Heat dissipation module and mobile electronic device assembly

Abstract

This application relates to the field of heat dissipation technology, and discloses a heat dissipation module and a mobile electronic device component. The heat dissipation module can be applied to a mobile terminal. The heat dissipation module includes a mounting part, a working part, a rotating part, and a first wireless charging coil. The mounting part is used to connect to the mobile terminal. The working part includes a battery and a piezoelectric fan, with the battery supplying power to the piezoelectric fan. The rotating part rotatably connects the mounting part and the working part, allowing the heat dissipation module to switch between a folded state and an unfolded state. The first wireless charging coil is used to charge the battery. When the heat dissipation module is in the folded state, the first wireless charging coil can couple with a second wireless charging coil in the mobile terminal; when the heat dissipation module is in the unfolded state, the first wireless charging coil is not coupled with the second wireless charging coil in the mobile terminal, and the air outlet of the piezoelectric fan is directed towards the heat-generating surface of the mobile terminal. This heat dissipation module combines industrial design, high reliability, and portability, with low noise and excellent heat dissipation performance.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation module and a mobile electronic device component. Background Technology

[0002] As mobile terminals (such as smartphones) become increasingly intelligent, their performance requirements are rising, leading to a rapid increase in the power consumption of electronic components and consequently, higher heat dissipation. Therefore, heat dissipation modules can be incorporated into mobile terminals to manage heat dissipation.

[0003] Based on different heat dissipation principles, current heat dissipation modules are divided into two types: passive heat dissipation (or natural heat dissipation) and active heat dissipation. Passive heat dissipation requires no external energy input and relies on passive heat dissipation devices to cool heat-generating components. Active heat dissipation includes active air cooling, which consumes power from the mobile terminal's battery and uses the principle of thermal convection to force airflow to cool the heated mobile terminal. The equivalent heat transfer coefficient of active air cooling is several times that of natural heat dissipation, for example, approximately 1.5 to 10 times, and it is an essential path for further improving the performance and heat dissipation capabilities of mobile terminal products in the future.

[0004] However, current active air-cooling modules struggle to reconcile industrial design with high reliability and portability, failing to adequately meet the heat dissipation needs of mobile devices. For instance, current active air-cooling modules require air inlets and outlets on the exterior of the mobile device, often conflicting with industrial design (ID) and protection requirements. Dust and water vapor can enter and exit the internal airflow channels of the mobile device, potentially causing both the cooling module and the device to malfunction, especially in extreme weather conditions like sandstorms or after being submerged in water. Furthermore, due to the unpredictable nature of user scenarios, such as drops, the reliability of fans within mobile devices is significantly lower than that of fans in static environments like traditional servers and personal computers (PCs), making repairs difficult and potentially compromising the original dustproof and waterproof design of the mobile device. Summary of the Invention

[0005] To address the aforementioned technical problems, this application provides a heat dissipation module and a mobile electronic device component. The heat dissipation module and mobile electronic device component provided in this application will be described below, and the following multiple beneficial effects can be combined with each other.

[0006] In a first aspect, embodiments of this application provide a heat dissipation module applicable to a mobile terminal. The heat dissipation module includes a mounting section, a working section, a rotating section, and a first wireless charging coil. The mounting section is used to connect to the mobile terminal. The working section includes a battery and a piezoelectric fan, with the battery supplying power to the piezoelectric fan. The rotating section rotatably connects the mounting section and the working section, allowing the heat dissipation module to switch between a folded state and an unfolded state. The first wireless charging coil is used to charge the battery. When the heat dissipation module is in the folded state, the first wireless charging coil can couple with a second wireless charging coil in the mobile terminal; when the heat dissipation module is in the unfolded state, the first wireless charging coil is not coupled with the second wireless charging coil in the mobile terminal, and the air outlet of the piezoelectric fan is directed towards the heat-generating surface of the mobile terminal.

[0007] The aforementioned heat dissipation module is externally mounted on the mobile terminal via an mounting part. This means the heat dissipation module can be used as an external accessory for the mobile terminal; in other words, it is not located inside the mobile terminal and does not occupy internal space. Furthermore, it does not conflict with the design of the mobile terminal itself, nor does it affect the industrial design, board area, or waterproof and dustproof design. For example, the layout of the piezoelectric fan's air inlet and outlet in the heat dissipation module does not affect the aesthetics and refinement of the mobile terminal. The size of the heat dissipation module, especially the air inlet and outlet ducts, is not limited by the internal layout space of the mobile terminal, allowing for a thinner and lighter design. Therefore, the heat dissipation module provided in this application embodiment can decouple the industrial design of the mobile terminal from high heat dissipation performance.

[0008] Furthermore, users can disassemble and install the heat dissipation module themselves to facilitate cleaning, repair, or replacement of its components without disassembling or damaging the mobile terminal. This does not affect the reliability of the mobile terminal, and the repair is simple, replaceable, and low-cost. Therefore, the heat dissipation module provided in this application embodiment has good maintainability and reliability.

[0009] Secondly, by flexibly adjusting the mounting position of the mounting part on the mobile terminal and the angle between the mounting part and the working part, the heat dissipation module can better achieve targeted low-impedance free-field heat dissipation, fully utilizing the high-speed convolution effect of the jet piezoelectric fan. This helps ensure that the heat dissipation module has high heat dissipation performance and low noise in different heat dissipation scenarios. Therefore, the heat dissipation module provided in this application embodiment has good heat dissipation performance and low noise.

[0010] Furthermore, it allows the heat dissipation module to better adapt to the usage needs of different application scenarios. For example, when heat dissipation is not required, the heat dissipation module can be switched to a folded state for easy carrying, while simultaneously charging the module's battery; when heat dissipation is required, the heat dissipation module can be switched to an unfolded state to allow the piezoelectric fan to operate efficiently. As another example, for different mobile terminals, the heat dissipation module can be installed in different positions via the mounting part, and by adjusting the angle between the mounting part and the working part, selective heat dissipation of different heat dissipation surfaces can be achieved to adapt to different working conditions, offering high flexibility and a wide range of applications. Therefore, the heat dissipation module provided in this application embodiment has excellent portability and versatility.

[0011] Finally, when the heat dissipation module is in the folded state, the first wireless charging coil can charge the battery to store energy, and the piezoelectric fan can remain inactive. When the heat dissipation module is in the unfolded state, the battery can power the piezoelectric fan, which then operates to dissipate heat from the mobile terminal. In other words, the piezoelectric fan is powered by the battery, not directly by the first wireless charging coil, thus the power supply efficiency of the first wireless charging coil does not affect the heat dissipation performance of the heat dissipation module. Furthermore, the first wireless charging coil and the piezoelectric fan can operate at off-peak times, avoiding excessive instantaneous heat generation. Therefore, this helps to further improve the heat dissipation performance of the heat dissipation module.

[0012] Furthermore, this power supply method features a simple structure, independent and universal components, and low cost. It effectively avoids the problems of conflicting industrial design effects, USB power supply and charging requirements, and incompatibility with different models found in the aforementioned technical solutions. Therefore, it helps to further improve the portability and versatility of the heat dissipation module.

[0013] It should be noted that in some application scenarios, the operating frequency of some components in the mobile terminal is close to that of the piezoelectric fan (e.g., 20kHz to 30kHz). Therefore, when the heat dissipation module is in the folded state, the piezoelectric fan is not working, which effectively avoids interference between the piezoelectric fan and the components in the mobile terminal, and also avoids the problem of limited space and weak heat dissipation benefits in the folded state. When the heat dissipation module is in the unfolded state, the piezoelectric fan is working. At this time, the piezoelectric fan is far away from the mobile terminal, so it will not interfere with the components in the mobile terminal, and the heat dissipation benefits are significant. In other words, by turning off the piezoelectric fan when the heat dissipation module is in the folded state and turning it on when the heat dissipation module is in the unfolded state, a better user thermal experience and performance can be ensured in various application scenarios.

[0014] In some implementations, the operating frequency of the piezoelectric fan can be designed to avoid the operating frequency range of devices that may cause interference. For example, the operating frequency of the piezoelectric fan can be set in a frequency band that is not sensitive to the human ear, such as 18kHz to 20kHz, thereby minimizing the interference between the piezoelectric fan and the devices in the mobile terminal.

[0015] Furthermore, compared to traditional mechanical fans, piezoelectric fans have no rotating parts, are completely solid-state, and have no bearings or motors. They are directly driven by piezoelectric elements, making them suitable for scenarios with high reliability requirements and severely limited space, such as mobile terminals, which are prone to drops. Piezoelectric fans have high airflow velocities at their outlets, for example, exceeding 10 m / s. This airflow can break the thermal boundary layer on the heat source surface, significantly improving convective heat transfer efficiency. They eliminate the need for metal heat sinks, resulting in substantial weight reduction, and also have a strong dust removal effect. Because piezoelectric fans typically operate in the ultrasonic frequency band (>20 kHz), which is inaudible to the human ear and has low mechanical noise, the high airflow velocity leads to significant aerodynamic noise, especially in the high-velocity, low-flow area near the outlet, where jet impact noise is prominent. This makes them unsuitable for confined spaces, but suitable for open, free fields with low impedance. They can also utilize the convolution effect to enhance heat dissipation and achieve low noise.

[0016] Therefore, compared with traditional fan cooling, the cooling module provided in this application combines the mounting part and the piezoelectric fan. The mounting part enables the cooling module to be placed externally on the mobile terminal without occupying internal space. Under low impedance free field, the piezoelectric fan utilizes the convolution effect of non-isolated air intake and exhaust, which further improves the cooling capacity of the cooling module and achieves low noise, avoiding and controlling the impact of jet impact noise. Therefore, the cooling module in this application achieves the effect of "1+1>2".

[0017] For example, whether the first wireless charging coil is coupled to the second wireless charging coil in the mobile terminal can be determined in the following way.

[0018] In some implementations, an indicator light on the heat dissipation module can indicate whether the first wireless charging coil is coupled to the second wireless charging coil in the mobile terminal. This method of determination is convenient and quick.

[0019] For example, an indicator light can indicate the battery's operating status. When the indicator light indicates that the battery is not charging, for example, when the indicator light indicates that the battery is discharging, it can be determined that the first wireless charging coil is not coupled to the second wireless charging coil; when the indicator light indicates that the battery is charging, and the heat dissipation module is not supplying power to the battery through a power supply interface (e.g., a USB interface), it can be determined that the first wireless charging coil is coupled to the second wireless charging coil.

[0020] In some implementations, the coupling between the first wireless charging coil and the second wireless charging coil in the mobile terminal can be determined by changes in the battery's voltage or charge.

[0021] For example, when the battery voltage or charge remains essentially unchanged, it indicates that the battery is neither discharging to supply power to the piezoelectric fan 213 nor charging. Therefore, it can be determined that the first wireless charging coil is not coupled to the second wireless charging coil. It should be noted that "the battery voltage or charge remains essentially unchanged" does not mean that the battery voltage or charge is completely and strictly constant. In reality, the battery voltage or charge can experience extremely small or slow changes. For example, the battery's internal resistance can cause a slow change in voltage or charge, which can be considered essentially unchanged.

[0022] For example, when the battery voltage or charge gradually decreases, it indicates that the battery is in a discharging state. Therefore, it can be determined that the first wireless charging coil is not coupled to the second wireless charging coil. Conversely, when the battery voltage or charge gradually increases, it indicates that the battery is in a charging state. If the heat dissipation module is not supplying power to the battery through the power supply interface (e.g., USB interface), it can be determined that the first wireless charging coil is coupled to the second wireless charging coil.

[0023] In some implementations, the coupling between the first wireless charging coil and the second wireless charging coil in the mobile terminal can be determined by the voltage or current change in the internal circuitry of the first wireless charging coil.

[0024] For example, if there is no minute-level voltage or current in the internal circuitry of the first wireless charging coil, it can be determined that the first wireless charging coil is not coupled to the second wireless charging coil. Conversely, if there is minute-level voltage or current in the internal circuitry of the first wireless charging coil, and the heat dissipation module is not supplying power to the battery through a power interface (e.g., a USB interface), it can be determined that the first wireless charging coil is coupled to the second wireless charging coil. It should be noted that minute-level voltage or current refers to voltage or current that lasts for one minute or more; that is, the voltage or current is stable and not caused by short-term interference.

[0025] In one possible implementation of the first aspect described above, a first wireless charging coil is disposed in the mounting portion, and the working portion further includes a circuit board connected to the battery. When the heat dissipation module is in a folded state, the first wireless charging coil is connected to the circuit board to charge the battery; when the heat dissipation module is in an unfolded state, the first wireless charging coil is spaced apart from the circuit board to stop charging the battery.

[0026] The above solution, using a simple physical structure, enables the first wireless charging coil to automatically turn on or stop charging the battery when the heat dissipation module switches between folded and unfolded states, thus achieving a foolproof design and effectively improving the ease of use and safety of the heat dissipation module.

[0027] In one possible implementation of the first aspect described above, a first wireless charging coil is disposed in the working part, which also includes a circuit board. The first wireless charging coil and the battery are respectively connected to the circuit board. When the heat dissipation module is in a folded state, the distance between the first wireless charging coil and the second wireless charging coil in the mobile terminal is less than or equal to the electromagnetic coupling distance, so as to charge the battery; when the heat dissipation module is in an unfolded state, the distance between the first wireless charging coil and the second wireless charging coil in the mobile terminal is greater than the electromagnetic coupling distance, so as to stop charging the battery.

[0028] It should be noted that, in the embodiments of this application, the electromagnetic coupling distance refers to the physical distance between two wireless charging coils that allows them to establish an effective magnetic field interaction and achieve energy or signal transmission. When the distance between the two wireless charging coils is less than or equal to the electromagnetic coupling distance, the two wireless charging coils can perform electromagnetic coupling, thereby achieving wireless charging; conversely, when the distance between the two wireless charging coils is greater than the electromagnetic coupling distance, the two wireless charging coils cannot perform electromagnetic coupling, thereby failing to achieve wireless charging.

[0029] The above solution, using a simple physical structure, enables the first wireless charging coil to automatically turn on or stop charging the battery when the heat dissipation module switches between folded and unfolded states, thus achieving a foolproof design and effectively improving the ease of use and safety of the heat dissipation module.

[0030] In one possible implementation of the first aspect described above, the heat dissipation module further includes a switch for controlling the operating state of the piezoelectric fan without relying on communication commands from a mobile terminal, enabling cross-device and cross-model operation. When the heat dissipation module is in the folded state, the switch is located between the mounting section and the operating section.

[0031] This design enables foolproof operation, helping to ensure that the piezoelectric fan and the first wireless charging coil operate at off-peak times, avoiding excessive instantaneous heat generation. For example, when the heat dissipation module is folded, the piezoelectric fan can automatically shut off, and the user cannot access the switch to turn it on, while the first wireless charging coil can charge the battery to store energy. Furthermore, when the heat dissipation module is folded, the switch is not visible to the user, resulting in a more aesthetically pleasing and refined appearance for the folded heat dissipation module.

[0032] In some implementations, the simple foolproof design described above can also be achieved through more complex hardware and software designs. In this case, the switch can also be placed in other locations, such as on the side of the working part facing away from the mounting part or on the side wall of the working part.

[0033] In one possible implementation of the first aspect described above, the piezoelectric fan includes a jet port, which serves as both the air outlet and air inlet of the piezoelectric fan.

[0034] Because the air inlet and outlet are not separate, fluid can flow directly in and out through the jet nozzle without undergoing long distances and bends inside the fan. This results in minimal fluid loss, a large airflow, and low impedance, effectively removing heat from the mobile device. Utilizing the free space outside the mobile device, the high-velocity, low-flow-rate gas ejected from the jet nozzle convolves and evolves into low-velocity, high-flow-rate gas before colliding with the heat-generating surface, causing convective heat transfer and improving heat dissipation efficiency while reducing noise. It eliminates the need for conductive materials such as thermal interface materials and heavy metal components like heat sinks (e.g., fins), resulting in a simple structure and excellent portability and versatility.

[0035] Correspondingly, the design of air intake and exhaust through the same jet port allows for a more compact structure of the piezoelectric fan, reducing its thickness and facilitating a thinner and lighter design. As a result, when the heat dissipation module is installed on a mobile terminal, it will not affect the grip of the mobile terminal.

[0036] In one possible implementation of the first aspect described above, the piezoelectric fan includes a first operating state and a second operating state. The operating frequency of the piezoelectric fan in the first operating state is lower than the operating frequency of the piezoelectric fan in the second operating state. Alternatively, the operating voltage of the piezoelectric fan in the first operating state is lower than the operating voltage of the piezoelectric fan in the second operating state.

[0037] When the piezoelectric fan is in its first working state, it can dissipate heat from the mobile terminal. When the piezoelectric fan is in its second working state, it can perform short-term self-dust removal to prevent dust accumulation (e.g., accumulation of dust, fiber dirt, etc.), thereby avoiding problems such as abnormal noise, noise, and performance degradation of the heat dissipation module, and thus improving the reliability of the heat dissipation module.

[0038] In this way, the piezoelectric fan can meet basic heat dissipation requirements while having self-cleaning and maintenance capabilities, effectively reducing the impact of dust accumulation on heat dissipation performance and operational stability, extending the service life of the heat dissipation module, and improving overall reliability and product experience.

[0039] By setting the operating frequency of the piezoelectric fan in the first operating state to be lower than that in the second operating state, the piezoelectric fan can operate at a relatively low operating frequency in the first operating state to reduce power consumption and ensure a long lifespan; in the second operating state, the piezoelectric fan can operate at a relatively high operating frequency to improve short-term dust removal efficiency.

[0040] By setting the operating voltage of the piezoelectric fan in the first operating state to be lower than that in the second operating state, the piezoelectric fan can operate at a relatively lower voltage in the first operating state, resulting in a relatively lower amplitude, thus reducing power consumption and ensuring a longer lifespan. In the second operating state, the piezoelectric fan can operate at a relatively higher voltage, resulting in a relatively higher amplitude, thus improving the short-term dust removal effect.

[0041] In one possible implementation of the first aspect described above, the operating frequency of the piezoelectric fan in the first operating state is less than the operating frequency of the piezoelectric fan in the second operating state, wherein the operating frequency of the piezoelectric fan in the first operating state is 20kHz to 30kHz, and the operating frequency of the piezoelectric fan in the second operating state is greater than 30kHz. Alternatively, the operating voltage of the piezoelectric fan in the first operating state is less than the operating voltage of the piezoelectric fan in the second operating state, and the ratio between the operating voltage of the piezoelectric fan in the second operating state and the operating voltage of the piezoelectric fan in the first operating state is greater than or equal to 1.3.

[0042] By setting the operating frequency of the piezoelectric fan in its first operating state to 20kHz to 30kHz, power consumption can be reduced and a longer lifespan can be ensured. By setting the operating frequency of the piezoelectric fan in its second operating state to greater than 30kHz, the short-term dust removal effect can be further improved.

[0043] By setting the ratio between the operating voltage of the piezoelectric fan in the second operating state and the operating voltage of the piezoelectric fan in the first operating state to be greater than or equal to 1.3, the short-term dust removal effect can be further improved.

[0044] In some implementations, piezoelectric fans can be driven by AC voltage, such as square wave or sine wave.

[0045] In one possible implementation of the first aspect above, the piezoelectric fan cover is provided with a dustproof net (or protective net), and the dustproof net (or protective net) has through holes that cover at least a portion of the air outlet.

[0046] The dust filter prevents dust, fibers, and other debris from entering the piezoelectric fan, thus avoiding dust accumulation. It does not significantly obstruct airflow and also prevents fingers from pressing or inserting into the fan, protecting it. Furthermore, by creating openings in the dust filter, the fan's outlet can be bypassed, preventing obstruction of fluid flow in the high-speed, low-flow, high-noise zone near the outlet. This helps further reduce flow resistance, increase the piezoelectric fan's flow rate, and reduce aerodynamic noise.

[0047] In one possible implementation of the first aspect described above, the ratio between the cross-sectional area of ​​the through-hole and the cross-sectional area of ​​the air outlet is greater than or equal to 1.5; and / or, the cross-sectional area of ​​the through-hole is less than or equal to 2 mm². 2 .

[0048] By setting the ratio between the cross-sectional area of ​​the through hole and the cross-sectional area of ​​the air outlet to be greater than or equal to 1.5, the through hole can be better compatible with various air outlet layouts, absorb the manufacturing and assembly tolerances of the heat dissipation module, and has strong versatility. This helps to better improve the airflow of the piezoelectric fan and reduce the noise of the piezoelectric fan.

[0049] By setting the cross-sectional area of ​​the through hole to be less than or equal to 2mm 2 This can prevent the cross-sectional area of ​​the through holes from being too large, which would affect the dustproof effect of the dustproof net.

[0050] In one possible implementation of the first aspect described above, the rotating part includes a limiting mechanism for limiting the rotation angle of the working part relative to the mounting part.

[0051] This allows for a stepped deployment of the heat dissipation module. That is, during deployment, the heat dissipation module can remain at several fixed positions at specific intervals, forming a stable deployment state, rather than a continuous, smooth deployment. At different intervals, the angle between the working part and the mounting part corresponds to different sizes, such as 45°, 90°, and 135°. Alternatively, the angle between the working part and the mounting part can be limited to a certain range to ensure that the air outlet of the piezoelectric fan in the working part can be better aligned with the heat-generating surface of the mobile terminal.

[0052] In one possible implementation of the first aspect above, the rotation angle range of the working part relative to the mounting part is less than or equal to 60°, and the air outlet faces the mounting part when the heat dissipation module is in a folded state.

[0053] This prevents the heat dissipation module from being over-expanded, which could cause the piezoelectric fan's exhaust vent to be misaligned with the hot surface of the mobile device. Furthermore, when the heat dissipation module is folded, the user cannot see the piezoelectric fan's exhaust vent, resulting in a more aesthetically pleasing and refined appearance for the folded heat dissipation module.

[0054] In one possible implementation of the first aspect described above, the mounting part includes a first magnetic chuck, and the heat dissipation module includes a second magnetic chuck and a positioning member. The first magnetic chuck is used to attach to the second magnetic chuck, and the second magnetic chuck is used to mount on the mobile terminal. The positioning member is used to position the second magnetic chuck during the mounting process on the mobile terminal.

[0055] This connection method allows for repeated assembly and disassembly of the heat dissipation module; for example, it can support thousands of magnetic cycles, and its durability and reliability far exceed that of mechanical fixing methods. Secondly, this connection method facilitates modular design, thus adapting to mobile phones of various sizes and thicknesses, offering strong compatibility. Finally, this connection method allows for simple and quick alignment and fixation, making operation simple and fast. Furthermore, the magnetic material exhibits stable performance in environments ranging from -20℃ to 60℃, therefore, this connection method has excellent temperature adaptability.

[0056] In addition, by setting up positioning components, it can be ensured that the second magnetic component can be installed in a suitable and basically correct position, thereby reducing the difficulty of installing the second magnetic component.

[0057] In one possible implementation of the first aspect above, the magnetic attraction force between the first magnetic member and the second magnetic member is adjustable; and / or, one end of the positioning member is used to be inserted into the power supply interface of the mobile terminal, and the other end of the positioning member is used to cooperate with the second magnetic member.

[0058] According to the embodiments of this application, by making the magnetic attraction force between the first magnetic component and the second magnetic component adjustable, different application scenarios and user preferences can be adapted. For example, the magnetic attraction force between the first magnetic component and the second magnetic component can have three levels: weak, medium, and strong. When it is necessary to remove the heat dissipation module from the mobile terminal, the magnetic attraction force between the first magnetic component and the second magnetic component can be adjusted to the weak level to reduce the difficulty of disassembling the heat dissipation module; when the heat dissipation module is installed on the mobile terminal, the magnetic attraction force between the first magnetic component and the second magnetic component can be adjusted to the strong level to ensure that the heat dissipation module can be reliably installed on the mobile terminal.

[0059] According to the embodiments of this application, one end of the positioning member is used to be inserted into the power supply interface of the mobile terminal, and the other end of the positioning member is used to cooperate with the second magnetic member. Since the power supply interfaces of different mobile terminals are not significantly different, installing the positioning member based on the power supply interface allows the positioning member to be adapted to different mobile terminals, thus increasing its versatility.

[0060] In one possible implementation of the first aspect described above, the mounting part includes a van der Waals suction cup for attaching to the mobile terminal.

[0061] Van der Waals suction cups are biomimetic suction cups that rely on intermolecular van der Waals forces for adsorption. They draw inspiration from the micron-scale bristle / fiber arrays on a gecko's foot, generating adhesive force by forming a large number of molecular-level contact points with the adsorbed surface through micro-nano structures. They are reversible, non-destructive, and reusable.

[0062] This connection method allows for repeated disassembly and reassembly of the heat dissipation module, supporting 20 to 100 disassembly and reassembly cycles, far exceeding traditional adhesive solutions. It leaves no residue, meaning no adhesive marks are left after disassembly, preserving the mobile terminal's appearance. This is suitable for applications requiring frequent disassembly and reassembly of the heat dissipation module. The micro van der Waals suction cup can be released without damage simply by gently bending the edge of the mounting part. After long-term use, the surface of the van der Waals suction cup can be cleaned with water to restore its adhesion. It has a long service life and is easy to maintain. Furthermore, this connection method is highly compatible, suitable for various materials on the surface to be attracted, and is safe and reliable, with stable and controllable adhesion, avoiding the safety risks associated with magnetic attraction solutions.

[0063] In one possible implementation of the first aspect described above, the heat dissipation module further includes at least one of the following components: a switch for controlling the operating state of the piezoelectric fan; an indicator light for indicating the operating state of the battery and / or the piezoelectric fan; a power supply interface for electrically connecting to an external power source to charge the battery and / or supply power to the piezoelectric fan; and an operating member rotatably connected to one end of the working part, the other end of the working part being rotatably connected to the mounting part via a rotating part, the operating member being operated by a user to rotate the working part relative to the mounting part.

[0064] According to the embodiments of this application, by setting a switch, users can manually control the piezoelectric fan to select its operating state. The heat dissipation module does not need to communicate with the mobile terminal or require software adaptation settings; the components are independent and universal, resulting in low cost. For example, the operating states of the piezoelectric fan can include off, silent, high-performance, and dust-cleaning states.

[0065] By setting indicator lights, users can intuitively understand the operating status of the battery and / or piezoelectric fan. For example, indicator lights can be used to indicate the battery's charging and discharging status. Similarly, indicator lights can also indicate the piezoelectric fan's off, silent, high-performance, and dust-collecting states.

[0066] By setting up a power supply interface, the flexibility and versatility of power supply can be further improved, resulting in better performance and wider applicability of the heat dissipation module. For example, even if some mobile terminal models do not have a wireless charging coil inside, they can still be easily and conveniently powered through the power supply interface and used in conjunction with the heat dissipation module.

[0067] By setting up control components, the heat dissipation module can be switched between folded and unfolded states more easily and conveniently.

[0068] Secondly, this application provides a heat dissipation module that can be applied to a mobile terminal. The heat dissipation module includes a mounting section, a working section, and a rotating section. The mounting section is used to connect to the mobile terminal. The working section includes a power supply interface and a piezoelectric fan. The power supply interface is used to electrically connect to an external power source to supply power to the piezoelectric fan. The rotating section rotatably connects the mounting section and the working section, allowing the heat dissipation module to switch between a folded state and an unfolded state. When the heat dissipation module is in the unfolded state, the air outlet of the piezoelectric fan is directed towards the heat-generating surface of the mobile terminal.

[0069] The aforementioned heat dissipation module is externally mounted on the mobile terminal via an mounting part. This means the heat dissipation module can be used as an external accessory for the mobile terminal; in other words, it is not located inside the mobile terminal and does not occupy internal space. Furthermore, it does not conflict with the design of the mobile terminal itself, nor does it affect the industrial design, board area, or waterproof and dustproof design. For example, the layout of the heat dissipation module's jet ports does not affect the aesthetics and refinement of the mobile terminal; the size of the heat dissipation module is also not limited by the internal layout space of the mobile terminal, allowing for a thinner and lighter design. Therefore, the heat dissipation module provided in this application embodiment can decouple the industrial design of the mobile terminal from high heat dissipation performance.

[0070] Furthermore, users can disassemble and install the heat dissipation module themselves to facilitate cleaning, repair, or replacement of its components without disassembling the mobile terminal. This does not affect the reliability of the mobile terminal, and the repair is simple, easy to disassemble, replaceable, and cost-effective. Therefore, the heat dissipation module provided in this application embodiment has good maintainability and reliability.

[0071] Secondly, by flexibly adjusting the mounting position of the mounting part on the mobile terminal and the angle between the mounting part and the working part, the heat dissipation module can better achieve targeted low-impedance free-field heat dissipation, thereby helping to ensure that the heat dissipation module has high heat dissipation performance in different heat dissipation scenarios. Therefore, the heat dissipation module provided in this application embodiment has good heat dissipation performance.

[0072] Furthermore, it allows the heat dissipation module to better adapt to the usage needs of different application scenarios. For example, when heat dissipation is not required, the heat dissipation module can be switched to a folded state for easy carrying, while simultaneously charging the module's battery; when heat dissipation is required, the heat dissipation module can be switched to an unfolded state to allow the piezoelectric fan to operate. As another example, for different mobile terminals, the heat dissipation module can be installed in different positions via the mounting part, and by adjusting the angle between the mounting part and the working part, selective heat dissipation of different heat dissipation surfaces can be achieved to adapt to different working conditions, offering high flexibility and a wide range of applications. Therefore, the heat dissipation module provided in this application embodiment has excellent portability and versatility.

[0073] Finally, the piezoelectric fan is powered via a power interface, eliminating the need for batteries, wireless charging coils, and their corresponding electrical connections. This results in a simple power supply structure with fewer components. Therefore, it effectively reduces the thickness, size, and cost of the heat dissipation module, further enhancing its portability and versatility, and avoiding battery-related safety risks or certification requirements. Furthermore, this power supply solution has broad applicability; even mobile devices without internal wireless charging coils can be easily powered via the power interface and used with the heat dissipation module.

[0074] Furthermore, compared to traditional mechanical fans, piezoelectric fans have no rotating parts, are completely solid-state, and have no bearings or motors. They are directly driven by piezoelectric elements, making them suitable for scenarios with high reliability requirements and severely limited space, such as mobile terminals, which are prone to drops. Piezoelectric fans have high airflow velocities at their outlets, for example, exceeding 10 m / s. This airflow can break the thermal boundary layer on the heat source surface, significantly improving convective heat transfer efficiency. They eliminate the need for metal heat sinks, resulting in substantial weight reduction, and also have a strong dust removal effect. Because piezoelectric fans typically operate in the ultrasonic frequency band (>20 kHz), which is inaudible to the human ear and has low mechanical noise, the high airflow velocity leads to significant aerodynamic noise, especially in the high-velocity, low-flow area near the outlet, where jet impact noise is prominent. This makes them unsuitable for confined spaces, but suitable for open, free fields with low impedance. They can also utilize the convolution effect to enhance heat dissipation and achieve low noise.

[0075] Therefore, compared with traditional fan cooling, the cooling module provided in this application combines the mounting part and the piezoelectric fan. The mounting part enables the cooling module to be placed externally on the mobile terminal without occupying internal space. Under low impedance free field, the piezoelectric fan utilizes the convolution effect of non-isolated air intake and exhaust, which further improves the cooling capacity of the cooling module and achieves low noise, avoiding and controlling the impact of jet impact noise. Therefore, the cooling module in this application achieves the effect of "1+1>2".

[0076] In one possible implementation of the second aspect above, the piezoelectric fan includes a jet port, which serves as both the air outlet and air inlet of the piezoelectric fan.

[0077] Because the air inlet and outlet are not separate, fluid can flow directly in and out through the jet nozzle without undergoing long distances and bends inside the fan. This results in minimal fluid loss, a large airflow, and low impedance, effectively removing heat from the mobile device. Utilizing the free space outside the mobile device, the high-velocity, low-flow-rate gas ejected from the jet nozzle convolves and evolves into low-velocity, high-flow-rate gas before colliding with the heat-generating surface, causing convective heat transfer and improving heat dissipation efficiency while reducing noise. It eliminates the need for conductive materials such as thermal interface materials and heavy metal components like heat sinks (e.g., fins), resulting in a simple structure and excellent portability and versatility.

[0078] Correspondingly, the design of air intake and exhaust through the same jet port allows for a more compact structure of the piezoelectric fan, reducing its thickness and facilitating a thinner and lighter design. As a result, when the heat dissipation module is installed on a mobile terminal, it will not affect the grip of the mobile terminal.

[0079] In one possible implementation of the second aspect described above, the piezoelectric fan includes a first operating state and a second operating state. The operating frequency of the piezoelectric fan in the first operating state is lower than the operating frequency of the piezoelectric fan in the second operating state. Alternatively, the operating voltage of the piezoelectric fan in the first operating state is lower than the operating voltage of the piezoelectric fan in the second operating state.

[0080] When the piezoelectric fan is in its first working state, it can dissipate heat from the mobile terminal. When the piezoelectric fan is in its second working state, it can perform short-term self-dust removal to prevent dust accumulation (e.g., accumulation of dust, fiber dirt, etc.), thereby avoiding problems such as abnormal noise, noise, and performance degradation of the heat dissipation module, and thus improving the reliability of the heat dissipation module.

[0081] In this way, the piezoelectric fan can meet basic heat dissipation requirements while having self-cleaning and maintenance capabilities, effectively reducing the impact of dust accumulation on heat dissipation performance and operational stability, extending the service life of the heat dissipation module, and improving overall reliability and product experience.

[0082] By setting the operating frequency of the piezoelectric fan in the first operating state to be lower than that in the second operating state, the piezoelectric fan can operate at a relatively low operating frequency in the first operating state to reduce power consumption and ensure a long lifespan; in the second operating state, the piezoelectric fan can operate at a relatively high operating frequency to improve short-term dust removal efficiency.

[0083] By setting the operating voltage of the piezoelectric fan in the first operating state to be lower than that in the second operating state, the piezoelectric fan can operate at a relatively lower voltage in the first operating state, resulting in a relatively lower amplitude, thus reducing power consumption and ensuring a longer lifespan. In the second operating state, the piezoelectric fan can operate at a relatively higher voltage for a short period of time, resulting in a relatively higher amplitude, thus improving the short-term dust removal effect.

[0084] In one possible implementation of the second aspect described above, the operating frequency of the piezoelectric fan in the first operating state is less than the operating frequency of the piezoelectric fan in the second operating state; the operating frequency of the piezoelectric fan in the first operating state is 20kHz to 30kHz, and the operating frequency of the piezoelectric fan in the second operating state is greater than 30kHz. Alternatively, the operating voltage of the piezoelectric fan in the first operating state is less than the operating voltage of the piezoelectric fan in the second operating state, and the ratio between the operating voltage of the piezoelectric fan in the second operating state and the operating voltage of the piezoelectric fan in the first operating state is greater than or equal to 1.3.

[0085] By setting the operating frequency of the piezoelectric fan in its first operating state to 20kHz to 30kHz, power consumption can be reduced and a longer lifespan can be ensured. By setting the operating frequency of the piezoelectric fan in its second operating state to greater than 30kHz, the short-term dust removal effect can be further improved.

[0086] By setting the ratio between the operating voltage of the piezoelectric fan in the second operating state and the operating voltage of the piezoelectric fan in the first operating state to be greater than or equal to 1.3, the short-term dust removal effect can be further improved.

[0087] In some implementations, piezoelectric fans can be driven by AC voltage, such as square wave or sine wave.

[0088] In one possible implementation of the second aspect above, the piezoelectric fan cover is provided with a dustproof net (or protective net), and the dustproof net (or protective net) has through holes that cover at least a portion of the air outlet.

[0089] The dust filter prevents dust, fibers, and other debris from entering the piezoelectric fan, thus avoiding dust accumulation. It does not significantly obstruct airflow and also prevents fingers from pressing or inserting into the fan, protecting it. Furthermore, by creating openings in the dust filter, the fan's outlet can be bypassed, preventing obstruction of fluid flow in the high-speed, low-flow, high-noise zone near the outlet. This helps to further increase the piezoelectric fan's airflow and reduce its aerodynamic noise.

[0090] In one possible implementation of the second aspect above, the ratio between the cross-sectional area of ​​the through-hole and the cross-sectional area of ​​the air outlet is greater than or equal to 1.5; and / or, the cross-sectional area of ​​the through-hole is less than or equal to 2 mm². 2 .

[0091] By setting the ratio between the cross-sectional area of ​​the through hole and the cross-sectional area of ​​the air outlet to be greater than or equal to 1.5, the through hole can be better compatible with various air outlet layouts, making it highly versatile. This, in turn, helps to improve the airflow of the piezoelectric fan and reduce its noise.

[0092] By setting the cross-sectional area of ​​the through hole to be less than or equal to 2mm 2 This can prevent the cross-sectional area of ​​the through holes from being too large, which would affect the dustproof effect of the dustproof net.

[0093] In one possible implementation of the second aspect described above, the rotating part includes a limiting mechanism for limiting the rotation angle of the working part relative to the mounting part.

[0094] This allows for a stepped deployment of the heat dissipation module. That is, during deployment, the heat dissipation module can remain at several fixed positions at specific intervals, forming a stable deployment state, rather than a continuous, smooth deployment. At different intervals, the angle between the working part and the mounting part corresponds to different sizes, such as 45°, 90°, and 135°. Alternatively, the angle between the working part and the mounting part can be limited to a certain range to ensure that the air outlet of the piezoelectric fan in the working part can be better aligned with the heat-generating surface of the mobile terminal.

[0095] In one possible implementation of the second aspect above, the rotation angle range of the working part relative to the mounting part is less than or equal to 60°, and the air outlet faces the mounting part when the heat dissipation module is in a folded state.

[0096] This prevents the heat dissipation module from being over-expanded, which could cause the piezoelectric fan's exhaust vent to be misaligned with the hot surface of the mobile device. Furthermore, when the heat dissipation module is folded, the user cannot see the piezoelectric fan's exhaust vent, resulting in a more aesthetically pleasing and refined appearance for the folded heat dissipation module.

[0097] In one possible implementation of the second aspect described above, the mounting part includes a first magnetic chuck, and the heat dissipation module includes a second magnetic chuck and a positioning member. The first magnetic chuck is used to attach to the second magnetic chuck, and the second magnetic chuck is used to mount on the mobile terminal. The positioning member is used to position the second magnetic chuck during the mounting process on the mobile terminal.

[0098] This connection method allows for repeated assembly and disassembly of the heat dissipation module; for example, it can support thousands of magnetic cycles, and its durability and reliability far exceed that of mechanical fixing methods. Secondly, this connection method facilitates modular design, thus adapting to mobile phones of various sizes and thicknesses, offering strong compatibility. Finally, this connection method allows for simple and quick alignment and fixation, making operation simple and fast. Furthermore, the magnetic material exhibits stable performance in environments ranging from -20℃ to 60℃, therefore, this connection method has excellent temperature adaptability.

[0099] In addition, by setting up positioning components, it can be ensured that the second magnetic component can be installed in a suitable and basically correct position, thereby reducing the difficulty of installing the second magnetic component.

[0100] In one possible implementation of the second aspect above, the magnetic attraction force between the first magnetic member and the second magnetic member is adjustable; and / or, one end of the positioning member is used to be inserted into the power supply interface of the mobile terminal, and the other end of the positioning member is used to cooperate with the second magnetic member.

[0101] According to the embodiments of this application, by making the magnetic attraction force between the first magnetic component and the second magnetic component adjustable, different application scenarios and user preferences can be adapted. For example, the magnetic attraction force between the first magnetic component and the second magnetic component can have three levels: weak, medium, and strong. When it is necessary to remove the heat dissipation module from the mobile terminal, the magnetic attraction force between the first magnetic component and the second magnetic component can be adjusted to the weak level to reduce the difficulty of disassembling the heat dissipation module; when the heat dissipation module is installed on the mobile terminal, the magnetic attraction force between the first magnetic component and the second magnetic component can be adjusted to the strong level to ensure that the heat dissipation module can be reliably installed on the mobile terminal.

[0102] According to the embodiments of this application, one end of the positioning member is used to be inserted into the power supply interface of the mobile terminal, and the other end of the positioning member is used to cooperate with the second magnetic member. Since the power supply interfaces of different mobile terminals are not significantly different, installing the positioning member based on the power supply interface allows the positioning member to be adapted to different mobile terminals, thus increasing its versatility.

[0103] In one possible implementation of the second aspect described above, the mounting part includes a van der Waals suction cup for attaching to the mobile terminal.

[0104] Van der Waals suction cups are biomimetic suction cups that rely on intermolecular van der Waals forces for adsorption. They draw inspiration from the micron-scale bristle / fiber arrays on a gecko's foot, generating adhesive force by forming a large number of molecular-level contact points with the adsorbed surface through micro-nano structures. They are reversible, non-destructive, and reusable.

[0105] This connection method allows for repeated disassembly and reassembly of the heat dissipation module, supporting 20 to 100 disassembly and reassembly cycles, far exceeding traditional adhesive solutions. It leaves no residue, meaning no adhesive marks are left after disassembly, preserving the mobile terminal's appearance. This is suitable for applications requiring frequent disassembly and reassembly of the heat dissipation module. The micro van der Waals suction cup can be released without damage simply by gently bending the edge of the mounting part. After long-term use, the surface of the van der Waals suction cup can be cleaned with water to restore its adhesion. It has a long service life and is easy to maintain. Furthermore, this connection method is highly compatible, suitable for various materials on the surface to be attracted, and is safe and reliable, with stable and controllable adhesion, avoiding the safety risks associated with magnetic attraction solutions.

[0106] In one possible implementation of the second aspect above, the heat dissipation module further includes at least one of the following components: a switch for controlling the operating state of the piezoelectric fan; an indicator light for indicating the operating state of the piezoelectric fan; and an operating member rotatably connected to one end of the working part, the other end of the working part being rotatably connected to the mounting part via a rotating part, the operating member being operated by a user to rotate the working part relative to the mounting part.

[0107] According to the embodiments of this application, by setting a switch, users can manually control the piezoelectric fan to select its operating state. The heat dissipation module does not need to communicate with the mobile terminal or require software adaptation settings; the components are independent and universal, resulting in low cost. For example, the operating states of the piezoelectric fan can include off, silent, high-performance, and dust-cleaning states.

[0108] By setting indicator lights, users can intuitively understand the operating status of the piezoelectric fan. For example, indicator lights can be used to indicate the operating status of the piezoelectric fan, such as off, silent, high-performance, and dust-collecting modes.

[0109] By setting up control components, the heat dissipation module can be switched between folded and unfolded states more easily and conveniently.

[0110] Thirdly, embodiments of this application provide a mobile electronic device component, including a mobile terminal and a heat dissipation module. The heat dissipation module is either the heat dissipation module described in the first aspect and any possible implementation thereof, or the heat dissipation module described in the second aspect and any possible implementation thereof. The mobile terminal has a heat-generating surface, and the heat dissipation module is mounted on the mobile terminal via a mounting portion. When the heat dissipation module is in an unfolded state, its air outlet faces the heat-generating surface.

[0111] It should be understood that the beneficial effects of the third aspect are substantially the same as those of the first aspect and any possible implementation thereof, as well as the beneficial effects of the second aspect and any possible implementation thereof, and will not be elaborated upon here.

[0112] In one possible implementation of the third aspect mentioned above, when the heat dissipation module is in the deployed state, the distance between the air outlet and the heat-generating surface is 2mm to 30mm.

[0113] This ensures that the heat dissipation module can have a high airflow, thereby further improving its heat dissipation performance. At the same time, it ensures that the heat dissipation module operates with low noise.

[0114] In one possible implementation of the third aspect described above, the mobile terminal includes a phone, the phone includes a back cover, the back cover includes a heat-generating surface, and a heat dissipation module is mounted on the heat-generating surface of the back cover. This allows the heat dissipation module to better dissipate heat from the mobile terminal. Attached Figure Description

[0115] Figure 1A A perspective view of the mobile terminal in an embodiment of this application is shown;

[0116] Figure 1B An exploded view of the mobile terminal in an embodiment of this application is shown;

[0117] Figure 2A An exemplary structure of a mobile electronic device component according to an embodiment of this application is shown. Figure 2A The heat dissipation module inside is in a folded state;

[0118] Figure 2B An exemplary structure of a mobile electronic device component according to an embodiment of this application is shown. Figure 2B The heat dissipation module inside is in the deployed state;

[0119] Figure 2C according to Figure 2A and Figure 2B This paper shows a folded structure diagram of the heat dissipation module in a mobile electronic device assembly according to an embodiment of this application;

[0120] Figure 2D according to Figure 2A and Figure 2B This paper shows an expanded structural diagram of a heat dissipation module in a mobile electronic device assembly according to an embodiment of this application.

[0121] Figure 3A A perspective view of the mounting portion in a heat dissipation module according to an embodiment of this application is shown;

[0122] Figure 3B This application illustrates a partial structure along the heat dissipation module in an embodiment of the present application. Figure 3A A sectional view obtained by cutting through section AA in the middle;

[0123] Figure 3C An exploded view of the mounting portion in a heat dissipation module according to an embodiment of this application is shown;

[0124] Figure 4A This illustration shows a positioning diagram of the positioning element in an embodiment of this application. Figure 4A This is a side view of the positioning component;

[0125] Figure 4B This illustration shows a positioning diagram of the positioning element in an embodiment of this application. Figure 4B This is a top view of the positioning component;

[0126] Figure 5A A perspective view of another heat dissipation module in an embodiment of this application is shown;

[0127] Figure 5B This application illustrates a partial structure along the heat dissipation module in another embodiment. Figure 5A A sectional view obtained by cutting the middle BB section;

[0128] Figure 6A A perspective view of the working part in a heat dissipation module according to an embodiment of this application is shown;

[0129] Figure 6B An exploded view of the working part in a heat dissipation module according to an embodiment of this application is shown;

[0130] Figure 7A An exemplary structure of a jet piezoelectric fan according to an embodiment of this application is shown;

[0131] Figure 7B according to Figure 7A The air intake process of the jet piezoelectric fan in the embodiment of this application is shown;

[0132] Figure 7C according to Figure 7A The exhaust process of the jet piezoelectric fan in an embodiment of this application is shown;

[0133] Figure 8 A schematic diagram of the noise characteristics of a fan in an embodiment of this application is shown;

[0134] Figure 9A An exemplary structure of the dustproof net in the working section of this application is shown. Figure 9A This is an exploded view of a portion of the structure within the work area;

[0135] Figure 9B An exemplary structure of the dustproof net in the working section of this application is shown. Figure 9B This is a top view of the work area;

[0136] Figure 10A An exemplary structure two of the dustproof netting in the embodiments of this application is shown;

[0137] Figure 10BAn exemplary structure three of the dustproof netting in this application embodiment is shown;

[0138] Figure 10C An exemplary structure four of the dustproof netting in an embodiment of this application is shown;

[0139] Figure 10D This application illustrates an exemplary structure five of the dustproof netting.

[0140] Figure 10E An exemplary structure six of the dustproof netting embodiments of this application is shown;

[0141] Figure 10F An exemplary structure seven of the dustproof netting in an embodiment of this application is shown;

[0142] Figure 10G An exemplary structure eight of the dustproof netting in an embodiment of this application is shown;

[0143] Figure 10H An exemplary structure nine of the dustproof netting in an embodiment of this application is shown;

[0144] Figure 11A An exemplary structure of the dustproof net in a comparative embodiment of this application is shown;

[0145] Figure 11B An exemplary structure two of the dustproof netting in the comparative scheme of this application embodiment is shown;

[0146] Figure 11C An exemplary structure three of the dustproof netting in the comparative scheme of this application embodiment is shown;

[0147] Figure 12 An exemplary structure of the working part in another heat dissipation module according to an embodiment of this application is shown;

[0148] Figure 13A This application illustrates an exemplary structure of a rotating part in a heat dissipation module according to an embodiment of the present application. Figure 13A The heat dissipation module is in a folded state;

[0149] Figure 13B This application illustrates an exemplary structure of a rotating part in a heat dissipation module according to an embodiment of the present application. Figure 13B The heat dissipation module is in its unfolded state from one perspective;

[0150] Figure 13C This application illustrates an exemplary structure of a rotating part in a heat dissipation module according to an embodiment of the present application. Figure 13C The heat dissipation module is in its unfolded state from another perspective;

[0151] Figure 14A Exemplary configurations of the first wireless charging coil are shown in other embodiments of this application. Figure 14A The heat dissipation module is in a folded state;

[0152] Figure 14B Exemplary configurations of the first wireless charging coil are shown in other embodiments of this application. Figure 14B The heat dissipation module is in the deployed state;

[0153] Figure 14C Exemplary configurations of the first wireless charging coil are shown in other embodiments of this application. Figure 14C This is an exploded view of the heat dissipation module in a folded state.

[0154] Figure 15A An exemplary structure of another mobile electronic device component in an embodiment of this application is shown. Figure 15A The heat dissipation module inside is in a folded state;

[0155] Figure 15B This application illustrates an exemplary structure of another mobile electronic device component according to an embodiment of the present application. Figure 15B The heat dissipation module inside is in the deployed state;

[0156] Figure 16 according to Figure 15A and Figure 15B A schematic diagram illustrating the use of an operating component in an embodiment of this application is shown. Detailed Implementation

[0157] The specific embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0158] This application provides a heat dissipation module that can be applied to a mobile terminal to dissipate heat from heat-generating components in the mobile terminal.

[0159] It is understood that the mobile terminal provided in this application may include, but is not limited to, any of the following: mobile phone, portable Android device (PAD), laptop computer, personal digital assistant (PDA), in-vehicle equipment, wearable device (e.g., watch, bracelet, etc.), virtual reality (VR) terminal device, augmented reality (AR) terminal device, wireless terminal in industrial control, wireless terminal in self-driving, wireless terminal in remote medical care, etc., and this application does not impose any specific limitations on this. For ease of description, the following description will use a mobile phone as an example.

[0160] Figure 1A and Figure 1B An exemplary structure of the mobile terminal 10 in an embodiment of this application is shown. Figure 1A A 3D view of mobile terminal 10. Figure 1B This is an exploded view of mobile terminal 10. Figure 1B The assembly direction of each component in the mobile terminal 10 is also indicated by dashed arrows. (Reference) Figure 1A and Figure 1B The mobile terminal 10 may include a housing 11 and a display screen 12.

[0161] The housing 11 may include a mid-frame 11-1, a back cover 11-2, and a camera decorative cover 11-3. The mid-frame 11-1 forms the basic skeleton of the mobile terminal 10. The back cover 11-2 is disposed on one side of the mid-frame 11-1 and serves as the rear structural component of the mobile terminal 10, protecting the internal electronic components. In some implementations, the back cover 11-2 may also be referred to as a battery cover. An opening 11-4 is provided on the back cover 11-2, and the camera decorative cover 11-3 is disposed on this opening. The camera decorative cover 11-3 protects the camera (not shown) and also serves as a decorative element, enhancing the design of the back of the mobile terminal 10. In some implementations, the camera decorative cover 11-3 may also be referred to as a deco.

[0162] The display screen 12 is used to display images, videos, etc. The display screen 12 can also integrate touch function, allowing users to interact with the display screen 12 by touching it. The display screen 12 is installed on the other side of the middle frame 11-1, so that the middle frame 11-1, the back cover 11-2 and the display screen 12 can together form a receiving cavity 13.

[0163] The cavity 13 can accommodate a heat-generating device 14, which can generate significant heat during operation. In some embodiments of this application, the heat-generating device 14 may be any of the following devices, including but not limited to: a lens module, a satellite communication module, a fingerprint recognition module, an antenna, a vibration motor, a multimedia application processor (MAP), a radio frequency amplifier (RFA), a power amplifier (PA), a battery management chip (PMIC), a system-on-chip (SOC), universal flash storage (UFS), a central processing unit (CPU), a graphics processing unit (GPU), a power management chip (PMIC), memory (or internal memory), a charging chip, or a battery. This application does not specifically limit the device in this regard.

[0164] In some implementations, a circuit board (not shown) may also be provided in the receiving cavity 13, and the heating device 14 may be mounted on the circuit board. For example, the circuit board may be the motherboard of the mobile terminal 10, and the heating device 14 may be various electronic devices mounted on the motherboard.

[0165] It is understandable that the above Figure 1A and Figure 1B This illustration only shows some structural components contained within the mobile terminal 10; the actual construction and location of these components are not subject to change. Figure 1A and Figure 1B There are no limitations. For example, the heating element 14 can be located at any position on the housing 11, such as below the camera decorative cover 11-3. There can be multiple heating elements 14, such as two, three, or four, and the functions of the multiple heating elements 14 can be the same or different.

[0166] When the aforementioned mobile terminal 10 uses functions such as camera function, image processing or scene recognition through artificial intelligence (AI), satellite communication function, live streaming or playing games, the heat-generating device 14 can work and generate high heat.

[0167] For example, the heat-generating device 14 can be a camera. When the camera function is used for a long time or when artificial intelligence functions are used for scene recognition, image processing and other operations, the heat-generating device 14 will generate high heat.

[0168] For example, there can be multiple heat-generating devices 14, including a satellite communication module, an antenna, a processor, and a memory chip. When using the satellite communication function of the mobile terminal 10, multiple heat-generating devices 14 work together. For instance, the satellite communication module allows the mobile terminal 10 to communicate with satellite signals; the antenna is used to receive and transmit satellite signals; the processor can process satellite signal data and is responsible for running satellite communication algorithms; and the memory chip is used to store data related to satellite communication. During this collaborative operation, the heat-generating devices 14 generate significant heat.

[0169] In order to dissipate heat from the heat-generating device 14, a heat dissipation module can be set on the mobile terminal 10. Several heat dissipation modules are described below as examples.

[0170] In some technical solutions, the heat dissipation module can be a fan module disposed in the receiving cavity 13 of the mobile terminal 10, which is an active heat dissipation. For example, the fan module can be disposed opposite to the camera decorative cover 11-3, and the air inlet and air outlet of the fan module can be opened on the camera decorative cover 11-3 or the middle frame 11-1. Furthermore, the air inlet and air outlet need to be isolated from each other to prevent hot air from the air outlet from being re-drawn into the air inlet.

[0171] The fan module may include heat sink fins and a fan. When the heat-generating device 14 is working, the heat generated by the heat-generating device 14 can be transferred to the heat sink fins. Cool air can be drawn into the air duct from the air inlet, pressurized by the fan, flow through the heat sink fins or air duct, carrying away the heat, and then discharged from the air outlet, thereby achieving heat dissipation for the heat-generating device 14.

[0172] It is worth noting that the heat dissipation module is located inside the mobile terminal 10, occupying internal space. It is difficult for the heat dissipation module to be compatible with industrial design and high reliability.

[0173] For example, to ensure the aesthetic appeal and sophistication of the mobile terminal 10, the layout of the air inlet and outlet of the heat dissipation module is limited. Furthermore, dust and water vapor can enter the interior of the mobile terminal 10 through these inlets and outlets, resulting in limited protection, especially in extreme weather conditions such as sandstorms or when submerged in water. To meet the requirements of a thin and light design for the mobile terminal 10, the internal space is limited, restricting the size of the heat dissipation module. Therefore, the heat dissipation module is unlikely to have good reliability and its heat dissipation performance is poor.

[0174] Secondly, the heat dissipation module has poor maintainability. For example, when the mobile terminal 10 is dropped, bumped, or squeezed, the heat dissipation module will suffer significant localized impact and deformation, leading to failure. For instance, the localized impact force can reach 1g to 10g (g is the acceleration due to gravity), with localized deformation exceeding 0.1mm. For example, when dust accumulates in the air duct or fan (e.g., dust, fibrous dirt, etc.), it not only affects the industrial design of the mobile terminal 10 but also causes problems such as abnormal noise, reduced heat dissipation performance, and other issues, ultimately leading to failure. When the heat dissipation module fails, the mobile terminal 10 needs to be disassembled for repair, which can easily damage the mobile terminal 10's waterproof and dustproof properties (e.g., IP68 / IP69 level waterproof and dustproof), resulting in high repair and replacement costs and poor operability. For example, the cost of a fan can range from approximately 10 RMB / Pcs to 80 RMB / Pcs, and the price of a mobile terminal 10 can range from approximately 2000 RMB / Pcs to 20000 RMB / Pcs. However, the field failure rate (FFR) caused by the failure of the heat dissipation module is as high as 1%, meaning that the benefits are less than the losses, which affects user experience and reputation.

[0175] In other technical solutions, the heat dissipation module can be a heat dissipation back clip disposed on the outside of the mobile terminal 10. The heat dissipation back clip can be installed on the mobile terminal 10 to dissipate heat from the mobile terminal 10.

[0176] In some embodiments, the heat dissipation module may be a mechanically air-cooled heat dissipation back clip, which is an active heat dissipation device. The heat dissipation module may include a back clip housing, and a mounting mechanism, a fan, and heat dissipation fins disposed on the back clip housing. The mounting mechanism may be a snap-on type or a clamp type, the fan may be an axial fan or a centrifugal fan driven by a DC brushless motor, and the heat dissipation fins may be copper or aluminum finned heat sinks.

[0177] During operation, the heat dissipation module is fixed to the mobile terminal 10 by the mounting mechanism. The fan rotates to generate fluid, which is forced to flow through the heat dissipation fins in contact with the mobile terminal 10, thereby quickly removing the heat generated by the mobile terminal 10.

[0178] In some implementations, the heat dissipation module may also include a thermoelectric cooler (TEC) to enhance heat dissipation performance or even achieve cooling.

[0179] It's worth noting that the fan in this cooling module is either an axial or centrifugal fan, and it's quite thick, for example, more than 3.5mm. The fan's outlet velocity is relatively low, for example, less than 10m / s, requiring the use of metal heat sink fins. Therefore, the cooling module is quite bulky and heavy, making it less portable and less acceptable to users, primarily targeting niche gaming phones.

[0180] Secondly, the heat dissipation module cannot be adapted across different models, and developing a customized version for each machine is costly. For example, a plastic mold can support the processing of injection molded parts of approximately 1 million pieces or more, while the actual shipment volume of most heat dissipation modules is less than or equal to 50,000 pieces, resulting in a high cost when the mold cost is amortized to each heat dissipation module. Therefore, the heat dissipation module has poor versatility and its cost remains high.

[0181] In other embodiments, the heat dissipation module can also be a piezoelectric liquid-cooled heat dissipation back clip, employing an ultra-thin piezoelectric liquid pump that utilizes the inverse piezoelectric effect of piezoelectric ceramics. When the piezoelectric liquid pump operates, it drives the coolant in the heat dissipation module to circulate in a directional manner. The coolant flows through the heat-generating area of ​​the mobile terminal 10 and carries the heat to the cold area, thereby removing heat from the heat-generating area. The heat dissipation module has a built-in wireless charging coil, allowing the mobile terminal 10 to provide reverse power to the heat dissipation module. Furthermore, the heat dissipation module is communicatively connected to the mobile terminal 10, allowing the mobile terminal 10 to control the start and stop of the heat dissipation module.

[0182] It's worth noting that, on the one hand, the heat dissipation module is extremely thin, resulting in limited heat dissipation performance. From a macroscopic perspective of external heat dissipation, it still relies on natural heat dissipation and cannot achieve the performance of active air cooling. On the other hand, the heat dissipation module is wirelessly powered via a wireless charging coil, resulting in low power supply efficiency (e.g., less than 10%). This also leads to severe self-heating of the heat dissipation module, and even no steady-state thermal gain. Therefore, the heat dissipation performance of the heat dissipation module is poor.

[0183] In some implementations, the heat dissipation module can also be electrically connected to the mobile terminal 10 via a universal serial bus (USB) interface to achieve wired power supply. However, this results in poor portability of the heat dissipation module. Furthermore, there are contradictions between industrial design aesthetics, USB power supply, and charging requirements. For example, wired power supply requires cables, making the overall structure less streamlined and leading to poor industrial design; also, when the mobile terminal 10 supplies power to the heat dissipation module via the USB interface, the mobile terminal 10 cannot be charged via the USB interface.

[0184] In some other implementations, the heat dissipation module is electrically connected to the battery inside the mobile terminal 10 via a specially provided power supply metal interface on the back cover 11-2 or camera decorative cover 11-3 of the mobile terminal 10 to achieve wired power supply. However, the structures and layouts of the back cover 11-2, camera decorative cover 11-3, and battery are different for different mobile terminals 10, so the heat dissipation module cannot be adapted across models, resulting in poor universality of the heat dissipation module.

[0185] Secondly, the heat dissipation module cannot be adapted across different models. Its software communication with the mobile terminal 10 requires customized adaptation, resulting in high development costs due to case-by-case development. Therefore, the heat dissipation module has poor versatility.

[0186] In summary, the heat dissipation modules in the above solutions are difficult to reconcile with industrial design, high reliability, and portability, and cannot better meet the heat dissipation requirements of the mobile terminal 10.

[0187] In view of this, embodiments of this application provide a heat dissipation module for a mobile terminal. This heat dissipation module is a wind-cooled heat dissipation back clip that can be used as an external accessory for the mobile terminal. This heat dissipation module can be externally mounted on the mobile terminal without occupying internal space, achieving decoupling between the industrial design and high heat dissipation performance of the mobile terminal. It is also easy to maintain and highly reliable. The heat dissipation module may include a mounting part, a working part, a rotating part, and a wireless charging coil. The working part may include a battery and a piezoelectric fan. The mounting part and the working part are rotatably connected via the rotating part, allowing the heat dissipation module to switch between a folded state and an unfolded state. In the folded state, the wireless charging coil can couple with the wireless charging coil in the mobile terminal to charge the battery of the heat dissipation module; in the unfolded state, the wireless charging coil is not coupled with the wireless charging coil in the mobile terminal to stop charging the battery.

[0188] By flexibly adjusting the installation position of the mounting section on the mobile terminal and the angle between the mounting section and the working section, it is helpful to ensure that the heat dissipation module has high heat dissipation performance in different heat dissipation scenarios and is easy to adapt to the usage requirements of different application scenarios. The heat dissipation module has good portability and versatility.

[0189] Furthermore, the piezoelectric fan can remain off during charging in the folded state, while the wireless charging coil remains off in the unfolded state, although the piezoelectric fan can operate. This ensures that the wireless charging coil's operation does not affect the piezoelectric fan, further enhancing its heat dissipation performance. Simultaneously, powering the battery via the wireless charging coil, and then the piezoelectric fan via the battery, further improves the portability and versatility of the heat dissipation module.

[0190] The technical solution of this application is described below with reference to the accompanying drawings.

[0191] Figure 2A and Figure 2B An exemplary structure of a mobile electronic device component 1 according to an embodiment of this application is shown. Figure 2A The heat dissipation module 20 is in a folded state. Figure 2B The heat dissipation module 20 is in the deployed state. Figure 2C according to Figure 2A and Figure 2B This diagram shows the folded structure of the heat dissipation module 20 in the mobile electronic device component 1 according to an embodiment of this application. Figure 2D according to Figure 2A and Figure 2B This diagram illustrates the deployed state structure of the heat dissipation module 20 in the mobile electronic device component 1 according to an embodiment of this application. (Refer to...) Figure 2C and Figure 2D and combined Figure 2A and Figure 2B The heat dissipation module 20 may include a mounting part 200, a working part 210, a rotating part 220 and a first wireless charging coil 230.

[0192] The mounting portion 200 serves as the mounting base for the heat dissipation module 20, and is used to connect to the mobile terminal 10. In other words, the heat dissipation module 20 can be mounted on the mobile terminal 10 via the mounting portion 200. In some implementations, the mounting portion 200 may include a housing 201, which protects the components inside the mounting portion 200.

[0193] The working unit 210 is a functional module of the heat dissipation module 20, used to implement the heat dissipation function of the heat dissipation module 20. In some implementations, the working unit 210 may include a housing 211, which protects the internal components of the working unit 210, such as the battery 212 and the piezoelectric fan 213. The battery 212 supplies power to the piezoelectric fan 213, which dissipates heat from the mobile terminal 10. For example, Figure 2D The direction of airflow from the piezoelectric fan 213 is indicated by a thick dashed arrow, and the direction of airflow from the piezoelectric fan 213 is indicated by a thick dashed arrow. The direction of airflow from the piezoelectric fan 213 is indicated by a thick solid arrow, and the high-speed ejection of gas from the outlet P1 entrains air along its flow path. As the gas gradually moves away from the outlet P1 and entrains surrounding air along its path, the gas velocity gradually decreases, and the gas flow rate gradually increases.

[0194] The rotating part 220 rotatably connects the mounting part 200 and the working part 210, so that the heat dissipation module 20 can be rotated. Figure 2A and Figure 2C The folded state shown Figure 2B and Figure 2D Switching between the expanded states shown.

[0195] The first wireless charging coil 230 is used to couple with the second wireless charging coil 15 in the mobile terminal 10 so as to charge the battery 212 of the working unit 210 to maintain the power supply of the battery 212.

[0196] In the heat dissipation module 20 Figure 2A and Figure 2C In the folded state shown, the mounting part 200 and the working part 210 can be stacked along the Z-axis direction. For example, the included angle between the mounting part 200 and the working part 210 can be in the range of 0° to 10°. For example, the included angle can be 0°, 5°, or 10°.

[0197] At this time, the first wireless charging coil 230 can be coupled with the second wireless charging coil 15 in the mobile terminal 10 to charge the battery 212 of the working unit 210.

[0198] In the heat dissipation module 20 Figure 2B and Figure 2D In the unfolded state shown, the mounting part 200 and the working part 210 can be set at a relatively large angle. For example, the included angle between the mounting part 200 and the working part 210 can be greater than 10°. For example, the included angle can be 45°, 60°, 90° or 135°, etc.

[0199] At this time, the first wireless charging coil 230 is not coupled to the second wireless charging coil 15 in the mobile terminal 10, so as to stop charging the battery 212 of the working unit 210. Furthermore, the air outlet P1 of the piezoelectric fan 213 of the working unit 210 can be directed toward the heat-generating surface S1 of the mobile terminal 10, so that the cool air blown out by the piezoelectric fan 213 can be transferred to the heat-generating surface S1 of the mobile terminal 10, thereby achieving efficient heat dissipation of the mobile terminal 10.

[0200] For example, whether the first wireless charging coil 230 is coupled to the second wireless charging coil 15 in the mobile terminal 10 can be determined in the following way.

[0201] In some implementations, the indicator light 250 of the heat dissipation module 20 can indicate whether the first wireless charging coil 230 is coupled to the second wireless charging coil 15 in the mobile terminal 10. This method of judgment is convenient and fast.

[0202] For example, indicator light 250 can indicate the operating status of battery 212. When indicator light 250 indicates that battery 212 is not in a charging state, for example, when indicator light 250 indicates that battery 212 is in a discharging state, it can be determined that the first wireless charging coil 230 is not coupled to the second wireless charging coil 15; when indicator light 250 indicates that battery 212 is in a charging state, and heat dissipation module 20 is not supplying power to battery 212 for charging through power supply interface (e.g., USB interface), it can be determined that the first wireless charging coil 230 is coupled to the second wireless charging coil 15.

[0203] In some implementations, the coupling between the first wireless charging coil 230 and the second wireless charging coil 15 in the mobile terminal 10 can be determined by the change in the voltage or charge of the battery 212.

[0204] For example, when the voltage or charge of battery 212 remains essentially unchanged, it indicates that battery 212 is neither in a discharging state to supply power to piezoelectric fan 213 nor in a charging state. Therefore, it can be determined that the first wireless charging coil 230 is not coupled to the second wireless charging coil 15. It should be noted that "the voltage or charge of battery 212 remains essentially unchanged" does not mean that the voltage or charge of battery 212 is completely and strictly constant. In fact, the voltage or charge of battery 212 can experience extremely small or slow changes. For example, the internal resistance of battery 212 can cause a slow change in voltage or charge, which can be considered as essentially unchanged.

[0205] For example, when the voltage or charge of battery 212 gradually decreases, it indicates that battery 212 is in a discharging state. Therefore, it can be determined that the first wireless charging coil 230 is not coupled to the second wireless charging coil 15. Conversely, when the voltage or charge of battery 212 gradually increases, it indicates that battery 212 is in a charging state. When the heat dissipation module 20 is not supplying power to the battery through the power supply interface (e.g., USB interface), it can be determined that the first wireless charging coil 230 is coupled to the second wireless charging coil 15.

[0206] In some implementations, the coupling between the first wireless charging coil 230 and the second wireless charging coil 15 in the mobile terminal 10 can be determined by the voltage or current change of the internal circuit of the first wireless charging coil 230.

[0207] For example, when there is no minute-level voltage or current in the internal circuitry of the first wireless charging coil 230, it can be determined that the first wireless charging coil 230 is not coupled to the second wireless charging coil 15; conversely, when there is minute-level voltage or current in the internal circuitry of the first wireless charging coil 230, and the heat dissipation module 20 is not supplying power to the battery for charging through a power supply interface (e.g., a USB interface), it can be determined that the first wireless charging coil 230 is coupled to the second wireless charging coil 15. It should be noted that minute-level voltage or current refers to voltage or current that lasts for one minute or more, that is, the voltage or current is stable and not caused by short-term interference.

[0208] It should be noted that the heat-generating surface S1 of the mobile terminal 10 can refer to the surface where the temperature of the heat generated by the heat-generating device 14 is significantly increased after being transferred to the housing 11 of the mobile terminal 10 during operation, thus dissipating heat to the outside. For example, due to the good thermal conductivity of the back cover 11-2, a large amount of heat generated by the heat-generating device 14 during operation will be transferred to the back cover 11-2 and then to the external environment of the mobile terminal 10 via the back cover 11-2. Therefore, the heat-generating surface S1 of the mobile terminal 10 can be the surface of the back cover 11-2, but this application is not limited to this. In other embodiments, the heat-generating surface S1 of the mobile terminal 10 can also be other surfaces of the mobile terminal 10, such as the surface of the mid-frame 11-1, the side, the surface of the camera decorative cover 11-3, or the surface of the display screen 12, etc.

[0209] It should also be noted that in this embodiment, the number of heating surfaces S1 is one, but this application is not limited to this. In some other embodiments, the number of heating surfaces S1 may also be multiple, such as two, three, or four. In this case, the air outlet P1 of the piezoelectric fan 213 of the heat dissipation module 20 can be directed towards at least one heating surface S1 to dissipate heat from that heating surface S1.

[0210] The aforementioned heat dissipation module 20 is externally mounted on the mobile terminal 10 via the mounting part 200. In other words, the heat dissipation module 20 can be used as an external accessory for the mobile terminal 10. Alternatively, the heat dissipation module 20 is not located inside the mobile terminal 10 and does not occupy internal space. Furthermore, it does not conflict with the design of the mobile terminal 10 itself, nor does it affect the industrial design, board area, or waterproof and dustproof design of the mobile terminal 10. For example, the layout of the air inlet P2 and air outlet P1 of the piezoelectric fan 213 of the heat dissipation module 20 does not affect the aesthetics and refinement of the mobile terminal 10. The size of the heat dissipation module 20, especially the air inlet and outlet ducts, is not limited by the internal layout space of the mobile terminal 10, allowing the mobile terminal 10 to be designed to be thinner and lighter. Therefore, the heat dissipation module 20 provided in this embodiment can decouple the industrial design and high reliability of the mobile terminal 10, and the heat dissipation performance of the heat dissipation module 20 is excellent.

[0211] Furthermore, users can disassemble and install the mounting unit 200 themselves to facilitate cleaning, repair, or replacement of the components of the heat dissipation module 20 without disassembling or damaging the mobile terminal 10, thus not affecting the reliability of the mobile terminal 10. Maintenance is simple, the module is replaceable, and the cost is low. Therefore, the heat dissipation module 20 provided in this embodiment has good maintainability and reliability.

[0212] Secondly, by flexibly adjusting the mounting position of the mounting part 200 on the mobile terminal 10 and the angle between the mounting part 200 and the working part 210, the heat dissipation module 20 can better achieve targeted low-impedance free-field heat dissipation, fully utilizing the high-velocity convolution effect of the jet piezoelectric fan. This helps ensure that the heat dissipation module 20 has high heat dissipation performance and low noise in different heat dissipation scenarios. Therefore, the heat dissipation module 20 provided in this embodiment has good heat dissipation performance and low noise.

[0213] Furthermore, it allows the heat dissipation module 20 to better adapt to the usage needs of different application scenarios. For example, when heat dissipation is not required, the heat dissipation module 20 can be switched to a folded state for easy carrying, while simultaneously charging the battery 212 of the heat dissipation module 20; when heat dissipation is required, the heat dissipation module 20 can be switched to an unfolded state to allow the piezoelectric fan 213 to work efficiently. As another example, for different mobile terminals 10, the heat dissipation module 20 can be installed in different locations via the mounting part 200, even on other accessories of the mobile terminal, or the mounting part 200 of the heat dissipation module 20 can be set on other structures for independent heat dissipation, such as on vehicle interior structural components. By adjusting the angle between the mounting part 200 and the working part 210, selective heat dissipation of different heat dissipation surfaces can be achieved to adapt to different working conditions, offering high flexibility and a wide range of applications. Therefore, the heat dissipation module 20 provided in this embodiment has excellent portability and versatility.

[0214] Finally, when the heat dissipation module 20 is in Figure 2A and Figure 2C In the folded state shown, the first wireless charging coil 230 can charge the battery 212 to store energy, and the piezoelectric fan 213 can be deactivated; when the heat dissipation module 20 is in the folded state... Figure 2B and Figure 2D In the unfolded state shown, the battery 212 can supply power to the piezoelectric fan 213, at which point the piezoelectric fan 213 can operate to dissipate heat from the mobile terminal 10. That is, the piezoelectric fan 213 is powered by the battery 212, rather than directly by the first wireless charging coil 230, thus ensuring that the power supply efficiency of the first wireless charging coil 230 does not affect the heat dissipation performance of the heat dissipation module 20. Simultaneously, the first wireless charging coil 230 and the piezoelectric fan 213 can operate at off-peak times, avoiding excessive instantaneous heat generation. Therefore, this helps to further improve the heat dissipation performance of the heat dissipation module 20.

[0215] Furthermore, this power supply method features a simple structure, independent and universal components, and low cost. It effectively avoids the problems of conflicting industrial design effects, USB power supply and charging requirements, and incompatibility with different models found in the aforementioned technical solutions. Therefore, it helps to further improve the portability and versatility of the heat dissipation module 20.

[0216] It should be noted that in some application scenarios, the operating frequency of some components of the mobile terminal 10 is close to the operating frequency of the piezoelectric fan 213 (e.g., 20kHz to 30kHz). Therefore, when the heat dissipation module 20 is in the folded state, the piezoelectric fan 213 is not working, which can effectively avoid mutual interference between the piezoelectric fan 213 and the components in the mobile terminal 10, and also avoid the problem of limited space and weak heat dissipation benefits in the folded state. When the heat dissipation module 20 is in the unfolded state, the piezoelectric fan 213 is working. At this time, the piezoelectric fan 213 is far away from the mobile terminal 10, so the piezoelectric fan 213 will not interfere with the components in the mobile terminal 10, and the heat dissipation benefits are significant. In other words, by turning off the piezoelectric fan 213 when the heat dissipation module 20 is in the folded state and turning it on when the heat dissipation module 20 is in the unfolded state, it can be ensured that the heat dissipation module 20 has a better user thermal experience and performance experience in various application scenarios.

[0217] In some embodiments of this application, the operating frequency of the piezoelectric fan 213 can be reasonably designed to avoid the operating frequency range of devices that may cause potential interference. For example, the operating frequency of the piezoelectric fan 213 can be set in a frequency band that is not sensitive to the human ear, such as 18kHz to 20kHz, thereby maximizing the reduction of interference between the piezoelectric fan 213 and the devices in the mobile terminal 10.

[0218] Furthermore, compared to traditional mechanical fans, the piezoelectric fan 213 has no traditional rotating parts, is completely solid-state, has no bearings or motors, and is directly driven by piezoelectric elements. It is suitable for scenarios with high reliability requirements and severely limited thickness space, such as mobile terminals, which are prone to drops. The piezoelectric fan 213 has a high air velocity at its outlet P1, for example, the air velocity can reach more than 10m / s. This airflow can break the thermal boundary layer on the surface of the heat source, significantly improving the convective heat transfer efficiency. It can achieve a significant weight reduction without the need for metal heat sink fins and has a strong dust removal effect. Since the piezoelectric fan 213 usually operates in the ultrasonic frequency band (>20kHz), which is inaudible to the human ear and has low mechanical noise, the high air velocity results in prominent aerodynamic noise, especially in the high-velocity, low-flow area near the air outlet, where jet impact noise is prominent. It is not suitable for confined space channels, but it is suitable for open free fields with low impedance. It can also utilize the convolution effect to enhance heat dissipation and achieve low noise.

[0219] Therefore, compared with traditional fan cooling, the heat dissipation module 20 provided in this application combines the mounting part 200 and the piezoelectric fan 213. The mounting part 200 achieves the effect of placing the heat dissipation module 20 externally on the mobile terminal 10 without occupying internal space. Under low impedance free field, the piezoelectric fan 213 utilizes the convolution effect of non-isolated air intake and exhaust, which further improves the heat dissipation capacity of the heat dissipation module 20 and achieves low noise, avoiding and controlling the influence of jet impact noise. Therefore, the heat dissipation module 20 in this application embodiment achieves the effect of "1+1>2".

[0220] The above will be further explained below with reference to the accompanying drawings. Figure 2A and Figure 2B The heat dissipation module 20 shown in the embodiment includes a mounting part 200, a working part 210, a rotating part 220, and a first wireless charging coil 230.

[0221] It is understood that the mounting part 200 of the heat dissipation module 20 can be installed at any position of the mobile terminal 10, including other accessories of the mobile terminal 10 or other product structural components that are not mobile terminal 10. This application does not impose specific restrictions on this, as long as the heat dissipation module 20 can dissipate heat from the mobile terminal 10.

[0222] For example, in the above Figure 2A and Figure 2B In the illustrated embodiment, the mounting portion 200 of the heat dissipation module 20 can be mounted on the heat-generating surface S1 of the rear cover 11-2 of the mobile terminal 10. This facilitates better heat dissipation from the mobile terminal 10 by the heat dissipation module 20.

[0223] In some implementations, when the heat dissipation module 20 is mounted on the back cover 11-2 of the mobile terminal 10 via the mounting part 200, the heat dissipation module 20 can be switched to... Figure 2B and Figure 2D The unfolded state shown allows the heat dissipation module 20 to support the mobile terminal 10. That is, when the heat dissipation module 20 is in... Figure 2B and Figure 2D In the unfolded state shown, the heat dissipation module 20 can also serve as a support to support the mobile terminal 10 on other components (e.g., a desktop).

[0224] For example, in some other embodiments, the mounting part 200 of the heat dissipation module 20 may also be mounted on other locations of the mobile terminal 10, such as the surface of components such as the mid-frame 11-1, the camera decorative cover 11-3, or the display screen 12, or other accessories of the mobile terminal such as the mobile phone. This application does not impose specific limitations on this.

[0225] It is understood that the mounting part 200 of the heat dissipation module 20 can be connected to the mobile terminal 10 in various ways. This application does not impose specific limitations on this, as long as the heat dissipation module 20 can be installed on the mobile terminal 10. Several connection methods are described below with reference to the accompanying drawings.

[0226] Figures 3A to 3C This paper illustrates an exemplary structure of the mounting portion 200 of a heat dissipation module 20 according to an embodiment of this application. Figure 3A This is a 3D view of part of the structure of the heat dissipation module 20. Figure 3B For the heat dissipation module 20, some structures along Figure 3A A sectional view obtained by cutting along section AA. Figure 3C This is an exploded view of the installation section 200.

[0227] refer to Figures 3A to 3C In some embodiments of this application, the mounting portion 200 of the heat dissipation module 20 can be connected to the mobile terminal 10 by magnetic attraction.

[0228] The mounting portion 200 may include a first magnetic member 202, and the heat dissipation module 20 may include a second magnetic member 203. The first magnetic member 202 is used to attach to the second magnetic member 203, and the second magnetic member 203 is used to install on a mobile terminal (not shown). Thus, after the second magnetic member 203 is installed on the mobile terminal, the mounting portion 200 can be fitted to the location of the second magnetic member 203 in the mobile terminal, so that the first magnetic member 202 and the second magnetic member 203 can be automatically attached and fixed, thereby allowing the heat dissipation module 20 to be installed on the mobile terminal.

[0229] This connection method allows for repeated assembly and disassembly of the heat dissipation module 20, supporting thousands of magnetic cycles, and its durability and reliability far exceed those of mechanical fixing methods. Secondly, this connection method facilitates modular design, adapting to phones of various sizes and thicknesses, offering strong compatibility. Finally, this connection method allows for simple and quick alignment and fixation, making operation convenient and fast. Furthermore, the magnetic material exhibits stable performance in environments ranging from -20℃ to 60℃, thus providing excellent temperature adaptability.

[0230] In some implementations, the first magnetic member 202 can be disposed at any position of the mounting portion 200, for example, at the bottom of the housing 201 of the mounting portion 200; this application does not impose specific limitations on this. The second magnetic member 203 can be disposed at any position of the mobile terminal, for example, on the outer surface of the back cover of the mobile terminal.

[0231] In some other embodiments, the heat dissipation module 20 may not include the second magnetic member 203. The second magnetic member 203 may be a device belonging to the mobile terminal itself. The second magnetic member 203 may be placed at any position of the mobile terminal, such as inside the back cover of the mobile terminal. This application does not impose specific restrictions on this.

[0232] For example, the mounting section 200 may also include Mylar 204 to enhance the appearance and sophistication of the mounting section 200.

[0233] The aforementioned connection method occupies less space, which helps to achieve a thinner and lighter design for the heat dissipation module 20. For example, the total weight of the heat dissipation module 20 can be approximately 20 grams, and the total thickness of the heat dissipation module 20 can be approximately 6.05 mm. Figure 3B As shown, when the heat dissipation module 20 is in the folded state, the housing 201 of the mounting part 200, the first magnetic clasp 202 and the Mylar 204, the housing 211 of the working part 210, and the piezoelectric fan 213 are stacked along the Z-axis direction. In the mounting part 200, the thickness of the housing 201 can be approximately 0.5 mm, the thickness of the first magnetic clasp 202 can be approximately 1.3 mm, and the thickness of the Mylar 204 can be approximately 0.15 mm; in the working part 210, the thickness of the housing 211 can be approximately 1.1 mm, and the thickness of the piezoelectric fan 213 can be approximately 3 mm.

[0234] It should be noted that, in the embodiments of this application, the thickness of each component may refer to the dimension of each component along the Z-axis when the heat dissipation module 20 is in a folded state, which will not be elaborated further below.

[0235] In some implementations, the first magnetic element 202 can be a magnet or a ferromagnetic element (e.g., an iron sheet). Similarly, the second magnetic element 203 can also be a magnet or a ferromagnetic element (e.g., an iron sheet). For example, the first magnetic element 202 can be a magnet and the second magnetic element 203 can be an iron sheet; or the first magnetic element 202 can be an iron sheet and the second magnetic element 203 can be a magnet; or both the first magnetic element 202 and the second magnetic element 203 can be magnets.

[0236] For example, the magnet in this application can be a magnet compatible with common magnetic standards (e.g., the MagSafe standard), which can have greater versatility and ease of use, and achieve precise positioning.

[0237] For example, the magnets in this application may be a ring-shaped magnet array.

[0238] For example, the magnet in this application may be made of neodymium iron boron strong magnetic material.

[0239] In some implementations, the magnetic attraction force between the first magnetic member 202 and the second magnetic member 203 is adjustable. For example, the first magnetic member 202 and / or the second magnetic member 203 can be magnets with adjustable magnetic attraction force; or, the magnetic attraction force of the first magnetic member 202 and / or the second magnetic member 203 can be adjusted by a magnetic force adjustment mechanism. This application does not impose specific limitations on this, as long as the magnetic attraction force between the first magnetic member 202 and the second magnetic member 203 can be adjusted.

[0240] Thus, by flexibly adjusting the magnetic attraction force between the first magnetic component 202 and the second magnetic component 203, different application scenarios and user preferences can be adapted. For example, the magnetic attraction force between the first magnetic component 202 and the second magnetic component 203 can have three levels: weak, medium, and strong. When it is necessary to remove the heat dissipation module 20 from the mobile terminal 10, the magnetic attraction force between the first magnetic component 202 and the second magnetic component 203 can be adjusted to the weak level to reduce the difficulty of disassembling the heat dissipation module 20; when the heat dissipation module 20 is installed on the mobile terminal 10, the magnetic attraction force between the first magnetic component 202 and the second magnetic component 203 can be adjusted to the strong level to ensure that the heat dissipation module 20 can be reliably installed on the mobile terminal 10.

[0241] In some implementations, to reduce the installation difficulty of the second magnetic component 203, the heat dissipation module 20 may also include a positioning component. Figure 4A and Figure 4B This illustration shows a positioning diagram of the positioning element 205 in an embodiment of this application. Figure 4A This is a side view of the positioning component 205. Figure 4B This is a top view of the positioning component 205.

[0242] refer to Figure 4A and Figure 4B The positioning component 205 is used to position the second magnetic component 203 during the installation of the second magnetic component 203 onto the mobile terminal 10. This ensures that the second magnetic component 203 can be installed in a suitable and substantially correct position, thereby reducing the difficulty of installing the second magnetic component 203.

[0243] For example, during the installation of the second magnetic member 203 onto the mobile terminal 10, one end of the positioning member 205 can be inserted into the power supply interface 16 (e.g., USB port) of the mobile terminal 10, and the other end of the positioning member 205 can cooperate with the second magnetic member 203. In this way, the second magnetic member 203 can be installed in a suitable and substantially correct position.

[0244] Since the power supply interfaces 16 of different mobile terminals 10 are not much different, the positioning component 205 can be adapted to different mobile terminals 10 by installing the positioning component 205 based on the power supply interface 16, thus making it more versatile.

[0245] For example, the positioning element 205 may have multiple positioning standards (e.g., two, three, or four levels) to more accurately adapt to different models. For example Figure 4B As shown, the positioning component 205 can have three different positioning standards: first standard 205a, second standard 205b, and third standard 205c. For one type of mobile terminal 10, the second magnetic component 203 can be positioned and installed according to the first standard 205a; for another type of mobile terminal 10, the second magnetic component 203 can be positioned and installed according to the second standard 205b; and for yet another type of mobile terminal 10, the second magnetic component 203 can be positioned and installed according to the third standard 205c.

[0246] For example, the positioning element 205 may be stepped and telescopic to switch between a first standard 205a, a second standard 205b, and a third standard 205c. Alternatively, the positioning element 205 may also have different scales to mark the first standard 205a, the second standard 205b, and the third standard 205c, which is not specifically limited in this application.

[0247] Figure 5A and Figure 5B This invention illustrates an exemplary structure of another heat dissipation module 20 in an embodiment of this application. Figure 5A This is a 3D view of part of the structure of the heat dissipation module 20. Figure 5B For the heat dissipation module 20, some structures along Figure 5A A sectional view obtained by cutting the BB section.

[0248] refer to Figure 5A and Figure 5B In some other embodiments of this application, the mounting portion 200 of the heat dissipation module 20 may include a van der Waals suction cup 206, and the mounting portion 200 may be attached to a mobile terminal (not shown) by means of the van der Waals suction cup 206.

[0249] The Van der Waals Force Suction Cup 206 is a biomimetic suction cup that relies on intermolecular van der Waals forces for adsorption. It draws inspiration from the micron-scale bristle / fiber array on a gecko's foot, and generates adhesive force by forming a large number of molecular-level contact points with the adsorbed surface through micro-nano structures. It is reversible, non-destructive, and reusable.

[0250] This connection method allows for repeated disassembly and reassembly of the heat dissipation module 20, supporting 20 to 100 disassembly and reassembly cycles, far exceeding traditional adhesive solutions. It leaves no residue, meaning no adhesive marks are left after disassembly, preserving the mobile terminal's appearance. This is suitable for applications requiring frequent disassembly and reassembly of the heat dissipation module 20. The micro van der Waals suction cup 206 can be released from its grip simply by gently bending the edge of the mounting part 200, achieving non-destructive disassembly. After prolonged use, the surface of the van der Waals suction cup 206 can be cleaned with water to restore its suction power. It has a long service life and is easy to maintain. Furthermore, this connection method is highly compatible, suitable for various materials on the surface to be attracted, and is safe and reliable, with stable and controllable suction power, avoiding the safety risks associated with magnetic attraction solutions.

[0251] The aforementioned connection method occupies less space, which helps to achieve a thinner and lighter design for the heat dissipation module 20. For example, the total weight of the heat dissipation module 20 can be approximately 22 grams, and the total thickness of the heat dissipation module 20 can be approximately 6.05 mm. Figure 5B As shown, when the heat dissipation module 20 is in the folded state, the housing 201 of the mounting part 200, the van der Waals suction cup 206, the housing 211 of the working part 210, and the piezoelectric fan 213 are stacked along the Z-axis. In the mounting part 200, the total thickness of the housing 201 and the van der Waals suction cup 206 can be approximately 1 mm; in the working part 210, the thickness of the housing 211 can be approximately 1.1 mm, and the thickness of the piezoelectric fan 213 can be approximately 3 mm; the gap between the mounting part 200 and the working part 210 can be approximately 0.95 mm, which can serve as the air outlet duct for the piezoelectric fan 213.

[0252] In some of these implementations, the van der Waals force suction cup 206 can also be referred to as a micro suction cup.

[0253] It is understandable that the above Figures 3A to 5B This illustration only shows several ways in which the mounting part 200 can be connected to the mobile terminal 10, and does not constitute a limitation of this application. For example, in some other embodiments, the mounting part 200 can also be connected to the mobile terminal 10 by means of adhesion, snap-fit, or fastener connection.

[0254] Alternatively, it can be understood that the above... Figures 3A to 5B In the embodiments shown, the mounting portion 200 is circular in shape, but this application is not limited to this. In other embodiments, the mounting portion 200 may also be a regular shape such as a rectangle, ellipse, or ring, or other irregular shapes.

[0255] After introducing the mounting part 200 of the heat dissipation module 20, the working part 210 of the heat dissipation module 20 will be introduced below with reference to the accompanying drawings.

[0256] Figure 6A and Figure 6BThis paper illustrates an exemplary structure of the working part 210 in a heat dissipation module 20 according to an embodiment of the present application, wherein... Figure 6A A three-dimensional view of Work Unit 210. Figure 6B This is an exploded view of work section 210, with dashed arrows indicating the assembly direction of each component. For ease of observation, Figure 6A The dustproof net 215 of the working part 210 is not shown in the figure.

[0257] refer to Figure 6A and Figure 6B In some embodiments of this application, the piezoelectric fan 213 of the working unit 210 may include a jet port P0. The jet port P0 serves as both the air outlet P1 and the air inlet P2 of the piezoelectric fan 213. The jet port P0 is used for both inlet and outlet of fluid; that is, the air inlet and outlet positions of the piezoelectric fan 213 are both achieved through the same jet port P0. Alternatively, there is no isolation between the air outlet P1 and the air inlet P2 of the piezoelectric fan 213. For example, Figure 6A The direction of airflow from the piezoelectric fan 213 is indicated by a thick dashed arrow, and the direction of airflow from the piezoelectric fan 213 is indicated by a thick dashed arrow. A thick solid arrow indicates the high-speed ejection of gas from the outlet P1, which entrains air near the flow path along its course. As the gas gradually moves away from the outlet P1 and entrains surrounding air along its path, the gas velocity gradually decreases, and the gas flow rate gradually increases.

[0258] In some implementations, the jet port P0 can also be referred to as the nozzle.

[0259] It is understandable that, utilizing the Helmholtz resonance effect, the air velocity at the outlet P1 of the piezoelectric fan 213 can reach over 30 m / s. The ejected fluid will entrain surrounding air along its path. Although the fluid velocity gradually decreases, the flow rate continuously increases. Compared to the limited flow channels and air intake / exhaust isolation in the confined space of a mobile phone, the free-field entrainment effect of the jet piezoelectric fan provided in this application can bring higher flow rate, stronger heat dissipation capacity, and lower noise. After the exhaust air leaves the dust filter 215 of the working part 210, due to the high flow velocity, the entrainment effect is still very significant, and nearby free-field cold air continues to be added, increasing the flow rate, thereby further improving the heat dissipation effect.

[0260] It should be noted that, Figure 6A and Figure 6B The mounting section 200 of the illustrated embodiment is similar to the one described above. Figures 3A to 3C The mounting part 200 in the illustrated embodiment is substantially the same; therefore, please refer to the above description for details. Figures 3A to 3C The relevant descriptions in the illustrated embodiments are not repeated here. In other embodiments, Figure 6A and Figure 6B The mounting section 200 can also have other structures, for example, it can be as described above. Figure 5A and Figure 5B The mounting part 200 in the illustrated embodiment is not specifically limited in this application.

[0261] The working principle and effect of the jet piezoelectric fan 213 provided in the embodiments of this application are described below with reference to the accompanying drawings.

[0262] Figure 7A An exemplary structure of the jet piezoelectric fan 213 in this application embodiment is shown. Figure 7B according to Figure 7A The air intake process of the jet piezoelectric fan 213 in this embodiment is shown. Figure 7C according to Figure 7A The exhaust process of the jet piezoelectric fan 213 in the embodiment of this application is shown.

[0263] refer to Figures 7A to 7C The piezoelectric fan 213 is a synthetic jet piezoelectric fan. A synthetic jet is characterized by outputting only momentum with zero mass, hence it is also called a zero-mass jet. Compared to traditional continuous blowing or suction dynamic control technologies, synthetic jets offer numerous advantages such as simple and compact structure, ultra-thin design, light weight, low cost, easy maintenance, and no need for an additional air source. However, this application is not limited to these advantages. For example, in some embodiments, the piezoelectric fan 213 may also be a non-zero-mass jet fan with inlet and outlet air isolation, and the outlet also emits high-velocity, low-flow air, utilizing the free-field convolution effect to enhance heat dissipation and reduce noise.

[0264] The working principle and effect of the synthetic jet piezoelectric fan 213 are illustrated below.

[0265] In other words, the piezoelectric fan 213 can be a synthetic jet fan that generates fluid using the principle of the synthetic jet exciter 2130. The synthetic jet exciter 2130 can alternately blow and suck in the surrounding fluid to generate a discontinuous jet (i.e., a synthetic jet). The synthetic jet exciter 2130 has a cavity that can generate a certain vibration mechanism (such as a piston, piezoelectric film, electromagnetic film, etc.), and the cavity is connected to the external fluid through the jet port. When the synthetic jet exciter 2130 is working, it alternately blows and sucks in the surrounding fluid. The blown fluid forms vortex rings due to shearing action and moves away from the orifice. Under certain conditions, it may not be sucked back into the synthetic jet exciter 2130.

[0266] For example Figures 7A to 7CAs shown, the synthetic jet exciter 2130 may include a piezoelectric ceramic 2131, a piezoelectric vibrator 2132, a diaphragm 2133, and a spring support 2134. The piezoelectric ceramic 2131 is disposed on the piezoelectric vibrator 2132, and the piezoelectric vibrator 2132 and the diaphragm 2133 together form a cavity 2135. The diaphragm 2133 is also provided with a jet port P0. The piezoelectric ceramic 2131 is usually provided with power supply electrodes and / or power supply devices such as flexible printed circuit boards (FPC).

[0267] During the operation of the synthetic jet exciter 2130, the piezoelectric ceramic 2131 can convert the periodically changing voltage signal into mechanical vibration using the inverse piezoelectric effect, thereby driving the piezoelectric oscillator 2132 and the diaphragm 2133 to produce periodic motion. The spring support 2134 can provide elastic support for the piezoelectric oscillator 2132, assisting the piezoelectric oscillator 2132 in resetting, preventing external impacts from being directly transmitted to the fragile piezoelectric ceramic 2131, and improving vibration efficiency and structural stability.

[0268] During the periodic motion of the piezoelectric vibrator 2132 and the diaphragm 2133, the volume of the cavity 2135 can change periodically, thereby allowing air to enter or exit through the jet port P0, so that fluid can enter and exit through the jet port P0. Figure 7B As shown, during the intake process, the volume of cavity 2135 increases, and a large amount of fluid can be drawn into cavity 2135 from jet port P0 in the direction indicated by the arrow; as Figure 7C As shown, during the exhaust process, the volume of cavity 2135 decreases, and a large amount of fluid can be blown out of cavity 2135 through jet port P0 in the direction indicated by the arrow.

[0269] During the alternating blowing and suction process, the fluid near the jet inlet P0 is subjected to strong shearing, resulting in flow separation at the jet inlet P0. This separation causes the fluid to roll downwards with the discharged fluid, forming vortex rings or vortex pairs (i.e., the convolution effect). When the next suction process begins, the vortex rings or vortex pairs formed in the previous blowing process and moving downstream have moved away from the jet inlet P0 and are no longer affected by the suction. In this continuous alternating blowing and suction process, the fluid forms a series of downstream migrating vortex rings or vortex pairs. This series of vortex rings or vortex pairs undergoes instability and breakup processes during its downstream movement, ultimately forming a stable turbulent or laminar jet downstream of the outlet.

[0270] Thus, the jet-type piezoelectric fan 213 does not separate the air inlet and outlet. Fluid can enter and exit directly through the jet port P0 without experiencing long distances and turns inside the fan 213. This results in less fluid loss, a larger air volume, and lower impedance, effectively removing heat from the mobile terminal. Utilizing the free space outside the mobile terminal, the high-velocity, low-flow gas ejected from the jet port convolves and develops into low-velocity, high-flow gas before colliding with the heating surface, causing convective heat transfer, thereby improving heat dissipation efficiency and reducing noise. It does not require conductive materials such as thermal interface materials, nor does it require heavy metal structural components such as heat sinks (e.g., heat dissipation fins), resulting in a simple structure and excellent portability and versatility.

[0271] Correspondingly, the design of air intake and exhaust through the same jet port P0 allows the structure of the piezoelectric fan 213 to be more compact and reduce its thickness, which is conducive to the thinner and lighter design of the piezoelectric fan 213. Thus, when the heat dissipation module 20 is installed on the mobile terminal, it will not affect the grip of the mobile terminal.

[0272] Compared to traditional fans, such as conventional mechanical centrifugal fans, which are constrained by moving parts like bearings, stators, and rotors, and whose performance deteriorates drastically when used with a mobile phone due to the variable direction of gravity, leading to increased transient stress, dust accumulation, and noise, the piezoelectric fan 213 of this application does not require such moving parts, is unaffected by gravity, has no bearings, and does not require a lubrication system. Users can clean and replace the fan themselves, and there is no need to add thermal interface materials or metal structures such as heat sink fins to ensure heat dissipation.

[0273] Compared to traditional piezoelectric fans, taking the vibrating plate type piezoelectric fan as an example, this type of fan uses the piezoelectric effect to drive an excited vibrating plate to generate fluid flow. Although it is thin, it produces a small air volume and low flow rate, limiting its application range to niche areas such as gaming phones. Therefore, to adapt to a wider range of applications, it is necessary to improve the heat dissipation effect. This requires the simultaneous use of copper or aluminum heat sinks, liquid cooling systems, or thermoelectric coolers (TECs) to collect heat and ensure effective heat dissipation. This makes it impossible to achieve a thin and light design for the heat dissipation module, which increases the weight of the mobile terminal when used, affecting the user's grip experience. The piezoelectric fan 213 of this application embodiment combines the advantages of being thin and light with high heat dissipation performance, making it widely applicable.

[0274] Taking a traditional jet piezoelectric fan as an example, the air inlet and outlet of a traditional jet piezoelectric fan are generally located on different sides, that is, the air inlet and outlet are separated. This will cause a certain amount of fluid loss and affect the heat dissipation efficiency of the jet piezoelectric fan. However, the piezoelectric fan 213 of this application embodiment has both air inlet and outlet located through the same jet outlet P0, which results in a compact structure and high heat dissipation performance, enabling better heat dissipation for mobile terminals.

[0275] In this embodiment of the application, a thermal gain test can be performed on a mobile terminal equipped with a heat dissipation module 20 to evaluate the heat generation and heat dissipation efficiency of the mobile terminal during operation.

[0276] For example, the heat dissipation module 20 can be placed on the back cover of the mobile terminal. The test environment temperature is maintained at 28°C, and the mobile terminal maintains a 4K resolution, a frame rate of 60 frames per second, and a power consumption of 1380mA. The piezoelectric fan 213 of the heat dissipation module 20 is initially turned off, and the mobile terminal is allowed to run continuously under the above test conditions for a certain period of time. During this process, the temperature of the mobile terminal will gradually increase. Then, the piezoelectric fan 213 is turned on for a period of time, during which the temperature of the mobile terminal can drop sharply. For example, the piezoelectric fan 213 can cool the back of the mobile terminal by approximately 5.9°C, the camera cover by approximately 7.8°C, the front by approximately 3.5°C, and the sides by approximately 3.8°C, demonstrating excellent heat dissipation performance of the piezoelectric fan 213.

[0277] In summary, the heat dissipation module 20 provided in this application embodiment can be externally mounted on the mobile terminal without occupying the internal space of the mobile terminal, effectively avoiding conflicts with the thin and light design of the mobile terminal. Furthermore, the heat dissipation module 20 has excellent heat dissipation performance and can selectively dissipate heat from the mobile terminal. It does not require conductive materials such as thermal interface materials, nor does it require heavy metal structural components such as heat sinks (e.g., heat dissipation fins). It has a simple structure and excellent portability and versatility.

[0278] It is understood that since the heat dissipation module 20 provided in this application embodiment does not occupy the internal space of the mobile terminal, when the heat dissipation module 20 is in the unfolded state, the distance between the air outlet P1 of the piezoelectric fan 213, that is, the jet outlet P0, and the heat-generating surface of the mobile terminal can be set to be large enough.

[0279] In some embodiments of this application, when the heat dissipation module 20 is in the deployed state, the distance between the air outlet P1 (i.e., the jet outlet P0) of the piezoelectric fan 213 and the heat-generating surface (not shown) of the mobile terminal can be 2mm to 30mm. This ensures that the heat dissipation module 20 can have a high airflow, thereby further improving its heat dissipation performance. Simultaneously, it ensures that the heat dissipation module 20 has low noise during operation.

[0280] According to the above Figures 7A to 7C It can be seen that the piezoelectric fan 213 of the synthetic jet piezoelectric type has a relatively small air volume and a relatively high flow velocity at the jet outlet P0, for example, the flow velocity can be about 30 m / s. As the blown fluid gradually moves away from the jet outlet P0, due to the convolution effect, the fluid along the way is entrained, so the air volume gradually increases, but the flow velocity gradually decreases, for example, the flow velocity can be less than 10 m / s. It has a significant heat dissipation effect when the distance from the jet outlet P0 is greater than or equal to 2 mm.

[0281] Therefore, when the heat dissipation module 20 is in the deployed state, the distance between the jet port P0 and the heat-generating surface of the mobile terminal is set to 2mm to 30mm, for example, this distance can be 2mm, 2.5mm, 3mm, or 5mm. At this time, the airflow of the piezoelectric fan 213 can reach 6L / min to 8L / min, with less airflow obstruction, allowing for better jetting onto the heat-generating surface of the mobile terminal. This also facilitates the free diffusion and flow of the airflow generated by the piezoelectric fan 213, making its working environment closer to a low-resistance free field, which is beneficial for improving the heat dissipation efficiency of the piezoelectric fan 213. At the point where the heat-generating surface of the mobile terminal is directly exposed to airflow, the flow velocity is high, and the temperature can drop by 2℃ to 10℃, eliminating the need for thermal interface materials, conductive materials such as heat sinks, or heavy structural components such as aluminum or copper. In some implementations, when the heat dissipation module 20 is in the deployed state, the distance between the jet port P0 and the heat-generating surface of the mobile terminal can be greater than or equal to 5mm to achieve optimal heat dissipation.

[0282] When the heat dissipation module 20 is in the folded state, the distance between the jet port P0 and the heat-generating surface of the mobile terminal can be less than 2mm. At this time, the airflow of the piezoelectric fan 213 can reach 2L / min to 4L / min. The airflow impacts the solid at high velocity, resulting in relatively high jet noise. At this time, the piezoelectric fan 213 can be turned off to allow it to be in a non-operating state.

[0283] Figure 8 A schematic diagram illustrating the noise characteristics of the piezoelectric fan 213 in an embodiment of this application is shown. (Reference) Figure 8 The fluid M0 ejected by the piezoelectric fan 213 of the synthetic jet piezoelectric type can flow in the direction shown by the arrow. In the jet shear layer S2, that is, the transition region between the fluid M0 and the surrounding still air, free jet noise can be generated. Free jet noise refers to the sound generated when the fluid flows in a free space without obstacles or constraints after being ejected from the jet port P0. In the turbulent S3, jet impact noise can be generated. Jet impact noise refers to the sound generated when the fluid M0 collides with the surface of the solid object M1.

[0284] It is understandable that the fluid M0 ejected by the piezoelectric fan 213 has a relatively high velocity at the jet outlet P0, for example, approximately 30 m / s. When the distance from the jet outlet P0 is less than 2 mm, the convolution effect has not yet fully developed. When the fluid M0 collides with the solid object M1, the velocity is much greater than 5 m / s, thus generating significant jet impact noise. As the ejected fluid M0 gradually moves away from the jet outlet P0, the convolution effect fully develops. When the distance from the jet outlet P0 is greater than or equal to 2 mm, for example, greater than 5 mm, the velocity of the fluid M0 can decrease significantly, thereby significantly reducing the jet impact noise, for example, by approximately 10-15 dBA. However, if the ejected airflow is inside a pipe and cannot be replenished by external convolution, the gas velocity will not decrease significantly, and the flow rate will not increase significantly, making it impossible to utilize the convolution effect. This is an inherent and insurmountable drawback of piezoelectric fans currently used in mobile terminals within confined spaces and enclosed flow channels.

[0285] It should be noted that when the distance between the jet outlet P0 of the piezoelectric fan 213 and the solid obstacle is large enough, such as 10mm to 30mm, due to the development of the convolution effect, the gas flow velocity is lower than a certain level, such as below 3m / s, and it enters the low flow velocity and high flow rate zone, and the jet impact noise is greatly reduced or even negligible.

[0286] Therefore, when the heat dissipation module 20 is in the deployed state, the distance between the jet port P0 and the heat-generating surface of the mobile terminal is set to 2mm to 30mm, for example, this distance can be 2mm, 2.5mm, 3mm, or 5mm, etc. This flow channel design cannot be achieved by a piezoelectric fan installed inside the mobile phone. At this time, compared with the piezoelectric fan and flow channel design in the limited space inside the mobile phone, the jet impact noise of the heat dissipation module 20 provided in this application will be significantly reduced, thereby achieving a low noise effect, for example, the noise can be less than or equal to 30dB.

[0287] In summary, by rationally designing the distance between the jet port P0 of the unfolded heat dissipation module 20 and the heat-generating surface of the mobile terminal, the high air volume and low noise characteristics of the piezoelectric fan 213 of the synthesized jet piezoelectric type under free field can be fully utilized to achieve a high air volume and low noise effect.

[0288] It is understood that the number of piezoelectric fans 213 is not limited in the embodiments of this application. For example, one, two, or three piezoelectric fans 213 can be set to further increase the air volume and thus improve the heat dissipation performance. For example, two piezoelectric fans 213 can be set, and the air volume of the two piezoelectric fans 213 can be as high as 12-24L / min, that is, the two piezoelectric fans 213 can deliver 12-24L of fluid per minute, which has good heat dissipation performance.

[0289] Furthermore, it is understood that the embodiments of this application do not impose specific restrictions on the number or shape of the jet ports P0 of the piezoelectric fan 213. For example, the piezoelectric fan 213 may be provided with one, two, four, six, or other jet ports P0. For another example, the jet ports P0 may be circular, elliptical, triangular, rectangular, trapezoidal, or other shapes. As long as the jet ports P0 can enable the flow of fluid, they are all within the protection scope of the embodiments of this application.

[0290] In some embodiments of this application, the piezoelectric fan 213 may include a first operating state and a second operating state. When the piezoelectric fan 213 is in the first operating state, it can dissipate heat from the mobile terminal (not shown). When the piezoelectric fan 213 is in the second operating state, it can perform short-term self-dust removal to prevent dust accumulation (e.g., accumulation of dust, fibrous dirt, etc.), thereby avoiding problems such as abnormal noise, noise, and performance degradation of the heat dissipation module 20, and thus improving the reliability of the heat dissipation module 20.

[0291] In this way, the piezoelectric fan 213 can meet basic heat dissipation requirements while having self-cleaning and maintenance capabilities, effectively reducing the impact of dust accumulation on heat dissipation performance and operational stability, extending the service life of the heat dissipation module 20, and improving overall reliability and product experience.

[0292] In some implementations, the first operating state may include a silent state and a performance state to meet the heat dissipation requirements of different scenarios. The silent state can be applied to quiet environments, such as offices and libraries. For example, at a test location 0.3m away from the piezoelectric fan 213, the noise level in the silent state can be below 30dBA. The performance state can be applied to high-power, high-background-noise applications such as gaming. For example, at a test location 0.3m away from the piezoelectric fan 213, the noise level of the piezoelectric fan 213 and the system can be between 35dBA and 40dBA.

[0293] In some implementations, the operating frequency of the piezoelectric fan 213 in the first operating state can be lower than the operating frequency of the piezoelectric fan 213 in the second operating state. In this way, in the first operating state, the piezoelectric fan 213 can operate reliably for a long time at a relatively low operating frequency to reduce power consumption; in the second operating state, the piezoelectric fan 213 can operate at a relatively high operating frequency to improve the short-term dust removal effect.

[0294] For example, the piezoelectric fan 213 can operate at a frequency of 20kHz to 30kHz in its first operating state to better reduce power consumption and ensure a long lifespan; for example, the operating frequency can be 20kHz, 21kHz, 22kHz, 23kHz, or 24kHz. The piezoelectric fan 213 can operate at a frequency greater than 30kHz in its second operating state to further improve short-term dust removal efficiency; for example, the operating frequency can be 36kHz, 40kHz, 51kHz, or 55kHz.

[0295] In some implementations, the operating voltage of the piezoelectric fan 213 in the first operating state can be lower than that in the second operating state. Thus, in the first operating state, the piezoelectric fan 213 can operate at a relatively low voltage, resulting in a relatively low amplitude, thereby reducing power consumption and ensuring long-term reliability. In the second operating state, the piezoelectric fan 213 can operate at a relatively high voltage for short periods, resulting in a relatively high amplitude, thereby improving short-term dust removal efficiency.

[0296] For example, the ratio between the operating voltage of the piezoelectric fan 213 in the second operating state and the operating voltage of the piezoelectric fan 213 in the first operating state can be greater than or equal to 1.3 to further improve the short-term dust removal effect. For example, this ratio can be 1.4, 1.5, 1.6, 1.7, 1.8, 1.9 or 2, etc.

[0297] In some of these implementations, the piezoelectric fan 213 can be driven by an AC voltage, such as a square wave or a sine wave.

[0298] Continue to refer to Figure 6B In some embodiments of this application, the working unit 210 may further include a circuit board 214, which can be connected to the battery 212 and the piezoelectric fan 213. The circuit board 214 is the control core of the working unit 210. It can receive electrical energy from the battery 212 and transmit it to the piezoelectric fan 213 to achieve a stable power supply to the piezoelectric fan 213. The circuit board 214 can also control the operating state of the battery 212, such as charging and discharging. Furthermore, the circuit board 214 can control the operating state of the piezoelectric fan 213, such as starting and stopping the piezoelectric fan 213, operating it, and switching between a first and second operating state.

[0299] Continue to refer to Figure 6BIn some embodiments of this application, the working part 210 may further include a dustproof net 215, which can be placed over the piezoelectric fan 213 to prevent dust, fibers, and other debris from entering the piezoelectric fan 213, thereby avoiding dust accumulation, while not significantly obstructing airflow. The dustproof net 215 can also be used to prevent fingers from pressing or inserting, thus protecting the piezoelectric fan 213. In this case, the mesh size of the dustproof net 215 can be set to be relatively large.

[0300] In some implementations, the dustproof net 215 can also be referred to as a protective net.

[0301] In some implementations, a dust filter 215 can be installed at the air inlet P2 to prevent dust and water mist from the surrounding environment from being sucked into the piezoelectric fan 213, while the air outlet P1 may not be equipped with one. Alternatively, dust filters 215 can be installed at both the air outlet P1 and the air inlet P2, and this application does not impose any specific restrictions on this.

[0302] Figure 9A and Figure 9B This paper shows an exemplary structure of the dustproof net 215 in the working part 210 of this application embodiment, wherein, Figure 9A This is an exploded view of a portion of the structure in work section 210. Figure 9B This is a top view of the working part 210. (Reference) Figure 9A and Figure 9B In this embodiment of the application, the dustproof net 215 may have through holes 2151, which cover at least a portion of the air outlet P1 of the piezoelectric fan 213. For example, in Figure 9A and Figure 9B In the illustrated embodiment, the through hole 2151 can completely cover the air outlet P1 of the piezoelectric fan 213, and the cross-sectional area of ​​the through hole 2151 can be greater than or equal to the air outlet P1 of the piezoelectric fan 213; for example, in some other implementations, the through hole 2151 can also partially cover the air outlet P1 of the piezoelectric fan 213, and this application does not impose specific limitations on this.

[0303] In this way, the dustproof net 215 can avoid obstructing the flow of fluid in the high-speed, low-flow, high-noise zone near the outlet P1 of the piezoelectric fan 213, thereby helping to further reduce flow resistance, increase the flow rate of the piezoelectric fan 213, and reduce the aerodynamic noise of the piezoelectric fan 213.

[0304] In some implementations, the piezoelectric fan 213 can have multiple air outlets P1 and through holes 2151, with each through hole 2151 corresponding one-to-one with a different air outlet P1 of the piezoelectric fan 213. Alternatively, the through holes 2151 may need to be compatible with the air outlets P1 of piezoelectric fans 213 from different manufacturers. Each through hole 2151 can cover the corresponding air outlet P1 of the piezoelectric fan 213. Alternatively, one through hole 2151 can correspond to multiple air outlets P1; for example, one through hole 2151 can correspond to two, three, or four air outlets P1. This application does not impose specific limitations on this.

[0305] In some implementations, the ratio between the cross-sectional area of ​​the through-hole 2151 and the cross-sectional area of ​​the air outlet P1 can be greater than or equal to 1.5. This allows the through-hole 2151 to better accommodate various layouts of the air outlet P1, absorbing manufacturing and assembly tolerances of the heat dissipation module, resulting in strong versatility. Consequently, it helps to better improve the airflow of the piezoelectric fan 213 and reduce the noise of the piezoelectric fan 213. For example, this ratio can be 1.5, 1.6, 1.7, 1.8, 1.9, 2, or 2.5, etc.

[0306] For example, when the piezoelectric fan 213 has multiple air outlets P1 and through holes 2151, and each of the multiple through holes 2151 corresponds one-to-one with the multiple air outlets P1 of the piezoelectric fan 213, the ratio between the cross-sectional area of ​​each through hole 2151 and the cross-sectional area of ​​the corresponding air outlet P1 can be greater than or equal to 1.5. Alternatively, when each through hole 2151 corresponds to multiple air outlets P1, the ratio between the cross-sectional area of ​​each through hole 2151 and the cross-sectional area of ​​each corresponding air outlet P1 can be greater than or equal to 1.5.

[0307] Additionally, it can be understood that in this embodiment, the cross-section of the air outlet P1 of the piezoelectric fan 213 can be perpendicular to the extension direction of the air outlet P1, and the cross-section of the through hole 2151 can be perpendicular to the extension direction of the through hole 2151, which will not be described again below.

[0308] In some implementations, the cross-sectional area of ​​the through hole 2151 can be less than or equal to 2 mm². 2 This avoids the cross-sectional area of ​​the through hole 2151 being too large, which would affect the dustproof effect of the dustproof mesh 215. For example, the cross-sectional area can be 2mm². 2 1.9mm 2 1.8mm 2 1.7mm 2 Or 1.6mm 2 wait.

[0309] For example, when the through hole 2151 is circular, its diameter can be less than or equal to 1.6 mm, so that the cross-sectional area of ​​the through hole 2151 can be less than or equal to 2 mm². 2 .

[0310] In some implementations, the dustproof net 215 may also include multiple mesh holes 2152. It can be understood that, compared to the through holes 2151, the cross-sectional area of ​​the mesh holes 2152 is smaller and the arrangement is more dense, thus allowing the dustproof net 215 to be mesh-like.

[0311] It is understood that the through holes 2151 and the mesh holes 2152 can have various shapes and arrangements to form dustproof nets 215 of different forms. The following is an exemplary description in conjunction with the accompanying drawings.

[0312] Continue to refer to Figure 9A and Figure 9B In some implementations, the dustproof mesh 215 can have six through holes 2151: through holes 2151a, 2151b, 2151c, 2151d, 2151e, and 2151f. The through holes 2151a, 2151b, 2151c, and 2151d can be heart-shaped and arranged in a 2×2 matrix, with through holes 2151a and 2151b in one row and through holes 2151c and 2151d in the other. The through holes 2151e and 2151f can be circular, with through hole 2151e located between through holes 2151a and 2151b, and through hole 2151f located between through holes 2151c and 2151d.

[0313] The multiple mesh holes 2152 of the dustproof net 215 can be circular in shape, and the multiple mesh holes 2152 are arranged in a ring to surround the through hole 2151.

[0314] The dustproof net 215 can also have a decorative hole 2153. The decorative hole 2153 can be circular in shape, and it can be located at the geometric center of the matrix formed by the through holes 2151a, 2151b, 2151c, and 2151d. This makes the dustproof net 215 more aesthetically pleasing and refined.

[0315] Figure 10A An exemplary second structure of the dustproof net 215 in an embodiment of this application is shown. (See reference...) Figure 10AIn some other implementations, the dustproof mesh 215 may have four through holes 2151, which are shaped like rounded rectangles with two straight sides and two curved sides. The four through holes 2151 are arranged in a circular array. The multiple mesh holes 2152 of the dustproof mesh 215 may be circular in shape and arranged in a ring around the through holes 2151. The dustproof mesh 215 does not have decorative holes.

[0316] Figure 10B An exemplary structure three of the dustproof net 215 in an embodiment of this application is shown. (See reference...) Figure 10B In some implementations, the dustproof mesh 215 may have ten through holes 2151, all of which are circular in shape and arranged in a circular array. The multiple mesh holes 2152 of the dustproof mesh 215 may also be circular in shape and arranged in a ring around the through holes 2151. Decorative holes 2153 of the dustproof mesh 215 are located at the center of the circular array formed by the ten through holes 2151.

[0317] Figure 10C An exemplary structure four of the dustproof net 215 in this application embodiment is shown. Figure 10D This application illustrates an exemplary structure five of the dustproof net 215. Figure 10E An exemplary structure of the dustproof net 215 in an embodiment of this application is shown. (See reference...) Figures 10C to 10E In some of these implementations, the multiple mesh holes 2152 of the dustproof mesh 215 can be rectangular in shape, and the multiple mesh holes 2152 are arranged in a ring to surround the through hole 2151.

[0318] It should be noted that, Figure 10C The number, shape, and arrangement of the through holes 2151 in the dustproof mesh 215 shown are the same as those described above. Figure 9A and Figure 9B The through-hole 2151 shown is the same; the number, shape, and arrangement of the decorative holes 2153 of the dustproof mesh 215 are the same as those described above. Figure 9A and Figure 9B The decorative hole 2153 shown is the same. Therefore, please refer to the above for details. Figure 9A and Figure 9B The relevant descriptions in the illustrated embodiments will not be repeated here.

[0319] Figure 10D The number, shape, and arrangement of the through holes 2151 in the dustproof mesh 215 shown are the same as those described above. Figure 10A The through hole 2151 shown is the same. Therefore, please refer to the above for details. Figure 10A The relevant descriptions in the illustrated embodiments will not be repeated here.

[0320] Figure 10E The number, shape, and arrangement of the through holes 2151 in the dustproof mesh 215 shown are the same as those described above. Figure 10B The through-hole 2151 shown is the same; the number, shape, and arrangement of the decorative holes 2153 of the dustproof mesh 215 are the same as those described above. Figure 10B The decorative hole 2153 shown is the same. Therefore, please refer to the above for details. Figure 10B The relevant descriptions in the illustrated embodiments will not be repeated here.

[0321] Figure 10F This application illustrates an exemplary structure seven of the dustproof net 215 in an embodiment of the present application. Figure 10G An exemplary structure eight of the dustproof net 215 in an embodiment of this application is shown. Figure 10H An exemplary structure nine of the dustproof net 215 in an embodiment of this application is shown. (See reference...) Figures 10F to 10H In some implementations, the multiple mesh holes 2152 of the dustproof mesh 215 can be circular in shape, and the multiple mesh holes 2152 are arranged in a ring to surround the through hole 2151. Furthermore, compared to the above... Figures 9A to 10E In other words, Figures 10F to 10H In the dustproof net shown, the arrangement of multiple mesh holes 2152 is sparser.

[0322] It is understandable that the above Figures 9A to 10H The diagram only illustrates several structures of the dustproof net 215 and does not constitute a limitation of this application. For example, the number of through holes 2151, mesh holes 2152, and decorative holes 2153 in the dustproof net 215 can be one, two, three, nine, or twelve, etc. Furthermore, the shapes of the through holes 2151, mesh holes 2152, and decorative holes 2153 in the dustproof net 215 can be regular shapes such as ovals and triangles, or other irregular shapes.

[0323] Figures 11A to 11C Exemplary structures of several dustproof nets 215 in comparative embodiments of this application are shown. Figure 11A The dustproof net 215 shown in (a), (b), and (c) is square in shape. Figure 11A The dustproof net 215 shown in (d) is rectangular in shape. Figure 11A The dustproof net 215 shown in (e) is irregular in shape. Figure 11A The mesh openings 2152 of the dustproof net 215 shown in (a), (b), (c), (d) are all circular. Furthermore, Figure 11A In the middle, from (a) to (c), the arrangement of the mesh holes 2152 of the dustproof net 215 gradually becomes sparse.

[0324] Compared to Figure 11A In other words, Figure 11BThe difference in the dustproof net 215 shown is that the shape of the mesh holes 2152 is different. Figure 11B The mesh holes 2152 of the dustproof net 215 shown are all rectangular.

[0325] Compared to Figure 11A In other words, Figure 11C The difference in the dustproof net 215 shown is that the arrangement density of the mesh holes 2152 is different. Figure 11C The arrangement of the mesh holes 2152 of the dustproof net 215 shown is sparser.

[0326] In the above Figures 11A to 11C In the comparative designs shown, the dust filter 215 does not have a through-hole to avoid the fan's air outlet (not shown). Therefore, the above... Figures 11A to 11C In the comparative scheme shown, the dust filter 215, when installed after the fan, obstructs fluid flow, resulting in lower fan flow and higher noise.

[0327] In this application, as described above Figures 9A to 10H As shown, the dustproof net 215 provided in this embodiment of the application has through holes. Therefore, the dustproof net 215 can avoid the air outlet P1 of the piezoelectric fan 213, thereby helping to further increase the airflow of the piezoelectric fan 213 and reduce the noise of the piezoelectric fan 213.

[0328] It is understandable that the above Figures 6A to 9B In the illustrated embodiment, the working part 210 is a rounded rectangle, but this application is not limited to this. For example, in other embodiments, the working part 210 may also be a regular shape such as a circle, ellipse, or ring, or other irregular shapes.

[0329] Figure 12 This paper illustrates an exemplary structure of the working part 210 in another heat dissipation module 20 according to an embodiment of this application. For ease of observation, Figure 12 The rear cover 11-2 is also shown, and the airflow direction of the piezoelectric fan 213 is indicated by a thick solid line arrow. (Reference) Figure 12 Taking the working part 210 as an example where the shape is ring-shaped, the working part 210 can have multiple piezoelectric fans 213. These multiple piezoelectric fans 213 can be arranged at intervals along the circumference of the ring, thereby helping to achieve uniform heat dissipation.

[0330] For example, the number of piezoelectric fans 213 can be two, and the two piezoelectric fans 213 can be arranged circumferentially in a ring. The air volume of the two piezoelectric fans 213 can be up to 12L / min, that is, the two piezoelectric fans 213 can deliver 12L of fluid per minute. Furthermore, the noise level can be less than or equal to 30dB, which is considered low noise. Alternatively, the number of piezoelectric fans 213 can also be three, four, or five, etc., and this application does not impose any limitation on this.

[0331] After introducing the working part 210 of the heat dissipation module 20, the rotating part 220 of the heat dissipation module 20 will be introduced below with reference to the accompanying drawings.

[0332] Figures 13A to 13C This paper illustrates an exemplary structure of the rotating part 220 in a heat dissipation module 20 according to an embodiment of the present application, wherein... Figure 13A The heat dissipation module 20 is in a folded state. Figure 13B The heat dissipation module 20 is in an unfolded state from one perspective. Figure 13C The heat dissipation module 20 is in an unfolded state from another perspective.

[0333] refer to Figures 13A to 13C In some embodiments of this application, the rotating part 220 may include a rotating shaft 221, which may be disposed between the housing 201 of the mounting part 200 and the housing 211 of the working part 210, thereby realizing a rotatable connection between the mounting part 200 and the working part 210.

[0334] In some embodiments of this application, the rotating part 220 may further include a limiting mechanism (not shown), which limits the rotation angle of the working part 210 relative to the mounting part 200. This allows for a stepped deployment of the heat dissipation module 20. That is, during deployment, the heat dissipation module 20 can remain at several fixed positions at fixed intervals, forming a stable deployment state, rather than a continuous and smooth deployment. At different intervals, the rotation angle of the working part 210 relative to the mounting part 200 corresponds to different sizes, for example, 45°, 90°, and 135°. Alternatively, the rotation angle of the working part 210 relative to the mounting part 200 can be limited to a certain range to ensure that the air outlet P1 of the piezoelectric fan 213 of the working part 210 can be better aligned with the heat-generating surface (not shown) of the mobile terminal. Simultaneously, setting multiple different rotation angle intervals or a certain rotation angle range also helps to achieve cross-model adaptation. Alternatively, there can be only one rotation angle to ensure heat dissipation while avoiding difficulty for users in choosing.

[0335] In some implementations, when the heat dissipation module 20 is in a folded state, the air outlet P1 of the piezoelectric fan 213 can face the mounting portion 200. At this time, the rotation angle of the working portion 210 relative to the mounting portion 200 can be less than or equal to 60°, for example, less than or equal to 50°, 45°, 40°, 35°, or 30°. This prevents the heat dissipation module 20 from being over-expanded, which would cause the air outlet P1 of the piezoelectric fan 213 to be unable to align with the heat-generating surface of the mobile terminal. Furthermore, when the heat dissipation module 20 is in a folded state, the user cannot observe the air outlet P1 of the piezoelectric fan 213, thus improving the aesthetics and refinement of the folded heat dissipation module 20.

[0336] In some other implementations, when the heat dissipation module 20 is in a folded state, the air outlet P1 of the piezoelectric fan 213 can also face away from the mounting portion 200. In this case, the rotation angle of the working portion 210 relative to the mounting portion 200 can be greater than 90°, for example, greater than or equal to 100°, 110°, 120°, or 130°. This avoids insufficient extension of the heat dissipation module 20, which could prevent the air outlet P1 of the piezoelectric fan 213 from being aligned with the heat-generating surface of the mobile terminal.

[0337] In other embodiments of this application, the heat dissipation module 20 may also be steplessly unfolded, that is, continuously and smoothly unfolded. This application does not impose specific limitations on this.

[0338] After introducing the rotating part 220 of the heat dissipation module 20, the first wireless charging coil 230 of the heat dissipation module 20 will be introduced below with reference to the accompanying drawings.

[0339] In some possible implementations, the first wireless charging coil 230 may be disposed in the mounting part 200 or the working part 210. Depending on the arrangement of the first wireless charging coil 230, the implementation methods of charging the battery 212 in the folded state and stopping charging the battery 212 in the unfolded state also differ, which will be described exemplarily below with reference to the accompanying drawings.

[0340] Continue to refer to Figures 13A to 13C In some embodiments of this application, the first wireless charging coil 230 may be disposed on the mounting portion 200.

[0341] In the heat dissipation module 20 Figure 13A In the folded state shown, the first wireless charging coil 230 can be connected to the circuit board 214 of the working unit 210, that is, the first wireless charging coil 230 and the circuit board 214 of the working unit 210 are electrically connected. In this way, the first wireless charging coil 230 can couple with the second wireless charging coil (not shown) in the mobile terminal and transmit the generated electrical energy to the circuit board 214, and then transmit the electrical energy to the battery 212 through the circuit board 214 to charge the battery 212.

[0342] In the heat dissipation module 20 Figure 13B and Figure 13C In the unfolded state shown, the first wireless charging coil 230 is spaced apart from the circuit board 214 of the working part 210, that is, the electrical connection between the first wireless charging coil 230 and the circuit board 214 of the working part 210 is broken. In this way, the first wireless charging coil 230 cannot couple with the second wireless charging coil in the mobile terminal and transmit the generated electrical energy to the circuit board 214, thereby stopping the charging of the battery 212.

[0343] The above solution, using a simple physical structure, enables the heat dissipation module 20 to... Figure 13A The folded state shown and Figure 13B and Figure 13C When switching between the unfolded states shown, the first wireless charging coil 230 can automatically turn on or stop charging the battery 212, thereby achieving a foolproof design and effectively improving the ease of use and safety of the heat dissipation module 20.

[0344] Furthermore, this distributed device layout can help to achieve a more optimized design of the heat dissipation module 20, ensuring both heat dissipation efficiency in the unfolded state and convenient charging in the folded state, maximizing space utilization; it also helps to disperse heat-generating devices to avoid local overheating and optimize thermal management; and it also helps to distribute weight reasonably, thereby balancing the weight of the mounting section 200 and the working section 210 and avoiding a large difference in weight between the mounting section 200 and the working section 210.

[0345] Finally, by placing the first wireless charging coil 230 in the mounting part 200, when the heat dissipation module 20 is in the folded state, the first wireless charging coil 230 is closer to the second wireless charging coil in the mobile terminal, thereby improving the coupling effect between the first wireless charging coil 230 and the second wireless charging coil in the mobile terminal.

[0346] Continue to refer to Figures 13A to 13C In some implementations, the mounting portion 200 may include a first conductive element 207, which is connected to the first wireless charging coil 230 and exposed on the surface of the mounting portion 200 facing the working portion 210. The working portion 210 may include a second conductive element 216, which may be connected to the circuit board 214 and exposed on the surface of the working portion 210 facing the mounting portion 200.

[0347] In the heat dissipation module 20 Figure 13A In the folded state shown, the first conductive element 207 and the second conductive element 216 can contact each other and conduct electricity, thereby enabling the first wireless charging coil 230 to be connected to the circuit board 214 of the working part 210.

[0348] In the heat dissipation module 20 Figure 13B and Figure 13C In the unfolded state shown, the first conductive element 207 and the second conductive element 216 can be separated from each other, thereby allowing the first wireless charging coil 230 to be spaced apart from the circuit board 214 of the working part 210.

[0349] For example, the first conductive element 207 can be a conductive structural element such as a metal contact (e.g., a flexible, retractable metal contact) or a metal sheet. Similarly, the second conductive element 216 can also be a conductive structural element such as a metal contact (e.g., a flexible, retractable metal contact) or a metal sheet.

[0350] For example, in Figures 13A to 13C In the illustrated embodiment, the first conductive element 207 is an elastic, stretchable metal contact, and the second conductive element 216 is a metal sheet. When the heat dissipation module 20 is in... Figure 13A In the folded state shown, the first conductive element 207 and the second conductive element 216 can abut against each other to achieve electrical connection; when the heat dissipation module 20 is in the folded state... Figure 13B and Figure 13C In the unfolded state shown, the first conductive element 207 and the second conductive element 216 can be separated from each other.

[0351] In some other implementations, the first wireless charging coil 230 and the circuit board 214 can also be electrically connected via a flexible printed circuit (FPC). For example, the flexible circuit board can be made of polyimide or polyester film as a substrate, and has the characteristics of being able to be freely bent, folded and twisted, which can adapt well to the unfolding and folding of the heat dissipation module 20.

[0352] Figures 14A to 14C Exemplary configurations of the first wireless charging coil 230 are shown in other embodiments of this application. Figure 14A The heat dissipation module 20 is in a folded state. Figure 14B The heat dissipation module 20 is in the deployed state. Figure 14C This is an exploded view of the heat dissipation module 20 in a folded state.

[0353] refer to Figures 14A to 14C In other embodiments of this application, the first wireless charging coil 230 may also be disposed in the working part 210 and connected to the circuit board 214 of the working part 210. In this way, the circuit board 214 is electrically connected to the first wireless charging coil 230 and is also electrically connected to the battery 212.

[0354] In the heat dissipation module 20 Figure 14A In the folded state shown, the distance between the first wireless charging coil 230 and the second wireless charging coil (not shown) in the mobile terminal can be less than or equal to the electromagnetic coupling distance. In this way, the first wireless charging coil 230 can couple with the second wireless charging coil (not shown) in the mobile terminal and transmit the generated electrical energy to the circuit board 214, and then transmit the electrical energy to the battery 212 via the circuit board 214 to charge the battery 212.

[0355] In the heat dissipation module 20 Figure 14B In the deployed state shown, the distance between the first wireless charging coil 230 and the second wireless charging coil (not shown) in the mobile terminal can be greater than the electromagnetic coupling distance. In this way, the first wireless charging coil 230 cannot couple with the second wireless charging coil in the mobile terminal and transmit the generated electrical energy to the circuit board 214, thereby stopping the charging of the battery 212.

[0356] It should be noted that, in the embodiments of this application, the electromagnetic coupling distance refers to the physical distance between two wireless charging coils that allows them to establish an effective magnetic field interaction and achieve energy or signal transmission. When the distance between the two wireless charging coils is less than or equal to the electromagnetic coupling distance, the two wireless charging coils can perform electromagnetic coupling, thereby achieving wireless charging; conversely, when the distance between the two wireless charging coils is greater than the electromagnetic coupling distance, the two wireless charging coils cannot perform electromagnetic coupling, thereby failing to achieve wireless charging.

[0357] The above solution, using a simple physical structure, enables the heat dissipation module 20 to... Figure 14A The folded state shown and Figure 14B When switching between the unfolded states shown, the first wireless charging coil 230 can automatically turn on or stop charging the battery 212, thereby achieving a foolproof design and effectively improving the ease of use and safety of the heat dissipation module 20.

[0358] Furthermore, this integrated component layout allows all components, such as the first wireless charging coil 230, battery 212, piezoelectric fan 213, and circuit board 214, to be integrated into the working section 210. This facilitates a highly integrated and modular design of the heat dissipation module 20, enabling individual replacement of faulty components, facilitating maintenance, and allowing for centralized dustproof and waterproof design, thus improving product reliability. Simultaneously, it eliminates the need for electrical connection devices (e.g., flexible circuit boards) spanning the rotating section 220, effectively simplifying the electrical connection structure.

[0359] It's understandable that the above choices can be made based on different market demands and product positioning. Figures 13A to 13C The distributed device layout shown, or the above Figures 14A to 14C The integrated device layout shown allows for flexible adjustment of component configurations, which helps control costs.

[0360] Continue to refer to Figures 14A to 14CIn some implementations, when the heat dissipation module 20 is in a folded state, the first wireless charging coil 230 can be located on the side of the piezoelectric fan 213 facing the mounting portion 200. Thus, when the heat dissipation module 20 is in a folded state, the first wireless charging coil 230 can be closer to the second wireless charging coil (not shown) in the mobile terminal, allowing for better coupling between the first and second wireless charging coils, thereby further improving charging efficiency.

[0361] When the heat dissipation module 20 is in the folded state, and the first wireless charging coil 230 is located on the side of the piezoelectric fan 213 facing the mounting portion 200, the first wireless charging coil 230 and the piezoelectric fan 213 do not overlap in the Z-axis direction. In other words, when the heat dissipation module 20 is in the folded state, the orthographic projection of the first wireless charging coil 230 onto a plane perpendicular to the Z-axis direction does not overlap with the orthographic projection of the piezoelectric fan 213 onto a plane perpendicular to the Z-axis direction. This prevents the first wireless charging coil 230 from obstructing the airflow path of the piezoelectric fan 213.

[0362] It is understandable that the above Figures 2A to 14C The heat dissipation module 20 in the illustrated embodiment may also include more components, such as a switch 240, an indicator light 250, and a power supply interface 260, to achieve more functions. The following description, in conjunction with the accompanying drawings, provides an exemplary illustration.

[0363] It should be noted that, for ease of description, the following will continue to use... Figures 14A to 14C The heat dissipation module 20 in the illustrated embodiment is described as an example. In fact, the heat dissipation module 20 in other illustrated embodiments may also include components such as a switch 240, an indicator light 250, and a power supply interface 260, which are related to… Figures 14A to 14C The components in the heat dissipation module 20 shown are essentially the same; therefore, please refer to the following for details. Figures 14A to 14C The relevant descriptions in the illustrated embodiments will not be repeated here.

[0364] Continue to refer to Figures 14A to 14C In some embodiments of this application, the heat dissipation module 20 may further include a switch 240. The switch 240 can be used to control the operating state of the piezoelectric fan 213 of the working part 210. In this way, the user can manually control the piezoelectric fan 213 through the switch 240 to select the operating state of the piezoelectric fan 213. The heat dissipation module 20 does not need to communicate with a mobile terminal (not shown) or require software settings adaptation. The accessories are independent and universal, and the cost is low.

[0365] In some implementations, the user's operation on switch 240 may include, but is not limited to, any one or more of the following operations: long press, single click, and double click. This application does not impose any restrictions on this.

[0366] In some of these implementations, the operating states of the piezoelectric fan 213 may include a shut-off state, a first operating state (e.g., a silent state, a high-performance state), and a second operating state (e.g., a dust removal state).

[0367] In some implementations, the user can manually turn the electrical connection between the battery 212 and the piezoelectric fan 213 on or off via switch 240.

[0368] In some implementations, the user can also control the piezoelectric fan 213 to switch between the first and second operating states via switch 240.

[0369] It is understandable that users can achieve different control effects by performing different operations on switch 240. For example, by clicking switch 240, the piezoelectric fan 213 can be turned on; by pressing and holding switch 240, the piezoelectric fan 213 can be turned off; and by double-clicking switch 240, the piezoelectric fan 213 can switch between a first working state and a second working state.

[0370] In some implementations, switch 240 can be connected to circuit board 214 of working part 210 to control the working state of piezoelectric fan 213 of working part 210.

[0371] In some of these implementations, the heat dissipation module 20 is located in Figure 14A In the folded state shown, the switch 240 can be located between the mounting portion 200 and the working portion 210. For example, the switch 240 can be mounted on the working portion 210. Alternatively, the switch 240 can also be mounted on the mounting portion 200; this application does not impose any specific limitations on this.

[0372] This allows for a foolproof design, helping to ensure that the piezoelectric fan 213 and the first wireless charging coil 230 operate at off-peak times, avoiding excessive instantaneous heat generation. For example, when the heat dissipation module 20 is in... Figure 14A In the folded state shown, the piezoelectric fan 213 can automatically turn off, and the user cannot access the switch 240 to turn on the piezoelectric fan 213. Meanwhile, the first wireless charging coil 230 can charge the battery 212, allowing the battery 212 to store energy. Furthermore, when the heat dissipation module 20 is in... Figure 14A When in the folded state shown, the switch 240 cannot be observed by the user, which makes the appearance and refinement of the folded heat dissipation module 20 better.

[0373] However, this application is not limited to this; in some alternative implementations, the above... Figures 14A to 14CThe simple foolproof design shown in the embodiment can also be implemented through more complex hardware and software designs. In this case, the switch 240 can also be located in other positions; for example, the switch 240 can be located on the side of the working part 210 facing away from the mounting part 200; or, the switch 240 can be located on the side wall of the working part 210. This allows the user to more easily access the switch 240, improving operational convenience.

[0374] Continue to refer to Figures 14A to 14C In some embodiments of this application, the heat dissipation module 20 may also include an indicator light 250, which is used to indicate the working status of the battery 212 and / or piezoelectric fan 213 of the working part 210, so that the user can intuitively know the working status of the battery 212 and / or piezoelectric fan 213.

[0375] In some of these implementations, the indicator light 250 can indicate different operating states of the battery 212 and / or the piezoelectric fan 213 through any one or more of different colors, different brightness, and flashing.

[0376] In some implementations, the operating states of the battery 212 may include, but are not limited to, charging state, discharging state, and remaining charge state.

[0377] In some implementations, the operating states of the piezoelectric fan 213 may include, but are not limited to, a shut-off state, a first operating state (e.g., a silent state, a high-performance state), and a second operating state (e.g., a dust removal state).

[0378] For example, when indicator light 250 is solid green, it indicates that battery 212 is charging; when indicator light 250 is solid white, it indicates that battery 212 is discharging; when indicator light 250 is solid red, it indicates that battery 212 has insufficient remaining power.

[0379] For example, when the brightness of indicator light 250 is weak, it can indicate that piezoelectric fan 213 is in the off state; when the brightness of indicator light 250 is high, it can indicate that piezoelectric fan 213 is in the on state; when indicator light 250 flashes slowly, it can indicate that piezoelectric fan 213 is in the first working state; when indicator light 250 flashes rapidly, it can indicate that piezoelectric fan 213 is in the second working state.

[0380] In some implementations, the indicator light 250 can be connected to the circuit board 214 of the working part 210 so that the circuit board 214 can control the state of the indicator light 250 according to the working state of the battery 212 and / or the piezoelectric fan 213.

[0381] It is understood that this application does not impose specific restrictions on the placement of the indicator light 250, as long as it ensures that the user can see the indicator light 250. For example, in Figures 14A to 14C In the illustrated embodiment, the indicator light 250 can be located on the side of the working part 210 facing away from the mounting part 200, making it easier for the user to observe the indicator light 250. Alternatively, in other embodiments, the indicator light 250 can also be located on the side wall of the working part 210 or the mounting part 200.

[0382] Continue to refer to Figures 14A to 14C In some embodiments of this application, the heat dissipation module 20 may further include a power supply interface 260, which is used to connect to an external power source to charge the battery 212 of the working part 210, or to supply power to the piezoelectric fan 213 of the working part 210, or to supply power to the piezoelectric fan 213 and charge the battery 212 simultaneously.

[0383] This further enhances the flexibility and versatility of power supply, resulting in better performance and a wider range of applications for the heat dissipation module 20. For example, even if some mobile terminal models lack an internal wireless charging coil, they can still be easily and conveniently powered via the power supply interface, making them compatible with the heat dissipation module 20. For instance, when the battery 212 is low on power, temporary power can be supplied via the power supply interface 260 to ensure the piezoelectric fan 213 functions properly; furthermore, auxiliary power supply via the power supply interface 260 can reduce the number of charge-discharge cycles of the battery 212, minimizing battery aging and extending its lifespan.

[0384] In some implementations, the power supply interface 260 can be a USB interface. Exemplarily, the USB interface can be USB Type-C. Exemplarily, the USB interface can be a USB plug or a USB cable. Exemplarily, the USB cable can be a retractable USB cable to further enhance portability.

[0385] In some of these implementations, the external power source can be a mobile terminal battery, a power bank, or a vehicle power supply, etc. This application does not impose any specific restrictions on this.

[0386] In some implementations, the power supply interface 260 can be connected to the circuit board 214 of the working part 210. The circuit board 214 can receive electrical energy from the power supply interface 260 and transfer the electrical energy to the battery 212 to charge the battery 212, or transfer the electrical energy to the fan to supply power to the piezoelectric fan 213.

[0387] It is understood that this application does not impose specific restrictions on the orientation of the power supply interface 260, as long as it ensures that the power supply interface 260 can be electrically connected to an external power source. For example, in Figures 14A to 14CIn the illustrated embodiment, the power supply interface 260 can be located on the side wall of the working part 210. This avoids excessively affecting the aesthetics and refinement of the heat dissipation module 20 and facilitates the electrical connection of the power supply interface 260 to an external power source. Alternatively, in other embodiments, the power supply interface 260 can also be located on the mounting part 200.

[0388] One or more power supply interfaces 260 can be provided to expand and realize different charging and discharging functions, such as powering the piezoelectric fan 213 and charging the battery 212; powering the piezoelectric fan 213 and charging the battery in the mobile terminal, supporting high-speed fast charging of mobile phones and having good heat dissipation and other functions.

[0389] Figure 15A and Figure 15B This application illustrates an exemplary structure of another mobile electronic device component 1 in an embodiment of the present application. Figure 15A The heat dissipation module 20 is in a folded state. Figure 15B The heat dissipation module 20 is in the deployed state. Compared to the above... Figures 2A to 14C The embodiment shown, Figure 15A and Figure 15B The difference in the illustrated embodiment is that the power supply method of the piezoelectric fan 213 of the heat dissipation module 20 is different.

[0390] refer to Figure 15A and Figure 15B The heat dissipation module 20 may include a mounting part 200, a working part 210, and a rotating part 220. The mounting part 200 serves as the mounting base for the heat dissipation module 20 and is used to connect to the mobile terminal 10. In other words, the heat dissipation module 20 can be mounted on the mobile terminal 10 via the mounting part 200.

[0391] The working unit 210 is a functional module of the heat dissipation module 20, used to implement the heat dissipation function of the heat dissipation module 20. The working unit 210 may include a power supply interface 260 and a piezoelectric fan 213. The power supply interface 260 is used to electrically connect to an external power source to supply power to the piezoelectric fan 213. For example, Figure 15A and Figure 15B The arrows indicate the airflow direction of the piezoelectric fan 213.

[0392] The rotating part 220 rotatably connects the mounting part 200 and the working part 210, so that the heat dissipation module 20 can be rotated. Figure 15A The folded state shown and Figure 15B Switching between the expanded states shown.

[0393] In the heat dissipation module 20 Figure 15AIn the folded state shown, the mounting part 200 and the working part 210 can be stacked along the Z-axis direction. For example, the included angle between the mounting part 200 and the working part 210 can be in the range of 0° to 10°. For example, the included angle can be 0°, 5°, or 10°.

[0394] In the heat dissipation module 20 Figure 15B In the unfolded state shown, the mounting part 200 and the working part 210 can be set at a relatively large angle. For example, the included angle between the mounting part 200 and the working part 210 can be greater than 10°. For example, the included angle can be 45°, 60°, 90° or 135°, etc.

[0395] At this time, the air outlet P1 of the piezoelectric fan 213 of the working part 210 can be directed toward the heat-generating surface S1 of the mobile terminal 10, so that the cold air blown out by the piezoelectric fan 213 can be transferred to the heat-generating surface S1 of the mobile terminal 10, thereby achieving efficient heat dissipation of the mobile terminal 10.

[0396] The aforementioned heat dissipation module 20 is externally mounted on the mobile terminal 10 via the mounting part 200. In other words, the heat dissipation module 20 can be used as an external accessory for the mobile terminal 10; or, the heat dissipation module 20 is not located inside the mobile terminal 10 and does not occupy internal space. Furthermore, it does not conflict with the design of the mobile terminal 10 itself, nor does it affect the industrial design, board area, or waterproof and dustproof design of the mobile terminal 10. For example, the layout of the air outlet P1 of the heat dissipation module 20 does not affect the aesthetics and refinement of the mobile terminal 10; the size of the heat dissipation module 20 is also not limited by the internal layout space of the mobile terminal 10, allowing the mobile terminal 10 to be designed to be thinner and lighter. Therefore, the heat dissipation module 20 provided in this application embodiment can decouple the industrial design of the mobile terminal 10 from its high heat dissipation performance.

[0397] Furthermore, users can disassemble and install the mounting unit 200 themselves to facilitate cleaning, repair, or replacement of components of the heat dissipation module 20 without disassembling the mobile terminal 10, thus not affecting the reliability of the mobile terminal 10. Maintenance is simple, the module is replaceable, and the cost is low. Therefore, the heat dissipation module 20 provided in this embodiment has good maintainability and reliability.

[0398] Secondly, by flexibly adjusting the mounting position of the mounting part 200 on the mobile terminal 10 and the angle between the mounting part 200 and the working part 210, the heat dissipation module 20 can better achieve targeted low-impedance free-field heat dissipation, thereby helping to ensure that the heat dissipation module 20 has high heat dissipation performance in different heat dissipation scenarios. Therefore, the heat dissipation module 20 provided in this application embodiment has good heat dissipation performance.

[0399] Furthermore, the heat dissipation module 20 can be better adapted to the usage needs of different application scenarios. For example, when heat dissipation is not required, the heat dissipation module 20 can be switched to a folded state for easy carrying; when heat dissipation is required, the heat dissipation module 20 can be switched to an unfolded state to facilitate the operation of the piezoelectric fan 213. As another example, for different mobile terminals 10, the heat dissipation module 20 can be installed in different positions via the mounting part 200, and by adjusting the angle between the mounting part 200 and the working part 210, selective heat dissipation of different heat dissipation surfaces can be achieved to adapt to different working conditions, offering high flexibility and a wide range of applications. Therefore, the heat dissipation module 20 provided in this embodiment has excellent portability and versatility.

[0400] Finally, the piezoelectric fan 213 is powered via the power interface 260, eliminating the need for a battery, wireless charging coil, and their corresponding electrical connections. This results in a simple power supply structure with fewer components. Therefore, it effectively reduces the thickness, size, and cost of the heat dissipation module 20, further enhancing its portability and versatility. It also avoids battery-related safety risks or certification issues, making it particularly suitable for mobile terminals without built-in wireless charging functionality and hardware, thus broadening its applicability. For example, even mobile terminal models without an internal wireless charging coil can be easily powered via the power interface 260 and used in conjunction with the heat dissipation module 20.

[0401] One or more power supply interfaces 260 can be provided to expand and realize different charging and discharging functions, such as powering the piezoelectric fan 213 and charging other devices, such as the battery in the mobile terminal, thereby supporting the high-speed fast charging of the mobile terminal and having good heat dissipation and other functions.

[0402] Furthermore, compared to traditional mechanical fans, the piezoelectric fan 213 has no traditional rotating parts, is completely solid-state, has no bearings or motors, and is directly driven by piezoelectric elements. It is suitable for scenarios with high reliability requirements and severely limited thickness space, such as mobile terminals, which are prone to drops. The piezoelectric fan 213 has a high air velocity at its outlet P1, for example, the air velocity can reach more than 10m / s. This airflow can break the thermal boundary layer on the surface of the heat source, significantly improving the convective heat transfer efficiency. It can achieve a significant weight reduction without the need for metal heat sink fins and has a strong dust removal effect. Since the piezoelectric fan 213 usually operates in the ultrasonic frequency band (>20kHz), which is inaudible to the human ear and has low mechanical noise, the high air velocity results in prominent aerodynamic noise, especially in the high-velocity, low-flow area near the air outlet, where jet impact noise is prominent. It is not suitable for confined space channels, but it is suitable for open free fields with low impedance. It can also utilize the convolution effect to enhance heat dissipation and achieve low noise.

[0403] Therefore, compared with traditional fan cooling, the heat dissipation module 20 provided in this application combines the mounting part 200 and the piezoelectric fan 213. The mounting part 200 achieves the effect of placing the heat dissipation module 20 externally on the mobile terminal 10 without occupying internal space. Under low impedance free field, the piezoelectric fan 213 utilizes the convolution effect of non-isolated air intake and exhaust, which further improves the heat dissipation capacity of the heat dissipation module 20 and achieves low noise, avoiding and controlling the influence of jet impact noise. Therefore, the heat dissipation module 20 in this application embodiment achieves the effect of "1+1>2".

[0404] In some embodiments of this application, the power supply interface 260 can be a USB interface. USB interfaces are more versatile, eliminating the need for external power supplies to be specifically configured with non-standard power supply ports. Exemplarily, the USB interface can be USB Type-C. Exemplarily, the USB interface can be a USB connector (or USB female connector) or a USB cable (or USB male connector). Exemplarily, the USB cable can be a retractable USB cable to further enhance portability.

[0405] Continue to refer to Figure 15A and Figure 15B In some embodiments of this application, the heat dissipation module 20 may further include an operating member 270. The operating member 270 is rotatably connected to one end of the working part 210, and the other end of the working part 210 is rotatably connected to the mounting part 200 via a rotating part 220. The operating member 270 is used for user operation to rotate the working part 210 relative to the mounting part 200, thereby allowing the heat dissipation module 20 to be more easily rotated. Figure 15A The folded state shown and Figure 15B Switching between the unfolded states shown is simple and convenient.

[0406] For example, when a user needs to use the heat dissipation module 20, they can grasp and manipulate the operating component 270 to move the operating component 270 away from the heat-generating surface S1 of the mobile terminal 10, thereby allowing the heat dissipation module 20 to be in a more flexible position. Figure 15B The expanded state shown.

[0407] In some implementations, the operating element 270 can be a finger clip, through which the user can pass their fingers to hold the mobile terminal 10 more stably and reduce the risk of dropping the mobile terminal 10.

[0408] In some implementations, the actuating element 270 can also function as a support. For example, Figure 16 according to Figure 15A and Figure 15B A schematic diagram illustrating the use of an operating element 270 according to an embodiment of this application is shown. (Reference) Figure 16 When the heat dissipation module 20 is installed on the back cover 11-2 of the mobile terminal 10, and the heat dissipation module 20 is in Figure 16 In the unfolded state shown, the operating element 270 allows the mobile terminal 10 to contact the desktop 30, so as to support the mobile terminal 10 on the desktop 30.

[0409] It is understood that when the operating component 270 is used as a support, the piezoelectric fan 213 can be turned on or off, and this application does not impose any restrictions on this.

[0410] In some implementations, the operating member 270 can be an incomplete annular structure, that is, the operating member 270 has an opening. For example, the operating member 270 can be similarly C-shaped, with its two ends rotatably connected to the working part 210.

[0411] In some of these implementations, when the heat dissipation module 20 is in Figure 15A In the folded state shown, the operating member 270 can surround the piezoelectric fan 213 of the working part 210 in the circumferential direction, which can help to further reduce the thickness of the heat dissipation module 20, thereby realizing the thin and light design of the heat dissipation module 20.

[0412] In some implementations, the working part 210 may include a first recess 219, and the operating member 270 may include a second recess 271. When the heat dissipation module 20 is in Figure 15A In the folded state shown, the first recess 219 and the second recess 271 fit together, which makes the structure of the heat dissipation module 20 more compact in the folded state, which is beneficial to the thinner and lighter design of the heat dissipation module 20.

[0413] It should be noted that, Figures 15A to 16 The operating element 270 in the illustrated embodiment is also applicable to the above-described embodiment. Figures 2A to 14C The heat dissipation module 20 in the illustrated embodiment. That is, the above-mentioned... Figures 2A to 14C The heat dissipation module 20 in the illustrated embodiment may also include an operating element 270.

[0414] In addition to the above Figures 15A to 16 The structure and variations of the heat dissipation module 20 shown are similar to those described above. Figures 2A to 14C The heat dissipation module 20 in the illustrated embodiment is essentially the same; therefore, please refer to the above for details. Figure 2A and Figure 2B The relevant descriptions in the illustrated embodiments are briefly introduced below.

[0415] In some embodiments of this application, Figures 15A to 16 In the embodiment shown, the mounting portion 200 of the heat dissipation module 20 is the same as described above. Figures 3A to 5B The mounting part 200 in the illustrated embodiment is substantially the same; therefore, please refer to the above description for details. Figures 3A to 5B The relevant descriptions in the illustrated embodiments.

[0416] For example, in Figures 15A to 16 In the illustrated embodiment, the mounting part 200 can also be connected to the mobile terminal 10 by means of magnetic attraction, van der Waals suction cup adsorption, bonding, snap-fit ​​connection or fastener connection.

[0417] In some embodiments of this application, Figures 15A to 16 In the embodiment shown, the piezoelectric fan 213 of the working part 210 of the heat dissipation module 20 is similar to the above-mentioned... Figures 6A to 7C The piezoelectric fan 213 in the illustrated embodiment is essentially the same; therefore, please refer to the above description for details. Figures 6A to 7C The relevant descriptions in the illustrated embodiments.

[0418] For example, in Figures 15A to 16 In the illustrated embodiment, the piezoelectric fan 213 of the working unit 210 may also include a jet port P0. The jet port P0 consists of the air outlet P1 and the air inlet P2 of the piezoelectric fan 213. The specific structure of the jet port P0 can be referred to the above description. Figures 6A to 7C The relevant descriptions in the illustrated embodiments will not be repeated here.

[0419] For example, in Figures 15A to 16 In the illustrated embodiment, the piezoelectric fan 213 of the working unit 210 may also include a first working state and a second working state. When the piezoelectric fan 213 is in the first working state, it can dissipate heat from the mobile terminal 10; when the piezoelectric fan 213 is in the second working state, it can perform short-term self-dust removal to prevent dust accumulation (e.g., accumulation of dust, fiber dirt, etc.), thereby avoiding problems such as abnormal noise, noise, and performance degradation of the heat dissipation module 20, and thus improving the reliability of the heat dissipation module 20.

[0420] In this way, the piezoelectric fan 213 can meet basic heat dissipation requirements while having self-cleaning and maintenance capabilities, effectively reducing the impact of dust accumulation on heat dissipation performance and operational stability, extending the service life of the heat dissipation module 20, and improving overall reliability and product experience.

[0421] In some implementations, the operating frequency of the piezoelectric fan 213 in the first operating state may be lower than the operating frequency of the piezoelectric fan 213 in the second operating state. For example, the operating frequency of the piezoelectric fan 213 in the first operating state may be 20kHz to 30kHz. The operating frequency of the piezoelectric fan 213 in the second operating state may be greater than 30kHz.

[0422] In some implementations, the operating voltage of the piezoelectric fan 213 in the first operating state may be less than the operating voltage of the piezoelectric fan 213 in the second operating state. For example, the ratio between the operating voltage of the piezoelectric fan 213 in the second operating state and the operating voltage of the piezoelectric fan 213 in the first operating state may be greater than or equal to 1.3.

[0423] In some embodiments of this application, Figures 15A to 16 In the illustrated embodiment, the working part 210 of the heat dissipation module 20 may also include a circuit board 214, which is similar to the one described above. Figure 6A and Figure 6B The circuit board 214 in the illustrated embodiment is substantially the same; therefore, please refer to the above description for details. Figure 6A and Figure 6B The relevant descriptions in the illustrated embodiments will not be repeated here.

[0424] In some embodiments of this application, Figures 15A to 16 In the illustrated embodiment, the working part 210 of the heat dissipation module 20 may also include a dustproof mesh, which is the same as described above. Figures 6A to 10H The dustproof net 215 in the illustrated embodiment is essentially the same; therefore, please refer to the above for details. Figures 6A to 10H The relevant descriptions in the illustrated embodiments.

[0425] For example, the dustproof mesh may also have through holes that cover at least a portion of the air outlet P1 of the piezoelectric fan 213. For example, the ratio between the cross-sectional area of ​​the through holes in the dustproof mesh and the cross-sectional area of ​​the air outlet P1 may be greater than or equal to 1.5. For example, the cross-sectional area of ​​the through holes in the dustproof mesh may be less than or equal to 2 mm². 2 .

[0426] In some embodiments of this application, Figures 15A to 16 In the illustrated embodiment, the rotating part 220 of the heat dissipation module 20 may also include a limiting mechanism, which is the same as described above. Figures 13A to 13C The limiting mechanism in the illustrated embodiments is essentially the same; therefore, please refer to the above for details. Figures 13A to 13C The relevant descriptions in the illustrated embodiments will not be repeated here.

[0427] In some embodiments of this application, Figures 15A to 16 In the illustrated embodiment, the heat dissipation module 20 may also include a switch, the switch being the same as described above. Figures 13A to 13C The switch 240 in the illustrated embodiment is essentially the same; therefore, please refer to the above description for details. Figures 13A to 13C The relevant descriptions in the illustrated embodiments will not be repeated here.

[0428] In some embodiments of this application, Figures 15A to 16 In the illustrated embodiment, the heat dissipation module 20 may also include indicator lights, which are the same as those described above. Figures 13A to 13C The indicator light 250 in the illustrated embodiment is essentially the same; therefore, please refer to the above description for details. Figures 13A to 13C The relevant descriptions in the illustrated embodiments will not be repeated here.

[0429] The above description illustrates the implementation of this application through specific embodiments. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application is presented in conjunction with some embodiments, this does not mean that the features of this application are limited to these embodiments, and this application can also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details have been omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0430] In the description of this application, it should be noted that the term "and / or" is a term used to describe the relationship between related objects, indicating that there are three possible scenarios. For example, A and / or B can mean: A exists alone, B exists alone, or A and B exist simultaneously.

[0431] In the description of this application, it should be noted that the terms "parallel," "perpendicular," etc., are used in relation to the current technological level, and are not absolute or strict mathematical definitions. For example, the parallelism in this application is not absolute parallelism. Approximate parallelism due to processing and assembly errors (e.g., an angle of 0.1° between two structural features) is also within the scope of mutual parallelism in this application. In other words, there can be a predetermined angular deviation between two parallel structures; for example, the predetermined angle can be within the range of ±10°. Similarly, the perpendicularity in this application is not absolute perpendicularity. Approximate perpendicularity due to processing and assembly errors (e.g., an angle of 89.9° between two structural features) is also within the scope of mutual perpendicularity in this application. In other words, there can be a predetermined angular deviation between two perpendicular structures; for example, the predetermined angle can be within the range of ±10°.

[0432] In the description of this application, it should be noted that when component A and component B are arranged opposite each other along a certain direction, it means that component A and component B are arranged face-to-face in that direction, and the projections of component A and component B along that direction at least partially overlap. Based on this, component A and component B may be spaced apart or closely fitted together in that direction.

[0433] In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "outer", "inner", "circumferential", "radial", "axial", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0434] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "set," "install," "connect," and "fit" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

Claims

1. A heat dissipation module (20) applied to a mobile terminal (10), characterized in that, include: The mounting part (200) is used to connect to the mobile terminal (10); The working unit (210) includes a battery (212) and a piezoelectric fan (213), wherein the battery (212) is used to supply power to the piezoelectric fan (213); A rotating part (220) rotatably connects the mounting part (200) and the working part (210) to allow the heat dissipation module (20) to switch between a folded state and an unfolded state; A first wireless charging coil (230) is used to charge the battery (212); When the heat dissipation module (20) is in the folded state, the first wireless charging coil (230) can be coupled to the second wireless charging coil (15) in the mobile terminal (10); When the heat dissipation module (20) is in the unfolded state, the first wireless charging coil (230) is not coupled to the second wireless charging coil (15) in the mobile terminal (10), and the air outlet (P1) of the piezoelectric fan (213) is directed toward the heat-generating surface (S1) of the mobile terminal (10).

2. The heat dissipation module (20) according to claim 1, characterized in that, The first wireless charging coil (230) is disposed on the mounting part (200), and the working part (210) further includes a circuit board (214), which is connected to the battery (212); When the heat dissipation module (20) is in the folded state, the first wireless charging coil (230) is connected to the circuit board (214) to charge the battery (212); When the heat dissipation module (20) is in the unfolded state, the first wireless charging coil (230) is spaced apart from the circuit board (214) to stop charging the battery (212).

3. The heat dissipation module (20) according to claim 1, characterized in that, The first wireless charging coil (230) is disposed in the working part (210), and the working part (210) also includes a circuit board (214). The first wireless charging coil (230) and the battery (212) are respectively connected to the circuit board (214). When the heat dissipation module (20) is in the folded state, the distance between the first wireless charging coil (230) and the second wireless charging coil (15) in the mobile terminal (10) is less than or equal to the electromagnetic coupling distance, so as to charge the battery (212); When the heat dissipation module (20) is in the unfolded state, the distance between the first wireless charging coil (230) and the second wireless charging coil (15) in the mobile terminal (10) is greater than the electromagnetic coupling distance, so as to stop charging the battery (212).

4. The heat dissipation module (20) according to any one of claims 1 to 3, characterized in that, The heat dissipation module (20) also includes a switch (240) for controlling the working state of the piezoelectric fan (213); When the heat dissipation module (20) is in the folded state, the switch (240) is located between the mounting part (200) and the working part (210).

5. The heat dissipation module (20) according to any one of claims 1 to 4, characterized in that, The piezoelectric fan (213) includes a jet port (P0), which is the air outlet (P1) and air inlet (P2) of the piezoelectric fan (213).

6. The heat dissipation module (20) according to any one of claims 1 to 5, characterized in that, The piezoelectric fan (213) includes a first working state and a second working state; The operating frequency of the piezoelectric fan (213) in the first operating state is less than the operating frequency of the piezoelectric fan (213) in the second operating state; or The operating voltage of the piezoelectric fan (213) in the first operating state is less than the operating voltage of the piezoelectric fan (213) in the second operating state.

7. The heat dissipation module (20) according to claim 6, characterized in that, The operating frequency of the piezoelectric fan (213) in the first operating state is lower than the operating frequency of the piezoelectric fan (213) in the second operating state. The operating frequency of the piezoelectric fan (213) in the first operating state is 20kHz to 30kHz, and the operating frequency of the piezoelectric fan (213) in the second operating state is greater than 30kHz; or The operating voltage of the piezoelectric fan (213) in the first working state is less than the operating voltage of the piezoelectric fan (213) in the second working state, and the ratio between the operating voltage of the piezoelectric fan (213) in the second working state and the operating voltage of the piezoelectric fan (213) in the first working state is greater than or equal to 1.

3.

8. The heat dissipation module (20) according to any one of claims 1 to 7, characterized in that, The piezoelectric fan (213) is covered with a dustproof net (215), and the dustproof net (215) has a through hole (2151) that covers at least part of the air outlet (P1).

9. The heat dissipation module (20) according to claim 8, characterized in that, The ratio between the cross-sectional area of ​​the through hole (2151) and the cross-sectional area of ​​the air outlet (P1) is greater than or equal to 1.5; and / or The cross-sectional area of ​​the through hole (2151) is less than or equal to 2 mm². 2 .

10. The heat dissipation module (20) according to any one of claims 1 to 9, characterized in that, The rotating part (220) includes a limiting mechanism for limiting the rotation angle of the working part (210) relative to the mounting part (200).

11. The heat dissipation module (20) according to claim 10, characterized in that, The rotation angle range of the working part (210) relative to the mounting part (200) is less than or equal to 60°, and when the heat dissipation module (20) is in the folded state, the air outlet (P1) faces the mounting part (200).

12. The heat dissipation module (20) according to any one of claims 1 to 11, characterized in that, The mounting part (200) includes a first magnetic suction member, and the heat dissipation module (20) includes a second magnetic suction member and a positioning member; The first magnetic component is used to be attracted to the second magnetic component, and the second magnetic component is used to be installed on the mobile terminal (10). The positioning element is used to position the second magnetic element during the process of installing the second magnetic element onto the mobile terminal (10).

13. The heat dissipation module (20) according to claim 12, characterized in that, The magnetic attraction force between the first magnetic element and the second magnetic element is adjustable; and / or One end of the positioning member is used to be inserted into the power supply interface (16) of the mobile terminal (10), and the other end of the positioning member is used to cooperate with the second magnetic member.

14. The heat dissipation module (20) according to any one of claims 1 to 11, characterized in that, The mounting part (200) includes a van der Waals suction cup for adsorbing onto the mobile terminal (10).

15. The heat dissipation module (20) according to any one of claims 1 to 14, characterized in that, The heat dissipation module (20) also includes at least one of the following components: A switch (240) is used to control the operating state of the piezoelectric fan (213); Indicator light (250) is used to indicate the operating status of the battery (212) and / or the piezoelectric fan (213); A power supply interface (260) is provided for electrical connection to an external power source to charge the battery (212) and / or supply power to the piezoelectric fan (213). An operating element (270) is rotatably connected to one end of the working part (210), and the other end of the working part (210) is rotatably connected to the mounting part (200) through the rotating part (220). The operating element (270) is used for user operation to make the working part (210) rotate relative to the mounting part (200).

16. A heat dissipation module (20) applied to a mobile terminal (10), characterized in that, include: The mounting part (200) is used to connect to the mobile terminal; The working part (210) includes a power supply interface (260) and a piezoelectric fan (213). The power supply interface (260) is used to connect to an external power source to supply power to the piezoelectric fan (213). A rotating part (220) rotatably connects the mounting part (200) and the working part (210) to allow the heat dissipation module (20) to switch between a folded state and an unfolded state; When the heat dissipation module (20) is in the unfolded state, the air outlet (P1) of the piezoelectric fan (213) is directed toward the heat-generating surface (S1) of the mobile terminal (10).

17. The heat dissipation module (20) according to claim 16, characterized in that, The piezoelectric fan (213) includes a jet port (P0), which is the air outlet (P1) and air inlet (P2) of the piezoelectric fan (213).

18. The heat dissipation module (20) according to claim 16 or 17, characterized in that, The piezoelectric fan (213) includes a first working state and a second working state; The operating frequency of the piezoelectric fan (213) in the first operating state is less than the operating frequency of the piezoelectric fan (213) in the second operating state; or The operating voltage of the piezoelectric fan (213) in the first operating state is less than the operating voltage of the piezoelectric fan (213) in the second operating state.

19. The heat dissipation module (20) according to claim 18, characterized in that, The operating frequency of the piezoelectric fan (213) in the first operating state is lower than the operating frequency of the piezoelectric fan (213) in the second operating state. The operating frequency of the piezoelectric fan (213) in the first operating state is 20kHz to 30kHz, and the operating frequency of the piezoelectric fan (213) in the second operating state is greater than 30kHz; or The operating voltage of the piezoelectric fan (213) in the first working state is less than the operating voltage of the piezoelectric fan (213) in the second working state, and the ratio between the operating voltage of the piezoelectric fan (213) in the second working state and the operating voltage of the piezoelectric fan (213) in the first working state is greater than or equal to 1.

3.

20. The heat dissipation module (20) according to any one of claims 16 to 19, characterized in that, The piezoelectric fan (213) is covered with a dustproof net (215), and the dustproof net (215) has a through hole (2151) that covers at least part of the air outlet (P1).

21. The heat dissipation module (20) according to claim 20, characterized in that, The ratio between the cross-sectional area of ​​the through hole (2151) and the cross-sectional area of ​​the air outlet (P1) is greater than or equal to 1.5; and / or The cross-sectional area of ​​the through hole (2151) is less than or equal to 2 mm². 2 .

22. A mobile electronic device component (1), characterized in that, Includes a mobile terminal (10) and a heat dissipation module (20) according to any one of claims 1 to 21, wherein: The mobile terminal (10) has a heat-generating surface (S1), and the heat dissipation module (20) is mounted on the mobile terminal (10) through the mounting part (200). When the heat dissipation module (20) is in the unfolded state, the air outlet (P1) of the heat dissipation module (20) faces the heat-generating surface (S1).

23. The mobile electronic device assembly (1) according to claim 22, characterized in that, When the heat dissipation module (20) is in the unfolded state, the distance between the air outlet (P1) and the heat-generating surface (S1) is 2mm to 30mm.

24. The mobile electronic device assembly (1) according to claim 22 or 23, characterized in that, The mobile terminal (10) includes a mobile phone, the mobile phone includes a back cover (11-2), the back cover (11-2) includes the heat-generating surface (S1), and the heat dissipation module (20) is installed on the heat-generating surface (S1) of the back cover (11-2).

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