Chip support, display module and display device

Abstract

The utility model provides a chip support, a display module and a display device. The chip support comprises a first part; a connecting layer is arranged on the first part, and the material of the connecting layer is a magnetic substance; wherein the first side of the connecting layer is connected with the display module, the second side of the connecting layer is connected with the first part, and the first side and the second side are two opposite sides of the connecting layer. According to the technical scheme, the reliability of connection between the chip support and the display module can be improved, and the chip support and the display module can be separated conveniently.

Description

Technical Field

[0001] The present application relates to the technical field of display equipment, and particularly designs a chip bracket, a display module and a display device. Background Art

[0002] With the development of flexible display screens, mobile phones, tablets, notebooks and other display devices are gradually developing towards full screens and narrow borders. At present, Pad Bending technology has gradually become the mainstream bending technology because it can gradually shorten the border width of the display panel.

[0003] However, for display modules with smaller display areas, Pad Bending will cause the MCL to extend beyond the CG edge. In this case, a chip bracket is needed to protect the exposed display panel to prevent damage to the display panel during transportation and production. However, there is not enough space inside the smaller display module for the bracket to adhere and fix. In addition, if the viscosity of the bracket is low, the bracket is easy to fall off; if the viscosity of the bracket is high, the bracket is not easy to peel off in the subsequent process. Therefore, how to provide a chip bracket that is reliable and easy to remove is an urgent problem that needs to be solved. Utility Model Content

[0004] In view of the above problems, the present application provides a chip bracket, a display module and a display device. The chip bracket can be reliably connected to the display module and can also be easily separated.

[0005] The first aspect of the present application provides a chip bracket. The chip bracket includes a first part; a connecting layer is arranged on the first part, and the material of the connecting layer is a magnetic material; wherein a first side of the connecting layer is magnetically connected to a display module, and a second side of the connecting layer is connected to the first part, and the first side and the second side are two opposite sides of the connecting layer.

[0006] In a possible implementation, the thickness of the connecting layer is 0.5 mm-1 mm.

[0007] In a possible implementation manner, an adhesive is provided on the second side, and the bonding strength of the adhesive is greater than or equal to 1000 gf / inch.

[0008] In a possible embodiment, the chip holder also includes a second part, the second part includes a first sub-part, a second sub-part and a third sub-part, the second sub-part and the third sub-part protrude from the same side of the first sub-part; wherein the first part is vertically connected to the first sub-part; the second sub-part is vertically connected to the first sub-part and is located on the same side of the first sub-part as the first part; the third sub-part is vertically connected to the first sub-part and is connected to the second sub-part; when the display module is connected to the chip holder, the bottom of the display module abuts against the third sub-part.

[0009] The second aspect of the present application provides a display module. The display module includes a display panel and a flexible circuit board; the display panel includes a first area, the flexible circuit board is arranged on the first area, the flexible circuit board includes a flexible circuit board device area and a non-device area, the non-device area is connected to the first side in any embodiment of the first aspect of the present application; wherein a connecting component is arranged on the non-device area, and the material of the connecting component includes metal.

[0010] In a possible implementation manner, the thickness of the connecting component is 0.1 mm-0.2 mm.

[0011] In a possible implementation manner, the length and width of the connecting component are less than or equal to 10 mm.

[0012] In a possible implementation, the display panel further includes a second area, and foam is disposed on the second area.

[0013] The third aspect of the present application provides a display device, which includes the chip bracket described in any embodiment of the first aspect of the present application and the display module described in any embodiment of the second aspect of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the drawings without paying creative work.

[0015] Figure 1 It is a structural schematic diagram of a display module according to an embodiment of the related art;

[0016] Figure 2 This is a schematic structural diagram of a chip bracket according to an embodiment of the present application;

[0017] Figure 3This is a schematic structural diagram of a chip bracket according to another embodiment of the present application;

[0018] Figure 4 This is a schematic structural diagram of a display module according to an embodiment of the present application;

[0019] Figure 5 Schematic diagram of the connection between the IC bracket and the display module.

[0020] Reference numerals:

[0021] Display panel part - 100;

[0022] Chip holder-10, first part-11, second part-12, connecting layer-111, first sub-part-121, second sub-part-122, third sub-part-123;

[0023] Display module-20, display panel-21, flexible circuit board-22, second area-23, first area-211, flexible circuit board device area-221, non-device area-222, connecting component-223. DETAILED DESCRIPTION

[0024] The following detailed description and drawings of the embodiments of the present application are used to illustrate the principles of the present application, but cannot be used to limit the scope of the present application, that is, the present application is not limited to the described embodiments.

[0025] The "range" disclosed in the present application is defined in the form of a lower limit and an upper limit, and a given range is defined by selecting a lower limit and an upper limit, and the selected lower limit and upper limit define the boundary of a specific range. The range defined in this way includes the endpoint values, and can be arbitrarily combined, that is, any lower limit can be combined with any upper limit to form a range. For example, if the range of 60-120 and 80-110 is listed for a specific parameter, it is understood that the range of 60-110 and 80-120 is also expected. In addition, if the minimum range values ​​1 and 2 are listed, and if the maximum range values ​​3, 4 and 5 are listed, the following ranges can all be expected: 1-3, 1-4, 1-5, 2-3, 2-4 and 2-5. In the present application, unless otherwise specified, the numerical range "ab" represents the abbreviation of any real number combination between a and b, wherein a and b are real numbers. For example, the numerical range "0-5" represents that all real numbers between "0-5" have been fully listed herein, and "0-5" is just the abbreviation of these numerical combinations. In addition, when a parameter is expressed as an integer ≥ 2, it is equivalent to disclosing that the parameter is, for example, an integer of 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc.

[0026] If not otherwise specified, all embodiments and optional embodiments of the present application can be combined with each other to form a new technical solution.

[0027] Unless otherwise specified, all technical features and optional technical features of this application can be combined with each other to form a new technical solution.

[0028] The terms used in the following embodiments are only for the purpose of describing specific embodiments, and are not intended to be used as limitations on the present application. As used in the specification and the appended claims of the present application, the singular expressions "one", "a kind of", "said", "above", "the" and "this" are intended to also include expressions such as "one or more", unless there is a clear contrary indication in the context. It should also be understood that in the following embodiments of the present application, "at least one", "one or more" refer to one, two or more. The term "and / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist; for example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural. The character " / " generally indicates that the objects associated before and after are in an "or" relationship.

[0029] References to "one embodiment", "some embodiments", "an example" or "some examples" described in this specification mean that a particular feature, structure or characteristic described in conjunction with the example is included in one or more examples of the present application. Thus, the phrases "in one embodiment", "in some other examples", "in some other examples", etc. appearing at different places in this specification do not necessarily all refer to the same example, but mean "one or more but not all examples", unless otherwise specifically emphasized. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized.

[0030] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different description objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0031] The present application embodiments will be described in more detail below with reference to the accompanying drawings. In each of the accompanying drawings, the same elements are represented by similar reference numerals. For the sake of clarity, the various parts in the accompanying drawings are not drawn to scale. In addition, some well-known parts may not be shown in the drawings.

[0032] Many specific details of the embodiments of the present application are described below, such as the structure, materials, dimensions, processing technology and techniques of the components, so as to more clearly understand the present disclosure. However, as those skilled in the art can understand, the technical solutions of the present application may not be implemented according to these specific details.

[0033] If mentioned below, Pad Bending refers to a technology that achieves the purpose of reducing the width of the lower frame by bending the Pad area of ​​the display panel to the back side of the display substrate; wherein the Pad area refers to the pad area in the display panel.

[0034] Figure 1 FIG. 1 is a schematic diagram of the structure of a display module according to an embodiment of the related art. Figure 1 As shown, in the current display panel manufacturing process, after the display panel undergoes Pad Bending, there will be a display panel portion 100 that exceeds the CG. This display panel portion 100 is easily damaged during subsequent production or transportation, so protective measures are required to prevent damage to the display panel. The prior art generally uses foam glue or other adhesives to solve this problem.

[0035] However, different display devices have different sizes of available space. For a display module with a larger display area, there is a lot of space on the back side that can be used, and the space can be used to connect with the chip holder. However, for a display module with a smaller display area, there is basically no space on the back side after the display panel is folded back, resulting in a small space for attaching the chip holder, which in turn leads to an unreliable connection between the chip holder and the display module, so that the chip holder cannot effectively protect the display module.

[0036] In view of the above problems, the embodiments of the present application provide a chip bracket, a display module and a display device. The chip bracket can be reliably connected to the display module and can also be easily torn off from the display module.

[0037] The chip bracket, display module and display device of the present application will be described in detail below with reference to the accompanying drawings.

[0038] Figure 2 FIG. 1 is a schematic diagram of the structure of a chip bracket according to an embodiment of the present application. Figure 2 As shown, the chip support 10 includes a first portion 11 ; a connecting layer 111 is disposed on the first portion 11 , and the material of the connecting layer 111 is a magnetic substance.

[0039] The chip holder 10 comprises a first portion 11 , on which a connection layer 111 is disposed, that is, the connection layer 111 is disposed on the first portion 11 .

[0040] It should be understood that the chip holder 10 may also be referred to as an IC holder 10 .

[0041] The material of the connection layer 111 is a magnetic material, which means that the connection layer 111 is a magnetic material. Magnetic material refers to a material that can respond to a magnetic field, generally containing iron, nickel and cobalt elements and their alloys, rare earth elements and their alloys, and some Mn compounds. The present application does not impose any restrictions on the specific material of the connection layer 111, for example, it can be iron or an iron alloy.

[0042] The first side of the connection layer 111 is magnetically connected to the display module, the second side of the connection layer 111 is connected to the first portion 11 , and the first side and the second side are two opposite sides of the connection layer.

[0043] It should be understood that the connection layer 111 has a smaller thickness than the length and width of the connection layer 111. Therefore, the first side and the second side of the connection layer 111 described in the present application refer to two opposite sides where the length and width of the connection layer 111 are located.

[0044] The connection layer 111 has two opposite sides, namely a first side for connecting with the display module and a second side for connecting with the first portion 11. That is, by providing the connection layer 111 on the IC bracket 10, the display module and the IC bracket 10 can be connected.

[0045] In the above scheme, the IC bracket 10 includes a first part 11, and a connection layer 111 of magnetic material is arranged on the first part 11. Specifically, one side of the connection layer 111 is used to connect with the display module, and the other side is provided with an adhesive for connecting with the first part 11, that is, for connecting with the IC bracket 10. The connection layer 111 of magnetic material is arranged on the IC bracket 10, and the connection between the IC bracket 10 and the display module is realized through the magnetic field adsorption effect, so that the connection between the two can be firm, and the separation of the two can also be more convenient. This implementation method can effectively protect the display module, improve the yield rate in the production process, and is simple to operate, which is conducive to wide application in industrial production.

[0046] In some embodiments, the thickness of the connecting layer 111 is 0.5 mm-1 mm.

[0047] In the above solution, by making the thickness of the connection layer 111 be 0.5 mm-1 mm, the connection layer 111 can have a stronger magnetic force.

[0048] Specifically, the thickness of the connection layer 111 may be 0.5 mm, 0.6 mm, 0.8 mm, 0.85 mm, 0.9 mm, 1 mm or any value within the above range.

[0049] In some embodiments, a bonding adhesive is disposed on the second side, and a bonding strength of the bonding adhesive is greater than or equal to 1000 gf / inch.

[0050] An adhesive is provided on the second side of the connecting layer 111 to fix the connecting layer 111 on the first part 11. The present application does not limit the specific type of the adhesive, as long as it can achieve the bonding performance. For example, the adhesive can be latex glue, epoxy glue, etc.

[0051] An adhesive is disposed on the second side of the connection layer 111 to fix the connection layer 111 on the IC bracket 10. In other words, the adhesive performance of the adhesive will affect the fixing effect of the connection layer 111 on the IC bracket 10.

[0052] In the above solution, by making the bonding strength of the adhesive greater than or equal to 1000 gf / inch, the connection layer 111 can be firmly disposed on the IC bracket 10 .

[0053] Specifically, the bonding strength of the adhesive may be 1000 gf / inch, 1050 gf / inch, 1100 gf / inch, 1200 gf / inch, 1500 gf / inch or any value within the above range.

[0054] In addition, the present application has no special requirements on the thickness of the adhesive. For example, the thickness of the adhesive can be 0.05 mm, but it can also be changed according to the actual bonding capacity.

[0055] Figure 3 FIG. 1 is a schematic diagram of the structure of a chip bracket according to another embodiment of the present application. Figure 3 As shown, the IC bracket 10 also includes a second part 12, and the second part 12 includes a first sub-part 121, a second sub-part 122 and a third sub-part 123, and the second sub-part 122 and the third sub-part 123 protrude from the same side of the first sub-part 121; wherein the first part 11 and the first sub-part 121 are vertically connected; the second sub-part 122 is vertically connected to the first sub-part 121, and is located on the same side of the first sub-part 121 as the first part 11; the third sub-part 123 is vertically connected to the first sub-part 121 and connected to the second sub-part 122; when the display module is connected to the IC bracket 10, the bottom of the display module abuts against the third sub-part 123.

[0056] like Figure 3 As shown, the second portion 12 includes a first sub-portion 121, a second sub-portion 122 and a third sub-portion 123. Specifically, the second sub-portion 122 and the third sub-portion 123 are both protruding from the first sub-portion 121 and are located on the same side of the first sub-portion 121.

[0057] The second sub-portion 122 and the third sub-portion 123 protrude from the same side of the first sub-portion 121 , and the first portion 11 is located on the same side as the second sub-portion 122 , that is, the first portion 11 protrudes from the first sub-portion 121 , and the first portion 11 has a certain thickness to be comparable to the protruding size of the third sub-portion 123 .

[0058] In the composition of the second part 12, the first sub-part 121 is vertically connected to the second sub-part 122 and the third sub-part 123, and the second sub-part 122 and the third sub-part 123 can be vertically connected or non-vertically connected. Figure 3 As shown, when the display module is circular, the edge of the second sub-portion 122 can be arc-shaped to be consistent with the shape of the display module frame; when the display module is other shapes, the edge of the second sub-portion 122 can also be other shapes. The present application does not specifically limit the specific shapes of the second sub-portion 122 and the third sub-portion 123.

[0059] When the display module is connected to the IC bracket 10 , the bottom of the display module abuts against the third sub-portion 123 , that is, the third sub-portion 123 provides a little supporting force to the display module.

[0060] In the above solution, the IC bracket 10 includes the first part 11 and the second part 12, and further, the second part 12 includes the first sub-part 121, the second sub-part 122 and the third sub-part 123. The first part 11 is used to connect with the display module, and the second part 12 is used to protect the display module.

[0061] Figure 4 FIG. 1 is a schematic diagram of the structure of a display module according to an embodiment of the present application. Figure 4 As shown, the display module 20 includes a display panel 21 and a flexible circuit board 22. The display panel 21 includes a first area 211, and the flexible circuit board 22 is arranged on the first area 211. The flexible circuit board 22 includes a flexible circuit board device area 221 and a non-device area 222, and the non-device area 222 is connected to the first side of the IC bracket 10 described in any of the above embodiments; wherein a connecting component 223 is arranged on the non-device area 222, and the material of the connecting component 223 includes metal.

[0062] The display module 20 includes a display panel 21, and the display panel 21 includes a first area 211. A flexible circuit board 22 is arranged on the first area 211. The flexible circuit board 22 includes a flexible circuit board device area 221 and a non-device area 222, and a connecting component 223 made of a material including metal is arranged on the non-device area 222 to connect with the IC bracket 10 described above.

[0063] The connecting layer 111 of the IC bracket 10 is a magnetic material. Therefore, in order to achieve the connection between the display module 20 and the IC bracket 10, the connecting component 223 that plays a connecting role only needs to have a magnetic effect with the connecting layer 111. That is, the material of the connecting component 223 includes metal. For example, the material of the connecting component 223 can be SUS steel, etc.

[0064] In the above scheme, the first part 11 of the IC bracket 10 for connecting with the display module 20 is provided with a magnetic material, and the non-device area 222 of the display module 20 for connection is provided with a connecting component 223 made of metal. Through the magnetic field effect, a reliable connection between the two can be achieved, and when the IC bracket 10 and the display module 20 are to be separated, the connecting component 223 can be energized to generate a magnetic force opposite to the magnetic force of the IC bracket 10, or magnetized with a magnet opposite to the magnetic force of the IC bracket 10, thereby detaching the IC bracket 10, thereby achieving easy separation of the two.

[0065] Figure 5 The figure is a schematic diagram of the connection between the IC bracket and the display module. Figure 5 As shown, when the display module 20 and the IC bracket 10 are connected, the first sub-portion 121 of the IC bracket 10 covers one side of the display module 20, and the third sub-portion 123 protruding from the first sub-portion 121 should cover the bottom of the display module 20 to protect the display panel portion 100 that exceeds the CG.

[0066] In some embodiments, the thickness of the connecting member 223 is 0.1 mm-0.2 mm.

[0067] In the above solution, by making the thickness of the connecting component 223 0.1 mm-0.2 mm, it can be reliably connected to the IC bracket 10 and can also avoid the thickness of the display module 20 being increased due to the excessive thickness of the connecting component 223 .

[0068] Specifically, the thickness of the connecting component 223 can be 0.1 mm, 0.12 mm, 0.14 mm, 0.15 mm, 0.2 mm or any value within the above range.

[0069] In some embodiments, the length and width of the connecting member 223 are less than or equal to 10 mm.

[0070] In the above solution, by making the length and width of the connecting component 223 not greater than 10 mm, it can be reliably connected to the IC bracket 10 and avoid occupying more space of the display module 20.

[0071] Please continue to refer to Figure 4 In some embodiments, the display panel 21 further includes a second area 23 , and the second area 23 is provided with foam.

[0072] In the above solution, by disposing foam on the second area 23 of the display panel 21 , the strength of the back surface of the display module 20 can be improved.

[0073] The embodiment of the present application also provides a display device, comprising the IC bracket and the display module described in the above embodiment.

[0074] In the embodiments of the present application, the display device may be a display device such as an OLED display, as well as any product or component with display and touch functions, such as a television, digital camera, mobile phone, tablet computer, etc. that includes these display devices, and the present application does not limit this.

[0075] It should be noted that the present application is not limited to the above-mentioned embodiments. The above-mentioned embodiments are only examples, and the embodiments having the same structure as the technical idea and exerting the same effect within the scope of the technical solution of the present application are all included in the technical scope of the present application. In addition, without departing from the scope of the main purpose of the present application, various modifications that can be thought of by those skilled in the art to the embodiments and other methods of combining some of the constituent elements in the embodiments are also included in the scope of the present application.

Claims

1. A chip holder, characterized in that: The chip support comprises: Part I; A connection layer is provided on the first part, and the material of the connection layer is a magnetic substance; The first side of the connection layer is used for magnetic connection with the display module, the second side of the connection layer is used for connection with the first part, and the first side and the second side are two opposite sides of the connection layer.

2. The chip holder according to claim 1, characterized in that: The thickness of the connecting layer is 0.5 mm-1 mm.

3. The chip holder according to claim 1, characterized in that: The second side is provided with adhesive, and the adhesive strength of the adhesive is greater than or equal to 1000 gf / inch.

4. The chip holder according to any one of claims 1 to 3, characterized in that: The chip support further comprises a second portion, the second portion comprises a first sub-portion, a second sub-portion and a third sub-portion, the second sub-portion and the third sub-portion protrude from the same side of the first sub-portion; in, The first portion is vertically connected to the first sub-portion; The second subsection is vertically connected to the first subsection and is located on the same side of the first subsection as the first section; The third subsection is vertically connected to the first subsection and connected to the second subsection; When the display module is connected to the chip bracket, the bottom of the display module abuts against the third sub-portion.

5. A display module, characterized in that: include: Display panels and flexible circuit boards; The display panel includes a first area, the flexible circuit board is arranged in the first area, the flexible circuit board includes a flexible circuit board device area and a non-device area, and the non-device area is connected to the first side of any one of claims 1 to 4; Wherein, a connecting component is arranged on the non-device area, and the material of the connecting component includes metal.

6. The display module according to claim 5, characterized in that: The thickness of the connecting component is 0.1 mm-0.2 mm.

7. The display module according to claim 5, characterized in that: The length of the connecting component is less than or equal to 10 mm, and the width of the connecting component is less than or equal to 10 mm.

8. The display module according to any one of claims 5 to 7, characterized in that: The display panel further includes a second area, and foam is disposed on the second area.

9. A display device, characterized in that: include: The chip holder according to any one of claims 1 to 4, and the display module according to any one of claims 5 to 8.

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