Vehicle-mounted controller heat dissipation assembly and vehicle

Abstract

The utility model relates to the technical field of vehicle-mounted equipment, in particular to a vehicle-mounted controller heat dissipation assembly and a vehicle. The vehicle-mounted controller heat dissipation assembly comprises a PCBA, a heat dissipation piece and a piezoelectric fan. The PCBA comprises a circuit board and a chip arranged on the circuit board. The heat dissipation piece is connected with the face, provided with the chip, of the PCBA, the side, back on to the PCBA, of the heat dissipation piece is provided with a plurality of protruding heat dissipation pieces, the multiple heat dissipation pieces are arranged at intervals in the first direction, and every two adjacent heat dissipation pieces define a flow channel extending in the second direction. And the piezoelectric fan is arranged in the flow channel and can form air flow flowing through the flow channel. According to the utility model, the piezoelectric fan which is small in size and light in weight is arranged, and heat exchange between heat of the radiating fins and surrounding air is further accelerated on the basis that the size of the radiating piece is not changed, so that efficient radiating is realized, the radiating requirement of the high-power-consumption vehicle-mounted controller is met, and the vehicle-mounted controller has better functional stability.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicle-mounted equipment, in particular to a vehicle-mounted controller heat dissipation component and a vehicle. Background Art

[0002] The current automotive market has gradually increased the functional requirements for vehicle-mounted controller products, and the demand for chip computing power in vehicle-mounted controllers is increasing. Therefore, vehicle-mounted controller products need to have good functional stability. As the power consumption of chips and modules integrated in PCBA gradually increases, the heat generation also increases accordingly, and the performance of chips and modules will decrease with the increase in temperature. Therefore, the heat dissipation problem of chips and modules needs to be solved urgently.

[0003] In order to solve the problem of chip heat dissipation, current vehicle controller products mostly use natural heat dissipation or axial air cooling. Due to the low heat exchange efficiency of natural heat dissipation, high-power vehicle controller products mostly use axial air cooling. However, the axial air cooling method has the following disadvantages in terms of heat dissipation effect and spatial layout: First, the air flow field is unevenly distributed, which cannot fully cover the vehicle controller, and the heat dissipation effect is not ideal; second, the use of axial fans for heat dissipation will increase the size of the vehicle controller, which will have a negative impact on the miniaturization of the controller and the lightweight of the vehicle. Utility Model Content

[0004] In view of this, the purpose of the present application is to provide a vehicle-mounted controller heat dissipation component and a vehicle to solve the problem that the existing high-power vehicle-mounted controller has poor heat dissipation effect and large size of the heat dissipation device.

[0005] The first aspect of the utility model provides a vehicle-mounted controller heat dissipation component, wherein the vehicle-mounted controller heat dissipation component comprises:

[0006] A PCBA, comprising a circuit board and a chip arranged on the circuit board;

[0007] A heat sink connected to a side of the PCBA on which the chip is provided, wherein a plurality of protruding heat sinks are provided on a side of the heat sink facing away from the PCBA, wherein the plurality of heat sinks are spaced apart along a first direction, and two adjacent heat sinks form a flow channel extending along a second direction;

[0008] The piezoelectric fan is disposed in the flow channel, and the piezoelectric fan can form a wind flow passing through the flow channel.

[0009] Preferably, the piezoelectric fan is arranged at one end of the flow channel in the length direction, and the other end of the flow channel in the length direction is provided with an opening.

[0010] Preferably, a plurality of the flow channels are provided, and the piezoelectric fans are provided in one-to-one correspondence with the flow channels.

[0011] Preferably, a plurality of the piezoelectric fans are arranged on the same side of the heat sink.

[0012] Preferably, the vehicle-mounted controller heat dissipation assembly further includes:

[0013] A support member is connected to the heat sink, the support member is arranged at one end in the length direction of the flow channel, and the piezoelectric fan is arranged on a side of the support member facing the flow channel.

[0014] Preferably, the support member is detachably connected to the heat sink.

[0015] Preferably, the heat sink is vertically arranged, and along the protruding direction of the heat sink from the heat sink body, the size of the heat sink in the first direction gradually decreases.

[0016] Preferably, the vehicle-mounted controller heat dissipation assembly further includes:

[0017] The heat conducting member is sandwiched between the chip and the heat dissipating member.

[0018] Preferably, a protruding contact portion is formed on a side of the heat sink facing the PCBA, the contact portion is arranged directly above the chip, and the heat conducting member is sandwiched between the contact portion and the chip.

[0019] A second aspect of the utility model provides a vehicle, comprising the vehicle-mounted controller heat dissipation assembly described in any of the above technical solutions.

[0020] Compared with the prior art, the beneficial effects of the utility model are:

[0021] The vehicle-mounted controller heat dissipation component of the utility model increases the heat dissipation area of ​​the heat dissipation component by arranging protruding heat sinks on the heat sink, and assembles a small and light piezoelectric fan in the flow channel. In this way, the heat exchange between the heat sink and the surrounding air is further accelerated without changing the volume of the heat sink, thereby achieving efficient heat dissipation and meeting the heat dissipation requirements of high-power vehicle-mounted controllers, so that the vehicle-mounted controller has better functional stability. Compared with the existing axial air-cooled heat dissipation method, the piezoelectric fan dissipates heat evenly and does not change the volume of the vehicle-mounted controller, so that the vehicle equipped with the vehicle-mounted controller heat dissipation component has the advantages of light weight and intelligent control.

[0022] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 An exploded view of the structure of the vehicle controller heat dissipation assembly provided in an embodiment of the utility model;

[0025] Figure 2 A structural cross-sectional view of a vehicle-mounted controller heat dissipation assembly provided in an embodiment of the utility model;

[0026] Figure 3 A schematic diagram of the assembly structure of a heat sink and a piezoelectric fan in a heat dissipation assembly of an on-board controller provided in an embodiment of the utility model.

[0027] Icons: 11 - circuit board; 12 - chip; 20 - heat sink; 21 - heat sink; 22 - flow channel; 23 - contact part; 30 - piezoelectric fan; 40 - support member; 50 - heat conductor; D1 - first direction; D2 - second direction. DETAILED DESCRIPTION

[0028] The following specific embodiments are provided to help the reader obtain a comprehensive understanding of the methods, devices and / or systems described herein. However, after understanding the disclosure of the present application, various changes, modifications and equivalents of the methods, devices and / or systems described herein will be apparent. For example, the order of operations described herein is merely an example, and is not limited to the order set forth herein, but in addition to the operations that must occur in a particular order, changes that will be apparent after understanding the disclosure of the present application may be made. In addition, in order to improve clarity and brevity, descriptions of features known in the art may be omitted.

[0029] The features described herein may be implemented in different forms and should not be interpreted as being limited to the examples described herein. Rather, the examples described herein have been provided only to illustrate some of the many possible ways of implementing the methods, devices and / or systems described herein that will be apparent after understanding the disclosure of the present application.

[0030] Throughout the specification, when an element (such as a layer, a region, or a substrate) is described as being “on”, “connected to”, “bound to”, “over”, or “covering” another element, it may be directly “on”, “connected to”, “bound to”, “over”, or “covering” another element, or one or more other elements may be present between them. In contrast, when an element is described as being “directly on”, “directly connected to”, “directly bound to”, “directly over”, or “directly covering” another element, there may be no other elements present between them.

[0031] As used herein, the term "and / or" includes any one of the associated listed items and any combination of any two or more items.

[0032] Although terms such as "first," "second," and "third" may be used herein to describe various members, components, regions, layers, or portions, these members, components, regions, layers, or portions are not limited by these terms. Rather, these terms are only used to distinguish one member, component, region, layer, or portion from another member, component, region, layer, or portion. Therefore, without departing from the teachings of the examples described herein, the first member, component, region, layer, or portion referred to may also be referred to as the second member, component, region, layer, or portion.

[0033] For ease of description, spatial relational terms such as "above", "upper", "below", and "lower" may be used herein to describe the relationship of one element to another element as shown in the accompanying drawings. Such spatial relational terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, an element described as being "above" or "upper" relative to another element will subsequently be "below" or "lower" relative to the other element. Therefore, the term "above" includes both "above" and "below" orientations depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relational terms used herein will be interpreted accordingly.

[0034] The terms used herein are only used to describe various examples and are not used to limit the present disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms "include", "comprise" and "have" list the stated features, quantities, operations, components, elements and / or their combinations that exist, but do not exclude the existence or addition of one or more other features, quantities, operations, components, elements and / or their combinations.

[0035] Variations in the shapes shown in the drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the drawings but include variations in shapes that occur during manufacturing.

[0036] The features of the examples described herein may be combined in various ways that will be apparent after understanding the disclosure of the present application. In addition, although the examples described herein have various configurations, other configurations are possible as will be apparent after understanding the disclosure of the present application.

[0037] According to a first aspect of the utility model, a vehicle-mounted controller heat dissipation assembly is provided, which includes a PCBA, a heat dissipation element 20 and a piezoelectric fan 30 .

[0038] In this embodiment, if Figures 1 to 3 As shown, the PCBA includes a circuit board 11 and a chip 12 disposed on the circuit board 11. The chip 12 is soldered on the circuit board 11. The chip 12 is formed into a block structure so that the chip 12 protrudes from the surface of the circuit board 11. In this embodiment, at least one chip 12 is provided on the circuit board 11, and the number of chips 12 provided can be set according to the requirements of the vehicle control. In addition, in this embodiment, the chip 12 is a high power consumption chip to meet the functional requirements of enriching the vehicle controller product.

[0039] In this embodiment, if Figures 1 to 3 As shown, the heat sink 20 is connected to a side of the PCBA on which the chip 12 is provided, so that the heat generated by the chip 12 during operation can be conducted to the heat sink 20. A plurality of protruding heat sinks 21 are provided on the side of the heat sink 20 facing away from the PCBA. The heat sink 21 is formed into a vertically arranged sheet structure, thereby increasing the heat dissipation area of ​​the heat sink 20, thereby achieving rapid heat dissipation.

[0040] Specifically, in this embodiment, Figures 1 to 3As shown, a plurality of heat sinks 21 are arranged at intervals along a first direction D1, and two adjacent heat sinks 21 enclose a flow channel 22 extending along a second direction D2. A piezoelectric fan 30 is arranged in the flow channel 22, and the piezoelectric fan 30 can form a wind flow through the flow channel 22 to blow away the hot air around the heat sink 21, thereby achieving efficient heat dissipation. The piezoelectric fan 30 is a new type of fan that works by using the piezoelectric effect, and has the advantages of small size and light weight, so that the piezoelectric fan 30 is easy to be embedded in the flow channel 22, so that the height dimension of the heat sink 20 is not changed, so that the vehicle-mounted controller has a compact structure and is light and beautiful as a whole.

[0041] It should be noted that, in this embodiment, the first direction D1 is perpendicular to the second direction D2 , and a plane formed by the first direction D1 and the second direction D2 is parallel to the circuit board 11 .

[0042] In a preferred embodiment, Figure 2 As shown, along the protruding direction of the heat sink 21 from the heat sink 20 body (i.e., the vertical upward direction), the size of the heat sink 21 in the first direction D1 gradually decreases, thereby further increasing the heat dissipation area of ​​the heat sink 21, and also increasing the cross-sectional area of ​​the flow channel 22, thereby reserving a larger installation space for installing the piezoelectric fan 30.

[0043] In this embodiment, if Figures 1 to 3 As shown, the flow channel 22 is formed into a strip structure, the piezoelectric fan 30 is arranged at one end of the flow channel 22 in the length direction, and an opening is arranged at the other end of the flow channel 22 in the length direction, so as to ensure that the wind flow formed by the piezoelectric fan 30 can pass through the entire flow channel 22, thereby ensuring that the wind flow can quickly blow away the heat around the heat sink 21, thereby improving the heat dissipation effect.

[0044] In addition, in this embodiment, if Figures 1 to 3 As shown, a plurality of flow channels 22 are provided, and the plurality of flow channels 22 are arranged along the first direction D1, and the piezoelectric fans 30 are provided one-to-one with the flow channels 22, so as to ensure the distribution of the air flow field and cover the entire vehicle controller, thereby further improving the heat dissipation effect.

[0045] Furthermore, in this embodiment, if Figures 1 to 3 As shown, a plurality of piezoelectric fans 30 are arranged on the same side of the heat sink 20, which is convenient for installation and can ensure that the wind direction in each flow channel 22 is consistent, so that the heat on the heat sink 20 can be quickly dissipated into the air.

[0046] Furthermore, in this embodiment, if Figures 1 to 3As shown, the vehicle controller heat dissipation assembly also includes a support member 40 connected to the heat sink 20 for fixing the piezoelectric fan 30. Specifically, the support member 40 is arranged at one end of the flow channel 22 in the length direction, and the piezoelectric fan 30 is arranged on the side of the support member 40 facing the flow channel 22, so that the piezoelectric fan 30 is first assembled on the support member 40, and after the support member 40 is installed on the heat sink 20, the piezoelectric fan 30 can be directly embedded in the flow channel 22, thereby improving assembly efficiency and facilitating maintenance and replacement. It should be noted that the piezoelectric fan 30 can be welded to the support member 40.

[0047] More specifically, in this embodiment, if Figure 1 As shown, the support member 40 is formed into a strip-shaped plate-like structure, and a plurality of piezoelectric fans 30 are arranged at intervals along the length direction of the support member 40 to ensure that each piezoelectric fan 30 can be inserted into the corresponding flow channel 22 .

[0048] In a preferred embodiment, the support member 40 is detachably connected to the heat sink 20, which facilitates installation and maintenance of the piezoelectric fan 30 on the support member 40. The support member 40 can be snap-connected to the heat sink 20. For example, claws can be set at both ends of the support member 40 in the length direction, and a slot can be set on the heat sink 20 at a position corresponding to the installation position of the support member 40.

[0049] Furthermore, in a preferred embodiment, Figure 1 and Figure 2 As shown, the vehicle controller heat dissipation assembly also includes a heat conductive member 50 sandwiched between the chip 12 and the heat dissipation member 20, which is used to fill the gap between the chip 12 and the heat dissipation member 20, so that the heat generated by the chip 12 during operation can be quickly transferred to the heat dissipation member 20 via the heat conductive member 50, thereby further improving the heat dissipation efficiency. In this embodiment, the heat conductive member 50 can be a thermal pad, which has thermal conductivity and a certain degree of elasticity, so that it can effectively fill the gap and achieve rapid heat conduction.

[0050] Furthermore, in this embodiment, if Figure 2 As shown, a protruding contact portion 23 is formed on the side of the heat sink 20 facing the PCBA, and the contact portion 23 is arranged directly above the chip 12. The thermal conductive member 50 is sandwiched between the contact portion 23 and the chip 12, so as to ensure that the two sides of the thermal conductive member 50 are in contact with the heat sink 20 and the chip 12 respectively, thereby avoiding the thermal conductive member 50 being unable to fit with the chip 12 due to an excessively large gap, thereby affecting the heat conduction effect of the thermal conductive member 50.

[0051] According to the vehicle-mounted controller heat dissipation assembly of the utility model, a protruding heat sink is provided on the heat sink to increase the heat dissipation area of ​​the heat sink, and a small and lightweight piezoelectric fan is assembled in the flow channel. In this way, the heat exchange between the heat sink and the surrounding air is further accelerated without changing the volume of the heat sink, thereby achieving efficient heat dissipation, meeting the heat dissipation requirements of a high-power vehicle-mounted controller, and ensuring that the vehicle-mounted controller has better functional stability.

[0052] The second aspect of the utility model provides a vehicle, in which a vehicle-mounted controller heat dissipation component installed on the vehicle can achieve efficient heat dissipation, meet the heat dissipation requirements of a high-power vehicle-mounted controller, and enable the vehicle-mounted controller to have better functional stability; compared with the existing axial air-cooling heat dissipation method, the piezoelectric fan dissipates heat evenly and does not change the volume of the vehicle-mounted controller, thereby enabling the vehicle equipped with the vehicle-mounted controller heat dissipation component to have the advantages of light vehicle weight and intelligent control.

[0053] Finally, it should be noted that the above-described embodiments are only specific implementation methods of the present application, which are used to illustrate the technical solutions of the present application, rather than to limit them. The protection scope of the present application is not limited thereto. Although the present application is described in detail with reference to the above-described embodiments, ordinary technicians in the field should understand that any technician familiar with the technical field can still modify the technical solutions recorded in the above-described embodiments within the technical scope disclosed in the present application, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A vehicle-mounted controller heat dissipation component, characterized in that: The vehicle-mounted controller heat dissipation component comprises: A PCBA, comprising a circuit board and a chip arranged on the circuit board; A heat sink connected to a side of the PCBA on which the chip is provided, wherein a plurality of protruding heat sinks are provided on a side of the heat sink facing away from the PCBA, wherein the plurality of heat sinks are spaced apart along a first direction, and two adjacent heat sinks form a flow channel extending along a second direction; The piezoelectric fan is disposed in the flow channel, and the piezoelectric fan can form a wind flow passing through the flow channel.

2. The vehicle-mounted controller heat dissipation assembly according to claim 1, characterized in that: The piezoelectric fan is disposed at one end of the flow channel in the length direction, and an opening is disposed at the other end of the flow channel in the length direction.

3. The vehicle-mounted controller heat dissipation assembly according to claim 1, characterized in that: A plurality of flow channels are provided, and the piezoelectric fans are provided in one-to-one correspondence with the flow channels.

4. The vehicle-mounted controller heat dissipation assembly according to claim 3, characterized in that: The plurality of piezoelectric fans are arranged on the same side of the heat sink.

5. The vehicle-mounted controller heat dissipation assembly according to claim 1, characterized in that: The vehicle-mounted controller heat dissipation component also includes: A support member is connected to the heat sink, the support member is arranged at one end in the length direction of the flow channel, and the piezoelectric fan is arranged on a side of the support member facing the flow channel.

6. The vehicle-mounted controller heat dissipation assembly according to claim 5, characterized in that: The support member is detachably connected to the heat sink.

7. The vehicle-mounted controller heat dissipation assembly according to claim 1, characterized in that: The heat sink is vertically arranged, and along the protruding direction of the heat sink from the heat sink body, the size of the heat sink in the first direction gradually decreases.

8. The vehicle-mounted controller heat dissipation assembly according to claim 1, characterized in that: The vehicle-mounted controller heat dissipation component also includes: The heat conducting member is sandwiched between the chip and the heat dissipating member.

9. The vehicle-mounted controller heat dissipation assembly according to claim 8, characterized in that: A protruding contact portion is formed on a side of the heat sink facing the PCBA, the contact portion is arranged directly above the chip, and the heat conducting member is sandwiched between the contact portion and the chip.

10. A vehicle, characterized in that: A vehicle-mounted controller heat dissipation assembly comprising any one of claims 1 to 9.

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