Display device

Abstract

The utility model relates to a display device. The display device includes: a display panel including a display area and a non-display area; a window disposed above the display panel and having a plurality of grooves formed on one surface of the window facing the display panel; and a viewing angle control member formed within the plurality of grooves, in which the viewing angle control member includes a light absorbing wall formed on a side wall of the plurality of grooves and formed to become thinner as approaching an upper surface of the plurality of grooves.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the priority of Korean Patent Application No. 10-2023-0044724 filed on April 5, 2023 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present disclosure relates to a display device and a method of manufacturing the display device. Background Art

[0004] As multimedia has developed, the appeal of display devices has increased. Therefore, various types of display devices such as liquid crystal displays (LCDs) and organic light emitting displays (OLEDs) have been developed.

[0005] Among display devices, organic light emitting displays generally use organic light emitting elements that generate light through recombination of electrons and holes to display images. The display device has a relatively fast response speed and large brightness and viewing angle, and is driven with relatively low power consumption.

[0006] A display device displays image information to a user. Display devices are generally developed to have a wide viewing angle so that a user can observe an image of the display device in various angular directions. However, when a display device or an electronic device including a display device has a wide viewing angle, it may adversely affect the characteristics of the display device or the electronic device, and therefore, a narrow viewing angle may be desirable.

[0007] For example, in the case of a vehicle's navigation system, when the display device has a wide viewing angle, light is reflected onto the vehicle's windshield during nighttime driving of the vehicle, which may adversely affect the driver's safe driving. For example, in the case of a computer or mobile phone, when the user does not want to expose private information, the wide viewing angle of the display device is contrary to the user's needs. Utility Model Content

[0008] According to an embodiment of the present disclosure, a display device includes: a display panel including a display area and a non-display area; a window arranged above the display panel and having a plurality of grooves formed on a surface of the window facing the display panel; and a viewing angle control member formed within the plurality of grooves, wherein the viewing angle control member includes a light absorbing wall formed on the side walls of the plurality of grooves and formed to become thinner as approaching the upper surfaces of the plurality of grooves.

[0009] In an embodiment of the present disclosure, the light absorbing wall comprises CuMgAlO x .

[0010] In an embodiment of the present disclosure, the viewing angle control member further includes a filler filled in an inner portion of the groove and at least partially surrounded by the light absorbing wall, and the filler is formed to become wider as approaching an upper surface of the plurality of grooves.

[0011] In the embodiment of the present disclosure, the filler is made of silicon dioxide (SiO 2 ) and silicone-based materials.

[0012] In an embodiment of the present disclosure, the display device further includes a protection layer disposed on one surface of the window and disposed between the viewing angle control members.

[0013] In an embodiment of the present disclosure, the protective layer includes a transparent oxide film.

[0014] In an embodiment of the present disclosure, each of the light absorbing walls includes a first light absorbing wall and a second light absorbing wall, wherein the first light absorbing wall is formed on the side walls of the plurality of grooves, and the second light absorbing wall is formed on the upper surfaces of the plurality of grooves, and the second light absorbing wall is formed to be thinner than the first light absorbing wall.

[0015] In an embodiment of the present disclosure, the viewing angle controlling member includes a filler in contact with the light absorbing wall.

[0016] In an embodiment of the present disclosure, the display device further includes a touch sensing layer disposed between the display panel and the window, wherein the viewing angle control member is disposed to face the touch sensing layer.

[0017] In an embodiment of the present disclosure, the touch sensing layer includes touch electrodes, and at least some of the viewing angle control members overlap with the touch electrodes.

[0018] In an embodiment of the present disclosure, the display panel includes: a substrate; a light-emitting element layer, which is arranged on the substrate and includes pixels and a pixel defining layer, the pixels include pixel electrodes, a light-emitting layer and a common electrode, and the pixel defining layer is arranged on the pixel electrode; and a thin film encapsulation layer, which is arranged on the light-emitting element layer.

[0019] In an embodiment of the present disclosure, the viewing angle control member is disposed to face the thin film encapsulation layer.

[0020] According to an embodiment of the present disclosure, a method for manufacturing a display device includes: forming a plurality of grooves in a first surface of a window by using a hard mask and a photoresist mask; forming a light absorbing wall on side surfaces of the plurality of grooves; filling an inner portion of the grooves with a filler so that the filler is at least partially surrounded by the light absorbing wall; and disposing the first surface of the window on a display panel, wherein the light absorbing wall is formed to become thinner as it approaches an upper portion of the window.

[0021] In an embodiment of the present disclosure, the method for manufacturing a display device further includes performing an oxidative heat treatment on the light absorbing wall.

[0022] In an embodiment of the present disclosure, the hard mask includes a transparent oxide film.

[0023] In an embodiment of the present disclosure, when forming the light absorbing wall, CuMgAl is deposited on one surface of the window where the groove is formed, and the CuMgAl is anisotropically etched.

[0024] In an embodiment of the present disclosure, the filler includes silicon dioxide (SiO 2 ) and siloxane-based materials.

[0025] In an embodiment of the present disclosure, the filler is formed to become wider as approaching an upper portion of the window.

[0026] In an embodiment of the present disclosure, the display panel includes: a substrate; a light-emitting element layer, which is arranged on the substrate and includes pixels and a pixel defining layer, the pixels include pixel electrodes, a light-emitting layer and a common electrode, and the pixel defining layer is arranged on the pixel electrode; and a thin film encapsulation layer, which is arranged on the light-emitting element layer.

[0027] In an embodiment of the present disclosure, the method for manufacturing a display device further includes providing a touch sensing layer on the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and other features of the present disclosure will become more apparent by describing in detail embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0029] Figure 1 is an exploded perspective view of a display device according to an embodiment of the present disclosure;

[0030] Figure 2 is a plan view of a display device according to an embodiment of the present disclosure;

[0031] Figure 3 This is to show that the present disclosure Figure 2 A cross-sectional view of the example taken along line II';

[0032] Figure 4 It is shown Figure 3 A view of an example of a display unit;

[0033] Figure 5 It is shown Figure 3 A view of an example of a touch sensing layer;

[0034] Figure 6 It is shown Figure 4 The sub-pixel and Figure 5 A plan view of an example of a first touch metal layer;

[0035] Figure 7 It is shown along Figure 6 A cross-sectional view of the example taken along line II-II';

[0036] Figure 8 yes Figure 7 an enlarged view of region B;

[0037] Fig. 9 Is used to describe Figure 7 A view of the perspective control component and the direction of light travel;

[0038] Fig.10 and Fig.11 According to some embodiments of the present disclosure Figure 7 an enlarged view of region B;

[0039] Fig.12 It is used to describe the properties of silicon dioxide (SiO 2 ) and transmission characteristics of siloxane-based materials;

[0040] Fig.13 is a flow chart for describing a method for manufacturing a window according to an embodiment of the present disclosure;

[0041] Fig.14 , Fig.15 , Fig.16 , Fig.17 and Fig.18 is a cross-sectional view for describing a method for manufacturing a window according to an embodiment of the present disclosure;

[0042] Fig.19 is a diagram showing an embodiment of the present disclosure Figure 2 A cross-sectional view of the example taken along line II';

[0043] Fig. 20 is a diagram showing an embodiment of the present disclosure Figure 6 A cross-sectional view of the example taken along line II-II'; and

[0044] Fig.21 : is a view showing an example to which a display device according to an embodiment of the present disclosure is applied. DETAILED DESCRIPTION

[0045] Now, embodiments of the present disclosure will be described more fully below with reference to the accompanying drawings. However, embodiments of the present disclosure may be provided in different forms and should not be construed as limiting. Throughout the specification and the accompanying drawings, the same reference numerals represent the same components. In the accompanying drawings, various thicknesses, lengths, and angles are shown, and although the arrangements shown do represent embodiments of the present disclosure, it should be understood that within the spirit and scope of the present disclosure, modifications of various thicknesses, lengths, and angles are possible, and the present disclosure is not necessarily limited to the specific thicknesses, lengths, and angles shown.

[0046] It will also be understood that when a layer is referred to as being “on” another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present. Conversely, when an element is referred to as being “directly on” another element, there may be no intervening elements present.

[0047] In addition, unless otherwise indicated, the phrase "in a plan view" means observing an object portion from above, and the phrase "in a schematic cross-sectional view" means observing a schematic cross section taken by vertically cutting an object portion from the side. The term "overlap" or "overlapped" means that the first object can be above or below the second object, or on one side of the second object, and vice versa. In addition, the term "overlap" may include, for example, layering, stacking, facing, or facing, extending on, covering, or partially covering, or any other suitable term as will be appreciated and understood by a person of ordinary skill in the art. The expression "not overlap" may include, for example, meanings such as "spaced apart from each other" or "offset from each other" or "separated from each other" and any other suitable equivalents as will be appreciated and understood by a person of ordinary skill in the art. The terms "face" and "facing" may mean that the first object may be directly opposite or indirectly opposite to the second object. In the case where a third object is inserted between the first object and the second object, the first object and the second object may be understood to be indirectly opposite to each other, but still facing each other.

[0048] For ease of description, spatially relative terms "below," "below," "down," "above," "upper," etc. may be used herein to describe the relationship between one element or component and another element or component as shown in the drawings. It will be understood that, in addition to the orientation depicted in the drawings, spatially relative terms are intended to include different orientations of the device in use or operation. For example, in the case where the device shown in the drawings is flipped, a device located "below" or "below" another device may be placed "above" the other device. Therefore, the illustrative term "below" may include both a lower position and an upper position. The device may also be oriented in other directions, and therefore the spatially relative terms may be interpreted differently depending on the orientation.

[0049] When an element is referred to as being “connected” or “coupled” to another element, the element may be “directly connected” or “directly coupled” to the other element, or “electrically connected” or “electrically coupled” to the other element without any intervening elements or with one or more intervening elements interposed therebetween.

[0050] It will be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element, or for the convenience of its description and explanation. For example, when discussing a "first element" in the specification, it may be referred to as a "second element" or a "third element", and without departing from the teachings of the present disclosure, the "second element" and the "third element" may be named in a similar manner.

[0051] In view of the measurements in question and the errors associated with the measurement of a particular quantity (e.g., limitations of the measurement system), the terms "about" or "approximately" as used herein are inclusive of the stated value and mean within an acceptable range of deviation of the particular value determined by one of ordinary skill in the art. For example, "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value.

[0052] In the specification and claims, for the purpose of its meaning and interpretation, the term "and / or" is intended to include any combination of the terms "and" and "or". For example, "A and / or B" may be understood to mean "A, B, or A and B". The terms "and" and "or" may be used in conjunction or disjunction and may be understood to be equivalent to "and / or".

[0053] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0054] Figure 1 is an exploded perspective view of a display device according to an embodiment of the present disclosure. Figure 2is a plan view of a display device according to an embodiment of the present disclosure.

[0055] As used herein, the terms "above", "top", and "upper surface" may refer to an upward direction (e.g., a Z-axis direction) relative to the display panel 100. As used herein, the terms "below", "bottom", and "lower surface" may refer to a downward direction (e.g., a direction opposite to the Z-axis direction) relative to the display panel 100. In addition, "left", "right", "upper", and "lower" may refer to directions when the display panel 100 is viewed in a plan view. For example, on a plane such as a surface, "left" refers to a direction opposite to the X-axis direction, "right" refers to the X-axis direction, "upper" refers to the Y-axis direction, and "lower" refers to a direction opposite to the Y-axis direction.

[0056] refer to Figure 1 and Figure 2 The display device 10 is a device for displaying a moving image or a still image, and can be used as a display screen for various products such as televisions, laptop computers, monitors, billboards, and Internet of Things (IOT) devices, and portable electronic devices such as mobile phones, smart phones, tablet personal computers (PCs), smart watches, watch phones, mobile communication terminals, electronic notebooks, electronic books, portable multimedia players (PMPs), navigation devices, and ultra-mobile PCs (UMPCs). The display device 10 can be, for example, any one of an organic light-emitting display, a liquid crystal display, a plasma display, a field emission display, an electrophoretic display, an electrowetting display, a quantum dot light-emitting display, and a micro-light-emitting diode (LED) display. In the following, it will be mainly described that the display device 10 is an organic light-emitting display, but the present disclosure is not limited thereto.

[0057] The display device 10 according to an embodiment of the present disclosure includes a window WM, a display panel 100 , a display driving circuit 250 , a circuit board 300 , and a touch driving circuit 400 .

[0058] The window WM covers the display panel 100 to protect the display panel 100 from external impact and contaminants. In the present embodiment, the window WM may be a glass substrate or a plastic substrate having a light-transmitting property.

[0059] The display panel 100 may include a main area MA and a protrusion area PA protruding from one side of the main area MA.

[0060] In a plan view, the main area MA may be formed in a rectangular shape having a short side in a first direction (X-axis direction) and a long side in a second direction (Y-axis direction) intersecting the first direction (X-axis direction). The corner where the short side in the first direction (X-axis direction) and the long side in the second direction (Y-axis direction) intersect may be a rounded corner with a predetermined radius of curvature or a right angle. The shape in the plan view of the display device 10 is not limited to a rectangular shape, and may be other polygonal shapes, a circular shape, or an elliptical shape. The main area MA may be formed to be flat, but is not limited thereto, and may include a curved surface portion formed at its left and right ends. In this case, the curved surface portion may have a substantially constant curvature or a variable curvature.

[0061] The main area MA may include a display area DA in which pixels are formed to display an image and a non-display area NDA which is a peripheral area of ​​the display area DA.

[0062] Scan lines, data lines, and power lines connected to pixels and pixels may be disposed in the display area DA. When the main area MA includes a curved surface portion, the display area DA may be disposed on the curved surface portion. In this case, an image of the display panel 100 may be observed even on the curved surface portion.

[0063] The non-display area NDA may be a region from the outside of the display area DA to the edge of the display panel 100. A scan driver for applying a scan signal to a scan line may be disposed in the non-display area NDA, and a connection line connecting a data line and the display driving circuit 250 to each other may be disposed in the non-display area NDA.

[0064] The protruding area PA may protrude from one side of the main area MA. Figure 2 As shown in , the protrusion area PA may protrude from the lower side of the main area MA. The length of the protrusion area PA in the first direction (X-axis direction) may be smaller than the length of the main area MA in the first direction (X-axis direction).

[0065] The protruding area PA may include a bending area BA and a pad area PDA. In this case, the pad area PDA may be disposed on one side of the bending area BA, and the main area MA may be disposed on the other side of the bending area BA. For example, the pad area PDA may be disposed on the lower side of the bending area BA, and the main area MA may be disposed on the upper side of the bending area BA.

[0066] The display panel 100 may be flexibly formed to bend, bend, fold, or curl. Therefore, the display panel 100 may be bent in the thickness direction (Z-axis direction) in the bending area BA. In this case, before the display panel 100 is bent, one surface of the pad area PDA of the display panel 100 faces upward, but after the display panel 100 is bent, one surface of the pad area PDA of the display panel 100 faces downward. For this reason, the pad area PDA is disposed below the main area MA and may therefore overlap the main area MA.

[0067] Pads that electrically connect the display driving circuit 250 and the circuit board 300 to each other may be provided in the pad area PDA of the display panel 100 .

[0068] The display driving circuit 250 outputs a signal and a voltage for driving the display panel 100. For example, the display driving circuit 250 may provide a data voltage to a data line. In addition, the display driving circuit 250 may provide a power supply voltage to a power line, and may provide a scan control signal to a scan driver. The display driving circuit 250 may be formed as an integrated circuit (IC) and may be mounted on the display panel 100 in a pad area PDA in a chip on glass (COG) manner, a chip on plastic (COP) manner, or an ultrasonic bonding manner, but the present disclosure is not limited thereto. For example, the display driving circuit 250 may be mounted on a circuit board 300.

[0069] The pads may include a display pad electrically connected to the display driving circuit 250 and a touch pad electrically connected to the touch line.

[0070] The circuit board 300 may be attached to the pad using an anisotropic conductive film (ACF). For this reason, the leads of the circuit board 300 may be electrically connected to the pad. The circuit board 300 may be, for example, a flexible printed circuit board, a printed circuit board, or a flexible film such as a chip on film.

[0071] The touch driving circuit 400 may be connected to the touch sensing layer TSL (see FIG. Figure 3 ). The touch driving circuit 400 applies a driving signal to the touch electrode of the touch sensing layer TSL and measures the capacitance value of the touch electrode. The driving signal may be a signal having a plurality of driving pulses. The touch driving circuit 400 may determine whether a touch has been input according to the capacitance value, and may calculate the touch coordinates at which the touch is input.

[0072] The touch driving circuit 400 may be provided on the circuit board 300. The touch driving circuit 400 may be formed as an integrated circuit (IC) and mounted on the circuit board 300.

[0073] Figure 3 It is shown along Figure 2A cross-sectional view of the example taken along line II'.

[0074] refer to Figure 3 The display panel 100 may include a substrate SUB1, a thin film transistor layer TFTL disposed on the substrate SUB1, a light emitting element layer EML, a thin film encapsulation layer TFEL, and a touch sensing layer TSL. A window WM is disposed on the display panel 100.

[0075] The substrate SUB1 may be made of an insulating material such as glass, quartz or a polymer resin. Examples of polymer resins may include polyethersulfone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallyl ester, polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT), cellulose acetate propionate (CAP) or a combination thereof. In addition, the substrate SUB1 may include a metal material.

[0076] The substrate SUB1 may be a rigid substrate or a flexible substrate that may be bent, folded, and rolled. For example, when the substrate SUB1 is a flexible substrate, the substrate SUB1 may be made of polyimide (PI), but the present disclosure is not limited thereto.

[0077] The thin film transistor layer TFTL may be disposed on the substrate SUB1. Scan lines, data lines, power lines, scan control lines, connection lines connecting pads and data lines to each other, etc., and thin film transistors of each pixel may be formed in the thin film transistor layer TFTL. Each of the thin film transistors may include a gate electrode, a semiconductor layer, a source electrode, and a drain electrode. Figure 4 When the scan driver 110 shown in FIG. 1 is formed in the non-display area NDA of the display panel 100 , the scan driver 110 may include a thin film transistor.

[0078] The thin film transistor layer TFTL may be disposed in the display area DA and the non-display area NDA. For example, a thin film transistor, a scan line, a data line, and a power line of each pixel of the thin film transistor layer TFTL may be disposed in the display area DA. A scan control line and a connection line of the thin film transistor layer TFTL may be disposed in the non-display area NDA.

[0079] The light emitting element layer EML may be disposed on the thin film transistor layer TFTL. The light emitting element layer EML may include pixels and a pixel defining layer defining the pixels, each of the pixels including a first electrode, a light emitting layer, and a second electrode. The light emitting layer may be an organic light emitting layer including an organic material. In this case, the light emitting layer may include a hole transport layer, an organic light emitting layer, and an electron transport layer. When a predetermined voltage is applied to the first electrode through the thin film transistor of the thin film transistor layer TFTL and a cathode voltage is applied to the second electrode, holes and electrons move to the organic light emitting layer through the hole transport layer and the electron transport layer, respectively, and recombine with each other in the organic light emitting layer to emit light. The pixels of the light emitting element layer EML may be disposed in the display area DA.

[0080] The thin film encapsulation layer TFEL may be disposed on the light emitting element layer EML. The thin film encapsulation layer TFEL is used to prevent oxygen or moisture from penetrating into the light emitting element layer EML. The thin film encapsulation layer TFEL may include at least one inorganic film. The inorganic film may be, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer, but is not limited thereto. In addition, the thin film encapsulation layer TFEL is used to protect the light emitting element layer EML from foreign matter such as dust. To this end, the thin film encapsulation layer TFEL may include at least one organic film. The organic film may be made of, for example, an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin, but the concept of the present disclosure is not limited thereto.

[0081] The thin film encapsulation layer TFEL may be disposed in both the display area DA and the non-display area NDA. For example, the thin film encapsulation layer TFEL may be disposed to cover the light emitting element layer EML of the display area DA and the non-display area NDA, and to cover the thin film transistor layer TFTL of the non-display area NDA.

[0082] The touch sensing layer TSL may be disposed on the thin film encapsulation layer TFEL. Since the touch sensing layer TSL is disposed on the thin film encapsulation layer TFEL, the thickness of the display device 10 may be reduced compared to a case where a separate touch panel including the touch sensing layer TSL is attached to the thin film encapsulation layer TFEL. For example, the touch sensing layer TSL may be directly disposed on the thin film encapsulation layer TFEL.

[0083] The touch sensing layer TSL may include a touch electrode for sensing a user's touch in a capacitive manner and a touch line connecting the pad and the touch electrode to each other. For example, the touch sensing layer TSL may sense a user's touch in a self-capacitive manner or a mutual-capacitive manner.

[0084] like Figure 5 As shown in , the touch electrodes of the touch sensing layer TSL may be disposed in the touch sensor area TSA overlapping the display area DA. Figure 5As shown in , the touch lines of the touch sensing layer TSL may be disposed in the touch peripheral area TPA overlapping the non-display area NDA.

[0085] The window WM may be disposed on the touch sensing layer TSL.

[0086] The window WM may provide a front surface of the display device 10. The window WM may be made of, for example, glass, sapphire, plastic, or the like.

[0087] In an embodiment of the present disclosure, a plurality of grooves arranged in a first direction (X-axis direction) and extending in a second direction (Y-axis direction) substantially perpendicular to the first direction (X-axis direction) may be defined in the lower surface of the window WM. However, the grooves are not limited thereto, and the grooves may be arranged in the second direction (Y-axis direction) and extend in the first direction (X-axis direction). In addition, a viewing angle control member LCU may be disposed in each of the plurality of grooves. The viewing angle control member LCU is made of a material having a light absorption function. The material having a light absorption function may be, for example, CuMgAlO having excellent adhesion and light absorption properties. x , but the present disclosure is not limited thereto.

[0088] The groove formed in the lower surface of the window WM may be disposed to overlap the display area DA. Therefore, the viewing angle control member LCU may be disposed to overlap the display area DA.

[0089] The traveling direction of light provided from the display panel 100 may be controlled by a viewing angle control member LCU disposed in a groove formed in the lower surface of the window WM. Figure 7 and Figure 8 Give a description.

[0090] The window WM and the display panel 100 may be attached to each other by a transparent adhesive member such as an optically clear adhesive (OCA) film.

[0091] Figure 4 It is shown Figure 3 An illustrative view of an example of a display unit.

[0092] exist Figure 4 , for convenience of explanation, pixels P, scan lines SL, data lines DL and power lines PL, scan control lines SCL, a scan driver 110, a display driving circuit 250 and a display pad DP of a display area DA are shown.

[0093] refer to Figure 4, scan lines SL, data lines DL, power lines PL, and pixels P are arranged in the display area DA. The scan lines SL may be formed parallel to each other in a first direction (X-axis direction), and the data lines DL may be formed parallel to each other in a second direction (Y-axis direction) crossing the first direction (X-axis direction). The power lines PL may include at least one line formed parallel to the data lines DL in the second direction (Y-axis direction) and a plurality of lines branched from the at least one line in the first direction (X-axis direction).

[0094] Each of the pixels P may be connected to at least one of the scan lines SL, any one of the data lines DL, and the power line PL. Each of the pixels P may include a thin film transistor, an organic light emitting diode, and a capacitor, and the thin film transistor includes a driving transistor and at least one switching transistor. When a scan signal is applied from the scan line SL, each of the pixels P may receive a data voltage of the data line DL, and may provide a driving current to the organic light emitting diode according to the data voltage applied to the gate electrode to emit light.

[0095] The scan driver 110 is connected to the display driving circuit 250 at least through the scan control line SCL. Therefore, the scan driver 110 can receive a scan control signal of the display driving circuit 250. The scan driver 110 generates a scan signal according to the scan control signal and provides the scan signal to the scan line SL.

[0096] exist Figure 5 1 has shown that the scan driver 110 is formed in the non-display area NDA and is located on the left outer side of the display area DA, but the present disclosure is not limited thereto. For example, the scan driver 110 may be disposed in the non-display area NDA and located on the left and right outer sides of the display area DA.

[0097] The display driving circuit 250 is connected to the display pad DP provided in the display pad area DPA to receive digital video data and timing signals. The display driving circuit 250 converts the digital video data into analog positive / negative data voltages, and provides the analog positive / negative data voltages to the data lines DL through the connection lines DLL. In addition, the display driving circuit 250 generates a scan control signal for controlling the scan driver 110 and provides a scan control signal for controlling the scan driver 110 through the scan control line SCL. The pixel P to be provided with the data voltage is selected by the scan signal of the scan driver 110, and the data voltage is provided to the selected pixel P. The display driving circuit 250 can be formed as an integrated circuit (IC) and attached to the substrate SUB1 in a chip on glass (COG) manner, a chip on plastic (COP) manner, or an ultrasonic bonding manner.

[0098] Figure 5 It is shown in detail Figure 3 An illustrative view of an example of a touch sensing layer.

[0099] exist Figure 5 , for convenience of explanation, the touch electrodes TE and RE, the touch lines TL and RL, and the touch pad TP are illustrated.

[0100] refer to Figure 5 The touch sensing layer TSL includes a touch sensor area TSA for sensing a user's touch and a touch peripheral area TPA disposed around the touch sensor area TSA. The touch sensor area TSA may overlap the display area DA, and the touch peripheral area TPA may overlap the non-display area NDA.

[0101] The touch electrodes TE and RE may be disposed in the touch sensor area TSA. The touch electrodes TE and RE may include sensing electrodes RE and driving electrodes TE. The sensing electrodes RE may be electrically connected to each other in a first direction (X-axis direction), and the driving electrodes TE may be electrically connected to each other in a second direction (Y-axis direction) intersecting the first direction (X-axis direction). In addition, Figure 5 2 has shown that the sensing electrodes RE and the driving electrodes TE are formed in a rhombus shape in a plan view, but the present disclosure is not limited thereto.

[0102] In order to prevent the sensing electrode RE and the driving electrode TE from being short-circuited to each other at the position where the sensing electrode RE and the driving electrode TE intersect, the driving electrodes TE adjacent to each other in the second direction (Y-axis direction) may be connected to each other through the connecting electrode BE. In this case, the driving electrode TE and the sensing electrode RE may be arranged at one layer, and the connecting electrode BE may be arranged at a layer different from the layer where the driving electrode TE and the sensing electrode RE are arranged. In addition, the sensing electrodes RE electrically connected to each other in the first direction (X-axis direction) and the driving electrodes TE electrically connected to each other in the second direction (Y-axis direction) are electrically insulated from each other.

[0103] The touch lines TL and RL may be disposed in the touch peripheral area TPA. The touch lines TL and RL may include a sensing line RL, a first driving line TL1, and a second driving line TL2. The sensing line RL may be connected to the sensing electrode RE, and the first driving line TL1 and the second driving line TL2 may be connected to the driving electrode TE.

[0104] The sensing electrode RE disposed on the right side of the touch sensor area TSA may be connected to the sensing line RL. For example, the sensing electrode RE disposed at the right end among the sensing electrodes RE electrically connected to each other in the first direction (X-axis direction) may be connected to the sensing line RL. The sensing line RL may be connected to the first touch pad TP1. For this reason, the touch drive circuit 400 may be electrically connected to the sensing electrode RE.

[0105] The driving electrode TE disposed on the lower side of the touch sensor area TSA may be connected to the first driving line TL1, and the driving electrode TE disposed on the upper side of the touch sensor area TSA may be connected to the second driving line TL2. For example, the driving electrode TE disposed at the lower end among the driving electrodes TE electrically connected to each other in the second direction (Y-axis direction) may be connected to the first driving line TL1, and the driving electrode TE disposed at the upper end among the driving electrodes TE electrically connected to each other in the second direction (Y-axis direction) may be connected to the second driving line TL2. The second driving line TL2 may be connected to the driving electrode TE on the upper side of the touch sensor area TSA via the left outer side of the touch sensor area TSA. The first driving line TL1 and the second driving line TL2 may be connected to the second touch pad TP2. For this reason, the touch driving circuit 400 may be electrically connected to the driving electrode TE.

[0106] The touch electrodes TE and RE may be driven in a mutual capacitance manner or a self-capacitance manner. First, when the touch electrodes TE and RE are driven in a mutual capacitance manner, a drive signal is provided to the drive electrode TE through the first drive line TL1 and the second drive line TL2 to charge the mutual capacitance formed in the intersection area formed by the intersection of the sensing electrode RE and the drive electrode TE. Then, the charge change of the sensing electrode RE is measured through the sensing line RL, and whether a touch is input is determined based on the charge change of the sensing electrode RE. The drive signal may be a signal having a plurality of drive pulses.

[0107] Second, when the touch electrodes TE and RE are driven in a self-capacitance manner, a driving signal is provided to both the driving electrode TE and the sensing electrode RE through the first driving line TL1, the second driving line TL2, and the sensing line RL to charge the self-capacitance of the driving electrode TE and the sensing electrode RE. Then, the charge change of the self-capacitance of the driving electrode TE and the sensing electrode RE is measured through the first driving line TL1, the second driving line TL2, and the sensing line RL, and whether a touch is input is determined based on the charge change of the self-capacitance.

[0108] like Figure 5 As shown in FIG, the driving electrodes TE, the sensing electrodes RE and the connecting electrodes BE may be formed as mesh-type electrodes. Figure 3 As shown in FIG. 1 , when a touch sensing layer TSL including a driving electrode TE and a sensing electrode RE is formed on the thin film encapsulation layer TFEL, the distance between the second electrode of the light emitting element layer EML and the driving electrode TE or the sensing electrode RE of the touch sensing layer TSL is relatively small, and therefore, a very large parasitic capacitance may be formed between the second electrode of the light emitting element layer EML and the driving electrode TE or the sensing electrode RE of the touch sensing layer TSL. Therefore, in order to reduce the parasitic capacitance, it is desirable that the driving electrode TE and the sensing electrode RE are formed as follows: Figure 5, rather than a non-patterned electrode formed as a conductive layer made of a transparent oxide such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0109] The first protection line GL1 may be disposed outside the sensing line RL disposed on the outermost side among the sensing lines RL. In addition, the first ground line GRL1 may be disposed outside the first protection line GL1. For example, the first protection line GL1 may be disposed on the right side of the sensing line RL disposed at the right side among the sensing lines RL, and the first ground line GRL1 may be disposed on the right side of the first protection line GL1.

[0110] The second protection line GL2 may be disposed between the sensing line RL disposed on the innermost side among the sensing lines RL and the first driving line TL1 disposed at the right end among the first driving lines TL1. In addition, the second protection line GL2 may be disposed between the first driving line TL1 disposed at the right end and the second ground line GRL2 among the first driving lines TL1. In addition, the third protection line GL3 may be disposed between the sensing line RL disposed on the innermost side among the sensing lines RL and the second ground line GRL2. The second ground line GRL2 may be connected to the first touch pad TP1 disposed on the leftmost side among the first touch pads TP1 and the second touch pad TP2 disposed on the rightmost side among the second touch pads TP2.

[0111] The fourth protection line GL4 may be disposed on the outer side of the second driving line TL2 disposed on the outermost side among the second driving lines TL2. In addition, the third ground line GRL3 may be disposed on the outer side of the fourth protection line GL4. For example, the fourth protection line GL4 may be disposed on the left side and the upper side of the second driving line TL2 disposed at the left side and the upper side among the second driving lines TL2, and the third ground line GRL3 may be disposed on the left side and the upper side of the fourth protection line GL4.

[0112] The fifth protection line GL5 may be disposed at the right side of the second drive line TL2 disposed on the right outermost side among the second drive lines TL2. For example, the fifth protection line GL5 may be disposed between the second drive line TL2 disposed at the right end among the second drive lines TL2 and the touch sensor area TSA. For example, the fifth protection line GL5 may be disposed between the second drive line TL2 disposed at the right end among the second drive lines TL2 and the touch electrodes TE and RE. For example, the fifth protection line GL5 may be disposed between the second drive line TL2 disposed at the right end among the second drive lines TL2 and the touch sensor area TSA.

[0113] According to the embodiments of the present disclosure, Figure 5, the first ground line GRL1, the second ground line GRL2, and the third ground line GRL3 are disposed adjacent to the upper side, the left side, the right side, and the bottom side of the display panel 100. For example, the first ground line GRL1 may be disposed adjacent to the right side of the display panel 100, and the second ground line GRL2 may be disposed adjacent to the lower side of the display panel 100. For example, the third ground line GRL3 may be disposed adjacent to the upper side and the left side of the display panel 100. In addition, a ground voltage is applied to the first ground line GRL1, the second ground line GRL2, and the third ground line GRL3. For this reason, when static electricity is applied from the outside, the static electricity may be discharged to the first ground line GRL1, the second ground line GRL2, and the third ground line GRL3.

[0114] In addition, according to the embodiments of the present disclosure, reference Figure 5 , the first protection line GL1 is disposed between the sensing line RL disposed at the outermost end of the arrangement of the sensing lines RL and the first ground line GRL1, and thus can be used to minimize the influence on the sensing line RL disposed at the outermost end of the arrangement of the sensing lines RL caused by the voltage change of the first ground line GRL1. The second protection line GL2 is disposed between the sensing line RL disposed at the innermost end of the arrangement of the sensing lines RL and the first driving line TL1 disposed at the outermost end of the arrangement of the first driving line TL1. For this reason, the second protection line GL2 can be used to minimize the influence on the sensing line RL disposed at the innermost end of the arrangement of the sensing lines RL and the first driving line TL1 disposed at the outermost end of the arrangement of the first driving line TL1 caused by the voltage change. The third protection line GL3 is disposed between the sensing line RL disposed at the innermost end of the arrangement of the sensing lines RL and the second ground line GRL2, and thus can be used to minimize the influence on the sensing line RL disposed at the innermost end of the arrangement of the sensing lines RL caused by the voltage change of the second ground line GRL2. The fourth protection line GL4 is disposed between the second drive line TL2 disposed on the outermost end of the arrangement of the second drive lines TL2 and the third ground line GRL3, and thus can be used to minimize the influence on the second drive line TL2 caused by the voltage change of the third ground line GRL3. The fifth protection line GL5 is disposed between the second drive line TL2 disposed on the innermost end of the arrangement of the second drive lines TL2 and the touch electrodes TE and RE, and thus can be used to minimize the mutual influence between the second drive line TL2 disposed on the innermost end of the arrangement of the second drive lines TL2 and the touch electrodes TE and RE.

[0115] When the touch electrodes TE and RE are driven in a mutual capacitance manner, a ground voltage may be applied to the first protection line GL1, the second protection line GL2, the third protection line GL3, the fourth protection line GL4, and the fifth protection line GL5. In addition, when the touch electrodes TE and RE are driven in a self-capacitance manner, a drive signal that is the same as a drive signal applied to the first drive line TL1, the second drive line TL2, and the sensing line RL may be applied to the first protection line GL1, the second protection line GL2, the third protection line GL3, the fourth protection line GL4, and the fifth protection line GL5.

[0116] Figure 6 It is shown Figure 4 The sub-pixel and Figure 5 A plan view of an example of a first touch metal layer. For example, Figure 6 Shows Figure 5 Area A.

[0117] refer to Figure 6 , the subpixels may include a first subpixel RP, a second subpixel GP, and a third subpixel BP. Each of the first subpixels RP may display a first color, and each of the second subpixels GP may display a second color. Each of the third subpixels BP may display a third color. For example, the first color may be red, the second color may be green, and the third color may be blue, but the present disclosure is not limited thereto.

[0118] The display panel 100 may present a white grayscale in units of pixels P. One first sub-pixel RP, two second sub-pixels GP, and one third sub-pixel BP may form one pixel P. In addition, the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP forming one pixel P may be as follows: Figure 6 As shown in FIG. 1 , the arrangement is in a diamond shape.

[0119] In the display panel 100, the number of the first sub-pixels RP and the number of the third sub-pixels BP may be the same as each other. In the display panel 100, the number of the second sub-pixels GP may be twice the number of the first sub-pixels RP and twice the number of the third sub-pixels BP. In addition, in the display panel 100, the number of the second sub-pixels GP may be the same as the sum of the number of the first sub-pixels RP and the number of the third sub-pixels BP.

[0120] Figure 6It has been shown that the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP are formed in a rhombus shape in a plan view, but the present disclosure is not limited thereto. For example, the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP may be formed in a rectangular shape or a square shape in a plan view, or may be formed in other polygonal shapes, a circular shape, or an elliptical shape in a plan view. In addition, the shape of the first sub-pixel RP, the shape of the second sub-pixel GP, and the shape of the third sub-pixel BP may be different from each other.

[0121] Figure 6 It has been shown that the size of the first sub-pixel RP, the size of the second sub-pixel GP, and the size of the third sub-pixel BP in the plan view are the same as each other, but the present disclosure is not limited to this. For example, the size of the first sub-pixel RP, the size of the second sub-pixel GP, and the size of the third sub-pixel BP in the plan view may be different from each other. For example, in the plan view, the size of the first sub-pixel RP may be larger than the size of the second sub-pixel GP, and the size of the third sub-pixel BP may be larger than the size of the second sub-pixel GP. In addition, in the plan view, the size of the first sub-pixel RP may be substantially equal to or smaller than the size of the third sub-pixel BP.

[0122] Figure 7 It is shown along Figure 6 A cross-sectional view of the example taken along line II-II', and Figure 8 yes Figure 7 A magnified view of region B. In addition, Fig. 9 Is used to describe Figure 7 The view angle controls the view of the widget and the direction of light travel.

[0123] refer to Figure 7 and Figure 8 The thin film transistor layer TFTL is formed on the substrate SUB1 . The thin film transistor layer TFTL includes a thin film transistor 120 , a gate insulating layer 130 , an interlayer insulating layer 140 , a passivation layer 150 , and a planarization layer 160 .

[0124] The first buffer layer BF1 may be formed on one surface of the substrate SUB1. The first buffer layer BF1 may be formed on one surface of the substrate SUB1 to protect the thin film transistor 120 and the organic light emitting layer 172 of the light emitting element layer EML from moisture penetrating through the substrate SUB1 (which is easily permeated by moisture). The first buffer layer BF1 may include a plurality of inorganic films alternately stacked with each other. For example, the first buffer layer BF1 may be formed as a plurality of films in which one or more inorganic films of a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are alternately stacked with each other. The first buffer layer BF1 may be omitted.

[0125] The thin film transistor 120 is formed on the first buffer layer BF1 and includes an active layer 121 , a gate electrode 122 , a source electrode 123 , and a drain electrode 124 . Figure 7 1 has been shown that the thin film transistor 120 is formed as a top gate type, in which the gate electrode 122 is located above the active layer 121, but it should be noted that the present disclosure is not limited thereto. For example, the thin film transistor 120 may be formed as a bottom gate type, in which the gate electrode 122 is located below the active layer 121, or the thin film transistor 120 may be formed as a dual gate type, in which the gate electrode 122 is located above and below the active layer 121.

[0126] The active layer 121 is formed on the first buffer layer BF1. The active layer 121 may include, for example, polycrystalline silicon, single crystal silicon, low temperature polycrystalline silicon, amorphous silicon, or an oxide semiconductor. For example, the oxide semiconductor may include a binary compound (AB) containing indium, zinc, gallium, tin, titanium, aluminum, hafnium (Hf), zirconium (Zr), magnesium (Mg), etc. x ), ternary compounds (AB x C y ) or quaternary compound (AB x C y D z For example, the active layer 121 may include ITZO (an oxide including indium, tin, and titanium) or IGZO (an oxide including indium, gallium, and tin). A light blocking layer for blocking external light incident on the active layer 121 may be formed between the first buffer layer BF1 and the active layer 121.

[0127] The gate insulating layer 130 may be formed on the active layer 121. The gate insulating layer 130 may be formed as an inorganic film such as a silicon nitride layer, a silicon nitride oxide layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0128] The gate electrode 122 and the gate line may be formed on the gate insulating layer 130. The gate electrode 122 and the gate line may be formed as a single layer or a multilayer including, for example, any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0129] An interlayer insulating layer 140 may be formed on the gate electrode 122 and the gate line. The interlayer insulating layer 140 may be formed as an inorganic film such as a silicon nitride layer, a silicon nitride oxide layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0130] The source electrode 123 and the drain electrode 124 may be formed on the interlayer insulating layer 140. Each of the source electrode 123 and the drain electrode 124 may be connected to the active layer 121 through each of the contact holes penetrating the gate insulating layer 130 and the interlayer insulating layer 140. The source electrode 123 and the drain electrode 124 may be formed as a single layer or a multilayer including, for example, any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0131] A passivation layer 150 for insulating the thin film transistor 120 may be formed on the source electrode 123 and the drain electrode 124. The passivation layer 150 may be formed as an inorganic film such as a silicon nitride layer, a silicon nitride oxide layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0132] A planarization layer 160 for planarizing a step generated by the thin film transistor 120 may be formed on the passivation layer 150. The planarization layer 160 may be formed as an organic film including, for example, acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, and the like.

[0133] The light emitting element layer EML is formed on the thin film transistor layer TFTL and includes a light emitting element 170 and a pixel defining layer 180 .

[0134] The light emitting elements 170 and the pixel defining layer 180 are formed on the planarization layer 160. Each of the light emitting elements 170 may include a first electrode 171 (eg, a pixel electrode), an organic light emitting layer 172, and a second electrode 173.

[0135] The first electrode 171 may be formed on the planarization layer 160. The first electrode 171 is connected to the drain electrode 124 of the thin film transistor 120 through a contact hole passing through the passivation layer 150 and the planarization layer 160.

[0136] In a top emission structure in which light is emitted toward the second electrode 173 based on the organic light emitting layer 172, the first electrode 171 may be made of a metal material having a high reflectivity, such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO / APC / ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

[0137] In a bottom emission structure in which light is emitted toward the first electrode 171 based on the organic light emitting layer 172, the first electrode 171 may be made of a transparent conductive material (TCO) (such as ITO or IZO) through which light can be transmitted, or a semi-transmissive conductive material (such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). In this case, when the first electrode 171 includes a semi-transmissive conductive material, light emission efficiency can be improved by a microcavity.

[0138] The pixel defining layer 180 may be formed to separate the first electrode 171 on the planarization layer 160, thereby serving as a pixel defining layer defining the sub-pixels RP, GP, and BP. The pixel defining layer 180 may be formed to cover the edge of the first electrode 171. For example, the pixel defining layer 180 may expose a portion of the first electrode 171. The pixel defining layer 180 may be formed as an organic film including, for example, acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc.

[0139] Each of the sub-pixels RP, GP, and BP refers to a region where the first electrode 171, the organic light emitting layer 172, and the second electrode 173 are sequentially stacked and holes from the first electrode 171 and electrons from the second electrode 173 are recombined with each other in the organic light emitting layer 172 to emit light. Each of the sub-pixels RP, GP, and BP may include a light emitting element 170.

[0140] The organic light emitting layer 172 is formed on the first electrode 171 and the pixel defining layer 180. The organic light emitting layer 172 may include an organic material to emit light of a predetermined color. For example, the organic light emitting layer 172 may include a hole transport layer, an organic material layer, and an electron transport layer. In this case, the organic light emitting layer 172 of the first sub-pixel RP may emit light of a first color, and the organic light emitting layer 172 of the second sub-pixel GP may emit light of a second color. In addition, the organic light emitting layer 172 of the third sub-pixel BP may emit light of a third color. The first color may be red, the second color may be green, and the third color may be blue, but the present disclosure is not limited thereto.

[0141] In addition, the organic light-emitting layer 172 of each of the sub-pixels RP, GP and BP can emit white light, and in this case, the first sub-pixel RP can overlap with the color filter layer of the first color, the second sub-pixel GP can overlap with the color filter layer of the second color, and the third sub-pixel BP can overlap with the color filter layer of the third color.

[0142] The second electrode 173 is formed on the organic light emitting layer 172. The second electrode 173 may be formed to cover the organic light emitting layer 172. The second electrode 173 may be a common layer commonly formed in the sub-pixels RP, GP, and BP. A capping layer may be formed on the second electrode 173.

[0143] In the top emission structure, the second electrode 173 may include, for example, a transparent conductive material (TCO) capable of transmitting light therethrough, such as ITO or IZO, or a semi-transmissive conductive material, such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). When the second electrode 173 includes a semi-transmissive conductive material, light emitting efficiency may be improved through a microcavity.

[0144] In the bottom emission structure, the second electrode 173 may be made of a metal material having high reflectivity, such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO / APC / ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

[0145] The thin film encapsulation layer TFEL is formed on the light emitting element layer EML and includes an encapsulation layer 190 .

[0146] The encapsulation layer 190 is disposed on the second electrode 173. The encapsulation layer 190 may include at least one inorganic film to prevent oxygen or moisture from penetrating into the organic light-emitting layer 172 and the second electrode 173. In addition, the encapsulation layer 190 may include at least one organic film to protect the light-emitting element layer EML from foreign matter such as dust. For example, the encapsulation layer 190 may include a first inorganic film disposed on the second electrode 173, an organic film disposed on the first inorganic film, and a second inorganic film disposed on the organic film. The first inorganic film and the second inorganic film may be formed, for example, as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer, but the present disclosure is not limited thereto. The organic film may be made of an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, etc., but the present disclosure is not limited thereto.

[0147] The second buffer layer BF2 is formed on the thin film encapsulation layer TFEL. The second buffer layer BF2 may include a plurality of inorganic films alternately stacked with each other. For example, the second buffer layer BF2 may be formed as a plurality of films, wherein one or more inorganic films of a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are alternately stacked with each other. The second buffer layer BF2 may be omitted.

[0148] The touch sensing layer TSL is formed on the second buffer layer BF2. Figure 5 As shown in , the touch sensing layer TSL may include driving electrodes TE, sensing electrodes RE, connecting electrodes BE, first driving lines TL1, second driving lines TL2, sensing lines RL, protection lines GL1, GL2, GL3, GL4, and GL5, and ground lines GRL1, GRL2, and GRL3. Figure 7, for convenience of explanation, the driving electrodes TE, the sensing electrodes RE, and the connecting electrodes BE of the touch sensing layer TSL have been illustrated.

[0149] The connection electrode BE may be disposed on the second buffer layer BF2. The connection electrode BE may be formed as a single layer or multiple layers including, for example, any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0150] The first touch insulating film TINS1 is disposed on the connection electrode BE and may include an opening exposing a portion of the connection electrode BE. The first touch insulating film TINS1 may be formed as an inorganic film such as a silicon nitride layer, a silicon oxide layer, a silicon oxynitride layer, a titanium oxide layer, or an aluminum oxide layer. For example, the first touch insulating film TINS1 may be formed as an organic film made of acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc.

[0151] The driving electrode TE and the sensing electrode RE may be disposed on the first touch insulating film TINS1. In addition, the first driving line TL1, the second driving line TL2, the sensing line RL, the protection line GL1, GL2, GL3, GL4, and GL5, and the ground lines GRL1, GRL2, and GRL3 other than the driving electrode TE and the sensing electrode RE may be disposed on the first touch insulating film TINS1. For example, the driving electrode TE, the sensing electrode RE, the first driving line TL1, the second driving line TL2, the sensing line RL, the protection line GL1, GL2, GL3, GL4, and GL5, and the ground lines GRL1, GRL2, and GRL3 other than the connection electrode BE may be disposed at the same layer as each other and may be made of the same material as each other. Each of the driving electrode TE, the sensing electrode RE, the first driving line TL1, the second driving line TL2, the sensing line RL, the protection lines GL1, GL2, GL3, GL4 and GL5, and the ground lines GRL1, GRL2 and GRL3 can be made of, for example, a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO / APC / ITO), but the embodiments of the present disclosure are not limited thereto. Figure 5The connection electrodes BE shown in the figure may be formed on the first touch insulating film TINS1. Each of the connection electrodes BE may be connected to the driving electrode TE through the touch contact hole TCNT passing through the first touch insulating film TINS1. The driving electrodes TE arranged in the second direction (Y-axis direction) may be electrically connected to each other through the connection electrodes BE. The connection electrodes BE may be made of, for example, a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO / APC / ITO), but the present disclosure is not limited thereto.

[0152] The second touch insulating film TINS2 is formed on the driving electrode TE and the sensing electrode RE. The second touch insulating film TINS2 may be used to flatten the steps formed by the driving electrode TE, the sensing electrode RE, and the connecting electrode BE. For example, the second touch insulating film TINS2 may be formed as an organic film made of acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc.

[0153] The window WM is disposed on the touch sensing layer TSL.

[0154] As described above, a plurality of grooves re arranged in a first direction (X-axis direction) and extending in a second direction (Y-axis direction) substantially perpendicular to the first direction (X-axis direction) may be provided in the lower surface of the window WM. A viewing angle control member LCU may be provided in each of the plurality of grooves re. Thus, the plurality of viewing angle control members LCU are provided at regular intervals in the first direction (X-axis direction). The width W1 of each of the plurality of grooves re may be in the range of about 2 μm to about 4 μm, and for example, about 3 μm.

[0155] The angle formed by the inner sidewall of each of the plurality of grooves re may be about 90° relative to the upper surface of the second touch insulating film TINS2. Therefore, loss of light of the light emitting element layer EML traveling in the upward direction (Z-axis direction) of the display panel 100 may be easily prevented.

[0156] As the height d1 of the viewing angle control member LCU increases, the ratio of light absorbed by the light absorption wall LCW of the viewing angle control member LCU to be described later to the light of the sub-pixels RP, GP, and BP may increase. Therefore, in order to improve the light absorption efficiency of the side light of the sub-pixels RP, GP, and BP, the height d1 of the viewing angle control member LCU may be in the range of about 5 μm to about 10 μm, and, for example, about 6 μm. The height d1 of the viewing angle control member LCU refers to the distance from the lower surface of the viewing angle control member LCU to the upper surface of the viewing angle control member LCU.

[0157] In addition, as the number of viewing angle control members LCU increases, the light absorption efficiency of the side light of the sub-pixels RP, GP and BP can be increased. However, as the number of viewing angle control members LCU on the sub-pixels RP, GP and BP increases, the proportion of light traveling in the upward direction (Z-axis direction) of the sub-pixels RP, GP and BP can be reduced due to the thickness of the light absorption wall LCW of the viewing angle control member LCU. Therefore, the spacing distance d2 between the viewing angle control members LCU can be in the range of about 8μm to about 10μm. The spacing distance d2 between the viewing angle control members LCU and the height d1 of the viewing angle control member LCU can be the same size, but the present disclosure is not limited to this. Here, the spacing distance d2 between the viewing angle control members LCU can be the distance from the central axis of the first viewing angle control member LCU to the central axis of the second viewing angle control member LCU adjacent to the first viewing angle control member LCU.

[0158] The upper and lower surfaces of the viewing angle control unit LCU may have a light-transmitting property.

[0159] The viewing angle controlling unit LCU may include a light absorbing wall LCW and a filler LCF.

[0160] The light absorbing wall LCW is provided on the side wall of the groove re of the lower surface WMB of the window WM. Therefore, the light absorbing wall LCW can be formed based on the shape of the groove re provided in the lower surface WMB of the window WM, and can control the traveling direction of the light output through the display surface. Fig. 9 Describe the light absorbing wall LCW and the direction of light travel.

[0161] The width W2 of the light absorption wall LCW on one surface of the window WM may be in the range of about 0.15 μm to about 0.5 μm, and may be, for example, about 0.3 μm. The light absorption wall LCW may be formed to be thinner toward the upper portion of the window WM. The light absorption wall LCW may be formed of, for example, CuMgAlO x The single-layer structure of the window WM is shown in FIG. 1 , but the present disclosure is not limited thereto and may be made of any material having a low-reflection light absorption function and having adhesion to the side wall of the window WM. x It has low reflectivity and high light absorption functions, and does not require a separate adhesive because it is adhesively formed on the sidewall of the groove re of the window WM. Therefore, the process can be simplified.

[0162] In addition, the viewing angle control member LCU may further include a filler LCF. In an embodiment of the present disclosure, the light absorbing wall LCW may be disposed on the inner wall of the plurality of grooves re, and the plurality of grooves re may be filled with the filler LCF. For example, each of the fillers LCF may be disposed between a pair of light absorbing walls LCW in each of the grooves re. The filler LCF becomes wider toward the center of the window WM. The filler LCF may be made of, for example, a transparent oxide film (e.g., silicon dioxide (SiO 2 ) and a siloxane-based material). However, the concept of the present disclosure is not limited thereto. For example, instead of the filler LCF, air may be provided between the light absorbing walls LCW.

[0163] The viewing angle control members LCU may be disposed on the touch sensing layer TSL. At least some of the viewing angle control members LCU may overlap the touch electrodes TE and RE in a third direction (Z-axis direction) (eg, thickness direction).

[0164] The protection layer PRL may be disposed on the lower surface WMB of the window WM in a region where the viewing angle control member LCU is not disposed. For example, the protection layer PRL may be disposed between the viewing angle control members LCU.

[0165] The protection layer PRL may be disposed between the window WM and the touch sensing layer TSL.

[0166] The protection layer PRL may be made of, for example, transparent IZO or IGZO. The protection layer PRL may be omitted.

[0167] Fig. 9 is a partial enlarged cross-sectional view of the display panel, which shows Figure 7 The light output by the organic light emitting layer travels.

[0168] refer to Fig. 9 , the light output from the organic light emitting layer 172 may be output along the third direction (Z-axis direction). Hereinafter, the light output from the organic light emitting layer 172 will be referred to as output light. Such output light may be output in various directions, rather than in a direction parallel to the third direction (Z-axis direction).

[0169] In addition, hereinafter, the light transmitted from the organic light emitting layer 172 to the light absorbing wall LCW will be referred to as the first light L1. Here, the first light L1 refers to the light output from the organic light emitting layer 172 in a state of being inclined at a predetermined angle between the third direction (Z-axis direction) and the first direction (X-axis direction). For example, the predetermined angle of the first light L1 relative to the upper surface of the first electrode 171 may be less than about 90°. In addition, the light transmitted from the organic light emitting layer 172 to the outside after passing through the light absorbing wall LCW will be referred to as the second light L2. The second light L2 refers to the light output from the light emitting element layer EML in a state of being inclined at a predetermined angle between the third direction (Z-axis direction) and the first direction (X-axis direction). For example, the predetermined angle of the second light L2 may be different from the predetermined angle of the first light L1. For example, the predetermined angle of the second light L2 relative to the upper surface of the first electrode 171 may be about 90°.

[0170] As described above, the light absorption wall LCW may be arranged at regular intervals along the first direction (X-axis direction). When the first light L1 is output from the organic light emitting layer 172, the first light L1 may be transmitted to the light absorption wall LCW. In this case, the first light L1 transmitted to the light absorption wall LCW may be absorbed by the light absorption wall LCW. For example, the light absorption wall LCW may block the travel of the first light L1. Therefore, the first light L1 is not transmitted to the outside through the display surface.

[0171] In contrast, when the second light L2 is output from the organic light emitting layer 172, the second light L2 may pass between the light absorbing walls LCW. For example, the second light L2 may be transmitted to the outside through the display surface.

[0172] As described above, the traveling direction of light output through the display surface of the display device 10 may become substantially constant by the light absorption wall LCW. For example, an image displayed through the display surface may not be projected from other directions that do not face the display surface.

[0173] As an example, the display device 10 may be installed inside a vehicle. In this case, the display device 10 may be arranged inside the vehicle so that its display surface is viewed by a user. Under normal circumstances, the light output from the organic light emitting layer 172 is output in various directions through the display surface, and thus, an image is projected onto the windshield of the vehicle. According to an embodiment of the present disclosure, the light output from the organic light emitting layer 172 may be output through the display surface in a substantially constant direction through the viewing angle control member LCU. Therefore, it is possible to prevent the image from being projected onto the windshield of the vehicle.

[0174] Fig.10 and Fig.11 According to some embodiments of the present disclosure Figure 7 Magnified view of area B.

[0175] In addition to the configuration of the light absorbing wall LCW, Fig.10 The window WM shown in can be used with Figure 8 The windows WM shown in FIG. 1 are substantially the same. Therefore, descriptions of other components that may be redundant may be omitted.

[0176] refer to Fig.10 , the light absorption wall LCW may include a first light absorption wall LCW-1 formed on the side surface of the groove re and a second light absorption wall LCW-2 formed on the bottom surface of the groove re. The thickness of the second light absorption wall LCW-2 is less than the thickness of the first light absorption wall LCW-1. Therefore, the second light absorption wall LCW-2 may not completely absorb light, and light may pass through the second light absorption wall LCW-2. However, during the process of forming the light absorption wall LCW, the second light absorption wall LCW-2 formed on the bottom surface of the groove re does not need to be removed, which simplifies the process.

[0177] In addition to the width W1 of the viewing angle control member LCU becoming smaller and the color filter of the viewing angle control member LCU being omitted, Fig.11 The window WM shown in can be used with Fig.10 The windows WM shown in FIG. 1 are substantially the same. Therefore, descriptions of other components that may be redundant will be omitted.

[0178] Only the configurations of the light absorbing wall LCW and the filler LCF are changed, and unless otherwise specified, the other components may be substantially the same as the aforementioned corresponding components. Therefore, the description of the other components will be omitted to prevent redundant description.

[0179] refer to Fig.11 , the width W11 of the viewing angle control member LCU may be the same as the width of the groove re of the window WM, and may be about 1 μm to about 2 μm. The opening W3 of the groove re of the window WM may become very narrow due to the width W2 of the light absorbing wall LCW of the viewing angle control member LCU. In this case, the filler in the groove re of the window WM may be omitted.

[0180] Fig.12 It is used to describe the properties of silicon dioxide (SiO 2 ) and transmission characteristics of siloxane-based materials.

[0181] refer to Fig.12 It can be confirmed that for all wavelengths of visible light, silicon dioxide (SiO 2 ) and the transmittance of siloxane-based materials is almost 100%. Figure 8 The area outside the light absorption wall LCW of the groove re of the window WM is filled with transparent silicon dioxide (SiO 2 ) and a filler LCF made of a silicone-based material, a light transmittance close to 100% can be expected for all wavelengths of visible light.

[0182] Fig.13 is a flowchart for describing a method for manufacturing a window according to an embodiment of the present disclosure. Figures 14 to 18 is a cross-sectional view for describing a method for manufacturing a window according to an embodiment of the present disclosure.

[0183] refer to Figures 14 to 16 , forming a protective layer PRL and a plurality of grooves re on the window WM ( Fig.13 S110 in ).

[0184] refer to Fig.14 , a hard mask HM is formed on the window WM. The window WM may be, for example, a glass substrate or a plastic substrate having a light-transmitting property. For example, when the window WM is a plastic substrate, the window WM may be made of a material such as polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyether sulfone (PES), polyarylate (PAR), polysulfone (PSF), and cyclic olefin copolymer (COC).

[0185] The hard mask HM may be a transparent oxide thin film made of, for example, IZO or IGZO.

[0186] refer to Fig.15 , the hard mask HM formed on the window WM is patterned using the photoresist mask PR. The patterned hard mask HM is a protection layer PRL and may remain in a subsequent process without being removed.

[0187] refer to Fig.16 , a groove re may be formed in the window WM by forming a trench in the window WM through etching using the patterned hard mask HM.

[0188] The plurality of grooves re formed using the hard mask HM may be formed at equal intervals and at the same depth. The plurality of grooves re may be formed within a range of about 20% or less of the total area of ​​the window WM, but the present disclosure is not limited thereto. The depth of the groove re may be within a range of about 10% to about 55% of the thickness of the window WM, but the present disclosure is not limited thereto.

[0189] Next, refer to Fig.17 , forming a light absorbing wall LCW ( Fig.13 S120 in ).

[0190] For example, CuMgAl is deposited on one surface of the window WM, and the light absorption wall LCW is formed on the side surface of the groove re by anisotropic etching.

[0191] In anisotropic etching, without a separate mask, a large voltage difference is formed in the third direction (Z-axis direction), and CuMgAl is etched by the etching material. In this case, by voltage control, the etching material can etch the light absorbing layer made of CuMgAl while moving in the third direction (Z-axis direction), that is, from the upper part to the lower part.

[0192] The etching material is a material that etches CuMgAl but may not etch the protection layer PRL and the window WM.

[0193] For this reason, Fig.17 As shown in the figure, the CuMgAl material arranged on the horizontal plane defined by the first direction (X-axis direction) and the second direction (Y-axis direction) and the CuMgAl material arranged at the lower portion of the groove re (i.e., the light absorbing layer) are removed, while the CuMgAl material arranged on the vertical plane defined by the third direction (Z-axis direction) may not be removed.

[0194] CuMgAl has excellent adhesive properties, and in particular, has excellent adhesiveness to glass. Therefore, when forming the light absorbing wall LCW made of CuMgAl in the window WM made of a glass material, a separate adhesive layer or adhesive is not required.

[0195] Next, refer to Fig.18 , a filler LCF is formed in the groove re in which the light absorbing wall LCW is formed ( Fig.13 The filler LCF can be made of transparent silicon dioxide (SiO 2 Since a single light absorbing wall LCW made of CuMgAl is formed, the reflection problem of the metal itself can be prevented compared with multiple light absorbing sides including conventional Ti metal.

[0196] Then, the CuMgAl is converted into CuMgAlO by performing an oxidative heat treatment on the light absorbing wall LCW. x In this case, the oxidation heat treatment temperature may be about 250° C., but the present disclosure is not limited thereto.

[0197] Next, a surface of the window WM may be set on the display panel ( Fig.13 S140 in ).

[0198] Here, the display panel has Figure 7 The display panel 100 has the same configuration as described in , and thus a detailed description thereof will be omitted.

[0199] In an example, an oxidation heat treatment may be performed on the light absorbing wall LCW before filling the filler LCF.

[0200] Fig.19 is a diagram showing an embodiment of the present disclosure Figure 2 A cross-sectional view of the example taken along line II', and Fig. 20 is a diagram showing an embodiment of the present disclosure Figure 6 A cross-sectional view of the example taken along line II-II'.

[0201] Fig.19 and Fig. 20 The display device 11 according to the embodiment of the present disclosure shown in FIG. Figure 3 and Figure 7 The display device 10 shown in FIG. 1 is different in that the touch sensing layer TSL is omitted.

[0202] refer to Fig.19 and Fig. 20 The display device 11 may include a substrate SUB1, a thin film transistor layer TFTL disposed on the substrate SUB1, a light emitting element layer EML, a thin film encapsulation layer TFEL, and a window WM. The viewing angle control member LCU may be disposed in a groove re formed in one surface of the window WM.

[0203] For example, the viewing angle control member LCU may be disposed on the thin film encapsulation layer TFEL. For example, the viewing angle control member LCU may be formed on the second buffer layer BF2 formed on the thin film encapsulation layer TFEL.

[0204] Fig.21 : is a view showing an example to which a display device according to an embodiment of the present disclosure is applied.

[0205] As an example, Fig.21 It is shown that the display device DD according to an embodiment of the present disclosure is installed inside a vehicle. Hereinafter, it will be described that the display device DD is installed inside a vehicle to be adjacent to a driver's seat of the vehicle.

[0206] According to an embodiment of the present disclosure, the display device DD may be a flat panel display device. As an example, the display device DD may be a navigation device that displays traffic information, etc. The display surface of the display device DD may be disposed inside the vehicle to face the user's line of sight. For example, the display surface of the display device DD may be a surface parallel to the second direction (Y-axis direction) and the third direction (Z-axis direction), and may face the user's line of sight in the first direction (X-axis direction).

[0207] As described above, light can be output from the display surface of the display device DD based on the first direction (X-axis direction) by the light blocking member. For example, light is not output from the display surface of the display device DD in the third direction (Z-axis direction), and therefore, the image may not be projected onto the windshield FG.

[0208] The display device according to the embodiment of the present disclosure may have a reduced overall thickness and provide a privacy function by forming a viewing angle control member in a window, the viewing angle control member absorbing light traveling in a lateral direction of a light emitting element layer.

[0209] Although the present disclosure has been described with reference to the embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present disclosure.

Claims

1. A display device, characterized in that The display device comprises: A display panel including a display area and a non-display area; a window disposed above the display panel and having a plurality of grooves formed on one surface of the window facing the display panel; and A viewing angle control member is formed in the plurality of grooves, The viewing angle control member includes a light absorbing wall formed on side walls of the plurality of grooves and formed to become thinner as approaching upper surfaces of the plurality of grooves.

2. The display device according to claim 1, characterized in that The viewing angle control member further includes a filler that fills inner portions of the plurality of grooves and is at least partially surrounded by the light absorbing wall, and The filler is formed to become wider as approaching the upper surfaces of the plurality of grooves.

3. The display device according to claim 1, characterized in that The display device further includes a protective layer disposed on the one surface of the window and disposed between the viewing angle control members, Wherein, the protective layer includes a transparent oxide film.

4. The display device according to claim 1, characterized in that Each of the light absorbing walls includes a first light absorbing wall and a second light absorbing wall, wherein the first light absorbing wall is formed on the side walls of the plurality of grooves, and the second light absorbing wall is formed on the upper surfaces of the plurality of grooves, and The second light absorbing wall is formed to be thinner than the first light absorbing wall.

5. The display device according to claim 1, characterized in that The viewing angle control member includes a filler in contact with the light absorbing wall.

6. The display device according to claim 1, characterized in that The display device further includes a touch sensing layer disposed between the display panel and the window, Wherein, the viewing angle control component is arranged to face the touch sensing layer.

7. The display device according to claim 6, characterized in that The touch sensing layer includes touch electrodes, and At least some of the viewing angle control members overlap with the touch electrodes.

8. The display device according to claim 1, characterized in that The display panel comprises: substrate; a light emitting element layer disposed on the substrate and comprising a pixel and a pixel defining layer, wherein the pixel comprises a pixel electrode, a light emitting layer and a common electrode, and the pixel defining layer is disposed on the pixel electrode; and A thin film encapsulation layer is disposed on the light emitting element layer, Wherein, the viewing angle control component is arranged to face the thin film encapsulation layer.

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