Transistor packaging device

Abstract

The utility model relates to the technical field of transistors, and discloses a transistor packaging device which comprises a device body, a cover plate is hinged to the upper surface of the device body, a plurality of annular frames distributed in a matrix mode are fixedly connected to the bottom surface of the cover plate, and a plurality of atomizing nozzles distributed in a circumferential mode fixedly communicate with the bottom surfaces of the annular frames. A plurality of placing grooves distributed in a matrix mode are formed in the device body, and sliding grooves are formed in the inner walls of the placing grooves. According to the transistor packaging device, by installing the atomization nozzle, when the cover plate is used for sealing the device body, atomized anti-static liquid can be sprayed into the device body, so that the device body is filled with the anti-static liquid, and a layer of conductive film is formed on the surface of a semiconductor transistor in the device body; therefore, the electrical property of the surface of the coated object is changed, surface charges are released or neutralized, and the effect of reducing or eliminating static accumulation is achieved.

Description

Technical Field

[0001] The present application relates to the field of transistor technology, and specifically to a transistor packaging device. Background Art

[0002] Transistor refers to any single component based on semiconductor materials. Transistor has multiple functions such as detection, rectification, amplification, switching, voltage regulation, signal modulation, etc. Transistor can be used for a variety of digital and analog functions.

[0003] The existing patent (publication number: CN208923092U) discloses a semiconductor transistor packaging structure with high stability, which relates to the technical field of semiconductor transistor packaging structure. The semiconductor transistor after packaging is realized not to shake, so that the semiconductor transistor has high stability. The semiconductor transistor packaging structure with high stability includes a base, a cover plate, a fixing device and a cap device. The semiconductor transistor packaging structure with high stability, the upper cover rotates on the connecting rod in the rotating groove through the rotating block, so that the card block is stuck in the card slot, the pressure plate contacts the top of the semiconductor transistor, puts it into the fixing hole, rotates the threaded cap, the threaded cap drives the connecting frame downward, the turntable drives the extension rod downward, the hook drives the pull rod downward through the pull hole, the card strip is downward, the second spring fixes the extension rod, the extension rod fixes the hook, the turntable rotates in the connecting frame, the threaded cap is tightened for clamping, the semiconductor transistor after packaging will not shake, so that the semiconductor transistor has high stability.

[0004] During use, the above-mentioned document can stably place the semiconductor transistor in the device and prevent it from shaking. However, static electricity will be generated during the placement or fixing of the semiconductor transistor. Static electricity can cause great damage to electronic components or even breakdown, which may cause damage to the semiconductor transistor. Utility Model Content

[0005] In view of the deficiencies in the prior art, the present application provides a transistor packaging device, which has the advantages of eliminating static electricity, etc., and solves the problems raised in the background technology.

[0006] To achieve the above-mentioned purpose, the present application provides the following technical solutions: a transistor packaging device, comprising a device body, a cover plate hinged on the upper surface of the device body, a plurality of annular frames distributed in a matrix are fixedly connected to the bottom surface of the cover plate, a plurality of atomizing nozzles distributed in a circumferential manner are fixedly connected to the bottom surfaces of the plurality of annular frames, a plurality of placement grooves distributed in a matrix are provided inside the device body, a plurality of sliding grooves are provided on the inner walls of the placement grooves, a clamping member is slidably connected inside the plurality of sliding grooves, a spring is fixedly connected to a side surface of the plurality of clamping members close to each other, and the other ends of the plurality of springs are fixedly connected to the inner wall of the sliding groove close to them.

[0007] Through the above solution, the semiconductor transistor can be clamped by installing the spring and the clamping member to prevent the semiconductor transistor from shaking.

[0008] Furthermore, two compression cylinders are fixedly connected to the inner wall of the device body, and compression rods are slidably connected to the inside of the two compression cylinders. The rear ends of the two compression rods are hinged with swing plates, and the other ends of the two swing plates are hinged to the cover plate. The front sides of the two compression rods are fixedly connected with elastic parts, and the other ends of the two elastic parts are fixedly connected to the compression cylinders adjacent to them.

[0009] Through the above scheme, the installation of the compression rod and the compression cylinder can compress the anti-static liquid in the compression cylinder, so that the anti-static liquid can be sprayed into the device body from multiple atomizing nozzles.

[0010] Furthermore, a winding groove is opened inside the device body, and the winding groove is connected to multiple sliding grooves. The inner bottom wall of the winding groove is rotatably connected to a winding rod. The side surfaces of multiple clamping members close to each other are fixedly connected to ropes, and the other ends of the multiple ropes are fixedly connected to the winding rod.

[0011] Through the above scheme, the winding rod and the rope are arranged so that when the rotating rod is rotated, the clamping member can be moved away from the semiconductor transistor, thereby facilitating the removal of the semiconductor transistor in the device body.

[0012] Furthermore, two water storage chambers are provided inside the device body, water inlet holes are provided on the inner top walls of the two water storage chambers, and plugs are installed inside the two water inlet holes.

[0013] Through the above scheme, the water inlet hole is provided to facilitate the injection of anti-static liquid into the water storage cavity, and the water storage cavity can be sealed by installing a plug to prevent the anti-static liquid from evaporating.

[0014] Furthermore, the outer surfaces of the two compression cylinders are fixedly connected to a water inlet pipe, the outer surfaces of the two water inlet pipes are installed with a first one-way valve, and the other ends of the two water inlet pipes are located in a water storage cavity adjacent thereto.

[0015] Through the above solution, installing the first one-way valve can avoid backflow when pressure is applied to the anti-static liquid in the compression cylinder, so that the pressure in the compression cylinder can be concentrated on the anti-static liquid in the compression cylinder.

[0016] Furthermore, the outer surfaces of the two compression cylinders are fixedly connected with three-way pipes, the outer surfaces of the two three-way pipes are installed with second one-way valves, and the other ends of the two three-way pipes are fixedly connected with two annular pipes adjacent thereto.

[0017] Through the above scheme, installing the second one-way valve can make the compression cylinder in a negative pressure state after the anti-static liquid in the compression cylinder is discharged, so that the anti-static liquid in the water storage chamber can be extracted through the water inlet pipe.

[0018] Furthermore, two elastic clips are fixedly connected to the front of the cover plate, and two buckles are fixedly connected to the front of the device body, and the two elastic clips are both matched with the buckles adjacent to them.

[0019] Through the above solution, the cooperation between the installed elastic clip and the buckle can make the cover plate and the device body tightly connected together, preventing foreign matter from entering the device body.

[0020] Furthermore, the two three-way pipes are both configured as telescopic hoses, and a rotating member is fixedly connected to the upper end of the reeling rod.

[0021] Through the above solution, the three-way pipe is provided with a telescopic hose to facilitate the swinging of the cover plate, and the installation of the rotating member can facilitate the user to rotate the winding rod to wind up the rope.

[0022] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0023] The transistor packaging device is equipped with an atomizing nozzle, which can spray atomized anti-static liquid into the device body when the device body is closed with a cover plate, so that the anti-static liquid fills the device body and forms a conductive film on the surface of the semiconductor transistor in the device body, thereby changing the electrical properties of the surface of the coated object, so that the surface charge is released or neutralized, thereby achieving the effect of reducing or eliminating static electricity accumulation. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a cross-sectional view of the overall structure of this application Figure 1 ;

[0025] Figure 2 This is a cross-sectional view of the overall structure of this application Figure 2 ;

[0026] Figure 3 This is the overall structure diagram of the whole Figure 3 ;

[0027] Figure 4 This is a schematic diagram of the overall structure of this application.

[0028] In the figure:

[0029] 1. Device body; 2. Cover plate; 3. Ring frame; 4. Atomizing nozzle; 5. Placement slot; 6. Sliding slot; 7. Clamping piece; 8. Spring; 9. Compression cylinder; 10. Compression rod; 11. Swing plate; 12. Winding slot; 13. Winding rod; 14. Rope; 15. Water storage chamber; 16. Water inlet hole; 17. Plug; 18. Water inlet pipe; 19. First one-way valve; 20. Three-way pipe; 21. Second one-way valve; 22. Elastic clamp; 23. Buckle; 24. Rotating piece; 25. Elastic piece. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0031] See also Figure 1 , Figure 2 and Figure 3 In this embodiment, a transistor packaging device includes a device body 1, a cover plate 2 is hinged on the upper surface of the device body 1, a plurality of annular frames 3 distributed in a matrix are fixedly connected to the bottom surface of the cover plate 2, and a plurality of atomizing nozzles 4 distributed in a circumference are fixedly connected to the bottom surfaces of the plurality of annular frames 3. When the device body 1 is sealed by using the cover plate 2, the atomized antistatic liquid can be sprayed into the device body 1 by installing the atomizing nozzle 4, so that the antistatic liquid is filled into the device body 1, so that a conductive film is formed on the surface of the semiconductor transistor in the device body 1, thereby changing the surface of the coated object. The electrical characteristics of the device can release or neutralize the surface charge, thereby reducing or eliminating the accumulation of static electricity. A plurality of placement grooves 5 distributed in a matrix are provided inside the device body 1, and the inner walls of the plurality of placement grooves 5 are provided with sliding grooves 6. The interiors of the plurality of sliding grooves 6 are slidably connected with clamping members 7, and the sides of the plurality of clamping members 7 close to each other are fixedly connected with springs 8, and the other ends of the plurality of springs 8 are fixedly connected to the inner walls of the sliding grooves 6 close to them. By installing the springs 8 and cooperating with the clamping members 7, the semiconductor transistor can be clamped to prevent the semiconductor transistor from shaking.

[0032] See also Figure 1 , Figure 2 and Figure 4The inner wall of the device body 1 is fixedly connected to two compression cylinders 9, and the interiors of the two compression cylinders 9 are slidably connected with compression rods 10. The rear ends of the two compression rods 10 are hinged with swing plates 11, and the other ends of the two swing plates 11 are hinged with the cover plate 2. The fronts of the two compression rods 10 are fixedly connected with elastic members 25, and the other ends of the two elastic members 25 are fixedly connected to the compression cylinders 9 close to them. The installation of the compression rods 10 and the compression cylinders 9 can compress the anti-static liquid in the compression cylinders 9, so that the anti-static liquid can be sprayed into the device body 1 from multiple atomizing nozzles. The outer surfaces of the two compression cylinders 9 are fixedly connected with water inlet pipes 18, and the outer surfaces of the two water inlet pipes 18 are installed with first one-way valves 19. The other ends of the two water inlet pipes 18 are located in the water storage chamber 15 close to them. The installation of the first one-way valve 19 can avoid When pressure is applied to the anti-static liquid in the compression cylinder 9, backflow occurs, so that the pressure in the compression cylinder 9 can be concentrated on the anti-static liquid in the compression cylinder 9. The outer surfaces of the two compression cylinders 9 are fixedly connected with a three-way pipe 20, and the outer surfaces of the two three-way pipes 20 are installed with a second one-way valve 21. The other ends of the two three-way pipes 20 are fixedly connected with two annular pipes close to them. The installation of the second one-way valve 21 can make the compression cylinder 9 be in a negative pressure state after the anti-static liquid in the compression cylinder 9 is discharged, which is convenient for extracting the anti-static liquid in the water storage chamber 15 through the water inlet pipe 18. The two three-way pipes 20 are both configured as telescopic hoses, and the upper end of the winding rod 13 is fixedly connected with a rotating part 24. The three-way pipe 20 is provided with a telescopic hose to facilitate the swinging of the cover plate 2. By installing the rotating part 24, the user can rotate the winding rod 13 to reel in the rope 14.

[0033] See also Figure 1 , Figure 2 and Figure 3The device body 1 is provided with a reeling groove 12 inside, the reeling groove 12 is communicated with a plurality of sliding grooves 6, the inner bottom wall of the reeling groove 12 is rotatably connected with a reeling rod 13, a side surface of the plurality of clamping members 7 close to each other is fixedly connected with a rope 14, the other ends of the plurality of ropes 14 are fixedly connected with the reeling rod 13, the reeling rod 13 and the rope 14 are provided so that when the rotating rod is rotated, the clamping member 7 can be moved away from the semiconductor transistor, so as to facilitate the removal of the semiconductor transistor in the device body 1, the device body 1 is provided with two water storage chambers 15 inside, and the inner top walls of the two water storage chambers 15 are provided with water inlet holes 1 6. Plugs 17 are installed inside the two water inlet holes 16. The water inlet holes 16 can be provided to facilitate the injection of antistatic liquid into the water storage chamber 15, and the water storage chamber 15 can be sealed by installing the plugs 17 to prevent the antistatic liquid from evaporating. Two elastic clips 22 are fixedly connected to the front of the cover plate 2, and two buckles 23 are fixedly connected to the front of the device body 1. The two elastic clips 22 are adapted to the buckles 23 adjacent to them. The installation of the elastic clips 22 and the buckles 23 can make the cover plate 2 and the device body 1 tightly connected together to prevent external impurities from entering the device body 1.

[0034] A transistor packaging device in this embodiment can install an atomizing nozzle 4 to spray atomized anti-static liquid into the device body 1 when the device body 1 is closed using a cover plate 2, so that the anti-static liquid fills the device body 1, and a conductive film is formed on the surface of the semiconductor transistor in the device body 1, thereby changing the electrical properties of the surface of the coated object, so that the surface charge is released or neutralized, thereby achieving the effect of reducing or eliminating static electricity accumulation.

[0035] The working principle of the above embodiment is as follows: when packaging the semiconductor transistor, the winding rod 13 is rotated to bring the multiple clamping members 7 closer to each other, and the semiconductor transistor is placed in the placement groove 5. When the winding rod 13 is released, the deformation force of the spring 8 will push the clamping member 7 to contact the semiconductor transistor and clamp it to prevent it from shaking in the device body 1. When the cover plate 2 is used to close the device body 1, the cover plate 2 is swung. At this time, the cover plate 2 can push the compression rod 10 to slide in the compression cylinder 9 through the swing plate 11, and squeeze the antistatic liquid in the compression cylinder 9 to make the compression The antistatic liquid in the cylinder 9 can enter the annular frame 3 through the three-way pipe 20 and be sprayed out from the multiple atomizing nozzles 4, so that the antistatic liquid fills the device body 1, and a conductive film is formed on the surface of the semiconductor transistor in the device body 1, thereby changing the electrical properties of the surface of the coated object, so that the surface charge is released or neutralized, thereby achieving the effect of reducing or eliminating static electricity accumulation. When the cover 2 is opened again, the deformation force of the elastic member can push the compression rod 10 to reset, so that the compression cylinder 9 can be in a negative pressure, and the antistatic liquid in the water storage chamber 15 is extracted into the compression cylinder 9 through the water inlet pipe 18.

[0036] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0037] Although the embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A transistor packaging device, comprising a device body (1), characterized in that: The upper surface of the device body (1) is hingedly connected with a cover plate (2); the bottom surface of the cover plate (2) is fixedly connected with a plurality of annular frames (3) distributed in a matrix; the bottom surfaces of the plurality of annular frames (3) are fixedly connected with a plurality of atomizing nozzles (4) distributed in a circumferential manner; the interior of the device body (1) is provided with a plurality of placement grooves (5) distributed in a matrix; the inner walls of the plurality of placement grooves (5) are provided with sliding grooves (6); the interiors of the plurality of sliding grooves (6) are slidably connected with clamping members (7); the sides of the plurality of clamping members (7) close to each other are fixedly connected with springs (8); the other ends of the plurality of springs (8) are fixedly connected to the inner walls of the sliding grooves (6) close to each other.

2. A transistor packaging device according to claim 1, characterized in that: Two compression cylinders (9) are fixedly connected to the inner wall of the device body (1), and compression rods (10) are slidably connected to the interior of the two compression cylinders (9). The rear ends of the two compression rods (10) are hinged to swing plates (11), and the other ends of the two swing plates (11) are hinged to the cover plate (2). The front sides of the two compression rods (10) are fixedly connected to elastic members (25), and the other ends of the two elastic members (25) are fixedly connected to the compression cylinders (9) adjacent to them.

3. A transistor packaging device according to claim 1, characterized in that: A winding groove (12) is provided inside the device body (1), the winding groove (12) is communicated with a plurality of sliding grooves (6), the inner bottom wall of the winding groove (12) is rotatably connected to a winding rod (13), a side surface of the plurality of clamping members (7) close to each other is fixedly connected to a rope (14), and the other ends of the plurality of ropes (14) are fixedly connected to the winding rod (13).

4. A transistor packaging device according to claim 1, characterized in that: Two water storage chambers (15) are provided inside the device body (1), the inner top walls of the two water storage chambers (15) are provided with water inlet holes (16), and plugs (17) are installed inside the two water inlet holes (16).

5. The transistor packaging device according to claim 2, characterized in that: The outer surfaces of the two compression cylinders (9) are fixedly connected to a water inlet pipe (18), the outer surfaces of the two water inlet pipes (18) are installed with a first one-way valve (19), and the other ends of the two water inlet pipes (18) are located in a water storage cavity (15) adjacent thereto.

6. A transistor packaging device according to claim 2, characterized in that: The outer surfaces of the two compression cylinders (9) are fixedly connected to a three-way pipe (20), the outer surfaces of the two three-way pipes (20) are installed with a second one-way valve (21), and the other ends of the two three-way pipes (20) are fixedly connected to two annular pipes adjacent thereto.

7. The transistor packaging device according to claim 1, characterized in that: The front side of the cover plate (2) is fixedly connected to two elastic clips (22), and the front side of the device body (1) is fixedly connected to two buckles (23), and the two elastic clips (22) are both matched with the buckles (23) adjacent thereto.

8. The transistor packaging device according to claim 6, characterized in that: The two three-way pipes (20) are both configured as telescopic hoses, and the upper end of the reeling rod (13) is fixedly connected to a rotating member (24).

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