Joint device and joint system comprising same

Abstract

The embodiment of the utility model provides a joint device and a joint system comprising the same, and the joint device comprises a frame which is provided with an opening; a flexible film disposed so as to overlap the frame and configured to pressurize the light-emitting element; a roller configured to wind the film to replace a portion of the film disposed overlapping the frame; and a pressing part configured to press the film to a region in which the light-emitting element is located so as to make the film cling to the frame. According to the jointing device and the jointing system comprising the jointing device provided by the embodiment of the utility model, the influence of foreign matters can be reduced in a jointing process.

Description

Technical Field

[0001] The embodiments of the utility model relate to a joining device and a joining system comprising the same. Background Art

[0002] With the development of information technology, the importance of display devices as a connection medium between users and information has attracted attention. In response to this, the use of display devices such as liquid crystal display devices, organic light emitting display devices, and inorganic light emitting display devices is increasing.

[0003] As an example, a display panel may be formed by transferring a light emitting element onto a substrate on which a thin film transistor is formed, and a display device including the display panel thus formed may be used.

[0004] In addition, in the process of manufacturing the display panel in this way, in order to reduce the resistance in the region where the thin film transistor is connected to the light emitting element, a process of bonding the light emitting element may be performed. Utility Model Content

[0005] The technical problem to be solved is to provide a bonding device and a bonding system including the same which can reduce the influence of foreign matter in the bonding process.

[0006] An embodiment of the utility model can provide a joining device, which includes: a frame equipped with an opening; a flexible film arranged to overlap with the frame and configured to pressurize the light-emitting element; a roller configured to wind the film to replace the portion of the film arranged to overlap with the frame; and a pressurizing portion configured to pressurize the film toward the area where the light-emitting element is located to make the film close to the frame.

[0007] The joining device according to the embodiment of the present invention may further include: a moving part configured to be connected to the pressing part and to move the pressing part.

[0008] The pressurizing part may include an air passage arranged to overlap with the opening of the frame.

[0009] The pressurizing part may also include: a pressurizing component, which forms an air channel; and an elastic component, which is tightly attached to the pressurizing component and is equipped with a bottom surface, a first inclined surface and a second inclined surface, wherein the bottom surface corresponds to the opening of the frame, the first inclined surface extends from one side of the bottom surface, and the second inclined surface extends from the other side of the bottom surface, and the frame includes inclined surfaces corresponding to the first inclined surface and the second inclined surface of the pressurizing part.

[0010] The pressurizing part may further include: a light-transmitting window coupled to the pressurizing member.

[0011] The air ducts may be located around the perimeter of the window.

[0012] The pressurizing member may include: a first pressurizing member; and a second pressurizing member that is pressurized by the first pressurizing member and is combined with the window.

[0013] The bonding device according to the embodiment of the present invention may further include: an upper film located between the first pressing member and the second pressing member; and an upper roller configured to roll up the upper film.

[0014] The film may comprise a flexible plastic that is light transmissive.

[0015] The roller may include: a first roller; and a second roller arranged to be spaced apart from the first roller, wherein the film includes: a first portion wound around the first roller; a second portion wound around the second roller; and a third portion connecting the first portion and the second portion and arranged to overlap the pressurizing portion.

[0016] The first roller and the second roller may rotate in the same direction.

[0017] The rotation speeds of the first roller and the second roller may be different from each other.

[0018] Foreign matter and pressure marks may remain in one of the first portion and the second portion of the membrane.

[0019] An embodiment of the utility model can provide a bonding system, which includes: a chamber equipped with an entrance and exit; a workbench configured to support a substrate received through the entrance and exit; a heat source configured to provide heat to the substrate; and a bonding device configured to provide pressure to the workbench, wherein the bonding device includes: a frame equipped with an opening; a film arranged to overlap with the frame; a roller configured to wind the film; and a pressurizing portion configured to make the film close to the frame.

[0020] The bonding device may further include: a moving part configured to move the pressurizing part toward the workbench or in a direction away from the workbench.

[0021] The pressurizing portion may include a light-transmissive first window, and the chamber may include: a second window located between the first window and the heat source.

[0022] The stage supports the substrate on a plane defined by a first direction and a second direction, and the roller rotates from the first direction to a third direction that is perpendicular to each of the first direction and the second direction.

[0023] The substrate may include: a thin film transistor substrate including a thin film transistor layer and a conductive material arranged on the thin film transistor layer; and a light emitting element transferred onto the thin film transistor substrate.

[0024] The bonding device and the bonding system including the same according to the embodiment of the utility model can reduce the influence of foreign matter in the bonding process. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a plan view showing a display device according to an embodiment of the present invention.

[0026] Figure 2 It is shown Figure 1 An example diagram of an example of pixels.

[0027] Figure 3 It is shown Figure 1 An example diagram of yet another example of pixels.

[0028] Figure 4 is shown along Figure 3 A cross-sectional view of an example of a display device taken along line AA'.

[0029] Figure 5 is a plan view showing a tile-type display device including a plurality of display devices according to an embodiment of the present invention.

[0030] Figure 6 It is shown in detail Figure 5 A magnified layout of the AR1 region.

[0031] Figure 7 is shown along Figure 6 A cross-sectional view of an example of a tile-type display device taken along the line BB'.

[0032] Figure 8 It is shown in detail Figure 5 A magnified layout of the AR2 region.

[0033] Fig. 9 is shown along Figure 8 A cross-sectional view of an example of a tile-type display device taken along the line FF'.

[0034] Fig.10 is a block diagram showing a tile type display device according to an embodiment of the present invention.

[0035] Fig.11 This is a diagram conceptually showing a transfer process of a light-emitting element.

[0036] Fig.12 FIG. 1 is a diagram exemplarily showing a backplane substrate to which a light emitting element is transferred.

[0037] Fig.13 is an example of a joining system according to an embodiment of the present invention.

[0038] Fig.14 It is shown Fig.13 A diagram showing a state in which the bonding system applies pressure to the backplane substrate.

[0039] Fig.15 is an example of a joining system according to an embodiment of the present invention.

[0040] Fig.16 , Fig.17 and Fig.18 is an example of Fig.15 A diagram of a process of performing a bonding process by a bonding system.

[0041] Fig.19 It is an example of a joining device according to an embodiment of the present invention.

[0042] Fig. 20 Cut along the X-X' line Fig.19 A vertical cross-sectional view of a pressurizing portion of a bonding device.

[0043] Fig.21 Cut along the X-X' line Fig.19 A vertical cross-sectional view of a frame of a joining device.

[0044] Fig. 22 is another example of a joining system according to an embodiment of the present invention.

[0045] Fig.23 and Fig.24 is an example of Fig. 22 A diagram of a process of performing a bonding process by a bonding system. DETAILED DESCRIPTION

[0046] Hereinafter, several embodiments of the present invention are described in detail with reference to the accompanying drawings so that a person with ordinary knowledge in the technical field to which the present invention belongs can easily implement the present invention. The present invention can be implemented in many different forms and is not limited to the embodiments described here.

[0047] In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same or similar components are given the same reference numerals throughout the specification. Therefore, the reference numerals described above can also be used in other drawings.

[0048] Furthermore, for the sake of convenience, the size and thickness of each structure shown in the drawings are arbitrarily shown, and therefore the present invention is not limited to the contents shown in the drawings. In the drawings, in order to clearly express multiple layers and regions, the thickness may be exaggerated.

[0049] Furthermore, in the description, the expression "same" may mean "substantially the same". That is, it may be the same to the extent that a person with ordinary knowledge can understand it as the same. Other expressions may also be expressions in which "substantially" is omitted.

[0050] The terms "first", "second" and the like may be used to describe a variety of constituent elements, but the constituent elements are not limited by the terms. The terms are only used to distinguish one constituent element from another constituent element. For example, without departing from the scope of the present invention, the first constituent element may be named as the second constituent element, and similarly, the second constituent element may be named as the first constituent element. Unless the context clearly indicates otherwise, a singular expression also includes a plural expression.

[0051] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0052] Figure 1 is a plan view showing a display device 10 according to an embodiment of the present invention. Figure 2 It is shown Figure 1 An example diagram of an example of a pixel PX. Figure 3 It is shown Figure 1 An example diagram of yet another example of a pixel PX.

[0053] Reference Figure 1 The display device 10 is a device for displaying moving images or still images, and can be used not only as a display screen for portable electronic devices such as mobile phones, smart phones, tablet personal computers, smart watches, watch phones, mobile communication terminals, electronic notepads, electronic books, portable multimedia players (PMP: portable multimedia player), navigators, ultra mobile PCs (UMPC: UltraMobile PC), etc., but also as a display screen for various products such as televisions, laptop computers, monitors, billboards, Internet of Things (IOT: internet of things) devices, etc.

[0054] The display panel 100 may be formed as a plane having a rectangular shape having a long side in a first direction DR1 and a short side in a second direction DR2 intersecting the first direction DR1. The corner where the long side in the first direction DR1 meets the short side in the second direction DR2 may be formed as an arc or as a right angle in a manner having a predetermined curvature. The plane shape of the display panel 100 is not limited to a rectangle, and may be formed as other polygons, a circle, or an ellipse. The display panel 100 may be formed flat, but is not limited thereto. For example, the display panel 100 may include a curved portion formed at the left and right ends and having a constant curvature or a variable curvature. In addition, the display panel 100 may be formed flexibly so that the display panel 100 may be bent, twisted, curved, folded, or curled.

[0055] The display panel 100 may further include pixels PX for displaying an image, scan lines extending along a first direction DR1, and data lines extending along a second direction DR2. The pixels PX may be arranged in a matrix in the first direction DR1 and the second direction DR2. The first direction DR1 and the second direction DR2 may be directions orthogonal to each other (e.g., an x-axis in a horizontal direction and a y-axis in a vertical direction), but are not limited thereto.

[0056] like Figure 2 and Figure 3 As shown, the pixel PX may include a plurality of sub-pixels SPX1 , SPX2 , and SPX3 . Figure 2 and Figure 3 The case where the pixel PX includes three sub-pixels SPX1 , SPX2 , and SPX3 (ie, a first sub-pixel SPX1 , a second sub-pixel SPX2 , and a third sub-pixel SPX3 ) is exemplarily shown, but the embodiments of the present invention are not limited thereto.

[0057] Each of the first subpixel SPX1 , the second subpixel SPX2 , and the third subpixel SPX3 may be electrically connected to one data line among the plurality of data lines, and may be electrically connected to at least one scan line among the plurality of scan lines.

[0058] Each of the first sub-pixel SPX1, the second sub-pixel SPX2, and the third sub-pixel SPX3 may have a rectangular, square, or diamond-shaped planar shape. Figure 2 As shown, each of the first sub-pixel SPX1, the second sub-pixel SPX2, and the third sub-pixel SPX3 may have a rectangular planar form including a short side in the first direction DR1 and a long side in the second direction DR2. Figure 3 As shown, each of the first sub-pixel SPX1 , the second sub-pixel SPX2 , and the third sub-pixel SPX3 may have a square or diamond planar form including sides having the same length in the first direction DR1 and the second direction DR2 .

[0059] like Figure 2 As shown, the first sub-pixel SPX1 , the second sub-pixel SPX2 , and the third sub-pixel SPX3 may be arranged along the first direction DR1 .

[0060] Alternatively, one of the second sub-pixel SPX2 and the third sub-pixel SPX3 and the first sub-pixel SPX1 may be arranged along the first direction DR1, and the other one of the second sub-pixel SPX2 and the third sub-pixel SPX3 and the first sub-pixel SPX1 may be arranged along the second direction DR2. Figure 3 As shown, the first sub-pixel SPX1 and the second sub-pixel SPX2 may be arranged along the first direction DR1, and the first sub-pixel SPX1 and the third sub-pixel SPX3 may be arranged along the second direction DR2. Alternatively, one of the first sub-pixel SPX1 and the third sub-pixel SPX3 and the second sub-pixel SPX2 may be arranged along the first direction DR1, and the other and the second sub-pixel SPX2 may be arranged along the second direction DR2. Alternatively, one of the first sub-pixel SPX1 and the second sub-pixel SPX2 and the third sub-pixel SPX3 may be arranged along the first direction DR1, and the other and the third sub-pixel SPX3 may be arranged along the second direction DR2.

[0061] The first sub-pixel SPX1 may emit a first light, the second sub-pixel SPX2 may emit a second light, and the third sub-pixel SPX3 may emit a third light. Here, the first light may be light of a red wavelength band, the second light may be light of a green wavelength band, and the third light may be light of a blue wavelength band. The red wavelength band may be a wavelength band of about 600nm to 750nm, the green wavelength band may be a wavelength band of about 480nm to 560nm, and the blue wavelength band may be a wavelength band of about 370nm to 460nm, but the embodiments of the present utility model are not limited thereto.

[0062] Each of the first sub-pixel SPX1, the second sub-pixel SPX2, and the third sub-pixel SPX3 may include an inorganic light-emitting element having an inorganic semiconductor as a light-emitting element. For example, the inorganic light-emitting element may be a flip chip type micro light-emitting diode (Micro LED (Light Emitting Diode), hereinafter also referred to as micro LED), but the embodiments of the utility model are not limited thereto.

[0063] like Figure 2 and Figure 3As shown, the area of ​​the first sub-pixel SPX1, the area of ​​the second sub-pixel SPX2, and the area of ​​the third sub-pixel SPX3 may be substantially the same, but the embodiments of the present invention are not limited thereto. At least one of the area of ​​the first sub-pixel SPX1, the area of ​​the second sub-pixel SPX2, and the area of ​​the third sub-pixel SPX3 may be different from the other. Alternatively, two of the area of ​​the first sub-pixel SPX1, the area of ​​the second sub-pixel SPX2, and the area of ​​the third sub-pixel SPX3 may be substantially the same, and the remaining one may be different from the two. Alternatively, the area of ​​the first sub-pixel SPX1, the area of ​​the second sub-pixel SPX2, and the area of ​​the third sub-pixel SPX3 may be different from each other.

[0064] Figure 4 is shown along Figure 3 A cross-sectional view of an example of a display device taken along line AA'.

[0065] Reference Figure 4 A thin film transistor layer TFTL may be disposed on the substrate SUB. The thin film transistor layer TFTL may be a layer in which a thin film transistor (TFT) is formed.

[0066] The thin film transistor layer TFTL may include an active layer ACT, a first gate layer GTL1, a second gate layer GTL2, a first data metal layer DTL1, and a second data metal layer DTL2. In addition, the thin film transistor layer TFTL may include a buffer film BF, a first gate insulating film 131, a second gate insulating film 132, an interlayer insulating film 140, a first planarizing film 160, a first insulating film 161, a second planarizing film 170, and a second insulating film 171.

[0067] The substrate SUB may be used to support the display device 10 (see Figure 1 ) is a substrate substrate or substrate component. The substrate SUB may be a rigid substrate made of glass. Alternatively, the substrate SUB may be a flexible substrate capable of bending, folding, rolling, etc. In this case, the substrate SUB may include an insulating material such as a polymer resin such as polyimide (PI).

[0068] A buffer film BF may be disposed on one surface of the substrate SUB. The buffer film BF may be a film for preventing air or moisture from penetrating. The buffer film BF may be formed by a plurality of inorganic films stacked alternately. For example, the buffer film BF may be formed by a multi-film in which one or more inorganic films of a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are alternately stacked. The buffer film BF may be omitted.

[0069] An active layer ACT may be disposed on the buffer film BF. The active layer ACT may include a silicon semiconductor such as polycrystalline silicon, single crystal silicon, low temperature polycrystalline silicon, and amorphous silicon, or may include an oxide semiconductor.

[0070] The active layer ACT may include a channel TCH, a first electrode TS, and a second electrode TD of the thin film transistor TFT. The channel TCH of the thin film transistor TFT may be a region overlapping with the gate electrode TG of the thin film transistor TFT in the third direction DR3 which is the thickness direction of the substrate SUB. The first electrode TS of the thin film transistor TFT may be arranged on one side of the channel TCH, and the second electrode TD of the thin film transistor TFT may be arranged on the other side of the channel TCH. The first electrode TS and the second electrode TD of the thin film transistor TFT may be a region not overlapping with the gate electrode TG in the third direction DR3. The first electrode TS and the second electrode TD of the thin film transistor TFT may be a region where a semiconductor (e.g., a silicon semiconductor, an oxide semiconductor, etc.) is doped with ions and has conductivity.

[0071] A first gate insulating film 131 may be disposed on the active layer ACT. The first gate insulating film 131 may be formed using an inorganic film (eg, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer).

[0072] A first gate layer GTL1 may be disposed on the first gate insulating film 131. The first gate layer GTL1 may include a gate electrode TG of the thin film transistor TFT and a first capacitor electrode CAE1. The first gate layer GTL1 may be formed as a single layer or multiple layers using one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof.

[0073] A second gate insulating film 132 may be disposed on the first gate layer GTL1. The second gate insulating film 132 may be formed using an inorganic film (eg, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer).

[0074] A second gate layer GTL2 may be disposed on the second gate insulating film 132. The second gate layer GTL2 may include a second capacitor electrode CAE2. The second gate layer GTL2 may be formed as a single layer or multiple layers using one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof.

[0075] An interlayer insulating film 140 may be disposed on the second gate layer GTL2. The interlayer insulating film 140 may be formed using an inorganic film (eg, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer).

[0076] A first data metal layer DTL1 including a first link electrode CE1 may be disposed on the interlayer insulating film 140. The first data metal layer DTL1 may be formed as a single layer or multiple layers using one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or alloys thereof.

[0077] The first connection electrode CE1 may be connected (eg, electrically connected) to the first electrode TS or the second electrode TD of the thin film transistor TFT through a first contact hole CT1 penetrating the second gate insulating film 132 and the interlayer insulating film 140 .

[0078] A first planarization film 160 for planarizing a step difference caused by the active layer ACT, the first gate layer GTL1, the second gate layer GTL2, and the first data metal layer DTL1 may be formed on the first data metal layer DTL1. The first planarization film 160 may be formed of an organic film such as acryl resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0079] The first insulating film 161 may be disposed on the first planarization film 160. The first insulating film 161 may be formed using an inorganic film (eg, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer).

[0080] A second data metal layer DTL2 may be formed on the first insulating film 161. The second data metal layer DTL2 may include a second connection electrode CE2 and a first power wiring VSL. The second connection electrode CE2 may be connected to the first connection electrode CE1 through a second contact hole CT2 penetrating the first insulating film 161 and the first planarization film 160. The second data metal layer DTL2 may be formed as a single layer or multiple layers using one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof.

[0081] A second planarization film 170 for planarizing the step difference may be formed on the second data metal layer DTL2. The second planarization film 170 may be formed of an organic film such as acryl resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0082] The second insulating film 171 may be disposed on the second planarization film 170. The second insulating film 171 may be formed using an inorganic film (eg, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer).

[0083] A light emitting element layer EML may be disposed on the second insulating film 171. The light emitting element layer EML includes a pixel electrode PXE, a common electrode CE, and a light emitting element LE. The third data metal layer DTL3 may include a pixel electrode PXE and a common electrode CE. Each of the aforementioned first sub-pixel SPX1, second sub-pixel SPX2, and third sub-pixel SPX3 includes a light emitting element LE connected to the pixel electrode PXE and the common electrode CE. The pixel electrode PXE may be one of an anode electrode and a cathode electrode of the light emitting element LE (e.g., an anode electrode). The common electrode CE may be the other of an anode electrode and a cathode electrode of the light emitting element LE (e.g., a cathode electrode).

[0084] The pixel electrode PXE and the common electrode CE may be arranged on the second insulating film 171. The pixel electrode PXE may be connected (e.g., electrically connected) to the second connection electrode CE2 through the third contact hole CT3 penetrating the second insulating film 171 and the second planarizing film 170. Accordingly, the pixel electrode PXE may be electrically connected to the first electrode TS or the second electrode TD of the thin film transistor TFT through the first connection electrode CE1 and the second connection electrode CE2. Therefore, the pixel voltage or the anode voltage controlled by the thin film transistor TFT may be applied to the pixel electrode PXE.

[0085] The common electrode CE may be connected to the first power wiring VSL through the fourth contact hole CT4 penetrating the second insulating film 171 and the second planarizing film 170. Therefore, the first power voltage of the first power wiring VSL may be applied to the common electrode CE.

[0086] The pixel electrode PXE and the common electrode CE may include a metal substance with high reflectivity such as a stack structure (Ti / Al / Ti) of aluminum (Al) and titanium (Ti), a stack structure (ITO / Al / ITO) of aluminum and indium tin oxide (ITO: Indium Tin Oxide), an APC (Ag-Pd-Cu) alloy, and a stack structure (ITO / APC / ITO) of an APC alloy and ITO. The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

[0087] Figure 4 The light emitting element LE is exemplarily shown as a flip chip type micro LED in which the first contact electrode CTE1 and the second contact electrode CTE2 are arranged to face the pixel electrode PXE and the common electrode CE. The light emitting element LE may include an inorganic substance such as gallium nitride (GaN). The length of the light emitting element LE in the first direction DR1, the length in the second direction DR2, and the length in the third direction DR3 may be several μm (micrometers) to several hundred μm, respectively. For example, the length of the light emitting element LE in the first direction DR1, the length in the second direction DR2, and the length in the third direction DR3 may be approximately 100 μm or less, respectively.

[0088] The light emitting element LE can be grown on a semiconductor substrate such as a silicon wafer. The light emitting element LE can be directly transferred from the silicon wafer to the pixel electrode PXE and the common electrode CE of the substrate SUB. Alternatively, the light emitting element LE can be transferred (or transferred) to the pixel electrode PXE and the common electrode CE of the substrate SUB by an electrostatic method using an electrostatic head or a stamping method using a flexible polymer such as polydimethylsiloxane (PDMS) or silicon as a carrier substrate.

[0089] Reference Figure 4 Each of the light emitting elements LE may be a light emitting structure including a base substrate SPUB, an n-type semiconductor NSEM, an active layer MQW, a p-type semiconductor PSEM, a first contact electrode CTE1 and a second contact electrode CTE2.

[0090] As an example, the base substrate SPUB may be a sapphire substrate, but the embodiments of the present invention are not limited thereto.

[0091] The n-type semiconductor NSEM may be arranged on a surface of the base substrate SPUB. For example, the n-type semiconductor NSEM may be arranged on the lower surface of the base substrate SPUB (for example, the surface located in the opposite direction of the third direction DR3). As an example, the n-type semiconductor NSEM may be formed using gallium nitride (GaN) doped with an n-type conductive dopant such as silicon (Si), germanium (Ge), selenium (Se), tellurium (Te), tin (Sn), etc.

[0092] The active layer MQW can be arranged on a portion of a surface of an n-type semiconductor NSEM. The active layer MQW can include a material of a single quantum well structure or a multi-quantum well structure. In the case where the active layer MQW includes a material of a multi-quantum well structure, it can also be a structure in which multiple well layers (well layers) and barrier layers (barrier layers) are alternately stacked with each other. At this time, the well layer can be formed using InGaN, and the barrier layer can be formed using GaN or AlGaN, but are not limited thereto. Alternatively, the active layer MQW can be a structure in which a semiconductor material of a type with a large band gap energy and a semiconductor material of a type with a small band gap energy are alternately stacked with each other, or it can include different III to V group semiconductor materials according to the wavelength band of the emitted light.

[0093] The p-type semiconductor PSEM may be disposed on a surface of the active layer MQW (e.g., a surface located in the opposite direction to the third direction DR3). As an example, the p-type semiconductor PSEM may be formed using gallium nitride (GaN) doped with a p-type conductive dopant such as magnesium (Mg), zinc (Zn), calcium (Ca), or barium (Ba).

[0094] The first contact electrode CTE1 may be disposed on the p-type semiconductor PSEM (e.g., in the opposite direction of the third direction DR3), and the second contact electrode CTE2 may be disposed on another portion of a surface of the n-type semiconductor NSEM (e.g., in the opposite direction of the third direction DR3). Another portion of a surface of the n-type semiconductor NSEM where the second contact electrode CTE2 is disposed may be disposed to be separated from a portion of a surface of the n-type semiconductor NSEM where the active layer MQW is disposed.

[0095] The first contact electrode CTE1 and the pixel electrode PXE may be bonded by a conductive adhesive member (not shown) such as an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP). Alternatively, the first contact electrode CTE1 and the pixel electrode PXE may be bonded by a soldering process.

[0096] In addition, a bank 190 covering the edge of the pixel electrode PXE and the edge of the common electrode CE may be disposed on the second insulating film 171. The bank 190 may be formed using an organic film such as acryl resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0097] The bank insulating film 191 may be disposed on the bank 190. The bank insulating film 191 may cover the edge of the pixel electrode PXE and the edge of the common electrode CE. The bank insulating film 191 may be formed using an inorganic film (e.g., a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer).

[0098] Figure 5 is a plan view showing a tile-type display device (TLD) including a plurality of display devices according to an embodiment.

[0099] Reference Figure 5 The tile type display device TLD may include a plurality of display devices 11, 12, 13, 14 and a connection portion SM. For example, the tile type display device TLD may include a first display device 11, a second display device 12, a third display device 13 and a fourth display device 14.

[0100] The plurality of display devices 11, 12, 13, 14 may be arranged in a grid form. The plurality of display devices 11, 12, 13, 14 may be arranged in a matrix form in M ​​(M is an integer greater than 1) rows and N (N is an integer greater than 1) columns. For example, the first display device 11 and the second display device 12 may be adjacent to each other in the first direction DR1. The first display device 11 and the third display device 13 may be adjacent to each other in the second direction DR2. The third display device 13 and the fourth display device 14 may be adjacent to each other in the first direction DR1. The second display device 12 and the fourth display device 14 may be adjacent to each other in the second direction DR2.

[0101] However, in the tile type display device TLD, the number and arrangement of the plurality of display devices are not limited to Figure 5 The number and arrangement of the plurality of display devices included in the tile type display device TLD may be set differently according to the sizes of the plurality of display devices and the tile type display device TLD, the shape of the tile type display device TLD, and the like.

[0102] Reference Figure 5, showing a situation where the multiple display devices 11, 12, 13, and 14 have the same size as each other, but the present invention is not limited to this. For example, one or more of the multiple display devices 11, 12, 13, and 14 may have a size different from that of the remaining display devices.

[0103] Each of the multiple display devices 11, 12, 13, 14 may be in a rectangular shape including a long side and a short side. The multiple display devices 11, 12, 13, 14 may be arranged so that the long sides or the short sides are connected to each other. A part or all of the multiple display devices 11, 12, 13, 14 may be arranged at the edge of the tile-type display device TLD and may constitute one side of the tile-type display device TLD. At least one of the multiple display devices 11, 12, 13, 14 may be arranged at at least one corner of the tile-type display device TLD and may form two adjacent sides of the tile-type display device TLD. At least one of the multiple display devices 11, 12, 13, 14 may be surrounded by other display devices.

[0104] Each of the plurality of display devices 11, 12, 13, 14 may be combined with Figures 1 to 4 The display device 10 (see Figure 1 Therefore, the description of each of the plurality of display devices 11, 12, 13, and 14 is omitted.

[0105] The connection part SM may include a bonding part or an adhesive part. In this case, the plurality of display devices 11, 12, 13, 14 may be connected to each other by a bonding part or an adhesive part of the connection part SM. The connection part SM may be arranged between the first display device 11 and the second display device 12, between the first display device 11 and the third display device 13, between the second display device 12 and the fourth display device 14, and between the third display device 13 and the fourth display device 14.

[0106] Figure 6 It is shown in detail Figure 5 A magnified layout of the AR1 region.

[0107] Reference Figure 6 The connection portion SM has a planar shape of a cross, a cross, or an addition symbol in the central area of ​​the tile-type display device TLD adjacent to the first display device 11, the second display device 12, the third display device 13, and the fourth display device 14.

[0108] In order to display an image, the first display device 11 may include first pixels PX1 arranged in a matrix form in the first direction DR1 and the second direction DR2. In order to display an image, the second display device 12 may include second pixels PX2 arranged in a matrix form in the first direction DR1 and the second direction DR2. In order to display an image, the third display device 13 may include third pixels PX3 arranged in a matrix form in the first direction DR1 and the second direction DR2. In order to display an image, the fourth display device 14 may include fourth pixels PX4 arranged in a matrix form in the first direction DR1 and the second direction DR2.

[0109] A minimum distance between first pixels PX1 adjacent in the first direction DR1 may be defined as a first horizontal spacing distance GH1, and a minimum distance between second pixels PX2 adjacent in the first direction DR1 may be defined as a second horizontal spacing distance GH2. The first horizontal spacing distance GH1 and the second horizontal spacing distance GH2 may be substantially the same.

[0110] A connection portion SM may be disposed between the first pixel PX1 and the second pixel PX2 adjacent to each other in the first direction DR1. A minimum distance G12 between the first pixel PX1 and the second pixel PX2 adjacent to each other in the first direction DR1 may be a sum of a minimum distance GHS1 between the first pixel PX1 and the connection portion SM in the first direction DR1, a minimum distance GHS2 between the second pixel PX2 and the connection portion SM in the first direction DR1, and a width GSM1 of the connection portion SM in the first direction DR1.

[0111] The minimum distance G12, the first horizontal spacing distance GH1, and the second horizontal spacing distance GH2 between the first pixel PX1 and the second pixel PX2 adjacent to each other in the first direction DR1 may be substantially the same. To this end, the minimum distance GHS1 between the first pixel PX1 and the connection portion SM in the first direction DR1 may be smaller than the first horizontal spacing distance GH1, and the minimum distance GHS2 between the second pixel PX2 and the connection portion SM in the first direction DR1 may be smaller than the second horizontal spacing distance GH2. Furthermore, the width GSM1 of the connection portion SM in the first direction DR1 may be smaller than the first horizontal spacing distance GH1 or the second horizontal spacing distance GH2.

[0112] A minimum distance between third pixels PX3 adjacent in the first direction DR1 may be defined as a third horizontal spacing distance GH3, and a minimum distance between fourth pixels PX4 adjacent in the first direction DR1 may be defined as a fourth horizontal spacing distance GH4. The third horizontal spacing distance GH3 and the fourth horizontal spacing distance GH4 may be substantially the same.

[0113] A connection portion SM may be disposed between the third pixel PX3 and the fourth pixel PX4 adjacent to each other in the first direction DR1. A minimum distance G34 between the third pixel PX3 and the fourth pixel PX4 adjacent to each other in the first direction DR1 may be a sum of a minimum distance GHS3 between the third pixel PX3 and the connection portion SM in the first direction DR1, a minimum distance GHS4 between the fourth pixel PX4 and the connection portion SM in the first direction DR1, and a width GSM1 of the connection portion SM in the first direction DR1.

[0114] The minimum distance G34, the third horizontal spacing distance GH3, and the fourth horizontal spacing distance GH4 between the third pixel PX3 and the fourth pixel PX4 adjacent to each other in the first direction DR1 may be substantially the same. To this end, the minimum distance GHS3 between the third pixel PX3 and the connection portion SM in the first direction DR1 may be smaller than the third horizontal spacing distance GH3, and the minimum distance GHS4 between the fourth pixel PX4 and the connection portion SM in the first direction DR1 may be smaller than the fourth horizontal spacing distance GH4. Furthermore, the width GSM1 of the connection portion SM in the first direction DR1 may be smaller than the third horizontal spacing distance GH3 or the fourth horizontal spacing distance GH4.

[0115] A minimum distance between first pixels PX1 adjacent in the second direction DR2 may be defined as a first vertical spacing distance GV1, and a minimum distance between third pixels PX3 adjacent in the second direction DR2 may be defined as a third vertical spacing distance GV3. The first vertical spacing distance GV1 and the third vertical spacing distance GV3 may be substantially the same.

[0116] A connection portion SM may be disposed between the first pixel PX1 and the third pixel PX3 adjacent to each other in the second direction DR2. A minimum distance G13 between the first pixel PX1 and the third pixel PX3 adjacent to each other in the second direction DR2 may be a sum of a minimum distance GVS1 between the first pixel PX1 and the connection portion SM in the second direction DR2, a minimum distance GVS3 between the third pixel PX3 and the connection portion SM in the second direction DR2, and a width GSM2 of the connection portion SM in the second direction DR2.

[0117] The minimum distance G13, the first vertical spacing distance GV1, and the third vertical spacing distance GV3 between the first pixel PX1 and the third pixel PX3 adjacent to each other in the second direction DR2 may be substantially the same. To this end, the minimum distance GVS1 between the first pixel PX1 and the connection portion SM in the second direction DR2 may be smaller than the first vertical spacing distance GV1, and the minimum distance GVS3 between the third pixel PX3 and the connection portion SM in the second direction DR2 may be smaller than the third vertical spacing distance GV3. Furthermore, the width GSM2 of the connection portion SM in the second direction DR2 may be smaller than the first vertical spacing distance GV1 or the third vertical spacing distance GV3.

[0118] The minimum distance between the second pixels PX2 adjacent in the second direction DR2 may be defined as a second vertical spacing distance GV2, and the minimum distance between the fourth pixels PX4 adjacent in the second direction DR2 may be defined as a fourth vertical spacing distance GV4. The second vertical spacing distance GV2 and the fourth vertical spacing distance GV4 may be substantially the same.

[0119] A connection portion SM may be disposed between the second pixel PX2 and the fourth pixel PX4 adjacent in the second direction DR2. A minimum distance G24 between the second pixel PX2 and the fourth pixel PX4 adjacent in the second direction DR2 may be a sum of a minimum distance GVS2 between the second pixel PX2 and the connection portion SM in the second direction DR2, a minimum distance GVS4 between the fourth pixel PX4 and the connection portion SM in the second direction DR2, and a width GSM2 of the connection portion SM in the second direction DR2.

[0120] The minimum distance G24, the second vertical spacing distance GV2, and the fourth vertical spacing distance GV4 between the second pixel PX2 and the fourth pixel PX4 adjacent to each other in the second direction DR2 may be substantially the same. To this end, the minimum distance GVS2 between the second pixel PX2 and the connection portion SM in the second direction DR2 may be smaller than the second vertical spacing distance GV2, and the minimum distance GVS4 between the fourth pixel PX4 and the connection portion SM in the second direction DR2 may be smaller than the fourth vertical spacing distance GV4. Furthermore, the width GSM2 of the connection portion SM in the second direction DR2 may be smaller than the second vertical spacing distance GV2 or the fourth vertical spacing distance GV4.

[0121] like Figure 6 As shown, in order to prevent the connection portion SM from being recognized between images displayed by the plurality of display devices 11 , 12 , 13 , and 14 , the minimum distance between pixels of adjacent display devices may be substantially the same as the minimum distance between pixels of the individual display devices.

[0122] Figure 7 is shown along Figure 6A cross-sectional view of an example of a tile-type display device taken along the line BB'.

[0123] Reference Figure 7 , the first display device 11 (refer to Figure 6 ) includes a first display panel 101 and a first front cover COV1. The second display device 12 (refer to Figure 6 ) includes a second display panel 102 and a second front cover COV2.

[0124] Each of the first display panel 101 and the second display panel 102 includes a substrate SUB, a thin film transistor layer TFTL, and a light emitting element layer EML. The thin film transistor layer TFTL and the light emitting element layer EML are combined. Figure 4 Detailed description is given in Figure 7 In the Figure 4 Repeat instructions.

[0125] The substrate SUB may include a first surface 41 on which the thin film transistor layer TFTL is disposed, a second surface 42 facing the first surface, and a first side surface 43 disposed between the first surface 41 and the second surface 42. The first surface 41 may be a front surface or an upper surface of the substrate SUB, and the second surface 42 may be a back surface or a lower surface of the substrate SUB.

[0126] In addition, the substrate SUB may further include a chamfer surface 44 disposed between the first surface 41 and the first side surface 43 and between the second surface 42 and the first side surface 43. The thin film transistor layer TFTL and the light emitting element layer EML may not be disposed on the chamfer surface 44. Due to the chamfer surface 44, the substrate SUB of the first display device 11 and the substrate SUB of the second display device 12 may be prevented from colliding and being damaged.

[0127] The chamfered surface 44 may also be arranged between each other side surface except the first surface 41 and the first side surface 43 and between each other side surface except the second surface 42 and the first side surface 43. Figure 5 In the case of the rectangular planar form shown, the chamfered surface 44 can be arranged between the first surface 41 and each of the second side surface, the third side surface and the fourth side surface, and between the second surface 42 and each of the second side surface, the third side surface and the fourth side surface.

[0128] The first front cover COV1 may be arranged on the chamfered surface 44 of the substrate SUB. For example, the first front cover COV1 may protrude more than the substrate SUB in the first direction DR1 and the second direction DR2. Therefore, the distance GSUB between the substrate SUB of the first display device 11 and the substrate SUB of the second display device 12 may be greater than the distance GCOV between the first front cover COV1 and the second front cover COV2.

[0129] Each of the first front cover COV1 and the second front cover COV2 includes an adhesive member 51, a light transmittance adjusting layer 52 disposed on the adhesive member 51, and an anti-glare layer (Anti-Glare Layer) 53 disposed on the light transmittance adjusting layer 52. And so on.

[0130] Hereinafter, the configuration of the first front cover COV1 will be described by taking it as an example, but the description of this configuration can also be directly applied to the description of the second front cover COV2.

[0131] The adhesive member 51 may be configured to attach the first front cover COV1 to the light emitting element layer EML of the first display panel 101. The adhesive member 51 may be a transparent adhesive member capable of transmitting light. For example, the adhesive member 51 may be an optical clear adhesive film (also called OCA film) or an optically clear resin (OCR).

[0132] The light transmittance adjusting layer 52 may be configured to reduce the light transmittance of external light incident from the outside, or reduce the light transmittance of reflected light that is reflected by the first display panel 101 and the second display panel 102 and incident again through the light transmittance adjusting layer 52. Since the first front cover COV1 includes the light transmittance adjusting layer 52, it is possible to prevent the connection portion SM from being recognized from the outside (refer to FIG. 1 ). Figure 6 ). Therefore, a seamless tile type display device TLD can be realized (refer to Figure 5 ).

[0133] The anti-glare layer 53 may be configured to reduce the glare caused by the display device 10 (see Figure 1 ) inside the metal wiring, etc. and the reflected light can be recognized from the outside. More specifically, the display device 10 may include metal wiring of the thin film transistor layer TFTL or metal electrodes (e.g., pixel electrodes PXE, etc.) on the thin film transistor layer TFTL, and external light incident from the outside may be reflected by the metal wiring, etc., so that the reflected light can be recognized from the outside. Excessive reflected light may become a factor that causes the visibility of the image to be reduced, so the anti-glare layer 53 may be designed to diffusely reflect external light and / or reflected light to prevent the visibility of the image from being reduced. Since the first front cover COV1 includes the anti-glare layer 53, the display device 10 (refer to Figure 1 )The contrast of the displayed image can be increased.

[0134] As an example, the light transmittance adjustment layer 52 may be implemented as a phase retardation layer. As an example, the anti-glare layer 53 may be implemented as a polarizing plate. However, the embodiments of the present invention are not limited thereto.

[0135] In addition, along Figure 6 An example of a tile type display device cut in sections C-C', D-D' and E-E' can be compared with reference Figure 7 An example of the tile-type display device cut along line BB' described above is similar or substantially the same.

[0136] Figure 8 It is shown in detail Figure 5 A magnified layout of the AR2 region.

[0137] Figure 8 A pad PAD and a first pixel PX1 arranged on an upper side of the first display device 11 are shown.

[0138] Reference Figure 8 , more than one pad PAD may be arranged at the upper edge of the first display device 11. When the data line (not shown) of the first display device 11 extends along the second direction DR2, the pad PAD may be arranged at the upper edge and / or the lower edge of the first display device 11. Alternatively, when the data line of the first display device 11 extends along the first direction DR1, the pad PAD may be arranged at the left edge and / or the right edge of the first display device 11.

[0139] The pad PAD may be electrically connected to the data line. Also, the pad PAD may be electrically connected to a side wiring (not shown).

[0140] The side wiring can be arranged on the substrate SUB (refer to Figure 7 ), the side wiring may be arranged to extend from the side and to the lower surface (or back surface). The side wiring may be connected to the connection wiring (not shown) on the lower surface of the substrate SUB. For a detailed description of the side wiring and the connection wiring, please refer to the following Fig. 9 A more detailed explanation is given.

[0141] Fig. 9 is shown along Figure 8 The tile type display device TLD (refer to Figure 5 ) is a cross-sectional view of an example.

[0142] exist Fig. 9 In, with Figure 4 The same reference numerals are given to the same components as those shown in the cross-sectional views. Figure 4 Description of duplicate description.

[0143] Reference Fig. 9, the pad PAD may be arranged on the first insulating film 161. The pad PAD may also be exposed without being covered by the embankment insulating film 191. The pad PAD may include the same material as the pixel electrode PXE or the common electrode CE. For example, the pad PAD may include a stacked structure (Ti / Al / Ti) of aluminum (Al) and titanium (Ti), a stacked structure (ITO / Al / ITO) of aluminum and ITO, an APC (Ag-Pd-Cu) alloy or a stacked structure (ITO / APC / ITO) of an APC alloy and ITO, etc. The pad PAD may include a metal material with high reflectivity.

[0144] The first data metal layer DTL1 may include a data line DL. The data line DL may be disposed on the interlayer insulating film 140. For example, the data line DL may be disposed at the same layer as the first link electrode CE1 and may include the same substance.

[0145] The pad PAD may be electrically connected to the data line DL through the fifth contact hole CT5 penetrating the first insulating film 161. Depending on circumstances, a link wiring (not shown) may be further provided between the pad PAD and the data line DL. In this case, the pad PAD and the data line DL may not be directly connected but may be electrically connected through the link wiring.

[0146] The connection wiring CCL may be disposed on the back side of the substrate SUB. The connection wiring CCL may be a single layer or multiple layers made of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0147] The backside planarization film BVIA may be arranged to cover a portion of the connection wiring CCL. The backside planarization film (BVIA) may be formed using an organic film such as acryl resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0148] The back insulating film BPVX may be arranged on the lower surface of the back planarizing film BVIA (e.g., covering the back planarizing film BVIA). The back insulating film BPVX may include an inorganic film. For example, the inorganic film may be formed using a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0149] The side wiring SCL may be arranged to extend from the lower surface edge of the substrate SUB toward the side surface and the upper surface edge.

[0150] One end of the side wiring SCL may be electrically connected to the connection wiring CCL. For example, the one end of the side wiring SCL may be connected to the side surface and the lower surface of the connection wiring CCL. The other end of the side wiring SCL may be electrically connected to the pad PAD. For example, the other end of the side wiring SCL may be connected to the pad PAD through the sixth contact hole CT6 penetrating the bank insulating film 191.

[0151] The side wiring SCL can be arranged on the side surface of the substrate SUB, the side surface of the buffer film BF, the side surface of the first gate insulating film 131, the side surface of the second gate insulating film 132, the side surface of the interlayer insulating film 140, the side surface of the first insulating film 161 and the side surface of the second insulating film 171.

[0152] The flexible film FPCB may be disposed below the back surface insulating film BPVX (eg, in a lower surface direction of the substrate SUB). The flexible film FPCB may be electrically connected to the connection wiring CCL using the conductive adhesive member CAM.

[0153] The flexible film FPCB may be connected to the connection wiring CCL through the seventh contact hole CT7.

[0154] The seventh contact hole CT7 may be a hole penetrating the back planarization film BVIA and the back insulating film BPVX, or may be a hole formed in a region where the back planarization film BVIA and the back insulating film BPVX are removed in advance.

[0155] A data driving circuit (not shown) for supplying a data voltage to the data line DL may be mounted on one surface of the flexible film FPCB. As an example, the flexible film FPCB may be implemented as a flexible printed circuit board (flexible printed circuit board), but is not limited thereto. As an example, the data driving circuit may be implemented as a source driver integrated circuit (SDIC: Source Driver Integrated Circuit).

[0156] As an example, the conductive adhesive member CAM electrically connecting the flexible film FPCB with the connection wiring CCL may be an anisotropic conductive film (ACF: Anisotropic Conductive Film) or an anisotropic conductive paste (ACP: Anisotropic Conductive Paste), but is not limited thereto.

[0157] Reference Fig. 9 , the flexible film FPCB may be arranged on the back side of the substrate SUB, and may be connected to the pad PAD through the connection wiring CCL and the side wiring SCL, etc. Accordingly, the pixel PX may be arranged to the display panel 100 (refer to Figure 1) edge area, and the ratio of the display area displaying the image can be increased.

[0158] Fig.10 is a block diagram showing a tile type display device TLD according to an embodiment.

[0159] Reference Fig.10 According to an embodiment, a tile-type display device TLD may include a host system HOST and a plurality of display devices 11 , 12 , 13 , and 14 .

[0160] exist Fig.10 In the figure, for the sake of convenience, it is shown that the host system HOST controls the first display device 11, but the host system HOST can also perform the function of controlling multiple display devices 11, 12, 13, and 14.

[0161] As an example, the host system HOST may be implemented as a set-top box, an application processor (AP: Application Processor), and the like.

[0162] The user's command may be input to the host system HOST in various forms. For example, a command based on a user's touch input may be input to the host system HOST. Alternatively, a user's command based on an external input device (e.g., a keyboard input or a button input of a remote controller, etc.) may be input to the host system HOST.

[0163] The host system HOST may receive raw video data corresponding to the raw image from the outside. The host system HOST may divide the raw video data into the same number as the number of the plurality of display devices 11, 12, 13, 14. For example, the host system HOST may divide the raw video data into first video data corresponding to the first image, second video data corresponding to the second image, third video data corresponding to the third image, and fourth video data corresponding to the fourth image, corresponding to the first display device 11, the second display device 12, the third display device 13, and the fourth display device 14. The host system HOST may transmit the first video data to the first display device 11, the second video data to the second display device 12, the third video data to the third display device 13, and the fourth video data to the fourth display device 14.

[0164] The first display device 11 can display the first image according to the first video data, the second display device 12 can display the second image according to the second video data, the third display device 13 can display the third image according to the third video data, and the fourth display device 14 can display the fourth image according to the fourth video data. Accordingly, the user can view the original image obtained by combining the first image to the fourth image displayed in the plurality of display devices 11, 12, 13 and 14.

[0165] Reference Fig.10 The first display device 11 may include a broadcast tuner 210, a signal processing unit 220, a display unit 230, a speaker 240, a user input unit 250, a hard disk drive (HDD) 260, a network communication unit 270, a user interface (UI) generation unit 280 and a control unit 290, etc.

[0166] The broadcast tuner 210 may tune a predetermined channel frequency according to the control of the control unit 290 and receive a broadcast signal of a corresponding channel using an antenna. The broadcast tuner 210 may include a channel detection module and a radio frequency (RF) demodulation module.

[0167] The broadcast signal demodulated by the broadcast tuner 210 is processed by the signal processor 220 and may be output to the display 230 and the speaker 240. Here, the signal processor 220 may include a demultiplexer 221, a video decoder 222, a video processor 223, an audio decoder 224, and an additional data processor 225.

[0168] The demultiplexer 221 separates the demodulated broadcast signal into a video signal, an audio signal, and additional data. The separated video signal, audio signal, and additional data are restored by the video decoder 222, the audio decoder 224, and the additional data processing unit 225, respectively. The video decoder 222, the audio decoder 224, and the additional data processing unit 225 can restore the decoded format corresponding to the encoding format when the broadcast signal is transmitted.

[0169] In addition, the decoded video signal is converted into a vertical frequency, resolution, aspect ratio, etc. suitable for the output standard of the display section 230 by the video processing section 223 , and the decoded audio signal can be output to the speaker 240 .

[0170] The display unit 230 includes a display panel 100 (see Figure 1 ) and a panel driving unit that controls the driving of the display panel 100.

[0171] The user input unit 250 may receive a signal transmitted by the host system HOST. The user input unit 250 may be configured to receive not only data on the selection of a channel transmitted by the host system HOST and the selection and operation of a user interface (UI: User Interface) menu, but also data allowing the user to select and input commands for communicating with other display devices.

[0172] The HDD 260 is used to store various software programs including an operating system (OS) program, recorded broadcast programs, videos, photos, and other data, and can be formed using a storage medium such as a hard disk or a nonvolatile memory. The HDD 260 can be called a storage unit.

[0173] The network communication unit 270 is used for short-range communication with the host system HOST and other display devices, and can be implemented using a communication module including an antenna pattern capable of implementing mobile communication, data communication, Bluetooth, RF, Ethernet, etc. The network communication unit 270 can also transmit and receive wireless signals with at least one of a base station, an external terminal and a server on a mobile communication network constructed according to a technical standard or communication scheme for mobile communication (for example, Global System for Mobile communication (GSM), Code Division Multiple Access (CDMA), Code Division Multiple Access 2000 (CDMA2000), Enhanced Voice-Data Optimized or Enhanced Voice-Data Only (EV-DO), Wideband CDMA (WCDMA), High Speed ​​Downlink Packet Access (HSDPA), High Speed ​​Uplink Packet Access (HSUPA), Long Term Evolution (LTE), Long Term Evolution-Advanced (LTE-A), 5G, etc.) through the antenna pattern described later.

[0174] The network communication unit 270 can transmit and receive wireless signals in a communication network based on wireless Internet technology through an antenna pattern described later. As wireless Internet technology, for example, wireless local area network (WLAN: Wireless LAN), wireless fidelity (Wi-Fi: Wireless-Fidelity), wireless fidelity direct connection (Wi-Fi Direct), Digital Living Network Alliance (DLNA: Digital Living Network Alliance), wireless broadband access (WiBro: Wireless Broadband), world interoperability for microwave access (WiMAX: World Inter operability for Microwave Access), high-speed downlink packet access (HSDPA: High Speed ​​Downlink Packet Access), high-speed uplink packet access (HSUPA: High Speed ​​Uplink Packet Access), long-term evolution (LTE: Long Term Evolution), advanced long-term evolution (LTE-A: Long Term Evolution-Advanced), etc., and the antenna pattern transmits and receives data according to at least one wireless Internet technology within the scope of Internet technologies not listed above.

[0175] The UI generation unit 280 generates a UI menu for communicating with the host system HOST and other display devices, and can be implemented by an algorithm code and an on screen display (OSD) integrated circuit (IC). The UI menu for communicating with the host system HOST and other display devices can be a menu for specifying a counterpart digital TV with which communication is desired and selecting a desired function.

[0176] The control unit 290 is responsible for the overall control of the first display device 11, and is responsible for the communication control between the host system HOST and the second display device 12, the third display device 13 and the fourth display device 14, and stores the corresponding algorithm code for control, and can be implemented by a microcontroller unit (MCU: Micro Controller Unit) that runs the stored algorithm code.

[0177] The control unit 290 controls the corresponding control commands and data to be transmitted to the host system HOST and the second display device 12, the third display device 13, and the fourth display device 14 through the network communication unit 270 according to the input and selection of the user input unit 250. Of course, in the case where predetermined control commands and data are input from the host system HOST and the second display device 12, the third display device 13, and the fourth display device 14, operations are performed according to the corresponding control commands.

[0178] In addition, the block diagram of the second display device 12, the block diagram of the third display device 13 and the block diagram of the fourth display device 14 are combined with Fig.10 The block diagram of the first display device 11 described above is substantially the same, so the description thereof is omitted.

[0179] Fig.11 The figure conceptually shows the transfer process of the light emitting element LE.

[0180] Reference Fig.11 , showing a thin film transistor substrate 1110 and a transfer substrate 1120 transferred to the thin film transistor substrate 1110 .

[0181] The thin film transistor substrate 1110 is simply shown to include a substrate SUB, a thin film transistor layer TFTL formed on the substrate SUB, and a common electrode CE and a pixel electrode PXE formed on the thin film transistor layer TFTL.

[0182] The transfer substrate 1120 may include a plurality of light emitting elements LE and a carrier substrate CAF configured to transfer the plurality of light emitting elements LE to the thin film transistor substrate 1110. The process of transferring the light emitting element LE to the thin film transistor substrate 1110 is also referred to as a transfer process.

[0183] In order to transfer more light emitting elements LE to the thin film transistor substrate 1110 in one transfer process, the transfer substrate 1120 may further include a carrier substrate CAF to which a plurality of light emitting elements LE are attached and then dropped. As an example, the carrier substrate CAF may be implemented as a carrier film including a high molecular weight material having elasticity such as the aforementioned silicon, but the embodiments of the present invention are not limited thereto.

[0184] The carrier substrate CAF may be attached to the base substrate SPUB of the light emitting element LE. The carrier substrate CAF may be separated from the base substrate SPUB and removed at a certain time point after the transfer process is completed.

[0185] The light emitting element LE may be an inorganic light emitting element, and the light emitting element LE may be a micro light emitting diode (MicroLED). A plurality of light emitting elements LE may be transferred in a single transfer process through the carrier substrate CAF.

[0186] In addition, for electrical connection between the light emitting element LE and the common electrode CE and the pixel electrode PXE, a bonding process may be performed after the transfer process. The bonding process may reduce the resistance between the light emitting element LE and the common electrode CE, or may reduce the resistance between the light emitting element LE and the pixel electrode PXE.

[0187] Reference Fig.11 The thin film transistor substrate 1110 may further include a conductive material COND disposed on the pixel electrode PXE and the common electrode CE.

[0188] The conductive material COND may be a structure for improving adhesion between the pixel electrode PXE and the common electrode CE and the light emitting element LE. The conductive material COND may be a structure for reducing resistance between the pixel electrode PXE and the common electrode CE and the light emitting element LE.

[0189] As an example, the conductive substance COND may be an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP), etc. As an example, the conductive substance COND may include a metallic conductive ball (not shown) having conductivity, etc. The conductive substance COND may also have conductivity by pressure and heat. However, the embodiment of the conductive substance COND is not limited thereto.

[0190] Reference Fig.11 , shows the situation that the conductive material COND is arranged on both the pixel electrode PXE and the common electrode CE, but the conductive material COND can be arranged only on the pixel electrode PXE, or only on the common electrode CE. Depending on the situation, the thickness of the conductive material COND arranged on the pixel electrode PXE and the common electrode CE can be different.

[0191] Through the transfer process and the bonding process described above, a plurality of light emitting elements LE can be transferred onto the thin film transistor substrate 1110 .

[0192] Fig.12 1 is a diagram exemplarily showing a backplane substrate 1200 to which a light emitting element LE is transferred.

[0193] Reference Fig.12 The backplane substrate 1200 may include a thin film transistor substrate 1110 and a transfer substrate 1120 .

[0194] Fig.12 The backplane substrate 1200 shown may be a plurality of light emitting elements LE attached to a carrier substrate CAF (see Fig.11 ) is transferred to the thin film transistor substrate 1110.

[0195] The backplane substrate 1200 may further include a mother substrate (not shown). After performing both the transfer process and the bonding process, the mother substrate may be separated and removed from the substrate SUB (e.g., the lower surface of the substrate SUB). As an example, the mother substrate may be a curable substrate including glass or the like, or may be a flexible substrate including plastic or the like.

[0196] As an example, the backplane substrate 1200 may include a substrate for forming a display device 10 (see Figure 1 ) substrate SUB.

[0197] As an example, the backplane substrate 1200 may include a substrate having two or more display devices 10 (see Figure 1 ) substrate SUB. After the transfer process and the bonding process of the backplane substrate 1200 are completed, a scribing process for cutting the substrate SUB can be performed. Two or more display devices 10 can be divided respectively by the scribing process. The scribing lines where the substrate SUB is cut can be physically displayed on the substrate SUB, but are not limited thereto. The light emitting element LE (refer to Fig.11 ) may not be transferred to the scribe line where the substrate SUB is cut. Also, the light emitting element LE may not be bonded to the scribe line.

[0198] As an example, the backplane substrate 1200 may include a substrate for forming a tile type display device TLD (refer to Figure 5 ) of multiple display devices 11, 12, 13, 14 (refer to Figure 5 ) of the substrate SUB. In this case, a plurality of pads PAD (refer to Fig. 9 ) area or arrange the side wiring SCL (refer to Fig. 9 ) may be a region where the light emitting element LE is not transferred, or may be a region where the light emitting element LE is not bonded.

[0199] Fig.13 is an example of a joining system 1300 according to an embodiment of the present invention.

[0200] Reference Fig.13 According to an embodiment of the present invention, the bonding system 1300 may include a chamber 1310 , a workbench 1320 , a pressurizing source 1330 , an elastic body 1340 , a heat source 1350 , and the like.

[0201] The chamber 1310 may provide a space for actually performing the bonding process. The chamber 1310 may include an inlet and outlet OPN. The backplane substrate 1200 may be transferred through the inlet and outlet OPN. The inlet and outlet OPN may be opened or closed. The transferred backplane substrate 1200 may be located on a workbench 1320 arranged in the chamber 1310. The chamber 1310 may include a window WD. The window WD may have light transmittance. The light emitted from the heat source 1350 may be irradiated to the backplane substrate 1200 through the window WD. Heat may be applied to the backplane substrate 1200 by means of the light irradiated to the backplane substrate 1200. Thus, the heat required for the bonding process may be provided.

[0202] The backplane substrate 1200 may be placed on the workbench 1320. The backplane substrate 1200 may be transferred through the port OPN and placed on the workbench 1320. The workbench 1320 may provide a bottom surface for performing a bonding process. The workbench 1320 may be arranged in a flat plate shape, but the embodiments of the present invention are not limited thereto.

[0203] The pressurizing source 1330 is configured to apply pressure to the elastic body 1340. As an example, the pressurizing source 1330 may inject gas (e.g., air) into the interior of the chamber 1310, and the elastic body 1340 may be expanded by the gas injected into the interior of the chamber 1310. As an example, the gas injected by the pressurizing source 1330 may include an inactive gas with low reactivity, but the embodiments of the utility model are not limited thereto. As the pressurizing source 1330 injects gas into the interior of the chamber 1310, the air pressure inside the chamber 1310 surrounded by the elastic body 1340 may be higher than the atmospheric pressure. According to an embodiment, the gas injected into the interior of the chamber 1310 may be discharged through an air outlet (not shown) provided in the chamber 1310. According to an embodiment, at least a portion of the window WD may be opened so that the air injected into the interior of the chamber 1310 is discharged. The pressurizing source 1330 may include a valve VAL. The gas may be injected or not injected into the chamber 1310 by opening and closing the valve (VAL).

[0204] The elastomer 1340 is configured to apply pressure to the workbench 1320 (e.g., the workbench 1320 and the backplane substrate 1200 arranged on the workbench 1320). The elastomer 1340 can be formed using a material having elasticity. For example, the elastomer 1340 may include a rubber material or a plastic material having flexibility (e.g., polyimide), but the embodiments of the present invention are not limited thereto. The elastomer 1340 can be expanded by the gas injected from the pressurizing source 1330. The elastomer 1340 can be in contact with the upper surface S1 of the backplane substrate 1200. The upper surface S1 of the backplane substrate 1200 can be subjected to pressure by the elastomer 1340, and can apply pressure to the light emitting element LE (refer to Fig.11 ) to apply pressure. Thus, pressure can be applied to the light emitting element LE during the bonding process. The elastomer 1340 can have light transmittance (for example, light transmittance to light of a wavelength band irradiated from the heat source 1350). Thus, at least a portion of the light irradiated from the heat source 1350 can be provided to the backplane substrate 1200 through the elastomer 1340.

[0205] The heat source 1350 may irradiate light. The light irradiated from the heat source 1350 is incident on the interior of the chamber 1310 through the window WD of the chamber 1310. The light irradiated from the heat source 1350 may be incident on the upper surface S1 of the backplane substrate 1200, thereby irradiating the light emitting element LE (refer to Fig.11 ) applies heat. According to an embodiment, the heat source 1350 may irradiate infrared rays having a longer wavelength band than visible rays, but embodiments of the present invention are not limited thereto.

[0206] Fig.14 It is shown Fig.13 FIG. 1 is a diagram showing a state in which the bonding system 1300 applies pressure to the backplane substrate 1200 .

[0207] Reference Fig.14 , shows an embodiment in which the valve VAL of the pressurizing source 1330 is opened to inject air AIR into the interior of the chamber 1310. The expanded elastic body 1340a may apply pressure to the upper surface S1 of the backplane substrate 1200. The heat source 1350 may provide heat to the upper surface S1 of the backplane substrate 1200.

[0208] In addition, the expanded elastic body 1340a can provide pressure to the upper surface S1 of the backplane substrate 1200. When the elastic body 1340a applies pressure to the upper surface S1 of the backplane substrate 1200, the elastic body 1340a may be stained with the aforementioned conductive material COND (refer to Fig.11 and Fig.12 ). For example, when the elastic body 1340a removes the carrier substrate CAF (refer to Fig.11 and Fig.12 ) is pressurized on the backplane substrate 1200, the elastic body 1340a may be stained with the conductive material COND. The conductive material COND stained with the elastic body 1340a may prevent uniform pressure from being applied to the upper surface S1 of the backplane substrate 1200. Therefore, the bonding quality may be uneven.

[0209] Fig.15 is an example of a joining system 1500 according to an embodiment of the present invention.

[0210] Reference Fig.15According to an embodiment of the present invention, the bonding system 1500 may include a chamber 1310 , a workbench 1320 , a heat source 1350 , a bonding device 1505 , and the like.

[0211] Description and references for chamber 1310, workbench 1320, and heat source 1350 Fig.13 and Fig.14 The contents of the description are the same, so the description of these structures is omitted.

[0212] The bonding device 1505 according to the embodiment of the present invention may include a frame 1510 , a roller 1520 , a film 1530 , a pressurizing portion 1540 , and a moving portion 1550 .

[0213] The frame 1510 is located on the workbench 1320 (for example, in the third direction DR3 from the workbench 1320). For example, the frame 1510 may be located at a predetermined distance from the workbench 1320. The membrane 1530 pressed by the pressurizing portion 1540 may be in close contact with the frame 1510. The frame 1510 may include an opening OA. The opening OA of the frame 1510 may correspond to the working area WA in the backplane substrate 1200. At the opening OA of the frame 1510, the membrane 1530 may expand, and the expanded membrane 1530 may press the area corresponding to the working area WA of the backplane substrate 1200.

[0214] The roller 1520 may be used as an axis for winding the film 1530. The film 1530 that is not pressed may be provided in a region overlapping with the frame 1510 and the pressurizing portion 1540 (e.g., a region overlapping with the frame 1510 and the pressurizing portion 1540 in the third direction DR3) by the roller 1520. The roller 1520 may rotate. The film 1530 may be wound or unwound by the rotation of the roller 1520.

[0215] Reference Fig.15 , the roller 1520 may include a first roller 1520a and a second roller 1520b. The first roller 1520a and the second roller 1520b may be arranged to be spaced apart from each other. For example, the first roller 1520a and the second roller 1520b may be arranged to be spaced apart from each other in the first direction DR1. A portion 1530a, 1530b of the film 1530 may be wound around the first roller 1520a and the second roller 1520b, respectively. The first roller 1520a and the second roller 1520b may rotate in the same direction. For example, according to the rotation of the first roller 1520a and the second roller 1520b, the first portion 1530a of the film 1530 may be wound around the first roller 1520a, and the second portion 1530b of the film 1530 may be unfolded from the second roller 1520b. The third portion 1530c of the film 1530 unfolded from the second roller 1520b may be located in an area overlapping with the frame 1510 and the pressurizing portion 1540.

[0216] The film 1530 may be located between the frame 1510 and the pressurizing portion 1540. The film 1530 may be pressurized by the pressurizing portion 1540 toward the frame 1510, so as to be closely attached between the pressurizing portion 1540 and the frame 1510. As an example, the film 1530 may be implemented as a flexible plastic film having light transmittance. As an example, the flexible plastic having light transmittance may include polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyethersulfone (PES), fiberglass reinforced plastic (FRP), etc. However, the embodiments of the present invention are not limited thereto, and the film 1530 may be selected from materials not described above as long as the film 1530 has light transmittance and can make the frame 1510 and the pressurizing part 1540 closely attached.

[0217] The film 1530 may be divided into two or more parts. Fig.15 The film 1530 may include a first portion 1530a wound on a first roller 1520a, a second portion 1530b wound on a second roller 1520b, and a third portion 1530c connecting the first portion 1530a and the second portion 1530b.

[0218] One of the first portion 1530a of the film 1530 and the second portion 1530b of the film 1530 (for example, the first portion 1530a of the film 1530) may contain foreign matter (for example, a conductive material COND (see FIG. 1 ) attached from the backplane substrate 1200). Fig.11 and Fig.12 )), and there may be pressure marks (for example, pressure marks caused by the pressurizing portion 1540).

[0219] The other of the first portion 1530a of the film 1530 and the second portion 1530b of the film 1530 (eg, the second portion 1530b of the film 1530) may be free from foreign matter and pressurization marks.

[0220] The third portion 1530c of the film 1530 may be pressurized by the pressurizing part 1540, and may be heated by the heat source 1350. Heat provided from the heat source 1350 may pass through the third portion 1530c of the film 1530 and be provided to the backplane substrate 1200.

[0221] The pressurizing unit 1540 may perform the function of making the film 1530 close to the frame 1510. Although not shown, the pressurizing unit 1540 may be provided by the aforementioned pressurizing source 1330 (see Fig.13 and Fig.14 ) receives air. The air supplied to the pressurizing part 1540 may provide pressure to the film 1530 closely attached to the frame 1510. The film 1530 may provide pressure to the backplane substrate 1200.

[0222] The pressurizing part 1540 may include a first window WD1. The first window WD1 may be configured to transmit light emitted from the heat source 1350. Fig.13 and Fig.14 The illustrated window provided in the chamber 1310 may be referred to as a second window WD2.

[0223] The moving part 1550 may be configured to move the pressurizing part 1540. For example, the moving part 1550 may move (eg, lift and lower) the pressurizing part 1540 in one direction (eg, a direction parallel to the third direction DR3) to bring the film 1530 into close contact with the frame 1510. The moving part 1550 may include a motor.

[0224] Fig.16 , Fig.17 and Fig.18 is an example of Fig.15 The joining system 1500 (refer to Fig.15 )Diagram of the process of performing the bonding process.

[0225] Reference Fig.16 The moving part 1550 may lower the pressurizing part 1540. The pressurizing part 1540 may pressurize the third portion 1530c of the film 1530. The third portion 1530c of the film 1530 may be pressed by the pressurizing part 1540 to be in close contact with the pressurizing part 1540 and the frame 1510.

[0226] The third portion 1530 c of the film 1530 may be deformed corresponding to the shapes of the pressurizing part 1540 and the frame 1510 .

[0227] Reference Fig.17 , air can be provided to the pressurizing unit 1540. For example, the air can be from the pressurizing source 1330 (refer to Fig.13 and Fig.14 The air provided to the pressurizing part 1540 may be released toward the third portion 1530 c of the film 1530 .

[0228] The third portion 1530 c of the film 1530 may be expanded by air pressurization. The expanded third portion 1530 c of the film 1530 may pressurize the working area WA of the backplane substrate 1200.

[0229] The heat source 1350 may irradiate heat. At least a portion of the light (or heat) irradiated by the heat source 1350 may heat the work area WA through the first window WD1 and the second window WD2. Thus, pressure and heat are applied to the work area WA, and thus the bonding process may be performed.

[0230] As an example, the pressure applied to the working area WA may be suitable for placing the light emitting element LE (see Fig.11 ) is bonded to the thin film transistor substrate 1110 (refer to Fig.11 ). For example, the pressure applied to the working area WA may be approximately 0.5 MPa to 0.6 MPa, but the embodiments of the present invention are not limited thereto.

[0231] Reference Fig.18 , the moving part 1550 may raise the pressurizing part 1540. The frame 1510, the film 1530, and the pressurizing part 1540 may be spaced apart from each other.

[0232] The roller 1520 may rotate in one direction. As an example, the rotation direction of the roller 1520 may be a direction rotating from the first direction DR1 to the third direction DR3 (+r direction). However, the embodiment of the present invention is not limited thereto, and the rotation direction of the roller 1520 may be a direction rotating from the third direction DR3 to the first direction DR1 (-r direction). In the following, for the sake of convenience, the rotation direction of the roller 1520 is assumed to be the +r direction and described, but the embodiment of the present invention is not limited thereto.

[0233] Reference Fig.18 , the first roller 1520a and the second roller 1520b can both rotate in the +r direction. The rotation speeds (or rotation accelerations) of the first roller 1520a and the second roller 1520b can be the same as each other, but can be different from each other according to the embodiment. For example, the rotation speeds of the first roller 1520a and the second roller 1520b can be adaptively changed according to the thickness of the film 1530 wound on each roller 1520a, 1520b. For example, the rotation speeds of the first roller 1520a and the second roller 1520b can be constant, regardless of the thickness of the film 1530 wound on each roller 1520a, 1520b.

[0234] As the first and second rollers 1520a and 1520b rotate in the +r direction, the length of the first portion 1530a of the film 1530 may increase, and the length of the second portion 1530b of the film 1530 may decrease. The pressurized and heated third portion 1530c of the film 1530 may move toward the first roller 1520a.

[0235] The backplane substrate 1200 may be moved on the workbench 1320. For example, the backplane substrate 1200 may be moved in one direction (for example, the opposite direction of the first direction DR1) on the workbench 1320. Accordingly, the area BA joined in the backplane substrate 1200 moves in one direction on the workbench 1320, and a new working area WA of the backplane substrate 1200 may be located in an area overlapping with the pressurizing portion 1540 and the frame 1510.

[0236] By repetition Figures 16 to 18 The process described in the figure can be repeated in the backplane substrate 1200 for the bonding process.

[0237] According to the embodiment of the present invention, since the film 1530 is moved by the roller 1520, the film 1530 pressurized by the pressurizing part 1540 can be continuously changed. Thus, the pressure for pressurizing the backplane substrate 1200 can be uniformly maintained.

[0238] Fig.19 is an example of a joining device 1505 according to an embodiment of the present invention.

[0239] Reference Fig.19 According to an embodiment of the present invention, the bonding device 1505 may include a frame 1510, a roller 1520, a film 1530, a pressurizing portion 1540, etc. Although not shown, the bonding device 1505 may also include a moving portion 1550 (see Figures 15 to 18 ), but in Fig.19 The moving part 1550 is omitted.

[0240] The frame 1510 may have a shape in which at least a portion of the upper surface and at least a portion of the lower surface are open. Fig.19 , the frame 1510 may have a hexahedral shape in which at least a portion of the upper surface and at least a portion of the lower surface are opened, but embodiments of the present invention are not limited thereto.

[0241] The roller 1520 may be configured to be rotatable with respect to an axis. The roller 1520 may be cylindrical in shape as a whole, but the embodiment of the present invention is not limited thereto. For example, the roller 1520 may be in the shape of a polygonal prism (eg, a triangular prism, a quadrangular prism, etc.).

[0242] The first roller 1520a and the second roller 1520b may have the same (or substantially the same) or similar shapes. Fig.19, the first roller 1520a and the second roller 1520b may both have a cylindrical shape, and the width and height of each cylinder constituting the first roller 1520a and the second roller 1520b may be the same (or substantially the same). However, the embodiments of the utility model are not limited thereto, and the shapes of the first roller 1520a and the second roller 1520b may be different from each other. For example, in order to make it easier to wind the film 1530 deformed by pressure, one of the first roller 1520a and the second roller 1520b may have a shape corresponding thereto.

[0243] The film 1530 may have light transmittance and flexibility. The first portion 1530a of the film 1530 may be wound on the first roller 1520a. The second portion 1530b of the film 1530 may be wound on the second roller 1520b. The third portion 1530c of the film 1530 may connect the first portion 1530a and the second portion 1530b of the film 1530. At least a portion of the third portion 1530c of the film 1530 may overlap with the frame 1510 and the pressurizing portion 1540 in the third direction DR3 and be arranged.

[0244] The third portion 1530 c of the film 1530 may be flatly (or substantially flatly) spread out, but embodiments of the present invention are not limited thereto.

[0245] The pressurizing portion 1540 may include a first window WD1 and an air passage AP. Light (or heat) irradiated from the heat source may reach the backplane substrate 1200 (see FIG. 1 ) through the first window WD1. Figures 15 to 18 ). The pressure from the outside (eg, the pressurized source 1330 (refer to Fig.13 and Fig.14 ))Introduced air.

[0246] The pressurizing part 1540 may include more than one air channel AP. The air channel AP may be located outside the first window WD1. The air channel AP may be located on the frame 1510 (eg, in the third direction DR3). The film 1530 may be located between the air channel AP and the frame 1510.

[0247] The lower surface of the pressurizing portion 1540 and the upper surface of the frame 1510 may have shapes corresponding to each other. Fig.19, the lower surface of the pressurizing portion 1540 and the upper surface of the frame 1510 may respectively have a quadrilateral shape including long sides and short sides. However, the embodiments of the present invention are not limited thereto, and the lower surface of the pressurizing portion 1540 and the upper surface of the frame 1510 may respectively have a circular or other polygonal shape. Hereinafter, an embodiment in which the pressurizing portion 1540 and the frame 1510 according to an embodiment of the present invention have a quadrilateral bottom surface including long sides with relatively long corners and short sides with relatively short corners will be described as an example. However, the embodiments of the present invention are not limited thereto.

[0248] Reference Fig.19 , the long side corners and the short side corners of the pressurizing portion 1540 may surround the first window WD1. The long side corners of the pressurizing portion 1540 and the short side corners of the pressurizing portion 1540 may be respectively provided with air passages AP. For example, the number of air passages AP provided at the long side corners of the pressurizing portion 1540 may be greater than the number of air passages AP provided at the short side corners of the pressurizing portion 1540. However, the embodiments of the present invention are not limited thereto. The intervals between the multiple air passages AP arranged in the pressurizing portion 1540 may be constant, but the embodiments of the present invention are not limited thereto.

[0249] Fig. 20 Cut along the X-X' line Fig.19 15 is a vertical cross-sectional view of the pressurizing portion 1540 of the bonding device 1505.

[0250] Reference Fig. 20 , the pressurizing portion 1540 according to the embodiment of the present invention may include a pressurizing member 2010 , an elastic member 2020 and a first window WD1 .

[0251] The pressurizing member 2010 may fix the first window WD1. The pressurizing member 2010 may be combined with the elastic member 2020. According to an embodiment, the pressurizing member 2010 may include a first pressurizing member 2010a and a second pressurizing member 2010b. However, the embodiments of the present invention are not limited thereto, and the pressurizing member 2010 may be formed as one body. Hereinafter, an embodiment in which the pressurizing member 2010 includes the first pressurizing member 2010a and the second pressurizing member 2010b is described as an example, but the embodiments of the present invention are not limited thereto.

[0252] The first pressing member 2010a may be coupled to the second pressing member 2010b. The first pressing member 2010a may surround at least a portion of a side surface of the first window WD1. According to an embodiment, the first pressing member 2010a may be connected to the moving part 1550 (refer to Fig.15 ).

[0253] The second pressurizing member 2010b may guide the area in which the first window WD1 is arranged in the pressurizing portion 1540. The second pressurizing member 2010b may be combined with (or closely attached to) the elastic member 2020. The second pressurizing member 2010b may include an inclined surface in the area combined with the elastic member 2020. The close contact force between the pressurizing member 2010 and the elastic member 2020 may be increased by the inclined surface of the second pressurizing member 2010b. According to an embodiment, the second pressurizing member 2010b may be connected to the moving portion 1550 (refer to Fig.15 ).

[0254] An air passage AP may be provided at the pressurizing member 2010. The air passage AP may be located at an outer side of the first window WD1.

[0255] The pressurizing member 2010 may include a material having a small deformation rate caused by compression. For example, the pressurizing member 2010 may be formed using metal, but the embodiments of the present invention are not limited thereto.

[0256] The elastic member 2020 may be coupled (or attached) to the pressurizing member 2010. The elastic member 2020 may include an elastic material having elastic force. For example, the elastic member 2020 may be formed using an elastic material such as silicon, polyurethane, rubber, etc., but the embodiments of the present invention are not limited thereto.

[0257] The elastic member 2020 may include an air channel AP. The air channel AP of the elastic member 2020 may extend from the air channel AP of the pressurizing member 2010.

[0258] The elastic member 2020 may include a bottom surface and one or more inclined surfaces extending from the bottom surface. Fig. 20 , the elastic member 2020 may include a lower surface 2020c and two inclined surfaces 2020a and 2020b extending from the lower surface.

[0259] The bottom surface 2020c of the elastic member 2020 may be flat. For example, the bottom surface 2020c of the elastic member 2020 may be parallel to a plane defined by the first direction DR1 and the second direction DR2. An air passage AP may be provided at the bottom surface 2020c of the elastic member 2020. Air may be released through the bottom surface 2020c of the elastic member 2020.

[0260] The inclined surfaces 2020a and 2020b of the elastic member 2020 may be formed by extending obliquely from the bottom surface 2020c of the elastic member 2020. For example, the inclined surface 2020a on one side of the elastic member 2020 may be located in the first direction DR1 from the bottom surface 2020c of the elastic member 2020, and may be formed by extending obliquely at a predetermined angle from the bottom surface 2020c of the elastic member 2020. The inclined surface 2020b on the other side of the elastic member 2020 may be located in the opposite direction of the first direction DR1 from the bottom surface 2020c of the elastic member 2020, and may be formed by extending obliquely at a predetermined angle from the bottom surface 2020c of the elastic member 2020.

[0261] The angles formed by the inclined surfaces 2020a, 2020b of the elastic component 2020 and the bottom surface 2020c of the elastic component 2020 may be the same as each other, but the embodiments of the utility model are not limited thereto. For example, the angle between the inclined surface 2020a on one side of the elastic component 2020 and the bottom surface 2020c of the elastic component 2020 may be the same as (or substantially the same as) the angle between the inclined surface 2020b on the other side of the elastic component 2020 and the bottom surface 2020c of the elastic component 2020. According to an embodiment, the angle between the inclined surface 2020a on one side of the elastic component 2020 and the bottom surface 2020c of the elastic component 2020 may be different from the angle between the inclined surface 2020b on the other side of the elastic component 2020 and the bottom surface 2020c of the elastic component 2020.

[0262] The first window WD1 may have light transmittance. For example, the first window WD1 may include quartz, glass, plastic, etc., but the embodiment of the present invention is not limited thereto.

[0263] Fig.21 Cut along the X-X' line Fig.19 A vertical cross-sectional view of the frame 1510 of the engaging device 1505.

[0264] Reference Fig.21 , the frame 1510 may include an opening OA and inclined surfaces 2110 a and 2110 b surrounding the opening OA.

[0265] However, for convenience of explanation, the inclined surface located in the first direction DR1 from the opening OA is referred to as one side inclined surface 2110a of the frame 1510, and the inclined surface located in the opposite direction of the first direction DR1 from the opening OA is referred to as the other side inclined surface 2110b of the frame 1510.

[0266] The inclined surface 2110a of the frame 1510 may correspond to the inclined surface 2020a of the elastic member 2020 (see Fig. 20The inclination angle of the inclined surface 2110 a of the frame 1510 may be the same as (or substantially the same as) or similar to the inclination angle of the inclined surface 2020 a of the elastic member 2020 .

[0267] The other side inclined surface 2110b of the frame 1510 may correspond to the other side inclined surface 2020b of the elastic member 2020 (see Fig. 20 The inclination angle of the other side inclined surface 2110 b of the frame 1510 may be the same (or substantially the same) or similar to the inclination angle of the other side inclined surface 2020 b of the elastic member 2020 .

[0268] The width of the upper portion (eg, the third direction DR3) of the opening OA is relatively wide, and the width of the lower portion (eg, the opposite direction of the third direction DR3) is relatively narrow. Fig. 20 )Closely adhere.

[0269] Fig. 22 is another example of a joining system 2200 according to an embodiment of the present invention.

[0270] Reference Fig. 22 According to an embodiment of the present invention, the bonding system 2200 may include a chamber 1310 , a workbench 1320 , a heat source 1350 , a bonding device 1505 ′, and the like.

[0271] Description and explanation of the chamber 1310, the workbench 1320 and the heat source 1350 Fig.13 and Fig.15 The contents to be described are the same, and descriptions of these configurations are omitted.

[0272] The bonding device 1505 ′ according to the embodiment of the present invention may include a frame 1510 , a roller 1520 , a film 1530 , a pressurizing portion 1540 , a moving portion 1550 , an upper roller 2220 , an upper film 2230 , and the like.

[0273] Description and description of frame 1510, roller 1520, and film 1530 Fig.15 The contents to be described are the same, and descriptions of these configurations are omitted.

[0274] Reference Fig. 22 , the pressurizing portion 1540 may include a pressurizing member 2010 and an elastic member 2020. The pressurizing member 2010 may include a first pressurizing member 2010a and a second pressurizing member 2010b.

[0275] The first pressurizing member 2010a may be connected to the moving part 1550. The first pressurizing member 2010a may pressurize the upper film 2230 while moving in one direction (eg, the third direction DR3). The first pressurizing member 2010a may pressurize the upper film 2230 to apply pressure to the second pressurizing member 2010b.

[0276] The second pressurizing member 2010b may be combined with the elastic member 2020. The second pressurizing member 2010b may be pressurized by the first pressurizing member 2010a. The second pressurizing member 2010b may pressurize the elastic member 2020 by virtue of the pressure of the first pressurizing member 2010a. The elastic member 2020 may pressurize the film 1530, and the film 1530 may be closely attached to the frame 1510.

[0277] The upper roller 2220 may be used as an axis for winding the upper film 2230. The upper film 2230 that is not pressurized in the region overlapping with the pressurizing part 1540 (for example, the region overlapping with the second pressurizing member 2010b in the third direction DR3) may be provided by the upper roller 2220. The upper roller 2220 may rotate. The upper film 2230 may be wound or unwound by the rotation of the upper roller 2220.

[0278] Reference Fig. 22 , the upper roller 2220 may include a first upper roller 2220a and a second upper roller 2220b. The first upper roller 2220a and the second upper roller 2220b may be arranged to be spaced apart from each other. For example, the first upper roller 2220a and the second upper roller 2220b may be arranged to be spaced apart from each other along the first direction DR1. A portion 2230a and 2230b of the upper film 2230 may be wound on the first upper roller 2220a and the second upper roller 2220b, respectively. The first upper roller 2220a and the second upper roller 2220b may rotate in the same direction. For example, as the first upper roller 2220a and the second upper roller 2220b rotate, the first portion 2230a of the upper film 2230 is wound on the first upper roller 2220a, and the second portion 2230b of the upper film 2230 is unfolded on the second upper roller 2220b. The third portion 2230c of the upper film 2230 unrolled from the second upper roller 22220b may be located in a region overlapping with the pressurizing part 1540 (eg, between the first pressurizing member 2010a and the second pressurizing member 2010b).

[0279] The upper film 2230 may be located between the first pressurizing member 2010a and the second pressurizing member 2010b. The upper film 2230 may be pressurized toward the second pressurizing member 2010b by the first pressurizing member 2010a, so that it may be closely attached between the first pressurizing member 2010a and the second pressurizing member 2010b. As an example, the upper film 2230 may be implemented as a flexible plastic film with light transmittance. As an example, the flexible plastic with light transmittance may include polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyethersulfone (PES), fiber reinforced plastic (FRP), etc. However, the embodiments of the present invention are not limited thereto, and the upper film 2230 may be selected from materials not described above as long as the upper film 2230 has light transmittance and can make the first pressurizing member 2010a and the second pressurizing member 2010b closely attached.

[0280] The upper film 2230 may be divided into two or more parts. Fig. 22 , the upper film 2230 may include a first portion 2230a wound on the first upper roller 2220a, a second portion 2230b wound on the second upper roller 2220b, and a third portion 2230c connecting the first portion 2230a and the second portion 2230b.

[0281] A pressurization mark (eg, a mark caused by the first pressurizing member 2010a ) may remain in one of the first portion 2230a of the upper film 2230 and the second portion 2230b of the upper film 2230 (eg, the first portion 2230a of the upper film 2230 ).

[0282] The other of the first portion 2230 a of the upper film 2230 and the second portion 2230 b of the upper film 2230 (eg, the second portion 2230 b of the upper film 2230 ) may have no pressurization mark.

[0283] The third portion 2230 c of the upper film 2230 may be pressurized by the first pressurizing member 2010 a , and may transmit light (or heat) provided by the heat source 1350 .

[0284] Reference Fig. 22During the period when the first pressing member 2010a does not apply pressure to the second pressing member 2010b, the elastic member 2020 and the frame 1510 may not be completely in close contact. For example, a gap sufficient to allow the film 1530 to move may be provided between the elastic member 2020 and the frame 1510.

[0285] Fig.23 and Fig.24 is an example of Fig. 22 A diagram of a bonding system 2200 performing a bonding process.

[0286] Reference Fig.23 The moving part 1550 may lower the first pressurizing member 2010a. The first pressurizing member 2010a may pressurize the third portion 2230c of the upper film 2230. The third portion 2230c of the upper film 2230 may be pressed by the first pressurizing member 2010a to be closely attached between the first pressurizing member 2010a and the second pressurizing member 2010b.

[0287] The third portion 2230c of the upper film 2230 may be deformed corresponding to the shapes of the first pressurizing member 2010a and the second pressurizing member 2010b.

[0288] Reference Fig.24 , air can be provided to the second pressurizing component 2010b. For example, the air can be from the pressurizing source 1330 (refer to Fig.13 and Fig.14 The air provided to the second pressurizing member 2010 b may be released toward the third portion 1530 c of the film 1530 .

[0289] The third portion 1530 c of the film 1530 may be expanded by air pressurization. The expanded third portion 1530 c of the film 1530 may pressurize the backplane substrate 1200 .

[0290] The heat source 1350 may irradiate light (or heat). At least a portion of the light (or heat) irradiated by the heat source 1350 may pass through the first window WD1, the upper film 2230, and the second window WD2 and heat the backplane substrate 1200. Thus, pressure and heat may be applied to the backplane substrate 1200 to perform a bonding process.

[0291] The drawings and detailed descriptions of the utility model referred to so far are merely exemplary of the utility model, and are used only for the purpose of illustrating the utility model, and are not used to define the meaning or limit the scope of the utility model recorded in the claims. Therefore, a person with ordinary knowledge in the technical field to which the utility model belongs should understand that various modifications and other equivalent embodiments can be made. Therefore, the true technical protection scope of the utility model should be determined by the technical ideas of the attached claims.

Claims

1. A bonding device, characterized in that: include: a frame, provided with an opening; a flexible film arranged to overlap the frame and configured to pressurize the light emitting element; a roller configured to roll up the film to replace a portion of the film arranged to overlap the frame; as well as The pressurizing unit is configured to pressurize the film toward the region where the light emitting element is located so as to bring the film into close contact with the frame.

2. The joining device according to claim 1, characterized in that: The pressurizing portion includes an air passage arranged to overlap with the opening of the frame.

3. The joining device according to claim 2, characterized in that: The pressurizing unit further comprises: a pressurizing member formed with the air passage; and The elastic member is in close contact with the pressure member and is provided with a bottom surface, a first inclined surface and a second inclined surface. The bottom surface corresponds to the opening of the frame, the first inclined surface extends from one side of the bottom surface, and the second inclined surface extends from the other side of the bottom surface. The frame includes an inclined surface corresponding to the first inclined surface and the second inclined surface of the pressurizing portion.

4. The joining device according to claim 3, characterized in that: The pressurizing unit further comprises: a light-transmitting window, coupled to the pressurizing member, Wherein, the air channel is located around the window, The pressurizing component comprises: a first pressurizing member; and The second pressing member is pressurized by the first pressing member and is combined with the window.

5. The joining device according to claim 4, characterized in that: Also includes: an upper film located between the first pressurizing member and the second pressurizing member; and The upper roller is configured to wind up the upper film.

6. The joining device according to claim 1, characterized in that: The roller comprises: a first roller; and a second roller, arranged to be spaced apart from the first roller, Wherein, the film comprises: A first portion, wound on the first roller; a second portion wound on the second roller; and The third part connects the first part and the second part and is arranged to overlap with the pressurizing part.

7. A joining system, characterized in that: include: a chamber, equipped with an entrance and an exit; a workbench configured to support the substrate received through the entrance; a heat source configured to provide heat to the substrate; as well as a bonding device configured to provide pressure to the workbench, Wherein, the joining device comprises: a frame, provided with an opening; a membrane arranged to overlap the frame; a roller configured to roll up the film; and The pressurizing unit is configured to bring the film into close contact with the frame.

8. The joining system according to claim 7, characterized in that The bonding device further includes a moving portion configured to move the pressurizing portion toward the workbench or away from the workbench.

9. The joining system according to claim 7, characterized in that The pressurizing portion includes a light-transmissive first window, The chamber includes a second window located between the first window and the heat source.

10. The joining system according to claim 7, characterized in that The worktable supports the substrate on a plane defined by a first direction and a second direction, The roller rotates from the first direction to a third direction, The third direction is perpendicular to each of the first direction and the second direction.

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