Double-pump and double-circulation airborne liquid cooling system with two-stage heat dissipation
By adopting a dual-pump dual-circulation structure and two-stage heat dissipation design in the onboard liquid cooling system, the problem of insufficient reliability and heat dissipation capabilities of traditional liquid cooling systems under the demand for large load heat dissipation is solved, and the efficient double-overall of key electronic equipment is achieved Degree of heat dissipation.
Patent Information
- Application Number
- CN202420864734.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-24
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2034-04-24
AI Technical Summary
In the case of large load heat dissipation requirements, traditional single circulation liquid cooling systems require high-power liquid cooling pumps to drive, and have poor reliability and multiple single-point failures, which cannot meet the unnecessary heat dissipation requirements of key electronic equipment.
The air-conditioned liquid cooling system adopts a dual pump dual circulation with two stages of heat dissipation. It passes through two independent circulation channels through two independent circulation channels to perform two stages of heat dissipation through the air-liquid three-stream radiator and the fuel-liquid three-stream radiator to ensure key electronic equipment Obtain double-resolution liquid cooling.
Two-stage heat dissipation is achieved, reducing the demand for a single heat sink for the aircraft, improving the reliability of the system, and ensuring that the dual-severity heat dissipation needs of key electronic equipment are met.
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Figure CN222509794U_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the technical field of aviation equipment cooling, and in particular relates to an airborne liquid cooling system with dual pumps and dual circulations and two-stage heat dissipation. Background Art
[0002] Liquid cooling systems have the advantages of high heat exchange efficiency and adaptability to high heat flux density cooling. The heat dissipation demand of aircraft electronic equipment has increased dramatically, and at the same time, strict requirements are placed on the cooling temperature. Under the condition of large load heat dissipation demand, the traditional single-cycle single-heat dissipation liquid cooling system has high requirements for heat sinks, and it is difficult to meet the requirements for primary heat dissipation.
[0003] Traditional single-cycle liquid cooling systems face large load heat dissipation requirements and require high-power liquid cooling pumps to drive them, which has poor reliability. In addition, single-cycle liquid cooling systems are single-redundant for electronic equipment heat dissipation, and the system has multiple single-point failures, which cannot meet the redundant heat dissipation requirements of key electronic equipment.
[0004] Therefore, it is desired to have a technical solution to overcome or at least alleviate at least one of the above-mentioned defects of the prior art. Utility Model Content
[0005] The purpose of the present application is to provide an airborne liquid cooling system with dual pumps and dual circulation and two-stage heat dissipation to solve at least one problem existing in the prior art.
[0006] The technical solution of this application is:
[0007] A dual-pump dual-circulation airborne liquid cooling system with two-stage heat dissipation, comprising:
[0008] A first circulation flow path, wherein a first liquid-cooling power assembly is disposed on the first circulation flow path, and the first liquid-cooling power assembly drives the coolant to circulate on the first circulation flow path, and the coolant sequentially passes through a plurality of electronic devices to be cooled to absorb heat, and then passes through an air-liquid three-stream radiator for first-stage heat dissipation, passes through a fuel-liquid three-stream radiator for second-stage heat dissipation, and then the coolant flows back to the first liquid-cooling power assembly to continue to circulate;
[0009] A second circulation flow path, wherein a second liquid-cooled power component is arranged on the second circulation flow path, and the second liquid-cooled power component drives the coolant to circulate on the second circulation flow path, and the coolant passes through the fuel-liquid three-stream radiator in turn for the first stage of heat dissipation, and passes through the air-liquid three-stream radiator for the second stage of heat dissipation. After a plurality of electronic devices to be cooled absorb heat, the coolant flows back to the second liquid-cooled power component to continue to circulate.
[0010] In at least one embodiment of the present application, the electronic equipment to be cooled includes key electronic equipment and common electronic equipment, wherein:
[0011] The coolant in the first circulation flow path and the coolant in the second circulation flow path both pass through the key electronic equipment, providing dual-redundant liquid cooling for the key electronic equipment;
[0012] The cooling liquid in the first circulation flow path or the second circulation flow path passes through the common electronic device to provide single-redundancy liquid cooling for the common electronic device.
[0013] In at least one embodiment of the present application, a plurality of temperature and pressure sensors are disposed on the first circulation flow path and the second circulation flow path, and the temperature and pressure sensors are electrically connected to a host computer.
[0014] In at least one embodiment of the present application, a plurality of pressure sensors are disposed on the first circulation flow path and the second circulation flow path, and the pressure sensors are electrically connected to a host computer.
[0015] In at least one embodiment of the present application, the liquid cooling end of the air-liquid three-flow radiator is provided with an adjusting valve, and the adjusting valve is electrically connected to the host computer.
[0016] In at least one embodiment of the present application, a reversing valve is provided at the fuel end of the fuel-liquid three-flow radiator, and the reversing valve is electrically connected to the upper computer.
[0017] In at least one embodiment of the present application,
[0018] The first circulation flow path is provided with a first shut-off valve, both ends of the first shut-off valve are connected with first ground equipment interfaces, and the first shut-off valve is electrically connected to a host computer;
[0019] A second shut-off valve is arranged on the second circulation flow path, and second ground equipment interfaces are connected to both ends of the second shut-off valve. The second shut-off valve is electrically connected to the upper computer.
[0020] In at least one embodiment of the present application, when the vehicle is not in operation on the ground,
[0021] The first shut-off valve is opened, and the coolant in the first circulation flow path is cooled down in the ground equipment through the first ground equipment interface, and the first circulation flow path and the second circulation flow path realize heat exchange through the air-liquid three-flow radiator and the fuel-liquid three-flow radiator; or,
[0022] Open the second shut-off valve, and the coolant in the second circulation flow path is cooled down in the ground equipment through the second ground equipment interface, and the first circulation flow path and the second circulation flow path realize heat exchange through the air-liquid three-flow radiator and the fuel-liquid three-flow radiator.
[0023] The utility model has at least the following beneficial technical effects:
[0024] The dual-pump dual-circulation airborne liquid cooling system of the present application has two-stage heat dissipation, which can achieve two-stage heat dissipation, reduce the demand for a single heat sink in the aircraft, and has high reliability. Key electronic equipment can achieve dual redundant heat dissipation through two circulation flow paths. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 It is a schematic diagram of an onboard liquid cooling system with dual pumps and dual circulation and two-stage heat dissipation according to an embodiment of the present application. DETAILED DESCRIPTION
[0026] In order to make the purpose, technical scheme and advantages of the implementation of this application clearer, the technical scheme in the embodiment of this application will be described in more detail below in conjunction with the drawings in the embodiment of this application. In the drawings, the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The described embodiments are part of the embodiments of this application, not all of them. The embodiments described below with reference to the drawings are exemplary and are intended to be used to explain this application, and should not be construed as limitations on this application. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application. The embodiments of this application are described in detail below in conjunction with the drawings.
[0027] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the scope of protection of the present application.
[0028] The following is combined with Figure 1 This application is described in further detail.
[0029] The present application provides an airborne liquid cooling system with dual pumps and dual circulations and two-stage heat dissipation, comprising two circulation flow paths: a first circulation flow path 1 and a second circulation flow path 2 .
[0030] For details, see Figure 1The first circulation flow path 1 is provided with a first liquid cooling power component 11, which drives the coolant to circulate on the first circulation flow path 1, passes through a plurality of electronic devices to be cooled arranged in parallel to absorb heat, passes through the air-liquid three-stream radiator 3 for the first stage of heat dissipation, and the ram air takes away part of the heat, passes through the fuel-liquid three-stream radiator 4 for the second stage of heat dissipation, and after sufficient cooling, the coolant flows back to the first liquid cooling power component 11 to continue to circulate; the second circulation flow path 2 is provided with a second liquid cooling power component 21, which drives the coolant to circulate on the second circulation flow path 2, passes through the fuel-liquid three-stream radiator 4 for the first stage of heat dissipation, passes through the air-liquid three-stream radiator 3 for the second stage of heat dissipation, and passes through a plurality of electronic devices to be cooled arranged in parallel to absorb heat, and then the coolant flows back to the second liquid cooling power component 21 to continue to circulate. Both liquid cooling power components of the circulation flow path are controlled by the host computer 9, and multiple temperature and pressure monitoring points are set in the circulation flow path to monitor the operation of the system.
[0031] In a preferred embodiment of the present application, the electronic equipment to be cooled on the first circulation flow path 1 and the second circulation flow path 2 includes key electronic equipment and ordinary electronic equipment, wherein the cooling liquid of the first circulation flow path 1 and the second circulation flow path 2 both pass through the key electronic equipment, providing dual-redundancy liquid cooling for the key electronic equipment; the cooling liquid of the first circulation flow path 1 or the second circulation flow path 2 passes through the ordinary electronic equipment, providing single-redundancy liquid cooling for the ordinary electronic equipment. In the event of a failure in the first circulation flow path 1, the second circulation flow path 2 continues to work, which can meet the heat dissipation requirements of the key electronic equipment, and vice versa.
[0032] According to the above-mentioned dual-pump dual-circulation airborne liquid cooling system with two-stage heat dissipation, the first circulation flow path 1 and the second circulation flow path 2 have three cross-linking relationships, including:
[0033] (1) Heat dissipation of key electronic equipment: Both cycles provide liquid cooling for key electronic equipment, achieving dual redundancy requirements for liquid cooling of key electronic equipment;
[0034] (2) The heat exchange of the air-liquid three-stream radiator 3 is carried out, and the two circulating coolants flow through the radiator, and the ram air is used as a heat sink to exchange heat;
[0035] (3) The fuel-liquid three-stream radiator 4 exchanges heat. The two circulating coolants both flow through the radiator, and both use the fuel as a heat sink to exchange heat.
[0036] In the preferred embodiment of the present application, a plurality of temperature and pressure sensors 5 are provided on the first circulation flow path 1 and the second circulation flow path 2, and the temperature and pressure sensors 5 are electrically connected to the host computer 9; a plurality of pressure sensors 6 are provided on the first circulation flow path 1 and the second circulation flow path 2, and the pressure sensors 6 are electrically connected to the host computer 9. The signals of the temperature and pressure sensors 5 and the pressure sensors 6 are uploaded to the host computer 9 for monitoring the operating status of the system, and logic design can be performed to provide an alarm signal when necessary.
[0037] In the preferred embodiment of the present application, the liquid cooling end of the air-liquid three-stream radiator 3 is provided with a regulating valve 7, the regulating valve 7 is electrically connected to the host computer 9, and the regulating valve 7 is used to adjust the flow of the coolant participating in the air heat dissipation, so as to play a role in regulating the system temperature. In this embodiment, the fuel end of the fuel-liquid three-stream radiator 4 is provided with a reversing valve 8, the reversing valve 8 is electrically connected to the host computer 9, and the reversing valve 8 is used to cut off the fuel passage participating in the heat dissipation, so as to play a role in regulating the system temperature. Under working conditions with high atmospheric temperature, the regulating valve 7 is in a fully closed state, and the coolant flows through the air-liquid three-stream radiator 3 in its entirety, and the reversing valve 8 causes the fuel to flow through the fuel-liquid three-stream radiator 4, making full use of the double heat sink for heat dissipation. Under working conditions with low atmospheric temperature, the reversing valve 8 is used to prevent the fuel from flowing through the fuel-liquid three-stream radiator 4, cutting off the heat exchange between the fuel and the coolant, and the regulating valve 7 is partially or fully opened according to the coolant temperature to adjust the system temperature.
[0038] In the preferred embodiment of the present application, a first shut-off valve 12 is provided on the first circulation flow path 1, and a first ground equipment interface 13 is connected to both ends of the first shut-off valve 12, and the first shut-off valve 12 is electrically connected to the host computer 9; a second shut-off valve 22 is provided on the second circulation flow path 2, and a second ground equipment interface 23 is connected to both ends of the second shut-off valve 22, and the second shut-off valve 22 is electrically connected to the host computer 9. In the ground non-driving state, there is no ram air, and the fuel does not flow and has no cooling capacity. The two shut-off valves can be used to cut off the liquid passage there, and the coolant of the liquid cooling cycle is cooled and cooled in the ground equipment through the corresponding ground equipment interface to ensure the normal operation of the system.
[0039] It can be understood that, when the vehicle is not driven on the ground, the first shut-off valve 12 is opened, the liquid passage there is cut off by the first shut-off valve 12, the coolant in the first circulation flow path 1 is cooled down in the ground equipment through the first ground equipment interface 13, and the first circulation flow path 1 and the second circulation flow path 2 realize heat exchange through the air-liquid three-stream radiator 3 and the fuel-liquid three-stream radiator 4; or, the second shut-off valve 22 is opened, the liquid passage there is cut off by the second shut-off valve 22, the coolant in the second circulation flow path 2 is cooled down in the ground equipment through the second ground equipment interface 23, and the first circulation flow path 1 and the second circulation flow path 2 realize heat exchange through the air-liquid three-stream radiator 3 and the fuel-liquid three-stream radiator 4. When cooling down by using ground equipment, the ground equipment can be connected to the first ground equipment interface 13 or the second ground equipment interface 23 of a single cycle, and the heat exchange of the two cycles can be realized by using the air-liquid three-flow radiator 3 and the fuel-liquid three-flow radiator 4. There is no need for two sets of ground equipment to be connected to the two cycles at the same time. By using the characteristics of the multi-flow radiator, the dual cycles share one set of ground equipment to meet the ground cooling needs of the entire machine.
[0040] The dual-pump dual-circulation airborne liquid cooling system of the present application has the following beneficial effects:
[0041] (1) It solves the problem that a single heat sink has a heavy burden and cannot meet the heat dissipation requirements;
[0042] (2) Given the ground conditions, when there is no available heat sink on the aircraft, the method to solve the heat dissipation problem on the aircraft is to set up a multi-stream radiator, so that a set of ground equipment can be used to ensure the dual-circulation heat dissipation problem, thus reducing the support pressure;
[0043] (3) By utilizing the dual-circulation feature, dual-redundancy liquid cooling can be provided for key electronic equipment, thus ensuring the safety of the entire machine;
[0044] (4) The system is equipped with regulating valves, reversing valves, etc., which can adjust the liquid supply temperature in multiple levels to achieve heat dissipation in a wide temperature range;
[0045] (5) The heat cross-linking of the two cycles is realized by using a multi-flow radiator, which not only satisfies the heat transfer between the two cycles but also satisfies the heat transfer to the outside. Compared with two independent cycles, it reduces the number of radiators and the space requirements on the aircraft, while improving the economy.
[0046] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.
Claims
1. A dual-pump dual-circulation airborne liquid cooling system with two-stage heat dissipation, characterized in that: include: A first circulation flow path (1), wherein a first liquid-cooling power component (11) is arranged on the first circulation flow path (1), and the first liquid-cooling power component (11) drives the coolant to circulate on the first circulation flow path (1), and sequentially passes through a plurality of electronic devices to be cooled to absorb heat, passes through an air-liquid three-stream radiator (3) to perform a first-stage heat dissipation, passes through a fuel-liquid three-stream radiator (4) to perform a second-stage heat dissipation, and then the coolant flows back to the first liquid-cooling power component (11) to continue to circulate; A second circulation flow path (2), wherein a second liquid-cooling power component (21) is arranged on the second circulation flow path (2), and the second liquid-cooling power component (21) drives the coolant to circulate on the second circulation flow path (2), and sequentially passes through the fuel-liquid three-stream radiator (4) for first-stage heat dissipation, and passes through the air-liquid three-stream radiator (3) for second-stage heat dissipation. After a plurality of electronic devices to be cooled absorb heat, the coolant flows back to the second liquid-cooling power component (21) to continue circulating.
2. The dual-pump dual-circulation airborne liquid cooling system with two-stage heat dissipation according to claim 1 is characterized in that: The electronic equipment to be cooled includes key electronic equipment and common electronic equipment, wherein: The cooling liquids in the first circulation flow path (1) and the second circulation flow path (2) both pass through the key electronic equipment, thereby providing dual-redundant liquid cooling for the key electronic equipment; The cooling liquid in the first circulation flow path (1) or the second circulation flow path (2) passes through the common electronic device to provide single-redundancy liquid cooling for the common electronic device.
3. The dual-pump dual-circulation airborne liquid cooling system with two-stage heat dissipation according to claim 2 is characterized in that: A plurality of temperature and pressure sensors (5) are provided on the first circulation flow path (1) and the second circulation flow path (2), and the temperature and pressure sensors (5) are electrically connected to a host computer (9).
4. The dual-pump dual-circulation airborne liquid cooling system with two-stage heat dissipation according to claim 3 is characterized in that: A plurality of pressure sensors (6) are provided on the first circulation flow path (1) and the second circulation flow path (2), and the pressure sensors (6) are electrically connected to a host computer (9).
5. The dual-pump dual-circulation airborne liquid cooling system with two-stage heat dissipation according to claim 1 is characterized in that: The liquid cooling end of the air-liquid three-stream radiator (3) is provided with an adjusting valve (7), and the adjusting valve (7) is electrically connected to the host computer (9).
6. The dual-pump dual-circulation airborne liquid cooling system with two-stage heat dissipation according to claim 1 is characterized in that: A reversing valve (8) is provided at the fuel end of the fuel-liquid three-stream radiator (4), and the reversing valve (8) is electrically connected to a host computer (9).
7. The dual-pump dual-circulation airborne liquid cooling system with two-stage heat dissipation according to claim 1 is characterized in that: The first circulation flow path (1) is provided with a first shutoff valve (12), both ends of the first shutoff valve (12) are connected to a first ground equipment interface (13), and the first shutoff valve (12) is electrically connected to a host computer (9); A second shutoff valve (22) is provided on the second circulation flow path (2), and second ground equipment interfaces (23) are connected to both ends of the second shutoff valve (22). The second shutoff valve (22) is electrically connected to the host computer (9).
8. The dual-pump dual-circulation airborne liquid cooling system with two-stage heat dissipation according to claim 7 is characterized in that: When not driving on the ground, The first shut-off valve (12) is opened, and the coolant in the first circulation flow path (1) is cooled in the ground equipment through the first ground equipment interface (13), and the first circulation flow path (1) and the second circulation flow path (2) realize heat exchange through the air-liquid three-flow radiator (3) and the fuel-liquid three-flow radiator (4); or, The second shut-off valve (22) is opened, and the coolant in the second circulation flow path (2) is cooled down in the ground equipment through the second ground equipment interface (23), and the first circulation flow path (1) and the second circulation flow path (2) realize heat exchange through the air-liquid three-stream radiator (3) and the fuel-liquid three-stream radiator (4).