Inter-crack stress change monitoring device

Abstract

The utility model provides an inter-crack stress change monitoring device, which comprises an elastic membrane, a pressure sensor and a data processing module, the elastic membrane is fixed above a crack, the pressure sensor is arranged on the lower surface of the elastic membrane, the pressure sensor senses the stress on the membrane and outputs an electric signal, and the data processing module is used for processing the stress on the elastic membrane. The data processing module is connected with the pressure sensors, receives and processes electric signals of the pressure sensors to obtain stress changes among the cracks, is suitable for monitoring the cracks in various civil engineering, mines and bridge structures, monitors the stress changes among the cracks in real time, is beneficial to evaluating the health condition of the structures, and is high in practicability. Early warning is provided for potential safety hazards of the structure, potential structural damage is prevented, the structure is simple, cost is low, operation is convenient, and large-scale application and popularization are easy.

Description

Technical Field

[0001] The utility model relates to the technical field of crack monitoring, in particular to a device for monitoring stress changes between cracks. Background Art

[0002] Cracks are a common problem in engineering fields such as civil engineering, mining and bridges. Cracks may occur and develop due to various factors, such as temperature changes, natural aging of materials, and external loads. These cracks not only affect the appearance of the structure, but more importantly, they may cause changes in the stress distribution inside the structure, thus posing a potential threat to the stability of the structure.

[0003] In order to ensure the safety and stability of engineering structures, it is particularly important to monitor the stress changes of cracks in real time. Through monitoring, we can timely understand the development trend of cracks, evaluate their impact on the structure, and take corresponding measures to repair or reinforce them. However, existing crack stress monitoring equipment is often complex in design and expensive, which limits their widespread application.

[0004] Therefore, the development of a simple, practical and cost-effective device for monitoring stress changes between cracks is of great significance for the maintenance and management of engineering structures. This can not only improve the efficiency and accuracy of monitoring, but also promote the popularization and application of this technology in different fields. Utility Model Content

[0005] 1. Technical issues to be solved

[0006] In view of the deficiencies of the prior art, the utility model provides a device for monitoring stress changes between cracks, which solves the problems raised in the above-mentioned background technology.

[0007] (II) Technical solution

[0008] To achieve the above objectives, the utility model is implemented through the following technical solutions: a device for monitoring stress changes between cracks, including an elastic diaphragm, a pressure sensor and a data processing module, the elastic diaphragm is fixed above the crack, the pressure sensor is arranged on the lower surface of the elastic diaphragm, the pressure sensor senses the stress on the diaphragm and outputs an electrical signal, the data processing module is connected to the pressure sensor, and the data processing module receives and processes the electrical signal of the pressure sensor to obtain the stress changes between the cracks.

[0009] Preferably, the elastic diaphragm is used to cover the crack, deforms with the deformation of the crack, and is made of highly elastic material to ensure good deformation recovery performance and durability. It is customized according to the size and shape of the crack to ensure a close fit to the crack.

[0010] Preferably, the pressure sensor is arranged on the lower surface of the elastic diaphragm and is in direct contact with the diaphragm. The semiconductor piezoresistive pressure sensor is sensitive to the stress applied to the diaphragm, has a linear relationship with the stress applied, and can accurately reflect stress changes.

[0011] Preferably, the data processing module includes a signal amplifier, an analog-to-digital converter and a microprocessor, which amplifies the electrical signal of the pressure sensor, performs analog-to-digital conversion, and performs data processing and analysis, communicates wirelessly or wired with a host computer, and transmits monitoring data in real time.

[0012] Preferably, when the stress between the cracks changes, the elastic diaphragm will deform accordingly, the pressure sensor senses the deformation of the diaphragm (ie, stress change), converts it into an electrical signal output, and the data processing module receives and processes these electrical signals to form stress change data that can be analyzed.

[0013] Preferably, the elastic membrane is fixed above the crack by mechanical fixation, adhesive fixation or thermoplastic fixation, or the elastic membrane is buried at both ends of the crack by asphalt.

[0014] (III) Beneficial effects

[0015] The utility model provides a device for monitoring stress changes between cracks. It has the following beneficial effects:

[0016] 1. This solution is suitable for crack monitoring in various civil engineering, mining and bridge structures. It monitors the stress changes between cracks in real time, helps to evaluate the health of the structure, provides early warning for structural safety hazards, and prevents potential structural damage. It has a simple structure, low cost, easy operation, and is easy to apply and promote on a large scale. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the structure of the utility model when viewed from above;

[0019] Figure 3 It is a schematic diagram of the top structure of the utility model.

[0020] In the figure: 11, pressure sensor; 12, crack; 13, elastic diaphragm; 14, data processing module. DETAILED DESCRIPTION

[0021] The utility model is further described in detail below in conjunction with the accompanying drawings:

[0022] The present invention provides a device for monitoring stress changes between cracks. Figure 1-3As shown, it includes an elastic diaphragm 13, a pressure sensor 11 and a data processing module 14. The elastic diaphragm 13 covers the crack 12. The pressure sensor 11 is arranged on the lower surface of the elastic diaphragm 13. The pressure sensor 11 senses the stress on the diaphragm and outputs an electrical signal. The data processing module 14 is connected to the pressure sensor 11. The data processing module 14 receives and processes the electrical signal of the pressure sensor 11, thereby obtaining the stress change between the cracks 12.

[0023] The elastic diaphragm 13 is made of highly elastic material and has good deformation recovery performance and durability. The pressure sensor 11 uses a semiconductor piezoresistive pressure sensor 11, and its output signal is linearly related to the stress it is subjected to. The data processing module 14 includes a signal amplifier, an analog-to-digital converter and a microprocessor. The signal amplifier is used to amplify the electrical signal of the pressure sensor 11, the analog-to-digital converter is used to convert the electrical signal of the pressure sensor 11 into a digital signal, and the microprocessor is used to process and analyze the electrical signal of the pressure sensor 11.

[0024] The elastic diaphragm 13 is trimmed according to the shape of the crack 12 or directly attached to the crack 12 so that the elastic diaphragm 13 and the crack 12 are adhered to achieve stress conduction. The suspended part of the elastic diaphragm 13 is opened to fix the pressure sensor 11. The stress is transmitted to the pressure sensor 11 after passing through the elastic diaphragm 13. The pressure sensor 11 monitors the stress change and sends the data to the data processing module 14.

[0025] For asphalt pavement, when the concrete layer is displaced due to water loss or sudden drop in temperature, and the tensile stress generated exceeds the tensile strength of the asphalt overlay layer, the asphalt overlay layer will crack. For the above-mentioned pavement reflective cracks, cracks larger than 5 cm can be directly repaired, while cracks smaller than 5 cm require real-time monitoring of the cracks. The inter-crack stress change monitoring device provided in this embodiment can monitor the stress changes of pavement reflective cracks smaller than 5 cm in real time.

[0026] Because the road surface still needs to be used normally when monitoring reflective cracks in the road surface, in order to avoid vehicles causing damage to the stress change monitoring device between cracks or monitoring errors, the stress change monitoring device between cracks should be installed in a position where vehicles can avoid running over it. For example, when the usage scenario is a single-lane road surface, it should be installed in the middle of the road surface as much as possible to avoid being run over by vehicles.

[0027] At the same time, the stress change monitoring device between cracks can also be completely immersed in the cracks for installation, for example, the two ends of the elastic membrane 13 are placed above the two ends of the crack 12 and then fixed by asphalt solidification, such as Figure 2As shown, the device for monitoring stress changes between cracks is shown when the pressure sensor 11 is set upward. The pressure sensor 11 can be inverted during installation, so that the device for monitoring stress changes between cracks is not higher than the road surface, which plays a protective role. At this time, a wireless data transmission module should be set on the pressure sensor 11 to complete the transmission of real-time monitoring data.

[0028] The elastic diaphragm 13 needs to have good elasticity and be able to deform with the deformation of the crack, and also needs to have sufficient durability and stability to maintain its performance for a long time. Depending on the application environment, the elastic diaphragm needs to have corrosion resistance, aging resistance and other characteristics, and be able to resist the erosion of various chemical substances.

[0029] Semiconductor piezoresistive pressure sensors are characterized by high precision and can usually accurately measure pressure values ​​within a measurement error range of 0.1%. This high-precision measurement can provide more accurate stress change data and help improve the accuracy of structural health assessment.

[0030] Since the semiconductor piezoresistive pressure sensor has a simple structure and no moving parts, it has high reliability and is not easily affected by environmental interference, vibration and other factors. Under long-term stable operation, its accuracy and sensitivity will not change significantly, ensuring the stability and reliability of the monitoring data.

[0031] Compared to other types of pressure sensors, semiconductor piezoresistive pressure sensors are relatively inexpensive, making them one of the most widely used pressure sensors on the market, helping to reduce the overall cost of monitoring devices.

[0032] Semiconductor piezoresistive pressure sensors usually have a small size and are easy to integrate into various devices and systems. Their output signals can usually be directly connected to common industrial control transmitters and data acquisition equipment, which is convenient and fast. This easy integration feature is conducive to the miniaturization and integration of monitoring devices, improving their practicality and convenience.

[0033] The main function of the signal amplifier is to amplify the electrical signal output by the pressure sensor. Since the electrical signal output by the pressure sensor may be relatively weak, it needs to be amplified by a signal amplifier for subsequent processing and conversion. The signal amplifier increases the amplitude of the electrical signal, making it easier to detect and process.

[0034] The function of the analog-to-digital converter is to convert the amplified analog signal into a digital signal. In the data processing module, the analog-to-digital converter converts the amplified electrical signal into a digital signal for processing and analysis by the microprocessor. The function of the analog-to-digital converter is to discretize the continuous analog signal to facilitate processing and storage by the computer or microprocessor.

[0035] The microprocessor is the core part of the data processing module, responsible for processing and analyzing digital signals. The microprocessor reads the digital signal output by the analog-to-digital converter, analyzes and processes it, and finally obtains the stress change data. The microprocessor can further process, store and transmit the digital signal. In the stress change monitoring device, the microprocessor is also responsible for controlling the operation of the entire device, including the control of the pressure sensor, the implementation of the data processing algorithm, etc.

[0036] like Figure 2-3 As shown, a data processing module 14 is provided above the pressure sensor 11. At this time, the data processing module 14 should also include a data transmission module to send the monitoring data processed by 14 to a terminal for monitoring data in real time.

[0037] For ease of configuration, the data processing module 14 may also only include a data transmission module for sending the data monitored by the pressure sensor 11 to a terminal for monitoring data in real time for data processing.

[0038] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A device for monitoring stress changes between cracks, characterized in that: The invention comprises an elastic diaphragm (13), a pressure sensor (11) and a data processing module (14), wherein the elastic diaphragm (13) is fixed above the crack (12), the pressure sensor (11) is arranged on the lower surface of the elastic diaphragm (13), the pressure sensor (11) senses the stress on the diaphragm and outputs an electrical signal, and the data processing module (14) is connected to the pressure sensor (11), and the data processing module (14) receives and processes the electrical signal of the pressure sensor (11), thereby obtaining the stress change between the cracks (12).

2. The device for monitoring stress changes between cracks according to claim 1, characterized in that: The elastic diaphragm (13) is made of a highly elastic material.

3. The device for monitoring stress changes between cracks according to claim 1, characterized in that: The pressure sensor (11) is a semiconductor piezoresistive pressure sensor, and its output signal is linearly related to the stress applied.

4. The device for monitoring stress changes between cracks according to claim 1, characterized in that: The data processing module (14) comprises a signal amplifier, an analog-to-digital converter and a microprocessor.

5. The device for monitoring stress changes between cracks according to claim 4, characterized in that: The signal amplifier is used to amplify the electrical signal of the pressure sensor (11).

6. The device for monitoring stress changes between cracks according to claim 4, characterized in that: The analog-to-digital converter is used to convert the electrical signal of the pressure sensor (11) into a digital signal.

7. The device for monitoring stress changes between cracks according to claim 4, characterized in that: The microprocessor is used to process and analyze the electrical signal of the pressure sensor (11).

8. The device for monitoring stress changes between cracks according to claim 4, characterized in that: The elastic membrane (13) is fixed above the crack (12) by mechanical fixation, adhesive fixation or thermoplastic fixation, or the elastic membrane (13) is buried at both ends of the crack (12) by asphalt.

Images