Silicon wafer flat super pre-washing machine

Abstract

The utility model discloses a silicon wafer flat super pre-washing machine which comprises a bottom plate, a hydraulic cylinder is fixedly connected to the edge, close to the right side, of the upper surface of the bottom plate, the output end of the hydraulic cylinder is fixedly connected with a hydraulic rod, the hydraulic rod is fixedly connected with a moving mechanism away from the hydraulic cylinder, the upper surface of the bottom plate is fixedly connected with a supporting plate, and the supporting plate is in an L shape. A first fan is fixedly connected to the lower surface of the horizontal part of the supporting plate and located above the moving mechanism, a switch base is fixedly connected to the position, close to the left side edge, of the upper surface of the bottom plate, and a first control switch and a second control switch are arranged on the switch base. The moving mechanism comprises a moving base, a vacuum hole, a motor, a cleaning column, supporting legs, rolling wheels, a rotating shaft, a second fan, a ventilation pipe and an air pump. According to the structure, the hydraulic cylinder, the hydraulic rod, the moving mechanism and the second fan are arranged, so that dust on cut silicon wafers can be quickly cleaned, and the machining quality of subsequent procedures is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer production, in particular to a silicon wafer flattening and pre-cleaning machine. Background Art

[0002] Semiconductor materials are the base for chip manufacturing. There are many materials for making semiconductors. At present, the semiconductor material pattern is mainly silicon-based and compound materials coexisting. Common semiconductor materials include silicon, gallium arsenide, gallium nitride and silicon carbide.

[0003] During the processing of silicon wafers, they need to be cut to meet production needs. However, powder and debris generated during the cutting process will remain on the cut silicon wafers. The waste debris on the silicon wafers will affect the quality and yield of the silicon wafer products in subsequent production. Utility Model Content

[0004] The utility model provides a silicon wafer flattening and pre-cleaning machine, which can quickly clean the powder and debris on the cut silicon wafers and ensure the processing quality of the subsequent processes.

[0005] In order to achieve the above-mentioned purpose, a silicon wafer flat-superior pre-washing machine is provided, comprising a bottom plate, the upper surface of the bottom plate is fixedly connected to a hydraulic cylinder near the right edge, the output end of the hydraulic cylinder is fixedly connected to a hydraulic rod, the hydraulic rod is fixedly connected to a moving mechanism away from the hydraulic cylinder, the upper surface of the bottom plate is fixedly connected to a support plate, the support plate is L-shaped, the lower surface of the horizontal part of the support plate is fixedly connected to a first fan, the first fan is above the moving mechanism, the upper surface of the bottom plate is fixedly connected to a switch base near the left edge, and the switch base is provided with a first control switch and a second control switch. The hydraulic cylinder and the hydraulic rod are provided to facilitate the moving mechanism to move back and forth, the moving mechanism is provided to facilitate the cleaning of the lower surface of the silicon wafer and fix the silicon wafer, the first fan is provided to facilitate the blowing off of the powder and debris on the upper surface and around the silicon wafer, and the first control switch and the second control switch are provided to facilitate the control of the hydraulic cylinder and the air pump.

[0006] According to the silicon wafer flattening and pre-washing machine, the mobile mechanism includes a mobile base, a vacuum hole, a motor, a cleaning column, legs, rollers, a rotating shaft, a second fan, a ventilation pipe, and an air pump. The mobile base is fixedly connected to the hydraulic rod, and a vertical through groove is provided on the upper surface of the mobile base. The groove of the mobile base passes through the front side surface of the mobile base, and the vacuum hole is provided on the mobile base near the hydraulic rod.

[0007] According to the silicon wafer flat-super pre-cleaning machine, the motor is fixedly connected to the rear surface of the mobile base, the rotating shaft is fixedly connected to the output end of the motor, the rotating shaft passes through the mobile base, and the rotating shaft is in the groove of the mobile base. The motor is provided to facilitate the rotation of the rotating shaft and the cleaning column.

[0008] According to the silicon wafer flat-super pre-washing machine, the cleaning column is fixedly connected to the cylindrical surface of the rotating shaft, a dust-free cloth is arranged on the surface of the cleaning column, the top height of the cleaning column coincides with the upper surface of the movable base, the bottom height of the cleaning column is lower than the lower surface of the movable base, and the second fan is fixedly connected to the lower surface of the movable base near the cleaning column. The cleaning column is arranged to facilitate the cleaning of the powder and debris on the lower surface of the silicon wafer when the lower surface of the silicon wafer passes through the top of the cleaning column, and the second fan is arranged to facilitate the blowing off of the powder and debris on the cleaning column.

[0009] According to the silicon wafer flattening and pre-cleaning machine, the air pump is fixedly connected to the lower surface of the mobile base, the vent pipe is fixedly connected to the output end of the air pump, and the end of the vent pipe away from the air pump is fixedly connected to the cylindrical surface of the vacuum hole. The air pump and the vent pipe are provided to facilitate reducing the pressure in the vacuum hole, and the silicon wafer is fixed to the mobile base by using the air pressure difference.

[0010] According to the silicon wafer flattening and pre-cleaning machine, the legs are fixedly connected to the lower surface of the mobile base, the rollers are rotatably connected to the bottom of the legs, and the legs and rollers are provided in plurality to facilitate reducing the friction resistance encountered by the mobile mechanism during movement.

[0011] According to the silicon wafer flattening and pre-cleaning machine, a groove is provided on the upper surface of the bottom plate near the left edge, and a magnet block is fixedly connected to the bottom surface of the groove of the bottom plate, and the plane where the upper surface of the magnet block is located coincides with the plane where the upper surface of the bottom plate is located. The magnet block is provided to facilitate the adsorption of the product placement box, thereby fixing the position of the product placement box.

[0012] According to the silicon wafer flattening and pre-cleaning machine, a product placement box is arranged on the upper surface of the bottom plate, the lower surface of the product placement box contacts the magnet block, the lower surface of the product placement box is provided with an iron sheet, the upper surface of the product placement box is provided with a box cover, and the upper surface of the box cover is fixedly connected with a handle. The product placement box is arranged to facilitate the placement of cleaned silicon wafers.

[0013] The beneficial effects of the utility model include: by arranging the hydraulic cylinder, the hydraulic rod, the moving mechanism and the second fan, the powder and chips on the cut silicon wafers can be cleaned quickly, thereby ensuring the processing quality of the subsequent processes.

[0014] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The utility model is further described below in conjunction with the accompanying drawings and embodiments;

[0016] Figure 1 This is a schematic diagram of the overall structure of a silicon wafer flattening and pre-cleaning machine according to the utility model;

[0017] Figure 2 This is a schematic cross-sectional structural diagram of the installation position of a magnet block of a silicon wafer flattening and pre-cleaning machine of the utility model;

[0018] Figure 3 This is a schematic diagram of the structure of the moving mechanism of a silicon wafer flattening and pre-cleaning machine of the utility model;

[0019] Figure 4 The utility model is a schematic diagram of the bottom structure of the moving mechanism of a silicon wafer flattening and pre-cleaning machine.

[0020] Legend:

[0021] 1. Bottom plate; 2. Moving mechanism; 3. Hydraulic rod; 4. Hydraulic cylinder; 5. Switch base; 6. First control switch; 7. Second control switch; 8. First fan; 9. Support plate; 10. Product placement box; 11. Box cover; 12. Handle; 13. Magnet block; 201. Moving base; 202. Vacuum hole; 203. Motor; 204. Cleaning column; 205. Support leg; 206. Roller; 207. Rotating shaft; 208. Second fan; 209. Ventilation pipe; 210. Air pump. DETAILED DESCRIPTION

[0022] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0023] Reference Figure 1-4The present utility model embodiment is a silicon wafer flat super pre-washing machine, which includes a bottom plate 1, the upper surface of the bottom plate 1 is fixedly connected to a hydraulic cylinder 4 near the right edge, the output end of the hydraulic cylinder 4 is fixedly connected to a hydraulic rod 3, the hydraulic rod 3 is fixedly connected to a moving mechanism 2 away from the hydraulic cylinder 4, the upper surface of the bottom plate 1 is fixedly connected to a support plate 9, the support plate 9 is L-shaped, the lower surface of the horizontal part of the support plate 9 is fixedly connected to a first fan 8, the first fan 8 is above the moving mechanism 2, the upper surface of the bottom plate 1 is fixedly connected to a switch base 5 near the left edge, and the switch base 5 is provided with a first control switch 6 and a second control switch 7. The first control switch 6 controls the operation of the hydraulic cylinder 4, the second control switch 7 controls the operation of the air pump 210, and the first fan 8 is always in an on state during the operation of the equipment.

[0024] The mobile mechanism 2 includes a mobile base 201, a vacuum hole 202, a motor 203, a cleaning column 204, a leg 205, a roller 206, a rotating shaft 207, a second fan 208, a ventilation pipe 209, and an air pump 210. The mobile base 201 is fixedly connected to the hydraulic rod 3. A vertical through groove is provided on the upper surface of the mobile base 201. The groove of the mobile base 201 passes through the front side surface of the mobile base 201. The vacuum hole 202 is provided on the mobile base 201 near the hydraulic rod 3.

[0025] A groove is provided on the upper surface of the bottom plate 1 near the left edge, and the bottom surface of the groove of the bottom plate 1 is fixedly connected to a magnet block 13, and the plane where the upper surface of the magnet block 13 is located coincides with the plane where the upper surface of the bottom plate 1 is located. A product placement box 10 is provided on the upper surface of the bottom plate 1, and the lower surface of the product placement box 10 is in contact with the magnet block 13. An iron sheet is provided on the lower surface of the product placement box 10, and a box cover 11 is provided on the upper surface of the product placement box 10, and a handle 12 is fixedly connected to the upper surface of the box cover 11. The cleaned silicon wafers need to be placed in the product placement box 10, and a new product placement box 10 needs to be replaced when the product placement box 10 is full.

[0026] The motor 203 is fixedly connected to the rear surface of the mobile base 201, the rotating shaft 207 is fixedly connected to the output end of the motor 203, the rotating shaft 207 passes through the mobile base 201, and the rotating shaft 207 is in the groove of the mobile base 201. The cleaning column 204 is fixedly connected to the cylindrical surface of the rotating shaft 207. A dust-free cloth is arranged on the surface of the cleaning column 204. The top height of the cleaning column 204 coincides with the upper surface of the mobile base 201, and the bottom height of the cleaning column 204 is lower than the lower surface of the mobile base 201. The second fan 208 is fixedly connected to the lower surface of the mobile base 201 near the cleaning column 204. The dust-free cloth needs to be replaced regularly. The length of the cleaning column 204 is greater than the length of the silicon wafer. The direction of rotation of the cleaning column 204 is opposite to the direction of movement of the silicon wafer. The motor 203 and the second fan 208 are always in the on state during the operation of the device.

[0027] The air pump 210 is fixedly connected to the lower surface of the mobile base 201, the ventilation pipe 209 is fixedly connected to the output end of the air pump 210, the end of the ventilation pipe 209 away from the air pump 210 is fixedly connected to the cylindrical surface of the vacuum hole 202, the support leg 205 is fixedly connected to the lower surface of the mobile base 201, and the roller 206 is rotatably connected to the bottom of the support leg 205, and the number of the support leg 205 and the roller 206 is multiple.

[0028] Working principle: Place the silicon wafer on the left edge of the mobile base 201 and push it to the right. When the silicon wafer passes through the top of the cleaning column 204, the cleaning column 204 will wipe off the powder on the lower surface of the silicon wafer. In this process, the powder remaining on the cleaning column 204 is blown away by the wind blown by the second fan 208 below. When the silicon wafer completely passes through the cleaning column 204 and reaches the top of the vacuum hole 202, the air pump 210 is controlled by the second control switch 7 to work. The air pump 210 extracts the gas in the vacuum hole 202 to reduce its internal pressure. Under the action of the pressure difference, the outside The air pressure will press the silicon wafer against the upper surface of the movable base 201, and then the first control switch 6 will be used to control the hydraulic cylinder 4 to move the movable base 201 to directly below the first fan 8. At this time, the powder and debris on the upper surface and around the silicon wafer will be blown off, thereby completing the cleaning of the silicon wafer. Then the first control switch 6 will be used to control the hydraulic cylinder 4 to move the movable base 201 to its original position, and then the second control switch 7 will be used to control the air pump 210 to release the vacuum hole 202, so that the vacuum hole 202 is restored, and then the cleaned silicon wafer is removed and placed in the product placement box 10.

[0029] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A silicon wafer flattening and pre-cleaning machine, characterized in that: The invention comprises a bottom plate (1), wherein the upper surface of the bottom plate (1) is fixedly connected to a hydraulic cylinder (4) near the right edge, the output end of the hydraulic cylinder (4) is fixedly connected to a hydraulic rod (3), and the hydraulic rod (3) is fixedly connected to a moving mechanism (2) away from the hydraulic cylinder (4); the upper surface of the bottom plate (1) is fixedly connected to a support plate (9), the support plate (9) is L-shaped, and the lower surface of the horizontal part of the support plate (9) is fixedly connected to a first fan (8), and the first fan (8) is above the moving mechanism (2); the upper surface of the bottom plate (1) is fixedly connected to a switch base (5) near the left edge, and the switch base (5) is provided with a first control switch (6) and a second control switch (7).

2. The silicon wafer flattening and pre-cleaning machine according to claim 1, characterized in that: The mobile mechanism (2) comprises a mobile base (201), a vacuum hole (202), a motor (203), a cleaning column (204), a leg (205), a roller (206), a rotating shaft (207), a second fan (208), a ventilation pipe (209), and an air pump (210); the mobile base (201) is fixedly connected to the hydraulic rod (3); a vertically penetrating groove is provided on the upper surface of the mobile base (201); the groove of the mobile base (201) penetrates the front side surface of the mobile base (201); and the vacuum hole (202) is provided on the mobile base (201) near the hydraulic rod (3).

3. A silicon wafer flattening and pre-cleaning machine according to claim 2, characterized in that: The motor (203) is fixedly connected to the rear surface of the mobile base (201), the rotating shaft (207) is fixedly connected to the output end of the motor (203), the rotating shaft (207) passes through the mobile base (201), and the rotating shaft (207) is in a groove of the mobile base (201).

4. The silicon wafer flattening and pre-cleaning machine according to claim 2, characterized in that: The cleaning column (204) is fixedly connected to the cylindrical surface of the rotating shaft (207); a dust-free cloth is arranged on the surface of the cleaning column (204); the top end of the cleaning column (204) coincides with the upper surface of the movable base (201); the bottom end of the cleaning column (204) is lower than the lower surface of the movable base (201); and the second fan (208) is fixedly connected to the lower surface of the movable base (201) near the cleaning column (204).

5. The silicon wafer flattening and pre-cleaning machine according to claim 2, characterized in that: The air pump (210) is fixedly connected to the lower surface of the mobile base (201), the ventilation pipe (209) is fixedly connected to the output end of the air pump (210), and one end of the ventilation pipe (209) away from the air pump (210) is fixedly connected to the cylindrical surface of the vacuum hole (202).

6. The silicon wafer flattening and pre-cleaning machine according to claim 2, characterized in that: The supporting leg (205) is fixedly connected to the lower surface of the mobile base (201), and the roller (206) is rotatably connected to the bottom of the supporting leg (205). There are a plurality of supporting legs (205) and rollers (206).

7. The silicon wafer flattening and pre-cleaning machine according to claim 1, characterized in that: A groove is provided on the upper surface of the bottom plate (1) near the left edge, the inner bottom surface of the groove of the bottom plate (1) is fixedly connected to a magnet block (13), and the plane where the upper surface of the magnet block (13) is located coincides with the plane where the upper surface of the bottom plate (1) is located.

8. The silicon wafer flattening and pre-cleaning machine according to claim 1, characterized in that: A product placement box (10) is arranged on the upper surface of the bottom plate (1), the lower surface of the product placement box (10) is in contact with the magnet block (13), the lower surface of the product placement box (10) is provided with an iron sheet, the upper surface of the product placement box (10) is provided with a box cover (11), and the upper surface of the box cover (11) is fixedly connected to a handle (12).

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