Electronic device

Abstract

The utility model discloses electronic equipment, and belongs to the field of electronic equipment. The electronic equipment comprises a frame body and a sound output part, the frame body comprises a frame and a main board upper cover, the main board upper cover is arranged in the frame and connected with the frame, a through hole is formed in the main board upper cover, and the through hole is not communicated with the edge of the main board upper cover; the main board upper cover comprises a first face, the sound emitting piece is arranged on the first face and opposite to the through hole in position, a sound emitting channel is formed in the main board upper cover and communicated with the through hole, and the sound emitting channel and the through hole form a sound emitting channel of the sound emitting piece.

Description

Technical Field

[0001] The present application belongs to the field of electronic equipment, and specifically relates to an electronic equipment. Background Art

[0002] With the development of science and technology, electronic devices are used more and more widely. Electronic devices can be used to take pictures, watch videos, etc. Usually, electronic devices are provided with sound output components, and the sound output components are arranged on the frame of the electronic device, and the frame is provided with a sound output channel. However, the sound output channel of the sound output component needs to have a certain height in order to produce sound normally, which results in that the thickness of the electronic device is usually large, which is not conducive to the thinness of the electronic device. Utility Model Content

[0003] The purpose of the embodiments of the present application is to provide an electronic device that at least solves the problem that the sound channel of the sound output part needs to have a certain height to produce sound normally, which results in the thickness of the electronic device being usually thick and is not conducive to the thinness of the electronic device.

[0004] An embodiment of the present application provides an electronic device, the electronic device comprising: a frame and a sound output component;

[0005] The frame includes a frame and a mainboard cover, the mainboard cover is arranged inside the frame and connected to the frame, the mainboard cover is provided with a through hole, and the through hole is not connected to the edge of the mainboard cover;

[0006] The mainboard cover includes a first surface, the sound output component is arranged on the first surface, and the sound output component is opposite to the through hole. A sound output channel is arranged on the mainboard cover, and the sound output channel is connected to the through hole. The sound output channel and the through hole form a sound output channel of the sound output component.

[0007] In the embodiment of the present application, since a through hole is provided on the mainboard cover, and the through hole is not connected to the edge of the mainboard cover, the mainboard cover includes a first surface, and the sound output component is provided on the first surface, therefore, the sound output component can be positioned opposite to the through hole, so that the sound emitted by the sound output component can be transmitted to the through hole. Since a sound outlet channel is provided on the mainboard cover, and the sound outlet channel is connected to the through hole, once the sound emitted by the sound output component is transmitted to the through hole, the sound can be transmitted from the through hole to the sound outlet channel, so that the sound outlet channel and the through hole form a sound outlet channel of the sound output component, and the sound output component is positioned opposite to the through hole, so that the depth of the through hole is equivalent to a part of the height of the sound outlet channel, so that the sound output component can be close to the mainboard cover, so that the distance between the sound output component and the mainboard cover is reduced. That is, in the embodiment of the present application, a through hole is provided on the upper cover of the mainboard, and the through hole is opposite to the position of the sound output component, so that the through hole can be used as a part of the sound output channel of the sound output component, and the depth of the through hole can be used as a part of the height of the sound output channel, so that the distance between the sound output component and the upper cover of the mainboard can be closer, which is conducive to the slimness of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 One of the exploded views of an electronic device provided in an embodiment of the present application is shown;

[0009] Figure 2 A second exploded view of an electronic device provided in an embodiment of the present application is shown;

[0010] Figure 3 One of the cross-sectional views of an electronic device provided by an embodiment of the present application is shown;

[0011] Figure 4 A second cross-sectional view of an electronic device provided in an embodiment of the present application;

[0012] Figure 5 A schematic diagram showing a frequency response simulation curve of an electronic device provided in an embodiment of the present application;

[0013] Figure 6 A schematic diagram showing a sealing frame provided in an embodiment of the present application;

[0014] Figure 7 A schematic diagram showing a support member provided in an embodiment of the present application.

[0015] Reference numerals:

[0016] 10: frame; 11: frame; 12: mainboard cover; 111: through hole; 112: sound outlet; 1101: first surface; 1102: second surface; 20: sound outlet; 30: display screen; 40: sealing frame; 41: first adhesive layer; 42: second adhesive layer; 50: covering member; 60: supporting member; 61: adhesive layer; 100: adhesive member; L: gap. DETAILED DESCRIPTION

[0017] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0018] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0019] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0020] Before explaining the electronic device provided by the embodiment of the present application, the application background of the electronic device provided by the embodiment of the present application is first specifically explained: In the related art, the electronic device includes a frame, the frame includes a frame and a mainboard cover, the sound output component is arranged on the mainboard cover, and a sound outlet channel is arranged on the mainboard cover, and a gap of a certain height is required between the sound output component and the mainboard cover, and the gap is connected to the sound outlet channel to form a sound outlet channel. However, in order to ensure that the sound emitted by the sound output component can be transmitted normally to the outside of the electronic device, the gap between the sound output component and the mainboard cover needs to be larger, that is, the sound output component is far away from the mainboard cover to ensure that the sound outlet channel has a certain height, but this will make the thickness of the electronic device larger, which is not conducive to the thinness of the electronic device.

[0021] like Figures 1 to 7 As shown, the electronic device comprises: a frame 10 and a sound output component 20;

[0022] The frame 10 includes a frame 11 and a mainboard cover 12. The mainboard cover 12 is arranged inside the frame 11 and connected to the frame 11. A through hole 111 is arranged on the mainboard cover 12, and the through hole 111 is not connected to the edge of the mainboard cover 12. The mainboard cover 12 includes a first surface 1101. The sound output component 20 is arranged on the first surface 1101, and the sound output component 20 is opposite to the through hole 111. A sound outlet channel 112 is arranged on the mainboard cover 12, and the sound outlet channel 112 is connected to the through hole 111. The sound outlet channel 112 and the through hole 111 form a sound output channel of the sound output component 20.

[0023] In the embodiment of the present application, since a through hole 111 is provided on the mainboard cover 12, and the through hole 111 is not connected to the edge of the mainboard cover 12, the mainboard cover 12 includes a first surface 1101, and the sound output component 20 is provided on the first surface 1101. Therefore, the sound output component 20 can be positioned opposite to the through hole 111, so that the sound emitted by the sound output component 20 can be transmitted to the through hole 111. Since a sound outlet channel 112 is provided on the mainboard cover 12 and the sound outlet channel 112 is connected to the through hole 111, once the sound emitted by the sound output component 20 is transmitted to the through hole 111, the sound can be transmitted from the through hole 111 to the sound outlet channel 112, so that the sound outlet channel 112 and the through hole 111 form a sound output channel of the sound output component 20, and the sound output component 20 is opposite to the through hole 111, so that the depth of the through hole 111 is equivalent to a part of the height of the sound output channel, so that the sound output component 20 can be close to the mainboard cover 12, thereby reducing the distance between the sound output component 20 and the mainboard cover 12. That is, in the embodiment of the present application, by providing a through hole 111 on the mainboard cover 12, and the through hole 111 is positioned opposite to the sound output component 20, the through hole 111 can be used as a part of the sound output channel of the sound output component 20, and the depth of the through hole 111 can be used as a part of the height of the sound output channel, so that the distance between the sound output component 20 and the mainboard cover 12 can be closer, which is conducive to the slimness of the electronic device.

[0024] It should be noted that the through hole 111 on the mainboard cover 12 passes through the mainboard cover 12, and the sound output member 20 is opposite to the through hole 111, so that the sound output from the sound output member 20 can be transmitted to the through hole 111, and the through hole 111 is equivalent to a part of the sound output channel. The sound output member 20 has a sound output end, and the sound output end faces the through hole 111.

[0025] In addition, in the embodiment of the present application, the sound output component 20 can be fixed to the mainboard cover 12 by the adhesive component 100. With such a setting, when the sound output component 20 is installed on the mainboard cover 12, the sound output component 20 can be directly connected to the adhesive component 100, and then the adhesive component 100 is bonded to the mainboard cover 12, so that the sound output component 20 can be set more conveniently. In addition, the existence of the adhesive component 100 can also seal the gap between the sound output component 20 and the mainboard cover 12, so as to prevent the sound emitted by the sound output component 20 from being transmitted from the gap to other positions of the mainboard cover 12, causing the problem of sound leakage in the electronic device.

[0026] It should be noted that the adhesive 100 may be a double-sided adhesive tape, and of course, the adhesive 100 may also be other types, for example, the adhesive 100 is glue, and for another example, the adhesive 100 is solid glue. This embodiment of the application does not limit this.

[0027] In addition, in the embodiment of the present application, the sound output component 20 may include at least one of a speaker and an earpiece. The sound output component 20 may be only a speaker, of course, the sound output component 20 may also be only an earpiece, or the sound output component 20 may also be a combination of a speaker and an earpiece.

[0028] In addition, in some embodiments, the electronic device may further include a display screen 30, the mainboard cover 12 further includes a second surface 1102 opposite to the first surface 1101, the display screen 30 is installed on the mainboard cover 12, and the display screen 30 has a display surface and a back surface opposite to the display surface, the edge of the back surface of the display screen 30 is connected to the mainboard cover 12, and the second surface 1102 faces the back surface of the display screen 30; a sealing frame 40 is provided on the second surface 1102, and the sealing frame 40 is provided around the through hole 111, the sealing frame 40 is abutted against the back surface of the display screen 30, and the internal space of the sealing frame 40, the through hole 111 and the sound outlet 112 form a sound outlet channel of the sound output component 20.

[0029] Since a sealing frame 40 is provided on the second surface 1102 of the mainboard cover 12, and the sealing frame 40 is provided around the through hole 111, and the sealing frame 40 is abutted against the back of the display screen 30, it is equivalent to sealing the gap L between the edge of the through hole 111 and the back of the display screen 30 through the sealing frame 40, so that the space between the edge of the through hole 111 and the back of the display screen 30 forms a sealed space. Once the sound output component 20 makes a sound, the sound of the sound output component 20 can be transmitted to the through hole 111 and enter the interior of the sealing frame 40. The existence of the sealing frame 40 ensures that the sound will not be transmitted to other locations, thereby avoiding the problem of sound leakage in the electronic device. Furthermore, after the sound is transmitted to the through hole 111, the sound can be blocked by the back of the display screen 30, so that the sound is transmitted to the sound outlet 112, that is, the transmission path of the sound of the sound output member 20 is: through hole 111-inner space of the sealing frame 40-back of the display screen 30-through hole 111-sound outlet 112, so that the through hole 111 on the mainboard cover 12, the inner space of the sealing frame 40 and the sound outlet 112 form a sound outlet channel of the sound output member 20, so that the sound of the sound output member 20 is transmitted outward. That is, by providing the sealing frame 40, the problem of sound leakage in the electronic device can be avoided, and the sound transmission of the sound output member 20 is also facilitated. In addition, by providing the through hole 111 on the mainboard cover 12, and the sealing frame 40 is provided around the through hole 111 on the second surface 1102 of the mainboard cover 12, the through hole 111 and the inner space of the sealing frame 40 can become part of the sound outlet channel, so that the thickness of the electronic device can be reduced by the sum of the depth of the through hole 111 and the thickness of the sealing frame 40.

[0030] In addition, in the embodiment of the present application, the sealing frame 40 may include at least one of a sealing foam and a sealing rubber ring. The sealing frame 40 may be only a sealing foam, or only a sealing rubber ring, or a combination of the sealing foam and the sealing rubber ring, that is, the sealing foam and the sealing rubber ring are stacked.

[0031] When the sealing frame 40 is a sealing foam, the sealing foam has good sealing performance and is easy to bond, so it can be conveniently set on the second surface 1102 of the mainboard cover 12. When the sealing frame 40 is a sealing rubber ring, the cost of the sealing rubber ring is low, which can reduce the cost of the electronic device.

[0032] In addition, in some embodiments, the sealing foam has a first surface and a second surface relative to each other; a first adhesive layer 41 is provided on the first surface, and a second adhesive layer 42 is provided on the second surface; the first adhesive layer 41 is bonded to the second surface 1102 of the mainboard cover 12, and the second adhesive layer 42 is bonded to the back of the display screen 30; the bonding strength of the first adhesive layer 41 is greater than the bonding strength of the second adhesive layer 42.

[0033] Due to the bonding strength of the first adhesive layer 41 and the second adhesive layer 42, when the first adhesive layer 41 is bonded to the second surface 1102 of the mainboard cover 12, it can be ensured that the sealing foam is firmly bonded to the second surface 1102 of the mainboard cover 12, thereby avoiding the sealing foam from being separated from the second surface 1102 of the mainboard cover 12, which would cause sound leakage in the electronic device; when the second adhesive layer 42 is bonded to the back of the display screen 30, it can be ensured that when the electronic device is disassembled and the sealing foam is separated from the back of the display screen 30, it is easy to separate the sealing foam from the display screen 30, thereby facilitating the maintenance of the electronic device.

[0034] In addition, in some embodiments, the mainboard cover 12 may further include a second surface 1102 opposite to the first surface 1101 , and the second surface 1102 is provided with a covering member 50 , and the covering member 50 covers the through hole 111 .

[0035] Since the second surface 1102 is provided with a cover 50, and the cover 50 covers the through hole 111, it is equivalent to that the cover 50 will seal the through hole 111 on the second surface 1102 of the mainboard cover 12, so that once the sound output component 20 emits a sound, the sound of the sound output component 20 can be transmitted to the through hole 111, and the existence of the cover 50 ensures that the sound will not be transmitted to other positions of the second surface 1102 of the mainboard cover 12 after being transmitted to the through hole 111, thereby avoiding the problem of sound leakage in the electronic device. In addition, after the sound is transmitted to the through hole 111, the sound can be blocked by the cover 50, so that the sound is transmitted to the sound outlet 112, that is, the transmission path of the sound of the sound output component 20 is: through hole 111-sound outlet 112, so that the through hole 111 on the mainboard cover 12 and the sound outlet 112 form the sound outlet channel of the sound output component 20, so that the sound of the sound output component 20 is transmitted outward. That is, by providing the cover 50, the problem of sound leakage in the electronic device can be avoided, and the sound transmission of the sound output part 20 is also facilitated. In addition, by providing the through hole 111 on the mainboard cover 12, and the cover 50 covers the through hole 111 on the second surface 1102 of the mainboard cover 12, the through hole 111 can become a part of the sound output channel, so that the thickness of the electronic device can be reduced by the depth of the through hole 111.

[0036] It should be noted that the cover 50 can be bonded to the second surface 1102 of the mainboard cover 12 by adhesive, so that the cover 50 and the second surface 1102 of the mainboard cover 12 are sealed to avoid sound leakage.

[0037] In addition, in some embodiments, the electronic device may further include a display screen 30 and a support member 60; the display screen 30 is mounted on the mainboard cover 12, and the display screen 30 has a display surface and a back surface opposite to the display surface, the edge of the back surface of the display screen 30 is connected to the mainboard cover 12, and the second surface 1102 faces the back surface of the display screen 30; the support member 60 is located between the cover member 50 and the display screen 30, and the support member 60 is respectively abutted against the cover member 50 and the back surface of the display screen 30.

[0038] Since the support member 60 is located between the cover member 50 and the display screen 30, and the support member 60 abuts against the back of the cover member 50 and the display screen 30 respectively, the support member 60 supports the cover member 50, thereby preventing the sound of the sound output member 20 from being transmitted to the cover member 50, and the cover member 50 from vibrating, which causes the cover member 50 to be easily separated from the second surface 1102 of the mainboard cover 12. That is, by providing the support member 60, the cover member 50 can be supported, and the problem of the cover member 50 being easily separated from the mainboard cover 12 can be avoided.

[0039] It should be noted that the support member 60 may be foam. Of course, the support member 60 may also be other types, for example, the support member 60 is a rubber member. The specific type of the support member 60 is not limited in the embodiment of the present application.

[0040] In addition, in some embodiments, the support member 60 has a first supporting surface and a second supporting surface relative to each other, and an adhesive layer 61 is provided on the first supporting surface and the second supporting surface. The first supporting surface is connected to the covering member 50 through the adhesive layer 61, and the second supporting surface is connected to the back of the display screen 30 through the adhesive layer 61.

[0041] Since the adhesive layer 61 is provided on both the first supporting surface and the second supporting surface of the support member 60, when the cover member 50 is connected to the support member 60, the first supporting surface can be directly bonded to the cover member 50 through the adhesive layer 61, and when the cover member 50 is connected to the back of the display screen 30, the second supporting surface can be directly connected to the back of the display screen 30 through the adhesive layer 61. That is, by providing the adhesive layer 61 on both the first supporting surface and the second supporting surface, the support member 60 can be easily installed.

[0042] It should be noted that the adhesive layer 61 may be an adhesive layer formed by adhesive glue, and of course, the adhesive layer 61 may also be a double-sided adhesive tape. The specific type of the adhesive layer 61 is not limited in the embodiment of the present application.

[0043] In addition, in some embodiments, the electronic device may include a display screen 30, which is mounted on the mainboard cover 12, and the display screen 30 has a display surface and a back surface opposite to the display surface, and the back surface of the display screen 30 faces the mainboard cover 12; there is a gap L between the edge of the display screen 30 and the frame 11, and the gap L is connected to the sound outlet 112, so that the sound emitted by the sound output component 20 can be transmitted to the outside of the electronic device.

[0044] Since there is a gap L between the edge of the display screen 30 and the frame 11, and the gap L is connected to the sound outlet channel, once the sound outlet 20 makes a sound, the sound of the sound outlet 20 is transmitted to the through hole 111 on the mainboard cover 12, and then the sound is transmitted to the sound outlet channel 112 through the through hole 111, and the sound can be transmitted from the sound outlet channel 112, and then transmitted to the gap L, so that the gap L is transmitted to the outside of the electronic device, so that the user can hear the sound of the sound outlet 20. That is, by setting the gap L between the edge of the display screen 30 and the frame 11, it is convenient for the sound of the sound outlet 20 to be transmitted to the outside of the electronic device, and then it is convenient for the user to hear the sound of the sound outlet 20.

[0045] It should be noted that, in the embodiment of the present application, the display screen 30 may include a display surface, a back surface and a side surface. The display screen 30 is opposite to the back surface, and the side surface is located between the display screen 30 and the back surface. There is a gap L between the side surface of the display screen 30 and the frame 11, that is, the side surface of the display screen does not participate in the sealing, and the sound of the sound output component 20 can be transmitted to the outside of the electronic device through the gap L.

[0046] It should also be noted that in the embodiments of the present application, electronic devices include but are not limited to controllers, smart devices, terminal products and other devices, where smart devices are, for example, smart phones, smart TVs, smart speakers, smart robots, VR devices, AR devices, XR devices and other devices, and terminal products include personal computers, tablet computers and other products.

[0047] In addition, in the embodiment of the present application, a through hole 111 is provided on the mainboard cover 12 to form a part of the sound output channel of the sound output component 20, so that a frequency response simulation curve is obtained when the electronic device is subjected to frequency response simulation, such as Figure 5 As shown, it is a frequency response simulation curve of the electronic device. From the frequency response simulation curve, it can be seen that the frequency response of the electronic device is consistent with the frequency response of the solution without setting the through hole 111 on the mainboard cover 12, indicating that setting the through hole 111 on the mainboard cover 12 will not affect the frequency response of the electronic device.

[0048] In the embodiment of the present application, since a through hole 111 is provided on the mainboard cover 12, and the through hole 111 is not connected to the edge of the mainboard cover 12, the mainboard cover 12 includes a first surface 1101, and the sound output component 20 is provided on the first surface 1101. Therefore, the sound output component 20 can be positioned opposite to the through hole 111, so that the sound emitted by the sound output component 20 can be transmitted to the through hole 111. Since a sound outlet channel 112 is provided on the mainboard cover 12 and the sound outlet channel 112 is connected to the through hole 111, once the sound emitted by the sound output component 20 is transmitted to the through hole 111, the sound can be transmitted from the through hole 111 to the sound outlet channel 112, so that the sound outlet channel 112 and the through hole 111 form a sound output channel of the sound output component 20, and the sound output component 20 is opposite to the through hole 111, so that the depth of the through hole 111 is equivalent to a part of the height of the sound output channel, so that the sound output component 20 can be close to the mainboard cover 12, thereby reducing the distance between the sound output component 20 and the mainboard cover 12. That is, in the embodiment of the present application, by providing a through hole 111 on the mainboard cover 12, and the through hole 111 is positioned opposite to the sound output component 20, the through hole 111 can be used as a part of the sound output channel of the sound output component 20, and the depth of the through hole 111 can be used as a part of the height of the sound output channel, so that the distance between the sound output component 20 and the mainboard cover 12 can be closer, which is conducive to the slimness of the electronic device.

[0049] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0050] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: The electronic device comprises: a frame and a sound output component; The frame includes a frame and a mainboard cover, the mainboard cover is arranged inside the frame and connected to the frame, the mainboard cover is provided with a through hole, and the through hole is not connected to the edge of the mainboard cover; The mainboard cover includes a first surface, the sound output component is arranged on the first surface, and the sound output component is opposite to the through hole. A sound output channel is arranged on the mainboard cover, and the sound output channel is connected to the through hole. The sound output channel and the through hole form a sound output channel of the sound output component.

2. The electronic device according to claim 1, characterized in that: The electronic device further includes a display screen, the mainboard cover further includes a second surface opposite to the first surface, the display screen is mounted on the mainboard cover, and the display screen has a display surface and a back surface opposite to the display surface, an edge of the back surface of the display screen is connected to the mainboard cover, and the second surface faces the back surface of the display screen; A sealing frame is arranged on the second surface and is arranged around the through hole. The sealing frame abuts against the back of the display screen. The inner space of the sealing frame, the through hole and the sound outlet channel form a sound outlet channel of the sound outlet component.

3. The electronic device according to claim 2, characterized in that: The sealing frame includes at least one of a sealing foam and a sealing rubber ring.

4. The electronic device according to claim 3, characterized in that: The sealing foam has a first surface and a second surface opposite to each other; The first surface is provided with a first adhesive layer, the second surface is provided with a second adhesive layer, the first adhesive layer is bonded to the second surface of the mainboard cover, and the second adhesive layer is bonded to the back surface of the display screen; The bonding strength of the first adhesive layer is greater than the bonding strength of the second adhesive layer.

5. The electronic device according to claim 1, characterized in that: The mainboard upper cover further includes a second surface opposite to the first surface, the second surface is provided with a covering member, and the covering member covers the through hole.

6. The electronic device according to claim 5, characterized in that: The electronic device also includes a display screen and a support member; The display screen is mounted on the mainboard cover, and the display screen has a display surface and a back surface opposite to the display surface, the edge of the back surface of the display screen is connected to the mainboard cover, and the second surface faces the back surface of the display screen; The support member is located between the cover member and the display screen, and the support member abuts against the cover member and the back surface of the display screen respectively.

7. The electronic device according to claim 6, characterized in that: The support member has a first support surface and a second support surface opposite to each other, and an adhesive layer is provided on the first support surface and the second support surface. The first support surface is connected to the covering member through the adhesive layer, and the second support surface is connected to the back of the display screen through the adhesive layer.

8. The electronic device according to claim 1, characterized in that: The electronic device comprises a display screen, which is mounted on the mainboard cover and has a display surface and a back surface opposite to the display surface, and the back surface of the display screen faces the mainboard cover; There is a gap between the edge of the display screen and the frame, and the gap is connected to the sound outlet, so that the sound emitted by the sound output component can be transmitted to the outside of the electronic device.

9. The electronic device according to any one of claims 1 to 8, characterized in that: The sound output component is fixed to the mainboard upper cover via an adhesive component.

10. The electronic device according to any one of claims 1 to 8, characterized in that: The sound output component includes at least one of a speaker and an earpiece.

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