Three-dimensional multi-runner heat dissipation structure

Abstract

The utility model relates to the field of heat dissipation systems, and particularly discloses a three-dimensional multi-flow-channel heat dissipation structure which comprises a heat dissipation bottom plate and a plurality of heat dissipation side plates perpendicularly fixed to the heat dissipation bottom plate, a bottom inlet flow channel and a bottom outlet flow channel are formed in the heat dissipation bottom plate, and heat dissipation flow channels allowing heat dissipation media to circulate are formed in the heat dissipation side plates. An inlet of the heat dissipation flow channel communicates with the bottom inlet flow channel, an outlet of the heat dissipation flow channel communicates with the bottom outlet flow channel, meanwhile, the heat dissipation bottom plate is provided with a medium inlet communicating with the bottom inlet flow channel and a medium outlet communicating with the bottom outlet flow channel, the heat dissipation side plates are matched with the heat dissipation bottom plate to form a multi-dimensional three-dimensional heat dissipation face, and the heat dissipation efficiency is improved. The LED lamp has the advantages of multi-dimensional heat dissipation, wide heat dissipation surface distribution and high heat dissipation efficiency.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation systems, and in particular to a three-dimensional multi-channel heat dissipation structure. Background Art

[0002] As the performance of electronic devices continues to improve, especially in high-power and high-frequency application scenarios, the heat generated by electronic components is increasing. As key components in the circuit, the stability and performance of capacitors and reactances directly affect the reliability and life of the entire system. In a high-temperature environment, the dielectric material of the capacitor may accelerate aging, the capacity and withstand voltage performance of the capacitor will decrease, and the magnetic material of the reactor may also lose magnetism due to overheating, resulting in changes in reactance value. Therefore, effectively solving the heat dissipation problem of capacitors and reactances is crucial to ensuring the normal operation of electronic equipment and extending its service life.

[0003] Conventional heat dissipation methods include forced air cooling and liquid cooling. Forced air cooling accelerates heat transfer by forcing air to flow through fans or other airflow devices. This method can significantly improve heat dissipation efficiency, especially in closed spaces or high-temperature environments. Reactors and inductors can be designed with heat sinks or heat dissipation fins to increase the heat dissipation surface area and improve the heat dissipation effect. Liquid cooling absorbs and transfers the heat generated by capacitors and inductors through circulating coolant (such as water, special coolant or thermally conductive oil). This system usually includes one or more radiators (or cold plates), pumps, heat exchangers, and circulation pipes. The coolant circulates in the system, takes away the heat and releases it to the environment through the heat exchanger, thereby maintaining the capacitors and inductors at a suitable operating temperature.

[0004] Most liquid cooling systems have flow channels on the side in contact with the heat generating components, and the heat dissipation medium exchanges heat when passing through the flow channels to achieve the heat dissipation effect. However, this heat dissipation method has low heat dissipation efficiency. Utility Model Content

[0005] In order to improve the heat dissipation efficiency of the heat dissipation system, the present application provides a three-dimensional multi-channel heat dissipation structure, which forms a multi-dimensional three-dimensional heat dissipation surface in the electronic device, so that the heat dissipation medium can fully exchange heat with the heat in the electronic device to improve the heat dissipation efficiency.

[0006] The present application provides a three-dimensional multi-channel heat dissipation structure adopts the following technical solution:

[0007] A three-dimensional multi-channel heat dissipation structure includes a heat dissipation base plate and multiple heat dissipation side plates, wherein the multiple heat dissipation side plates are vertically fixed to the heat dissipation base plate surface, the heat dissipation base plate is provided with a bottom inlet flow channel and a bottom outlet flow channel, the heat dissipation side plates are provided with a heat dissipation flow channel for heat dissipation medium to circulate, the two ends of the heat dissipation flow channel are respectively connected to the bottom inlet flow channel and the bottom outlet flow channel, and the heat dissipation base plate is provided with a medium inlet connected to the bottom inlet flow channel and a medium outlet connected to the bottom outlet flow channel.

[0008] By adopting the above technical solution, the heat dissipation base plate is attached to the electronic components, and along with the flow of the heat dissipation medium, the heat generated by the electronic components is absorbed and transferred to achieve heat dissipation of the electronic components; at the same time, the heat dissipation side plate is located on the side of the heat-generating component, and the heat dissipation medium flows in the heat dissipation flow channel to continuously exchange heat from other sides of the electronic components, forming a multi-dimensional three-dimensional heat dissipation surface, so that the heat dissipation medium can more fully exchange heat with the electronic components, thereby improving the heat dissipation efficiency.

[0009] Optionally, the heat dissipation base plate is further provided with a transfer channel, and the transfer channel is used to connect the heat dissipation channel.

[0010] By adopting the above technical solution, the transfer flow channel is used to facilitate the connection between the heat dissipation flow channels, which can meet the various settings of the heat dissipation side plates. The heat dissipation flow channels can be connected in sequence to form a one-way continuous flow passage, or to form a multi-branch flow passage.

[0011] Optionally, a plurality of the heat dissipation side plates are arranged end to end along the edge of the heat dissipation base plate, and each of the heat dissipation channels is connected in sequence through a bottom inlet channel, a transfer channel and a bottom outlet channel, and electronic components are arranged on the heat dissipation base plate and located between the plurality of heat dissipation side plates.

[0012] By adopting the above technical solution, the heat dissipation side plate forms a complete heat dissipation surface around the electronic component, dissipates heat from all sides of the electronic component, ensures the uniformity of the heat dissipation surface distribution, and improves the heat dissipation effect.

[0013] Optionally, it also includes one or more heat dissipation inner baffles, which are interspersed between the electronic components, fixed to the heat dissipation base plate, and heat dissipation channels are also opened in the heat dissipation inner baffles.

[0014] By adopting the above technical solution, each heat dissipation inner partition is interspersed between the electronic components, absorbs and transfers heat from the inside of the electronic components, and forms heat dissipation surfaces at different positions of the electronic components to improve the heat dissipation effect; at the same time, it cooperates with the heat dissipation side plates to form a cavity to perform zoned heat dissipation on the electronic components, thereby improving the heat dissipation efficiency.

[0015] Optionally, the heat dissipation flow channel includes a heat dissipation inlet flow channel, a heat dissipation outlet flow channel and a heat dissipation connecting flow channel, the heat dissipation inlet flow channel, the heat dissipation connecting flow channel and the heat dissipation outlet flow channel are connected in sequence, the heat dissipation inlet flow channel is connected to the bottom inlet flow channel, the heat dissipation outlet flow channel is connected to the bottom outlet flow channel, the heat dissipation inlet flow channel and the heat dissipation outlet flow channel are opened perpendicular to the heat dissipation base plate, and the heat dissipation connecting flow channel is opened parallel to the heat dissipation base plate.

[0016] By adopting the above technical solution, a continuous flow passage is formed by utilizing the heat dissipation inlet flow passage, the heat dissipation outlet flow passage and the heat dissipation connecting flow passage, and at the same time, the linear flow passage is convenient to open, thereby reducing the processing cost.

[0017] Optionally, there are multiple heat dissipation inlet flow channels, heat dissipation outlet flow channels and heat dissipation connecting flow channels.

[0018] By adopting the above technical solution, a plurality of flow channels are provided to disperse the heat dissipation medium on the heat dissipation side plates and the heat dissipation inner partition plate body, so that the heat dissipation medium can fully absorb heat and improve the heat exchange efficiency.

[0019] Optionally, the plurality of heat dissipation inlet flow channels are arranged at equal intervals, the plurality of heat dissipation outlet flow channels are arranged at equal intervals, and the plurality of heat dissipation connecting flow channels are arranged at equal intervals.

[0020] By adopting the above technical solution, the uniformity of the distribution of the heat dissipation medium on the heat dissipation side plates and the heat dissipation inner partition plate body is improved, the heat exchange efficiency is further improved, and then the heat dissipation effect is improved.

[0021] Optionally, the heat dissipation connecting flow channels are all arranged through the plate body, and plugs are arranged at both ends of each heat dissipation connecting flow channel, and each heat dissipation connecting flow channel simultaneously passes through multiple heat dissipation inlet flow channels and multiple heat dissipation outlet flow channels.

[0022] By adopting the above technical solution, the arrangement of the flow channel is simplified, the processing cost is reduced, and at the same time the dispersion degree of the heat dissipation medium is further improved, which helps to improve the heat dissipation efficiency.

[0023] In summary, the present application includes at least one of the following beneficial technical effects:

[0024] 1. The heat dissipation bottom plate is attached to the electronic components, and along with the flow of the heat dissipation medium, the heat generated by the electronic components is absorbed and transferred to achieve heat dissipation of the electronic components; at the same time, the heat dissipation side plate is located on the side of the heat-generating component, and the heat dissipation medium flows in the heat dissipation flow channel to continuously exchange heat from other sides of the electronic components, forming a multi-dimensional three-dimensional heat dissipation surface, so that the heat dissipation medium can have a more sufficient heat exchange with the electronic components, thereby improving the heat dissipation efficiency;

[0025] 2. The heat dissipation side plate forms a complete heat dissipation surface around the electronic components, dissipating heat from all sides of the electronic components, ensuring the uniformity of the heat dissipation surface distribution to improve the heat dissipation effect;

[0026] 3. Each heat dissipation inner partition is interspersed between the electronic components to absorb and transfer heat from the inside of the electronic components, forming heat dissipation surfaces at different positions of the electronic components to improve the heat dissipation effect; at the same time, it cooperates with the heat dissipation side plates to form a chamber to dissipate heat for the electronic components in different areas to improve the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application;

[0028] Figure 2 is a schematic diagram of an embodiment of the present application for showing a flow path of a heat dissipation medium;

[0029] Figure 3 It is a schematic diagram showing the heat dissipation channel according to an embodiment of the present application.

[0030] Figure numerals: 1. heat dissipation base plate; 11. bottom inlet flow channel; 12. bottom outlet flow channel; 13. transfer flow channel; 2. heat dissipation side plate; 3. L-shaped plate; 4. heat dissipation inner partition plate; 5. heat dissipation flow channel; 51. heat dissipation inlet flow channel; 52. heat dissipation outlet flow channel; 53. heat dissipation connecting flow channel; 6. medium inlet; 7. medium outlet; 8. plug. DETAILED DESCRIPTION

[0031] The following is combined with Figure 1-3 This application is described in further detail.

[0032] The present application discloses a three-dimensional multi-channel heat dissipation structure. Figure 1 and Figure 2 , including a heat dissipation base plate 1 and a plurality of heat dissipation side plates 2 vertically fixed on the heat dissipation base plate 1, a bottom inlet flow channel 11 and a bottom outlet flow channel 12 are opened in the heat dissipation base plate 1, a heat dissipation flow channel 5 for the circulation of heat dissipation medium is opened in the heat dissipation side plate 2, the inlet of the heat dissipation flow channel 5 is connected to the bottom inlet flow channel 11, and the outlet is connected to the bottom outlet flow channel 12, and at the same time, the heat dissipation base plate 1 is provided with a medium inlet 6 connected to the bottom inlet flow channel 11 and a medium outlet 7 connected to the bottom outlet flow channel 12.

[0033] The heat dissipation medium flows from the medium inlet 6 into the bottom inlet channel 11, flows from the inlet of the heat dissipation channel 5, flows out from the outlet, and finally flows out from the medium outlet 7 through the bottom outlet channel 12. The heat dissipation medium continuously flows in each channel to absorb and transfer the heat generated by the electronic components to maintain a suitable ambient temperature for the electronic components.

[0034] When the heat dissipation medium flows in the bottom inlet flow channel 11 and the bottom outlet flow channel 12, heat exchange is completed by making the bottom plate contact with one side of the electronic component; at the same time, the heat dissipation side plate 2 is located on the side of the heat-generating component, and the heat dissipation medium flows in the heat dissipation flow channel 5 to continuously exchange heat from other sides of the electronic component, forming a multi-dimensional three-dimensional heat dissipation surface, so that the heat dissipation medium can more fully exchange heat with the electronic component, thereby improving the heat dissipation efficiency.

[0035] In this embodiment, refer to Figure 1 and Figure 2 There are four heat dissipation side panels 2, and the heat dissipation bottom plate 1 is set in a square shape. The four heat dissipation side panels 2 are connected end to end and fixed to the four sides of the heat dissipation bottom plate 1. The heat dissipation bottom plate 1 and the four heat dissipation side panels 2 form a box-like structure with an open top, and the electronic components are correspondingly arranged in the box-like structure. The heat dissipation bottom plate 1 and the heat dissipation side panels 2 absorb heat from the bottom and four sides of the electronic components respectively, effectively improving the heat dissipation effect.

[0036] Reference Figure 1 An L-shaped plate 3 is arranged between two adjacent heat dissipation side plates 2, and the two plate surfaces of the L-shaped plate 3 are respectively attached to the side walls of the two adjacent heat dissipation side plates 2. At the same time, a plurality of fixing bolts are passed through the L-shaped plate 3 to connect and fix the L-shaped plate 3 with the heat dissipation side plates 2, thereby connecting the four heat dissipation side plates 2 end to end.

[0037] In order to realize the sequential circulation of the heat dissipation medium in the heat dissipation channels 5 in the four heat dissipation side plates 2, the heat dissipation bottom plate 1 is further provided with two transfer channels 13. The bottom inlet channel 11, the two transfer channels 13, and the bottom outlet channel 12 sequentially connect the four heat dissipation channels 5 to realize the circulation of the heat dissipation medium in the four heat dissipation side plates 2 and the heat dissipation bottom plate 1.

[0038] For specific distribution paths, please refer to Figure 2 The heat dissipation medium flows into the bottom inlet flow channel 11 from the medium inlet 6, and is divided into two paths and flows into the heat dissipation flow channels 5 of the two adjacent heat dissipation side plates 2 respectively. One path flows directly from the outlet of the heat dissipation flow channel 5 to the bottom outlet flow channel 12, and the other path flows to the transfer flow channel 13, and flows through the transfer flow channel 13 to the heat dissipation flow channel 5 of the next heat dissipation side plate 2, and then flows into another transfer flow channel 13, and flows into the bottom outlet flow channel 12 through the heat dissipation flow channel 5 of the last heat dissipation side plate 2. The two paths of heat dissipation medium are combined from the bottom outlet flow channel 12 and flow out from the medium outlet 7.

[0039] Further, refer to Figure 1 and Figure 2A plurality of heat dissipation inner baffles 4 are also fixed on the heat dissipation bottom plate 1. The heat dissipation inner baffles 4 are interspersed between the electronic components. Heat dissipation channels 5 are also provided in the heat dissipation inner baffles 4. The two ends of the heat dissipation channels 5 are connected to the bottom inlet channel 11 and the bottom outlet channel 12, and a branch is formed in the aforementioned heat dissipation medium flow path. The heat dissipation inner baffles 4 are interspersed between the electronic components, absorbing heat between the electronic components, further improving the efficiency of the heat dissipation medium absorbing heat; at the same time, they cooperate with the heat dissipation side plates 2 to form a chamber, dissipate heat for the electronic components in different areas, and improve the heat dissipation efficiency.

[0040] In this embodiment, two heat dissipation inner baffles 4 are provided, wherein the heat dissipation flow channel 5 of one heat dissipation inner baffle 4 is connected between the bottom inlet flow channel and the transfer flow channel 13, and the heat dissipation flow channel 5 of the other heat dissipation inner baffle 4 is connected between the bottom outlet flow channel 12 and the other transfer flow channel 13. For specific flow paths, see Figure 2 In other embodiments, the heat dissipation inner baffles 4 may also be provided in other numbers. When the number of the heat dissipation inner baffles 4 is large, more transfer channels 13 may be provided accordingly to ensure the circulation of the heat dissipation medium.

[0041] Further, refer to Figure 2 and Figure 3 The heat dissipation channel 5 includes a heat dissipation inlet channel 51, a heat dissipation outlet channel 52 and a heat dissipation connection channel 53. The heat dissipation inlet channel 51 and the heat dissipation outlet channel 52 are both opened perpendicular to the surface of the heat dissipation base plate 1, and the heat dissipation connection channel 53 is opened parallel to the surface of the heat dissipation base plate 1, and the heat dissipation inlet channel 51, the heat dissipation connection channel 53 and the heat dissipation outlet channel 52 are connected in sequence. When in use, the heat dissipation medium flows in from the heat dissipation inlet channel 51, passes through the heat dissipation flow channel, and flows out from the heat dissipation outlet channel 52. While flowing in the heat dissipation channel 5, the heat dissipation medium continuously absorbs the heat emitted by the electronic components to form a heat dissipation surface perpendicular to the heat dissipation base plate 1, realizes the coordination of the dimensional heat dissipation surface, and improves the heat dissipation efficiency and effect.

[0042] In order to allow the heat dissipation medium to fully absorb heat and improve the heat dissipation effect, the heat dissipation inlet flow channel 51, the heat dissipation outlet flow channel 52 and the heat dissipation connecting flow channel 53 can be set to multiple, so that the heat dissipation medium is dispersed in the heat dissipation side plate 2 and the heat dissipation inner partition plate 4 plate body to improve the heat exchange efficiency. In this embodiment, the heat dissipation inlet flow channel 51, the heat dissipation outlet flow channel 52 and the heat dissipation connecting flow channel 53 are all set to three. In other embodiments, it can also be adjusted to other numbers according to the actual needs of heat dissipation.

[0043] Preferably, the heat dissipation inlet flow channel 51, the heat dissipation outlet flow channel 52 and the heat dissipation connecting flow channel 53 are all arranged at equal intervals, thereby improving the uniformity of the heat dissipation medium on the heat dissipation side plate 2 and the heat dissipation inner partition plate 4, further improving the heat exchange efficiency, and thus improving the heat dissipation effect.

[0044] In this embodiment, in order to facilitate the opening of the flow channels in the heat dissipation side plate 2 and the heat dissipation inner partition plate 4, the heat dissipation communication flow channel 53 is directly set through the plate body, and the two ends of the heat dissipation communication flow channel 53 are filled with plugs 8. At the same time, the heat dissipation communication flow channel 53 simultaneously penetrates multiple heat dissipation inlet flow channels 51 and multiple heat dissipation outlet flow channels 52, that is, the heat dissipation communication flow channel 53, the heat dissipation inlet flow channel 51 and the heat dissipation outlet flow channel 52 are arranged in a cross. The above structure can simplify the setting of the flow channel, reduce the processing cost, and further improve the dispersion degree of the heat dissipation medium, which helps to improve the heat dissipation efficiency.

[0045] The implementation principle of a three-dimensional multi-channel heat dissipation structure disclosed in the embodiment of the present application is:

[0046] The heat dissipation base plate 1 is provided with a bottom inlet flow channel 11, a bottom outlet flow channel 12 and a transfer flow channel 13 for the circulation of the heat dissipation medium, and the heat dissipation base plate 1 is attached to the electronic component, and the heat generated by the electronic component is absorbed and transferred along with the flow of the heat dissipation medium to achieve heat dissipation of the electronic component;

[0047] Each heat dissipation side plate 2 is arranged perpendicular to the heat dissipation bottom plate 1 and surrounds the electronic component. The flow channel in the heat dissipation bottom plate 1 supplies heat dissipation medium to the heat dissipation flow channel 5 in each heat dissipation side plate 2, so that each heat dissipation side plate 2 forms a heat dissipation surface around the electronic component, forming a multi-dimensional heat dissipation surface to improve the heat dissipation effect;

[0048] Each heat dissipation inner partition plate 4 is interspersed between the electronic components to absorb and transfer heat from the inside of the electronic components, forming heat dissipation surfaces at different positions of the electronic components to improve the heat dissipation effect.

[0049] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A three-dimensional multi-channel heat dissipation structure, characterized in that: The invention comprises a heat dissipation base plate (1) and a plurality of heat dissipation side plates (2), wherein the plurality of heat dissipation side plates (2) are vertically fixed to the plate surface of the heat dissipation base plate (1), the heat dissipation base plate (1) is provided with a bottom inlet flow channel (11) and a bottom outlet flow channel (12), the heat dissipation side plates (2) are provided with a heat dissipation flow channel (5) for the circulation of a heat dissipation medium, the two ends of the heat dissipation flow channel (5) are respectively connected to the bottom inlet flow channel (11) and the bottom outlet flow channel (12), and the heat dissipation base plate (1) is provided with a medium inlet (6) connected to the bottom inlet flow channel (11) and a medium outlet (7) connected to the bottom outlet flow channel (12).

2. A three-dimensional multi-channel heat dissipation structure according to claim 1, characterized in that: The heat dissipation bottom plate (1) is also provided with a transfer channel (13), and the transfer channel (13) is used to connect to the heat dissipation channel (5).

3. A three-dimensional multi-channel heat dissipation structure according to claim 2, characterized in that: The plurality of heat dissipation side plates (2) are arranged end to end along the edge of the heat dissipation bottom plate (1), and the heat dissipation channels (5) are connected in sequence through a bottom inlet channel (11), a transfer channel (13) and a bottom outlet channel (12). The electronic components are arranged on the heat dissipation bottom plate (1) and are located between the plurality of heat dissipation side plates (2).

4. The three-dimensional multi-channel heat dissipation structure according to claim 2, characterized in that: It also comprises one or more heat dissipation inner baffles (4), wherein the heat dissipation inner baffles (4) are interspersed and arranged between the electronic components, the heat dissipation inner baffles (4) are fixed to the heat dissipation bottom plate (1), and a heat dissipation flow channel (5) is also provided in the heat dissipation inner baffles (4).

5. A three-dimensional multi-channel heat dissipation structure according to claim 1 or 4, characterized in that: The heat dissipation flow channel (5) comprises a heat dissipation inlet flow channel (51), a heat dissipation outlet flow channel (52) and a heat dissipation connecting flow channel (53); the heat dissipation inlet flow channel (51), the heat dissipation connecting flow channel (53) and the heat dissipation outlet flow channel (52) are connected in sequence; the heat dissipation inlet flow channel (51) is connected to the bottom inlet flow channel (11); the heat dissipation outlet flow channel (52) is connected to the bottom outlet flow channel (12); the heat dissipation inlet flow channel (51) and the heat dissipation outlet flow channel (52) are opened perpendicularly to the heat dissipation bottom plate (1); and the heat dissipation connecting flow channel (53) is opened parallel to the heat dissipation bottom plate (1).

6. A three-dimensional multi-channel heat dissipation structure according to claim 5, characterized in that: A plurality of the heat dissipation inlet flow channels (51), the heat dissipation outlet flow channels (52) and the heat dissipation connecting flow channels (53) are provided.

7. The three-dimensional multi-channel heat dissipation structure according to claim 6, characterized in that: The plurality of heat dissipation inlet flow channels (51) are arranged at equal intervals, the plurality of heat dissipation outlet flow channels (52) are arranged at equal intervals, and the plurality of heat dissipation connecting flow channels (53) are arranged at equal intervals.

8. The three-dimensional multi-channel heat dissipation structure according to claim 6, characterized in that: The heat dissipation communication channels (53) are all arranged through the plate body, and plugs (8) are arranged at both ends of each heat dissipation communication channel (53), and each heat dissipation communication channel (53) simultaneously runs through a plurality of heat dissipation inlet channels (51) and a plurality of heat dissipation outlet channels (52).

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