Array circuit and display device

By combining the test line metal of the test unit with the extended line metal outside the GIP unit, the test point is set in a non -box, which solves the problem of static interference in the LCD display during testing to ensure the normal display of the display.

CN222421337UActive Publication Date: 2025-01-28TRULY (RENSHOU) HIGH-END DISPLAY TECH LTD
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Patent Information

Application Number
CN202421167983.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-27
Publication Date
2025-01-28
Estimated Expiration
2034-05-27

AI Technical Summary

Technical Problem

Existing LCD screens are prone to static electricity when connected to the test point, resulting in abnormal liquid crystal in the box and affecting the normal display of the display.

Method used

By combining the test line metal of the test unit with the extended line metal over the extension of each GIP unit, set the test point in the non -box, thereby reducing the effects of static electricity during laser melting on the liquid crystal inside the box.

Benefits of technology

Effectively avoid the effect of static electricity on the display screen during the laser melting process, and prevent the display from abnormal electrical electricity.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an array circuit and a display device. The array circuit comprises a plurality of gate lines forming a gate line array, a plurality of GIP units and a test unit. The gate lines are respectively connected with the pixel units in the corresponding rows; the GIP units are connected with the gate lines in a one-to-one correspondence manner; the test line metal of the test unit coincides with the extension line metal of each GIP unit, and the extension line is located on the outer side of the GIP unit. The test line metal of the test unit coincides with the extension line metal on the outer side of each GIP unit, so that the test point is arranged in a non-box, the influence of static electricity on liquid crystal in the box during laser melting can be reduced, and display abnormity is avoided.
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Description

Technical Field

[0001] The utility model relates to the technical field of display screens, and in particular to an array circuit and a display device. Background Art

[0002] GOA technology (GOA: Gate Driver IC on Array) is a new type of panel developed in recent years. It directly etches the IC of the driving signal on the panel, eliminating the cost of the Gate Driver IC and the process of binding the IC to the panel. More importantly, because the Gate Driver IC and the display panel are integrated, the product is thinner, has a higher resolution, and has better stability and vibration resistance. At present, GOA technology has become the mainstream of the mobile terminal industry, and almost all smartphones use this type of LCD panel.

[0003] GOA technology can make products thinner, with higher resolution, better stability and vibration resistance. In order to meet the needs of subsequent testing, some test points will be added to the display. However, the existing test points may have disadvantages such as electrostatic interference, which may affect the normal display of the display during the test.

[0004] like Figure 1 and Figure 2 In the prior art, the test line for testing the gate signal is wired on one side close to the effective display area AA. After the frame glue is attached, if the signal of a certain row of the gate is tested at this time, laser fusion is performed at the place where the first metal and the second metal overlap, and the relevant required signal can be measured at the test pad. However, since the place where the first metal and the second metal overlap, that is, the place where the laser fusion is performed, is inside the box of the display screen, static electricity may be generated during the laser fusion process. In addition, after the laser fusion, the liquid crystal in the box may be abnormal, resulting in abnormal display screen. Utility Model Content

[0005] When the existing liquid crystal display screen is connected to the test points, static electricity is easily generated, which causes the liquid crystal in the box to be abnormal, resulting in abnormal display screen.

[0006] To solve the above problems, an array circuit and a display device are proposed. By overlapping the test line metal of the test unit with the extension line metal outside each GIP unit, the test point is set outside the box, which can reduce the influence of static electricity on the liquid crystal in the box during laser melting and avoid display abnormalities.

[0007] In a first aspect, an array circuit comprises:

[0008] A plurality of gate lines form a gate line array;

[0009] Multiple GIP units;

[0010] Test unit;

[0011] The gate lines are respectively connected to the pixel units of the corresponding rows;

[0012] The GIP units are connected to the gate lines in a one-to-one correspondence;

[0013] The test line metal of the test unit overlaps with the extension metal of each of the GIP units, and the extension metal is located outside the GIP unit.

[0014] In combination with the array circuit described in the utility model, in a first possible implementation manner, the test unit includes:

[0015] Test pad;

[0016] Connecting segment metal;

[0017] Test section metal;

[0018] The test pad is electrically connected to the connection section metal;

[0019] The connecting section metal is integrally connected to the testing section metal.

[0020] In combination with the first possible implementation of the utility model, in a second possible implementation, the GIP unit includes:

[0021] GIP module;

[0022] Extension metal;

[0023] The extension metal is electrically connected to the GIP module and extends from the GIP module to the outside of the display device.

[0024] In combination with the second possible implementation manner of the utility model, in a third possible implementation manner, the test section metal crosses and overlaps with each of the extension section metals, is located above the extension section metals, and is insulated from the extension section metals.

[0025] In combination with the third possible implementation manner of the utility model, in a fourth possible implementation manner, the array circuit further includes an insulating layer;

[0026] The insulating layer is disposed between the test section metal and the extension section metal to insulate the test section metal from the extension section metal;

[0027] During testing, the metal of the test section and the metal of the extension section are overlapped by melting the insulating layer with a laser.

[0028] In combination with the fourth possible implementation manner of the utility model, in a fifth possible implementation manner, the array circuit further includes:

[0029] Control IC;

[0030] The control IC is electrically connected to each of the GIP units.

[0031] In a second aspect, a display device includes the array circuit according to the first aspect, and further includes:

[0032] Plastic frame;

[0033] The glue frame is coated around the array circuit and covers the intersection and overlap area of ​​the test section metal and the extension section metal.

[0034] In conjunction with the display device described in the second aspect, in a first possible implementation manner, the plastic frame is square to adapt to the size of the display device.

[0035] By implementing the array circuit and display device described in the utility model, the test line metal of the test unit is overlapped with the extension line metal outside each GIP unit, so that the test point is set outside the box, which can reduce the influence of static electricity on the liquid crystal in the box during laser melting and avoid display abnormality. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0037] Figure 1 It is a schematic diagram of the layout of the array circuit structure in the prior art;

[0038] Figure 2 It is a schematic diagram of a display device in the prior art;

[0039] Figure 3 It is a schematic diagram of the layout of the array circuit structure in the utility model;

[0040] Figure 4 It is a schematic diagram of a display device in the utility model;

[0041] Figure 5 It is a partially enlarged schematic diagram of the array circuit structure in the utility model. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the utility model to clearly and completely describe the technical solution in the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, other embodiments obtained by ordinary technicians in this field without creative work are all within the scope of protection of the utility model.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0044] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0045] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0046] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0047] When the existing liquid crystal display screen is connected to the test points, static electricity is easily generated, which causes the liquid crystal in the box to be abnormal, resulting in abnormal display screen.

[0048] In view of the above problems, an array circuit and a display device are proposed. By overlapping the test line metal of the test unit with the extension line metal outside each GIP module 220, the test point is set outside the box, which can reduce the influence of static electricity on the liquid crystal in the box during laser melting and avoid display abnormality.

[0049] In a first aspect, an array circuit, such as Figure 3 , Figure 3 The schematic diagram of the layout of the array circuit structure in the utility model includes a plurality of gate lines 100, which form a gate line 100 array, a plurality of GIP modules 220, and a test unit; the gate lines 100 are respectively connected to the pixel units of the corresponding rows; the GIP modules 220 are connected to the gate lines 100 in a one-to-one correspondence; the test line metal of the test unit overlaps with the extension line metal of each GIP module 220, and the extension line is located on the outside of the GIP module 220.

[0050] The extension line metal is on the outside of the GIP module 220. After the glue frame 500 is applied, it is equivalent to placing the test point outside the box.

[0051] Furthermore, if Figure 5 , Figure 5 The schematic diagram is a partial enlarged schematic diagram of the array circuit structure in the utility model. The test unit includes a test pad 310, a connection metal section 320, and a test metal section 330; the test pad 310 is electrically connected to the connection metal section 320; and the connection metal section 320 and the test metal section 330 are integrally connected.

[0052] Specifically, Figure 5 The GIP module 220 includes a GIP module and an extension metal 210 ; the extension metal 210 is electrically connected to the GIP module and extends from the GIP module to the outside of the display device.

[0053] Furthermore, the test segment metal 330 crosses and overlaps with each extension segment metal 210 , is located above the extension segment metal 210 , and is insulated from the extension segment metal 210 .

[0054] It is worth noting that the test segment metal 330 can also be located at the lower layer of the extension segment metal 210 for cross-fusion.

[0055] Furthermore, the array circuit also includes an insulating layer; the insulating layer is arranged between the test segment metal 330 and the extension segment metal 210 to insulate the test segment metal 330 from the extension segment metal 210; during testing, the test segment metal 330 and the extension segment metal 210 are overlapped by laser melting the insulating layer.

[0056] Furthermore, the array circuit further includes a control IC 400 ; the control IC 400 is electrically connected to each GIP module 220 .

[0057] In a second aspect, a display device, such as Figure 4 , Figure 4It is a schematic diagram of the display device in the utility model; it includes the array circuit of the first aspect, wherein it also includes a plastic frame 500; the plastic frame 500 is coated around the array circuit and covers the intersection and overlap area of ​​the test segment metal 330 and the extension segment metal 210.

[0058] Preferably, the plastic frame 500 is square to fit the size of the display device.

[0059] By implementing the array circuit and display device of the utility model, the test line metal of the test unit is overlapped with the extension line metal outside each GIP module 220, so that the test point is set outside the box, which can reduce the influence of static electricity on the liquid crystal in the box during laser melting and avoid display abnormality.

[0060] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An array circuit, characterized in that: include: A plurality of gate lines form a gate line array; Multiple GIP units; Test unit; The gate lines are respectively connected to the pixel units of the corresponding rows; The GIP units are connected to the gate lines in a one-to-one correspondence; The test line metal of the test unit overlaps with the extension metal of each of the GIP units, and the extension metal is located outside the GIP unit.

2. The array circuit according to claim 1, characterized in that: The test unit comprises: Test pad; Connecting segment metal; Test section metal; The test pad is electrically connected to the connection section metal; The connecting section metal is integrally connected to the testing section metal.

3. The array circuit according to claim 2, characterized in that: The GIP unit comprises: GIP module; Extension metal; The extension metal is electrically connected to the GIP module and extends from the GIP module to the outside of the display device.

4. The array circuit according to claim 3, characterized in that: The testing section metal crosses and overlaps with each of the extending section metals, is located above the extending section metals, and is insulated from the extending section metals.

5. The array circuit according to claim 4, characterized in that: The array circuit further comprises an insulating layer; The insulating layer is disposed between the test section metal and the extension section metal to insulate the test section metal from the extension section metal; During testing, the metal of the test section and the metal of the extension section are overlapped by melting the insulating layer with a laser.

6. The array circuit according to any one of claims 2 to 5, characterized in that: The array circuit further comprises: Control IC; The control IC is electrically connected to each of the GIP units.

7. A display device, comprising the array circuit according to claim 6, characterized in that: Also includes: Plastic frame; The glue frame is coated around the array circuit and covers the intersection and overlap area of ​​the test section metal and the extension section metal.

8. The display device according to claim 7, characterized in that: The plastic frame is square to fit the size of the display device.