Computer graphics card heat dissipation mechanism

Abstract

The utility model discloses a computer graphics card heat dissipation mechanism which comprises a graphics card body, a clamping groove A and a clamping groove B. The clamping groove A and the clamping groove B are formed in the two sides of the graphics card body respectively. A clamping block is embedded in the clamping groove A. A frame body is connected to the clamping block. A heat dissipation pipe is arranged in the frame body. One end of the heat dissipation pipe is connected with a water tank through a pump body. A shell is arranged at the top of the water tank, a semiconductor chilling plate is arranged in the shell, a fan is mounted on the semiconductor chilling plate, and an air pump is mounted in the shell. The iron blocks on the clamping plate and the clamping block are matched with the electromagnets in the clamping groove A and the clamping groove B to be separated from the display card body, so that the heat dissipation pipe and the water tank are separated from the display card body, the heat dissipation mechanism is convenient to disassemble and assemble, space is provided for inspection and maintenance of the display card body, and the practicability of the heat dissipation mechanism is improved.

Description

Technical Field

[0001] The utility model relates to the field related to heat dissipation of graphics cards, in particular to a heat dissipation mechanism for a computer graphics card. Background Art

[0002] Effective heat dissipation of the graphics card allows the heat generated by the graphics card to be dissipated quickly and effectively during operation, thereby ensuring the stability and life of the graphics card. Graphics cards usually generate a lot of heat during high-load operations such as large-scale games or graphics processing. If the heat dissipation is not in place, the graphics card may be overheated and cause freezes, crashes, and other problems, which will have a serious impact on the gaming or graphics processing experience.

[0003] After searching, Chinese utility model patent CN219122647U discloses a computer graphics card cooling mechanism, including a water tank, a connecting pipe, a semiconductor cooling sheet and a pump, the water tank is connected to the connecting pipe, the other end of the connecting pipe is connected to a cache bin, the semiconductor cooling sheet is embedded and installed on one side of the cache bin, the semiconductor cooling sheet is fitted with a display chip, two connecting pipes are provided, the pump is installed on one of the connecting pipes, and a circulation channel is formed between the cache bin, the connecting pipe and the water tank. The utility model computer graphics card cooling mechanism reduces the space occupied inside the computer case by arranging the water tank and the pump outside the computer case, and is powered by an external power supply, thereby reducing the pressure on the power supply inside the computer case, without the need for the user to replace a power supply with a higher power.

[0004] The existing device may have the following problems when in use: the heat dissipation structure is installed together with the graphics card by using bolts, but there are many components on the graphics card and they are fragile, making it inconvenient to disassemble and assemble. It is inconvenient to inspect and maintain the graphics card, which can easily cause damage to the graphics card and reduce its service life. Utility Model Content

[0005] The purpose of the utility model is to provide a computer graphics card heat dissipation mechanism to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a computer graphics card heat dissipation mechanism, comprising a graphics card body, a card slot A, and a card slot B, wherein the graphics card body is provided with a card slot A and a card slot B on both sides thereof, a card block is embedded in the card slot A, a frame is connected to the card block, a heat dissipation pipe is arranged inside the frame, one end of the heat dissipation pipe is connected to a water tank through a pump body, a semiconductor refrigeration sheet is started to cool the fluid inside the water tank, the pump body is started to transport the fluid to the heat dissipation pipe, the heat dissipation pipe absorbs the heat in the air to dissipate the heat of the graphics card body, and the fluid after absorbing heat flows back to the inside of the water tank for the next step of processing to maintain the heat dissipation effect, a shell is provided on the top of the water tank, a semiconductor refrigeration sheet is arranged inside the shell, a fan is installed on the semiconductor refrigeration sheet, an air pump is installed inside the shell, and the heat generated by the hot end of the semiconductor refrigeration sheet is dissipated by starting the fan.

[0007] In a further embodiment, a card plate is provided on one side of the water tank, and the card plate is engaged with a card slot B, and the card plate has the same structure as the card block.

[0008] In a further embodiment, an electromagnet is provided inside the slot A, an iron block is provided on the block, the internal structures of the slots A and B are the same, a control button is provided on the water tank, the control button is electrically connected to the electromagnet, and the control button controls the electromagnet to facilitate the installation and disassembly of the heat dissipation tube box water tank.

[0009] In a further embodiment, one end of the heat dissipation pipe away from the pump body is fixedly connected to a water tank, and a dustproof net is provided on the shell to reduce the entry of dust and increase the service life of the components.

[0010] In a further embodiment, the cooling surface of the semiconductor refrigeration sheet is attached to the top of the water tank, and a hose is connected to the air pump. The air pump cooperates with the hose to discharge hot air to prevent heat from spreading around the graphics card body.

[0011] In a further embodiment, a cooling fan is disposed inside the graphics card body, and a cooling pipe is disposed on the top of the cooling fan, so that the cooling pipe cooperates with the cooling fan to perform cooling work and improve the cooling efficiency.

[0012] Compared with the prior art, the beneficial effect of the utility model is that the iron blocks on the card plate and the card block cooperate with the electromagnets inside the card slots A and B to be detached from the graphics card body, so that the heat dissipation pipe and the water tank are detached from the graphics card body, which facilitates the disassembly and assembly of the heat dissipation mechanism, provides space for inspection and maintenance of the graphics card body, and improves the practicality of the heat dissipation mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0014] Figure 2 It is a schematic diagram of the cross-sectional structure of the utility model;

[0015] Figure 3 This is a schematic diagram of the connection groove structure of the utility model;

[0016] Figure 4 This is a schematic diagram of the water tank structure of the utility model;

[0017] Figure 5 It is a schematic diagram of the shell structure of the utility model.

[0018] In the figure: 1. Graphics card body; 2. Frame; 3. Cooling fan; 4. Heat pipe; 5. Card block; 6. Card slot A; 7. Electromagnet; 8. Iron block; 9. Water tank; 10. Pump body; 11. Control button; 12. Card slot B; 13. Shell; 14. Hose; 15. Fan; 16. Air pump; 17. Semiconductor cooling plate. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0020] See also Figure 1-4 The utility model provides an embodiment: a computer graphics card heat dissipation mechanism, including a graphics card body 1, a card slot A6, and a card slot B12. The graphics card body 1 is provided with card slots A6 and card slots B12 on both sides respectively. A card block 5 is embedded in the card slot A6, and a frame 2 is connected to the card block 5. A card plate is provided on one side of the water tank 9, and the card plate is embedded and connected with the card slot B12. The card plate has the same structure as the card block 5. An electromagnet 7 is provided in the card slot A6, and an iron block 8 is provided on the card block 5. The card slot A6 and the card slot B12 have the same internal structure. A control button 11 is provided on the water tank 9, and the control button 11 is electrically connected to the electromagnet 7. The control button 11 is started to turn off the electromagnet 7, so that the card plate and the card block 5 can move and detach from the graphics card body 1, and the heat dissipation pipe 4 and the water tank 9 are separated from the graphics card body 1, so that the graphics card body 1 can be inspected and maintained.

[0021] See also Figure 1-5The frame 2 is provided with a heat dissipation pipe 4 inside, one end of the heat dissipation pipe 4 is connected to a water tank 9 through a pump body 10, a shell 13 is provided on the top of the water tank 9, a semiconductor cooling sheet 17 is provided inside the shell 13, a heat dissipation fan 3 is provided inside the graphics card body 1, and a heat dissipation pipe 4 is provided on the top of the heat dissipation fan 3, the semiconductor cooling sheet 17 is started to cool the fluid inside the water tank 9, the pump body 10 is started to transport the fluid to the heat dissipation pipe 4, the heat dissipation fan 3 is started to cooperate with the heat dissipation pipe 4 to dissipate heat for the graphics card body 1, and the fluid after absorbing heat flows back to the inside of the water tank 9 for the next step of processing to keep the heat dissipation. In order to achieve thermal effect, a fan 15 is installed on the semiconductor refrigeration sheet 17, an air pump 16 is installed inside the shell 13, the end of the heat dissipation pipe 4 away from the pump body 10 is fixedly connected to the water tank 9, a dustproof net is provided on the shell 13, the cooling surface of the semiconductor refrigeration sheet 17 is in contact with the top of the water tank 9, and the air pump 16 is connected to the hose 14. The heat generated by the hot end of the semiconductor refrigeration sheet 17 is dissipated by starting the fan 15, and the air pump 16 cooperates with the hose 14 to discharge the hot air to avoid the heat from spreading to the vicinity of the graphics card body 1, reduce the heat accumulation around the graphics card body 1, and increase the service life of the graphics card body 1.

[0022] Working principle: Start the semiconductor refrigeration plate 17 to cool the fluid inside the water tank 9, start the pump body 10 to transport the fluid to the heat dissipation pipe 4, start the cooling fan 3 to cooperate with the heat dissipation pipe 4 to dissipate the heat of the graphics card body 1, and the fluid after absorbing heat flows back to the inside of the water tank 9 for the next step of processing to maintain the heat dissipation effect. The heat generated by the hot end of the semiconductor refrigeration plate 17 is dissipated by starting the fan 15, and the air pump 16 cooperates with the hose 14 to discharge the hot air to prevent the heat from spreading to the surrounding of the graphics card body 1. Start the control button 11 to turn off the electromagnet 7, so that the card board and the card block 5 can move and detach from the graphics card body 1, and the heat dissipation pipe 4 and the water tank 9 detach from the graphics card body 1, providing space for inspection and maintenance of the graphics card body 1.

[0023] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A computer graphics card heat dissipation mechanism, comprising a graphics card body (1), a card slot A (6), and a card slot B (12), characterized in that: A card slot A (6) and a card slot B (12) are respectively provided on both sides of the graphics card body (1), a card block (5) is embedded in the card slot A (6), a frame (2) is connected to the card block (5), a heat dissipation pipe (4) is provided inside the frame (2), one end of the heat dissipation pipe (4) is connected to a water tank (9) through a pump body (10), a shell (13) is provided on the top of the water tank (9), a semiconductor cooling plate (17) is provided inside the shell (13), a fan (15) is installed on the semiconductor cooling plate (17), and an air pump (16) is installed inside the shell (13).

2. A computer graphics card heat dissipation mechanism according to claim 1, characterized in that: A card plate is provided on one side of the water tank (9), and the card plate is engaged with a card slot B (12). The card plate has the same structure as the card block (5).

3. A computer graphics card heat dissipation mechanism according to claim 1, characterized in that: An electromagnet (7) is arranged inside the card slot A (6), an iron block (8) is arranged on the card block (5), the card slot A (6) and the card slot B (12) have the same internal structure, a control button (11) is arranged on the water tank (9), and the control button (11) is electrically connected to the electromagnet (7).

4. A computer graphics card heat dissipation mechanism according to claim 1, characterized in that: One end of the heat dissipation pipe (4) away from the pump body (10) is fixedly connected to a water tank (9), and a dustproof net is provided on the housing (13).

5. A computer graphics card heat dissipation mechanism according to claim 1, characterized in that: The cooling surface of the semiconductor cooling sheet (17) is attached to the top of the water tank (9), and a hose (14) is connected to the air pump (16).

6. A computer graphics card heat dissipation mechanism according to claim 1, characterized in that: A cooling fan (3) is arranged inside the graphics card body (1), and a cooling pipe (4) is arranged on the top of the cooling fan (3).

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