Heat-conducting buffer adhesive tape

Abstract

The utility model discloses a heat-conducting buffer adhesive tape which comprises one or more adhesive tape main bodies, and each adhesive tape main body is provided with a combined splicing structure; the adhesive tape main body is also provided with a heat dissipation structure, and the heat dissipation structure is provided with a temperature discoloration coating and a buffer structure; an adhesive layer is also arranged at the bottom of the adhesive tape main body; the combined splicing structure comprises a first splicing structure and a second splicing structure. By arranging the first splicing structure and the second splicing structure, the two adhesive tape bodies can be quickly connected or detached according to requirements, the operation is simple and quick, and the heat-conducting buffer adhesive tape with different widths is formed, so that the heat-conducting buffer adhesive tape can be used for wrapping articles with different width specifications, the applicability is improved, and the production cost is reduced. The utilization rate of the heat-conducting buffer adhesive tape is improved, the cost and waste are reduced, and the environmental pollution is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of adhesive tapes, in particular to a thermally conductive buffer adhesive tape. Background Art

[0002] At present, flame retardant tapes are used for bonding, sealing and repairing. They are widely used in refrigerators, air conditioners, automobiles, petrochemicals, bridges, hotels, electronics and other industries. They are used for coating, sealing, etc. and are easy to use. However, with the development of modern industrial technology and material technology, flame retardant tapes with a single structure cannot meet the high requirements of high temperature, flame retardancy and strength when used in specific applications. In response to the above problems, people invented patent number: CN201921053533.0, which discloses a reinforced shielding flame retardant tape. By setting a waterproof layer, it can effectively prevent liquid accumulation and play a role in fire prevention and flame retardancy. The reinforcement layer is not easy to be broken after use, and the flame retardant effect is good and the service life is extended. The nanoparticles have strong adhesion, high temperature resistance, anti-fouling and dustproof, aging resistance, fire prevention and other functions. However, the tape still has the following problems: 1. The width of existing tapes is mostly fixed. When the width needs to be adjusted, it is often required to cut and process. It is impossible to quickly combine and increase or decrease the width size in time according to the needs, which increases the customization cost, and causes waste and pollution; 2. The functionality is single and there is no prompt function, which cannot meet the needs of existing tapes. Utility Model Content

[0003] The utility model aims to provide a thermally conductive buffer tape in view of the current technical deficiencies, and aims to solve the technical problem that the tape in the prior art has a single functionality and cannot quickly adjust the wrapping width according to demand.

[0004] The technical solution adopted by the utility model to achieve the above-mentioned purpose is:

[0005] A thermally conductive buffer tape is wound on a reel. The thermally conductive buffer tape comprises one or more tape bodies. The tape bodies are all provided with a combined splicing structure. The tape bodies are also provided with a heat dissipation structure. The heat dissipation structure is provided with a temperature-changing coating and a buffer structure. The bottom of the tape body is also provided with an adhesive layer.

[0006] As a further improvement, the combined splicing structure includes a first splicing structure and a second splicing structure, the first splicing structure is arranged on one side of the tape body, and the second splicing structure is arranged on the other side of the tape body, and the first splicing structure is used to be combined and connected with the second splicing structure of another tape body to form a thermally conductive buffer tape of different widths.

[0007] As a further improvement, the first splicing structure includes a strip-shaped insertion groove, a clamping groove is provided on one side of the strip-shaped insertion groove, and a notch is provided on the other side of the strip-shaped insertion groove.

[0008] As a further improvement, the second splicing structure includes a strip-shaped protrusion, and a clamping block is provided on the outer side of the strip-shaped protrusion, and the clamping block is inserted and connected with the clamping slot in cooperation.

[0009] As a further improvement, the tape body is provided with a plurality of through holes, the heat dissipation structure includes a contact layer, a connecting layer and a thermal conductive layer, the contact layer is arranged at the bottom of the tape body, the thermal conductive layer is arranged at the top of the tape body, the connecting layer is composed of a plurality of connecting columns, the plurality of connecting columns are respectively arranged in the through holes, and the two ends of the connecting columns are respectively connected to the contact layer and the thermal conductive layer.

[0010] As a further improvement, the temperature-chromic coating is arranged on the outer surfaces of the contact layer, the connection layer and the heat-conducting layer; the thickness of the temperature-chromic coating is 0.2 μm-3 μm.

[0011] As a further improvement, the buffer structure includes an arc surface and a cavity, the arc surface is arranged on the top of the heat-conducting layer, and the cavity is arranged in the heat-conducting layer.

[0012] As a further improvement, the adhesive layer includes two adhesive strips, and the adhesive strips are arranged on both sides of the contact layer in a mirror-image manner; the adhesive strips each include a strong adhesive part and a weak adhesive part, the strong adhesive part includes a first stripe area and a second stripe area, the weak adhesive part includes a first glue dot part and a second glue dot part, the first glue dot part is arranged on the inner bottom surface of the edge of the tape body, the first stripe area is arranged on one side of the first glue dot part, the second glue dot part is arranged on the other side of the first stripe area, and the second stripe area is arranged between the second glue dot part and the contact layer.

[0013] As a further improvement, the width of the first stripe area is smaller than the width of the second stripe area, the width of the first glue dot part is smaller than the width of the second glue dot part, the bottom surfaces of the first stripe area and the second stripe area, and the first stripe area and the second stripe area are parallel to the bottom of the contact layer; and a release layer is provided at the bottom of the adhesive layer.

[0014] As a further improvement, the contact layer, the connection layer and the heat-conducting layer are all heat-conducting silicone layers.

[0015] Compared with the prior art, the above one or more technical solutions in the thermally conductive buffer tape provided in the embodiment of the utility model have at least one of the following technical effects:

[0016] 1. The utility model can quickly connect or disassemble the two tape bodies according to the needs by setting the first splicing structure and the second splicing structure. The operation is simple and fast, and no cutting action is required, so as to ensure the integrity of the tape body, thereby forming thermally conductive buffer tapes of different widths, so that the thermally conductive buffer tape can be used for wrapping articles of different width specifications, thereby improving applicability and improving the utilization rate of the thermally conductive buffer tape, reducing costs and waste generation, and reducing environmental pollution;

[0017] 2. The buffer structure is provided to play a buffering and protective role, and the capsule cavity and the heat dissipation structure are combined to increase the heat dissipation area and improve the heat conduction and heat dissipation effect; the temperature color-changing coating is provided to intuitively feedback the temperature conditions and display them on the surface of the thermally conductive buffer tape, so that the temperature conditions can be quickly known and the prompt effect can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0019] Figure 1 This is a schematic diagram of the overall structure of the thermally conductive buffer tape of this embodiment;

[0020] Figure 2 is a schematic structural diagram of the tape body of this embodiment;

[0021] Figure 3 for Figure 2 An enlarged schematic diagram of A in FIG.

[0022] Figure 4 It is a schematic diagram of the bottom structure of a half-section of the machine tape body of this embodiment;

[0023] Figure 5 for Figure 4 Schematic cross-sectional view of AA. DETAILED DESCRIPTION

[0024] The following description is only a preferred embodiment of the present invention and does not limit the protection scope of the present invention.

[0025] For example, see the attached Figure 1 to Figure 5A thermally conductive buffer tape 1 is wound on a reel, and the thermally conductive buffer tape 1 includes one or more tape bodies 2, and the tape bodies 2 are each provided with a combined splicing structure 3; the tape bodies 2 are each also provided with a heat dissipation structure 4, and the heat dissipation structure 4 is each provided with a temperature-chromic coating 5 and a buffer structure 6; and the bottom of the tape body 2 is also provided with an adhesive layer 7.

[0026] The combined splicing structure 3 includes a first splicing structure 9 and a second splicing structure 10. The first splicing structure 9 is arranged on one side of the tape body 2, and the second splicing structure 10 is arranged on the other side of the tape body 2. The first splicing structure 9 is used to be combined with the second splicing structure 10 of another tape body 2 to form a thermally conductive buffer tape 1 of different widths. The first splicing structure 9 includes a strip-shaped insertion groove 90, one side of the strip-shaped insertion groove 90 is provided with a card slot 91, and the other side of the strip-shaped insertion groove 90 is provided with a notch 92. The second splicing structure 10 includes a strip-shaped protrusion 100, and the outer side of the strip-shaped protrusion 100 is provided with a card block 101, and the card block 101 is inserted and connected with the card slot 91. Since the combined splicing structure 3 forms thermally conductive buffer tapes 1 of different widths according to needs, the thermally conductive buffer tape 1 can be used for wrapping articles of different width specifications, which greatly improves applicability, improves the utilization rate of the thermally conductive buffer tape 1, reduces costs and waste generation, and reduces environmental pollution.

[0027] The tape body 2 is provided with a plurality of through holes, and the heat dissipation structure 4 includes a contact layer 40, a connecting layer 41 and a heat-conducting layer 42. The contact layer 40 is arranged at the bottom of the tape body 2, and the heat-conducting layer 42 is arranged at the top of the tape body 2. The connecting layer 41 is composed of a plurality of connecting columns, and the plurality of connecting columns are respectively arranged in the through holes, and the two ends of the connecting columns are respectively connected to the contact layer 40 and the heat-conducting layer 42. The heat dissipation structure 4 is used to increase the direct contact area between the bottom and the outer surface of the thermally conductive buffer tape 1, thereby improving the heat dissipation efficiency and effect.

[0028] The temperature-chromic coating 5 is arranged on the outer surfaces of the contact layer 40, the connecting layer 41 and the thermal conductive layer 42. The temperature-chromic coating 5 is made of thermochromic paint. The temperature-chromic coating 5 is used to intuitively feedback the temperature conditions and display them on the surface of the thermal conductive buffer tape 1, so as to quickly know the temperature conditions and improve the prompt effect; the thickness of the temperature-chromic coating 5 is 0.2μm-3μm.

[0029] The buffer structure 6 includes an arc surface 60 and a cavity 61. The arc surface 60 is arranged on the top of the heat conductive layer 42, and the cavity 61 is arranged in the heat conductive layer 42. The buffer structure 6 is used for buffering and protection, and the cavity 61 is used for increasing the heat dissipation area, thereby improving the heat conduction and heat dissipation effect.

[0030] The adhesive layer 7 includes two adhesive strips 70, and the adhesive strips 70 are arranged on both sides of the contact layer 40 in a mirror-image manner; the adhesive strips 70 each include a strong adhesive portion 700 and a weak adhesive portion 701, the strong adhesive portion 700 includes a first stripe area 700a and a second stripe area 700b, the weak adhesive portion 701 includes a first glue dot portion 701a and a second glue dot portion 701b, the first glue dot portion 701a is arranged on the inner bottom surface of the edge of the tape body 2, the first stripe area 700a is arranged on one side of the first glue dot portion 701a, and the second glue dot portion 701b is arranged on the first stripe area 700a On the other side of the adhesive layer 7, the second stripe area 700b is arranged between the second glue-dispensing part 701b and the contact layer 40; the width of the first stripe area 700a is smaller than the width of the second stripe area 700b, the width of the first glue-dispensing part 701a is smaller than the width of the second glue-dispensing part 701b, the bottom surfaces of the first stripe area 700a and the second stripe area 700b, the first stripe area 700a and the second stripe area 700b are parallel to the bottom of the contact layer 40; a release layer is provided at the bottom of the adhesive layer 7; the weakly sticky part 701 is convenient for tearing and detaching during the detachment action, and the strongly sticky part 700 is used to ensure stability during pasting.

[0031] The contact layer 40 , the connection layer 41 and the heat-conducting layer 42 are all heat-conducting silicone layers. Heat is discharged by moving the contact layer 40 toward the connection layer 41 and the heat-conducting layer 42 for heat conduction and heat dissipation.

[0032] The utility model can quickly connect or disassemble the two tape bodies according to needs by setting the first splicing structure and the second splicing structure. The operation is simple and quick, and there is no need to perform cutting, so the integrity of the tape body is ensured, thereby forming thermally conductive buffer tapes of different widths, so that the thermally conductive buffer tape can be used for wrapping items of different width specifications, thereby improving applicability, and improving the utilization rate of the thermally conductive buffer tape, reducing costs and waste generation, and reducing environmental pollution; the buffer structure is set to play a buffering and protective role, and the capsule cavity and the heat dissipation structure are combined to increase the heat dissipation area and improve the thermal conductivity and heat dissipation effect; the temperature color-changing coating is set to intuitively feedback the temperature condition and display it on the surface of the thermally conductive buffer tape, so that the temperature condition is quickly known and the prompt effect is improved.

[0033] The present invention is not limited to the above-mentioned embodiments. Other thermally conductive buffer tapes obtained by using the same or similar structures or devices as the above-mentioned embodiments of the present invention are all within the protection scope of the present invention.

Claims

1. A thermally conductive buffer tape, the thermally conductive buffer tape being wound on a reel, characterized in that: The thermally conductive buffer tape comprises one or more tape bodies, each of which is provided with a combined splicing structure; each of the tape bodies is also provided with a heat dissipation structure, each of which is provided with a temperature-changing coating and a buffer structure; and each of the tape bodies is also provided with an adhesive layer at the bottom.

2. The thermally conductive buffer tape according to claim 1, characterized in that: The combined splicing structures include a first splicing structure and a second splicing structure, wherein the first splicing structure is arranged on one side of the tape body, and the second splicing structure is arranged on the other side of the tape body, and the first splicing structure is used to be combined and connected with the second splicing structure of another tape body to form a thermally conductive buffer tape of different widths.

3. The thermally conductive buffer tape according to claim 2, characterized in that: The first splicing structure comprises a strip-shaped insertion groove, a clamping groove is provided on one side of the strip-shaped insertion groove, and a notch is provided on the other side of the strip-shaped insertion groove.

4. The thermally conductive buffer tape according to claim 3, characterized in that: The second splicing structure comprises a strip-shaped protrusion, a clamping block is arranged on the outer side of the strip-shaped protrusion, and the clamping block is inserted and connected with the clamping slot in cooperation.

5. The thermally conductive buffer tape according to claim 4, characterized in that: The tape body is provided with a plurality of through holes, and the heat dissipation structure includes a contact layer, a connecting layer and a heat-conducting layer. The contact layer is arranged at the bottom of the tape body, and the heat-conducting layer is arranged at the top of the tape body. The connecting layer is composed of a plurality of connecting columns, and the plurality of connecting columns are respectively arranged in the through holes, and the two ends of the connecting columns are respectively connected to the contact layer and the heat-conducting layer.

6. The thermally conductive buffer tape according to claim 5, characterized in that: The temperature-chromic coating is arranged on the outer surfaces of the contact layer, the connection layer and the heat-conducting layer; the thickness of the temperature-chromic coating is 0.2 μm-3 μm.

7. The thermally conductive buffer tape according to claim 6, characterized in that: The buffer structure includes an arc surface and a cavity, the arc surface is arranged on the top of the heat-conducting layer, and the cavity is arranged in the heat-conducting layer.

8. The thermally conductive buffer tape according to claim 7, characterized in that: The adhesive layer includes two adhesive strips, and the adhesive strips are arranged on both sides of the contact layer in a mirror-image manner; the adhesive strips each include a strong adhesive part and a weak adhesive part, the strong adhesive part includes a first stripe area and a second stripe area, and the weak adhesive part includes a first glue dot part and a second glue dot part, the first glue dot part is arranged on the inner bottom surface of the edge of the tape body, the first stripe area is arranged on one side of the first glue dot part, the second glue dot part is arranged on the other side of the first stripe area, and the second stripe area is arranged between the second glue dot part and the contact layer.

9. The thermally conductive buffer tape according to claim 8, characterized in that: The width of the first stripe area is smaller than that of the second stripe area, the width of the first glue spot part is smaller than that of the second glue spot part, the bottom surfaces of the first stripe area and the second stripe area, and the first stripe area and the second stripe area are parallel to the bottom of the contact layer; a release layer is provided at the bottom of the adhesive layer.

10. The thermally conductive buffer tape according to claim 9, characterized in that: The contact layer, the connection layer and the heat-conducting layer are all heat-conducting silicone layers.

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