Electronic device

Abstract

The utility model discloses electronic equipment, and belongs to the technical field of electronic equipment. The electronic equipment comprises a cover body and a display screen, a mounting cavity is formed between the cover body and the display screen, and a mounting hole is formed in the cover body; a camera and a camera decoration ring, the camera is arranged in the mounting cavity and is opposite to the mounting hole, and the camera decoration ring is partially located in the mounting hole and surrounds the camera; wherein the camera decoration ring comprises a non-metal decoration ring and a metal decoration ring; the nonmetal decoration ring comprises a first boss, the first boss is arranged in the mounting hole in a penetrating mode, the metal decoration ring comprises an inner ring and an outer ring, the inner ring is arranged on the first boss, and the outer ring is arranged on the peripheral side of the inner ring in a sleeving mode.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to an electronic equipment. Background Art

[0002] Camera decorative rings can protect and fix the lens, as well as beautify the camera module, and have become an essential component of mobile phones. Metal has become the best material for camera decorative rings due to its high strength, beautiful appearance and easy processing.

[0003] However, the density of metal is still relatively high for the mobile phone industry that pursues thinness and lightness. The ever-increasing camera decorative ring conflicts with the growing demand for weight reduction of mobile phones. Disassembling the one-piece metal camera decorative ring into plastic structure and metal structure can achieve the purpose of weight reduction while ensuring strength and aesthetics.

[0004] However, the decorative ring in the related technology has the problem of too large a proportion of metal structure, which leads to the overall weight of the camera decorative ring of the product being relatively large, which is not conducive to lightweight design. Utility Model Content

[0005] The present application aims to provide an electronic device that at least solves the technical problem that the overall weight of the camera decorative ring is large and is not conducive to lightweight design.

[0006] In order to solve the above technical problems, this application is implemented as follows:

[0007] An embodiment of the present application proposes an electronic device, which includes: a cover body and a display screen, a mounting cavity is formed between the cover body and the display screen, and a mounting hole is arranged on the cover body; a camera and a camera decorative ring, the camera is arranged in the mounting cavity and opposite to the mounting hole, and the camera decorative ring is partially located in the mounting hole and surrounds the camera; wherein the camera decorative ring includes a non-metallic decorative ring and a metal decorative ring; the non-metallic decorative ring includes a first boss, the first boss is penetrated through the mounting hole, and the metal decorative ring includes an inner ring and an outer ring, the inner ring is arranged on the first boss, and the outer ring is sleeved on the outer peripheral side of the inner ring.

[0008] The electronic device defined in the present application includes a cover body and a display screen, wherein the cover body is mounted on the back side of the display screen, a mounting cavity is enclosed between the cover body and the display screen, and a mounting hole is provided on the cover body. The cover body forms the outer surface of the electronic device, and the cover body can provide shielding and protection for the internal structure of the electronic device. For example, if the electronic device is a mobile phone, the cover body is the back cover of the mobile phone, and the camera module is exposed on the back cover. The display screen can display image information and text information.

[0009] The electronic device also includes a camera and a camera decoration ring. The camera is arranged in the installation cavity, and the camera is opposite to the installation hole. The camera decoration ring is partially arranged at the installation hole, and the camera decoration ring surrounds the camera.

[0010] The camera decorative ring includes a metal decorative ring and a non-metal decorative ring, which are connected to the cover body, wherein the non-metal decorative ring is sleeved on the outside of the camera, and the metal decorative ring is sleeved on the outside of the non-metal decorative ring, and the metal decorative ring and the non-metal decorative ring protect the camera inside together, wherein the metal decorative ring has a high structural strength and can resist external impact, thereby providing reliable protection for the camera, and the material density of the non-metal decorative ring is relatively low, which can reduce the weight of the electronic device on the basis of providing positioning and protection for the camera. At the same time, the metal decorative ring and the non-metal decorative ring can form a distinct decorative effect on the outside of the camera.

[0011] On this basis, the non-metallic decorative ring includes a first boss, which is inserted into the mounting hole, and after assembly, the first boss is wrapped around the camera. The metal decorative ring includes an inner ring and an outer ring, the inner ring is installed on the top of the first boss to play a decorative and protective role on the top of the first boss, the outer ring is sleeved around the inner ring, and the outer ring forms a second layer of protection on the circumference of the inner ring, and the inner ring and the outer ring can form two distinct decorative effects on the top of the first boss.

[0012] Among them, the inner ring is directly buckled on the top of the first boss, the outer ring avoids the space between the inner ring and the first boss, and the outer ring avoids the space of the inner ring facing away from the first boss, that is, the outer ring will not be inserted between the inner ring and the first boss, or the inner ring will not be inserted between the outer ring and the first boss, and the inner ring and the outer ring are nested above the first boss, rather than interspersed above the first boss.

[0013] It can be seen that by limiting the outer ring to the periphery of the inner ring, the outer ring can be prevented from extending between the inner ring and the first boss, thereby reducing the volume of the outer ring and the proportion of the metal decorative ring. This can achieve the technical effect of optimizing the structure of the metal decorative ring, reducing the weight of the metal decorative ring, and providing convenient conditions for the lightweight design of electronic equipment.

[0014] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0016] Figure 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

[0017] Figure 2 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

[0018] Figure 3 is a schematic structural diagram of a side ring according to an embodiment of the present application;

[0019] Figure 4 It is a schematic diagram of the structure of an electronic device according to an embodiment of the present application.

[0020] Reference numerals:

[0021] 100 electronic device, 110 cover body, 1102 mounting hole, 120 non-metallic decorative ring, 122 first boss, 1222 first step surface, 124 second boss, 130 metal decorative ring, 132 inner ring, 1322 second step surface, 134 outer ring, 136 side ring, 1361 metal base, 1362 groove, 1363 third step surface, 1364 side wall, 1365 bottom wall, 1366 first gap, 1368 second gap, 1369 third boss, 138 first colloid, 1382 first double-sided adhesive layer, 1384 first glue layer, 140 embedded part, 150 adhesive component, 152 second glue layer, 154 second double-sided adhesive layer, 160 second colloid, 161 third colloid, 162 fourth colloid, 164 fourth double-sided adhesive layer. DETAILED DESCRIPTION

[0022] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0023] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0024] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0025] Combine the following Figures 1 to 4 An electronic device 100 according to an embodiment of the present application is described.

[0026] like Figure 1 , Figure 2 and Figure 4 As shown, according to some embodiments of the present application, the electronic device 100 includes: a cover body 110 and a display screen, a mounting cavity is formed between the cover body 110 and the display screen, and a mounting hole 1102 is provided on the cover body 110; a camera and a camera decorative ring, the camera is arranged in the mounting cavity and is opposite to the mounting hole 1102, the camera decorative ring is partially located in the mounting hole 1102 and surrounds the camera; wherein, the camera decorative ring includes a non-metallic decorative ring 120 and a metal decorative ring 130; the non-metallic decorative ring 120 includes a first boss 122, the first boss 122 is penetrated through the mounting hole 1102, the metal decorative ring 130 includes an inner ring 132 and an outer ring 134, the inner ring 132 is arranged on the first boss 122, and the outer ring 134 is sleeved on the outer peripheral side of the inner ring 132.

[0027] The electronic device 100 defined in the present application includes a cover 110 and a display screen. The cover 110 is mounted on the back side of the display screen. A mounting cavity is enclosed between the cover 110 and the display screen. The cover 110 is provided with a mounting hole 1102. The cover 110 forms the outer surface of the electronic device 100. The cover 110 can provide shielding and protection for the internal structure of the electronic device 100. For example, if the electronic device 100 is a mobile phone, the cover 110 is the back cover of the mobile phone, and the camera module is exposed on the back cover. The display screen can display image information and text information.

[0028] The electronic device 100 further includes a camera and a camera decoration ring. The camera is disposed in the mounting cavity, and the camera is opposite to the mounting hole 1102. The camera decoration ring is partially disposed at the mounting hole 1102, and the camera decoration ring surrounds the camera.

[0029] The camera decorative ring includes a metal decorative ring 130 and a non-metal decorative ring 120, which are connected to the cover 110, wherein the non-metal decorative ring 120 is sleeved on the outside of the camera, and the metal decorative ring 130 is sleeved on the outside of the non-metal decorative ring 120, and the metal decorative ring 130 and the non-metal decorative ring 120 protect the camera inside together, wherein the metal decorative ring 130 has a high structural strength and can resist external impact, thereby providing reliable protection for the camera, and the material density of the non-metal decorative ring 120 is relatively low, which can reduce the weight of the electronic device 100 on the basis of providing positioning and protection for the camera. At the same time, the metal decorative ring 130 and the non-metal decorative ring 120 can form a layered decorative effect on the outside of the camera.

[0030] On this basis, the non-metallic decorative ring 120 includes a first boss 122, which is inserted into the mounting hole 1102. After assembly, the first boss 122 is wrapped around the camera. The metal decorative ring 130 includes an inner ring 132 and an outer ring 134. The inner ring 132 is installed on the top of the first boss 122 to play a decorative and protective role on the top of the first boss 122. The outer ring 134 is sleeved around the inner ring 132. The outer ring 134 forms a second layer of protection on the circumference of the inner ring 132, and the inner ring 132 and the outer ring 134 can form two distinct layers of decorative effects on the top of the first boss 122.

[0031] Among them, the inner ring 132 is directly buckled on the top of the first boss 122, the outer ring 134 avoids the space between the inner ring 132 and the first boss 122, and the outer ring 134 avoids the space of the inner ring 132 facing away from the first boss 122, that is, the outer ring 134 will not be inserted between the inner ring 132 and the first boss 122, or the inner ring 132 will not be inserted between the outer ring 134 and the first boss 122, and the inner ring 132 and the outer ring 134 are nested above the first boss 122, rather than interspersed above the first boss 122.

[0032] It can be seen that by limiting the outer ring 134 around the inner ring 132, the outer ring 134 can be prevented from extending between the inner ring 132 and the first boss 122, thereby reducing the volume of the outer ring 134 and reducing the proportion of the metal decorative ring 130. In addition, the structure of the metal decorative ring 130 is optimized, the weight of the metal decorative ring 130 is reduced, and the technical effect of providing convenient conditions for the lightweight design of the electronic device 100 is achieved.

[0033] like Figure 1 , Figure 2 and Figure 4 As shown, in some embodiments, optionally, the metal decorative ring 130 also includes a side ring 136, which is sleeved on the outer peripheral side of the first boss 122, and the side ring 136 is located between the outer ring 134 and the cover body 110; the inner ring 132 is connected to the first boss 122, and the side ring 136 connects the cover body 110 and the outer ring 134.

[0034] In this technical solution, the metal decorative ring 130 further includes a side ring 136 . The side ring 136 is sleeved on the outer side of the first boss 122 , and the side ring 136 is clamped between the outer ring 134 and the cover body 110 .

[0035] The side ring 136 can provide protection around the first boss 122. Specifically, it can cooperate with the outer ring 134 and the inner ring 132 on the top to form all-round protection for the first boss 122 to avoid external impact directly acting on the first boss 122 with weaker strength, thereby improving the protection effect of the camera and achieving the technical effect of improving the reliability of the camera and reducing the failure rate of the camera.

[0036] On this basis, the inner ring 132 is fixed on the first boss 122. Specifically, the first boss 122 and the inner ring 132 can be bonded by the second colloid 160. The top of the side ring 136 is connected to the outer ring 134, and the bottom of the side ring 136 is connected to the cover body 110. On the one hand, the side ring 136 can play a transitional connection role between the outer ring 134 and the cover body 110. On the other hand, the side ring 136 can provide support under the outer ring 134, so that the outer ring 134 can be accurately positioned around the inner ring 132, reducing the possibility of misalignment or even falling off of the outer ring 134, thereby achieving the technical effect of improving the structural stability and reliability of the metal decorative ring 130.

[0037] Specifically, the inner ring 132 , the outer ring 134 and the side ring 136 can form three different visual effects through color separation to increase the visual layering of the metal decorative ring 130 , thereby enhancing the decorative effect of the metal decorative ring 130 .

[0038] like Figure 1 , Figure 2 and Figure 4 As shown, in some embodiments, optionally, the side ring 136 and the cover body 110 are bonded by a first colloid 138, and the first colloid 138 includes a first double-sided adhesive layer 1382 and a first glue layer 1384, and the first double-sided adhesive layer 1382 and the first glue layer 1384 are arranged side by side.

[0039] In this technical solution, the side ring 136 is bonded to the cover body 110. Specifically, a first double-sided adhesive layer 1382 and a first glue layer 1384 are arranged between the side ring 136 and the cover body 110, and the first double-sided adhesive layer 1382 and the first glue layer 1384 are arranged side by side between the side ring 136 and the cover body 110, that is, the first glue layer 1384 and the first double-sided adhesive layer 1382 bond the side ring 136 and the cover body 110 together.

[0040] By setting the first double-sided adhesive layer 1382, the initial positioning of the side ring 136 on the cover body 110 can be achieved. During the assembly process, the side ring 136 is first bonded to the cover body 110 through the first double-sided adhesive layer 1382, thereby reducing the assembly difficulty of the side ring 136 and improving the assembly accuracy of the side ring 136.

[0041] On this basis, under the support of the first double-sided tape, there is still a gap between the side ring 136 and the cover body 110. The first glue layer 1384 can be formed by filling at least part of the gap with glue, thereby strengthening the bonding strength between the side ring 136 and the cover body 110 with the help of the first glue layer 1384, reducing the possibility of dislocation or even falling off of the side ring 136, thereby achieving the technical effect of improving the bonding stability and reliability of the side ring 136.

[0042] like Figure 1 , Figure 2 and Figure 4 As shown, in some embodiments, optionally, the first double-sided adhesive layer 1382 surrounds the first glue layer 1384 .

[0043] In this technical solution, the first double-sided adhesive layer 1382 surrounds the circumference of the first glue layer 1384. The first double-sided adhesive layer 1382 can play a shielding role around the first glue layer 1384, thereby preventing the glue from overflowing to the outside of the side ring 136 during the molding process of the first glue layer 1384, thereby optimizing the bonding structure between the inner ring 132 and the cover body 110 and reducing the complexity of the bonding process.

[0044] Specifically, during the assembly process, the side ring 136 is first adhered to the cover body 110 through the first double-sided adhesive layer 1382 , and then glue is injected into the gap on the inner circumference of the first double-sided adhesive to form a parallel first glue layer 1384 on the inner ring side of the first double-sided adhesive layer 1382 .

[0045] like Figure 1 , Figure 2 and Figure 4 As shown, in some embodiments, optionally, the side ring 136 includes a metal base 1361 and an embedded component 140 , the embedded component 140 is embedded in the metal base 1361 , and the density of the embedded component 140 is less than the density of the metal base 1361 .

[0046] In this embodiment, the side ring 136 includes a metal base 1361 and an embedded component 140 . The embedded component 140 is disposed inside the metal base 1361 . The metal base 1361 can shield the embedded component 140 to prevent the embedded component 140 from being exposed to the outside.

[0047] On this basis, the density of the embedded part 140 is lower than the density of the metal base 1361. Specifically, non-metallic materials such as plastic, plastic, foam, etc. can be selected. By arranging the embedded part 140 with lower density inside the metal base 1361, the proportion of metal material in the side ring 136 can be reduced, so as to further reduce the proportion of the metal decorative ring 130 in the decorative ring, thereby achieving weight reduction of the decorative ring.

[0048] At the same time, by arranging the embedded part 140 in the metal base 1361, a large amount of dirt and liquid accumulation can be avoided in the metal base 1361, thereby reducing the possibility of the side ring 136 being corroded by dirt and liquid accumulation, and reducing the possibility of generating odor in the side ring 136. Thus, the service life of the metal decorative ring 130 is extended and the user experience is improved.

[0049] like Figure 1 , Figure 2 and Figure 4As shown, in some embodiments, optionally, a groove 1362 is provided in the metal base 1361, and the embedded part 140 is molded in the groove 1362 by an injection molding process; or the embedded part 140 is bonded to the groove 1362 by an adhesive.

[0050] In this technical solution, a groove 1362 is formed on the metal base 1361, and the groove 1362 is annular, and the opening of the groove 1362 faces the side where the outer ring 134 is located. During the assembly process, the side ring 136 is first bonded to the cover body 110 through the first glue layer 1384 and the double-sided adhesive layer, and then the outer ring 134 is bonded to the side ring 136 through the fourth colloid 162, and the outer ring 134 bonded to the side ring 136 covers the opening of the groove 1362 to provide shielding for the groove 1362, thereby reducing the possibility of contaminants entering the groove 1362.

[0051] Among them, by opening the groove 1362 on the side ring 136, the volume occupied by the side ring 136 can be reduced, thereby reducing the weight of the side ring 136, providing convenient conditions for the lightweight design of the metal decorative ring 130.

[0052] On this basis, an embedded part 140 is arranged in the groove 1362, and the embedded part 140 fills at least part of the space in the groove 1362, wherein the density of the material of the embedded part 140 is less than the density of the material of the metal decorative ring 130, so as to retain the original intention of opening the groove 1362 to reduce weight.

[0053] By arranging the embedded part 140 in the groove 1362, the groove 1362 can be pre-filled to prevent a large amount of dirt and liquid from accumulating in the groove 1362, thereby reducing the possibility of the metal decorative ring 130 being corroded by dirt and liquid, and reducing the possibility of generating odor in the groove 1362. This can extend the service life of the metal decorative ring 130 and improve the user experience.

[0054] like Figure 1 , Figure 2 and Figure 4 As shown, in some embodiments, optionally, a gap is included between the groove 1362 and the embedded part 140, and the electronic device 100 further includes: an adhesive component 150, which is disposed in the gap.

[0055] In this technical solution, the embedded part 140 and the groove 1362 are clearance-fitted. By setting the embedded part 140 with clearance-fitting groove 1362, the assembly difficulty of the embedded part 140 can be reduced, avoiding the situation where the embedded part 140 cannot be pressed into the groove 1362, thereby achieving the technical effect of optimizing the assembly process of the electronic device 100.

[0056] Since the embedded part 140 and the groove 1362 are clearance-matched, there is a gap between the inner surface of the groove 1362 and the embedded part 140. On this basis, an adhesive component 150 is provided in the gap, and the adhesive component 150 adheres the embedded part 140 to the groove 1362 to prevent the embedded part 140 from shaking in the groove 1362, thereby eliminating the vibration noise of the embedded part 140 in the groove 1362, thereby achieving the technical effect of improving the user experience.

[0057] Specifically, the side ring 136 and the embedded part 140 can be bonded by pre-embedded double-sided tape, or by pre-applying glue and then installing the embedded part 140 to bond the embedded part 140 and the side ring 136, or by first installing the embedded part 140 and then injecting glue into the gap to bond the embedded part 140 and the side ring 136.

[0058] Specifically, the embedded part 140 in this technical solution is an independent structure that is molded separately. Compared with the process of directly nano-injection molding the embedded part 140 in the groove 1362, the embedded embedded part 140 does not require pretreatment of the aluminum-plastic bonding surface of the inner ring 132, thereby reducing the process complexity and process cost.

[0059] In addition, before nano injection molding, the pre-treatment method is to use strong acids and alkalis to erode nano-scale micropores on the metal surface. The use of a large amount of strong acids and alkalis in the pre-treatment will bring great environmental pressure and increase production costs.

[0060] On the other hand, nano injection molding is applicable to a limited number of plastic types, and is only applicable to a few plastics such as PBT (polybutyleneterephthalate), PPS (Polyphenylene sulfide), PA (Polyamide) and PPA (Polyphthalamide), and the process applicability is poor. The pre-formed independent insert 140 in this technical solution is not limited by the material, and can be formed with a material with low molding process complexity and low procurement cost.

[0061] On the other hand, in nano injection molding, in order to make the thermal expansion and contraction speed of plastic close to that of metal, glass fiber or carbon fiber needs to be added to the plastic, which not only increases the cost but also affects the weight reduction effect. However, the independently molded insert 140 in this technical solution does not need to change the expansion and contraction speed, which can relatively reduce costs and improve weight reduction effects.

[0062] like Figure 2 and Figure 3As shown, in some embodiments, optionally, the groove 1362 includes a side wall 1364 and a bottom wall 1365, a first gap 1366 is included between the embedding part 140 and the side wall 1364, a second gap 1368 is included between the embedding part 140 and the bottom wall 1365, and the adhesive component 150 includes: a second glue layer 152, and the second glue layer 152 is at least located in the second gap 1368.

[0063] In this technical solution, the inner surface of the groove 1362 includes a side wall 1364 and a bottom wall 1365. After the assembly of the insert 140 is completed, a first gap 1366 is formed between the inner and outer annular surfaces of the insert 140 and the side wall 1364, and a second gap 1368 is formed between the lower surface of the insert 140 and the bottom wall 1365.

[0064] On this basis, the bonding component 150 includes a second glue layer 152, and the second glue layer 152 is at least present in the second gap 1368, that is, the second glue layer 152 at least bonds the embedded part 140 and the bottom wall 1365. When the amount of glue pre-applied is large, the glue can enter the first gap 1366 inside and outside the embedded part 140 during the process of pressing the embedded part 140, so as to increase the bonding area, thereby improving the positioning stability of the embedded part 140 and reducing the possibility of the embedded part 140 being misplaced or even falling out.

[0065] Furthermore, the reserved first gap 1366 can accommodate a portion of the glue, thereby reducing the possibility of the glue overflowing to the outside of the groove 1362, thereby achieving the technical effect of reducing the difficulty of assembling the embedded component 140.

[0066] like Figure 2 and Figure 3 As shown, in some embodiments, optionally, the bottom wall 1365 includes a third boss 1369 , the third boss 1369 covers a portion of the bottom wall 1365 , and the embedded part 140 abuts against the third boss 1369 .

[0067] In this technical solution, a third boss 1369 is provided on the bottom wall 1365 . During the assembly of the embedded component 140 , the embedded component 140 is pressed into the groove 1362 until the lower surface of the embedded component 140 abuts against the upper surface of the third boss 1369 .

[0068] By setting a third boss 1369 on the bottom wall 1365, the third boss 1369 can provide support for the embedded part 140 to prevent the embedded part 140 from being tilted in the groove 1362 due to uneven pressure on the glue, thereby ensuring the uniformity of the thickness of the second glue layer 152 and achieving the technical effect of improving the positioning accuracy of the embedded part 140.

[0069] Specifically, there are a plurality of third bosses 1369, and the plurality of third bosses 1369 are spaced apart in the extending direction of the groove 1362. At the same time, the side wall 1364 of the groove 1362 includes an inner annular surface and an outer annular surface opposite to each other, and the third boss 1369 is in contact with one of the inner annular surface and the outer annular surface, and is spaced apart from the other, so that sufficient space for the glue to flow is reserved between the embedded component 140 and the bottom wall 1365, so as to avoid excessive reaction force of the glue when the embedded component 140 is pressed in.

[0070] like Figure 3 As shown, in some embodiments, optionally, the groove 1362 includes a bottom wall 1365 , a second gap 1368 is included between the embedding piece 140 and the bottom wall 1365 , and the adhesive component 150 includes: a second double-sided adhesive layer 154 , which is disposed in the second gap 1368 .

[0071] In this technical solution, the inner surface of the groove 1362 includes a side wall 1364 and a bottom wall 1365. After the assembly of the insert 140 is completed, a first gap 1366 is formed between the inner and outer annular surfaces of the insert 140 and the side wall 1364, and a second gap 1368 is formed between the lower surface of the insert 140 and the bottom wall 1365.

[0072] On this basis, the adhesive component 150 includes a second double-sided adhesive layer 154, which is attached between the bottom wall 1365 and the lower surface of the embedded part 140. The second double-sided adhesive can be pre-attached to the bottom wall 1365 or the lower surface of the embedded part 140. After the adhesive component 150 is pressed in, the other side of the second double-sided adhesive layer 154 is in contact and attached to complete the assembly.

[0073] Compared with the glue dispensing solution and the glue injection solution, the use of the second double-sided adhesive layer 154 to bond the embedded component 140 and the bottom wall 1365 has the advantages of low process complexity and low process cost, and can achieve the technical effect of reducing the production cost of the electronic device 100.

[0074] In some embodiments, optionally, the embedding part 140 includes at least one of a hard foam embedding part 140 , a polycarbonate embedding part 140 , and a polyamide embedding part 140 .

[0075] In this technical solution, the material of the embedding part 140 is limited. Specifically, the embedding part 140 includes one or a combination of a hard foam embedding part 140 , a polycarbonate embedding part 140 , and a polyamide embedding part 140 .

[0076] The density of hard foam, polycarbonate (PC) and polyamide (PA) is lower than that of metal materials, and the overall weight of the decorative ring can be reduced while effectively filling the groove 1362 , thereby facilitating the lightweight design of the electronic device 100 .

[0077] Specifically, the electronic device 100 further includes a fourth double-sided adhesive layer 164 , and the fourth double-sided adhesive layer 164 is bonded to the cover 110 and the non-metallic decorative ring 120 .

[0078] like Figure 1 As shown, in some embodiments, optionally, the outer ring 134 and the inner ring 132 are made of stainless steel; and the side ring 136 is made of aluminum alloy.

[0079] In some embodiments, optionally, a first step surface 1222 is provided on one side of the first boss 122 close to the inner ring 132, and a second step surface 1322 is provided on the inner ring 132. The second step surface 1322 and the first step surface 1222 are snapped together to form a cavity, and a second colloid 160 is provided in the cavity, and the second colloid 160 bonds the first step surface 1222 and the second step surface 1322.

[0080] In this embodiment, a first step surface 1222 is disposed on the top of the first boss 122, and a second step surface 1322 is correspondingly disposed on the bottom of the inner ring 132, and the first step surface 1222 and the second step surface 1322 are opposite to each other. After the inner ring 132 is assembled above the first boss 122, the first step surface 1222 and the second step surface 1322 are buckled together to enclose a cavity.

[0081] On this basis, a second colloid 160 is provided in the cavity, the top of the second colloid 160 is bonded to the second step surface 1322 , and the bottom of the second colloid 160 is bonded to the first step surface 1222 , so that the inner ring 132 is fixed to the top of the first boss 122 through the second colloid 160 .

[0082] By providing the first step surface 1222 and the second step surface 1322, a cavity for arranging the second colloid 160 can be formed between the inner ring 132 and the first boss 122, so as to avoid the second colloid 160 from raising the inner ring 132, thereby improving the assembly accuracy of the inner ring 132 and ensuring that the inner ring 132 can be accurately installed in a predetermined position, thereby ensuring that the protection and decorative capabilities of the inner ring 132 are not affected.

[0083] Specifically, the second colloid 160 occupies part of the space in the cavity, and the remaining space can be used as an assembly margin for the second colloid 160 during the assembly process, and can be used as an expansion margin for the second colloid 160 after the assembly is completed, thereby reducing the possibility of misalignment of the inner ring 132.

[0084] like Figure 1As shown, in some embodiments, optionally, the non-metallic decorative ring 120 also includes a second boss 124, the second boss 124 is arranged on the first boss 122, and the inner ring 132 is mounted on the circumference of the second boss 124; the end face of the second boss 124 and the surface of the inner ring 132 facing away from the first boss 122 are bonded by a third colloid 161.

[0085] In this embodiment, a second boss 124 is further provided on the top of the first boss 122, and the peripheral side surface of the second boss 124 and the top surface of the first boss 122 form a first step surface 1222. The inner ring 132 includes a ring body as a surrounding edge around the ring body, the lower end of the surrounding edge protrudes relative to the ring body, and the bottom surface of the ring body and the inner ring surface of the surrounding edge form a second step surface 1322. The ring body is sleeved on the peripheral side of the second boss 124, and the second boss 124 can position the inner ring 132 to ensure that the inner ring 132 can be accurately assembled at the predetermined installation position.

[0086] On this basis, the second boss 124 and the top of the ring body are provided with a third colloid 161, and the third colloid 161 bonds the second boss 124 and the ring body together. The third colloid 161 cooperates with the second colloid 160 to form bilateral positioning on the upper and lower sides of the inner ring 132, so as to improve the bonding strength of the inner ring 132 on the non-metallic decorative ring 120, reduce the possibility of the inner ring 132 loosening, dislocation, or even falling off, thereby achieving the technical effect of improving the structural reliability of the electronic device 100 and reducing the failure rate of the camera decorative ring.

[0087] like Figure 1 As shown, in some embodiments, optionally, a third step surface 1363 is provided on one side of the side ring 136 close to the outer ring 134, and the third step surface 1363 and the outer ring surface of the inner ring 132 enclose a groove 1362, and the outer ring 134 is partially embedded in the groove 1362, and a fourth colloid 162 is provided in the groove 1362, and the fourth colloid 162 bonds the third step surface 1363 and the outer ring 134.

[0088] In this embodiment, a third step surface 1363 is provided at the top of the side ring 136. After the side ring 136 is assembled, a groove 1362 is enclosed between the third step surface 1363 and the outer ring surface of the inner ring 132. Correspondingly, a downwardly protruding limiting step is provided at the bottom of the outer ring 134. After the assembly is completed, the limiting step is inserted into the groove 1362. The third step surface 1363 can limit the limiting step, thereby reducing the possibility of misalignment of the outer ring 134 and ensuring that the outer ring 134 can be accurately assembled to the predetermined position.

[0089] On this basis, a fourth colloid 162 is provided in the groove 1362, the bottom of the fourth colloid 162 is bonded to the third step surface 1363, and the top of the fourth colloid 162 is bonded to the limiting step, so as to bond the outer ring 134 and the side ring 136 together. At the same time, the fourth colloid 162 can play a sealing role between the outer ring 134 and the side ring 136 to prevent liquid and impurities from entering the area between the metal decorative ring 130 and the non-metallic decorative ring 120, to prevent the metal decorative ring 130 from being corroded by the liquid and impurities accumulated inside, and to prevent the metal decorative ring 130 from generating odor inside, thereby achieving the technical effect of extending the service life of the camera decorative ring and improving the user experience.

[0090] The electronic device 100 may be a terminal or other device other than a terminal. For example, the electronic device 100 may be a mobile phone, a tablet computer, a laptop computer, a PDA, an in-vehicle electronic device, a mobile Internet device (MID), an augmented reality (AR) / virtual reality (VR) device, a robot, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a personal digital assistant (PDA), etc. It may also be a personal computer (PC), a television (TV), a teller machine or a self-service machine, etc., which is not specifically limited in the embodiments of the present application.

[0091] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0092] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: A cover body and a display screen, wherein a mounting cavity is formed between the cover body and the display screen, and a mounting hole is provided on the cover body; A camera and a camera decoration ring, wherein the camera is disposed in the mounting cavity and is opposite to the mounting hole, and the camera decoration ring is partially located in the mounting hole and surrounds the camera; Wherein, the camera decorative ring includes a non-metallic decorative ring and a metal decorative ring; The non-metallic decorative ring includes a first boss, the first boss is penetrated through the mounting hole, and the metal decorative ring includes an inner ring and an outer ring, the inner ring is arranged on the first boss, and the outer ring is sleeved on the outer peripheral side of the inner ring.

2. The electronic device according to claim 1, characterized in that: The metal decorative ring further includes a side ring, which is sleeved on the outer peripheral side of the first boss and is located between the outer ring and the cover body; The inner ring is connected to the first boss, and the side ring is connected to the cover body and the outer ring.

3. The electronic device according to claim 2, characterized in that: The side ring and the cover body are bonded by a first colloid, wherein the first colloid comprises a first double-sided adhesive layer and a first glue layer, and the first double-sided adhesive layer and the first glue layer are arranged side by side.

4. The electronic device according to claim 3, characterized in that: The first double-sided adhesive layer surrounds the first glue layer.

5. The electronic device according to claim 2, characterized in that: The side ring includes a metal base and an embedded part, wherein the embedded part is embedded in the metal base, and the density of the embedded part is lower than that of the metal base.

6. The electronic device according to claim 5, characterized in that: The metal base is provided with a groove, and the embedded part is formed in the groove by injection molding; Alternatively, the embedded part is bonded in the groove by an adhesive.

7. The electronic device according to claim 5, characterized in that: The embedded part is at least one of a hard foam embedded part, a polycarbonate embedded part, and a polyamide embedded part; The outer ring and the inner ring are made of stainless steel; The side ring is made of aluminum alloy.

8. The electronic device according to any one of claims 1 to 7, characterized in that: A first step surface is provided on one side of the first boss close to the inner ring, and a second step surface is provided on the inner ring. The second step surface and the first step surface are snapped together to form a cavity. A second colloid is provided in the cavity, and the second colloid bonds the first step surface and the second step surface.

9. The electronic device according to claim 8, characterized in that: The non-metallic decorative ring further comprises a second boss, the second boss is arranged on the first boss, and the inner ring is sleeved on the circumference of the second boss; The end surface of the second boss and the surface of the inner ring facing away from the first boss are bonded by a third colloid.

10. The electronic device according to any one of claims 2 to 7, characterized in that: A third step surface is provided on one side of the side ring close to the outer ring, and the third step surface and the outer ring surface of the inner ring enclose a groove, and the outer ring is partially embedded in the groove. A fourth colloid is provided in the groove, and the fourth colloid bonds the third step surface and the outer ring.

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