Batching device for preparing low-cavity solder paste
By designing a batching device for solder paste preparation, the device uses electric telescopic rod and lead inclined plate technology to ensure that the material falls slowly in the solder paste, solving the problem of hollows in the solder paste preparation, and improving the electrical conductivity of the product and stability.
Patent Information
- Application Number
- CN202421281905.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-06
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2034-06-06
AI Technical Summary
A common problem in the preparation of solder paste is hollowing, which leads to a decrease in the conductivity and stability of the solder paste. The existing batching devices are prone to stir up blisters when adding feeds, increasing the probability of hollowing.
A batching device for preparation of low-altitude solder paste is designed, which includes components such as a batching mixing box, an electric telescopic rod, a lead inclined plate and a stirring leaf. The lead inclined plate is moved downward by the electric telescopic rod, so that the material is guided through the lead inclined plate when it approaches the liquid level, ensuring that the material falls slowly against the inner wall, and avoiding direct pouring and causing bubbles.
This device makes solid material addition more stable, significantly reduces bubbles in the mixed material, reduces the hollow rate of solder paste products, and thus improves the processing quality of the product.
Smart Images

Figure CN222518340U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of solder paste preparation, in particular to a batching device for preparing low-void solder paste. Background Art
[0002] Solder paste is a new type of welding material that came into being with SMT. It is a paste mixture formed by mixing solder powder, flux and other surfactants, thixotropic agents, etc. It is mainly used for welding electronic components such as PCB surface resistors, capacitors, ICs, etc. in the SMT industry. With the rapid development of semiconductor technology, the quality requirements for solder paste are getting higher and higher. Voids are a common problem in the preparation of solder paste, which will affect the conductivity and stability of solder paste. When preparing the ingredients of solder paste, some solid material powders need to be added to the solution for stirring. When adding materials, the materials are often introduced into the container from the top. After the solid materials enter the container, they will fall quickly under the action of gravity and hit the middle of the solution, which will stir up many bubbles, and then the materials stirred later will contain more bubbles, and the solder paste products will have voids, which will reduce the processing quality of the products. Utility Model Content
[0003] The utility model aims to provide a dispensing device for preparing low-void solder paste to solve the problems raised in the above-mentioned background technology.
[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a batching device for preparing low-void solder paste comprises a fixed table, a batching and mixing box is fixedly installed on the top of the fixed table, a base is connected to the bottom of the fixed table, a water tank is installed on one side of the base, both sides of the top of the batching and mixing box are connected to a fixed frame, a silo is fixedly installed on one side of the fixed frame, a discharge solenoid valve is provided at the bottom of the silo, a feed pipe is connected to the bottom of the discharge solenoid valve, an organic box is connected to the top of the batching and mixing box, a motor is installed inside the organic box, a rotating rod is connected to the output end of the motor, a stirring blade is provided on the surface of the rotating rod, electric telescopic rods are installed on both sides of the top of the batching and mixing box, the output end of the electric telescopic rod is connected to a material guide inclined plate, the bottom of the feed pipe is connected to a wall-attached tube, a material port is provided at the bottom of the wall-attached tube, and a switch panel is installed on one side of the front of the fixed table.
[0005] Preferably, the motor, the electric telescopic rod and the unloading solenoid valve are all electrically connected to an external power supply through a switch panel, and the switch panel facilitates the control of the motor, the electric telescopic rod and the unloading solenoid valve.
[0006] Preferably, the feed pipe passes through the batching and mixing box and extends to the interior of the batching and mixing box, and the feed introduction inclined plate is located at the bottom of the wall-attached pipe.
[0007] Preferably, the material inlet is arranged on a side of the wall-adhering tube close to the inner wall of the batching and mixing box, and the bottom of the material introduction inclined plate is close to the inner wall of the batching and mixing box.
[0008] Preferably, reinforcement frames are connected to both sides of the batching and mixing box, the bottom of the reinforcement frame is fixedly connected to the top of the fixed platform, and an observation window is provided on the front of the batching and mixing box.
[0009] Preferably, a mounting plate is connected to one side of the bottom of the inner wall of the water tank, a water pump is installed on the top of the mounting plate, the output end of the water pump is connected to a water pipe, one end of the water pipe is connected to the top of the ingredient mixing box, and the water pump is electrically connected to the switch panel.
[0010] Preferably, a discharge valve is installed at the bottom of the batching and mixing box, and the bottom of the discharge valve is connected to a bottom pipe.
[0011] Compared with the prior art, the beneficial effects of the utility model are:
[0012] The material is placed inside the silo, and the electric telescopic rod is started to move the material introduction ramp downward. The bottom of the material introduction ramp is close to the inner wall of the batching and mixing box. The material introduction ramp is moved down to a position above the liquid surface inside the batching and mixing box. During batching, the material enters the batching and mixing box through the feed pipe and is discharged through the material port at the bottom of the wall-attached tube. Most of the material will fall along the inner wall of the batching and mixing box, and when the material is close to the liquid surface, it will be guided by the material introduction ramp, so that the material clings to the inner wall of the batching and mixing box and slowly falls into the solution. The entire batching device can make the solid material added into the solution more smoothly, avoiding the phenomenon of directly pouring the material and stirring up a large number of bubbles, thereby greatly reducing the bubbles in the later mixed material, making the solder paste product low in voids and improving the processing quality of the product. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a schematic diagram of the structure of the utility model;
[0014] Figure 2 This is the internal structure diagram of the batching and mixing box of the utility model;
[0015] Figure 3 It is an enlarged structural diagram of the utility model A;
[0016] Figure 4 This is the internal structure diagram of the water tank of the utility model.
[0017] In the figure: 1. fixed table; 2. batching and mixing box; 3. base; 4. fixed frame; 5. silo; 6. unloading solenoid valve; 7. feeding pipe; 8. switch panel; 9. observation window; 10. electric telescopic rod; 11. water tank; 12. machine box; 13. motor; 14. rotating rod; 15. stirring blade; 16. discharge valve; 17. bottom pipe; 18. material guide inclined plate; 19. wall-attached pipe; 20. material port; 21. mounting plate; 22. water pump; 23. water pipe; 24. reinforcement frame. DETAILED DESCRIPTION
[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0019] See also Figure 1-4 The utility model provides a batching device for preparing low-void solder paste, comprising a fixed platform 1, a batching and mixing box 2 is fixedly installed on the top of the fixed platform 1, a base 3 is connected to the bottom of the fixed platform 1, a water tank 11 is installed on one side of the base 3, both sides of the top of the batching and mixing box 2 are connected to a fixed frame 4, a silo 5 is fixedly installed on one side of the fixed frame 4, a discharge solenoid valve 6 is provided at the bottom of the silo 5, a feed pipe 7 is connected to the bottom of the discharge solenoid valve 6, an organic box 12 is connected to the top of the batching and mixing box 2, a motor 13 is installed inside the machine box 12, and the output of the motor 13 The end is connected with a rotating rod 14, and the surface of the rotating rod 14 is provided with a stirring blade 15. Electric telescopic rods 10 are installed on both sides of the top of the batching and mixing box 2. The output end of the electric telescopic rod 10 is connected with a material introduction inclined plate 18. The bottom of the feed pipe 7 is connected with a wall-attached tube 19, and the bottom of the wall-attached tube 19 is provided with a material port 20. A switch panel 8 is installed on one side of the front of the fixed platform 1. The motor 13, the electric telescopic rod 10 and the unloading solenoid valve 6 are electrically connected to the external power supply through the switch panel 8. A discharge valve 16 is installed at the bottom of the batching and mixing box 2, and the bottom of the discharge valve 16 is connected with a bottom pipe 17;
[0020] In this embodiment, when batching, the discharge solenoid valve 6 at the bottom of the silo 5 is opened, and the material enters the interior of the batching mixing box 2 through the feed pipe 7 and is discharged through the material port 20 at the bottom of the wall-attached tube 19. Most of the material will fall along the inner wall of the batching mixing box 2, and when the material is close to the liquid surface, it will be guided by the guide inclined plate 18, so that the material will cling to the inner wall of the batching mixing box 2 and slowly fall into the solution. Then, the motor 13 is started to stir the mixed material inside the batching mixing box 2 to complete the batching and mixing operation.
[0021] See also Figure 1-4The feed pipe 7 passes through the batching and mixing box 2 and extends to the inside of the batching and mixing box 2. The material introduction inclined plate 18 is located at the bottom of the wall-attached tube 19. The material port 20 is located on the side of the wall-attached tube 19 close to the inner wall of the batching and mixing box 2. The bottom of the material introduction inclined plate 18 is close to the inner wall of the batching and mixing box 2.
[0022] In this embodiment, after the solid material slowly falls into the solution close to the inner wall of the batching and mixing box 2, the motor 13 is started to drive the rotating rod 14 to rotate. The rotating rod 14 can rotate and drive the stirring blade 15 to rotate, thereby mixing and stirring the materials inside the batching and mixing box 2.
[0023] See also Figure 1-4 , both sides of the batching and mixing box 2 are connected with reinforcement frames 24, the bottom of the reinforcement frames 24 is fixedly connected to the top of the fixed platform 1, the front of the batching and mixing box 2 is provided with an observation window 9, one side of the bottom of the inner wall of the water tank 11 is connected with a mounting plate 21, the top of the mounting plate 21 is installed with a water pump 22, the output end of the water pump 22 is connected with a water pipe 23, one end of the water pipe 23 is connected with the top of the batching and mixing box 2;
[0024] In this embodiment, the water tank 11 may be filled with a solution for batching, and starting the water pump 22 can transport the solution to the interior of the batching mixing box 2 through the water pipe 23 .
[0025] In specific use, the utility model is a batching device for preparing low-void solder paste. The batching mixing box 2 is filled with a configured solution. When adding solid materials to the solution during use, the materials are placed in the silo 5, and the surface of the silo 5 is provided with a scale. The electric telescopic rod 10 is started to move the material introduction inclined plate 18 downward, and the bottom of the material introduction inclined plate 18 is close to the inner wall of the batching mixing box 2. The material introduction inclined plate 18 is moved down to the upper position of the material mixing box 2 near the liquid surface. When batching, the material discharge solenoid valve 6 at the bottom of the silo 5 is opened, and the material is fed through the feed The tube 7 enters the interior of the batching and mixing box 2 and is discharged through the material port 20 at the bottom of the wall-attached tube 19. Most of the material will fall along the inner wall of the batching and mixing box 2. When the material is close to the liquid surface, it will be guided by the material guide ramp 18, so that the material will cling to the inner wall of the batching and mixing box 2 and slowly fall into the solution, which can make the addition of solid materials more stable and avoid the phenomenon of directly pouring materials to arouse bubbles, thereby greatly reducing the bubbles in the materials mixed later, making the solder paste product low in voids and improving the processing quality of the product.
[0026] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.
Claims
1. A dispensing device for preparing low void solder paste, comprising a fixing table (1), characterized in that: A batching and mixing box (2) is fixedly mounted on the top of the fixed platform (1), a base (3) is connected to the bottom of the fixed platform (1), a water tank (11) is mounted on one side of the base (3), both sides of the top of the batching and mixing box (2) are connected to a fixed frame (4), a silo (5) is fixedly mounted on one side of the fixed frame (4), a discharge solenoid valve (6) is provided at the bottom of the silo (5), a feed pipe (7) is connected to the bottom of the discharge solenoid valve (6), and a machine box (12) is connected to the top of the batching and mixing box (2), and the machine box A motor (13) is installed inside (12), the output end of the motor (13) is connected to a rotating rod (14), and a stirring blade (15) is provided on the surface of the rotating rod (14). Electric telescopic rods (10) are installed on both sides of the top of the batching mixing box (2), and the output end of the electric telescopic rod (10) is connected to a material introduction inclined plate (18). The bottom of the feed pipe (7) is connected to a wall-attached tube (19), and a material port (20) is provided at the bottom of the wall-attached tube (19). A switch panel (8) is installed on one side of the front of the fixed platform (1).
2. The dispensing device for preparing low void solder paste according to claim 1, characterized in that: The motor (13), the electric telescopic rod (10) and the unloading solenoid valve (6) are all electrically connected to an external power source via a switch panel (8).
3. The batching device for preparing low void solder paste according to claim 1, characterized in that: The feed pipe (7) passes through the batching and mixing box (2) and extends to the interior of the batching and mixing box (2), and the material introduction inclined plate (18) is located at the bottom of the wall-adhering tube (19).
4. The batching device for preparing low void solder paste according to claim 1, characterized in that: The material inlet (20) is arranged on a side of the wall-adhering tube (19) close to the inner wall of the batching and mixing box (2), and the bottom of the material introduction inclined plate (18) is close to the inner wall of the batching and mixing box (2).
5. The batching device for preparing low void solder paste according to claim 1, characterized in that: Both sides of the batching and mixing box (2) are connected to reinforcement frames (24), the bottom of the reinforcement frame (24) is fixedly connected to the top of the fixed platform (1), and the front of the batching and mixing box (2) is provided with an observation window (9).
6. The batching device for preparing low void solder paste according to claim 1, characterized in that: A mounting plate (21) is connected to one side of the bottom of the inner wall of the water tank (11), a water pump (22) is installed on the top of the mounting plate (21), an output end of the water pump (22) is connected to a water pipe (23), and one end of the water pipe (23) is connected to the top of the batching mixing box (2).
7. The dispensing device for preparing low void solder paste according to claim 1, characterized in that: A discharge valve (16) is installed at the bottom of the batching and mixing box (2), and the bottom of the discharge valve (16) is connected to a bottom pipe (17).