Regenerative chip and printer consumable

Abstract

The utility model discloses a regeneration chip and a printer consumable, and belongs to the technical field of consumables. The regeneration chip is used for being arranged on a printer consumable box and located on the outer side of an original consumable chip arranged on the printer consumable box, the regeneration chip comprises a substrate, a wafer and a printer connecting circuit, and at least part of the substrate is used for being attached to the outer side of the original consumable chip; the wafer is arranged on the substrate; the printer connecting circuit is electrically connected with the wafer, the printer connecting circuit is arranged on the side, away from the printer consumable box, of the substrate, the printer connecting circuit is used for being opposite to a printer circuit of an original consumable chip, and the printer connecting circuit can make contact with a printer probe. According to the scheme, when the regeneration chip is installed on the printer consumable box, at least part of the substrate is directly attached to the outer side of the original consumable chip, and a groove does not need to be formed in the printer consumable box, so that the installation mode of the regeneration chip can be simplified, and the installation cost can be reduced.

Description

Technical Field

[0001] The present application belongs to the technical field of consumables, and specifically relates to a regenerated chip and printer consumables. Background Art

[0002] Currently in the printing field, consumable accessories are installed on printers for use, which is completed by the consumable chip and the printer consumable box. The printer determines the consumable capacity, remaining quantity, production date, etc. through the information recorded in the consumable chip, and writes the updated data such as the remaining quantity of consumables back to the consumable chip according to the usage of the printer consumable box.

[0003] At present, most consumables on the market are disposable, so a recycling industry has emerged to recycle and reuse consumables. Recycling manufacturers recycle the exhausted consumables and process them with special processes so that the consumables can be reused. In the recycling industry, the currently known recycling method is to install a recycling chip outside the original consumable chip of the consumable, and the printer obtains the information of the recycling chip to perform printing operations, thereby realizing the reuse of consumables.

[0004] However, when installing the regenerated chip, in order to improve the stability of the connection between the regenerated chip and the printer consumables box and avoid the regenerated chip protruding too much from the consumables, it is necessary to dig a groove on the printer consumables box, then embed the wafer into the groove, and then attach the substrate to the printer consumables box, which makes the installation method of the regenerated chip complicated.

[0005] Therefore, the existing regeneration chip has the problem of complicated installation method. Utility Model Content

[0006] The purpose of the embodiments of the present application is to provide a regeneration chip and printer consumables that can solve the problem of complex installation methods of existing regeneration chips in related technologies.

[0007] In a first aspect, an embodiment of the present application provides a regeneration chip, which is used to be arranged on a printer consumable box and is located outside an original consumable chip arranged on the printer consumable box, including:

[0008] A substrate, wherein at least a portion of the substrate is used to be attached to the outer side of the original consumable chip;

[0009] A wafer is disposed on the substrate;

[0010] A printer connection circuit is electrically connected to the wafer, and the printer connection circuit is arranged on a side of the substrate away from the printer consumable box. The printer connection circuit is used to be opposite to the printer circuit of the original consumable chip, and the printer connection circuit can contact a printer probe.

[0011] Optionally, the substrate is at least partially used to be attached to the printer consumables box; and the wafer is arranged on a side of the substrate away from the printer consumables box.

[0012] Optionally, the printer connection line includes:

[0013] A power connection circuit, used to be opposite to the power circuit of the printer circuit, and the width of the power connection circuit is equal to the width of the power circuit;

[0014] A ground connection circuit, used to be opposite to the ground circuit of the printer circuit, and the width of the ground connection circuit is equal to the width of the ground circuit;

[0015] The data connection line is used to be opposite to the data line of the printer line, and the width of the data connection line is equal to that of the data line.

[0016] Optionally, the regeneration chip further comprises a wafer connection circuit, the wafer connection circuit electrically connects the wafer and the printer connection circuit, and the width of the printer connection circuit is greater than the width of the wafer connection circuit;

[0017] The length of the printer connection line is greater than the length of the printer line, and one end of the printer connection line away from the wafer can be aligned with one end of the printer line away from the wafer mounting position of the printer consumable box.

[0018] Optionally, the regeneration chip also includes a packaging film, which partially covers the wafer and the printer connection circuit away from the substrate and a portion of the wafer mounting position close to the printer consumables box, and another portion of the printer connection circuit is provided with a window, which is opposite to the printer connection circuit so that part of the printer connection circuit is exposed, and the size of the window is equal to the size of the printer circuit.

[0019] Optionally, the wafer may be opposite to a wafer mounting position of the printer consumables box, and when the regeneration chip is arranged on the printer consumables box, the wafer is located within the range of the wafer mounting position.

[0020] Optionally, the regeneration chip further comprises a wafer test circuit electrically connected to the wafer, and the wafer test circuit is arranged on a side of the substrate away from the printer consumables box;

[0021] The substrate includes a first substrate and a second substrate, the length direction of the first substrate is perpendicular to the length direction of the second substrate, the wafer test circuit and the wafer are both arranged on the first substrate, and the printer connection circuit is arranged on the second substrate.

[0022] Optionally, the regeneration chip further comprises an adhesive layer, the adhesive layer is arranged on a side of the substrate away from the wafer, and the adhesive layer is used to adhere the substrate to the printer consumables box;

[0023] The regeneration chip further comprises an anti-sticking layer, which is arranged on a side of the adhesive layer away from the substrate, and the anti-sticking layer is provided with a hand-tear portion, which protrudes from the substrate along the width direction of the substrate.

[0024] In a second aspect, an embodiment of the present application further provides a printer consumable, including a printer consumable box and the above-mentioned regeneration chip, wherein the substrate of the regeneration chip is at least partially attached to the outer side of the original consumable chip set on the printer consumable box, and the regeneration chip is located on the printer consumable box.

[0025] Optionally, a wafer mounting position and a limiting protrusion are provided on the printer consumable box, the limiting protrusion is located at the edge of the wafer mounting position away from the original consumable chip, and the edge of the first substrate of the regenerated chip away from the second substrate of the regenerated chip abuts against the limiting protrusion.

[0026] Optionally, a chip limiting portion is provided on the printer consumables box, and the chip limiting portion is located between the wafer mounting position and the original consumables chip;

[0027] The printer connection circuit of the regenerated chip includes a first part and a second part connected to the first part, the first part is opposite to the printer circuit of the original consumable chip, at least part of the second part is covered by the packaging film of the regenerated chip, an end of the first part away from the second part is aligned with an end of the printer circuit away from the chip limiting part, and the second part and the packaging film cover at least part of the chip limiting part.

[0028] In the embodiment of the present application, the regeneration chip includes a substrate, a wafer and a printer connection circuit, the substrate is at least partially used to fit the outer side of the original consumable chip, the wafer is arranged on the substrate, the printer connection circuits are all arranged on the side of the substrate away from the printer consumable box, the printer connection circuit is electrically connected to the wafer, the printer connection circuit is opposite to the printer circuit of the original consumable chip, and the printer probe can contact the printer connection circuit to obtain the information of the regeneration chip and realize the printing function. When the regeneration chip is installed on the printer consumable box, at least part of the substrate can be directly attached to the outer side of the original consumable chip, so that there is no need to dig a groove on the printer consumable box, thereby simplifying the installation method of the regeneration chip and reducing the installation cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1This is one of the structural schematic diagrams of the regeneration chip disclosed in the embodiment of the present application;

[0030] Figure 2 This is the second structural schematic diagram of the regeneration chip disclosed in the embodiment of the present application (hiding the packaging film);

[0031] Figure 3 This is the third structural schematic diagram of the regeneration chip disclosed in the embodiment of the present application (hiding the packaging film and the wafer);

[0032] Figure 4 It is a rear view of the regeneration chip disclosed in the embodiment of the present application (hiding the adhesive layer and the anti-sticking layer);

[0033] Figure 5 is a rear view of the regeneration chip disclosed in the embodiment of the present application (hiding the anti-sticking layer);

[0034] Figure 6 is a rear view of the regeneration chip disclosed in the embodiment of the present application;

[0035] Figure 7 It is a partial schematic diagram of the printer consumables box disclosed in the embodiment of the present application.

[0036] Description of reference numerals:

[0037] 100-Printer consumables box; 110-Wafer mounting position; 120-Chip limiting part;

[0038] 130- limiting convex part; 140- first limiting part; 150- second limiting part;

[0039] 160- third limiting part;

[0040] 200-original consumables chip; 210-printer circuit; 211-power circuit;

[0041] 212- ground line; 213- data line;

[0042] 300-regeneration chip; 310-substrate; 311-first substrate;

[0043] 312 - second substrate; 320 - wafer black glue layer; 330 - printer connection line;

[0044] 331-power connection line; 332-ground connection line; 333-data connection line;

[0045] 340-encapsulation film; 350-wafer test circuit; 360-adhesive layer;

[0046] 370 - wafer connection line; 371 - first connection line; 372 - second connection line;

[0047] 373 - third connecting line; 380 - anti-adhesive layer; 381 - hand-tear portion. DETAILED DESCRIPTION

[0048] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0049] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0050] The following is a detailed description of the regeneration chip and printer consumables provided in the embodiments of the present application through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0051] refer to Figure 1-Figure 6 The embodiment of the present application discloses a regeneration chip 300, which can be used to be set on the printer consumables box 100, and the regeneration chip 300 can be located outside the original consumables chip 200 set on the printer consumables box 100. In this way, it is convenient for the printer probe to contact the regeneration chip 300 to obtain information from the regeneration chip 300.

[0052] Specifically, the regeneration chip 300 may include a substrate 310 and a wafer, at least a portion of the substrate 310 may be used to be attached to the outside of the original consumable chip 200, and the wafer may be disposed on the substrate 310. When the regeneration chip 300 is installed on the printer consumable box 100, at least a portion of the substrate 310 may be directly attached to the outside of the original consumable chip 200, so that there is no need to dig a groove on the printer consumable box 100, which can effectively simplify the installation method of the regeneration chip 300 and reduce the installation cost.

[0053] In addition, the regeneration chip 300 further includes a printer connection line 330, which can be electrically connected to the wafer, and can be arranged on a side of the substrate 310 away from the printer consumables box 100, and the printer connection line 330 can be used to be opposite to the printer line 210 of the original consumable chip 200, and the printer connection line 330 can be in contact with a printer probe. In this way, after the regeneration chip 300 is arranged on the printer consumables box 100, the printer connection line 330 is opposite to the printer line 210 of the original consumable chip 200, and the printer probe can be in contact with the printer connection line 330, so as to obtain information of the regeneration chip 300 through the printer connection line 330, so as to realize the reuse of the printer consumables box 100.

[0054] Here, since the wafer and printer connection line 330 are both arranged on the side of the substrate 310 away from the printer consumables box 100, when producing the regenerated chip 300, the number of openings on the substrate 310 can be reduced, thereby shortening the opening time, which can effectively simplify the production process of the regenerated chip 300 and reduce production costs.

[0055] It should be noted that, in order to ensure the miniaturization and integration of the regeneration chip 300 , a portion of openings may be provided on the substrate 310 so that a portion of the connection ends of the wafer can be connected to the printer connection circuit 330 .

[0056] In this embodiment, the regenerated chip 300 may also include a wafer black glue layer 320, part of which is arranged on the side of the wafer away from the substrate 310 and covers the wafer, and the rest of the wafer black glue layer 320 is connected to the substrate 310 to fix the wafer package.

[0057] In an optional embodiment of the present application, the substrate 310 is at least partially used to be attached to the printer consumable box 100, and the wafer can be arranged on the side of the substrate 310 away from the printer consumable box 100. In this way, since the wafer is arranged on the side of the substrate 310 away from the printer consumable box 100, when installing the regeneration chip 300, the side of the substrate 310 away from the wafer can be attached to the printer consumable box 100, so there is no need to dig a groove on the printer consumable box 100. In addition, the substrate 310 and the wafer can be prevented from warping up, and in the process of installing or removing the printer consumable box 100, the wafer can be effectively prevented from being embedded in the printer consumable box installation structure, that is, the wafer can be prevented from being stuck on the printer consumable box installation structure, causing damage to the printer or the regeneration chip 300, etc.

[0058] In another optional embodiment of the present application, the wafer can be arranged on the side of the substrate 310 close to the printer consumables box 100. When installing the regenerated chip 300, at least part of the substrate 310 can be attached to the outside of the original consumables chip 200. Specifically, the side of the substrate 310 away from the printer connection line 330 can be attached to the outside of the original consumables chip 200, and the part of the substrate 310 where the wafer is arranged can be tilted to avoid squeezing the wafer. In this way, the installation is simpler, the production efficiency is relatively higher, less materials are used, and the cost is relatively lower.

[0059] Here, in order to improve the stability of the connection between the regeneration chip 300 and the printer consumables box 100, the side of the wafer black glue layer 320 facing away from the substrate 310 is flat, and the wafer black glue layer 320 can be attached to the printer consumables box 100, so that the contact area between the regeneration chip 300 and the printer consumables box 100 can be increased.

[0060] In an optional embodiment of the present application, the printer connection line 330 may include a power connection line 331, a ground connection line 332 and a data connection line 333, wherein the power connection line 331 can be used to be opposite to the power line 211 of the printer line 210, the ground connection line 332 can be used to be opposite to the ground line 212 of the printer line 210, and the data connection line 333 can be used to be opposite to the data line 213 of the printer line 210, and the width of the power connection line 331 can be equal to the width of the power line 211, the width of the ground connection line 332 can be equal to the width of the ground line 212, and the width of the data connection line 333 can be equal to the width of the data line 213. In this way, after the regeneration chip 300 is set on the outside of the original consumable chip 200, the power connection line 331 can cover the power line 211 of the printer line 210 and match the power line 211, the ground connection line 332 can cover the ground line 212 of the printer line 210 and match the ground line 212, and the data connection line 333 can cover the data line 213 of the printer line 210 and match the data line 213, so as to adapt to the original moving path of the printer probe to avoid affecting the original printing function of the printer.

[0061] Of course, in other embodiments, the width of the power connection line 331 may be greater than or less than the width of the power line 211 , the width of the ground connection line 332 may be greater than or less than the width of the ground line 212 , and the width of the data connection line 333 may be greater than or less than the width of the data line 213 .

[0062] In an optional embodiment of the present application, the regeneration chip 300 may further include a wafer connection line 370 , which electrically connects the wafer and the printer connection line 330 , and the width of the printer connection line 330 is greater than the width of the wafer connection line 370 .

[0063] The length of the printer connection line 330 may be greater than the length of the printer line 210, and the end of the printer connection line 330 away from the wafer may be aligned with the end of the printer line 210 away from the wafer mounting position 110 of the printer consumables box 100. In this way, along the direction close to the wafer, the printer connection line 330 partially protrudes from the printer line 210, and the portion of the printer connection line 330 protruding from the printer line 210 may cover at least a portion of the chip stopper 120 provided on the printer consumables box 100, thereby reducing the probability of the wafer connection line 370 connecting the printer connection line 330 and the wafer on the regeneration chip 300 being broken, and increasing the service life of the regeneration chip 300.

[0064] Of course, the length of the printer connection line 330 can be less than or equal to the length of the printer line 210.

[0065] Optionally, the wafer connection line 370 may include a first connection line 371, a second connection line 372 and a third connection line 373, the two ends of the first connection line 371 may be respectively connected to the power connection line 331 and the power end of the wafer, the two ends of the second connection line 372 may be respectively connected to the ground connection line 332 and the ground end of the wafer, and the two ends of the third connection line 373 may be respectively connected to the data connection line 333 and the data end of the wafer.

[0066] Here, the width of the first connection line 371 is smaller than that of the power connection line 331 , the width of the second connection line 372 is smaller than that of the ground connection line 332 , and the width of the third connection line 373 is smaller than that of the data connection line 333 .

[0067] Further optionally, part of the packaging film 340 described below may cover at least part of the wafer connection line 370. In this way, the strength of the wafer connection line 370 may be improved to prevent the wafer connection line 370 from being broken.

[0068] In this embodiment, a portion of the wafer connection circuit 370 close to the wafer is disposed on the first substrate 311 described below, and a portion of the wafer connection circuit 370 close to the printer connection circuit 330 is disposed on the second substrate 312 described below.

[0069] In an optional embodiment of the present application, the regeneration chip 300 may further include a packaging film 340, which partially covers a portion of the printer connection line 330 close to the wafer mounting position 110 of the printer consumable box 100. In this way, the risk of short circuit caused by exposed circuits can be reduced, and another portion of the printer connection line 330 is provided with a window, which can be opposite to the printer connection line 330 to expose part of the printer connection line 330. In this way, the printer probe can contact the printer connection line 330.

[0070] Here, the size of the window opening can be equal to the size of the printer circuit 210. In this way, the moving path of the printer probe can be adapted to avoid affecting the original printing function of the printer.

[0071] In this embodiment, the length of the window in the direction of the printer connecting line 330 may be 2.8 mm.

[0072] In other embodiments, the window size is smaller than the size of the printer circuit 210.

[0073] In an optional embodiment of the present application, the wafer may be opposite to the wafer mounting position 110 of the printer consumables box 100, and when the regeneration chip 300 is disposed on the printer consumables box 100, the wafer is located within the range of the wafer mounting position 110. In this way, it is possible to prevent the wafer from being damaged by collision with other components of the printer after exceeding the wafer mounting position 110.

[0074] In other embodiments, the wafer may not be disposed in the wafer mounting position 110 , or the wafer may be beyond the range of the wafer mounting position 110 .

[0075] In an optional embodiment, the regeneration chip 300 may further include a wafer test circuit 350, which may be electrically connected to the wafer, and the wafer test circuit 350 may be disposed on a side of the substrate 310 away from the printer consumables box 100. The wafer test circuit 350 may be used for users or operators to test the performance of the wafer.

[0076] In other embodiments, the regeneration chip 300 may not be provided with the wafer test circuit 350 .

[0077] In an optional embodiment, the substrate 310 may include a first substrate 311 and a second substrate 312, the length direction of the first substrate 311 is perpendicular to the length direction of the second substrate 312, and the wafer test circuit 350 and the wafer can be arranged on the first substrate 311, and the printer connection circuit 330 can be arranged on the second substrate 312.

[0078] Here, due to the existence of the wafer testing circuit 350 , along the length direction of the printer connecting circuit 330 , the width of the first substrate 311 may be slightly greater than the length of the wafer mounting position 110 .

[0079] Of course, in order to prevent the wafer from getting stuck in the printer consumable box installation structure, the width of the first substrate 311 along the length direction of the printer connection line 330 can be smaller than the length of the wafer installation position 110, so as to reduce the size of the wafer. Here, the size of the wafer and the wafer black glue layer 320 is as small as possible, so as to prevent the wafer from getting stuck in the printer consumable box installation structure.

[0080] It should be noted that the term "perpendicular" here may be quasi-perpendicular, substantially perpendicular or approximately perpendicular, and specifically, "perpendicular" is not limited to being absolutely perpendicular. The angle between the length direction of the first substrate 311 and the length direction of the second substrate 312 is not limited to 90 degrees, and the angle between the length direction of the first substrate 311 and the length direction of the second substrate 312 may be 85-95 degrees.

[0081] In this embodiment, the substrate 310 may be a “T”-shaped structure.

[0082] Optionally, the edge of the first substrate 311 away from the wafer test circuit 350 can be aligned with the first edge of the wafer mounting position 110, and the first edge of the wafer mounting position 110 is adjacent to the edge of the wafer mounting position 110 away from the original consumable chip 200, and can be specifically the right edge of the wafer mounting position 110. When installing the regenerated chip 300, it is only necessary to align the edge of the first substrate 311 away from the second substrate 312 with the edge of the wafer mounting position 110 away from the original consumable chip 200, and to align the edge of the first substrate 311 away from the wafer test circuit 350 with the first edge of the wafer mounting position 110, so that the printer connection circuit 330 of the regenerated chip 300 can be aligned with the printer circuit 210 of the original consumable chip 200, without the need to perform additional alignment operations of the printer connection circuit 330 and the printer circuit 210, which is conducive to the rapid installation of the regenerated chip 300 and saves the installation time of the regenerated chip 300.

[0083] In an optional embodiment, the substrate 310 may be made of a flexible material, so that the substrate 310 is not easily broken when subjected to stress.

[0084] When the size of the wafer mounting position 110 is small, the portion of the first substrate 311 where the wafer test circuit 350 is disposed can protrude from the wafer mounting position 110. Since the substrate 310 is made of a flexible material, the first substrate 311 is not easily broken by force, and the probability of the wafer test circuit 350 breaking can be reduced.

[0085] In this embodiment, the length of the first substrate 311 can be 6 mm, the width of the first substrate 311 can be 4.2 mm, and the distance from the side of the first substrate 311 close to the wafer test circuit 350 to the second substrate 312 can be 1.5 mm. Of course, the length and width of the first substrate 311 can be set according to actual needs, or according to the size of the wafer mounting position 110 of the printer consumable box 100, and the length and width of the first substrate 311 are not specifically limited. The width of the second substrate 312 can be equal to the width of the original consumable chip 200. Specifically, the width of the second substrate 312 can be 4 mm, and the length of the second substrate 312 can be 4.8 mm. Here, the width and length of the second substrate 312 are not limited, and can be set according to actual needs.

[0086] In an optional embodiment of the present application, Figure 5 As shown, the regeneration chip 300 may further include an adhesive layer 360, which may be disposed on a side of the substrate 310 away from the wafer, and the adhesive layer 360 may adhere the substrate 310 to the printer consumables box 100. Here, the adhesive layer 360 may be a backing adhesive.

[0087] It should be noted that the portion of the first substrate 311 where the wafer test circuit 350 is provided is not provided with the adhesive layer 360 , that is, the portion of the first substrate 311 where the wafer test circuit 350 is provided is not bonded to the printer consumable box 100 .

[0088] In an optional embodiment, if Figure 6 As shown, the regeneration chip 300 may further include an anti-adhesive layer 380, which is disposed on a side of the adhesive layer 360 away from the substrate 310. Here, the anti-adhesive layer 380 may be made of release paper. The anti-adhesive layer 380 may be provided with a hand-tear portion 381, which protrudes from the substrate 310 along the width direction of the substrate 310, so as to facilitate the user to remove the anti-adhesive layer 380 when installing the regeneration chip 300.

[0089] In other embodiments, the regeneration chip 300 may be attached to the printer consumables box 100 or to the outside of the original consumables chip 200 by means of positioning pins, hot melting or welding.

[0090] It should be noted that Figure 4 and Figure 5 The horizontal line filled part in the figure is the metal layer on the substrate 310. It can be understood that the metal layer on the substrate 310 is also attached with a packaging film on the outside to isolate the metal layer from the outside, which is not shown in the figure.

[0091] Based on the regeneration chip 300 disclosed in the embodiment of the present application, the embodiment of the present application further provides a printer consumable, which may include a printer consumable box 100 and the regeneration chip 300 described in any of the above embodiments. The substrate 310 of the regeneration chip 300 is at least partially attached to the outer side of the original consumable chip 200 provided on the printer consumable box 100, and the regeneration chip 300 is located on the printer consumable box 100.

[0092] The beneficial effects achieved by the printer consumables provided in the embodiment of the present application are consistent with the beneficial effects achieved by the regeneration chip 300 provided in the embodiment of the present application, and will not be repeated here.

[0093] It should be noted that the above-mentioned printer consumables box 100 may include at least one of common consumables boxes such as a toner box, an ink bag box and an ink box.

[0094] In an optional embodiment of the present application, Figure 7 As shown, the printer consumables box 100 may be provided with a wafer mounting position 110 and a limiting convex portion 130. The wafer mounting position 110 is used to provide a mounting position for the wafer of the regenerated chip 300. The limiting convex portion 130 may be located at the edge of the wafer mounting position 110 away from the original consumables chip 200, and the edge of the first substrate 311 of the regenerated chip 300 away from the second substrate 312 of the regenerated chip 300 may abut against the limiting convex portion 130. In this way, on the one hand, the limiting convex portion 130 may limit the regenerated chip 300, and may prevent the regenerated chip 300 from moving after installation; on the other hand, during installation, the edge of the first substrate 311 of the regenerated chip 300 away from the second substrate 312 abuts against the limiting convex portion 130, so that there is no need to adjust the position of the regenerated chip 300 in the length direction, which is convenient for installing the regenerated chip 300 and helps save installation time.

[0095] Of course, the limiting protrusion 130 may not be provided on the printer consumables box 100 , or the edge of the first substrate 311 of the regeneration chip 300 away from the second substrate 312 of the regeneration chip 300 does not abut against the limiting protrusion 130 .

[0096] Here, the wafer mounting position 110 may be located at one side of the original consumable chip 200 . Specifically, the wafer mounting position 110 and the original consumable chip 200 may be distributed along the length direction of the printer consumable box 100 .

[0097] In an optional embodiment, a chip limiting portion 120 may also be provided on the printer consumable box 100. The chip limiting portion 120 may be located between the wafer mounting position 110 and the original consumable chip 200. The chip limiting portion 120 may be used to limit the movement of the original consumable chip 200 toward the wafer mounting position 110 to improve the stability of the installation of the original consumable chip 200.

[0098] The printer connection line 330 of the regenerated chip 300 may include a first part and a second part, the first part may be connected to the second part, the first part may be opposite to the printer line 210 of the original consumable chip 200, and the end of the first part away from the second part may be aligned with the end of the printer line 210 away from the chip stopper 120, so that the printer connection line 330 can completely cover the printer line 210. At least part of the second part may be covered by the packaging film 340 of the regenerated chip 300, and the second part and the packaging film 340 cover at least part of the chip stopper 120. In this way, covering at least part of the chip stopper 120 by the second part is equivalent to widening the line passing through the chip stopper 120, relative to the method of covering at least part of the chip stopper 120 by the wafer connection line 370 described below, thereby reducing the risk of line breakage. In addition, the strength of the second part can be strengthened by the packaging film 340, which can reduce the risk of the second part breaking, thereby reducing the probability of the regenerated chip 300 breaking at the chip stopper 120 and improving the service life of the regenerated chip.

[0099] In this embodiment, the first portion may be provided with the above-mentioned window.

[0100] Optionally, the length of the second portion may be 4 mm.

[0101] In other embodiments, the length of the printer connection line 330 is equal to the length of the printer line 210 , the printer connection line 330 and the printer line 210 can be completely aligned, and the wafer connection line 370 covers at least a portion of the chip limiting portion 120 .

[0102] In an optional embodiment, a first limiting portion 140, a second limiting portion 150 and a third limiting portion 160 may also be provided on the printer consumable box 100, and the first limiting portion 140 and the second limiting portion 150 are arranged close to the wafer mounting position 110, and the second limiting portion 150 and the third limiting portion 160 can be located on two opposite sides of the original consumable chip 200, specifically, they can be located on the left and right sides of the original consumable chip 200 to limit the left and right movement of the original consumable chip 200; the first limiting portion 140 can be arranged away from the wafer mounting position 110, and the edge of the original consumable chip 200 away from the wafer mounting position 110 can be offset against the first limiting portion 140, and the first limiting portion 140 can limit the original consumable chip 200 from moving in a direction away from the wafer mounting position 110. In this way, the first limiting portion 140, the second limiting portion 150 and the third limiting portion 160 limit the original consumable chip 200, thereby improving the installation stability of the original consumable chip 200 and providing a reference position for the installation of the regenerated chip 300.

[0103] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A regeneration chip, used to be arranged on a printer consumables box (100) and located outside an original consumables chip (200) arranged on the printer consumables box (100), characterized in that: include: A substrate (310), wherein at least a portion of the substrate (310) is used to adhere to the outer side of the original consumable chip (200); A wafer is arranged on the substrate (310); A printer connection circuit (330) is electrically connected to the wafer. The printer connection circuit (330) is arranged on a side of the substrate (310) away from the printer consumable box (100). The printer connection circuit (330) is used to be opposite to the printer circuit (210) of the original consumable chip (200), and the printer connection circuit (330) can contact a printer probe.

2. The regeneration chip according to claim 1, characterized in that: The substrate (310) is at least partially used to be attached to the printer consumables box (100), and the wafer is arranged on a side of the substrate (310) away from the printer consumables box (100).

3. The regeneration chip according to claim 1, characterized in that: The printer connection circuit (330) comprises: A power connection circuit (331) is used to be opposite to the power circuit (211) of the printer circuit (210), and the width of the power connection circuit (331) is equal to the width of the power circuit (211); A ground connection circuit (332), which is used to be opposite to the ground circuit (212) of the printer circuit (210), and the width of the ground connection circuit (332) is equal to the width of the ground circuit (212); The data connection line (333) is used to be opposite to the data line (213) of the printer line (210), and the width of the data connection line (333) is equal to that of the data line (213).

4. The regeneration chip according to claim 1, characterized in that: The regeneration chip (300) further comprises a wafer connection circuit (370), wherein the wafer connection circuit (370) electrically connects the wafer and the printer connection circuit (330), and the width of the printer connection circuit (330) is greater than the width of the wafer connection circuit (370); The length of the printer connection line (330) is greater than the length of the printer line (210), and an end of the printer connection line (330) away from the wafer can be aligned with an end of the printer line (210) away from the wafer mounting position (110) of the printer consumable box (100).

5. The regeneration chip according to claim 1, characterized in that: The regeneration chip (300) further comprises a packaging film (340), wherein the packaging film (340) partially covers a portion of the printer connection circuit (330) close to the wafer mounting position (110) of the printer consumable box (100), and another portion of the printer connection circuit (330) is provided with a window, wherein the window is opposite to the printer connection circuit (330) so that a portion of the printer connection circuit (330) is exposed, and the size of the window is equal to the size of the printer circuit (210).

6. The regeneration chip according to claim 1, characterized in that: The wafer may be opposite to the wafer mounting position (110) of the printer consumables box (100); when the regeneration chip is arranged on the printer consumables box, the wafer is located within the range of the wafer mounting position (110).

7. The regeneration chip according to claim 6, characterized in that: The regeneration chip (300) further comprises a wafer test circuit (350) electrically connected to the wafer, wherein the wafer test circuit (350) is arranged on a side of the substrate (310) away from the printer consumables box (100); The substrate (310) comprises a first substrate (311) and a second substrate (312); the length direction of the first substrate (311) is perpendicular to the length direction of the second substrate (312); the wafer test circuit (350) and the wafer are both arranged on the first substrate (311); and the printer connection circuit (330) is arranged on the second substrate (312).

8. The regeneration chip according to claim 2, characterized in that: The regeneration chip (300) further comprises an adhesive layer (360), the adhesive layer (360) being arranged on a side of the substrate (310) away from the wafer, the adhesive layer (360) being used to adhere the substrate (310) to the printer consumables box (100); The regeneration chip (300) further comprises an anti-sticking layer (380), wherein the anti-sticking layer (380) is arranged on a side of the adhesive layer (360) away from the substrate (310), and the anti-sticking layer (380) is provided with a hand-tear portion (381), and along the width direction of the substrate (310), the hand-tear portion (381) protrudes from the substrate (310).

9. A printer consumable, characterized in that: The invention comprises a printer consumables box (100) and a regeneration chip (300) as claimed in any one of claims 1 to 8, wherein a substrate (310) of the regeneration chip (300) is at least partially attached to the outer side of an original consumables chip (200) arranged on the printer consumables box (100), and the regeneration chip (300) is located on the printer consumables box (100).

10. The printer consumables according to claim 9, characterized in that: The printer consumables box (100) is provided with a wafer mounting position (110) and a limiting protrusion (130); the limiting protrusion (130) is located at an edge of the wafer mounting position (110) away from the original consumables chip (200); and an edge of the first substrate (311) of the regenerated chip (300) away from the second substrate (312) of the regenerated chip (300) abuts against the limiting protrusion (130).

11. The printer consumables according to claim 9, characterized in that: The printer consumables box (100) is provided with a chip limiting portion (120), and the chip limiting portion (120) is located between the wafer mounting position (110) and the original consumables chip (200); The printer connection circuit (330) of the regeneration chip (300) comprises a first part and a second part connected to the first part, the first part is opposite to the printer circuit (210) of the original consumable chip (200), at least part of the second part is covered by the packaging film (340) of the regeneration chip (300), an end of the first part away from the second part is aligned with an end of the printer circuit (210) away from the chip limiting portion (120), and the second part and the packaging film (340) cover at least part of the chip limiting portion (120).

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