Clamping mechanism for chip aging test socket

Abstract

The utility model relates to a clamping mechanism for a chip aging test socket, which comprises a chip connecting seat, the center of the chip connecting seat is provided with a plurality of ball clamping hole assemblies arranged in order, metal probes are inserted in the ball clamping hole assemblies, the upper parts of the metal probes are provided with a left clamping sheet and a right clamping sheet, and the upper parts of the left clamping sheet and the right clamping sheet are connected with the chip connecting seat. The left clamping piece and the right clamping piece enable the metal probe to be of a Y-shaped structure, the center of the chip connecting seat is connected with a chip placing plate used for placing a chip, and the chip placing plate is provided with contact holes in one-to-one correspondence with the ball clamping hole assemblies. And the top end of the metal probe penetrates through the ball clamping hole assembly, extends into the contact hole and is in contact with a welding point of a product. According to the utility model, the detection quality can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor testing, in particular to a clamping mechanism for a chip aging test socket. Background Art

[0002] With the development of science and technology, electronic chips have been widely used in various electronic products. After completing mass production of chips, it is necessary to test the qualification of the chips to select unqualified chips and retain qualified chips. However, in the current field of semiconductor chip testing, the test socket mainly includes a lower test socket body, a test probe, and a lower test socket probe holding plate to complete the test of single-sided pin array chips. Its function is to test chips with single-sided pin arrays. For new packaging technology chips with double-sided pin arrays, especially the main chip of stacked semiconductor chips, this test socket does not have the function of testing the upper and lower sides of the chip at the same time.

[0003] After searching, the patent: A burn-in test socket that can assist the heat dissipation of the chip (CN202222685037.5), including an upper pinhole plate, an upper metal clamping plate, a lower metal clamping plate, a lower pinhole plate and a probe, the upper surface of the upper pinhole plate is provided with a test slot, four insulating plates are arranged in the middle of the upper pinhole plate, a first mounting slot is provided in the middle of the test slot, the upper metal clamping plate is fixedly installed inside the first mounting slot, the upper and lower metal clamping plates are provided with a plurality of probe holes on the upper surfaces, the upper surface of the lower pinhole plate is provided with a second mounting slot, and the lower metal clamping plate is fixedly installed inside the second mounting slot. The probe on the upper pinhole plate can achieve contact with the product, but cannot ensure the stability of the contact, resulting in inaccurate final test results.

[0004] In view of the above-mentioned defects, the designers have actively carried out research and innovation in order to create a new type of clamping mechanism for chip aging test sockets to make it more valuable for industrial use. Utility Model Content

[0005] In order to solve the above technical problems, the purpose of the utility model is to provide a clamping mechanism for a chip aging test socket.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A clamping mechanism for a chip aging test socket comprises a chip connection seat, a plurality of neatly arranged ball-clamping hole assemblies are provided at the center of the chip connection seat, a metal probe is inserted in the ball-clamping hole assembly, a left clamping piece and a right clamping piece are provided at the upper part of the metal probe, the left clamping piece and the right clamping piece make the metal probe present a "Y"-shaped structure, a chip placement plate for chip placement is connected at the center of the chip connection seat, contact holes corresponding to the ball-clamping hole assemblies are provided on the chip placement plate, and the top end of the metal probe passes through the ball-clamping hole assembly, extends into the contact hole and contacts with the welding point of the product;

[0008] The ball clamping hole assembly includes a ball clamping hole body, which is opened on the chip connecting seat, and a support guide column is connected to the ball clamping hole body. A through hole for the left clamping plate and the right clamping plate to pass through is provided between the support guide column and the ball clamping hole body, and the support guide column is arranged in the middle of the left clamping plate and the right clamping plate.

[0009] Preferably, in the clamping mechanism for a chip aging test socket, a card slot is provided on the chip connection seat, and the chip placement board is connected to the card slot.

[0010] Preferably, in the clamping mechanism for a chip aging test socket, the left clamping piece and the right clamping piece are elastic clamping pieces.

[0011] Preferably, in the clamping mechanism for a chip aging test socket, the top ends of the left clamping piece and the right clamping piece are connected with clamping heads for contacting with welding points.

[0012] Preferably, in the clamping mechanism for a chip aging test socket, the clamping piece of the clamping head is integrally formed.

[0013] Preferably, in the clamping mechanism for a chip aging test socket, the diameter of the contact hole is larger than the diameter of the ball clamping hole body.

[0014] By means of the above solution, the utility model has at least the following advantages:

[0015] The utility model can clamp and contact the welding points of the product (chip), thereby ensuring the stability of the contact and the quality of the subsequent detection.

[0016] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the utility model in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a structural schematic diagram of the utility model;

[0019] Figure 2 It is a structural schematic diagram of the ball clamp hole assembly of the utility model;

[0020] Figure 3 It is a schematic diagram of the metal probe of the utility model clamping the product;

[0021] Figure 4 It is a schematic diagram of the metal probe of the utility model when releasing the product. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0023] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0024] Example

[0025] like Figure 1 and Figure 2 As shown, a clamping mechanism for a chip aging test socket comprises a chip connection seat 1, a plurality of neatly arranged ball-clamping hole assemblies 3 are provided at the center of the chip connection seat 1, a metal probe 2 is inserted in the ball-clamping hole assembly 3, a left clamping piece 21 and a right clamping piece 22 are provided at the upper part of the metal probe 2, the left clamping piece 21 and the right clamping piece 22 make the metal probe 2 present a "Y"-shaped structure, a chip placement plate 4 for chip placement is connected at the center of the chip connection seat 1, contact holes 5 corresponding to the ball-clamping hole assemblies 3 are provided on the chip placement plate 4, and the top end of the metal probe 2 passes through the ball-clamping hole assembly 3 and extends into the contact hole 5 and contacts with the welding point of the product;

[0026] The ball clamping hole assembly 3 includes a ball clamping hole body 31, and the ball clamping hole body 31 is opened on the chip connection seat 1. A support guide column 32 is connected to the ball clamping hole body 31. A through hole for the left clamping plate 21 and the right clamping plate 22 to pass through is provided between the support guide column 32 and the ball clamping hole body 31. The support guide column 32 is located in the middle of the left clamping plate 21 and the right clamping plate 22.

[0027] In the present invention, a card slot is provided on the chip connection seat 1, and the chip placement plate 4 is card-connected to the card slot.

[0028] The left clamping piece 21 and the right clamping piece 22 in the present invention are elastic clamping pieces, and the top ends of the left clamping piece 21 and the right clamping piece 22 are connected with a clamping head 23 for contacting with the welding point, and the clamping piece of the clamping head 23 is integrally formed.

[0029] The diameter of the contact hole 5 in the present invention is larger than the diameter of the ball clamping hole body 31, so as to ensure that the left clamping piece 21 and the right clamping piece 22 have movable space in the contact hole.

[0030] The working principle of the utility model is as follows:

[0031] like Figure 3 As shown, during specific operation, the product is placed on the chip placement board, and the welding points of the product (chip) correspond to the contact holes. At this time, the left clamping piece and the right clamping piece of the metal probe will hold the welding points on the left and right sides, thereby ensuring contact with the product and ensuring subsequent detection.

[0032] like Figure 4 As shown, if the product is to be removed, just press the chip connector downwards. At the same time, the chip connector is connected to the base, and there is a movable distance between the chip connector and the base through a spring. When the chip connector is pressed down, the support guide column will move downward together, forcing the left clamping piece and the right clamping piece to be spread apart, so that the clamping head is separated from the welding point, ensuring that the welding point of the product will not be scratched, while also ensuring the stability of the contact.

[0033] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0034] In the description of this application, it should be noted that the terms "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0035] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or vertical, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0036] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0037] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principle of the present invention, and these improvements and modifications should also be regarded as within the protection scope of the present invention.

Claims

1. A clamping mechanism for a chip aging test socket, characterized in that: The invention comprises a chip connection seat (1), wherein a plurality of neatly arranged ball-clamping hole assemblies (3) are provided at the center of the chip connection seat (1), a metal probe (2) is inserted into the ball-clamping hole assemblies (3), a left clamping piece (21) and a right clamping piece (22) are provided at the upper part of the metal probe (2), the left clamping piece (21) and the right clamping piece (22) make the metal probe (2) present a "Y"-shaped structure, a chip placement plate (4) for chip placement is connected at the center of the chip connection seat (1), contact holes (5) corresponding to the ball-clamping hole assemblies (3) are provided on the chip placement plate (4), and the top end of the metal probe (2) passes through the ball-clamping hole assemblies (3) and extends into the contact hole (5) and contacts with the welding point of the product; The ball clamping hole assembly (3) comprises a ball clamping hole body (31), the ball clamping hole body (31) is arranged on the chip connection seat (1), a support guide column (32) is connected inside the ball clamping hole body (31), a through hole for a left clamping plate (21) and a right clamping plate (22) to pass through is provided between the support guide column (32) and the ball clamping hole body (31), and the support guide column (32) is arranged in the middle of the left clamping plate (21) and the right clamping plate (22).

2. The clamping mechanism for a chip burn-in test socket according to claim 1, characterized in that: The chip connection seat (1) is provided with a card slot, and the chip placement plate (4) is card-connected to the card slot.

3. The clamping mechanism for a chip burn-in test socket according to claim 1, characterized in that: The left clamping piece (21) and the right clamping piece (22) are elastic clamping pieces.

4. A clamping mechanism for a chip aging test socket according to claim 1 or 3, characterized in that: The top ends of the left clamping piece (21) and the right clamping piece (22) are connected with clamping heads (23) for contacting the welding points.

5. The clamping mechanism for a chip burn-in test socket according to claim 4, characterized in that: The clamping piece of the clamping head (23) is integrally formed.

6. The clamping mechanism for a chip burn-in test socket according to claim 1, characterized in that: The diameter of the contact hole (5) is greater than the diameter of the ball clamping hole body (31).

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