Structure for improving optical single-point reflectivity

Abstract

The utility model discloses a structure for improving optical single-point reflectivity, which comprises a substrate, an LED light-emitting chip is arranged on the substrate, a layer of transparent adhesive is arranged on the light-emitting chip, the layer of transparent adhesive is in the shape of a hemisphere protruding outwards, a layer of transparent optical adhesive is covered on the transparent adhesive after the transparent adhesive is heated and solidified, and the transparent optical adhesive is coated on the substrate. And the middle part of the layer of transparent optical cement is recessed inwards. The structure for improving the optical single-point reflectivity can improve the light reflectivity and increase the single-point brightness when the light-emitting chip emits light.

Description

Technical Field

[0001] The utility model relates to the technical field of optical product production, in particular to a structure for improving optical single-point reflectivity. Background Art

[0002] The traditional COB Mini LED forms a hemispherical glue point after the silicone is sealed once, so as to protect the LED lamp bead light-emitting chip and solve the total reflection problem of the LED lamp bead light-emitting chip during the light-emitting process. However, when the whole board is observed through a polarizing film, it is found that the light will be dark, and this problem needs to be solved.

[0003] The patent with application publication number CN 115731809 A discloses a display panel manufacturing method, a display panel and a display module, wherein a plurality of light-emitting chips are arranged on the display back panel; at the same time, a packaging glue unit is arranged on the display back panel to cover each light-emitting chip respectively, and each packaging glue unit is separated from each other; each packaging glue unit is subjected to secondary processing to form each packaging glue unit into a lens. The display panel of the invention is provided with packaging glue units that cover each light-emitting chip respectively on the display back panel, and each packaging glue unit is separated from each other, and then the packaging glue unit is subjected to secondary processing to form a lens, so as to better diffuse the light emitted by the light-emitting chip, solve the problem of waste of resources and increase in cost due to inconvenient maintenance, and the problem of granular light spots caused by the reduction in the number of light-emitting chips and the increase in spacing, realize local maintainability and independent astigmatism, improve reliability, maintenance operability and display effect, and reduce maintenance costs. However, the patent does not involve how to solve the problem of internal bubbles during dispensing. Utility Model Content

[0004] The utility model aims to provide a structure for improving the optical single-point reflectivity, which can improve the light reflectivity and increase the single-point brightness when the light-emitting chip emits light.

[0005] In order to solve the above technical problems, a technical solution adopted by the utility model is: to provide a structure for improving the optical single-point reflectivity, which includes a substrate, on which an LED light-emitting chip is arranged, and on which a layer of transparent glue is arranged, and the layer of transparent glue is in an outwardly protruding hemispherical shape. After the transparent glue is heated and cured, a layer of transparent optical glue is covered on the transparent glue, and the middle part of the layer of transparent optical glue is concave inward.

[0006] Preferably, the surface of the inwardly recessed portion in the middle of the layer of transparent optical adhesive is a concave arc surface.

[0007] Preferably, the transparent adhesive is a silicone-based thermosetting adhesive, and the transparent optical adhesive is a silicone-based thermosetting adhesive.

[0008] Preferably, the transparent optical glue dot is directly above the light-emitting chip assembly and forms a hemispherical shape.

[0009] The beneficial effect of the utility model is: the structure of improving the optical single-point reflectivity of the utility model implements secondary concave dispensing on the traditional Mini LED sealing process, so that the Mini LED lamp bead light-emitting chip improves the reflectivity and increases the single-point brightness when emitting light, so that the uniform light effect is greatly improved, thereby enhancing the visual experience of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0011] Figure 1 It is a schematic structural diagram of a structure for improving optical single-point reflectivity in an embodiment of the utility model. DETAILED DESCRIPTION

[0012] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0013] Embodiments of the utility model:

[0014] The utility model provides a structure for improving the optical single point reflectivity. Figure 1 (The arrow indicates the divergent direction of the light emitted by the light-emitting chip), comprising a substrate 1, on which an LED light-emitting chip 2 is arranged, on which a layer of transparent glue 3 is arranged, the layer of transparent glue 3 is in an outwardly protruding hemispherical shape, and after the transparent glue 3 is heated and cured, a layer of transparent optical glue 4 is covered on the transparent glue 3, and the middle part of the layer of transparent optical glue 4 is recessed inward to form a recessed portion 5.

[0015] Preferably, the surface of the recessed portion 5 in the middle of the layer of transparent optical glue 4 is a concave arc surface, which can improve the uniform light effect of the light-emitting chip. After the secondary concave glue dispensing, the Mini LED lamp bead light-emitting chip can increase the reflectivity when emitting light, increase the single-point brightness, and greatly improve the uniform light effect, thereby enhancing the visual experience of the product.

[0016] Preferably, the transparent adhesive 3 is a very thin silicone-based thermosetting adhesive, and the transparent optical adhesive 4 is a silicone-based thermosetting adhesive.

[0017] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A structure for improving optical single-point reflectivity, comprising a substrate, an LED light-emitting chip is arranged on the substrate, and a layer of transparent glue is arranged on the light-emitting chip, characterized in that: The layer of transparent adhesive is in the shape of a hemisphere protruding outwards. After the transparent adhesive is heated and cured, a layer of transparent optical adhesive is covered on the transparent adhesive. The middle part of the layer of transparent optical adhesive is concave inwards.

2. The structure for improving optical single-point reflectivity according to claim 1, characterized in that: The surface of the inwardly recessed portion of the middle portion of the layer of transparent optical adhesive is a concave arc surface.

3. The structure for improving optical single-point reflectivity according to claim 1, characterized in that: The transparent adhesive is a silicone-based thermosetting adhesive, and the transparent optical adhesive is a silicone-based thermosetting adhesive.

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