Display device

Abstract

The present disclosure discloses a display device including: a first substrate including a component area and a main display area surrounding at least a portion of the component area; a second substrate disposed on the first substrate and including a component area and a main display area surrounding at least a portion of the component area; a first-1 electrode disposed on one surface of the first substrate; and a second-1 electrode disposed on one surface of the second substrate, in which each of the first substrate and the second substrate includes an electrochromic material.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application is based on and claims the benefit of priority from Korean Patent Application No. 10-2023-0075069 filed on June 12, 2023 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0003] One or more embodiments relate to a display device. Background Art

[0004] The display device visually displays data. The display device may provide an image by using a light emitting diode. As the applications and structures of the display device have been diversified, various designs for embedding components such as a camera in the display device have been attempted. Utility Model Content

[0005] In order to improve the transmittance of the component area of ​​the display device where the components are arranged, attempts have been made to apply a transparent material to the substrate or use a colored material and drill holes in the substrate that overlap with the component area. In this case, there are problems of process risks and structural disadvantages. One or more embodiments include a display device with improved transmittance in the component area. However, the embodiments are only examples, and the scope of the present disclosure is not limited thereto.

[0006] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented embodiments of the disclosure.

[0007] An embodiment of the display device includes: a first substrate, including a component area and a main display area surrounding at least a portion of the component area; a second substrate, arranged on the first substrate and including the component area and the main display area surrounding at least a portion of the component area; a first-1 electrode, arranged on one surface of the first substrate; and a second-1 electrode, arranged on one surface of the second substrate, wherein each of the first substrate and the second substrate includes an electrochromic material.

[0008] In a plan view, at least one of the first-1 electrode and the second-1 electrode may surround at least a portion of the component region.

[0009] At least a portion of the first-1 electrode and at least a portion of the second-1 electrode may overlap each other.

[0010] The display device may further include: a first-2 electrode disposed on a surface of the first substrate opposite to a surface on which the first-1 electrode is disposed.

[0011] The display device may further include: a second-2 electrode disposed on a surface of the second substrate opposite to a surface on which the second-1 electrode is disposed.

[0012] Each of the first substrate and the second substrate may include a peripheral region surrounding the main display region, and a portion of the first-1 electrode and a portion of the second-1 electrode may each be arranged in the peripheral region to bypass the main display region.

[0013] The second substrate may include an opening disposed in the peripheral region and penetrating the second substrate.

[0014] The first-1 electrode and the second-1 electrode may be connected to each other in a portion of the peripheral region.

[0015] The transmittance of each of the first substrate and the second substrate may increase when a voltage is applied thereto.

[0016] The display device may further include: a barrier layer disposed between the first substrate and the second substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and other aspects, features and advantages of specific embodiments of the present disclosure will become more apparent through the following description in conjunction with the accompanying drawings, in which:

[0018] Figure 1 is a schematic perspective view of a display device according to an embodiment;

[0019] Figure 2 is a schematic cross-sectional view of a portion of a display device according to an embodiment;

[0020] Figure 3 is a schematic plan view of a display device according to an embodiment;

[0021] Figure 4 is a cross-sectional view of a portion of a display device according to an embodiment;

[0022] Figure 5A and Figure 5B is a schematic plan view of a portion of a display device according to an embodiment;

[0023] Fig. 6A and Figure 6B is a schematic cross-sectional view of a portion of a display device according to an embodiment;

[0024] Fig. 7A and Figure 7B is a schematic cross-sectional view of a portion of a display device according to an embodiment;

[0025] Figure 8 is a schematic cross-sectional view of a portion of a display device according to an embodiment;

[0026] Fig. 9 is a cross-sectional view of a portion of a display device according to another embodiment;

[0027] Fig. 10A and Fig. 10B is a schematic plan view of a portion of a display device according to another embodiment;

[0028] Fig.11A and Fig. 11B is a schematic cross-sectional view of a portion of a display device according to another embodiment;

[0029] Fig. 12A and Fig. 12B is a schematic cross-sectional view of a portion of a display device according to another embodiment; and

[0030] Fig.13 is a schematic cross-sectional view of a portion of a display device according to another embodiment. DETAILED DESCRIPTION

[0031] Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings, in which like reference numerals refer to like elements throughout the specification. In this regard, the embodiments may have different forms and should not be construed as being limited to the descriptions set forth herein. Accordingly, embodiments are described below only by reference to the accompanying drawings to illustrate aspects of the present description.

[0032] As used herein, the word "or" means a logical "OR," thus, unless the context indicates otherwise, the expression "A, B, or C" means "A, B, and C," "A and B but not C," "A and C but not B," "B and C but not A," "A but not B and not C," "B but not A and not C," and "C but not A and not B." Throughout this disclosure, the expression "at least one of a, b, and c" means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0033] Various modifications may be applied to this embodiment, and specific embodiments will be illustrated in the accompanying drawings and described in the detailed description section. The effects and features of this embodiment and methods for achieving them will become clearer with reference to the detailed description below in conjunction with the accompanying drawings. However, this embodiment may be implemented in various forms without being limited to the embodiments presented below.

[0034] Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings, and in the description with reference to the accompanying drawings, the same or corresponding elements are denoted by the same reference numerals and redundant descriptions thereof are omitted.

[0035] In the following embodiments, it will be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element.

[0036] In the following embodiments, unless clearly indicated otherwise in the context, the singular expression in the present specification includes the plural expression.

[0037] In the following embodiments, it will be further understood that the terms “include” and “comprising” used herein specify the presence of stated features or elements, but do not preclude the presence or addition of one or more other features or elements.

[0038] In the following embodiments, it will be understood that when a layer, region or element is referred to as being "formed on" another layer, region or element, it may be directly or indirectly formed on the other layer, region or element. That is, for example, there may be intervening layers, regions or elements.

[0039] For the convenience of explanation, the size of the elements in the drawings may be exaggerated. In other words, since the size and thickness of the elements in the drawings are arbitrarily illustrated for the convenience of explanation, the following embodiments are not limited thereto.

[0040] When a specific embodiment can be implemented differently, a specific process order can be performed differently from the described order. For example, two processes described successively can be performed substantially simultaneously or in the reverse order of the described order.

[0041] In the following embodiments, it will be understood that when a layer, region or element is connected to another layer, region or element, the layer, region or element may be directly connected, or may be indirectly connected through another layer, region or element between them. For example, in this specification, when a layer, region or element is electrically connected to another layer, region or element, the layer, region or element may not only be directly electrically connected, but may also be indirectly electrically connected through another layer, region or element between them.

[0042] The x direction, y direction, and z direction are not limited to directions corresponding to the three axes of the rectangular coordinate system and can be interpreted in a broad sense. For example, the x direction, y direction, and z direction may be perpendicular to each other, or may represent different directions that are not perpendicular to each other.

[0043] Figure 1 is a schematic perspective view of a display device according to an embodiment.

[0044] refer to Figure 1, the display device 1 includes a display area DA and a peripheral area DPA around the display area DA. The display area DA may include a component area CA and a main display area MDA surrounding at least a portion of the component area CA. In other words, each of the component area CA and the main display area MDA may display an image alone or together. The peripheral area DPA may be a non-display area in which a display element is not arranged. The display area DA may be completely surrounded by the peripheral area DPA.

[0045] Figure 1 One component area CA is shown to be arranged in the main display area MDA. In another embodiment, the display device 1 may have two or more component areas CA, and the plurality of component areas CA may have different shapes and sizes. When viewed in a direction substantially perpendicular to the upper surface of the display device 1, the component area CA may have various shapes such as a circle, an ellipse, or a polygon such as a quadrilateral, a star shape, or a diamond shape. Figure 1 It is shown that when viewed in a direction substantially perpendicular to the upper surface of the display device 1, the component area CA is arranged at the upper center of the main display area MDA (in the y direction) having a substantially quadrilateral shape, but the component area CA can be arranged on one side of the main display area MDA having a quadrilateral shape, for example, the upper right side or the upper left side.

[0046] The display device 1 may provide an image by using a plurality of main sub-pixels Pm arranged in the main display area MDA and a plurality of auxiliary sub-pixels Pa arranged in the component area CA.

[0047] As reference below Figure 2 As described, in the component area CA, the component 20 as an electronic component may be disposed under the substrate 100 to correspond to the component area CA. The component 20 may be a camera using infrared or visible light, and may include an image capture device. Alternatively, the component 20 may be a solar cell, a flash, an illumination sensor, a proximity sensor, or an iris sensor. Alternatively, the component 20 may have a function of receiving sound. In order to reduce restrictions on the function of the component 20, the component area CA may include a transmission area TA through which light or / and sound output from the component 20 to the outside or propagated from the outside toward the component 20 may pass. In the case of the display device 1 according to the embodiment, when light is transmitted through the component area CA, the transmittance may be about 10% or more, for example, 40% or more, 25% or more, 50% or more, 85% or more, or 90% or more.

[0048] A plurality of auxiliary sub-pixels Pa may be arranged in the component area CA. The plurality of auxiliary sub-pixels Pa may emit light to provide a specific image. The image displayed in the component area CA is an auxiliary image and may have a resolution lower than that of the image displayed in the main display area MDA. In other words, the component area CA includes a transmission area TA through which light and / or sound may be transmitted, and when the sub-pixel is not arranged in the transmission area TA, the number of auxiliary sub-pixels Pa that may be arranged per unit area may be less than the number of main sub-pixels Pm arranged per unit area in the main display area MDA.

[0049] Figure 2 is a schematic cross-sectional view of a portion of a display device according to an embodiment.

[0050] refer to Figure 2 , the display device 1 may include a display panel 10 including a display element and a component 20 corresponding to the component area CA.

[0051] The display panel 10 may include a substrate 100 , a display element layer 200 disposed on the substrate 100 , and a thin film encapsulation layer 300 as a sealing member for sealing the display element layer 200 .

[0052] The substrate 100 may have a multilayer structure including a layer containing a polymer resin or an inorganic layer. For example, the substrate 100 may include a first substrate 1100, a second substrate 2100 disposed on the first substrate 1100, a first barrier layer 1102 disposed between the first substrate 1100 and the second substrate 2100, and a second barrier layer 2102 disposed on the second substrate 2100.

[0053] Each of the first barrier layer 1102 and the second barrier layer 2102 may include silicon oxide (SiO x ), silicon nitride (SiN x ) or silicon oxynitride (SiO x N y ) of inorganic insulating materials.

[0054] Each of the first substrate 1100 and the second substrate 2100 may include a polymer resin such as polyimide.

[0055] In some embodiments, each of the first substrate 1100 and the second substrate 2100 may include an electrochromic material that undergoes a change when exposed to an electric field. For example, each of the first substrate 1100 and the second substrate 2100 may include an electrochromic polyimide whose transmittance increases when exposed to an electric field.

[0056] In this case, other physical properties of the first substrate 1100 and the second substrate 2100 may remain substantially the same as those in the case where each of the first substrate 1100 and the second substrate 2100 includes a material that does not have an electrochromic property. For example, the transmittance of each of the first substrate 1100 and the second substrate 2100 before applying an electric field may be about 60% to about 65%. The thermal expansion coefficient of each of the first substrate 1100 and the second substrate 2100 may be about 3ppm / °C to about 6ppm / °C, which may remain the same even after applying an electric field. The temperature at which the mass reduction during the thermogravimetric analysis of the first substrate 1100 and the second substrate 2100 is observed may be about 530°C to about 580°C, which may remain the same even after applying an electric field. The modulus of each of the first substrate 1100 and the second substrate 2100 may be about 9Gpa to about 12Gpa, which may remain the same even after applying an electric field.

[0057] After the electric field is applied, the electrochromic related physical properties of the first substrate 1100 and the second substrate 2100 may be changed. For example, before the electric field is applied, the transmittance of each of the first substrate 1100 and the second substrate 2100 may be about 60% to about 65%, and after the electric field is applied, the transmittance of each of the first substrate 1100 and the second substrate 2100 may be about 80% or more. In this case, the driving voltage of each of the first substrate 1100 and the second substrate 2100 may be about 0.5V to about 5V to generate the electrochromic phenomenon. The time for maintaining the electrochromic may be about 0.1 seconds to about 1 second.

[0058] By including an electrochromic material in each of the first substrate 1100 and the second substrate 2100, the transmittance of a partial area (eg, the component area CA) can be selectively changed by applying a voltage to the partial area. At the same time, the stability required as a substrate can be ensured, and the structure of the substrate can be unchanged.

[0059] The display device 1 may include a first-1 electrode 1101a and a second-1 electrode 2101a as members for applying a voltage to partial regions of the first substrate 1100 and the second substrate 2100. In an embodiment, the first-1 electrode 1101a may be disposed on the first substrate 1100, and the second-1 electrode 2101a may be disposed on the second substrate 2100. At least some portions of the first-1 electrode 1101a and at least some portions of the second-1 electrode 2101a may be disposed on the first substrate 1100 and the second substrate 2100, respectively, to overlap with the component area CA.

[0060] The display element layer 200 may include a circuit layer including a thin film transistor TFT, an organic light emitting diode OLED as a display element, and an insulating layer IL disposed therebetween.

[0061] The thin film transistor TFT and the main organic light emitting diode OLEDm connected to the thin film transistor TFT may be arranged to implement a main sub-pixel Pm in the main display area MDA of the display panel 10. The auxiliary organic light emitting diode OLEDa may be arranged in the component area CA to implement the auxiliary sub-pixel Pa. The area of ​​the component area CA in which the auxiliary sub-pixel Pa is arranged may be referred to as an auxiliary display area.

[0062] The transmission area TA in which the display element is not arranged may be arranged in the component area CA. The transmission area TA may be an area through which light / signals emitted from the component 20 arranged to correspond to the component area CA or light / signals incident into the component area CA are transmitted. The auxiliary display area and the transmission area TA may be alternately arranged in the component area CA.

[0063] The thin film encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. For example, the thin film encapsulation layer 300 may include a first inorganic encapsulation layer 310, a second inorganic encapsulation layer 330, and an organic encapsulation layer 320 disposed therebetween. Each of the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may include a layer made of aluminum oxide (AlO x ), titanium oxide (TiO x ), tantalum oxide (TaO x ), hafnium oxide (HfO x ), zinc oxide (ZnO x ), silicon oxide (SiO x ), silicon nitride (SiN x ) and silicon oxynitride (SiO x N y The organic encapsulating layer 320 may include at least one inorganic insulating material selected from polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, and hexamethyldisiloxane.

[0064] The area of ​​the component area CA may be larger than the area where the component 20 is arranged. In addition, a plurality of components 20 may be arranged in the component area CA. The plurality of components 20 may have different functions. For example, one of the plurality of components 20 may be a camera, and another may be an infrared sensor.

[0065] Although not in Figure 2, but components such as an input sensing member for sensing a touch input, an anti-reflection member including a polarizer and a retarder or a color filter and a black matrix, and a transparent window may be further provided on the display panel 10.

[0066] In the present embodiment, the thin film encapsulation layer 300 is used as an encapsulation member for sealing the display element layer 200 , but the present disclosure is not limited thereto. For example, a sealing substrate bonded to the substrate 100 by a sealant or glass frit may be used as a member for sealing the display element layer 200 .

[0067] Figure 3 is a schematic plan view of a display device according to an embodiment.

[0068] refer to Figure 3 , the display device 1 may include a display area DA and a peripheral area DPA surrounding the display area DA. The display area DA may include a component area CA and a main display area MDA surrounding at least a portion of the component area CA.

[0069] The display device 1 may include an electrode 101 extending from the component area CA to the peripheral area DPA. The electrode 101 may include the following reference Figure 4 and Fig. 9 The first-1 electrode, the first-2 electrode, the second-1 electrode, and the second-2 electrode are described.

[0070] The display device 1 may include a terminal portion 40 disposed at one side of the peripheral area DPA. The terminal portion 40 may be connected to a circuit board.

[0071] The electrode 101 may extend from the component area CA and may be partially arranged in the peripheral area DPA. For example, the electrode 101 may be arranged in the peripheral area DPA by extending from the component area CA and bypassing the display area DA. In an embodiment, the electrode 101 may extend from the component area CA in the +y direction, may be bent at the upper end of the peripheral area DPA in the ±y direction and extend along the peripheral area DPA, and may then be bent at its lower end in the ±y direction and connected to the terminal portion 40. In this case, a portion of the electrode 101 may be arranged in a portion of the main display area MDA arranged between the component area CA and the peripheral area DPA.

[0072] Figure 3 The electrode 101 is shown to be arranged in a portion of the peripheral area DPA arranged approximately in the +x direction of the display area DA, but the disclosure is not limited thereto. In another embodiment, the electrode 101 may be arranged in a portion of the peripheral area DPA arranged approximately in the -x direction of the display area DA.

[0073] Figure 4 is a cross-sectional view of a portion of a display device according to an embodiment. Figure 4 It is taken along the line I-I' Figure 3 0046] A cross-sectional view of one of the various examples of embodiments shown in FIG.

[0074] refer to Figure 4 , the display device 1 may include a display area DA including a main display area MDA and a component area CA. The main subpixel Pm may be arranged in the main display area MDA, and the first auxiliary subpixel Pa1 and the second auxiliary subpixel Pa2 may be arranged in the component area CA.

[0075] Although not in Figure 4 However, the area of ​​the component area CA in which the first auxiliary sub-pixel Pa1 and the second auxiliary sub-pixel Pa2 are not arranged may be a transmission area TA ( Figure 2 ).

[0076] A sub-pixel circuit including a first thin film transistor TFT1 and a second thin film transistor TFT2 and a main organic light emitting diode OLEDm as a main display element connected to the sub-pixel circuit may be arranged in the main display area MDA. A first auxiliary organic light emitting diode OLEDa1 and a second auxiliary organic light emitting diode OLEDa2 may be arranged as auxiliary display elements in the component area CA.

[0077] In the present embodiment, an organic light emitting diode is used as a display element, but in another embodiment, an inorganic light emitting device or a quantum dot light emitting device or the like may be used as a display element.

[0078] The second substrate 2100 may be disposed on the first substrate 1100. The first barrier layer 1102 may be disposed between the first substrate 1100 and the second substrate 2100. The second barrier layer 2102 may be disposed on the second substrate 2100. The first barrier layer 1102 and the second barrier layer 2102 may prevent external air from penetrating into the sub-pixel circuit and the organic light emitting diode.

[0079] Figure 4 Two substrates and two barrier layers are illustrated, but the present disclosure is not limited thereto and the number of substrates and the number of barrier layers may vary.

[0080] The first-1 electrode 1101a and the second-1 electrode 2101a may be disposed on one surface of the first substrate 1100 and one surface of the second substrate 2100, respectively. For example, the first-1 electrode 1101a may be disposed on the first substrate 1100, and the second-1 electrode 2101a may be disposed on the second substrate 2100.

[0081] Figure 4The first-1 electrode 1101a and the second-1 electrode 2101a are shown to be disposed on the upper surface of the first substrate 1100 and the upper surface of the second substrate 2100, respectively, but the present disclosure is not limited thereto. When the first-1 electrode 1101a and the second-1 electrode 2101a are arranged to correspond to the first substrate 1100 and the second substrate 2100, respectively, there is no limitation on their positions. In an embodiment, the first-1 electrode 1101a may be disposed on the upper surface of the first substrate 1100, and the second-1 electrode 2101a may be disposed on the lower surface of the second substrate 2100 (or between the second substrate 2100 and the first barrier layer 1102). In another embodiment, the first-1 electrode 1101a may be inserted into the first substrate 1100, and the second-1 electrode 2101a may be inserted into the second substrate 2100. In another embodiment, the first-1 electrode 1101 a may be inserted into the first barrier layer 1102 , and the second-1 electrode 2101 a may be inserted into the second barrier layer 2102 .

[0082] At least a portion of at least one of the first-1 electrode 1101a and the second-1 electrode 2101a may overlap the component area CA.

[0083] The first-1 electrode 1101a and the second-1 electrode 2101a may overlap at least a portion of the component area CA and overlap a portion of the main display area MDA, and may extend to the peripheral area DPA. In an embodiment, a portion of each of the first-1 electrode 1101a and the second-1 electrode 2101a may be arranged in the component area CA, another portion thereof may be arranged in the main display area MDA between the component area CA and the peripheral area DPA, and another portion thereof may be arranged in the peripheral area DPA.

[0084] Figure 4 The first-1 electrode 1101a and the second-1 electrode 2101a are arranged to overlap the entire component area CA, but the disclosure is not limited thereto. In another embodiment, the first-1 electrode 1101a may be arranged to overlap the entire component area CA, and the second-1 electrode 2101a may be arranged to overlap a portion of the component area CA.

[0085] The first-1 electrode 1101a and the second-1 electrode 2101a may not overlap with the main organic light emitting diode OLEDm.

[0086] The first-1 electrode 1101a and the second-1 electrode 2101a may overlap each other. In an embodiment, the first-1 electrode 1101a and the second-1 electrode 2101a may have the same shape on a plane and may completely overlap each other. Figure 5A and Figure 5BThe present disclosure is not limited thereto, but the first-1 electrode 1101a and the second-1 electrode 2101a may partially overlap each other. However, in this specification, for ease of description, an embodiment in which the first-1 electrode 1101a and the second-1 electrode 2101a completely overlap each other is shown and described.

[0087] The lower metal layer BML may be arranged in the second barrier layer 2102. The lower metal layer BML may be arranged to correspond to the lower portion of the first thin film transistor TFT1. The lower metal layer BML may block external light from reaching the main sub-pixel Pm including the first thin film transistor TFT1. For example, the lower metal layer BML may prevent light introduced from the lower portions of the first substrate 1100 and the second substrate 2100 from reaching the main sub-pixel Pm. In some embodiments, a constant voltage or signal may be applied to the lower metal layer BML to prevent damage to the sub-pixel circuit due to electrostatic discharge.

[0088] The lower metal layer BML may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) or copper (Cu). The lower metal layer BML may be a single layer or multiple layers of the above materials.

[0089] The buffer layer 103 may be disposed on the second barrier layer 2102. The buffer layer 103 may be disposed on the first substrate 1100 and the second substrate 2100 to reduce or prevent foreign matter, moisture, or external air from penetrating from the lower portion of the first substrate 1100 and the second substrate 2100, and may provide a flat surface on the first substrate 1100 and the second substrate 2100. The buffer layer 103 may include an inorganic material such as an oxide or a nitride, an organic material, or an organic / inorganic composite material, and may include a single layer or a multilayer structure of an inorganic material and an organic material. In some embodiments, the buffer layer 103 may have a silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), aluminum oxide (AlO x ), aluminum nitride (AlN x ), titanium oxide (TiO x ) and titanium nitride (TiN x ) is a single-layer or multi-layer structure of at least one of the above.

[0090] The first thin film transistor TFT1 and the second thin film transistor TFT2 may be disposed above the buffer layer 103. The first thin film transistor TFT1 may include a first active layer A1, a first-1 gate electrode G1-1 and a first-2 gate electrode G1-2, a first source electrode S1, and a first drain electrode D1. The second thin film transistor TFT2 may include a second active layer A2, a second-1 gate electrode G2-1 and a second-2 gate electrode G2-2, a second source electrode S2, and a second drain electrode D2. The first thin film transistor TFT1 may be connected to the main organic light emitting diode OLEDm to drive the main organic light emitting diode OLEDm.

[0091] In some embodiments, the first thin film transistor TFT1 may be a driving transistor of the main sub-pixel Pm, and the second thin film transistor TFT2 may be a switching transistor.

[0092] The first active layer A1 may be disposed on the buffer layer 103 and may include polysilicon. In another embodiment, the first active layer A1 may include amorphous silicon. The first active layer A1 may include a channel region, a source region doped with impurities, and a drain region doped with impurities.

[0093] The first active layer A1 may overlap the lower metal layer BML with the buffer layer 103 between the first active layer A1 and the lower metal layer BML. In an embodiment, the width of the first active layer A1 may be less than the width of the lower metal layer BML, and thus, when viewed in a direction perpendicular to the first active layer A1, the first active layer A1 may completely overlap the lower metal layer BML.

[0094] The first gate insulating layer 1104 may be arranged to cover the first active layer A1. The first gate insulating layer 1104 may include a silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), aluminum oxide (AlO x ), titanium oxide (TiO x ), tantalum oxide (TaO x ), hafnium oxide (HfO x ) or zinc oxide (ZnO x The first gate insulating layer 1104 may have a single-layer or multi-layer structure including the above-mentioned inorganic insulating material.

[0095] The first-1 gate electrode G1-1 may be disposed on the first gate insulating layer 1104 to overlap the first active layer A1. The first-1 gate electrode G1-1 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), or copper (Cu), and may have a single-layer or multi-layer structure of the above materials.

[0096] The second gate insulating layer 2104 may be arranged to cover the first-1 gate electrode G1-1. The second gate insulating layer 2104 may include a silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), aluminum oxide (AlO x ), titanium oxide (TiO x ), tantalum oxide (TaO x ), hafnium oxide (HfO x ) or zinc oxide (ZnO x The second gate insulating layer 2104 may have a single-layer or multi-layer structure including the above-mentioned inorganic insulating material.

[0097] The first-2 gate electrode G1-2 may be disposed on the second gate insulating layer 2104 to overlap with the first-1 gate electrode G1-1. The first-2 gate electrode G1-2 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), or copper (Cu), and may have a single-layer or multi-layer structure of the above materials.

[0098] In some embodiments, the first-1 gate electrode G1-1 and the first-2 gate electrode G1-2 overlapping each other with the second gate insulating layer 2104 therebetween may form a storage capacitor. For example, the first-1 gate electrode G1-1 may be formed integrally with the lower electrode of the storage capacitor, and the first-2 gate electrode G1-2 may be formed integrally with the upper electrode of the storage capacitor. In another embodiment, the lower electrode and the upper electrode of the storage capacitor may be formed separately from the first-1 gate electrode G1-1 and the first-2 gate electrode G1-2.

[0099] The second-1 gate electrode G2-1 may be disposed on the second gate insulating layer 2104 and may be arranged separately from the first-2 gate electrode G1-2. The second-1 gate electrode G2-1 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), or copper (Cu), and may have a single-layer or multi-layer structure of the above materials.

[0100] The first interlayer insulating layer 1105 may be arranged to cover the first-2 gate electrode G1-2 and the second-1 gate electrode G2-1. The first interlayer insulating layer 1105 may include a silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), aluminum oxide (AlO x ), titanium oxide (TiO x ), tantalum oxide (TaO x ), hafnium oxide (HfO x ) or zinc oxide (ZnO x ) An inorganic insulating material. The first interlayer insulating layer 1105 may have a single-layer or multi-layer structure including the above-mentioned inorganic insulating material.

[0101] The second active layer A2 may be disposed on the first interlayer insulating layer 1105 and may be arranged to overlap the second-1 gate electrode G2-1. The second active layer A2 may include an oxide of at least one material selected from the group consisting of indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). The second active layer A2 may include a channel region, a source region doped with impurities, and a drain region doped with impurities.

[0102] The third gate insulating layer 3104 may be arranged to cover the second active layer A2. The third gate insulating layer 3104 may include a silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), aluminum oxide (AlO x ), titanium oxide (TiO x ), tantalum oxide (TaO x ), hafnium oxide (HfO x ) or zinc oxide (ZnO x The third gate insulating layer 3104 may have a single-layer or multi-layer structure including the above-mentioned inorganic insulating material.

[0103] The second-2 gate electrode G2-2 may be disposed on the third gate insulating layer 3104 to overlap the second-1 gate electrode G2-1 and the second active layer A2. The second-2 gate electrode G2-2 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), or copper (Cu), and may have a single-layer or multi-layer structure of the above materials.

[0104] The second interlayer insulating layer 2105 may be arranged to cover the second-2 gate electrode G2-2. The second interlayer insulating layer 2105 may include silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), aluminum oxide (AlO x ), titanium oxide (TiO x ), tantalum oxide (TaO x ), hafnium oxide (HfO x ) or zinc oxide (ZnO x The second interlayer insulating layer 2105 may have a single-layer or multi-layer structure including the above-mentioned inorganic insulating material.

[0105] The first to third gate insulating layers 1104 , 2104 , and 3104 , the first interlayer insulating layer 1105 , and the second interlayer insulating layer 2105 may be disposed in the main display area MDA and may overlap a portion of the component area CA.

[0106] The first source electrode S1, the first drain electrode D1, the second source electrode S2, and the second drain electrode D2 may be disposed on the second interlayer insulating layer 2105. The first source electrode S1 and the first drain electrode D1 may be arranged to overlap the first active layer A1. The second source electrode S2 and the second drain electrode D2 may be arranged to overlap the second active layer A2.

[0107] The first source electrode S1 and the first drain electrode D1 may be connected to the first active layer A1 through contact holes formed in the first and second interlayer insulating layers 1105 and 2105 and the first to third gate insulating layers 1104 , 2104 , and 3104 .

[0108] For example, the first source electrode S1 may be connected to the source region of the first active layer A1 through a contact hole formed in the first interlayer insulating layer 1105 and the second interlayer insulating layer 2105 and the first to third gate insulating layers 1104, 2104, and 3104. The first drain electrode D1 may be connected to the drain region of the first active layer A1 through a contact hole formed in the first interlayer insulating layer 1105 and the second interlayer insulating layer 2105 and the first to third gate insulating layers 1104, 2104, and 3104.

[0109] The second source electrode S2 may be connected to the source region of the second active layer A2 through contact holes formed in the second interlayer insulating layer 2105 and the third gate insulating layer 3104. The second drain electrode D2 may be connected to the drain region of the second active layer A2 through contact holes formed in the second interlayer insulating layer 2105 and the third gate insulating layer 3104.

[0110] The first conductive thin film layer 1109 may be disposed on the second interlayer insulating layer 2105 in a region where the first thin film transistor TFT1 and the second thin film transistor TFT2 are not disposed. The first conductive thin film layer 1109 may cover a portion of the first interlayer insulating layer 1105 and the second interlayer insulating layer 2105 and the first to third gate insulating layers 1104, 2104, and 3104. A portion of the first conductive thin film layer 1109 may be disposed in the main display area MDA, and the first conductive thin film layer 1109 may extend to the component area CA.

[0111] A portion of the first conductive film layer 1109 may overlap with the component 20 and may include a material having high transmittance or a transparent material. In an embodiment, the first conductive film layer 1109 may include a material including, for example, indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O 3 ), a single layer or multilayer structure of a conductive oxide of indium gallium oxide (IGO) or aluminum zinc oxide (AZO).

[0112] The first organic insulating layer 1107 may be disposed to cover the first and second source electrodes S1 and S2, the first and second drain electrodes D1 and D2, and the first conductive thin film layer 1109. The first organic insulating layer 1107 may be disposed in the main display area MDA, the component area CA, and the peripheral area DPA.

[0113] The first organic insulating layer 1107 may include a contact hole overlapping the first drain electrode D1 of the first thin film transistor TFT1 and a plurality of contact holes overlapping a portion of the first conductive thin film layer 1109. At least one of the plurality of contact holes overlapping a portion of the first conductive thin film layer 1109 may be disposed in the main display area MDA, and another may be disposed in the component area CA.

[0114] The first organic insulating layer 1107 may include a general polymer such as benzocyclobutene, polyimide, hexamethyldisiloxane, polymethyl methacrylate or polystyrene, a polymer derivative having a phenol group, an acrylic polymer, an imide-based polymer, an aromatic ether-based polymer, an amide-based polymer, a fluorine-based polymer, a paraxylene-based polymer or a vinyl alcohol-based polymer.

[0115] The first contact metal CM1 and the second contact metal CM2 may be provided on the first organic insulating layer 1107. The first contact metal CM1 may be arranged in the main display area MDA, and the second contact metal CM2 may be arranged in the component area CA. The first contact metal CM1 may be connected to the first drain electrode D1 through a contact hole in the first organic insulating layer 1107 overlapping with the first drain electrode D1, and thus, electrically connected to the first thin film transistor TFT1. The first contact metal CM1 may be connected to a portion of the first conductive film layer 1109 arranged in the main display area MDA through a contact hole in the first organic insulating layer 1107 overlapping with the first conductive film layer 1109. The second contact metal CM2 may be connected to a portion of the first conductive film layer 1109 arranged in the component area CA through a contact hole in the first organic insulating layer 1107 overlapping with the first conductive film layer 1109.

[0116] Each of the first contact metal CM1 and the second contact metal CM2 may include aluminum (Al), copper (Cu), or titanium (Ti), and may be formed as a single layer or a plurality of layers each including the above materials.

[0117] The second organic insulating layer 2107 may be disposed on the first organic insulating layer 1107. The second organic insulating layer 2107 may be arranged in the main display area MDA. The second organic insulating layer 2107 may include a plurality of contact holes overlapping the first contact metal CM1.

[0118] The second organic insulating layer 2107 may include a general polymer such as benzocyclobutene, polyimide, hexamethyldisiloxane, polymethyl methacrylate or polystyrene, a polymer derivative having a phenol group, an acrylic polymer, an imide polymer, an aromatic ether polymer, an amide polymer, a fluorine polymer, a paraxylene polymer or a vinyl alcohol polymer.

[0119] The second conductive thin film layer 2109 may be disposed on the first organic insulating layer 1107 and the second organic insulating layer 2107. A portion of the second conductive thin film layer 2109 may be disposed in the main display area MDA, and the second conductive thin film layer 2109 may extend to the component area CA.

[0120] A portion of the second conductive thin film layer 2109 may be connected to the first contact metal CM1 through a contact hole in the second organic insulating layer 2107 that overlaps with the first contact metal CM1 .

[0121] A portion of the second conductive film layer 2109 may overlap with the component 20 and may include a material having high transmittance or a transparent material. In an embodiment, the second conductive film layer 2109 may include a material including, for example, indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O 3 ), a single layer or multilayer structure of a conductive oxide of indium gallium oxide (IGO) or aluminum zinc oxide (AZO).

[0122] The third organic insulating layer 3107 may be disposed on the second organic insulating layer 2107. The third organic insulating layer 3107 may be arranged in the main display area MDA, the component area CA, and the peripheral area DPA.

[0123] The third organic insulating layer 3107 may include a contact hole overlapping the first contact metal CM1 , a contact hole overlapping the second conductive thin film layer 2109 in the component area CA, and a contact hole overlapping the second contact metal CM2 .

[0124] A portion of the first contact metal CM1 may be exposed through a contact hole passing through the second organic insulating layer 2107 and the third organic insulating layer 3107 overlapping the first contact metal CM1 .

[0125] The third organic insulating layer 3107 may include a general polymer such as benzocyclobutene, polyimide, hexamethyldisiloxane, polymethyl methacrylate or polystyrene, a polymer derivative having a phenol group, an acrylic polymer, an imide polymer, an aromatic ether polymer, an amide polymer, a fluorine polymer, a paraxylene polymer or a vinyl alcohol polymer.

[0126] The main sub-pixel electrode 1210 may be disposed on the third organic insulating layer 3107 of the main display area MDA. The first auxiliary sub-pixel electrode 2210 and the second auxiliary sub-pixel electrode 3210 may be disposed on the third organic insulating layer 3107 of the component area CA.

[0127] The main subpixel electrode 1210 may be connected to the first contact metal CM1 through a contact hole overlapping the first contact metal CM1 and passing through the second organic insulating layer 2107 and the third organic insulating layer 3107. Therefore, the main subpixel electrode 1210 may be electrically connected to the first thin film transistor TFT1 through the first contact metal CM1 and the first drain electrode D1.

[0128] The first auxiliary subpixel electrode 2210 may be connected to the second conductive thin film layer 2109 through a contact hole in the third organic insulating layer 3107 overlapping the second conductive thin film layer 2109. Therefore, the first auxiliary subpixel electrode 2210 may be electrically connected to the first thin film transistor TFT1 through the second conductive thin film layer 2109, the first contact metal CM1, and the first drain electrode D1.

[0129] The second auxiliary subpixel electrode 3210 may be connected to the second contact metal CM2 through a contact hole overlapping the second contact metal CM2 in the third organic insulating layer 3107. Therefore, the second auxiliary subpixel electrode 3210 may be electrically connected to the first thin film transistor TFT1 through the second contact metal CM2, the first conductive thin film layer 1109, the first contact metal CM1, and the first drain electrode D1.

[0130] Each of the main sub-pixel electrode 1210, the first auxiliary sub-pixel electrode 2210, and the second auxiliary sub-pixel electrode 3210 may include an indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O 3 ), indium gallium oxide (IGO) or aluminum zinc oxide (AZO). Each of the main sub-pixel electrode 1210, the first auxiliary sub-pixel electrode 2210 and the second auxiliary sub-pixel electrode 3210 may include a reflective film containing silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr) or a compound thereof. For example, each of the main sub-pixel electrode 1210, the first auxiliary sub-pixel electrode 2210 and the second auxiliary sub-pixel electrode 3210 may have a conductive oxide of ITO, IZO, ZnO or In 2 O 3 The formed film is formed on one surface or both surfaces of the above-mentioned reflective film. In an embodiment, each of the main sub-pixel electrode 1210, the first auxiliary sub-pixel electrode 2210, and the second auxiliary sub-pixel electrode 3210 may have a stacked structure of ITO / Ag / ITO.

[0131] The sub-pixel defining film 111 may be disposed on the third organic insulating layer 3107. The sub-pixel defining film 111 may cover an edge region (or edge) of each of the main sub-pixel electrode 1210, the first auxiliary sub-pixel electrode 2210, and the second auxiliary sub-pixel electrode 3210.

[0132] In other words, the sub-pixel defining film 111 may include an opening exposing a central portion of each of the main sub-pixel electrode 1210 , the first auxiliary sub-pixel electrode 2210 , and the second auxiliary sub-pixel electrode 3210 .

[0133] For example, the subpixel defining film 111 may include a first opening 111-OP1 exposing a central portion of the main subpixel electrode 1210. The subpixel defining film 111 may include a second opening 111-OP2 exposing a central portion of the first auxiliary subpixel electrode 2210. The subpixel defining film 111 may include a third opening 111-OP3 exposing a central portion of the second auxiliary subpixel electrode 3210.

[0134] The size and shape of the emission region of the main organic light emitting diode OLEDm (i.e., the main sub-pixel Pm) may be defined by the first opening 111-OP1 of the sub-pixel defining film 111. The size and shape of the emission region of the first auxiliary organic light emitting diode OLEDa1 (i.e., the first auxiliary sub-pixel Pa1) may be defined by the second opening 111-OP2 of the sub-pixel defining film 111. The size and shape of the emission region of the second auxiliary organic light emitting diode OLEDa2 (i.e., the second auxiliary sub-pixel Pa2) may be defined by the third opening 111-OP3 of the sub-pixel defining film 111.

[0135] The main intermediate layer 1220, the first auxiliary intermediate layer 2220, and the second auxiliary intermediate layer 3220 may be respectively arranged in the first to third openings 111-OP1, 111-OP2, and 111-OP3 of the subpixel defining film 111. For example, the main intermediate layer 1220 may be arranged in the first opening 111-OP1 and disposed on the main subpixel electrode 1210. The first auxiliary intermediate layer 2220 may be arranged in the second opening 111-OP2 and disposed on the first auxiliary subpixel electrode 2210. The second auxiliary intermediate layer 3220 may be arranged in the third opening 111-OP3 and disposed on the second auxiliary subpixel electrode 3210.

[0136] Each of the main intermediate layer 1220, the first auxiliary intermediate layer 2220, and the second auxiliary intermediate layer 3220 may include an emission layer (EML) including a low molecular weight material or a polymer material. Each of the main intermediate layer 1220, the first auxiliary intermediate layer 2220, and the second auxiliary intermediate layer 3220 may have a structure in which a hole injection layer (HIL), a hole transport layer (HTL), an EML, an electron transport layer (ETL), or an electron injection layer (EIL) is stacked in a single or composite structure.

[0137] Although not in Figure 4 , but the counter electrode may be arranged to cover the main intermediate layer 1220 and the first auxiliary intermediate layer 2220 and the second auxiliary intermediate layer 3220. In addition, the thin film encapsulation layer 300 ( Figure 2 ) can be set on the counter electrode.

[0138] Figure 4The main sub-pixel electrode 1210, the first auxiliary sub-pixel electrode 2210, the second auxiliary sub-pixel electrode 3210, and the second conductive film layer 2109 are each partially arranged in the contact hole, but the present disclosure is not limited thereto. In another embodiment, each of the main sub-pixel electrode 1210, the first auxiliary sub-pixel electrode 2210, the second auxiliary sub-pixel electrode 3210, and the second conductive film layer 2109 can be electrically connected to the lower layer (e.g., the first contact metal CM1, the second contact metal CM2, and the second conductive film layer 2109) through a separate contact metal arranged in the contact hole.

[0139] Figure 5A and Figure 5B is a schematic plan view of a portion of a display device according to an embodiment.

[0140] Figure 5A and Figure 5B is based on Figure 4 Schematic plan view of a portion of a display device of the embodiment shown in FIG.

[0141] refer to Figure 5A , the second substrate 2100 may include a component area CA and a main display area MDA surrounding at least a portion of the component area CA.

[0142] The second-1 electrode 2101a may be arranged to substantially surround the component area CA. For example, the second-1 electrode 2101a may include a second portion 2101a-2 having a substantially circular shape with one side open and substantially surrounding the component area CA. The second-1 electrode 2101a may include a first portion 2101a-1 extending from a central portion of the component area CA to the main display area MDA through one open side of the second portion 2101a-2.

[0143] The first portion 2101 a - 1 or the second portion 2101 a - 2 of the second-1 electrode 2101 a may be grounded. Figure 5A The second portion 2101a-2 is shown to be grounded, but in another embodiment, the first portion 2101a-1 may be grounded.

[0144] Since the second substrate 2100 may include an insulating material, the first portion 2101 a - 1 or the second portion 2101 a - 2 may extend to any region within the second substrate 2100 and be grounded.

[0145] Figure 5AThe illustrated component area CA has a circular shape and the second portion 2101a-2 of the second-1 electrode 2101a has a substantially circular shape surrounding the component area CA, but the present disclosure is not limited thereto. In another embodiment, the shape of the component area CA may be variously transformed into a polygon such as a quadrilateral, a star shape, or a diamond shape, and the second portion 2101a-2 may surround a portion of the component area CA.

[0146] refer to Figure 5B , a voltage may be applied to an ungrounded portion of the second-1 electrode 2101a (e.g., the first portion 2101a-1). In this case, a potential difference may occur between the first portion 2101a-1 and the second portion 2101a-2, and a portion of the second substrate 2100 disposed between the first portion 2101a-1 and the second portion 2101a-2 may be exposed to an electric field.

[0147] Since the second substrate 2100 may include an electrochromic material, the transmittance of the second substrate 2100 may change when the second substrate 2100 is exposed to an electric field. For example, when the second substrate 2100 is exposed to an electric field, the transmittance of the second substrate 2100 may increase. Due to the potential difference between the first portion 2101a-1 and the second portion 2101a-2 of the second-1 electrode 2101a, an electric field may be formed in a region (or component region CA) between the first portion 2101a-1 and the second portion 2101a-2 of the second-1 electrode 2101a. A portion of the second substrate 2100 corresponding to the component region CA may be exposed to the electric field, and therefore, the transmittance of the second substrate 2100 may increase.

[0148] Although not in Figure 5A and Figure 5B As shown in FIG. 1 , however, the first substrate 1100 ( Fig. 6A ) and the first-1 electrode 1101a ( Fig. 6A ) may be arranged in the -z direction of the second substrate 2100. Like the second-1 electrode 2101a, the first-1 electrode 1101a ( Fig. 6A ) may include a first portion 1101a-1 and a second portion 1101a-2 ( Fig. 6A ).

[0149] First-1 electrode 1101a ( Fig. 6A ) may have the same shape as that of the second-1 electrode 2101a. Therefore, in a plan view, the first-1 electrode 1101a ( Fig. 6A ) may be covered by the second-1 electrode 2101a and, therefore, may not be visible. The present disclosure is not limited thereto, and in another embodiment, the first-1 electrode 1101a ( Fig. 6A) and the second-1 electrode 2101a may partially overlap each other.

[0150] A voltage is applied to the first-1 electrode 1101a ( Fig. 6A ) to form an electric field and change the first substrate 1100 ( Fig. 6A ) may be similar to the relationship between the second-1 electrode 2101a and the second substrate 2100.

[0151] Fig. 6A and Figure 6B is a schematic cross-sectional view of a portion of a display device according to an embodiment.

[0152] Fig. 6A It can be taken along line III-III' Figure 5A 0046] A cross-sectional view of one of the various examples of embodiments shown in FIG.

[0153] Figure 6B It can be taken along line III-III' Figure 5B 0046] A cross-sectional view of one of the various examples of embodiments shown in FIG.

[0154] refer to Fig. 6A , the second-1 electrode 2101a may include a first portion 2101a-1 and a second portion 2101a-2. The first-1 electrode 1101a may include a first portion 1101a-1 and a second portion 1101a-2.

[0155] The planar shapes of the second-1 electrode 2101a and the first-1 electrode 1101a may be the same as those of the reference Figure 5A and Figure 5B The plane shapes described are similar.

[0156] For example, the second portion 2101 a - 2 of the second-1 electrode 2101 a and the second portion 1101 a - 2 of the first-1 electrode 1101 a may be grounded to the second substrate 2100 and the first substrate 1100 , respectively.

[0157] Fig. 6A The first-1 electrode 1101a and the second-1 electrode 2101a are illustrated as completely overlapping each other, but the present disclosure is not limited thereto. In another embodiment, the first-1 electrode 1101a and the second-1 electrode 2101a may partially overlap each other.

[0158] The first-1 electrode 1101a may be disposed in a groove formed in one surface of the first substrate 1100. In other words, an upper surface (or lower surface) of the first-1 electrode 1101a may be coplanar with an upper surface (or lower surface) of the first substrate 1100.

[0159] Fig. 6AThe first-1 electrode 1101a is shown disposed on the upper surface of the first substrate 1100, but the present disclosure is not limited thereto. In another embodiment, the first-1 electrode 1101a may be disposed on the lower surface of the first substrate 1100. In another embodiment, the first-1 electrode 1101a may be inserted into the first substrate 1100.

[0160] The second-1 electrode 2101a may be disposed in a groove formed in one surface of the second substrate 2100. In other words, an upper surface (or lower surface) of the second-1 electrode 2101a may be coplanar with an upper surface (or lower surface) of the second substrate 2100.

[0161] Fig. 6A The second-1 electrode 2101a is shown disposed on the upper surface of the second substrate 2100, but the present disclosure is not limited thereto. In another embodiment, the second-1 electrode 2101a may be disposed on the lower surface of the second substrate 2100. In another embodiment, the second-1 electrode 2101a may be inserted into the second substrate 2100.

[0162] refer to Figure 6B , a voltage may be applied to an ungrounded portion of the first-1 electrode 1101a (e.g., the first portion 1101a-1). In this case, a potential difference may occur between the first portion 1101a-1 and the second portion 1101a-2, and a portion of the first substrate 1100 disposed between the first portion 1101a-1 and the second portion 1101a-2 may be exposed to an electric field.

[0163] Since the first substrate 1100 may include an electrochromic material, the transmittance of the first substrate 1100 may change when the first substrate 1100 is exposed to an electric field. For example, when the first substrate 1100 is exposed to an electric field, the transmittance of the first substrate 1100 may increase. Due to the potential difference between the first portion 1101a-1 and the second portion 1101a-2 of the first-1 electrode 1101a, an electric field may be formed in the component area CA. A portion of the first substrate 1100 corresponding to the component area CA may be exposed to the electric field, and thus, the transmittance of the first substrate 1100 may increase.

[0164] A voltage may be applied to an ungrounded portion of the second-1 electrode 2101a (e.g., the first portion 2101a-1). In this case, a potential difference may occur between the first portion 2101a-1 and the second portion 2101a-2, and a portion of the second substrate 2100 disposed between the first portion 2101a-1 and the second portion 2101a-2 may be exposed to an electric field.

[0165] Since the second substrate 2100 may include an electrochromic material, the transmittance of the second substrate 2100 may change when the second substrate 2100 is exposed to an electric field. For example, when the second substrate 2100 is exposed to an electric field, the transmittance of the second substrate 2100 may increase. Due to the potential difference between the first portion 2101a-1 and the second portion 2101a-2 of the second-1 electrode 2101a, an electric field may be formed in the component area CA. A portion of the second substrate 2100 corresponding to the component area CA may be exposed to the electric field, and thus, the transmittance of the second substrate 2100 may increase.

[0166] Fig. 7A and Figure 7B is a schematic cross-sectional view of a portion of a display device according to another embodiment.

[0167] Fig. 7A It can be taken along line III-III' Figure 5A 0046] A cross-sectional view of one of the various examples of embodiments shown in FIG.

[0168] Figure 7B It can be taken along line III-III' Figure 5B 0046] A cross-sectional view of one of the various examples of embodiments shown in FIG.

[0169] refer to Fig. 7A , the first-1 electrode 1101a may be disposed on the first substrate 1100. In this case, the first-1 electrode 1101a may be patterned on the first substrate 1100. In other words, a lower surface of the first-1 electrode 1101a may be coplanar with an upper surface of the first substrate 1100.

[0170] The second-1 electrode 2101a may be disposed on the second substrate 2100. In this case, the second-1 electrode 2101a may be patterned on the second substrate 2100. In other words, a lower surface of the second-1 electrode 2101a may be coplanar with an upper surface of the second substrate 2100.

[0171] In addition, Fig. 7A and Figure 7B The features of the embodiments shown in the reference Fig. 6A and Figure 6B The characteristics described are the same.

[0172] Figure 8 is a schematic cross-sectional view of a portion of a display device according to an embodiment.

[0173] Figure 8 It is taken along the line II-II' Figure 3 0046] A cross-sectional view of one of the various examples of embodiments shown in FIG.

[0174] refer to Figure 8 , the second substrate 2100 may include an opening 2100-OP arranged in the peripheral area DPA and penetrating the second substrate 2100. The first barrier layer 1102 may include an opening 1102-OP arranged in the peripheral area DPA and penetrating the first barrier layer 1102. The opening 2100-OP of the second substrate 2100 and the opening 1102-OP of the first barrier layer 1102 may overlap each other.

[0175] In some embodiments, the first barrier layer 1102 may be omitted.

[0176] The second-1 electrode 2101a may be disposed on the second substrate 2100. The first-1 electrode 1101a may be disposed under the first barrier layer 1102.

[0177] The connection wire CNT may be disposed in the opening 2100-OP of the second substrate 2100 and the opening 1102-OP of the first barrier layer 1102. The connection wire CNT may be connected to the second-1 electrode 2101a and the first-1 electrode 1101a. In some embodiments, the connection wire CNT may be a portion of the second-1 electrode 2101a or the first-1 electrode 1101a extending from the second-1 electrode 2101a or the first-1 electrode 1101a, respectively.

[0178] The second-1 electrode 2101a and the first-1 electrode 1101a may be electrically connected to each other through a connection wire CNT. The same voltage may be applied to the second-1 electrode 2101a and the first-1 electrode 1101a.

[0179] The portion of the second-1 electrode 2101a to which the voltage is applied may be the first portion 2101a-1 ( Figure 5B ). Therefore, according to Figure 8 In the embodiment shown in FIG. 1 , in the second-1 electrode 2101a, the second portion 2101a-2 ( Figure 5B ) may be grounded, and a voltage may be applied to the first portion 2101a-1 ( Figure 5B ). This can be similarly applied to the first-1 electrode 1101a.

[0180] The terminal portion 40 may be disposed adjacent to the first-1 electrode 1101 a .

[0181] The bump layer 401 may be disposed between the terminal portion 40 and the first-1 electrode 1101a. The bump layer 401 may include a plurality of bumps including a conductive material (e.g., a metal). For example, the bump layer 401 may include a plurality of bumps including copper (Cu), nickel (Ni), tin (Sn), or gold (Au), or an alloy including at least one of copper (Cu), nickel (Ni), tin (Sn), and gold (Au).

[0182] The electrical signal generated from the terminal portion 40 may be transmitted to the display panel 10 through the bump layer 401 ( Figure 2 ). Although not in Figure 8 , but the display device may further include a separate wire contacting the bump layer 401 and connected to the display panel.

[0183] In some embodiments, the bumps of the bump layer 401 may be formed directly on the terminal portion 40 , and thus, the bump layer 401 may be a part of the terminal portion 40 .

[0184] The conductive ink layer 403 may protrude from the side surface of the terminal part 40 and may be connected to the bottom of the first-1 electrode 1101a. The conductive ink layer 403 may include a conductive material (eg, metal).

[0185] The conductive ink layer 403 may electrically connect the terminal portion 40 with the first-1 electrode 1101a. An electrical signal generated from the terminal portion 40 may be transmitted to the first-1 electrode 1101a, the connection line CNT, and the second-1 electrode 2101a through the conductive ink layer 403. In other words, the first-1 electrode 1101a and the second-1 electrode 2101a may receive a voltage from the terminal portion 40 through the conductive ink layer 403.

[0186] Figure 8 The terminal portion 40, the bump layer 401 and the conductive ink layer 403 are shown to be disposed under the first-1 electrode 1101a, but the present disclosure is not limited thereto. In another embodiment, the terminal portion 40, the bump layer 401 and the conductive ink layer 403 may be disposed on the second-1 electrode 2101a.

[0187] Fig. 9 is a cross-sectional view of a portion of a display device according to another embodiment. Fig. 9 It is taken along the line I-I' Figure 3 0046] A cross-sectional view of one of the various examples of embodiments shown in FIG.

[0188] Apart from Fig. 9 Other features than some of the features of the embodiments shown in the previous reference Figure 4 are described and are therefore omitted, and hereinafter, the differences are mainly described.

[0189] The first-2 electrode 1101b may be disposed on a lower surface of the first substrate 1100. In other words, the first-2 electrode 1101b may be disposed on one surface of the first substrate 1100 facing the part 20.

[0190] The second-2 electrode 2101b may be disposed between the second substrate 2100 and the first barrier layer 1102. In other words, the second-2 electrode 2101b may be provided on one surface of the second substrate 2100 facing the first barrier layer 1102.

[0191] At least a portion of each of the first-2 electrode 1101b and the second-2 electrode 2101b may overlap the member 20. For example, at least a portion of the first-2 electrode 1101b may overlap the first-1 electrode 1101a. At least a portion of the second-2 electrode 2101b may overlap the second-1 electrode 2101a.

[0192] At least a portion of each of the first-2 electrode 1101b and the second-2 electrode 2101b may be arranged in the component area CA, may overlap with a portion of the main display area MDA, and may extend to the peripheral area DPA. In an embodiment, a portion of each of the first-2 electrode 1101b and the second-2 electrode 2101b may be arranged in the component area CA, another portion thereof may be arranged in the main display area MDA between the component area CA and the peripheral area DPA, and another portion thereof may be arranged in the peripheral area DPA.

[0193] Fig. 9 The first-2 electrode 1101b and the second-2 electrode 2101b are arranged to overlap the entire component area CA, but the disclosure is not limited thereto. In another embodiment, the first-2 electrode 1101b may be arranged to overlap the entire component area CA, and the second-2 electrode 2101b may be arranged to overlap a portion of the component area CA.

[0194] The first-2 electrode 1101 b and the second-2 electrode 2101 b may not overlap with the main organic light emitting diode OLEDm.

[0195] Fig. 9All of the first-1 electrode to the second-2 electrode 1101a, 1101b, 2101a, and 2101b are illustrated, but the present disclosure is not limited thereto, and some of the first-1 electrode to the second-2 electrode 1101a, 1101b, 2101a, and 2101b may be omitted. In another embodiment, the display device 1 may include the first-1 electrode 1101a, the second-1 electrode 2101a, and the second-2 electrode 2101b. Alternatively, the display device 1 may include the first-1 electrode 1101a, the first-2 electrode 1101b, and the second-1 electrode 2101a.

[0196] The first-1 electrode 1101a and the first-2 electrode 1101b may overlap each other. In an embodiment, the first-1 electrode 1101a and the first-2 electrode 1101b may have the same shape on a plane and may completely overlap each other.

[0197] The second-1 electrode 2101a and the second-2 electrode 2101b may overlap each other. In an embodiment, the second-1 electrode 2101a and the second-2 electrode 2101b may have the same shape on a plane and may completely overlap each other.

[0198] The present disclosure is not limited thereto, and the first-1 electrode 1101a and the first-2 electrode 1101b may partially overlap each other, and the second-1 electrode 2101a and the second-2 electrode 2101b may partially overlap each other. However, in this specification, for the convenience of description, an embodiment in which the first-1 electrode 1101a and the first-2 electrode 1101b completely overlap each other and the second-1 electrode 2101a and the second-2 electrode 2101b completely overlap each other is shown and described.

[0199] Fig. 10A and Fig. 10B is a schematic plan view of a portion of a display device according to another embodiment.

[0200] Fig. 10A and Fig. 10B is based on Fig. 9 Schematic plan view of a portion of a display device of the embodiment shown in FIG.

[0201] Hereinafter, description is provided based on the second-1 electrode 2101a, but the features described below may be equally applied to the first-1 electrode 1101a ( Fig. 9 )、first-2 electrode 1101b( Fig. 9 ) and the second-2 electrode 2101b ( Fig. 9 ).

[0202] refer to Fig. 10A, the second substrate 2100 may include a component area CA and a main display area MDA surrounding at least a portion of the component area CA.

[0203] The second-1 electrode 2101a may be arranged to surround the component area CA. For example, the second-1 electrode 2101a may have a substantially circular shape and surround the component area CA.

[0204] The second-1 electrode 2101a may include a grid shape. For example, the second-1 electrode 2101a may include a grid shape in a portion corresponding to the component area CA. However, the present disclosure is not necessarily limited thereto, and the portion of the second-1 electrode 2101a corresponding to the component area CA may include various shapes such as stripes in the ±x direction and stripes in the ±y direction, or may be completely filled.

[0205] The second-1 electrode 2101a may be grounded. Since the second substrate 2100 may include an insulating material, the second-1 electrode 2101a may extend to any region within the second substrate 2100 and be grounded. Fig. 10A The second-1 electrode 2101a is shown to be grounded, but in another embodiment, the second-2 electrode 2101b ( Fig. 9 ) can be grounded.

[0206] Fig. 10A The component area CA is shown to have a circular shape and the second-1 electrode 2101a has a circular shape surrounding the component area CA, but the present disclosure is not limited thereto. In another embodiment, the shape of the component area CA may be variously transformed into a polygon such as a quadrilateral, a star shape, or a diamond shape, and the second-1 electrode 2101a may surround a portion of the component area CA.

[0207] Although not in Fig. 10A and Fig. 10B As shown in FIG. 1 , however, the second -2 electrode 2101b ( Fig. 9 )、first substrate 1100( Fig. 9 )、first-1 electrode 1101a( Fig. 9 ) and the first-2 electrode 1101b ( Fig. 9 ) can be arranged in the -z direction of the second substrate 2100.

[0208] The second-2 electrode 2101b ( Fig. 9 ) may have the same shape as that of the second-1 electrode 2101a. Therefore, in a plan view, the second-2 electrode 2101b ( Fig. 9 ) may be covered by the second-1 electrode 2101a and, therefore, may not be visible. The present disclosure is not limited thereto, and in another embodiment, the second-2 electrode 2101b ( Fig. 9) and the second-1 electrode 2101a may partially overlap each other.

[0209] First-1 electrode 1101a ( Fig. 9 ) and the first-2 electrode 1101b ( Fig. 9 ) may each have the same shape as that of the second-1 electrode 2101a. Therefore, in a plan view, the first-1 electrode 1101a ( Fig. 9 ) and the first-2 electrode 1101b ( Fig. 9 ) may be covered by the second-1 electrode 2101a and, therefore, may not be visible. The present disclosure is not limited thereto, and in another embodiment, the first-1 electrode 1101a ( Fig. 9 )、first-2 electrode 1101b( Fig. 9 ) and the second-1 electrode 2101a may partially overlap each other.

[0210] refer to Fig. 10B , a voltage may be applied to an ungrounded portion of the second electrode 2101 (eg, the second-2 electrode 2101b ( Fig. 9 )). In this case, a potential difference may appear between the second-1 electrode 2101a and the second-2 electrode 2101b ( Fig. 9 ), and a portion of the second substrate 2100 disposed between the second-1 electrode 2101a and the second-2 electrode 2101b may be exposed to the electric field.

[0211] Because the second substrate 2100 may include an electrochromic material, the transmittance of the second substrate 2100 may change when the second substrate 2100 is exposed to an electric field. For example, when the second substrate 2100 is exposed to an electric field, the transmittance of the second substrate 2100 may increase. Fig. 9 ), and thus an electric field may be formed in a region (or component area CA) between the second-1 electrode 2101a and the second-2 electrode 2101b. A portion of the second substrate 2100 corresponding to the component area CA may be exposed to the electric field, and thus, transmittance of the second substrate 2100 may be increased.

[0212] On the first-1 electrode 1101a ( Fig. 9 ) and the first-2 electrode 1101b ( Fig. 9 ) and changes the first substrate 1100 ( Fig. 9 ) can be similar to the process of the second-1 electrode 2101a, the second-2 electrode 2101b ( Fig. 9 ) and the relationship between the second substrate 2100.

[0213] Fig.11A and Fig. 11B is a schematic cross-sectional view of a portion of a display device according to another embodiment.

[0214] Fig.11A It can be taken along line IV-IV' Fig. 10A 0046] A cross-sectional view of one of the various examples of embodiments shown in FIG.

[0215] Fig. 11B It can be taken along line IV-IV' Fig. 10B 0046] A cross-sectional view of one of the various examples of embodiments shown in FIG.

[0216] refer to Fig.11A , the second electrode 2101 may include a second-1 electrode 2101a and a second-2 electrode 2101b. The first electrode 1101 may include a first-1 electrode 1101a and a first-2 electrode 1101b.

[0217] The planar shapes of the first-1 electrode to the second-2 electrode 1101a, 1101b, 2101a, and 2101b may be the same as those of the reference electrode. Fig. 10A and Fig. 10B The shapes described are similar.

[0218] One of the first electrodes 1101 and one of the second electrodes 2101 may be grounded. For example, the first-1 electrode 1101a and the second-2 electrode 2101b may be grounded. In another embodiment, the first-2 electrode 1101b and the second-1 electrode 2101a may be grounded.

[0219] Fig.11A The first-1 to second-2 electrodes 1101a, 1101b, 2101a, and 2101b are illustrated as completely overlapping each other, but the present disclosure is not limited thereto. In another embodiment, the first-1 to second-2 electrodes 1101a, 1101b, 2101a, and 2101b may partially overlap each other.

[0220] The first-1 electrode 1101a may be disposed in a groove formed in an upper surface of the first substrate 1100. In other words, an upper surface of the first-1 electrode 1101a may be coplanar with an upper surface of the first substrate 1100.

[0221] The first-2 electrode 1101b may be arranged in a groove formed in the lower surface of the first substrate 1100. Alternatively, after the first-2 electrode 1101b is patterned, the first substrate 1100 may be disposed on the first-2 electrode 1101b. In other words, the lower surface of the first-2 electrode 1101b may be coplanar with the lower surface of the first substrate 1100.

[0222] Fig.11AThe first-1 electrode 1101a is disposed on the upper surface of the first substrate 1100 and the first-2 electrode 1101b is disposed on the lower surface of the first substrate 1100, but the disclosure is not limited thereto. In another embodiment, one of the first-1 electrode 1101a and the first-2 electrode 1101b may be inserted into the first substrate 1100.

[0223] The second-1 electrode 2101a may be disposed in a groove formed in an upper surface of the second substrate 2100. In other words, an upper surface of the second-1 electrode 2101a may be coplanar with an upper surface of the second substrate 2100.

[0224] The second-2 electrode 2101b may be disposed in a groove formed in the lower surface of the second substrate 2100. Alternatively, the second substrate 2100 may be disposed on the second-2 electrode 2101b after the second-2 electrode 2101b is patterned on the first barrier layer 1102. In other words, the lower surface of the second-2 electrode 2101b may be coplanar with the lower surface of the second substrate 2100.

[0225] Fig.11A The second-1 electrode 2101a is disposed on the upper surface of the second substrate 2100 and the second-2 electrode 2101b is disposed on the lower surface of the second substrate 2100, but the disclosure is not limited thereto. In another embodiment, one of the second-1 electrode 2101a and the second-2 electrode 2101b may be inserted into the second substrate 2100.

[0226] refer to Fig. 11B , a voltage may be applied to an ungrounded electrode (e.g., the first-2 electrode 1101b) of the first electrode 1101. In this case, a potential difference may occur between the first-1 electrode 1101a and the first-2 electrode 1101b, and a portion of the first substrate 1100 disposed between the first-1 electrode 1101a and the first-2 electrode 1101b may be exposed to an electric field.

[0227] Since the first substrate 1100 may include an electrochromic material, the transmittance of the first substrate 1100 may change when the first substrate 1100 is exposed to an electric field. For example, when the first substrate 1100 is exposed to an electric field, the transmittance of the first substrate 1100 may increase. Due to the potential difference between the first-1 electrode 1101a and the first-2 electrode 1101b, an electric field may be formed in the component area CA. A portion of the first substrate 1100 corresponding to the component area CA may be exposed to the electric field, and thus, the transmittance of the first substrate 1100 may increase.

[0228] A voltage may be applied to an ungrounded portion (e.g., the second-2 electrode 2101b) of the second electrode 2101. In this case, a potential difference may occur between the second-1 electrode 2101a and the second-2 electrode 2101b, and a portion of the second substrate 2100 disposed between the second-1 electrode 2101a and the second-2 electrode 2101b may be exposed to an electric field.

[0229] Since the second substrate 2100 may include an electrochromic material, the transmittance of the second substrate 2100 may change when the second substrate 2100 is exposed to an electric field. For example, when the second substrate 2100 is exposed to an electric field, the transmittance of the second substrate 2100 may increase. Due to the potential difference between the second-1 electrode 2101a and the second-2 electrode 2101b, an electric field may be formed in the component area CA. A portion of the second substrate 2100 corresponding to the component area CA may be exposed to the electric field, and thus, the transmittance of the second substrate 2100 may increase.

[0230] Fig. 12A and Fig. 12B is a schematic cross-sectional view of a portion of a display device according to another embodiment.

[0231] Fig. 12A It can be taken along line IV-IV' Fig. 10A 0046] A cross-sectional view of one of the various examples of embodiments shown in FIG.

[0232] Fig. 12B It can be taken along line IV-IV' Fig. 10B 0046] A cross-sectional view of one of the various examples of embodiments shown in FIG.

[0233] refer to Fig. 12A , the first-1 electrode 1101a may be disposed on the first substrate 1100. In this case, the first-1 electrode 1101a may be patterned on the first substrate 1100. In other words, a lower surface of the first-1 electrode 1101a may be coplanar with an upper surface of the first substrate 1100.

[0234] The second-1 electrode 2101a may be disposed on the second substrate 2100. In this case, the second-1 electrode 2101a may be patterned on the second substrate 2100. In other words, a lower surface of the second-1 electrode 2101a may be coplanar with an upper surface of the second substrate 2100.

[0235] In addition, Fig. 12A and Fig. 12B The features of the embodiments shown in the reference Fig.11A and Fig. 11B The characteristics described are the same.

[0236] Fig.13 is a schematic cross-sectional view of a portion of a display device according to another embodiment.

[0237] Fig.13 It is taken along the line II-II' Figure 3 0046] A cross-sectional view of one of the various examples of embodiments shown in FIG.

[0238] In the following, Fig.13 Among the features of the embodiments shown in Figure 8 The differences between the embodiments shown in FIG.

[0239] refer to Fig.13 , the second-1 electrode 2101 a may be disposed on the second substrate 2100 , and the first-2 electrode 1101 b may be disposed under the first substrate 1100 .

[0240] The connection wire CNT may be disposed in the opening 2100-OP of the second substrate 2100 and the opening 1102-OP of the first barrier layer 1102. The connection wire CNT may be connected to the second-1 electrode 2101a and the first-2 electrode 1101b. In some embodiments, the connection wire CNT may be a portion of the second-1 electrode 2101a or the first-2 electrode 1101b extending from the second-1 electrode 2101a or the first-2 electrode 1101b, respectively.

[0241] The second-1 electrode 2101a and the first-2 electrode 1101b may be electrically connected to each other through a connection wire CNT. The same voltage may be applied to the second-1 electrode 2101a and the first-2 electrode 1101b.

[0242] The terminal portion 40 may be disposed adjacent to the first-2 electrode 1101 b. The bump layer 401 may be disposed between the terminal portion 40 and the first-2 electrode 1101 b.

[0243] The conductive ink layer 403 may protrude from the side surface of the terminal part 40 and may be connected to the bottom of the 1 st - 2 electrode 1101 b .

[0244] The conductive ink layer 403 may electrically connect the terminal portion 40 with the first-2 electrode 1101b. An electrical signal generated from the terminal portion 40 may be transmitted to the first-2 electrode 1101b, the connection line CNT, and the second-1 electrode 2101a through the conductive ink layer 403. In other words, the first-2 electrode 1101b and the second-1 electrode 2101a may receive a voltage from the terminal portion 40 through the conductive ink layer 403.

[0245] In this case, since a voltage is applied to the second-1 electrode 2101a and the first-2 electrode 1101b, it can be understood that the second-2 electrode 2101b ( Fig. 11B ) and the first-1 electrode 1101a ( Fig. 11B ) is grounded.

[0246] Fig.13 The terminal portion 40, the bump layer 401 and the conductive ink layer 403 are shown disposed under the first-2 electrode 1101b, but the disclosure is not limited thereto. In another embodiment, the terminal portion 40, the bump layer 401 and the conductive ink layer 403 may be disposed on the second-1 electrode 2101a.

[0247] Fig. 6A and Figure 6B The embodiment shown in can be defined as a first embodiment, Fig. 7A and Figure 7B The embodiment shown in can be defined as a second embodiment, Fig.11A and Fig. 11B The embodiment shown in can be defined as a third embodiment, and Fig. 12A and Fig. 12B The embodiment shown in can be defined as a fourth embodiment.

[0248] In the first and second embodiments, the two ends of the circuit to which the voltage is applied to form the electric field are arranged on the same plane through the first and second parts of the electrodes (for example, the second-1 electrode 2101a ( Fig. 6A and Figure 6B In the third and fourth embodiments, the second electrodes (for example, the second-1 electrode 2101a and the second-2 electrode 2101b ( Fig.11A )) to achieve it.

[0249] Since the electrode including the plurality of portions in the same plane is formed in the first and second embodiments, the electrode can be formed by a single mask.

[0250] Since a plurality of electrodes are formed on different planes in the third embodiment and the fourth embodiment, the electrodes can be formed by a plurality of masks.

[0251] In the first and second embodiments, electrodes including a plurality of portions on the same plane are arranged, and therefore, there may be a size difference between an electric field formed on the same plane and an electric field formed on a different plane in the ±z direction. For example, in the first embodiment, the electric field may be away from the portion on which the second-1 electrode 2101a ( Figure 6B) of the first part 2101a-1 and the second part 2101a-2 ( Figure 6B ) is reduced in the same plane as that of the first embodiment. In this case, the driving voltage required in the first embodiment and the second embodiment may be about 3V or higher to achieve a transmittance greater than or equal to a target transmittance (eg, a transmittance of about 80% or higher).

[0252] Since the plurality of electrodes are arranged on different planes in the third and fourth embodiments, a constant electric field can be formed in the portion of the substrate arranged between the electrodes. For example, in the third embodiment, a constant electric field can be formed between the second-1 electrode 2101a and the second-2 electrode 2101b ( Fig. 11B ) forms a constant electric field between the electrodes. In this case, the driving voltage required in the third and fourth embodiments may be about 0.5V to about 3V to achieve a transmittance greater than or equal to a target transmittance (eg, a transmittance of about 80% or more).

[0253] Therefore, compared with the first and second embodiments, in the third and fourth embodiments, the electrochromic efficiency can be high and the driving voltage can be low, which can be advantageous in use. Compared with the third and fourth embodiments, the first and second embodiments can have advantages in the manufacturing process because the number of masks required to form the electrodes is small.

[0254] According to the embodiment, a display device having an improved transmittance of a component area by applying a voltage to the component area of ​​the display device including a substrate including an electrochromic material may be realized. However, the scope of the present disclosure is not limited thereto.

[0255] It should be understood that the embodiments described herein should be considered in a descriptive sense only and not for the purpose of limitation. The description of features or aspects in each embodiment should generally be considered to be applicable to other similar features or aspects in other embodiments. Although the embodiments have been described with reference to the accompanying drawings, it will be understood by those of ordinary skill in the art that various changes may be made to the embodiments in form and detail without departing from the spirit and scope defined by the claims.

Claims

1. A display device, characterized in that: The display device comprises: A first substrate including a component area and a main display area surrounding at least a portion of the component area; a second substrate disposed on the first substrate and comprising a component area and a main display area surrounding at least a portion of the component area; A first-1 electrode disposed on one surface of the first substrate; and The second-1 electrode is disposed on one surface of the second substrate.

2. The display device according to claim 1, characterized in that Each of the first substrate and the second substrate includes an electrochromic material, and Wherein, in a plan view, at least one of the first-1 electrode and the second-1 electrode surrounds at least a portion of the component area.

3. The display device according to claim 1, characterized in that At least a portion of the first-1 electrode and at least a portion of the second-1 electrode overlap each other.

4. The display device according to claim 1, characterized in that The display device further comprises: A first-2 electrode is provided on a surface of the first substrate opposite to the one surface on which the first-1 electrode is provided.

5. The display device according to claim 1, characterized in that The display device further comprises: The second-2 electrode is provided on a surface of the second substrate opposite to the one surface on which the second-1 electrode is provided.

6. The display device according to claim 1, characterized in that: Each of the first substrate and the second substrate includes a peripheral area surrounding the main display area, and A portion of the first-1 electrode and a portion of the second-1 electrode are each arranged in the peripheral area to bypass the main display area.

7. The display device according to claim 6, characterized in that: The second substrate includes an opening that is arranged in the peripheral region and penetrates the second substrate.

8. The display device according to claim 6, characterized in that: The first-1 electrode and the second-1 electrode are connected to each other in a portion of the peripheral region.

9. The display device according to any one of claims 1 to 8, characterized in that: A transmittance of each of the first substrate and the second substrate increases when a voltage is applied thereto.

10. The display device according to any one of claims 1 to 8, characterized in that: The display device further comprises: A barrier layer is arranged between the first substrate and the second substrate.

Images