Sample stage uniform cooling device and microwave plasma chemical vapor deposition system

Abstract

The utility model provides a sample table uniform cooling device and a microwave plasma chemical vapor deposition system, and relates to the related field of microwave plasma chemical vapor deposition. The sample table uniform cooling device comprises a sample table and a plurality of groups of cooling mechanisms arranged in the sample table. Each cooling mechanism comprises a cooling pipeline, a liquid inlet pipeline and a liquid outlet pipeline. One end of each group of liquid inlet pipeline is communicated with one end of the same group of cooling pipeline, and the other end is externally connected with a cooling circulation device. And a first flow meter and a first valve are arranged on each group of liquid inlet pipelines. One end of each group of liquid outlet pipeline is communicated with the other end of the same group of cooling pipeline, and the other end is externally connected with a cooling circulation device. And each group of cooling pipelines are sequentially and annularly arranged along the direction from the center of the sample table to the edge of the sample table. Through the arrangement, local adjustment of the temperatures of different areas of the sample table is realized, so that the surface temperature of the film can be uniform in the growth process.

Description

Technical Field

[0001] The utility model relates to the field of microwave chemical plasma vapor deposition equipment, in particular to a sample table uniform cooling device and a microwave plasma chemical vapor deposition system. Background Art

[0002] At present, the sample stage cooling device of commercial microwave plasma chemical vapor deposition (MPCVD) equipment on the market cannot locally regulate the temperature of different areas of the sample stage, and the temperature of the entire sample stage is uniformly regulated. For example, patent JPS63235478A discloses a microwave chemical vapor deposition device, in which a cooling mechanism is provided in the sample stage of the device, but the cooling method of the cooling mechanism is still to uniformly regulate the temperature of the entire sample stage, and it is impossible to achieve local regulation of the temperature of different areas of the sample stage.

[0003] However, in the process of growing large-scale polycrystalline thin films, see Figure 4 , usually the size of plasma 61 does not match the size of large-sized polycrystalline film, and the contact between the bottom of large-sized polycrystalline film and the sample stage is also inconsistent, resulting in uneven temperature along the radial direction of large-sized polycrystalline film. Maintaining uniform temperature on the surface of large-sized polycrystalline film during its growth is crucial for growing high-quality films.

[0004] Therefore, there is an urgent need for a cooling device that can locally adjust the temperature of different areas of the sample stage to solve the problem that the current MPCVD equipment cannot locally regulate the temperature of different areas of the sample stage. Utility Model Content

[0005] In order to solve the above problems, the utility model provides a sample stage uniform cooling device and a microwave plasma chemical vapor deposition system, which realizes local control of the temperature of different areas of the sample stage by arranging multiple groups of cooling mechanisms in the sample stage.

[0006] The first aspect of the utility model provides a uniform cooling device for a sample stage. The uniform cooling device for a sample stage includes a sample stage and a plurality of cooling mechanisms arranged in the sample stage. Each group of cooling mechanisms includes a cooling pipeline, a liquid inlet pipeline and a liquid outlet pipeline. One end of each group of liquid inlet pipelines is connected to one end of the same group of cooling pipelines, and the other end is externally connected to a cooling circulation device. A first flow meter and a first valve are provided on each group of liquid inlet pipelines. One end of each group of liquid outlet pipelines is connected to the other end of the same group of cooling pipelines, and the other end is externally connected to a cooling circulation device. Along the center of the sample stage to the edge of the sample stage, each group of cooling pipelines is arranged in a ring in sequence.

[0007] In a specific implementation manner, each group of liquid outlet pipelines is provided with a second flow meter and a second valve.

[0008] In a specific embodiment, the minimum spacing between adjacent cooling pipelines is 5-10 mm.

[0009] In a specific implementation manner, the diameters of the cooling pipeline, the liquid inlet pipeline and the liquid outlet pipeline are all 5 to 10 mm.

[0010] In a specific embodiment, the cross-sectional shapes of the cooling pipeline, the liquid inlet pipeline and the liquid outlet pipeline are independently selected from a circle or a square.

[0011] In a specific embodiment, the materials of the cooling pipeline, the liquid inlet pipeline and the liquid outlet pipeline are independently selected from any one of high molecular polymers, metals or alloys.

[0012] In a specific embodiment, the cooling liquid used by the cooling mechanism is selected from any one of water, carbon dioxide or propylene glycol.

[0013] In a specific embodiment, the cooling pipelines are arranged in a circular ring shape or a square ring shape.

[0014] The second aspect of the utility model provides a microwave plasma chemical vapor deposition system. The microwave plasma chemical vapor deposition system includes a sample stage uniform cooling device as provided in the first aspect of the utility model, and also includes a microwave plasma chemical vapor deposition device and a host computer. The sample stage uniform cooling device is arranged in the microwave plasma chemical vapor deposition device. The host computer is electrically connected to the cooling circulation device, the microwave plasma chemical vapor deposition device, the first flowmeter, the first valve, the second flowmeter and the second valve respectively.

[0015] In a specific embodiment, it also includes an observation window arranged on the microwave plasma chemical vapor deposition equipment, and a temperature measuring gun is arranged outside the observation window.

[0016] Beneficial Effects

[0017] 1) The utility model sets multiple cooling mechanisms in the sample stage, and each cooling mechanism includes a cooling pipeline, a liquid inlet pipeline and a liquid outlet pipeline. The cooling pipelines are arranged in a ring, and each liquid inlet pipeline and each liquid outlet pipeline are externally connected to a cooling circulation device. A first flow meter and a first valve are also provided on the liquid inlet pipeline. Through the above arrangement, the local adjustment of the temperature of different areas of the sample stage is achieved, so that the surface temperature of the film can be uniform during the growth process.

[0018] 2) The utility model also provides a second flow meter and a second valve in the liquid outlet pipeline, so that the experimenter can obtain the liquid flow in the liquid outlet pipeline, and further control the cooling circulation device and the second valve to make the liquid flow in the liquid outlet pipeline meet the experimental requirements.

[0019] 3) The utility model provides a microwave plasma chemical vapor deposition system, in which a sample stage uniform cooling device, a microwave plasma chemical vapor deposition device and a host computer are provided. The host computer and the microwave plasma chemical vapor deposition device, the cooling circulation device, the first flow meter, a valve, the second flow meter and the second valve are electrically connected respectively, so that the experimenter can control the host computer to control the cooling circulation mechanism, saving the operation of the experimenter.

[0020] 4) The microwave plasma chemical vapor deposition device of the microwave plasma chemical vapor deposition system provided by the utility model is also provided with a temperature measuring window, and a temperature measuring gun is arranged outside the temperature measuring window. The temperature of a single sample can be measured by the temperature measuring gun, and the experimenter can control the cooling circulation mechanism according to the data read by the temperature measuring gun, so as to better adjust the temperature of the sample. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0022] Figure 2 It is a partial structural schematic diagram of the utility model.

[0023] Figure 3 It is a bottom view of the utility model.

[0024] Figure 4 It is a schematic structural diagram of the microwave plasma chemical vapor deposition system of the utility model.

[0025] Reference numerals

[0026] Cooling mechanism 1;

[0027] Cooling line 2;

[0028] Liquid inlet pipeline 3, first flow meter 31, first valve 32;

[0029] Liquid outlet pipeline 4, second flow meter 41, second valve 42;

[0030] Observation window 5, temperature measuring gun 51;

[0031] Microwave plasma chemical vapor deposition equipment 6, plasma 61. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. In the description of the utility model, it should be noted that the orientation or position relationship indicated by the terms "left side", "right side", "upper side", "lower side", "above", "below", "adjacent", etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0033] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] In addition, in the description of the present invention, unless otherwise specified, “plurality” means two or more.

[0035] Embodiment 1

[0036] This embodiment provides a uniform cooling device for a sample stage, see Figure 1 , including a sample stage and a plurality of cooling mechanisms 1 arranged under the sample stage, each cooling mechanism 1 including a cooling pipeline 2, a liquid inlet pipeline 3 and a liquid outlet pipeline 4. Figure 1 and Figure 3 , along the center of the sample stage to the edge of the sample stage, each group of cooling pipes 2 is arranged in a ring in sequence. Specifically, the minimum spacing D between adjacent cooling pipes 2 is 5 to 10 mm. It is worth noting that, refer to Figure 3 , the minimum spacing D refers to the radius difference between adjacent cooling pipes 2. Preferably, the minimum spacing between adjacent cooling pipes 2 is 8 mm.

[0037] Continue reading Figure 1One end of each group of liquid inlet pipelines 3 is connected to one end of the same group of cooling pipelines 2, and the other end is connected to an external cooling circulation device. One end of each group of liquid outlet pipelines 4 is connected to the other end of the same group of cooling pipelines 2, and the other end is connected to an external cooling circulation device. Each group of liquid inlet pipelines 3 is provided with a first flowmeter 31 and a first valve 32. The first flowmeter 31 is used to monitor the liquid flow in each liquid inlet pipeline 3, and the first valve 32 is used to control the liquid flow in each liquid inlet pipeline 3. For details, continue to refer to Figure 1 The cooling circulation device is provided with a main liquid inlet pipeline and a main liquid outlet pipeline, one end of the main liquid inlet pipeline is connected to the cooling circulation device, and the other end is connected to each group of liquid inlet pipelines 3. One end of the main liquid outlet pipeline is connected to the cooling circulation device, and the other end is connected to each group of liquid outlet pipelines 4.

[0038] In one specific embodiment, see Figure 2 Each group of liquid outlet pipelines 4 is provided with a second flow meter 41 and a second valve 42 . The second flow meter 41 is used to monitor the liquid flow in each liquid outlet pipeline 4 , and the second valve 42 is used to control the liquid flow in each liquid outlet pipeline 4 .

[0039] In a specific embodiment, the flow rate of the coolant in each group of cooling mechanisms 1 is 0-50 ml / min. More specifically, the flow rate of the coolant in each group of cooling mechanisms 1 is different and decreases from the center to the outside. Preferably, the flow rate of the coolant in each group of cooling mechanisms 1 from the center to the outside is 50 ml / min, 40 ml / min, and 30 ml / min, respectively.

[0040] In a specific embodiment, the diameters of the cooling pipeline 2, the liquid inlet pipeline 3, and the liquid outlet pipeline 4 are all 5 to 10 mm. It is worth noting that the diameter is the radius of the pipeline. If the cross-sectional shape of the pipeline is non-circular, the diameter is the inner diameter of its inscribed circle or circumscribed circle. Preferably, the diameters of the cooling pipeline 2, the liquid inlet pipeline 3, and the liquid outlet pipeline 4 are all 5 mm.

[0041] In a specific embodiment, the cross-sectional shapes of the cooling pipeline 2, the liquid inlet pipeline 3 and the liquid outlet pipeline 4 are independently selected from a circle or a square. Figure 1 The cross-sectional shapes of the cooling pipeline 2, the liquid inlet pipeline 3 and the liquid outlet pipeline 4 are all circular.

[0042] In a specific embodiment, the materials of the cooling pipeline 2, the liquid inlet pipeline 3 and the liquid outlet pipeline 4 are independently selected from any one of polymers, metals or alloys. Among them, polymers include PP, PET, etc., metals include copper, iron and aluminum, etc., and alloys include stainless steel, aluminum alloy, etc. Preferably, the materials of the cooling pipeline 2, the liquid inlet pipeline 3 and the liquid outlet pipeline 4 are all stainless steel.

[0043] In a specific embodiment, the coolant used by the cooling mechanism 1 is selected from any one of water, carbon dioxide or propylene glycol. Preferably, the coolant used by the cooling mechanism 1 is propylene glycol, which can better remove the heat of the sample stage.

[0044] In a specific embodiment, the cooling pipeline 2 is arranged in a circular ring or a square ring. Figure 1 , the cooling pipeline 2 is arranged in a circular ring shape.

[0045] Embodiment 2

[0046] See also Figures 1 to 4 This embodiment provides a microwave plasma chemical vapor deposition system, including the sample stage uniform cooling device, microwave plasma chemical vapor deposition equipment 6 and a host computer as described in the first embodiment. The sample stage is arranged in the microwave plasma chemical vapor deposition equipment 6, and the sample stage uniform cooling device is arranged in the sample stage. The host computer is electrically connected to the cooling circulation device, the microwave plasma chemical vapor deposition equipment 6, the first flowmeter 31, the first valve 32, the second flowmeter 41 and the second valve 42 respectively.

[0047] Specifically, see Figure 4 , and also includes an observation window 5 arranged on the microwave plasma chemical vapor deposition equipment 6, and a temperature measuring gun 51 is arranged outside the observation window 5. The temperature measuring gun 51 is used to measure the temperature of the sample so that the experimenter can know the temperature, thereby adjusting the sample stage uniform cooling device to make the sample reach the ideal temperature.

[0048] It is worth noting that the host computer generally refers to a computer with certain computing and processing capabilities, and the host computer plays a role in unified control, coordination and interaction of the above-mentioned sample table uniform cooling device, microwave plasma chemical vapor deposition equipment 6, the first flow meter 31, the first valve 32, the second flow meter 41 and the second valve 42.

[0049] This embodiment also provides a method for using the microwave plasma chemical vapor deposition system, and the specific method for using is as follows:

[0050] 1) Place the sample on the sample stage in the sample stage uniform cooling water device and start the microwave plasma chemical vapor deposition equipment 6.

[0051] 2) The temperature of different areas of the sample stage is measured through the observation window 51 on the microwave plasma chemical vapor deposition device 6 and using a temperature measuring gun 51 .

[0052] 3) The upper computer controls the cooling circulation device and the first valve 32 set on each liquid inlet pipeline 3. If the temperature of a certain area of ​​the sample platform is greater than the ideal temperature, the experimenter controls the upper computer to cool the circulation device to speed up the flow rate of the coolant, so that the flow rate of the coolant in the cooling pipeline 2, the liquid inlet pipeline 3 and the liquid outlet pipeline 4 is accelerated, and more heat can be taken away. The first valve 32 set on the liquid inlet pipeline 3 corresponding to the area is gradually opened, so that more coolant can enter the liquid inlet pipeline 3. If the temperature of a certain area of ​​the sample platform is lower than the ideal temperature, the cooling circulation device slows down the flow rate of the coolant, so that the flow rate of the coolant in the cooling pipeline 2, the liquid inlet pipeline 3 and the liquid outlet pipeline 4 is slowed down, and the heat taken away is reduced. The first valve 32 set on the liquid inlet pipeline 3 corresponding to the area is gradually closed, so that less coolant can enter the liquid inlet pipeline 3.

[0053] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principle of the present invention. These improvements and substitutions should also be regarded as the protection scope of the present invention.

Claims

1. A sample stage uniform cooling device, comprising a sample stage, characterized in that: It also includes a plurality of cooling mechanisms (1) disposed in the sample stage; each cooling mechanism (1) includes a cooling pipeline (2), a liquid inlet pipeline (3) and a liquid outlet pipeline (4); One end of each group of the liquid inlet pipeline (3) is connected to one end of the cooling pipeline (2) of the same group, and the other end is externally connected to a cooling circulation device; each group of the liquid inlet pipeline (3) is provided with a first flow meter (31) and a first valve (32); One end of each group of the liquid outlet pipelines (4) is connected to the other end of the cooling pipeline (2) in the same group, and the other end is externally connected to the cooling circulation device; Along the center of the sample stage towards the edge of the sample stage, each group of cooling pipelines (2) is arranged in a ring in sequence.

2. The sample stage uniform cooling device according to claim 1, characterized in that: Each group of the liquid outlet pipelines (4) is provided with a second flow meter (41) and a second valve (42).

3. The sample stage uniform cooling device according to claim 1, characterized in that: The minimum spacing between adjacent cooling pipelines (2) is 5 to 10 mm.

4. The sample stage uniform cooling device according to claim 1, characterized in that: The diameters of the cooling pipeline (2), the liquid inlet pipeline (3) and the liquid outlet pipeline (4) are all 5 to 10 mm.

5. The sample stage uniform cooling device according to claim 1, characterized in that: The cross-sectional shapes of the cooling pipeline (2), the liquid inlet pipeline (3) and the liquid outlet pipeline (4) are independently selected from a circle or a square.

6. The sample stage uniform cooling device according to claim 1, characterized in that: The materials of the cooling pipeline (2), the liquid inlet pipeline (3) and the liquid outlet pipeline (4) are independently selected from any one of high molecular polymers, metals or alloys.

7. The sample stage uniform cooling device according to claim 1, characterized in that: The cooling liquid used by the cooling mechanism (1) is selected from any one of water, carbon dioxide or propylene glycol.

8. The sample stage uniform cooling device according to claim 1, characterized in that: The cooling pipeline (2) is arranged in a circular ring shape or a square ring shape.

9. A microwave plasma chemical vapor deposition system, characterized in that: It comprises a sample stage uniform cooling device as claimed in any one of claims 1 to 8, a microwave plasma chemical vapor deposition device (6) and a host computer; The sample stage uniform cooling device is arranged in the microwave plasma chemical vapor deposition equipment (6); The host computer is electrically connected to the cooling circulation device, the microwave plasma chemical vapor deposition equipment (6), the first flow meter (31) and the first valve (32) respectively.

10. The microwave plasma chemical vapor deposition system according to claim 9, characterized in that: It also comprises an observation window (5) arranged on the microwave plasma chemical vapor deposition equipment, and a temperature measuring gun (51) is arranged outside the observation window (5).

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