LED packaging structure

Abstract

The utility model discloses an LED packaging structure, comprising a substrate, a housing and a chip, the bottom surface of the housing is provided with a groove, the inner wall of the groove is provided with a fluorescent material, the housing abuts against the substrate, the bottom surface of the housing is fixed on the top surface of the substrate, the groove of the housing and the substrate jointly encircle to form a cavity, the chip is arranged on the top surface of the substrate and is located in the cavity, and the chip is arranged on the top surface of the substrate. And gaps are reserved between the surface of the chip and the fluorescent material on the inner wall of the groove. According to the LED packaging structure, the shell is provided with the groove, the end face, provided with the groove, of the shell abuts against the substrate, the cavity is formed by the end face, provided with the groove, of the shell and the top face of the substrate, the chip is fixed to the substrate and located in the cavity, and a large amount of heat generated by the chip can be guided out of the substrate through the gap reserved between the chip and the fluorescent material; and heat is prevented from being directly conducted to the fluorescent material, so that attenuation of the fluorescent material is slowed down, carbonization of glue can be reduced, and the luminous flux maintenance rate of an LED product is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, in particular to an LED packaging structure. Background Art

[0002] LED (semiconductor light emitting diode) packaging refers to the packaging of light-emitting chips, which is quite different from integrated circuit packaging. LED packaging not only requires protection of the wick, but also requires light transmission. Therefore, LED packaging has special requirements for packaging materials.

[0003] Currently, the LED can emit white light by applying glue on the surface of the chip and then adhering fluorescent material to the surface. However, this approach has hidden dangers. The energy generated by the chip when it emits light is relatively large. The light-emitting chip and the fluorescent material are in direct contact. The fluorescent material will be directly baked by the high temperature of the LED chip, causing the fluorescent material to quickly degrade. In addition, under the influence of high temperature, the glue will also carbonize. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes an LED packaging structure, in which there is an isolated gap between the LED chip and the fluorescent material, so that the heat of the chip will not be directly transferred to the fluorescent material, thereby slowing down the attenuation of the fluorescent material, and also reducing the carbonization of the glue, thereby improving the luminous flux maintenance rate of the LED product.

[0005] According to the first embodiment of the present invention, the LED packaging structure includes:

[0006] substrate;

[0007] The shell has a bottom surface provided with a groove, the inner wall of the groove is paved with fluorescent material, the bottom surface of the shell is fixedly connected to the top surface of the substrate and the groove and the substrate form a cavity;

[0008] A chip is mounted on the substrate and located in the cavity, and a gap is left between the surface of the chip and the fluorescent material.

[0009] According to the LED packaging structure of the embodiment of the utility model, at least the following beneficial effects are achieved: a groove is provided on the bottom surface of the shell, a fluorescent material is laid on the inner wall of the groove, the bottom surface of the shell is fixed to the top surface of the substrate, and the groove of the shell and the top surface of the substrate form a cavity, the chip is mounted on the top surface of the substrate and is located in the cavity, and a gap is left between the surface of the chip and the fluorescent material on the inner wall. Since there is a gap between the surface of the chip and the fluorescent material and there is no direct contact, a large amount of heat generated by the chip when it is working can be discharged through the substrate and will not be directly conducted to the fluorescent material, thereby slowing down the attenuation of the fluorescent material, and also reducing the carbonization of the glue, thereby improving the luminous flux maintenance rate of the LED product.

[0010] According to some embodiments of the present invention, the shell is an integrally formed structure, and the top surface of the shell is a plane.

[0011] According to some embodiments of the present invention, the cross-sectional shape of the groove is a concave shape, and the bottom and side walls of the groove are both planar structures.

[0012] According to some embodiments of the utility model, a transverse groove is provided inside the shell, and a threading hole is provided on the side wall, and the transverse groove is connected with the cavity through the threading hole.

[0013] According to some embodiments of the present invention, two sides of the groove are symmetrically provided with through openings, and the openings are used for air circulation.

[0014] According to some embodiments of the present invention, the fluorescent material is fluorescent powder, and the fluorescent powder is mixed with adhesive to form a fluorescent adhesive layer attached to the inner wall.

[0015] According to some embodiments of the present invention, the fluorescent material is a fluorescent film, and the fluorescent film is adhered to the inner wall by glue.

[0016] According to some embodiments of the present invention, the substrate is rectangular in shape, and the shape of the shell matches the shape of the substrate, so that the shell is covered on top of the substrate.

[0017] According to some embodiments of the present invention, the shell is made of high-transmittance glass.

[0018] According to some embodiments of the present invention, the substrate is made of ceramic or metal.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:

[0021] Figure 1 This is a cross-sectional schematic diagram of an LED packaging structure according to an embodiment of the utility model;

[0022] Figure 2 for Figure 1 An exploded view of the LED package structure is shown;

[0023] Figure 3 This is a cross-sectional schematic diagram of an LED packaging structure according to an embodiment of the utility model;

[0024] Figure 4 for Figure 3 An exploded view of the LED package structure is shown.

[0025] Reference numerals:

[0026] Substrate 100 , housing 200 , groove 210 , chip 300 , adhesive 400 , fluorescent adhesive layer 500 , fluorescent film 600 , connecting wire 700 . DETAILED DESCRIPTION

[0027] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0028] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0029] In the description of the present utility model, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0030] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0031] LED (semiconductor light emitting diode) packaging refers to the packaging of light-emitting chips, which is quite different from integrated circuit packaging. LED packaging not only requires protection of the wick, but also requires light transmission. Therefore, LED packaging has special requirements for packaging materials.

[0032] Currently, the LED can emit white light by applying glue on the surface of the chip and then adhering fluorescent material to the surface. However, this approach has hidden dangers. The energy generated by the chip when it emits light is relatively large. The light-emitting chip and the fluorescent material are in direct contact. The fluorescent material will be directly baked by the high temperature of the LED chip, causing the fluorescent material to quickly degrade. In addition, under the influence of high temperature, the glue will also carbonize.

[0033] In response to the problems existing in the existing LED packaging, the present application proposes an LED packaging structure, wherein a groove is provided on the bottom surface of the shell, and a fluorescent material is provided on the inner wall of the groove. The chip is arranged on the top surface of the substrate and is located in a closed cavity formed by the groove and the substrate. There is a gap between the surface of the chip and the fluorescent material on the inner wall of the groove. A large amount of heat generated by the chip can be discharged from the substrate to prevent the heat from being directly conducted to the fluorescent material, thereby slowing down the attenuation of the fluorescent material, and reducing the carbonization of the glue, thereby improving the luminous flux maintenance rate of the LED product.

[0034] Reference Figures 1 to 4 An LED packaging structure provided by an embodiment of the utility model includes a substrate 100, a shell 200 and a chip 300. The shell 200 is located above the substrate 100. A groove 210 is provided in the middle of the bottom surface of the shell 200. The inner wall of the groove 210 is paved with a fluorescent material. The bottom surface of the shell 200 is fixed to the top surface of the substrate 100 by an adhesive 400, and the groove 210 of the shell 200 and the substrate 100 are enclosed to form a cavity. The chip 300 is fixed to the middle of the top surface of the substrate 100 and is located in the cavity formed by the groove 210 of the shell 200 and the substrate 100. The surface of the chip 300 does not contact the fluorescent material on the inner wall of the groove 210, and a gap is left. It can be understood that the groove 210 of the shell 200 covers the chip 300 on the substrate 100, and the fluorescent material on the inner wall of the groove 210 of the shell 200 does not contact the surface of the chip 300. A certain gap is left between the fluorescent material and the surface of the chip 300. The reserved gap is greater than 10 microns, so that the heat generated by the chip 300 when working will not directly bake the fluorescent material.

[0035] It should be noted that when the chip 300 is emitting light and is in working state, the chip 300 will generate a large amount of heat. Since the chip 300 is not in direct contact with the fluorescent material, and there is an isolation gap between the chip 300 and the fluorescent material, the heat generated by the chip 300 can be discharged from the substrate 100, which greatly reduces the impact of the heat of the chip 300 on the fluorescent material, slows down the attenuation of the fluorescent material, and reduces the carbonization of the glue, thereby improving the luminous flux maintenance rate of the LED.

[0036] In some embodiments of the utility model, the shell 200 is an integrally formed structure, the bottom and top surfaces of the shell 200 are both planes, a groove 210 is provided on the bottom surface of the shell 200, the groove 210 is located in the middle of the bottom surface of the shell 200, the cross-sectional shape of the groove 210 is a concave shape, the bottom and side surfaces of the groove 210 are both planar structures, the opening of the groove 210 faces the top surface of the substrate 100, the groove 210 is covered above the chip 300, and the integrally formed structure can enhance the overall strength of the shell 200. At the same time, the groove 210 opened on the bottom surface of the shell 200 can be adapted to the chip 300 installed on the substrate 100, avoiding the chip 300 from being in the air, thereby covering the chip 300 on the substrate 100. In other embodiments, the shell 200 is covered on top of the substrate 100 through a bracket, one end of the bracket is fixed on the substrate 100, and the other end is fixedly connected to the shell 200 through an adhesive 400. The shell 200, the bracket and the substrate 100 together form a closed cavity, and the chip 300 is fixed on the substrate 100 and is located in the cavity. By arranging a bracket between the shell 200 and the substrate 100, it is also possible to achieve the effect that the shell 200 covers the chip 300 in the cavity, and there is a gap between the surface of the chip 300 and the fluorescent material on the inner wall of the groove 210.

[0037] It should be noted that a transverse groove is provided inside the shell 200, and the transverse groove is located on one side of the groove 210. A threading hole is provided on the side wall of the groove 210 close to the transverse groove. The transverse groove is connected to the cavity through the threading hole. The connecting wire 700 can pass through the transverse groove and the threading hole to reach the cavity. One end of the connecting wire 700 is connected to the solder pad of the chip 300, and the other end is connected to the metal solder pad of the substrate 100.

[0038] It should be noted that openings are symmetrically provided on both sides of the groove 210 of the shell 200, and the openings penetrate the shell 200. The openings can keep the air in the cavity circulating with the outside world, and can also accelerate the volatilization of heat in the cavity when the chip 300 emits light. The size of the opening can be changed according to different specifications of LEDs.

[0039] Further, such as Figure 1 and Figure 2 As shown, the fluorescent material is fluorescent powder. Specifically, the chip 300 is placed at a position specified by the substrate 100 through the device, the pad of the chip 300 is connected to the metal pad of the substrate 100 by the connecting wire 700, the groove 210 of the housing 200 is opened upward, and the fluorescent glue is sprayed on the bottom of the groove 210 to form a layer of fluorescent glue 500, wherein the fluorescent glue is prepared by fully mixing the fluorescent powder and the adhesive 400 in a certain ratio, and adjusting the concentration ratio of the fluorescent powder in the fluorescent glue to the adhesive 400 can make the LED display different color temperatures when it is lit.

[0040] In some specific embodiments of the present invention, refer to Figure 3 and Figure 4 , the fluorescent material is a fluorescent film 600. Specifically, the chip 300 is placed at a position specified by the substrate 100 through the device, the pad of the chip 300 is connected to the metal pad of the substrate 100 by the connecting wire 700, the opening of the groove 210 of the shell 200 is facing upward, the fluorescent film 600 is cut into a size that matches the opening of the groove 210, and a layer of adhesive is applied to the bottom of the groove 210 of the shell 200. After the glue is applied, it is left to stand for a period of time to completely discharge the bubbles in the glue. The fluorescent film 600 is fixed in the groove 210 of the shell 200 by the glue applied to the bottom of the groove 210. After the fluorescent film 600 is attached, the glass shell 200 with the fluorescent film 600 is sent to an oven for curing and shaping.

[0041] It should be noted that the substrate 100 is rectangular in shape, and the shape of the housing 200 is also rectangular to match the substrate 100, and the housing 200 can just cover the top of the substrate 100. In other embodiments, a plurality of chips 300 are provided on the substrate 100, and the housing 200 is provided with grooves 210 that are consistent with the number of chips 300, and the housing 200 covers the top of the substrate 100, and the bottom surface of the housing 200 abuts against the top surface of the substrate 100, and the grooves 210 of the housing 200 cover the plurality of chips 300 on the substrate 100; in other embodiments, the shape of the substrate can be any shape, and the shape of the substrate changes according to the size, function and shape of the required LED, and the shape of the housing can be made rectangular or circular according to requirements.

[0042] In some embodiments of the present invention, the shell 200 is made of high-transmittance glass, such as quartz glass. Quartz glass has high heat resistance and can be used at a temperature of up to 1400 degrees Celsius. Quartz glass also has high spectral transmittance and will not be damaged by radiation. The shell 200 made of quartz glass also has excellent mechanical properties, further improving the overall strength of the LED packaging structure.

[0043] It should be noted that the substrate 100 is made of ceramic or metal. The substrate 100 made of ceramic material has excellent electrical insulation performance, high thermal conductivity, excellent soft solderability and high adhesion strength, and also has a large current carrying capacity. The LED packaged with the substrate 100 made of ceramic material can quickly volatilize the heat of the chip 300 and reduce the impact of heat on other components. The substrate made of metal material includes aluminum substrate, copper substrate and metal composite substrate. The substrate made of metal material has good thermal conductivity and electrical insulation performance, and also has high hardness and high strength.

[0044] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. An LED packaging structure, characterized in that: include: substrate(100); A housing (200) having a groove (210) on its bottom surface, an inner wall of the groove (210) being paved with fluorescent material, the bottom surface of the housing (200) being fixedly connected to the top surface of the substrate (100), and the groove (210) and the substrate (100) forming a cavity; A chip (300) is mounted on the substrate (100) and is located in the cavity, and a gap is left between the surface of the chip (300) and the fluorescent material.

2. The LED packaging structure according to claim 1, characterized in that: The housing (200) is an integrally formed structure, and the top surface of the housing (200) is a plane.

3. The LED packaging structure according to claim 1, characterized in that: The cross-sectional shape of the groove (210) is a concave shape, and the bottom and side walls of the groove (210) are both planar structures.

4. The LED packaging structure according to claim 3, characterized in that: A transverse groove (220) is provided inside the housing (200), a threading hole (230) is provided on the side wall, and the transverse groove (220) is connected to the cavity through the threading hole (230).

5. The LED packaging structure according to claim 1, characterized in that: The groove (210) is symmetrically provided with through openings on both sides, and the openings are used for air circulation.

6. The LED packaging structure according to claim 1, characterized in that: The fluorescent material is fluorescent powder, and the fluorescent powder is mixed with adhesive (400) to form a fluorescent adhesive layer (500) attached to the inner wall.

7. The LED packaging structure according to claim 1, characterized in that: The fluorescent material is a fluorescent film (600), and the fluorescent film (600) is adhered to the inner wall by glue.

8. The LED packaging structure according to claim 1, characterized in that: The shape of the substrate (100) is rectangular, and the shape of the housing (200) matches the shape of the substrate (100), so that the housing (200) is covered on the substrate (100).

9. The LED packaging structure according to claim 1, characterized in that: The outer shell (200) is made of high light-transmittance glass.

10. The LED packaging structure according to claim 1, characterized in that: The substrate (100) is made of ceramic or metal.

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