An energy storage inverter

Abstract

This utility model relates to the field of inverter heat dissipation technology and discloses an energy storage inverter. The energy storage inverter includes a housing, a power circuit module, a power heat sink, a piezoelectric fan assembly, and an inductive heat sink. The power circuit module is disposed within the housing, and the power heat sink is disposed within the housing and thermally coupled to the power circuit module. The piezoelectric fan assembly and the inductive heat sink are respectively disposed on opposite sides of the power heat sink, and the inductive heat sink is thermally coupled to a power inductor within the housing. The piezoelectric fan assembly includes a drive unit and a reverse piezoelectric vibration unit. The drive unit can apply an alternating voltage to the reverse piezoelectric vibration unit, which can generate an oscillating airflow towards the power heat sink through vibration. The energy storage inverter provided by this utility model, by employing a piezoelectric fan assembly, is suitable for high-reliability heat dissipation requirements in harsh outdoor environments.

Description

Technical Field

[0001] This utility model relates to the field of inverter heat dissipation technology, specifically to an energy storage inverter. Background Technology

[0002] An energy storage inverter is a comprehensive device that combines an inverter and an energy storage system. It can be used to convert electrical energy into another form and store it in batteries to cope with power fluctuations, improve grid stability, and provide convenient power support for renewable energy and daily life and travel.

[0003] To meet the high reliability and heat dissipation requirements of harsh outdoor environments, energy storage inverters often employ a cooling fan combined with a heat sink for heat dissipation. However, energy storage inverters need to meet the requirement of a service life of more than ten years when used outdoors. In current technology, cooling fans mostly use electromagnetic drive, but they suffer from mechanical wear, limited lifespan, and low protection levels, which cannot meet the stringent requirements of long-term outdoor use of energy storage inverters.

[0004] Therefore, there is an urgent need to provide an energy storage inverter to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide an energy storage inverter that meets the high reliability heat dissipation requirements of harsh outdoor environments.

[0006] This utility model is achieved through the following technical solution:

[0007] An energy storage inverter, comprising:

[0008] case;

[0009] The power circuit module is disposed within the housing;

[0010] A power heat sink is disposed inside the housing and thermally coupled to the power circuit module;

[0011] A piezoelectric fan assembly and an inductive heat sink are respectively disposed on opposite sides of the power heat sink. The inductive heat sink is thermally coupled to the power inductor inside the housing. The piezoelectric fan assembly includes a drive unit and an inverse piezoelectric vibration unit. The drive unit can apply an alternating voltage to the inverse piezoelectric vibration unit, and the inverse piezoelectric vibration unit can generate an oscillating airflow toward the power heat sink through vibration.

[0012] As an optional solution, the driving unit is a circuit board.

[0013] As an optional solution, the inverse piezoelectric vibration unit includes multiple ceramic piezoelectric vibrators and multiple heat dissipation blades. The end of each ceramic piezoelectric vibrator facing away from the power heat sink is connected to the circuit board, and the end of each ceramic piezoelectric vibrator close to the power heat sink is connected to one of the heat dissipation blades.

[0014] As an alternative, the power radiator is provided with a duct plate on the side away from the power circuit module. The duct plate simultaneously shields the power radiator and the piezoelectric fan assembly. The duct plate is provided with a first duct hole and a second duct hole. The first duct hole corresponds to the position of the piezoelectric fan assembly, and the second duct hole corresponds to the position of the air outlet of the power radiator.

[0015] As an optional solution, the housing is provided with ventilation holes, which are directly opposite the air outlet of the inductor heat sink.

[0016] As an optional solution, the power circuit module includes a PCB board and a plurality of MOSFETs disposed on the PCB board, wherein the plurality of MOSFETs are disposed at one end of the PCB board near the power heat sink and are thermally coupled to the power heat sink.

[0017] As an alternative, a miniature axial flow fan is provided on the inner side of the housing. The miniature axial flow fan is used to drive the airflow channel to dissipate heat from at least some of the heat-generating components on the PCB board.

[0018] As an optional solution, a thermally conductive insulating material is provided between the power heat sink and the MOSFET.

[0019] As an optional solution, the housing includes a front shell, a middle shell, and a rear shell. A cavity is provided on one side of the middle shell, and the power heat sink, the piezoelectric fan assembly, and the inductor heat sink are housed in the cavity. The power circuit module is disposed on the other side of the middle shell. Multiple cutout windows are provided on the middle shell, and each MOS transistor is thermally coupled to the power heat sink through the corresponding cutout window. The front shell and the rear shell are respectively fastened to the front and rear sides of the middle shell.

[0020] As an alternative, the power inductor is embedded in the inductor heat sink using a potting process.

[0021] The beneficial effects of this utility model are as follows:

[0022] This invention provides an energy storage inverter based on the inverse piezoelectric effect. When the drive unit applies an alternating voltage to the inverse piezoelectric vibrating unit, the inverse piezoelectric vibrating unit will generate periodic deformation and high-frequency vibration, thereby fanning air to form a stable oscillating airflow towards the power heat sink, thus forming laminar forced convection. The power heat sink and the piezoelectric fan assembly form the main heat dissipation channel. The power heat sink is responsible for absorbing the heat generated by the main heat-generating components on the power circuit module, while the piezoelectric fan assembly uses its generated airflow to quickly blow away the hot air on the surface of the power heat sink, forming rapid air convection and effectively removing heat. The inductor heat sink forms a top natural reinforcement layer, mainly responsible for absorbing the heat of the power inductor, and the forced convection at its bottom further enhances the heat dissipation effect.

[0023] Therefore, the energy storage inverter provided by this utility model adopts a piezoelectric fan component, which can be controlled by the inverse piezoelectric effect, completely eliminating electromagnetic interference, improving the electromagnetic compatibility performance of the system, realizing stepless speed regulation, precisely matching heat dissipation requirements, supporting burst mode operation, adapting to transient heat loads, having the ability to start at -40℃, and adapting to various climatic environments; moreover, the wear-free design of the piezoelectric fan component enables the entire machine to exceed the 10-year threshold; and the heat dissipation capacity is increased by 40% for the same volume, while the weight of the entire machine is reduced by more than 30%; in addition, the piezoelectric fan component has a natural dustproof and waterproof structure, reducing the requirements for the casing process. Attached Figure Description

[0024] To more clearly and understandably illustrate the embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. The drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of the energy storage inverter provided in this embodiment of the utility model;

[0026] Figure 2 This is an exploded view of the structure of the energy storage inverter provided in this embodiment of the utility model;

[0027] Figure 3 This is an exploded view of the power radiator, piezoelectric fan assembly, and air duct plate provided in this embodiment of the utility model;

[0028] Figure 4 This is a schematic diagram showing the combination of the power radiator, piezoelectric fan assembly, and air duct plate provided in this embodiment of the utility model.

[0029] Figure 5 This is an exploded view of the energy storage inverter provided in this embodiment of the utility model, with the front and rear shells hidden.

[0030] Figure 6 This is a schematic diagram of the energy storage inverter provided in this embodiment of the present invention with the front casing removed.

[0031] In the picture:

[0032] 1. Housing; 11. Front housing; 12. Middle housing; 121. Cutout window; 122. Cavity; 13. Rear housing; 131. Ventilation hole; 2. Power circuit module; 21. PCB board; 22. MOSFET; 3. Power heat sink; 4. Piezoelectric fan assembly; 41. Circuit board; 42. Ceramic piezoelectric vibrator; 43. Heat dissipation blades; 5. Inductive heat sink; 6. Air duct plate; 61. First air duct hole; 62. Second air duct hole; 7. Thermally conductive insulating material; 8. Miniature axial flow fan; 9. Power inductor. Detailed Implementation

[0033] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0034] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0035] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0036] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0037] An energy storage inverter is a comprehensive device that combines an inverter and an energy storage system. It can be used to convert electrical energy into another form and store it in batteries to cope with power fluctuations, improve grid stability, and provide convenient power support for renewable energy and daily life and travel.

[0038] To meet the high-reliability heat dissipation requirements of harsh outdoor environments, energy storage inverters often employ a cooling fan combined with a heat sink for heat dissipation. However, energy storage inverters need to meet a service life requirement of more than ten years when used outdoors. In current technology, cooling fans mostly use electromagnetic drives, but these suffer from mechanical wear, limited lifespan, and low protection levels, failing to meet the stringent requirements of long-term outdoor use of energy storage inverters. Moreover, heat sinks generally include inductive heat sinks and power heat sinks. In traditional outdoor energy storage inverters, the inductive heat sink and power heat sink are usually installed separately on the inverter casing, resulting in a large space occupation and affecting the overall size and compactness of the energy storage inverter.

[0039] To solve the above problems, such as Figure 1 and Figure 2 As shown, this embodiment provides an energy storage inverter, including a housing 1, a power circuit module 2, a power heat sink 3, a piezoelectric fan assembly 4, and an inductive heat sink 5. The power circuit module 2 is disposed within the housing 1, and the power heat sink 3 is disposed within the housing 1 and thermally coupled to the power circuit module 2. The piezoelectric fan assembly 4 and the inductive heat sink 5 are respectively disposed on opposite sides of the power heat sink 3. The inductive heat sink 5 is thermally coupled to a power inductor 9 within the housing 1. The piezoelectric fan assembly 4 includes a drive unit and an inverse piezoelectric vibration unit. The drive unit can apply an alternating voltage to the inverse piezoelectric vibration unit, which can generate an oscillating airflow towards the power heat sink 3 through vibration. Thermal coupling refers to the heat transfer phenomenon between two structural components, which can be direct contact between the two structural components or heat conduction between them through an intermediate heat-conducting element.

[0040] The energy storage inverter provided in this embodiment is based on the inverse piezoelectric effect. When the drive unit applies an alternating voltage to the inverse piezoelectric vibration unit, the inverse piezoelectric vibration unit will generate periodic deformation and high-frequency vibration, thereby fanning the air to form a stable oscillating airflow towards the power heat sink 3, and thus forming laminar forced convection.

[0041] In one optional embodiment, the piezoelectric fan assembly 4 is disposed on the lower side of the power heat sink 3, and the inductive heat sink 5 is disposed on the upper side of the power heat sink 3. In another optional embodiment, the piezoelectric fan assembly 4 may also be disposed on the upper side of the power heat sink 3, and the inductive heat sink 5 may be disposed on the lower side of the power heat sink 3. This embodiment is described using the example of the piezoelectric fan assembly 4 being disposed on the lower side of the power heat sink 3 and the inductive heat sink 5 being disposed on the upper side of the power heat sink 3.

[0042] Specifically, in this embodiment, as Figure 3 As shown, the driving unit is a circuit board 41, and the inverse piezoelectric vibration unit includes multiple ceramic piezoelectric vibrators 42 and multiple heat dissipation blades 43. The end of each ceramic piezoelectric vibrator 42 facing away from the power heat sink 3 is connected to the circuit board 41, and the end of each ceramic piezoelectric vibrator 42 close to the power heat sink 3 is connected to a heat dissipation blade 43.

[0043] The circuit board 41 is an embedded circuit board that integrates piezoelectric drive circuit and control logic, which is existing technology and will not be described in detail here. The ceramic piezoelectric vibrator 42 is the power source. Based on the inverse piezoelectric effect, when the circuit board 41 applies an alternating voltage to the ceramic piezoelectric vibrator 42, the ceramic piezoelectric vibrator 42 will generate periodic deformation, which drives the heat sink 43 to generate high-frequency vibration (typical frequency 20kHz~30kHz), thereby fanning the air to form an upward stable airflow. Multiple sets of ceramic piezoelectric vibrators 42 and heat sink 43 work together to form laminar forced convection.

[0044] The power heat sink 3 and the piezoelectric fan assembly 4 form the main heat dissipation channel. The power heat sink 3 is responsible for absorbing the heat generated by the main heat-generating components on the power circuit module 2, while the piezoelectric fan assembly 4 uses its upward airflow to quickly blow away the hot air on the surface of the power heat sink 3, forming rapid air convection and effectively removing heat. The inductor heat sink 5 forms the top natural reinforcement layer, mainly responsible for absorbing the heat from the power inductor 9. The forced convection at its bottom further enhances the heat dissipation effect. The close proximity of the inductor heat sink 5 and the power heat sink 3 achieves centralized deployment of heat sinks, reducing space occupation and contributing to the size control and lightweight improvement of the energy storage inverter.

[0045] It should be noted that the number of piezoelectric fan components 4 can be one set, two sets side by side, three sets side by side, or more, depending on the actual needs; no specific limitation is made here. Furthermore, the specific structures and working principles of the power heat sink 3 and the inductive heat sink 5 are existing technologies and will not be elaborated upon here.

[0046] The advantages of the piezoelectric fan assembly 4 used in this embodiment compared with the electromagnetic fan (driven by electromagnetic means) in the prior art can be seen in Table 1.

[0047] Table 1

[0048] Comparison Dimensions piezoelectric fan assembly electromagnetic fan Driving principle Piezoelectric effect, no electromagnetic interference Electromagnetic induction generates electromagnetic interference. Moving parts Micrometer-level vibration, no mechanical contact Rotor bearings are subject to mechanical wear. life >100,000 hours (no wear) Typically 10,000 to 30,000 hours Protection level Naturally meets IP67 (fully sealed structure) requirements. Maximum IP55 (requires special design) Energy efficiency ratio Electrical energy to kinetic energy conversion efficiency > 85% Typical 50-70% noise <30dB (ultrasonic frequency band) 45-65dB Response speed Millisecond-level start / stop Second-level start / stop weight Lighter than traditional fans with the same air volume by more than 60% Large weight Shock and vibration resistance Extremely strong (without precision mechanical structure) Sensitive (bearings are prone to damage)

[0049] Therefore, the piezoelectric fan assembly 4 used in this embodiment can be controlled by the piezoelectric effect, with no electromagnetic interference, improving the electromagnetic compatibility performance of the system. Its specific control method can be used in conjunction with a temperature sensor, adjusting the amplitude and frequency of the drive voltage according to the feedback from the temperature sensor to achieve stepless speed regulation, accurately match heat dissipation requirements, support burst mode operation, adapt to transient heat loads, have the ability to start at -40℃, and adapt to various climatic environments. Furthermore, the wear-free design of the piezoelectric fan assembly 4 allows the entire machine to exceed the ten-year lifespan threshold. Moreover, the heat dissipation capacity is increased by 40% for the same machine volume, and the weight of the entire machine is reduced by more than 30%. In addition, the piezoelectric fan assembly 4 has a natural dustproof and waterproof structure, reducing the requirements for the outer casing process.

[0050] In this embodiment, the heat sink fins of the power radiator 3 extend vertically, and multiple ceramic piezoelectric vibrators 42 are arranged in parallel at intervals and are parallel to the heat sink fins of the power radiator 3. In this way, the piezoelectric fan assembly 4 can generate a vertically rising airflow and ensure that the airflow can penetrate deep into the gaps between the heat sink fins to effectively remove heat.

[0051] In an optional embodiment, such as Figure 3 and Figure 4 As shown, a duct plate 6 is provided on the side of the power radiator 3 away from the power circuit module 2. The duct plate 6 also blocks the piezoelectric fan assembly 4. The duct plate 6 is provided with a first duct hole 61 and a second duct hole 62. The first duct hole 61 corresponds to the position of the piezoelectric fan assembly 4, and the second duct hole 62 corresponds to the position of the air outlet of the power radiator 3. The first air duct hole 61 and the second air duct hole 62 are both arranged in a row of several. The air duct plate 6 guides the airflow. The first air duct hole 61 serves as the air inlet and the second air duct hole 62 serves as the air outlet. After the external air enters through the first air duct hole 61, the piezoelectric fan assembly 4 fanns the air based on the inverse piezoelectric effect to form an upward airflow, which allows the airflow to penetrate deep into the gap of the heat sink fins of the power radiator 3 and effectively remove heat. When the airflow reaches the air outlet (upper end) of the power radiator 3, part of the airflow continues to flow upward through the inductor radiator 5 to achieve further heat dissipation, while the other part of the hot air is discharged through the second air duct hole 62 at the top, guiding the formation of an airflow loop, accelerating the air circulation of the entire heat dissipation system, continuously cooling the power radiator 3, and improving the heat dissipation efficiency.

[0052] In an optional embodiment, such as Figure 1As shown, a ventilation hole 131 is provided on the upper side of the housing 1, and the ventilation hole 131 is directly opposite the air outlet of the inductor heat sink 5. The hot air generated by the airflow passing through the inductor heat sink 5 is discharged through the ventilation hole 131 on the top, realizing natural heat dissipation and preventing hot air from accumulating between the heat sink fins of the inductor heat sink 5.

[0053] Optionally, such as Figure 5 As shown, the power circuit module 2 includes a PCB board 21 and multiple MOSFETs 22 (metal-oxide-semiconductor field-effect transistors, an important semiconductor device) disposed on the PCB board 21. The multiple MOSFETs 22 are located at the end of the PCB board 21 near the power heat sink 3 and are thermally coupled to the power heat sink 3. Since the MOSFETs 22 are the main heat-generating components, this arrangement, which makes the MOSFETs 22 face the power heat sink 3 and are directly thermally coupled to the power heat sink 3, improves heat dissipation efficiency. As for the other specific structures and working principles of the power circuit module 2, they are all existing technologies and will not be described in detail here.

[0054] Specifically, such as Figure 1 and Figure 2 As shown, the housing 1 includes a front housing 11, a middle housing 12, and a rear housing 13. A power heat sink 3, a piezoelectric fan assembly 4, and an inductive heat sink 5 are disposed on one side of the middle housing 12, and a power circuit module 2 is disposed on the other side of the middle housing 12. The middle housing 12 has multiple perforated windows 121, through which each MOSFET 22 is thermally coupled to the power heat sink 3. The front housing 11 and the rear housing 13 are respectively fastened to the front and rear sides of the middle housing 12. The rear housing 13 has a clearance opening in the middle to allow airflow through the air duct plate 6. Specifically, in this embodiment, the power heat sink 3, the piezoelectric fan assembly 4, and the inductive heat sink 5 are disposed on the rear side of the middle housing 12, and the power circuit module 2 is disposed on the front side of the middle housing 12. The middle shell 12 serves as a mounting bracket, supporting and installing the power heat sink 3, inductor heat sink 5, and power circuit module 2. Installation can be achieved through adhesive bonding, screw fastening, or other methods. The front shell 11 and rear shell 13 are fastened to the front and rear sides of the middle shell 12, thus encapsulating the power heat sink 3, piezoelectric fan assembly 4, inductor heat sink 5, and power circuit module 2. In this embodiment, the ventilation hole 131 is located on the top of the rear shell 13; however, in other embodiments, the ventilation hole 131 can also be located on the top of the middle shell 12.

[0055] In an optional embodiment, such as Figure 2 As shown, a recess 122 is provided on the rear side of the middle shell 12, and the power heat sink 3, the piezoelectric fan assembly 4, and the inductor heat sink 5 are housed in the recess 122. This reduces the overall thickness of the energy storage inverter, which is beneficial for controlling the size and improving the compactness of the energy storage inverter.

[0056] In an optional embodiment, such as Figure 5 As shown, a thermally conductive insulating material 7 is disposed between the power heat sink 3 and each MOSFET 22. The thermally conductive insulating material 7 fills the space between the MOSFET 22 and the power heat sink 3, achieving both thermal conductivity and insulation. Optionally, the thermally conductive insulating material 7 can be a material with a thermal conductivity greater than 3 W / (m·K), such as thermal grease.

[0057] like Figure 5 As shown, the power inductor 9 is one of the most critical components in the energy storage inverter, primarily serving functions such as energy storage, voltage boosting, filtering, and electromagnetic interference elimination. In this embodiment, the power inductor 9 can be embedded within the inductor heat sink 5 through a potting process. This increases the heat capacity, enhances heat transfer and storage, optimizes heat dissipation efficiency, and significantly improves the performance and lifespan of the power inductor 9. Figure 2 As shown, the power inductor 9 is encapsulated in the inductor heat sink 5 without taking up any space.

[0058] In an optional embodiment, such as Figure 6 As shown, a miniature axial flow fan 8 is provided on the inner side of the housing 1. The miniature axial flow fan 8 is used to drive the airflow channel to dissipate heat from at least some of the heat-generating components on the PCB board 21, specifically from the heat-generating components that are not in contact with the power heat sink 3. In this embodiment, the miniature axial flow fan 8 (diameter 30mm-50mm) is installed at a specific airflow location in the middle housing 12. The airflow direction it generates is perpendicular to the airflow of the piezoelectric fan assembly 4, so as to form horizontal turbulence on the front side of the power circuit module 2, enhance local convective heat transfer, and thus dissipate heat from other heat-generating components on the PCB board 21 that are not in contact with the power heat sink 3. The miniature axial flow fan 8 can have two operating modes: continuous low speed mode (normal operation) and pulsed high wind mode (when the temperature is abnormal), which can be used as needed.

[0059] For example, in one specific embodiment, the power heat sink 3 can be selected as 200×150×20mm (ceramic matrix composite material), the piezoelectric fan assembly 4 can be selected as 4 sets connected in parallel, the air volume of a single set is 2.5CFM, its operating temperature range can be selected as -40℃~+85℃, and the protection level can be selected as IP67. In this way, the weight of the whole machine is reduced by 35% compared with the traditional solution. During installation, thermal grease with a thickness of less than 0.1mm is applied between the MOSFET 22 and the power heat sink 3, the distance between the piezoelectric fan assembly 4 and the air duct plate 6 is maintained at 5±0.5mm, and the power inductor 9 is potted with epoxy resin with a temperature resistance greater than 180℃.

[0060] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. An energy storage inverter, characterized in that, include: case; The power circuit module is disposed within the housing; A power heat sink is disposed inside the housing and thermally coupled to the power circuit module; A piezoelectric fan assembly and an inductive heat sink are respectively disposed on opposite sides of the power heat sink. The inductive heat sink is thermally coupled to the power inductor inside the housing. The piezoelectric fan assembly includes a drive unit and an inverse piezoelectric vibration unit. The drive unit can apply an alternating voltage to the inverse piezoelectric vibration unit, and the inverse piezoelectric vibration unit can generate an oscillating airflow toward the power heat sink through vibration.

2. The energy storage inverter according to claim 1, characterized in that, The driving unit is a circuit board.

3. The energy storage inverter according to claim 2, characterized in that, The inverse piezoelectric vibration unit includes multiple ceramic piezoelectric vibrators and multiple heat dissipation blades. The end of each ceramic piezoelectric vibrator facing away from the power heat sink is connected to the circuit board, and the end of each ceramic piezoelectric vibrator close to the power heat sink is connected to one of the heat dissipation blades.

4. The energy storage inverter according to claim 1, characterized in that, The power radiator has a duct plate on the side away from the power circuit module. The duct plate simultaneously shields the power radiator and the piezoelectric fan assembly. The duct plate has a first duct hole and a second duct hole. The first duct hole corresponds to the position of the piezoelectric fan assembly, and the second duct hole corresponds to the position of the air outlet of the power radiator.

5. The energy storage inverter according to claim 1, characterized in that, The housing has ventilation holes, which are directly opposite the air outlet of the inductor heat sink.

6. The energy storage inverter according to claim 1, characterized in that, The power circuit module includes a PCB board and a plurality of MOSFETs disposed on the PCB board. The plurality of MOSFETs are disposed at one end of the PCB board near the power heat sink and are thermally coupled to the power heat sink.

7. The energy storage inverter according to claim 6, characterized in that, A miniature axial flow fan is provided on the inner side of the housing. The miniature axial flow fan is used to drive the airflow channel to dissipate heat from at least some of the heat-generating components on the PCB board.

8. The energy storage inverter according to claim 6, characterized in that, A thermally conductive insulating material is provided between the power heat sink and the MOS transistor.

9. The energy storage inverter according to claim 6, characterized in that, The housing includes a front shell, a middle shell, and a rear shell. A cavity is provided on one side of the middle shell, and the power heat sink, the piezoelectric fan assembly, and the inductor heat sink are housed in the cavity. The power circuit module is disposed on the other side of the middle shell. Multiple cutout windows are provided on the middle shell, and each MOS transistor is thermally coupled to the power heat sink through the corresponding cutout window. The front shell and the rear shell are respectively fastened to the front and rear sides of the middle shell.

10. The energy storage inverter according to any one of claims 1 to 9, characterized in that, The power inductor is embedded in the inductor heat sink through a potting process.

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