respectively slidably connected to the inside of the two sliding grooves 11, and the other ends of the two springs 5 are respectively fixedly connected to one end of the two limit plates 3, and the two ends of the two springs 5 are respectively fixedly connected to the inside of the two sliding grooves 11 and one end of the two limit plates 3. When a limit plate 3 slides and stretches a spring 5, a spring 5 will stretch and will not slide with a limit plate 3.
[0024] Reference Figure 1 and Figure 3 The heat-conducting component includes a heat-absorbing layer 7, which is made of heat-absorbing sponge. Its main function is to absorb heat from the outside and protect the lower materials and equipment. The heat-absorbing layer 7 is fixedly connected to the inner wall of the frame 1. A heat-conducting frame 9 is fixedly connected inside the heat-absorbing layer 7. The heat-conducting frame 9 is made of aluminum alloy. The heat-conducting frame 9 is embedded in the heat-absorbing layer 7. Its main function is to improve the heat conduction efficiency and effectively transfer the heat to the heat-conducting layer 8. The bottom of the heat-absorbing layer 7 is fixedly connected with an adhesive layer 6. The adhesive layer 6 is made of thermal conductive glue. The adhesive layer 6 can be firmly attached to the surface of the heat dissipation device. The top of the heat-absorbing layer 7 is fixedly connected with a heat-conducting layer 8. The heat-conducting layer 8 is made of thermal conductive silica gel. Its main function is to conduct heat from the heat-absorbing layer 7 to the heat dissipation device.
[0025] Working principle: When using the heat sink, align a block 12 of one heat sink with the card slot 10 of another heat sink and insert it. At this time, the buckle 2 of the other heat sink will be squeezed and moved by a block 12 to embed into the interior of the frame 1. The limit plate 3 and the slider 4 will be pushed and moved. At this time, the spring 5 will be squeezed and stretched. When the buckle 2 slides through the notch of the block 12, the pressure on the buckle 2 will no longer exist. At this time, the pressure on the spring 5 will disappear. The spring 5 will contract and pull the buckle 2, the limit plate 3 and the slider 4 to move. At this time, the installation is completed. When it is necessary to partially replace the heat sink, you can slide The slider 4 on the upper part of the heat dissipation device to be replaced will pull the buckle 2 and the limit plate 3 to move and embed into the interior of the frame 1, and the removal can be completed at this time. By assembling and splicing multiple devices together, the heat dissipation needs of different areas can be met. The adhesive layer 6 can be well adhered to the surface of the heat-generating device without affecting the heat absorption efficiency of the heat absorption layer 7. The heat absorption layer 7 can quickly absorb the heat generated by the device, and then conduct it to the heat-conducting frame 9 and the heat-conducting layer 8. The heat-conducting frame 9 can speed up the heat transfer and provide additional structural support. The heat-conducting layer 8 can transfer heat to the radiator, thereby realizing rapid heat transfer.
[0026] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A combined heat-conducting silicone sheet with an embedded heat-conducting structure, comprising a frame (1), characterized in that: A heat conduction component is arranged inside the frame (1); a clamping block (12) is fixedly connected to the left and rear sides of the frame (1); a clamping buckle (2) is slidably connected to the front and right sides of the frame (1); a limiting plate (3) is slidably connected to the front and right sides of the frame (1); a sliding block (4) is slidably connected to the front and right sides of the frame (1); one end of the two limiting plates (3) is respectively fixedly connected to one end of the two clamping buckles (2); a spring (5) is sleeved on the outer periphery of the two clamping buckles (2); the other end of the two limiting plates (3) is respectively fixedly connected to one end of the two sliding blocks (4); a clamping slot (10) is provided on the front and right sides of the frame (1); and a sliding slot (11) is provided on the front and right sides of the upper part of the frame (1).
2. The combined thermally conductive silicone sheet with an embedded thermally conductive structure according to claim 1, characterized in that: The heat-conducting component comprises a heat-absorbing layer (7), the heat-absorbing layer (7) is fixedly connected to the inner wall of the frame (1), a heat-conducting frame (9) is fixedly connected inside the heat-absorbing layer (7), an adhesive layer (6) is fixedly connected to the bottom of the heat-absorbing layer (7), and a heat-conducting layer (8) is fixedly connected to the top of the heat-absorbing layer (7).
3. The combined thermally conductive silicone sheet with an embedded thermally conductive structure according to claim 1, characterized in that: The two buckles (2) and the two limit plates (3) are respectively slidably connected inside the two slide grooves (11), and the two sliders (4) are respectively slidably connected inside the two slide grooves (11).
4. The combined thermally conductive silicone sheet with an embedded thermally conductive structure according to claim 1, characterized in that: One end of the two springs (5) is respectively fixedly connected to the inside of the two slide grooves (11), and the other end of the two springs (5) is respectively fixedly connected to one end of the two limit plates (3).
5. The combined thermally conductive silicone sheet with an embedded thermally conductive structure according to claim 2, characterized in that: The heat conducting frame (9) is made of aluminum alloy.
6. The combined thermally conductive silicone sheet with an embedded thermally conductive structure according to claim 2, characterized in that: The heat absorbing layer (7) is made of heat absorbing sponge.
7. The combined thermally conductive silicone sheet with an embedded thermally conductive structure according to claim 2, characterized in that: The heat-conducting layer (8) is made of heat-conducting silica gel.
8. The combined thermally conductive silicone sheet with an embedded thermally conductive structure according to claim 2, characterized in that: The adhesive layer (6) is made of thermally conductive adhesive.