Lamp bead and LED display screen

By designing LED lamp beads of three rows of light-emitting chip sets in parallel, the problem of chip failure or disconnection in RGB chips is solved, and the normal use of lamp beads when chip damage or circuit breaking is achieved. Improves the reliability and service life of the LED display.

CN222440607UActive Publication Date: 2025-02-07HUBEI XINYING OPTOELECTRONICS CO LTD
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Patent Information

Application Number
CN202421174345.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-27
Publication Date
2025-02-07
Estimated Expiration
2034-05-27

AI Technical Summary

Technical Problem

If one of the existing LED lamp beads fails or disconnects in the RGB chip, it will cause the lamp beads to be unable to light up the white light and cannot meet the long-term use requirements of outdoor LED displays.

Method used

A lamp bead is designed that includes three rows of light emitting chip sets arranged in parallel, each row has at least two chips, and each row of chips is arranged in parallel, and the colors of each row of chips are the same, and the colors of the three rows of chips are different. Even if one of the chips is disconnected due to wire breakage or damage, the other chips can still maintain normal operation.

Benefits of technology

It realizes that even if a light-emitting chip is broken due to wire breakage or damage, the lamp bead can still be used normally, solving the problem that the chip failure or wire breakage in the RGB chip makes the lamp bead unable to light up the white light, and improving the reliability of the LED display screen. and service life.

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Abstract

The utility model relates to a lamp bead and an LED display screen, the lamp bead comprises a support, the support is provided with three rows of light-emitting chip sets, the number of light-emitting chips in each row of light-emitting chip sets is at least two, the light-emitting colors of the light-emitting chips in each row of light-emitting chip sets are consistent, and the light-emitting chips in each row of light-emitting chip sets are arranged in parallel; the three rows of light-emitting chip sets are different in light emitting color. Each of the three rows of light-emitting chip sets emits light in the mode that at least two light-emitting chips are connected in parallel, each row of light-emitting chip sets only needs one light-emitting chip to normally lighten white light, and even if one of the two light-emitting chips is broken due to the problems of wire breakage, chip damage and the like, normal use of the lamp bead is not affected. The technical problem that in the prior art, if one of the RGB chips fails, wires are broken and the like, an open circuit is caused, and then the lamp bead cannot lighten the white light is solved.
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Description

Technical Field

[0001] The present application relates to the field of LED lamp beads, and in particular to a lamp bead and an LED display screen. Background Art

[0002] The structure of LED lamp beads is mainly composed of the following parts: Bracket: The base of the LED lamp bead, usually made of copper because copper has good conductivity. There will be leads on the bracket to connect the electrodes inside the LED lamp bead. Chip: The core part of the LED lamp bead, and it is also the key to light emission. The chip is usually made of semiconductor materials such as gallium arsenide and aluminum gallium arsenide. Package: The chip is encapsulated in a transparent material to protect the chip and provide a suitable optical effect. Common packaging materials include epoxy resin, silicone, etc. Heat dissipation material: used to dissipate the heat generated by the LED lamp bead to ensure its normal operation and life. Common heat dissipation materials include aluminum substrate, ceramic substrate, etc. Glue: An adhesive used to fix the chip and the conductive material, which can be silicone resin or epoxy resin. The lamp beads encapsulated with silicone resin have good heat dissipation performance and less light decay; the lamp beads encapsulated with epoxy resin have low cost, but poor heat dissipation performance. Phosphor: Used to excite white light. The common phosphor is Intemei, and blue light + yellow phosphor excites white light. Wire: Connect the chip and the conductive pins at both ends, usually using gold wire or silver wire as the wire. Silver glue: used to fix the chip and conduct electricity, its main components are silver powder, EPOXY (epoxy resin) and additives. Chip: the main component of LED lamp beads, it is a luminous semiconductor material, and its luminous color depends on the wavelength. Gold wire: connects the chip PAD (soldering pad) with the bracket and enables it to conduct.

[0003] In the related technology, ordinary lamp beads are mainly arranged in an RGB line. The disadvantage of this mode is that if one of the RGB chips fails or breaks, causing a circuit break, the lamp beads will not be able to light up the white light. Outdoor LED display screens generally have a three-year or five-year warranty requirement, which is a huge test for traditional LED lamp beads. Utility Model Content

[0004] The present application provides a lamp bead and an LED display screen, which can prevent the normal use of the lamp bead from being affected even if one of the light-emitting chips in the light-emitting chip group is short-circuited due to problems such as broken wires or chip damage; and solves the technical problem in the related art that if one of the RGB chips fails, breaks the wires, etc., causing a short circuit, the lamp bead will not be able to light up white light.

[0005] In a first aspect, an embodiment of the present application provides a lamp bead, comprising:

[0006] A bracket, wherein three rows of light-emitting chip groups are installed on the bracket, the number of light-emitting chips in each row of the light-emitting chip groups is at least two, the light-emitting colors of the light-emitting chips in each row of the light-emitting chip groups are consistent, and the light-emitting chips in each row of the light-emitting chip groups are arranged in parallel;

[0007] The three rows of light-emitting chip groups emit different luminous colors.

[0008] In combination with the first aspect, in one implementation, the light emitting color of the light emitting chip groups in the first row is red, the light emitting color of the light emitting chip groups in the second row is green, and the light emitting color of the light emitting chip groups in the third row is blue.

[0009] In combination with the first aspect, in one embodiment, the bracket is fixed with a common positive electrode pad and a first negative electrode pad;

[0010] The first row of the light-emitting chip group is fixed to the common positive electrode pad, and the light-emitting chips of the first row of the light-emitting chip group are electrically connected to the common positive electrode pad through silver paste, and the light-emitting chips of the first row of the light-emitting chip group are connected to the first negative electrode pad through welding wires.

[0011] In combination with the first aspect, in one embodiment, the bracket is fixed with a common positive electrode pad and a second negative electrode pad;

[0012] The second row of the light emitting chip group is fixed to the common positive pad, and the light emitting chips of the second row of the light emitting chip group are electrically connected to the common positive pad through welding wires, and the light emitting chips of the second row of the light emitting chip group are connected to the second negative pad through welding wires.

[0013] In combination with the first aspect, in one embodiment, the bracket is fixed with a common positive electrode pad and a third negative electrode pad;

[0014] The light-emitting chips in the third row are fixed to the common positive pad, and the light-emitting chips in the third row are electrically connected to the common positive pad through welding wires, and the light-emitting chips in the third row are connected to the third negative pad through welding wires.

[0015] In combination with the first aspect, in one embodiment, the bracket is fixed with a common positive electrode pad and a third negative electrode pad;

[0016] Two light-emitting chips of the light-emitting chip group in the third row are fixed to the common positive electrode pad, and the remaining light-emitting chip is fixed to the third negative electrode pad. The light-emitting chips of the light-emitting chip group in the third row are electrically connected to the common positive electrode pad through welding wires, and the light-emitting chips of the light-emitting chip group in the third row are electrically connected to the third negative electrode pad through welding wires.

[0017] In combination with the first aspect, in one implementation, the pad region 4 of the third negative electrode pad is arranged in an L-shape to increase the contact area with the packaging material.

[0018] In combination with the first aspect, in one embodiment, the bracket is fixed with a common positive electrode pad and three negative electrode pads;

[0019] The width of at least part of the bending area of ​​the common positive electrode pad is greater than the width of its own pin area;

[0020] The width of at least part of the bending area of ​​each negative electrode pad is greater than the width of its own pin area.

[0021] In a second aspect, an embodiment of the present application provides an LED display screen, characterized in that it includes the lamp beads described above.

[0022] In combination with the second aspect, in one implementation, the LED display screen further includes a power supply, and the power supply adopts a constant current power supply mode.

[0023] The beneficial effects brought by the technical solution provided by the embodiments of the present application include:

[0024] The three-row light-emitting chip group uses at least two light-emitting chips in parallel to emit light. Each row of the light-emitting chip group only needs one light-emitting chip to normally light up the white light. Even if one of the two light-emitting chips is broken due to problems such as broken wires or chip damage, it will not affect the normal use of the lamp bead. This solves the problem in the related art that if one of the RGB chips fails or breaks, causing a circuit break, the lamp bead will not be able to light up the white light. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 It is a schematic diagram of the arrangement of the light-emitting chipset of the lamp beads;

[0027] Figure 2 This is a schematic diagram of the soldering pad and pin structure of the lamp bead;

[0028] Figure 3 This is a schematic diagram of the lamp bead from an upward perspective;

[0029] Figure 4 It is a front view schematic diagram of the lamp bead.

[0030] In the figure: 1. bracket; 2. light-emitting chipset; 3. common positive electrode pad; 31. pad area one; 32. bending area one; 33. pin area one; 4. first negative electrode pad; 41. pad area two; 42. bending area two; 43. pin area two; 5. second negative electrode pad; 51. pad area three; 52. bending area three; 53. pin area three; 6. third negative electrode pad; 61. pad area four; 62. bending area four; 63. pin area four. DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0032] The embodiment of the present application provides a lamp bead and an LED display screen, which can prevent the normal use of the lamp bead from being affected even if one of the light-emitting chips in the light-emitting chip group is short-circuited due to problems such as broken wires and chip damage; and solves the problem in the related art that if one of the RGB chips fails, breaks the wires, etc., causing a short circuit, the lamp bead will be unable to light up white light.

[0033] like Figure 1 As shown, an embodiment of the present application provides a lamp bead, which may include: a bracket 1, on which three rows of light-emitting chip groups 2 are installed, the number of light-emitting chips in each row of the light-emitting chip group 2 is at least two, the light-emitting colors of the light-emitting chips in each row of the light-emitting chip group are consistent, and the light-emitting chips in each row of the light-emitting chip group are arranged in parallel; the light-emitting colors of the three rows of the light-emitting chip groups 2 are different.

[0034] Among them, the three rows of light-emitting chip groups 2 all use at least two light-emitting chips in parallel to emit light, and each row of light-emitting chip groups 2 only needs one light-emitting chip to normally light up the white light. Even if one of the two light-emitting chips is broken due to problems such as broken wires and chip damage, it will not affect the normal use of this lamp bead. This solves the problem in the related art that if one of the RGB chips fails, breaks the wire, etc., causing a circuit break, the lamp bead will not be able to light up the white light. Exemplarily, in this embodiment, three light-emitting chips are connected in parallel to emit light. Even if two of the two light-emitting chips are broken due to problems such as broken wires and chip damage, it will not affect the normal use of this lamp bead.

[0035] Further, the light emitting color of the first row of light emitting chip groups 2 is red, the light emitting color of the second row of light emitting chip groups 2 is green, and the light emitting color of the third row of light emitting chip groups 2 is blue. Alternatively, the light emitting color of the first row of light emitting chip groups 2 may be green, the light emitting color of the second row of light emitting chip groups 2 may be red, and the light emitting color of the third row of light emitting chip groups 2 may be blue. There is no specific limitation, and the light emitting colors of the three rows of light emitting chip groups 2 may be different.

[0036] Further, such as Figure 2 As shown, the bracket 1 is fixed with a common positive electrode pad 3 and a first negative electrode pad 4; the first row of light-emitting chip groups 2 are fixed to the common positive electrode pad 3, and the light-emitting chips of the first row of light-emitting chip groups 2 are electrically connected to the common positive electrode pad 3 through silver paste, and the light-emitting chips of the first row of light-emitting chip groups 2 are connected to the first negative electrode pad 4 through a welding wire. Exemplarily, the first row of light-emitting chip groups 2 use a counter electrode chip, whose positive electrode is connected to the common positive electrode pad 3 using silver paste, and whose negative electrode is connected to the first negative electrode pad 4 using a welding wire process.

[0037] Further, such as Figure 2 As shown, the bracket 1 is fixed with a common positive electrode pad 3 and a second negative electrode pad 5; the second row of light-emitting chip group 2 is fixed to the common positive electrode pad 3, and the light-emitting chips of the second row of light-emitting chip group 2 are electrically connected to the common positive electrode pad 3 through welding wires, and the light-emitting chips of the second row of light-emitting chip group 2 are connected to the second negative electrode pad 5 through welding wires. Exemplarily, the second row of light-emitting chip group 2 adopts a dual-electrode chip, the positive electrode of which is connected to the common positive electrode pad 3 by welding wire technology, and the negative electrode of which is connected to the second negative electrode pad 5 by welding wire technology.

[0038] Further, such as Figure 2 As shown, the bracket 1 is fixed with a common positive electrode pad 3 and a third negative electrode pad 6; the third row of light-emitting chip group 2 is fixed to the common positive electrode pad 3, and the light-emitting chips of the third row of light-emitting chip group 2 are electrically connected to the common positive electrode pad 3 through a welding wire, and the light-emitting chips of the third row of light-emitting chip group 2 are connected to the third negative electrode pad 6 through a welding wire. Exemplarily, the third row of light-emitting chip group 2 uses a dual-electrode chip, the positive electrode of which is connected to the common positive electrode pad 3 by a welding wire process, and the negative electrode of which is connected to the third negative electrode pad 6 by a welding wire process.

[0039] Further, such as Figure 2As shown, the bracket 1 is fixed with a common positive pad 3 and a third negative pad 6; two light-emitting chips of the third row of light-emitting chips group 2 are fixed to the common positive pad 3, and the remaining light-emitting chips are fixed to the third negative pad 6, and the light-emitting chips of the third row of light-emitting chips group 2 are electrically connected to the common positive pad 3 through welding wires, and the light-emitting chips of the third row of light-emitting chips group 2 are electrically connected to the third negative pad 6 through welding wires. In this embodiment, the first and second light-emitting chips can be fixed to the common positive pad 3, and the third light-emitting chip can be fixed to the third negative pad 6. Such a configuration can reduce the heat energy of the common positive pad 3, and the third negative pad 6 can bear part of the heat.

[0040] Further, such as Figure 2 As shown, the pad area 4 61 of the third negative electrode pad 6 is arranged in an L shape to increase the contact area with the packaging material. Exemplarily, the third negative electrode pad 6 includes a pad area 4 61, a bending area 4 62 and a pin area 4 63 connected in sequence, and the pad area 4 61 is arranged in an L shape, which can increase the contact area between the third negative electrode pad 6 and the packaging material during subsequent filling, thereby effectively preventing the pad shadow phenomenon and avoiding affecting the wire bonding.

[0041] Further, such as Figure 2 As shown, the bracket 1 is fixed with a common positive electrode pad 3 and three negative electrode pads; the bending area of ​​the common positive electrode pad 3 has a width greater than the width of its own pin area at least in part; the bending area of ​​each negative electrode pad has a width greater than the width of its own pin area at least in part. Exemplarily, the common positive electrode pad 3 includes a pad area 1 31, a bending area 1 32 and a pin area 1 33 connected in sequence, and the width of the bending area 1 32 gradually increases along the spacing direction from the pin area 1 33 to the pad area 1 31; the first negative electrode pad 4 includes a pad area 2 41, a bending area 2 42 and a pin area 2 43 connected in sequence, and the width of the bending area 2 42 gradually increases along the spacing direction from the pad area 2 41 to the pin area 2 43; the second negative electrode pad 5 includes a pad area 3 51, a bending area 3 52 and a pin area 3 53 connected in sequence , along the spacing direction from the pad area three 51 to the pin area three 53, the width of the bending area three 52 gradually increases; the third negative electrode pad 6 includes a pad area four 61, a bending area four 62 and a pin area four 63 connected in sequence, and along the spacing direction from the pad area four 61 to the pin area four 63, the width of the bending area four 62 gradually widens; the four pads all increase the bending area to varying degrees, which can effectively increase the contact area between the bracket and PPA (polyphthalamide), making the combination tighter, thereby effectively preventing water vapor from penetrating into the interior of the lamp bead from the junction of the pin area and the packaging material.

[0042] like Figure 3As shown in FIG. 1 , it is a schematic diagram of the structure of the lamp bead viewed from above, from which it can be seen that the pin area distribution of the common positive electrode pad 3, the first negative electrode pad 4, the second negative electrode pad 5 and the third negative electrode pad 6 is as follows: Figure 4 As shown, it is a schematic diagram of the front view structure of the lamp bead, from which the bending degree of the pin area of ​​the second negative electrode pad 5 and the third negative electrode pad 6 and the bending degree of the pin area can be seen.

[0043] The embodiment of the present application also provides an LED display screen, which includes the lamp beads mentioned above.

[0044] Furthermore, the LED display screen also includes a power supply, which adopts a constant current power supply mode. For example, the constant current power supply mode is adopted to improve the brightness of the lamp beads, and even if a single branch of the lamp is dead, it can still maintain high brightness; because the constant current power supply method is adopted, assuming that one of the three light-emitting chips fails, the current on this branch will be evenly distributed to the other two branches, and the current passing through the light-emitting chips of the other two branches will increase, thereby improving the brightness of the light-emitting chips, which to a certain extent compensates for the brightness drop caused by the loss of a light-emitting chip.

[0045] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0046] It should be noted that, in this application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0047] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims

1. A lamp bead, characterized in that: It includes: A bracket (1), wherein the bracket (1) is equipped with three rows of light-emitting chip groups (2), the number of light-emitting chips in each row of the light-emitting chip groups (2) is at least two, the light-emitting colors of the light-emitting chips in each row of the light-emitting chip groups are consistent, and the light-emitting chips in each row of the light-emitting chip groups are arranged in parallel; The three rows of light-emitting chip groups (2) emit light of different colors.

2. The lamp bead according to claim 1, characterized in that: The light emitting color of the light emitting chip groups (2) in the first row is red, the light emitting color of the light emitting chip groups (2) in the second row is green, and the light emitting color of the light emitting chip groups (2) in the third row is blue.

3. The lamp bead according to claim 1, characterized in that: The bracket (1) is fixed with a common positive electrode pad (3) and a first negative electrode pad (4); The first row of the light-emitting chip group (2) is fixed to the common positive electrode pad (3), and the light-emitting chips of the first row of the light-emitting chip group (2) are electrically connected to the common positive electrode pad (3) via silver paste, and the light-emitting chips of the first row of the light-emitting chip group (2) are connected to the first negative electrode pad (4) via welding wires.

4. The lamp bead according to claim 1, characterized in that: The bracket (1) is fixed with a common positive electrode welding pad (3) and a second negative electrode welding pad (5); The second row of the light-emitting chip group (2) is fixed to the common positive electrode pad (3), and the light-emitting chips of the second row of the light-emitting chip group (2) are electrically connected to the common positive electrode pad (3) via a welding wire, and the light-emitting chips of the second row of the light-emitting chip group (2) are connected to the second negative electrode pad (5) via a welding wire.

5. The lamp bead according to claim 1, characterized in that: The bracket (1) is fixed with a common positive electrode pad (3) and a third negative electrode pad (6); The light-emitting chip group (2) in the third row is fixed to the common positive electrode pad (3), and the light-emitting chips in the light-emitting chip group (2) in the third row are electrically connected to the common positive electrode pad (3) via a welding wire, and the light-emitting chips in the light-emitting chip group (2) in the third row are connected to the third negative electrode pad (6) via a welding wire.

6. The lamp bead according to claim 1, characterized in that: The bracket (1) is fixed with a common positive electrode pad (3) and a third negative electrode pad (6); Two light-emitting chips of the light-emitting chip group (2) in the third row are fixed to the common positive electrode pad (3), and the remaining light-emitting chips are fixed to the third negative electrode pad (6); the light-emitting chips of the light-emitting chip group (2) in the third row are electrically connected to the common positive electrode pad (3) via welding wires, and the light-emitting chips of the light-emitting chip group (2) in the third row are electrically connected to the third negative electrode pad (6) via welding wires.

7. The lamp bead according to claim 6, characterized in that: The pad region four (61) of the third negative electrode pad (6) is arranged in an L-shape to increase the contact area with the packaging material.

8. The lamp bead according to claim 1, characterized in that: The bracket (1) is fixed with a common positive electrode pad (3) and three negative electrode pads; The width of at least part of the bending area of ​​the common positive electrode pad (3) is greater than the width of its own pin area; The width of at least part of the bending area of ​​each negative electrode pad is greater than the width of its own pin area.

9. An LED display screen, characterized in that: It includes the lamp bead as described in any one of claims 1 to 8.

10. The LED display screen according to claim 9, characterized in that: The LED display screen also includes a power supply, and the power supply adopts a constant current power supply mode.