Display device

Abstract

There is provided a display device including: a first substrate including a light emitting area and a non-light emitting area; a first pixel electrode in the light emitting region of the first substrate; a pixel defining layer in the non-emission area of the first substrate and defining a first opening; a thin film encapsulation layer on the first pixel electrode and the pixel defining layer; a first light control layer overlapping the light emitting region on the thin film encapsulation layer; a planarization layer on the thin film encapsulation layer; and a bank pattern overlapping the non-emission area on the planarization layer and defining a second opening, in which the first light control layer includes: a first surface pointing to the first pixel electrode; a first side facing the bank pattern; and a first inclined surface connecting the first surface and the first side surface, and the planarization layer is in contact with the first inclined surface. The display device has improved light efficiency and reliability.

Description

[0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0107488 filed in the Korean Intellectual Property Office on August 17, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0002] An embodiment of the present disclosure relates to a display device. Background Art

[0003] As multimedia has developed, the importance of display devices has increased. Therefore, various types (or kinds) of display devices, such as liquid crystal display (LCD) devices and organic light emitting diode display (OLED) devices, have been developed.

[0004] Since the self-luminous display device does not require a light source such as a backlight unit, the self-luminous display device can be constructed as a lightweight type (or kind) with low power consumption and has high-quality characteristics such as a wide viewing angle, high brightness and contrast, and a fast response speed, and therefore has attracted attention as a next-generation display device. Utility Model Content

[0005] An object of the present invention is to provide a display device in which the loss of light efficiency and the degradation of reliability are solved or improved.

[0006] The embodiments of the present disclosure are not limited to those mentioned above, and additional embodiments of the present disclosure not mentioned herein will be clearly understood by those skilled in the art from the following description of the present disclosure.

[0007] According to one or more disclosed embodiments, a display device includes: a first substrate, including a light-emitting area and a non-light-emitting area; a first pixel electrode, in the light-emitting area of ​​the first substrate; a pixel defining layer, in the non-light-emitting area of ​​the first substrate, and defining a first opening; a thin film encapsulation layer, on the first pixel electrode and the pixel defining layer; a first light control layer, overlapping with the light-emitting area on the thin film encapsulation layer; a planarization layer, on the thin film encapsulation layer; and a dam pattern, overlapping with the non-light-emitting area on the planarization layer, and defining a second opening, wherein the first light control layer includes: a first surface, pointing to the first pixel electrode; a first side surface, pointing to the dam pattern; and a first inclined surface, connecting the first surface with the first side surface, and the planarization layer is in contact with the first inclined surface (for example, in direct physical contact).

[0008] The first light-control layer and the planarization layer may contact (eg, directly physically contact) the thin film encapsulation layer on the thin film encapsulation layer, and an inclination angle formed by the thin film encapsulation layer and the first inclined surface in a direction toward the non-light emitting region is an acute angle.

[0009] The planarization layer may be located between the thin film encapsulation layer and the first inclined surface by overlapping the light emitting region.

[0010] The planarization layer may completely fill the space between the thin film encapsulation layer and the first inclined surface by overlapping the light emitting region.

[0011] The first light-controlling layer may include one selected from a quantum dot material and an organic material.

[0012] The planarization layer may include a metal diffuser (eg, a metal light diffuser).

[0013] The display device may further include a second light control layer spaced apart from the first light control layer, and a planarization layer between the second light control layer and the first light control layer, wherein the second light control layer includes a second inclined surface in contact with (eg, in direct physical contact with) the planarization layer.

[0014] The planarization layer includes: a first portion in contact with (e.g., direct physical contact with) the first inclined surface; a second portion overlapping the non-luminous area; and a third portion that may be in contact with (e.g., direct physical contact with) the second inclined surface, and the second portion is between the first portion and the third portion.

[0015] The first portion and the third portion may extend from the second portion, and the first portion, the second portion and the third portion may be integrally formed.

[0016] The second portion may include: a first sub-portion extending from the first portion; and a second sub-portion extending from the third portion, and the first sub-portion and the second sub-portion are spaced apart from each other with the bank pattern between the first sub-portion and the second sub-portion.

[0017] An inclined angle formed by the thin film encapsulation layer and the second inclined surface in a direction toward the non-light emitting region may be an acute angle.

[0018] An inclination angle formed by the thin film encapsulation layer and the second inclined surface in a direction toward the non-light emitting region may be a right angle or an obtuse angle.

[0019] The display device may further include: a first covering layer completely covering the first light control layer, the planarization layer, and the second light control layer, wherein the first covering layer is in contact with (eg, in direct physical contact with) the first light control layer, the planarization layer, and the second light control layer.

[0020] The planarization layer may be completely surrounded by the first light management layer, the first cover layer, the second light management layer and the thin film encapsulation layer.

[0021] The planarization layer may be completely surrounded by the first light management layer, the first cover layer and the thin film encapsulation layer.

[0022] The display device may also include: a second substrate, including a light-transmitting area and a light-shielding area; and a color filter layer, in the light-transmitting area of ​​the second substrate and arranged toward the first substrate, wherein the second substrate faces the first substrate, and the filler is between the second substrate and the first substrate, and the color filter layer is overlapped with the first inclined surface of the first light control layer.

[0023] A width of the first opening in a direction parallel to the first substrate may be greater than a width of the second opening.

[0024] According to one or more disclosed embodiments, a display device includes: a substrate including a first light-emitting area, a second light-emitting area and a non-light-emitting area between the first light-emitting area and the second light-emitting area; a pixel electrode in the first light-emitting area of ​​the substrate; a pixel defining layer in the non-light-emitting area of ​​the substrate; a first light-control layer on the pixel electrode; a planarization layer on the pixel electrode and the pixel defining layer; and a dam pattern on the planarization layer overlapping the non-light-emitting area, wherein the planarization layer includes: a first portion overlapping the first light-emitting area; and a second portion overlapping the non-light-emitting area, and in a plane, the first portion surrounds the first light-control layer, and the second portion surrounds the first light-emitting area.

[0025] The display device may further include: a second light control layer overlapping with the second light emitting area, wherein the planarization layer also includes a third part overlapping with the second light emitting area, the third part surrounds the second light control layer on the plane, and on the plane, the width of the first part is greater than the width of the third part.

[0026] On a plane, the second portion may be surrounded by the bank pattern by overlapping the non-light emitting area.

[0027] Further details of other embodiments are included in the detailed description and accompanying drawings.

[0028] According to an embodiment of the present disclosure, a display device in which loss of light efficiency and degradation of reliability are resolved or improved may be provided.

[0029] The effects according to the embodiments of the present disclosure are not limited to those mentioned above, and more various effects are included in the following description of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The above and other aspects and features of the embodiments of the present disclosure will become more apparent by describing the embodiments of the present disclosure in more detail with reference to the accompanying drawings, in which:

[0031] Figure 1 is a schematic perspective view showing a display device according to an embodiment;

[0032] Figure 2 It is shown Figure 1A schematic cross-sectional view of a display device;

[0033] Figure 3 It is shown Figure 1 and Figure 2 A schematic plan view showing a substrate;

[0034] Figure 4 is shown display driver and drive circuit attached to Figure 3 A schematic plan view of a display device;

[0035] Figure 5 is a diagram showing the display substrate from Figure 4 an enlarged schematic plan view of a portion 'A' of the invention;

[0036] Figure 6 is shown with Figure 5 A schematic plan view of a color conversion substrate corresponding to portion 'A';

[0037] Figure 7 is a diagram showing a display device according to an embodiment Figure 6 A cross-sectional view taken along the line X1-X1';

[0038] Figure 8 It is shown Figure 7 an enlarged cross-sectional view of a portion of a first light emitting region;

[0039] Fig. 9 It is shown Figure 7 an enlarged cross-sectional view of a portion 'T1';

[0040] Fig.10 It is shown Figure 7 A schematic plan view of the arrangement of a light control layer and a planarization layer;

[0041] Fig.11 is a diagram showing a display device according to another embodiment Figure 6 A cross-sectional view taken along the line X1-X1';

[0042] Fig.12 It is shown Fig.11 an enlarged cross-sectional view of a portion 'T3';

[0043] Fig.13 It is shown Fig.11 A schematic plan view of the arrangement of a light control layer and a planarization layer;

[0044] Fig.14 is a diagram showing a display device according to another embodiment Figure 6 A cross-sectional view taken along the line X1-X1';

[0045] Fig.15 It is shown Fig.14 an enlarged cross-sectional view of a portion 'T5' of FIG.

[0046] Fig.16 It is shown Fig.14 Schematic plan view of the arrangement of the light control layer and the planarization layer. DETAILED DESCRIPTION

[0047] The subject matter of the present disclosure will now be more fully described herein with reference to the accompanying drawings in which some embodiments of the present disclosure are shown. However, the subject matter of the present disclosure may be embodied in different forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art.

[0048] It will also be understood that when a layer is referred to as being “on” another layer or substrate, it can be directly on the other layer or substrate, or one or more intervening layers may also be present. Throughout the specification, the same reference numerals refer to the same components.

[0049] It will be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. For example, without departing from the spirit and scope of the present disclosure, the first element discussed below may be referred to as the second element. Similarly, the second element may also be referred to as the first element.

[0050] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It will also be understood that terms defined in common dictionaries should be interpreted as having a meaning consistent with that in the context of the relevant art and are clearly defined herein unless they are interpreted in an idealized or overly formal sense.

[0051] Hereinafter, embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings.

[0052] Figure 1 is a schematic perspective view showing a display device 1 according to an embodiment.

[0053] Reference Figure 1The display device 1 can be applied to various suitable electronic devices such as small-sized and medium-sized electronic devices (such as tablet PCs, smart phones, vehicle navigation units, cameras, central information displays (CIDs) provided to vehicles, watch-type electronic devices, personal digital assistants (PDAs), portable multimedia players (PMPs), and / or game consoles) and / or medium-sized and / or large-sized electronic devices (such as televisions, outdoor billboards, monitors, desktop computers integrated with monitors, and / or laptop computers). These examples are only suggested as non-limiting embodiments and can be applied to other suitable electronic devices without departing from the concept of the present disclosure.

[0054] In some embodiments, the display device 1 may have a rectangular shape in a plane. For example, the display device 1 may include two first sides extending in a first direction (X-axis direction) and two second sides in a second direction (Y-axis direction) intersecting the first direction (X-axis direction). The corner where the first side and the second side of the display device 1 meet may be formed as a right angle, but is not limited thereto, and may be circular. In some embodiments, the length of the first side and the length of the second side may be different from each other, but are not limited thereto. The planar shape of the display device 1 is not limited to the example shown, and may be applied to a circular shape or other suitable shapes.

[0055] The display device 1 may include a display area DA for displaying an image and a non-display area NDA for not displaying an image. Pixels including a plurality of light-emitting areas may be in the display area DA to display an image. The non-display area NDA may be near the display area DA and may surround the display area DA. The image displayed in the display area DA may be viewed by a user in a third direction (Z-axis direction) (in the direction indicated by the arrow in the drawing) that intersects the first direction (X-axis direction) and the second direction (Y-axis direction).

[0056] Figure 2 It is shown Figure 1 sectional view of the display device 1.

[0057] Reference Figure 1 and Figure 2 The display device 1 may further include a display substrate 10 and a color conversion substrate 30 , and may further include a sealing portion 50 for bonding the display substrate 10 and the color conversion substrate 30 to each other and a filler 70 filled between the display substrate 10 and the color conversion substrate 30 .

[0058] The display substrate 10 may include elements and circuits for displaying images (e.g., pixel circuits such as switching elements) and a light control layer for converting the wavelength of light emitted from the self-luminous element and the light-emitting element or partially transmitting light. In an embodiment, the self-luminous element may include at least one selected from an organic light-emitting diode, a quantum dot light-emitting diode, an inorganic micro-light-emitting diode (e.g., a micro-LED), and an inorganic nano-light-emitting diode (e.g., a nano-LED). Hereinafter, the case where the self-luminous element is an organic light-emitting element will be described by way of example.

[0059] The color conversion substrate 30 may be on the display substrate 10, and may face the display substrate 10. The color conversion substrate 30 may include a color filter.

[0060] The sealing portion 50 may be located between the display substrate 10 and the color conversion substrate 30 by overlapping the non-display area NDA. The display substrate 10 and the color conversion substrate 30 may be combined with each other through the sealing portion 50. For example, the sealing portion 50 may include or be formed of an organic material. For example, the sealing portion 50 may include or be made of an epoxy-based resin, but is not limited thereto.

[0061] The filler 70 may be in the space between the display substrate 10 and the color conversion substrate 30 surrounded by the sealing portion 50. The filler 70 may fill the space between the display substrate 10 and the color conversion substrate 30. The filler 70 may include a material capable of transmitting light or be made of a material capable of transmitting light. For example, the filler 70 may include an organic material or be made of an organic material. For example, the filler 70 may include a silicon-based organic material, an epoxy-based organic material, or a mixture of a silicon-based organic material and an epoxy-based organic material.

[0062] Figure 3 It is shown Figure 1 Schematic plan view of a display substrate 10. Figure 4 The display driver 400 and the circuit board 500 are attached to Figure 3 A plan view of the display device 1 is shown in FIG.

[0063] Reference Figure 3 , a plurality of light emitting areas LA1, LA2, and LA3 and a non-light emitting area NLA may be defined in the display area DA of the display substrate 10. The light emitting areas LA1, LA2, and LA3 may include a first light emitting area LA1, a second light emitting area LA2, and a third light emitting area LA3. The first light emitting area LA1, the second light emitting area LA2, and the third light emitting area LA3 may be areas in which light generated by the display substrate 10 is emitted to the outside of the display substrate 10. The first light emitting area LA1, the second light emitting area LA2, and the third light emitting area LA3 form one group, and a plurality of groups may be defined in the display area DA.

[0064] The non-emission area NLA may be an area in which light is not emitted to the outside of the display substrate 10. The non-emission area NLA may surround each of the first, second, and third emission areas LA1, LA2, and LA3 in the display area DA.

[0065] The sealing part 50 may be in the non-display area NDA, and may be disposed along the edge of the display substrate 10 to surround the display area DA.

[0066] The display substrate 10 may include a pad area PDA extending to one side of the non-display area NDA. A plurality of display pads PD may be in the pad area PDA. The display pads PD may be disposed at a portion of the pad area PDA adjacent to a long side, and the display pads PD may be electrically connected to a pixel circuit in the display area DA through a connection line or the like.

[0067] Reference Figure 4 , the display driver 400 and the circuit board 500 may be attached to one side of the pad area PDA of the display substrate 10 .

[0068] The circuit board 500 may be on the display pad PD by overlapping the pad area PDA. The circuit board 500 may be attached to the display pad PD by using a conductive adhesive member such as an anisotropic conductive film and an anisotropic conductive adhesive. Thus, the circuit board 500 may be electrically connected to the display substrate 10 and the signal line. The circuit board 500 may be a flexible printed circuit board and / or a flexible film such as a chip on film.

[0069] The display driver 400 may be on the circuit board 500. Each of the display drivers 400 may be attached to the circuit board 500 in a chip on plastic (COP) scheme. In some embodiments, the display driver 400 may be on the display pad PD by overlapping with the pad area PDA. Each of the display drivers 400 may be attached to the pad area PDA of the display substrate 10 in a chip on glass (COG) scheme.

[0070] Figure 5 It is shown Figure 4 1 is a plan view of portion 'A' of the display device 1.

[0071] Reference Figure 5 , the first light emitting area LA1 and the third light emitting area LA3 included in the display substrate 10 may be adjacent to each other in the first direction (X-axis direction), and the second light emitting area LA2 may be disposed at one side of the first light emitting area LA1 and the third light emitting area LA3 along the second direction (Y-axis direction), but the present disclosure is not limited thereto. The arrangement of the first light emitting area LA1, the second light emitting area LA2, and the third light emitting area LA3 may be changed in various suitable ways.

[0072] In some embodiments, the plane shape of each of the first to third light emitting regions LA1, LA2, and LA3 may be a quadrilateral. For example, the quadrilateral may be a rectangle or a square, but the present disclosure is not limited thereto. The plane shape of each of the first to third light emitting regions LA1, LA2, and LA3 may have a circular shape, an elliptical shape, a diamond shape, or other suitable polygonal shapes.

[0073] In some embodiments, each of the first light emitting area LA1, the second light emitting area LA2, and the third light emitting area LA3 may emit red, green, or blue light, and the color of the light emitted from each of the light emitting areas LA1, LA2, and LA3 may be determined according to the light emitting element ( Figure 7 The first light emitting area LA1 may emit a red first light, the second light emitting area LA2 may emit a green second light, and the third light emitting area LA3 may emit a blue third light, but the present disclosure is not limited thereto.

[0074] Figure 6 is shown with Figure 5 Part 'A' corresponds to a schematic plan view of the color conversion substrate 30.

[0075] Reference Figure 6 , the color conversion substrate 30 may include light-transmitting areas TA1, TA2, and TA3 and a light-shielding area BA. The light-transmitting areas TA1, TA2, and TA3 of the color conversion substrate 30 may correspond to the light-emitting areas LA1, LA2, and LA3 of the display substrate 10. Light emitted from the light-emitting areas LA1, LA2, and LA3 of the display substrate 10 may be provided to the outside of the display device 1 by transmitting through the light-transmitting areas TA1, TA2, and TA3 of the color conversion substrate 30.

[0076] The light-transmitting areas TA1, TA2, and TA3 may include a first light-transmitting area TA1, a second light-transmitting area TA2, and a third light-transmitting area TA3, and the first light-transmitting area TA1, the second light-transmitting area TA2, and the third light-transmitting area TA3 transmit light of different colors from each other. Each of the plurality of light-transmitting areas TA1, TA2, and TA3 may transmit red light, green light, or blue light, and the colors of the light transmitted from the light-transmitting areas TA1, TA2, and TA3 may be different according to the corresponding light-emitting areas LA1, LA2, and LA3. For example, the first light-transmitting area TA1 may correspond to the first light-emitting area LA1 or overlap the first light-emitting area LA1. In some embodiments, the second light-transmitting area TA2 may correspond to the second light-emitting area LA2 or overlap the second light-emitting area LA2, and the third light-transmitting area TA3 may correspond to the third light-emitting area LA3 or overlap the third light-emitting area LA3.

[0077] In some embodiments, when Figure 5 The display substrate 10 and Figure 6 When the color conversion substrates 30 shown in the figure correspond to each other, the first light-transmitting area TA1 and the third light-transmitting area TA3 can be adjacent to each other along the first direction (X-axis direction), and the second light-transmitting area TA2 can be at one side of the first light-transmitting area TA1 and the third light-transmitting area TA3 along the second direction (Y-axis direction).

[0078] In some embodiments, the plane shape of the first light-transmitting area TA1, the second light-transmitting area TA2, and the third light-transmitting area TA3 may be a quadrilateral. For example, the quadrilateral may be a rectangle or a square, but the present disclosure is not limited thereto. The plane shape of each of the first light-transmitting area TA1, the second light-transmitting area TA2, and the third light-transmitting area TA3 may have a circular shape, an elliptical shape, a diamond shape, or other suitable polygonal shapes.

[0079] The light-shielding area BA may be an area in which light emitted from the display substrate 10 is not transmitted. The light-shielding area BA may surround the light-transmitting areas TA1, TA2, and TA3.

[0080] Figure 7 It is shown along Figure 6 A cross-sectional view of a display device 1 according to an embodiment taken along line X1 - X1 ′ of FIG. 1 . The display substrate 10 and the color conversion substrate 30 may face each other with the filler 70 therebetween.

[0081] Reference Figure 7 , the display substrate 10 may include a first substrate 110 , a thin film transistor layer 130 , a display element layer 150 , a thin film encapsulation layer 170 , a light controller 200 , and a bank pattern 290 .

[0082] The thin film transistor layer 130 may be on the first substrate 110. The thin film transistor layer 130 may include a buffer layer 115, an insulating layer 125 (eg, an electrical insulating layer 125), transistors T1, T2, and T3, and a via layer 135.

[0083] The buffer layer 115 may be on the first substrate 110. The buffer layer 115 may block or reduce the penetration of particles and / or moisture through the first substrate 110. The buffer layer 115 may include an inorganic material. For example, the buffer layer 115 may include silicon oxide (SiO x ), Silicon Nitride (SiN x ) and at least one of silicon oxynitride (SiON). The buffer layer 115 may be formed of a single layer or multiple layers. In some embodiments, a plurality of signal lines (e.g., gate lines, data lines, power lines, etc.) for transmitting signals to the transistors T1, T2, and T3 may be further on the buffer layer 115.

[0084] The insulating layer 125 may be on the buffer layer 115 and the signal line. The insulating layer 125 may protect the plurality of signal lines. The insulating layer 125 may include an inorganic material, and may include, for example, silicon oxide (SiO x ), Silicon Nitride (SiN x ) and / or silicon oxynitride (SiON). The insulating layer 125 may be formed of a single layer or a multi-layer.

[0085] The transistor T1, the transistor T2, and the transistor T3 may be on the insulating layer 125. Each of the transistors T1, T2, and T3 included in the present embodiment may be a thin film transistor. The transistors T1, T2, and T3 may overlap with the light emitting regions LA1, LA2, and LA3, respectively. For example, the first transistor T1 may overlap with the first light emitting region LA1, the second transistor T2 may overlap with the second light emitting region LA2, and the third transistor T3 may overlap with the third light emitting region LA3. Although the first transistor T1, the second transistor T2, and the third transistor T3 are shown in the drawings to overlap with the light emitting regions LA1, LA2, and LA3 but not with the non-light emitting region NLA, this is only an example, and the present disclosure is not limited thereto. In some embodiments, at least one of the first transistor T1, the second transistor T2, and the third transistor T3 may overlap with the non-light emitting region NLA. In some embodiments, all of the first transistor T1, the second transistor T2, and the third transistor T3 may overlap with the non-light emitting region NLA, but may not overlap with the light emitting regions LA1, LA2, and LA3.

[0086] The via layer 135 may cover the transistors T1, T2, and T3. The via layer 135 may be a planarization layer for planarizing the upper surfaces of the transistors T1, T2, and T3. In some embodiments, the via layer 135 may include an organic material. For example, the via layer 135 may include an acryl resin, an epoxy resin, an imide resin, and / or an ester resin, etc. In some embodiments, the via layer 135 may include a photosensitive organic material.

[0087] The display element layer 150 may be on the via layer 135. The display element layer 150 may include light emitting elements ED1, ED2, and ED3 and a pixel defining layer 151. The light emitting elements ED1, ED2, and ED3 may include pixel electrodes AE1, AE2, and AE3, a light emitting layer OL, and a common electrode CE.

[0088] The pixel electrodes AE1, AE2, and AE3 may be on the via layer 135. The pixel electrodes AE1, AE2, and AE3 may be in different light emitting areas LA1, LA2, and LA3, respectively, to emit lights of different colors from each other. The pixel electrodes AE1, AE2, and AE3 may include a first pixel electrode AE1, a second pixel electrode AE2, and a third pixel electrode AE3 overlapping the light emitting areas LA1, LA2, and LA3, respectively. A portion of the pixel electrodes AE1, AE2, and AE3 overlapping the light emitting areas LA1, LA2, and LA3, respectively, may extend to the non-light emitting area NLA.

[0089] The pixel electrodes AE1, AE2, and AE3 may be electrically connected to the transistors T1, T2, and T3 by passing through the via layer 135. The pixel electrodes AE1, AE2, and AE3 may include a conductive metal. For example, the pixel electrodes AE1, AE2, and AE3 may have a material layer having a high work function (such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and / or indium oxide (In 2 O 3 )) and / or a stacked layer structure of a reflective material layer (such as Ag, Mg, Al, Pt, Pb, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca and / or a mixture thereof). In some embodiments, the pixel electrodes AE1, AE2 and AE3 may have ITO / Mg, ITO / MgF 2 , ITO / Ag and ITO / Ag / ITO multilayer structures, but not limited thereto.

[0090] The pixel defining layer 151 may be on the via layer 135 and the pixel electrodes AE1, AE2, and AE3. The pixel defining layer 151 may overlap the non-light emitting area NLA. The pixel defining layer 151 may define a first opening OP1 for defining the light emitting areas LA1, LA2, and LA3. In some embodiments, the light emitting areas LA1, LA2, and LA3 and the non-light emitting area NLA of the display substrate 10 may be defined by the pixel defining layer 151.

[0091] The pixel defining layer 151 may include an organic insulating material (eg, an organic electrical insulating material) such as polyacrylate resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene ether resin, polyphenylene sulfide resin, and / or benzocyclobutene (BCB).

[0092] The light emitting layer OL may be on the pixel electrodes AE1, AE2, and AE3. The light emitting layer OL included in the present embodiment may have a shape of a continuous film formed over the plurality of light emitting areas LA1, LA2, and LA3 and the non-light emitting area NLA.

[0093] The light-emitting layer OL may include a series structure. In some embodiments, the light-emitting layer OL of the display device 1 may include a structure in which a plurality of light-emitting layers are stacked. That is, the light-emitting layer OL according to the embodiment may include a structure in which a plurality of light-emitting organic layers are stacked. The series-type light-emitting layer OL may improve the light efficiency and life characteristics of the display device. For example, the light-emitting layer OL may include a first light-emitting organic layer, a second light-emitting organic layer, and a third light-emitting organic layer stacked in sequence, and the first light-emitting organic layer, the second light-emitting organic layer, and the third light-emitting organic layer may be arranged to overlap each other. For example, the first light-emitting organic layer may emit blue light, the second light-emitting organic layer may emit green light, and the third light-emitting organic layer may emit red light. Therefore, the light-emitting layer OL according to the embodiment may emit white light. However, the number of light-emitting organic layers, the stacking order of the light-emitting organic layers, and the wavelength band of the light-emitting organic layers are not limited thereto.

[0094] The tandem structure of the light emitting layer OL can improve the light efficiency and lifespan characteristics of the display device.

[0095] The common electrode CE may be on the light emitting layer OL. The common electrode CE may have a continuous film shape throughout the plurality of light emitting regions LA1, LA2, and LA3 and the non-light emitting region NLA. The common electrode CE may cover the light emitting layer OL throughout the plurality of light emitting regions LA1, LA2, and LA3 and the non-light emitting region NLA.

[0096] In some embodiments, the common electrode CE may have a semi-transmissive property or a transmissive property. When the common electrode CE has a semi-transmissive property, the common electrode CE may include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti and / or their compounds and / or mixtures (e.g., a mixture of Ag and Mg), or a material having a multilayer structure such as LiF / Ca or LiF / Al. When the common electrode CE has a transmissive property, the common electrode CE may include a transparent conductive oxide (TCO). For example, the common electrode CE may include tungsten oxide (W x O y ), titanium oxide (TiO 2 ), indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO) and / or magnesium oxide (MgO), etc.

[0097] The element covering layer 159 may be on the common electrode CE. The element covering layer 159 may have a shape of a continuous film throughout the plurality of light emitting regions LA1, LA2, and LA3 and the non-light emitting region NLA. The element covering layer 159 may cover the common electrode CE throughout the plurality of light emitting regions LA1, LA2, and LA3 and the non-light emitting region NLA. The element covering layer 159 may prevent or reduce damage to the light emitting elements ED1, ED2, and ED3 by external air, and may improve external light emitting efficiency.

[0098] The element cover layer 159 may include an inorganic insulating material (eg, an inorganic electrical insulating material). For example, the element cover layer 159 may include aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ), zinc oxide (ZnO), silicon oxide (SiO 2 ), silicon nitride (Si 3 N 4 ) and at least one of silicon oxycarbide (SiOC).

[0099] The thin film encapsulation layer 170 may be on the element cover layer 159. The thin film encapsulation layer 170 may have a continuous film shape throughout the plurality of light emitting regions LA1, LA2, and LA3 and the non-light emitting region NLA. The thin film encapsulation layer 170 includes at least one inorganic film to prevent or reduce oxygen and / or moisture from penetrating into the display element layer 150. The thin film encapsulation layer 170 includes at least one organic film to protect the display element layer 150 from particles such as dust.

[0100] The thin film encapsulation layer 170 may include a first encapsulation layer 171, a second encapsulation layer 173, and a third encapsulation layer 175 stacked sequentially. The first encapsulation layer 171 and the third encapsulation layer 175 may be inorganic encapsulation layers, and the second encapsulation layer 173 between the first encapsulation layer 171 and the third encapsulation layer 175 may be an organic encapsulation layer.

[0101] Each of the first encapsulation layer 171 and the third encapsulation layer 175 may include one or more inorganic insulating materials (eg, inorganic electrical insulating materials). The inorganic insulating materials may include aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and / or silicon oxynitride.

[0102] The second encapsulation layer 173 may include a polymer material. The polymer material may include an acryl resin, an epoxy resin, a polyimide and / or polyethylene. For example, the second encapsulation layer 173 may include an acryl resin (e.g., polymethyl methacrylate and / or polyacrylic acid, etc.). The second encapsulation layer 173 may be formed by curing a monomer and / or coating a polymer.

[0103] In some embodiments, each of the first encapsulation layer 171 and the third encapsulation layer 175 may be formed of a single layer, but is not limited thereto. At least one of the first encapsulation layer 171 and the third encapsulation layer 175 may have a structure (eg, a multilayer structure) in which a plurality of layers including or made of an inorganic material are stacked.

[0104] The light controller 200 may be on the thin film encapsulation layer 170. The light controller 200 may include a light control layer 200Q, a planarization layer 281, a first capping layer 283, a second capping layer 285, and a bank pattern 290. The light control layer 200Q may include wavelength conversion layers 230 and 250 and a light-transmitting layer 270.

[0105] The wavelength conversion layers 230 and 250 and the light-transmitting layer 270 included in the light-controlling layer 200Q may be on the third encapsulation layer 175. The wavelength conversion layers 230 and 250 may include a first wavelength conversion layer 230 and a second wavelength conversion layer 250. The first wavelength conversion layer 230, the second wavelength conversion layer 250, and the light-transmitting layer 270 may overlap with the light-emitting regions LA1, LA2, and LA3, respectively. For example, the first wavelength conversion layer 230 may overlap with the first light-emitting region LA1, the second wavelength conversion layer 250 may overlap with the second light-emitting region LA2, and the light-transmitting layer 270 may overlap with the third light-emitting region LA3.

[0106] In some embodiments, the first wavelength conversion layer 230 may include a first base resin 231 and a first scatterer 233 (eg, a first light scatterer 233 ) dispersed in the first base resin 231 , and may further include a first wavelength converter 235 dispersed in the first base resin 231 .

[0107] The first base resin 231 may include a material having a high light transmittance or be made of a material having a high light transmittance. In some embodiments, the first base resin 231 may include an organic material or be made of an organic material. For example, the first base resin 231 may include an organic material such as an epoxy resin, an acryl resin, a cardo resin, and / or an imide resin.

[0108] The first scatterer 233 may have a refractive index different from that of the first matrix resin 231, and may form an optical interface with the first matrix resin 231. For example, the first scatterer 233 may be metal oxide particles and / or organic particles. Examples of metal oxides may include titanium oxide (TiO 2 )、ZrO 2 ), aluminum oxide (Al 2 O 3 ), indium oxide (In 2 O 3 ), zinc oxide (ZnO) and / or tin oxide (SnO 2 ), and examples of the organic particulate material may include acryl-based resin and / or urethane-based resin.

[0109] Examples of the first wavelength converter 235 may include quantum dots, quantum rods, and / or phosphors, etc. For example, quantum dots may be particulate materials that emit light of a set or specific color when electrons transition from a conduction band to a valence band. Quantum dots may have a set or specific band gap according to their composition and size, and thus may emit light having a unique wavelength after absorbing light. Examples of semiconductor nanocrystals of quantum dots may include group IV nanocrystals, group II-VI compound nanocrystals, group III-V compound nanocrystals, group IV-VI compound nanocrystals, or combinations thereof.

[0110] The II-VI compound may be selected from the group comprising or consisting of: a binary compound selected from the group consisting of CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, MgSe, MgS and mixtures thereof; a binary compound selected from the group consisting of InZnP, AgInS, CuInS, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, C CdHgSeS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, MgZnSe, MgZnS and mixtures thereof; and a four-element compound selected from the group consisting of HgZnTeS, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, HgZnSTe and mixtures thereof.

[0111] The III-V compounds can be selected from a group including or consisting of: a binary compound selected from the group consisting of GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN, InP, InAs, InSb and mixtures thereof; a ternary compound selected from the group consisting of GaNP, GaNAs, GaNSb, GaPAs, GaPSb, AlNP, AlNAs, AlNSb, AlPAs, AlPSb, InGaP, InNP, InAlP, InNAs, InNSb, InPAs, InPSb and mixtures thereof; and a quaternary compound selected from the group consisting of GaAlNP, GaAlNAs, GaAlNSb, GaAlPAs, GaAlPSb, GaInNP, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNP, InAlNAs, InAlNSb, InAlPAs, InAlPSb and mixtures thereof.

[0112] The IV-VI compound may be selected from a group comprising or consisting of a binary compound selected from the group consisting of SnS, SnSe, SnTe, PbS, PbSe, PbTe and mixtures thereof; a ternary compound selected from the group consisting of SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, SnPbTe and mixtures thereof; and a quaternary compound selected from the group consisting of SnPbSSe, SnPbSeTe, SnPbSTe and mixtures thereof. The IV group element may be selected from the group consisting of Si, Ge and mixtures thereof. The IV group compound may be a binary compound selected from the group consisting of SiC, SiGe and mixtures thereof.

[0113] At this time, the two-element compound, the three-element compound or the four-element compound can be present in the particle with a uniform (e.g., substantially uniform) concentration, or can be present in the same particle by being divided into a state with a partially different concentration distribution. In addition, the two-element compound, the three-element compound or the four-element compound can have a core / shell structure in which one quantum dot surrounds another quantum dot. The interface of the core and the shell can have a concentration gradient in which the concentration of the element present in the shell decreases along the direction toward the center of the core.

[0114] In some embodiments, the quantum dot may have a core-shell structure including a core having the above-mentioned nanocrystal and a shell surrounding the core. The shell of the quantum dot may be used as a passivation layer for maintaining semiconductor properties by preventing or reducing the occurrence of chemical denaturation of the core, and may also be used as a charged layer for imparting electrophoretic properties to the quantum dot. The shell may be a single layer or multiple layers. Examples of the shell of the quantum dot may include metal and / or non-metal oxides, semiconductor compounds, or combinations thereof.

[0115] For example, examples of oxides of metals and / or non-metals may include binary compounds (such as SiO 2 、Al 2 O 3 、TiO 2 、ZnO、MnO、Mn 2 O 3 , Mn 3 O 4 , CuO, FeO, Fe 2 O 3 , Fe 3 O 4 , CoO, Co 3 O 4 and / or NiO) or ternary compounds (such as MgAl 2 O 4 、CoFe 2 O 4 、NiFe2 O 4 and / or CoMn 2 O 4 ), but the present disclosure is not limited thereto.

[0116] In addition, examples of semiconductor compounds may include CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnSeS, ZnTeS, GaAs, GaP, GaSb, HgS, HgSe, HgTe, InAs, InP, InGaP, InSb, AlAs, AlP and / or AlSb, but the present disclosure is not limited thereto.

[0117] The light emitted by the first wavelength converter 235 may have a full width at half maximum (FWHM) of 45 nm or less, or 40 nm or less, or 30 nm or less, and the color purity and color reproducibility of the color displayed by the display device 1 may be further improved. In addition, the light emitted from the first wavelength converter 235 may be emitted toward various suitable directions regardless of the incident direction of the incident light. Therefore, the lateral visibility of the light displayed in the first light emitting area LA1 may be improved.

[0118] In some embodiments, the second wavelength conversion layer 250 may include a second base resin 251 and a second scatterer 253 (eg, a second light scatterer 253 ) dispersed in the second base resin 251 , and may further include a second wavelength converter 255 dispersed in the second base resin 251 .

[0119] The second base resin 251 may include a material having a high light transmittance or be made of a material having a high light transmittance. In some embodiments, the second base resin 251 may include an organic material or be made of an organic material. For example, the first base resin 231 may include an organic material such as an epoxy resin, an acryl resin, a cardo resin, and / or an imide resin.

[0120] The second scatterer 253 has a refractive index different from that of the second matrix resin 251 and may form an optical interface with the second matrix resin 251. For example, the second scatterer 253 may be light scattering particles. The detailed description of the second scatterer 253 is substantially the same or similar to that of the first scatterer 233, and thus its repeated description is not repeated here.

[0121] Examples of the second wavelength converter 255 include quantum dots, quantum rods, and / or phosphors. A more detailed description of the second wavelength converter 255 is substantially the same as or similar to the description of the first wavelength converter 235, and thus its repeated description will not be repeated here.

[0122] In some embodiments, both the first wavelength converter 235 and the second wavelength converter 255 may include or be made of quantum dots. In this case, the particle size of the quantum dots constituting the second wavelength converter 255 may be smaller than the particle size of the quantum dots constituting the first wavelength converter 235.

[0123] The light-transmitting layer 270 may include a third matrix resin 271 and a third scatterer 273 (e.g., a third light scatterer 273) in the third matrix resin 271. The light-transmitting layer 270 may not include a wavelength conversion material. The third scatterer 273 has a refractive index different from that of the third matrix resin 271 and may form an optical interface with the third matrix resin 271. For example, the third scatterer 273 may be a light scattering particle. The detailed description of the third scatterer 273 is substantially the same or similar to the detailed description of the first scatterer 233, and therefore its repeated description is not repeated here.

[0124] The planarization layer 281 may be located on the thin film encapsulation layer 170 by overlapping the non-emission area NLA. The planarization layer 281 may be disposed between the wavelength conversion layers 230 and 250 and the light-transmitting layer 270 and the thin film encapsulation layer 170 by overlapping the emission areas LA1, LA2, and LA3.

[0125] The planarization layer 281 may include an organic material. The planarization layer 281 may include all organic materials that do not affect the life of the wavelength conversion layers 230 and 250 and the light-transmitting layer 270. For example, the planarization layer 281 may include acrylate and the same material as the first to third base resins 231, 251, and 271, but is not limited thereto.

[0126] The first capping layer 283 may cover the wavelength conversion layers 230 and 250, the light-transmitting layer 270, and the planarization layer 281. The first capping layer 283 may extend to overlap the light emitting areas LA1, LA2, and LA3 and the non-light emitting area NLA.

[0127] The first cover layer 283 may prevent or reduce damage to the wavelength conversion layers 230 and 250 and the light-transmitting layer 270 due to penetration of impurities such as external moisture and / or air.

[0128] The first cover layer 283 may include or be made of an inorganic material. For example, the first cover layer 283 may include silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, and / or silicon oxynitride.

[0129] The second capping layer 285 may be on the first capping layer 283. The second capping layer 285 may be between the first capping layer 283 and the bank pattern 290 by overlapping with the bank pattern 290 which will be further described below.

[0130] The second capping layer 285 may include a reflective function. The second capping layer 285 may prevent or reduce the loss of light passing through the wavelength conversion layers 230 and 250 and the light-transmitting layer 270 , which would otherwise be lost due to absorption into the bank pattern 290 .

[0131] The second capping layer 285 may be a metal layer. For example, the second capping layer 285 may include at least one of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, and Cr.

[0132] The bank pattern 290 may be on the second cover layer 285. The bank pattern 290 may overlap the non-emission area NLA of the display substrate 10 and the light blocking area BA of the color conversion substrate 30. The bank pattern 290 may define a second opening OP2 overlapping the emission areas LA1, LA2, and LA3. Figure 7 As shown in FIG. 1 , the dam pattern 290 may have an inverted tapered shape having a width toward the lower surface of the first substrate 110 smaller than a width toward the upper surface of the second substrate 310. The width of the second opening OP2 defined by the dam pattern 290 in a direction parallel to the first substrate 110 may be smaller than the width of the first opening OP1 defined by the pixel defining layer 151. In some embodiments, the second opening OP2 may be within the first opening OP1.

[0133] The bank pattern 290 may perform a light absorption function. The bank pattern 290 may prevent or reduce a color mixing defect of the display device 1 that may be caused by light passing through the wavelength conversion layers 230 and 250 and the light-transmitting layer 270 being emitted to the non-emission area NLA.

[0134] The bank pattern 290 may include a light absorbing material. For example, the bank pattern 290 may include an inorganic black pigment and / or an organic black pigment. The inorganic black pigment may be carbon black, and the organic black pigment may include at least one of lactam black, perylene black, and aniline black, but the present disclosure is not limited thereto.

[0135] Reference Figure 7 , the color conversion substrate 30 may include a second substrate 310 , a plurality of color filter layers 321 , 323 , and 325 , and a low refractive index layer 330 .

[0136] The second substrate 310 may be spaced apart from the first substrate 110 and face the first substrate 110. The second substrate 310 may include a light-transmitting material or be made of a light-transmitting material. The second substrate 310 may include a glass substrate or a plastic substrate. In some embodiments, the second substrate 310 may also include a separate layer (e.g., an insulating layer such as an inorganic layer (e.g., an electrical insulating layer)) on a glass substrate and / or a plastic substrate. The second substrate 310 may include a plurality of light-transmitting regions TA1, TA2, and TA3 and a light-shielding region BA.

[0137] The plurality of light-transmitting areas TA1, TA2, and TA3 may overlap the light-emitting areas LA1, LA2, and LA3 of the display substrate 10. For example, the first light-transmitting area TA1 may overlap the first light-emitting area LA1, the second light-transmitting area TA2 may overlap the second light-emitting area LA2, and the third light-transmitting area TA3 may overlap the third light-emitting area LA3. The light-shielding area BA of the color conversion substrate 30 may overlap the non-light-emitting area NLA of the display substrate 10.

[0138] A plurality of color filter layers 321, 323, and 325 may be on one surface of the second substrate 310. Each of the plurality of color filter layers 321, 323, and 325 may be disposed on one surface of the second substrate 310 toward the display substrate 10. The color filter layers 321, 323, and 325 may include a first color filter layer 321, a second color filter layer 323, and a third color filter layer 325 respectively overlapping the light-transmitting areas TA1, TA2, and TA3.

[0139] A plurality of color filter layers 321, 323, and 325 may include a colorant (such as a dye and / or a pigment) that absorbs light of a wavelength band other than a set or specific wavelength band. The color filter layers 321, 323, and 325 may be in the light-transmitting areas TA1, TA2, and TA3, respectively, to transmit only a portion of the light incident to the color filter layers 321, 323, and 325 from the corresponding light-transmitting areas TA1, TA2, and TA3. Therefore, only the light transmitted by the color filter layers 321, 323, and 325 can be selectively emitted from the light-transmitting areas TA1, TA2, and TA3. In an embodiment, the first color filter layer 321 may be a red color filter layer, the second color filter layer 323 may be a green color filter layer, and the third color filter layer 325 may be a blue color filter layer. Light emitted from the plurality of light emitting elements ED1 , ED2 , and ED3 may be emitted to the outside of the display device 1 through the color filter layers 321 , 323 , and 325 by passing through the wavelength conversion layers 230 and 250 and the light-transmitting layer 270 .

[0140] The color conversion substrate 30 may include color patterns 321a, 323a, and 325a by overlapping with the light shielding area BA. The color patterns 321a, 323a, and 325a may be stacked in the order of a second color filter 323a, a first color filter 321a, and a third color filter 325a in a direction toward the display substrate 10. The color patterns 321a, 323a, and 325a may absorb external light by overlapping with the light shielding area BA, thereby reducing color distortion caused by reflection of external light. The color patterns 321a, 323a, and 325a may have a structure in which red, green, and blue color filter layers 321, 323, and 325 are stacked.

[0141] In some embodiments, a light shielding member having a light shielding function may be used instead of the color patterns 321a, 323a, and 325a. For example, the light shielding member includes or is made of a material used as a black matrix and can absorb all (or substantially all) visible light wavelengths.

[0142] The low refractive index layer 330 may be on the plurality of color filter layers 321, 323, and 325 and the color patterns 321a, 323a, and 325a in a direction toward the display substrate 10. The low refractive index layer 330 may prevent or reduce damage or contamination to the color filter layers 321, 323, and 325 due to penetration of impurities such as external moisture and / or air. In some embodiments, the low refractive index layer 330 may improve the light efficiency of the display device 1. In more detail, the low refractive index layer 330 may include a refractive index lower than that of each of the wavelength conversion layers 230 and 250 and the light-transmitting layer 270, thereby allowing light from the light-emitting areas LA1, LA2, and LA3 of the display substrate 10 that pass through the wavelength conversion layers 230 and 250 and the light-transmitting layer 270 to pass through the color filter layers 321, 323, and 325 without loss.

[0143] As described above, the display substrate 10 and the color conversion substrate 30 may face each other with the filler 70 between the display substrate 10 and the color conversion substrate 30. The filler 70 may be located between the low refractive index layer 330 and the bank pattern 290 by overlapping the non-light emitting area NLA and the light shielding area BA, and may be located between the low refractive index layer 330 and the first cover layer 283 by overlapping the light emitting areas LA1, LA2, and LA3 and the light transmitting areas TA1, TA2, and TA3.

[0144] Figure 8 It is shown Figure 7 An enlarged cross-sectional view of a portion of the first light emitting area LA1.

[0145] Reference Figure 8, the first wavelength conversion layer 230 of the display device 1 may include a lower surface 230 a , an upper surface 230 b , a side surface 230 c , and an inclined surface 230 s .

[0146] The lower surface 230a of the first wavelength conversion layer 230 may be a surface in contact with (e.g., in direct physical contact with) the third encapsulation layer 175, and the upper surface 230b of the first wavelength conversion layer 230 may be a surface facing the lower surface 230a. In some embodiments, the side surface 230c of the first wavelength conversion layer 230 may be a surface directed toward the bank pattern 290, and the inclined surface 230s of the first wavelength conversion layer 230 may be a surface connecting the lower surface 230a with the side surface 230c.

[0147] The wavelength conversion layers 230 and 250 and the light-transmitting layer 270 of the display device 1 included in the present disclosure can be formed by light processing. In more detail, the wavelength conversion layers 230 and 250 and the light-transmitting layer 270 can be formed by an exposure process and a development process after printing the materials of the wavelength conversion layers 230 and 250 and the light-transmitting layer 270 on the thin film encapsulation layer 170.

[0148] In some embodiments, the wavelength conversion layers 230 and 250 and the light-transmitting layer 270 may be exposed to overdevelopment caused by a manufacturing process. A portion of one surface of the wavelength conversion layers 230 and 250 and the light-transmitting layer 270 exposed to overdevelopment and directed toward the thin film encapsulation layer 170 may be lost.

[0149] The inclined surface 230s of the first wavelength conversion layer 230 may be formed by overdevelopment in the manufacturing process as described above. The inclined surface 230s of the first wavelength conversion layer 230 may be recessed inward from the side surface 230c of the first wavelength conversion layer 230. Figure 8 As shown in , an undercut UC may be formed under the inclined surface 230s of the first wavelength conversion layer 230. An inclined angle θ1 formed by the third encapsulation layer 175 and the inclined surface 230s of the first wavelength conversion layer 230 in a direction toward the non-light emitting area NLA may be an acute angle.

[0150] In some embodiments, all structures overlapping the light emitting areas LA1, LA2, and LA3 and the light transmitting areas TA1, TA2, and TA3 of the display device 1 may overlap the inclined surface 230s of the first wavelength conversion layer 230. For example, the pixel electrodes AE1, AE2, and AE3, the light emitting layer OL, the common electrode CE, the thin film encapsulation layer 170, the filler 70, and the color filter layer 320 overlapping the light emitting areas LA1, LA2, and LA3 and the light transmitting areas TA1, TA2, and TA3 may overlap the inclined surface 230s of the first wavelength conversion layer 230.

[0151] In some embodiments, the planarization layer 281 of the display device 1 may include a first portion 281 a and a second portion 281 b .

[0152] The first portion 281a of the planarization layer 281 may overlap the first light emitting region LA1. The first portion 281a of the planarization layer 281 may be between the third encapsulation layer 175 and the inclined surface 230s of the first wavelength conversion layer 230. The first portion 281a of the planarization layer 281 may be in contact with (e.g., in direct physical contact with) the third encapsulation layer 175 overlapping the first light emitting region LA1, and may be in contact with (e.g., in direct physical contact with) the inclined surface 230s of the first wavelength conversion layer 230.

[0153] The first portion 281a of the planarization layer 281 may completely fill the undercut UC of the first wavelength conversion layer 230. The first portion 281a of the planarization layer 281 may planarize the undercut UC.

[0154] In some embodiments, when the undercut UC of the first wavelength conversion layer 230 is exposed without being covered by the planarization layer 281, a portion of the undercut UC may not be covered by the first cover layer 283. This may be caused because the undercut UC has a large curve and a deep shape. The portion of the undercut UC that is not covered by the first cover layer 283 may be a path through which the exhaust gas of the bank pattern 290 penetrates. As a result, the color efficiency of the first wavelength conversion layer 230 may be reduced.

[0155] The first portion 281 a of the planarization layer 281 included in the present disclosure may fill the undercut UC of the first wavelength conversion layer 230 , thereby facilitating the first capping layer 283 to completely cover the first wavelength conversion layer 230 without an exposed portion.

[0156] The second portion 281b of the planarization layer 281 may overlap the non-emission area NLA. The second portion 281b of the planarization layer 281 may extend from the first portion 281a of the planarization layer 281. The second portion 281b of the planarization layer 281 may cover the third encapsulation layer 175 overlapping the non-emission area NLA and contact (e.g., directly physically contact) the third encapsulation layer 175.

[0157] As described above, the planarization layer 281 may include all organic materials that do not affect the life of the wavelength conversion layers 230 and 250 and the light-transmitting layer 270. For example, the planarization layer 281 may include both a photocurable organic material and a thermosetting organic material. The refractive index of the planarization layer 281 including the organic material may have a value of 1.5 or less at a wavelength range from 380 nm to 680 nm.

[0158] In some embodiments, the planarization layer 281 may include the same material as the first to third scatterers 233, 253, and 273 (eg, the first to third light scatterers 233, 253, and 273). 2 )、ZrO 2 ), aluminum oxide (Al 2 O 3 ), indium oxide (In 2 O 3 ), zinc oxide (ZnO) and / or tin oxide (SnO 2 ) may be an example of a material of the first to third scatterers 233, 253, and 273, and acryl-based resin and / or urethane-based resin may be an example of a material of the organic particulate material.

[0159] In some embodiments, all structures overlapping the light emitting areas LA1, LA2, and LA3 and the light transmitting areas TA1, TA2, and TA3 of the display device 1 may overlap the first portion 281a of the planarization layer 281. Therefore, a repeated description thereof will not be repeated here.

[0160] Fig. 9 It is shown Figure 7 An enlarged cross-sectional view of portion 'T1'.

[0161] Reference Fig. 9 , the second wavelength conversion layer 250 overlapping the second light emitting area LA2 may include a lower surface 250a, an upper surface 250b, a side surface 250c, and an inclined surface 250s.

[0162] The lower surface 250a of the second wavelength conversion layer 250 may be a surface in contact with (e.g., in direct physical contact with) the third encapsulation layer 175, and the upper surface 250b of the second wavelength conversion layer 250 may be a surface facing the lower surface 250a. In some embodiments, the side surface 250c of the second wavelength conversion layer 250 may be a surface directed toward the bank pattern 290, and the inclined surface 250s of the second wavelength conversion layer 250 may be a surface connecting the lower surface 250a with the side surface 250c.

[0163] As described above, the inclined surface 250s of the second wavelength conversion layer 250 may be formed due to overdevelopment in the manufacturing process of the display device 1. Therefore, an undercut UC may be formed below the inclined surface 250s of the second wavelength conversion layer 250. The inclined angle θ2 formed by the third encapsulation layer 175 and the inclined surface 250s of the second wavelength conversion layer 250 in the direction toward the non-light emitting area NLA may be an acute angle.

[0164] In some embodiments, the planarization layer 281 included in the present embodiment may include a third portion 281c overlapping the second light emitting region LA2. The third portion 281c of the planarization layer 281 may overlap the second light emitting region LA2. The third portion 281c of the planarization layer 281 may be between the third encapsulation layer 175 and the inclined surface 250s of the second wavelength conversion layer 250. The third portion 281c of the planarization layer 281 may fill the undercut UC of the second wavelength conversion layer 250. The third portion 281c of the planarization layer 281 may planarize the undercut UC.

[0165] In some embodiments, the third portion 281c of the planarization layer 281 may extend to the first portion 281a and the second portion 281b of the planarization layer 281. The second portion 281b of the planarization layer 281 may be between the first portion 281a and the third portion 281c. The first portion 281a, the second portion 281b, and the third portion 281c of the planarization layer 281 included in the display device 1 may be integrally formed.

[0166] The first cover layer 283 may be on the first wavelength conversion layer 230, the planarization layer 281, and the second wavelength conversion layer 250. The first cover layer 283 may be in contact with (e.g., in direct physical contact with) the first wavelength conversion layer 230, the planarization layer 281, and the second wavelength conversion layer 250. In more detail, the first cover layer 283 may be in contact with (e.g., in direct physical contact with) the upper surface 230b and the side surface 230c of the first wavelength conversion layer 230, and extend to the upper surface of the planarization layer 281 as an extension thereof. In some embodiments, the first cover layer 283 may extend to the side surface 250c and the upper surface 250b of the second wavelength conversion layer 250.

[0167] In some embodiments, the first covering layer 283 may overlap the inclined surface 230s of the first wavelength conversion layer 230 and the inclined surface 250s of the second wavelength conversion layer 250, but the first covering layer 283 may not be in contact with the inclined surface 230s of the first wavelength conversion layer 230 and the inclined surface 250s of the second wavelength conversion layer 250 (for example, may not be in direct physical contact with the inclined surface 230s of the first wavelength conversion layer 230 and the inclined surface 250s of the second wavelength conversion layer 250).

[0168] The second capping layer 285 may be on an upper surface of the first capping layer 283. The second capping layer 285 may cover the first capping layer 283 and expose a portion of the first capping layer 283 in the second opening OP2. The second capping layer 285 may be located between the first capping layer 283 and the bank pattern 290 by overlapping the non-emission area NLA between the first and second emission areas LA1 and LA2.

[0169] An upper surface of the first capping layer 283 partially exposed by the second capping layer 285 in the second opening OP2 and an upper surface of the bank pattern 290 may be covered by the filler 70. An upper surface of the first capping layer 283 partially exposed by the second capping layer 285 in the second opening OP2 and an upper surface of the bank pattern 290 may be in contact with (e.g., in direct physical contact with) the filler 70.

[0170] Although the first wavelength conversion layer 230 and the second wavelength conversion layer 250 are shown for ease of description, the light-transmitting layer 270 of the display device 1 may include structural features that are the same as those of the first wavelength conversion layer 230 and the second wavelength conversion layer 250. In more detail, due to overdevelopment in the manufacturing process, one surface of the light-transmitting layer 270 facing the third encapsulation layer 175 may be partially lost. As a result, one surface of the light-transmitting layer 270 may form an inclined surface having a shape similar to that of the first wavelength conversion layer 230 and the second wavelength conversion layer 250. Therefore, an undercut UC may be formed under the inclined surface of the light-transmitting layer 270. The inclined angle formed by the inclined surface included in the light-transmitting layer 270 of the display device 1 and the third encapsulation layer 175 may be an acute angle. The undercut UC of the light-transmitting layer 270 may be covered by the planarization layer 281.

[0171] Fig.10 It is shown Figure 7 Schematic plan view of the arrangement of the light control layer 200Q and the planarization layer 281.

[0172] Reference Fig.10 , on a plane, the planarization layer 281 may surround the light control layer 200Q by overlapping the light emitting regions LA1, LA2, and LA3. In more detail, the first portion 281a of the planarization layer 281 may surround the first wavelength conversion layer 230 by overlapping the first light emitting region LA1. In some embodiments, the third portion 281c of the planarization layer 281 may surround the second wavelength conversion layer 250 by overlapping the second light emitting region LA2.

[0173] As described above, in cross section, the light control layer 200Q of the display device 1 includes an inclined surface that is recessed toward the inside thereof on one surface facing the thin film encapsulation layer 170, so that the first portion 281a and the third portion 281c of the planarization layer 281 may overlap the light control layer 200Q in the third direction (Z-axis direction). In this case, in a plane, the first portion 281a and the third portion 281c of the planarization layer 281 may surround the light control layer 200Q in the light emitting areas LA1, LA2, and LA3.

[0174] On a plane, the planarization layer 281 may surround the light-emitting regions LA1, LA2, and LA3 by overlapping the non-light-emitting region NLA. In more detail, the second portion 281b of the planarization layer 281 may surround the light-emitting regions LA1, LA2, and LA3 by overlapping the non-light-emitting region NLA. On a plane, the non-light-emitting region NLA of the display device 1 may be entirely covered by the second portion 281b of the planarization layer 281.

[0175] Fig.11 FIG. 1 is a diagram showing a display device 3 according to another embodiment. Figure 6 A cross-sectional view taken along line X1-X1'. Fig.12 It is shown Fig.11 An enlarged cross-sectional view of portion 'T3'.

[0176] The light control layer 200Q of the display device 3 may have the same shape as that of the light control layer 200Q of the display device 1. Hereinafter, a repeated description thereof will not be repeated here.

[0177] Reference Figure 11 to Figure 12 , the planarization layer 281 of the display device 3 may include a first portion 281a overlapping the first light emitting area LA1 and a third portion 281c overlapping the second light emitting area LA2. As described above, the first portion 281a of the planarization layer 281 may contact (e.g., directly physically contact) the inclined surface 230s of the first wavelength conversion layer 230, and may planarize the undercut UC of the lower end of the first wavelength conversion layer 230. In some embodiments, the third portion 281c of the planarization layer 281 may contact (directly physically contact) the inclined surface 250s of the second wavelength conversion layer 250, and may planarize the undercut UC of the lower end of the second wavelength conversion layer 250. The inclination angle θ1 formed by the third encapsulation layer 175 and the inclined surface 230s of the first wavelength conversion layer 230 and the inclination angle θ2 formed by the third encapsulation layer 175 and the inclined surface 250s of the second wavelength conversion layer 250 may be acute angles.

[0178] The present embodiment is different from the other embodiments in that the second portion 281b of the planarization layer 281 included in the display device 3 includes a first sub-portion b1 and a second sub-portion b2. The first sub-portion b1 of the planarization layer 281 may extend from a first portion 281a of the planarization layer 281 overlapping the first light emitting area LA1, and the second sub-portion b2 of the planarization layer 281 may extend from a third portion 281c of the planarization layer 281 overlapping the second light emitting area LA2. The first sub-portion b1 and the second sub-portion b2 of the planarization layer 281 may be spaced apart from each other while partially exposing the third encapsulation layer 175 by partially overlapping the non-light emitting area NLA.

[0179] The first covering layer 283 of the display device 3 may contact (e.g., directly physically contact) the first subportion b1 and the second subportion b2 of the planarization layer 281 by overlapping the non-emission area NLA. The first covering layer 283 of the display device 3 may cover the first subportion b1 and the second subportion b2 of the planarization layer 281 by overlapping the non-emission area NLA. In a portion where the first subportion b1 and the second subportion b2 of the planarization layer 281 are spaced apart from each other, the first covering layer 283 may partially contact (e.g., directly physically contact) the third encapsulation layer 175.

[0180] The second cover layer 285 of the display device 3 may cover the first cover layer 283 by overlapping the non-emission area NLA. Therefore, the first cover layer 283 may be between the third encapsulation layer 175 and the second cover layer 285 in a portion where the first and second subparts b1 and b2 of the planarization layer 281 are spaced apart from each other.

[0181] The embankment pattern 290 of the display device 3 may be located on the second cover layer 285 in a portion where the first sub-portion b1 and the second sub-portion b2 of the planarization layer 281 are spaced apart from each other. The embankment pattern 290 may partially fill a spaced portion between the first sub-portion b1 and the second sub-portion b2. Therefore, the embankment pattern 290 may have a shape protruding toward the display substrate 10 by overlapping the non-light emitting area NLA. A protruding portion of the embankment pattern 290 may fill a spaced portion between the first sub-portion b1 and the second sub-portion b2. A repeated description thereof will not be repeated here.

[0182] Fig.13 It is shown Fig.11 Schematic plan view of the arrangement of the light control layer 200Q and the planarization layer 281.

[0183] Reference Fig.13 , on a plane, the planarization layer 281 of the display device 3 may surround the light control layer 200Q by overlapping the light emitting areas LA1, LA2, and LA3. In more detail, on a plane, the first portion 281a of the planarization layer 281 may surround the first wavelength conversion layer 230 by overlapping the first light emitting area LA1. In some embodiments, the third portion 281c of the planarization layer 281 may surround the second wavelength conversion layer 250 by overlapping the second light emitting area LA2. The repeated description thereof will not be repeated here.

[0184] On a plane, the planarization layer 281 of the display device 3 may surround the light-emitting regions LA1, LA2, and LA3 by overlapping the non-light-emitting region NLA. In some embodiments, the planarization layer 281 of the display device 3 overlapping the non-light-emitting region NLA may be surrounded by the embankment pattern 290. In more detail, by overlapping the non-light-emitting region NLA, the first sub-portion b1 of the planarization layer 281 may surround the first light-emitting region LA1 by overlapping the non-light-emitting region NLA, and the second sub-portion b2 of the planarization layer 281 may surround the second light-emitting region LA2. The first sub-portion b1 and the second sub-portion b2 of the second portion 281b may be surrounded by the embankment pattern 290 by overlapping the non-light-emitting region NLA.

[0185] Although the first wavelength conversion layer 230 and the second wavelength conversion layer 250 of the display device 3 are shown for ease of description, the light-transmitting layer 270 overlapped with the third light-emitting area LA3 of the display device 3 may also have the same structure as those of the wavelength conversion layers 230 and 250 .

[0186] Fig.14 It is shown along Figure 6 A cross-sectional view of a display device 5 according to another embodiment is taken along line X1 - X1 ′. Fig.15 It is shown Fig.14 An enlarged cross-sectional view of portion 'T5'.

[0187] Reference Figure 14 to Figure 15 , the first wavelength conversion layer 230 of the display device 5 may include a lower surface 230a, an upper surface 230b, a side surface 230c, and an inclined surface 230s. The lower surface 230a of the first wavelength conversion layer 230 may be a surface in contact with (e.g., in direct physical contact with) the third encapsulation layer 175, and the upper surface 230b of the first wavelength conversion layer 230 may be a surface facing the lower surface 230a. In some embodiments, the side surface 230c of the first wavelength conversion layer 230 may be a surface directed to the dam pattern 290, and the inclined surface 230s of the first wavelength conversion layer 230 may be a surface connecting the lower surface 230a with the side surface 230c. The inclined angle θ1 formed by the inclined surface 230s of the first wavelength conversion layer 230 and the third encapsulation layer 175 may be an acute angle.

[0188] In some embodiments, the second wavelength conversion layer 250 of the display device 5 may include a lower surface 250a, an upper surface 250b, and a side surface 250c. The lower surface 250a of the second wavelength conversion layer 250 may be a surface in contact with (e.g., in direct physical contact with) the third encapsulation layer 175, and the upper surface 250b of the second wavelength conversion layer 250 may be a surface facing the lower surface 250a. In some embodiments, the side 250c of the second wavelength conversion layer 250 may be a surface directed toward the bank pattern 290. The side 250c of the second wavelength conversion layer 250 may be an inclined surface. Therefore, the side 250c of the second wavelength conversion layer 250 and the third encapsulation layer 175 may form an inclined angle. The inclined angle θ3 formed by the side 250c of the second wavelength conversion layer 250 and the third encapsulation layer 175 in the direction toward the non-light emitting area NLA may be an obtuse angle. This embodiment is different from other embodiments in that the inclined surface of the second wavelength conversion layer 250 included in the display device 5 is formed at an obtuse angle with the third encapsulation layer 175.

[0189] The planarization layer 281 of the display device 5 may include a first portion 281a overlapping the first light emitting area LA1 and a second portion 281b overlapping the non-light emitting area NLA. The second portion 281b overlapping the non-light emitting area NLA may extend from the first portion 281a of the planarization layer 281 overlapping the first light emitting area LA1.

[0190] In some embodiments, the planarization layer 281 of the display device 5 may include a third portion 281c overlapping the second light emitting area LA2, but the present disclosure is not limited thereto. Depending on the shape of the second wavelength conversion layer 250 overlapping the second light emitting area LA2, the planarization layer 281 of the display device 5 may not overlap the second light emitting area LA2. In some embodiments, the planarization layer 281 of the display device 5 may overlap the first light emitting area LA1, the non-light emitting area NLA, and the second light emitting area LA2, or in some embodiments, the planarization layer 281 of the display device 5 may overlap only the first light emitting area LA1 and the non-light emitting area NLA.

[0191] like Fig.14 As shown in , the light-transmitting layer 270 of the display device 5 may include the same structure and features as those of the second wavelength conversion layer 250 of the display device 5. In some embodiments, the light-transmitting layer 270 of the display device 5 may include a side directed toward the dam pattern 290, and an inclination angle formed by the side of the light-transmitting layer 270 directed toward the dam pattern 290 and the third encapsulation layer 175 in a direction toward the non-light-emitting area NLA may be an obtuse angle.

[0192] Fig.16 It is shown Fig.14Schematic plan view of the arrangement of the light control layer 200Q and the planarization layer 281.

[0193] Reference Fig.16 , on a plane, the planarization layer 281 of the display device 5 may surround the light control layer 200Q by overlapping with the light emitting areas LA1, LA2, and LA3. In more detail, the first portion 281a of the planarization layer 281 may surround the first wavelength conversion layer 230 by overlapping with the first light emitting area LA1. The first portion 281a of the planarization layer 281 and the first wavelength conversion layer 230 may overlap each other in the third direction (Z-axis direction) in the first light emitting area LA1. In some embodiments, the third portion 281c of the planarization layer 281 may surround the second wavelength conversion layer 250 by overlapping with the second light emitting area LA2.

[0194] A width W1 of a first portion 281 a of the planarization layer 281 surrounding the first wavelength conversion layer 230 in the first light emitting area LA1 may be greater than a width W2 of a third portion 281 c of the planarization layer 281 surrounding the second wavelength conversion layer 250 in the second light emitting area LA2.

[0195] On a plane, the planarization layer 281 of the display device 5 may surround the light emitting areas LA1, LA2, and LA3 by overlapping the non-light emitting area NLA. In more detail, the second portion 281b of the planarization layer 281 may surround the light emitting areas LA1, LA2, and LA3 by overlapping the non-light emitting area NLA. On a plane, the second portion 281b of the planarization layer 281 may entirely cover the non-light emitting area NLA.

[0196] In summarizing the detailed description, it will be appreciated by those skilled in the art that many changes and modifications may be made to the described embodiments without departing substantially from the spirit and scope of the present disclosure. Therefore, the disclosed embodiments of the present disclosure are used in a general and descriptive sense, rather than for the purpose of limitation.

Claims

1. A display device, characterized in that: The display device comprises: A first substrate including a light-emitting region and a non-light-emitting region; a first pixel electrode, in the light emitting area of ​​the first substrate; a pixel defining layer, in the non-light emitting region of the first substrate, and defining a first opening; a thin film encapsulation layer, on the first pixel electrode and the pixel defining layer; a first light control layer, overlapping the light emitting area on the thin film encapsulation layer; a planarization layer on the thin film encapsulation layer; and a bank pattern overlapping the non-light emitting area on the planarization layer and defining a second opening, The first light control layer includes: a first surface pointing to the first pixel electrode; a first side surface pointing to the bank pattern; and a first inclined surface connecting the first surface and the first side surface, and The planarization layer is in contact with the first inclined surface.

2. The display device according to claim 1, characterized in that The first light control layer and the planarization layer are in contact with the thin film encapsulation layer on the thin film encapsulation layer, and An inclination angle formed by the thin film encapsulation layer and the first inclined surface in a direction toward the non-light emitting region is an acute angle.

3. The display device according to claim 2, characterized in that: The planarization layer is located between the thin film encapsulation layer and the first inclined surface by overlapping the light emitting region, The planarization layer completely fills the space between the thin film encapsulation layer and the first inclined surface by overlapping the light emitting area.

4. The display device according to claim 1, characterized in that The display device further includes a second light control layer spaced apart from the first light control layer, and the planarization layer is between the second light control layer and the first light control layer, The second light control layer includes a second inclined surface in contact with the planarization layer.

5. The display device according to claim 4, characterized in that: The planarization layer includes: a first portion in contact with the first inclined surface; a second portion overlapping the non-light emitting region; and a third portion in contact with the second inclined surface, and The second portion is between the first portion and the third portion.

6. The display device according to claim 5, characterized in that: The first portion and the third portion extend from the second portion, and The first portion, the second portion, and the third portion are integrally formed.

7. The display device according to claim 5, characterized in that: The second portion includes: a first sub-portion extending from the first portion; and a second sub-portion extending from the third portion, and The first sub-portion and the second sub-portion are spaced apart from each other, and the bank pattern is between the first sub-portion and the second sub-portion.

8. The display device according to claim 1, characterized in that: The display device further includes: A second substrate including a light-transmitting area and a light-shielding area; and a color filter layer in the light-transmitting region of the second substrate and facing the first substrate, wherein the second substrate faces the first substrate, and the filler is between the second substrate and the first substrate, and The color filter layer overlaps the first inclined surface of the first light control layer.

9. A display device, characterized in that: The display device comprises: A substrate comprising a first light emitting area, a second light emitting area and a non-light emitting area between the first light emitting area and the second light emitting area; a pixel electrode, in the first light emitting region of the substrate; a pixel defining layer in the non-luminescent region of the substrate; A first light control layer, on the pixel electrode; a planarization layer on the pixel electrode and the pixel defining layer; and a bank pattern, overlapping the non-light emitting area on the planarization layer, The planarization layer includes: a first portion overlapping the first light emitting region; and a second portion overlapping the non-light emitting region, and In a plane, the first portion surrounds the first light-controlling layer, and the second portion surrounds the first light-emitting area.

10. The display device according to claim 9, characterized in that: The display device further includes: a second light control layer, overlapping the second light emitting area, Wherein, the planarization layer further includes: a third portion, overlapping with the second light emitting area, The third portion surrounds the second light control layer in a plane, and In a plane, the width of the first portion is greater than the width of the third portion.

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