High-voltage-impact-resistant electronic tag protection device
By installing a high-pressure resistant alloy protective cover up and down at the electronic tag chip position to form a stable alloy cover body, the problem of electronic tag chips being fragile and unable to work normally in high-pressure environments in the prior art is solved, efficient protection of labels is achieved, and waste is reduced.
Patent Information
- Application Number
- CN202420669403.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-02
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2034-04-02
AI Technical Summary
Existing electronic tag chips are fragile and easily damaged by impacts under high pressure environments, resulting in misalignment and looseness of the tag chips and antennas, resulting in poor contact, and inability to read food information, resulting in waste.
An electronic tag protection device that resists high-pressure impact is designed. By installing a high-pressure resistant alloy protective cover up and down at the chip position, a complete hollow-shaped protective body is formed, covering the chip and conductive adhesive layer, and locked by a press-fit latching buckle to form a stable alloy cover body.
The device can effectively protect the chip and conductive adhesive layer, withstand the impact of high pressure, greatly improve the environmental applicability of the label, reduce waste, and ensure the readability of food information.
Smart Images
Figure CN222653410U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic tag protection, in particular to an electronic tag protection device capable of resisting high-voltage impact. Background Art
[0002] As a way of product identification, electronic tags are widely used in the field of food traceability and anti-counterfeiting. As the most important component of the finished product, they are often accompanied by different types of products and require higher pressure in the surrounding environment and other operating requirements. For example, in the anti-counterfeiting traceability of bottled wine, the electronic tag is attached to the outside of the bottle or prevented on the top of the bottle cap. During the lamination, packaging, transportation, warehousing, sales, and consumption of bottled wine, the product is handled, loaded and unloaded, moved, put on and off the shelves, etc., and collisions, squeezing, falling, etc. may occur, and the label chip may be damaged by impact. For example, in the production process of special foods such as tea cakes, the electronic tag will be placed in the middle of the tea leaves and enter the steaming, pressing, drying and other operations with the tea leaves. Among them, the pressing is generally carried out by stone mill or machine pressing. The pressure of the machine pressing can reach tens of tons. In the drying process, the tea cake will shrink due to long-term baking.
[0003] At present, the main component of the tag chip is single crystal silicon, which is generally about 0.5 mm thick. It is made of very fragile glass material and has a very high risk of being crushed. It will cause the tag chip and the antenna to be misaligned, loose, and other poor contact phenomena. When the electronic tag is damaged, the information of foods such as bottled wine and tea cakes cannot be read. The product needs to be sent back for re-production or treated as a defective product, resulting in waste. Therefore, an electronic tag protection device that can resist high-voltage shock is proposed. Summary of the invention
[0004] In view of the shortcomings of the prior art, the utility model provides an electronic tag protection device that is resistant to high-voltage impact, which has the advantages of improving the protection effect of the electronic tag and reducing waste, and solves the problem of poor contact such as misalignment and looseness between the tag chip and the antenna. When the electronic tag is damaged, the information of food such as bottled wine and tea cakes cannot be read, and the product needs to be sent back for re-production or treated as a defective product, resulting in waste.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an electronic tag protection device resistant to high-voltage impact, comprising a tag substrate and a chip, wherein the outer wall of the chip is provided with a protection mechanism;
[0006] The protection mechanism includes a conductive adhesive layer bonded to the bottom of the chip, a tag antenna is bonded to the bottom of the conductive adhesive layer, an alloy protective upper cover is fixedly installed on the outer peripheral wall of the tag antenna, two protective cover upper locking buckles are fixedly installed on the outer peripheral wall of the tag antenna, an alloy protective lower cover is fixedly installed on the outer peripheral wall of the tag substrate, and two protective cover lower locking buckles are fixedly installed on the outer peripheral wall of the tag substrate.
[0007] Furthermore, two first mounting grooves and two second mounting grooves are respectively opened on opposite sides of the alloy protection upper cover and the alloy protection lower cover, and the locking buckle on the protection cover and the alloy protection lower cover are respectively clamped in the inside of the first mounting groove and the second mounting groove and are adapted in size.
[0008] Furthermore, the alloy protection upper cover and the alloy protection lower cover are connected to each other and form an alloy cover body, and the chip and the conductive adhesive layer are located inside the alloy cover body.
[0009] Furthermore, two adjacent upper locking buckles of the protective cover and lower locking buckles of the protective cover are clamped with each other, and the volume of the upper locking buckle of the protective cover is larger than the volume of the lower locking buckle of the protective cover.
[0010] Furthermore, the tag substrate and the tag antenna both penetrate the interior of the alloy cover and extend to the left and right sides.
[0011] Furthermore, the chip is located above the label substrate.
[0012] Compared with the prior art, the technical solution of this application has the following beneficial effects:
[0013] The electronic tag protection device resistant to high-voltage impact forms a complete hollow protection body by respectively providing high-voltage alloy protection covers above and below the chip position of the electronic tag, and only covers the chip and the conductive adhesive layer inside the alloy cover body. The upper and lower parts have press-fit locks, which form a stable alloy cover body after being locked, and provide solid protection for the chip and the conductive adhesive layer, and can withstand high-pressure impact, thereby greatly improving the environmental applicability of the tag. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a schematic diagram of the structure of the utility model;
[0015] Figure 2 This is a schematic diagram of the connection structure between the tag antenna and the chip of the utility model.
[0016] In the figure: 1. Tag substrate; 2. Tag antenna; 3. Chip; 4. Conductive adhesive layer; 5. Alloy protective upper cover; 6. Protective cover upper locking buckle; 7. Alloy protective lower cover; 8. Protective cover lower locking buckle. DETAILED DESCRIPTION
[0017] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0018] See also Figure 1-2 In this embodiment, an electronic tag protection device resistant to high-voltage impact includes a tag substrate 1 and a chip 3, and an outer wall of the chip 3 is provided with a protection mechanism.
[0019] The chip 3 is located above the label substrate 1 .
[0020] The protective mechanism includes a conductive adhesive layer 4 bonded to the bottom of the chip 3, a tag antenna 2 is bonded to the bottom of the conductive adhesive layer 4, the tag substrate 1 and the tag antenna 2 both penetrate the interior of the alloy cover and extend to the left and right sides, an alloy protective upper cover 5 is fixedly installed on the outer peripheral wall of the tag antenna 2, two protective cover upper locking buckles 6 are fixedly installed on the outer peripheral wall of the tag antenna 2, an alloy protective lower cover 7 is fixedly installed on the outer peripheral wall of the tag substrate 1, the alloy protective upper cover 5 and the alloy protective lower cover 7 are connected to each other and form an alloy cover.
[0021] The chip 3 and the conductive adhesive layer 4 are located inside the alloy cover body, and two first mounting grooves and a second mounting groove are respectively opened on the opposite sides of the alloy protective upper cover 5 and the alloy protective lower cover 7. The upper locking buckle 6 of the protective cover and the lower locking buckle 7 of the alloy protective cover are respectively clamped in the inside of the first mounting groove and the second mounting groove and are adapted in size. Two adjacent upper locking buckles 6 of the protective cover and lower locking buckles 8 of the protective cover are clamped with each other, and the volume of the upper locking buckle 6 of the protective cover is larger than the volume of the lower locking buckle 8 of the protective cover, and two lower locking buckles 8 of the protective cover are fixedly installed on the outer peripheral wall of the label substrate 1.
[0022] In this embodiment, the compressive strength of the alloy cover is 30 tons / square.
[0023] The working principle of the above embodiment is:
[0024] First, the conductive adhesive layer 4 is bonded to the outer peripheral wall of the tag antenna 2, and then the chip 3 is bonded to the top of the conductive adhesive layer 4. At this time, after the tag substrate 1 is attached to the tag antenna 2, the alloy protective upper cover 5 and the alloy protective lower cover 7 are attached to each other, and finally the protective cover upper locking buckle 6 and the protective cover lower locking buckle 8 are locked with each other. At this time, the chip 3 and the conductive adhesive layer 4 are firmly protected and can withstand the impact of high pressure, which greatly improves the environmental applicability of the label.
[0025] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.
[0026] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. An electronic tag protection device resistant to high-voltage shock, comprising a tag substrate (1) and a chip (3), characterized in that: The outer wall of the chip (3) is provided with a protective mechanism; The protective mechanism comprises a conductive adhesive layer (4) bonded to the bottom of the chip (3), a tag antenna (2) bonded to the bottom of the conductive adhesive layer (4), an alloy protective upper cover (5) fixedly mounted on the outer peripheral wall of the tag antenna (2), two protective cover upper locking buckles (6) fixedly mounted on the outer peripheral wall of the tag antenna (2), an alloy protective lower cover (7) fixedly mounted on the outer peripheral wall of the tag substrate (1), and two protective cover lower locking buckles (8) fixedly mounted on the outer peripheral wall of the tag substrate (1).
2. The electronic tag protection device resistant to high voltage shock according to claim 1 is characterized in that: Two first mounting grooves and two second mounting grooves are respectively provided on opposite sides of the alloy protection upper cover (5) and the alloy protection lower cover (7), and the protection cover upper locking buckle (6) and the alloy protection lower cover (7) are respectively snapped into the inside of the first mounting groove and the second mounting groove and are of matching size.
3. The electronic tag protection device resistant to high voltage shock according to claim 1 is characterized in that: The alloy protection upper cover (5) and the alloy protection lower cover (7) are connected to each other and form an alloy cover body, and the chip (3) and the conductive adhesive layer (4) are located inside the alloy cover body.
4. The electronic tag protection device resistant to high voltage shock according to claim 1 is characterized in that: Two adjacent upper locking buckles (6) and lower locking buckles (8) of the protective cover are mutually clamped, and the volume of the upper locking buckle (6) of the protective cover is larger than the volume of the lower locking buckle (8) of the protective cover.
5. The electronic tag protection device resistant to high voltage shock according to claim 3 is characterized in that: The tag substrate (1) and the tag antenna (2) both penetrate the interior of the alloy cover and extend to the left and right sides.
6. The electronic tag protection device resistant to high voltage shock according to claim 1, characterized in that: The chip (3) is located above the label substrate (1).